ST 74LX1G04 User Manual

LOW VOLTAGE CMOS SINGLE INVERTER

■ 5V TOLERANT INPUTS

■ HIGH SPEED: t

■ LOW POWER DISSIPATION:

I

=1µA(MAX.)atTA=25°C

CC

■ POWER DOWN PROTECTION ON INPUTS

AND OUTPUTS

■ SYMMETRICAL OUTPUTIMPEDANCE:

|I

|=IOL= 24mA (MIN) at VCC=3V

OH

■ BALANCED PROPAGATION DELAYS:

t

≅ t

PLH

PHL

■ OPERATING VOLTAGE RANGE:

V

(OPR) = 1.65V to 5.5V

CC

(1.2V Data Reten tion)

■ IMPROVED LATCH-UP IMMUNITY

= 4.2ns (MAX.) at VCC=3V

PD

74LX1G04

WITH 5V TOLERANT INPUT

SOT23-5 SOT323-5

Flip-Chip4

DESCRIPTION

The 74LX1G04 is a low voltage CMOS SINGLE
INVERTER fabricated with sub-micron silicon
gate and double-layer metal wi ring C

2

MOS
technology.
It is ideal f or 1.65 to 5.5 V

operations and low

CC

ORDER CODES

PACKAGE T & R

SOT23-5L 74LX1G04STR

SOT323-5L 74LX1G04CTR

Flip-Chip 74LX1G04BJR

power and low noise a pplications. The internal
circuit is composed of 3 stages including buffer
output, which provide high noise immunity and
stable output.
Powerdownprotectionisprovidedoninputand
output and 0 to 7V can be accepted on inputs with

no regard to the supp ly voltage. It can be
interfaced to 5V signal e nvironment for inputs in
mixed 3.3/5V system.
All inputs and outputs are equipped with
protection circuits against static discharge.

PIN CONNECTION AND IEC LOGIC SYMBOLS (top view for S OT, top through view for Flip-Chip)

1/13April 2004

74LX1G04

INPUT AND OUTPUT EQUIVALENT CIRCUIT

PIN DESCRIPTION

PIN for SOT PIN for Flip-Chip SYMBOL NAME AND FUNCTION

1 N.C. Not connected
2 1 1A Data Input
4 3 1Y Data Output
3 2 GND Ground (0V)
54

V

CC

Positive Supply Voltage

TRUTH TABLE

AY

LH

HL

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Value Unit

V

V
V
V

I

I

OK

I

or I

I

CC

T

T

Absolute Maximum Rating are those value beyond which damage to the device may occur. Functional operation under these condition is not
implied

1) I

absolute maximum rating must be observed

O

2) V

<GND

O

Supply Voltage

CC

DC Input Voltage

I

DC Output Voltage (VCC=0V)

O

DC Output Voltage (High or Low State) (note 1) -0.5 to VCC+0.5

O

DC Input Diode Current

IK

DC Output Diode Current (note 2)
DC Output Current

O

DC VCCor Ground Current per Supply Pin

GND

Storage Temperature

stg

Lead Temperature (10 sec)

L

-0.5 to +7.0 V

-0.5 to +7.0 V

-0.5 to +7.0 V
V

-50 mA

-50 mA

± 50 mA
± 50 mA

-65 to +150 °C

260 °C

2/13

74LX1G04

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Value Unit

V

V
V
V

I

OH,IOL

I

OH,IOL

I

OH,IOL

I

OH,IOL

I

OH,IOL

T

dt/dv Input Rise and Fall Time (note 2) 0 to 10 ns/V

1) Truth Table guaranteed: 1.2V to 3.6V

2) V

from0.8V to 2V at VCC=3.0V

IN

DC SPECIFICATION

Supply Voltage (note 1)

CC

Input Voltage

I

Output Voltage (VCC=0V)

O

Output Voltage (High or Low State) 0 to V

O

High or Low Level Output Current (VCC=4.5to5.5V)
High or Low Level Output Current (VCC=3.0to3.6V)
High or Low Level Output Current (VCC=2.7to3.0V)
High or Low Level Output Current (VCC=2.3to2.7V)
High or Low Level Output Current (VCC=1.65to2.3V)
Operating Temperature

op

Test Condition Value

1.65 to 5.5 V
0to5.5 V
0to5.5 V

CC

± 32 mA
± 24 mA
± 16 mA

± 8mA
± 4mA

-55 to 125 °C

V

Symbol Parameter

V

V

V

High Level Input

IH

Voltage

V

Low Level Input

IL

Voltage

High Level Output

OH

Voltage

Low Level Output

OL

Voltage

Input Leakage

I

I

Current

I

Power Off Leakage

off

Current
Quiescent Supply

I

CC

Current

V

CC

(V)

1.65 to 1.95

3.0 to 5.5

1.65 to 1.95

3.0 to 5.5

1.65to4.5

1.65

2.3

3.0

4.5

1.65to4.5

1.65

2.3

3.0

4.5

1.65to5.5

0

1.65to5.5

-40 to 85 °C -55 to 125 °C

Min. Max. Min. Max.

0.75V

0.7V

0.7V

CC
CC
CC

0.25V

0.3V

0.3V

0.75V

CC
CC
CC

IO=-100 µAVCC-0.1 VCC-0.1

=-4 mA

I

O

I

=-8 mA

O

I

=-16 mA

O

I

=-24 mA

O

=-32 mA

I

O

IO=100 µA

=4 mA

I

O

I

=8 mA

O

I

=16 mA

O

I

=24 mA

O

=32 mA

I

O

= 0 to 5.5V

V

I

V

or VO=5.5V

I

V

I=VCC

or GND

1.2 1.2

1.9 1.9

2.4 2.4

2.2 2.2

3.8 3.8

0.1 0.1

0.45 0.45

0.3 0.3

0.4 0.4

0.55 0.55

0.55 0.55
± 10 ± 10 µA

10 10 µA

10 10 µA

0.7V

0.7V

CC
CC

CC

0.25V

0.3V

0.3V

CC
CC

Unit

V2.3 to 2.7

CC

V2.3 to 2.7

V

V

3/13

74LX1G04

AC ELECTRICAL CHARACTERISTICS

Test Condition Value

Symbol Parameter

t

PLHtPHL

Propagation Delay
Time

V

(V)

CC

C

(pF)

R

L

(Ω)

= t

t

L

s

(ns)

1.65 to 1.95

2.3to2.7 26.527.6

3.0to3.6 15.516.5

15 1MΩ 2.0

-40to85°C -55to125°C

r

Min. Max. Min. Max.

29.5210.5

Unit

4.5to5.5 14.115.5

1.65 to 1.95 30 1000 2.0 2 10.5 2 11.5

ns

2.3 to 2.7 30 500 2.0 2 7.5 2 8.5

2.7 50 500 2.5 1 6.1 1 7.1

3.0 to 3.6 50 500 2.5 1 5.5 1 6.5

4.5 to 5.5 50 500 2.5 1 4.2 1 5.2

CAPACITANCE CHARACTERISTICS

Test Condition Value

=25°C

Symbol Parameter

V

CC

(V)

C

C

Input Capacitance

IN

Power Dissipation Capacitance

PD

(note 1)

04pF

1.8 fIN=10MHz 36.8

3.3 38

1) CPDis defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without
load. (Refer to Test Circuit). Average current can be obtained by the following equation. I

CC(opr)=CPDxVCCxfIN+ICC

T

A

Min. Typ. Max.

Unit

pF2.5 37

4/13

TEST CIRCUIT

74LX1G04

RT=Z

of pulse generator (typically 50Ω)

OUT

TEST CIRCUIT AND WAVEFORM SYMBOL VALUE

V

Symbol

CC

1.65 to 1.95V 2.3 to 2.7V 2.7 to 5.5V

C

R
V
V

t

r=tr

L
L

IH

M

15pF/30pF 15pF/30pF 15pF/50pF

1MΩ/1000Ω 500Ω 500Ω

V

CC

V

CC

VCC/2 VCC/2 VCC/2

<2.0ns <2.0ns <2.5ns

WAVEFORM: PROPAGATION DELAY (f=1MHz; 50% duty cycle)

V

CC

5/13

74LX1G04

Figure1 : RECO MMENDE D S O LDERING RE F LOW PROFILE FOR LEADFREE FLIP-CHIP

MOUNTING ON PCB

Temperature (˚C)

Temperature (˚C)

260˚C max

260˚C max
255˚C

255˚C

220˚C

220˚C

180˚C

180˚C

125 ˚C

125 ˚C

3˚C/s max

3˚C/s max

0

0

01234567

01234567

10-30 sec

10-30 sec

90 to 150 sec

90 sec max

90 sec max

2˚C/s recommended

2˚C/s recommended

6˚C/s max

6˚C/s max

Time (min)

Time (min)

For Flip-Chip mounting on the PCB, S TM icroelectronics recommends the use of a solder s tenci l aperture
of 330 x 330 µm² maximum and a typical stencil thick nes s of 125µm . Flip-Chips are fully compatible with
the use of near eut ec tic 95.5Sn 4Ag 0.5Cu s older paste with no clean flux. ST's r ec ommendations for
Flip-Chip board mou nting are illustrated on the soldering reflow profile shown in figure 1 below.
Dwell time in th e soldering zone (with temperat ure higher than 220 °C) has to be kept as short as possible
to prevent component and subs trate damages. Peak temperature must not exceed 260°C. Controlled
atmosphere (N2 or N2H2) is recomm ended during the whole reflow, specially above 150°C.
Flip-Chips are able to withstand three time s the previous recommended reflow pro file in order to be
compatible with a double reflow when SMDs are mounted on both sides of the PCB plus one additional
repair. A maximum of three soldering reflows are allo wed f or these leadfree packages (with repair step
included). The use of a no clean flux is highly rec ommended to avoid any cleaning operation. In order to
prevent any bump cracks, ultrasonic cleaning met hods are not recommended.

6/13

74LX1G04

SOT23-5L MECHANICAL DATA

mm. mils

DIM.

MIN. TYP MAX. MIN. TYP. MAX.

A 0.90 1.45 35.4 57.1

A1 0.00 0.10 0.0 3.9

A2 0.90 1.30 35.4 51.2

b 0.35 0.50 13.7 19.7

C 0.09 0.20 3.5 7.8

D 2.80 3.00 110.2 118.1

E 1.50 1.75 59.0 68.8

e0.95 37.4

H 2.60 3.00 102.3 118.1

L 0.10 0.60 3.9 23.6

.

7049676C

7/13

74LX1G04

SOT323-5L MECHANICAL DATA

mm. mils

DIM.

MIN. TYP MAX. MIN. TYP. MAX.

A 0.80 1.10 31.5 43.3

A1 0.00 0.10 0.0 3.9

A2 0.80 1.00 31.5 39.4

b 0.15 0.30 5.9 11.8

C 0.10 0.18 3.9 7.1

D 1.80 2.20 70.9 86.6

E 1.80 2.40 70.9 94.5

E1 1.15 1.35 45.3 53.1

e

e1 1.3 51.2

L 0.10 0.30 3.9 11.8

.65

0

25.6

8/13

74LX1G04

Flip-Chip4 MECHANICAL DATA

mm. mils

DIM.

MIN. TYP MAX. MIN. TYP. MAX.

A 0.585 0.65 0.715 23.03 25.59 28.15

A1 0.21 0.25 0.29 8.27 9.84 11.42

A2 0.40 15.75

b 0.265 0.315 0.365 10.43 12.40 14.37

D 1.02 1.07 1.12 40.15 42.13 44.09

D1 0.5 19.69

E 1.02 1.07 1.12 40.15 42.13 44.09

E1 0.5 19.69

7224716/D

9/13

74LX1G04

Tape & Reel SOT23-xL MECHANICAL DATA

DIM.

MIN. TYP MAX. MIN. TYP. MAX.

A 180 7.086
C 12.8 13.0 13.2 0.504 0.512 0.519
D 20.2 0.795
N 60 2.362

T 14.4 0.567
Ao 3.13 3.23 3.33 0.123 0.127 0.131
Bo 3.07 3.17 3.27 0.120 0.124 0.128
Ko 1.27 1.37 1.47 0.050 0.054 0.0.58
Po 3.9 4.0 4.1 0.153 0.157 0.161

P 3.9 4.0 4.1 0.153 0.157 0.161

mm. inch

10/13

Tape & Reel SOT323-xL MECHANICAL DATA

74LX1G04

DIM.

MIN. TYP MAX. MIN. TYP. MAX.

A 175 180 185 6.889 7.086 7.283

C 12.8 13 13.2 0.504 0.512 0.519

D 20.2 0.795

N 59.5 60 60.5 2.362

T 14.4 0.567
Ao 2.25 0.088
Bo 2.7 0.106
Ko 1.2 0.047
Po 3.9 4 4.1 0.153 0.157 0.161

P 3.8 4 4.2 0.149 0.157 0.165

mm. inch

11/13

74LX1G04

Tape & Reel Flip-Chip 4 MECHANICAL DATA

mm. inch

DIM.

MIN. TYP MAX. MIN. TYP. MAX.

A 178 6.926

C 12.8 13.2 0.504 0.519

D 20.2 0.795

N 59 60 61 2.323 2.362 2.401

T 8.4 0.331
Ao 1.12 1.17 1.22 0.044 0.046 0.048
Bo 1.12 1.17 1.22 0.044 0.046 0.048
Ko 0.68 0.73 0.78 0.027 0.029 0.031
Po 3.9 4 4.1 0.153 0.157 0.161

P 3.9 4 4.1 0.153 0.157 0.161

12/13

74LX1G04

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such inform ation nor fo r an y infring ement of p atents or o ther rights of third p arties which may r esult f rom
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.

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