SOYO LI-7000
LPX SYSTEM
****************************************************
Socket 370 Celeron Processor supported
FW82810 AGP/PCI/AMR Chipset
66/100 MHz Front Side Bus supported
Custom LPX Form Factor
****************************************************
User's Manual
SOYO™ LI-7000
ii
Copyright © 1999 by Soyo Computer Inc.
Trademarks:
Soyo is the registered trademark of Soyo Computer Inc. All trademarks are the
properties of their owners.
Product Rights:
All names of the product and corporate mentioned in this publication are used for
identification purposes only. The registered trademarks and copyrights belong to
their respective companies.
Copyright Notice:
All rights reserved. This manual has been copyrighted by Soyo Computer Inc. No
part of this manual may be reproduced, transmitted, transcribed, translated into any
other language, or stored in a retrieval system, in any form or by any means, such
as by electronic, mechanical, magnetic, optical, chemical, manual or otherwise,
without permission in writing from Soyo Computer Inc.
Disclaimer:
Soyo Computer Inc. makes no representations or warranties regarding the contents
of this manual. We reserve the right to amend the manual or revise the
specifications of the product described in it from time to time without obligation to
notify any person of such revision or amend. The information contained in this
manual is provided to our customers for general use. Customers should be aware
that the personal computer field is subject to many patents. All of our customers
should ensure that their use of our products does not infringe upon any patents. It is
the policy of Soyo Computer Inc. to respect the valid patent rights of third parties
and not to infringe upon or to cause others to infringe upon such rights.
Restricted Rights Legend:
Use, duplication, or disclosure by the Government is subject to restrictions set
forth in subparagraph (c)(1)(ii) of the Rights in Technical Data and Computer
Software clause at 252.277-7013.
About This Guide:
This Quick Start Guide can help system manufacturers and end users in setting up
and installing the Motherboard. Information in this guide has been carefully
checked for reliability; however, to the correctness of the contents there is no
guarantee given. The information in this document is subject to amend without
notice.
For further information, please visit our Web Site on the Internet. The address is
"http://www.soyo.com.tw".
Edition: August 1999
Version 1.0
LI-7000 SERIAL
FC
C
Tested To Comply
With FCC Standards
FOR HOME OR OFFICE USE
POST CONSUMER
RECYCLED PAPER
100%
Table of Contents LI-7000
iii
Table of Contents
CHAPTER 1 INTRODUCTION..............................................................1
1-1 KEY FEATURES.............................................................1
1-2 LI-7000 SYSTEM ILLUSTRATION ................................1
1-3 UMPACKING..................................................................4
CHAPTER 2 MOTHERBOARD DESCRIPTION ...................................5
2-1 INTRODUCTION............................................................5
2-2 KEY FEATURES.............................................................5
2-3 HANDLING THE MOTHERBOARD..............................7
2-4 ELECTROSTATIC DISCHARGE PRECAUTIONS .........7
2-5 SY-7IWL-T MOTHERBOARD COMPONENTS.............8
2-6 CHIPSET.......................................................................10
2-7 I/O INTERFACE CONTROLLER..................................16
2-8 AUDIO SUBSYSTEM...................................................18
2-9 HARDWARE MONITOR...............................................18
2-10 WAKE ON LAN TECHNOLOGY..................................19
CHAPTER 3 HARDWARE INSTALLATION.......................................20
3-1 PREPARATIONS...........................................................20
3-2 INSTALLATION GUIDE...............................................21
3-2.1 CPU Installation............................................................. 22
3-2.2 SDRAM Memory Module Installation.............................. 24
3-2.3 Motherboard Connector.................................................. 26
3-2.4 Jumpers Setting .............................................................. 42
3-2.5 CMOS Clearing (JP5)..................................................... 43
3-2.6 Power On ....................................................................... 43
3-2.7 Quick BIOS Setup........................................................... 44
3-2.8 Troubleshooting at Fist Start........................................... 46
3-2.9 Power Off....................................................................... 47
CHAPTER 4 BIOS SETUP UTILITY...................................................48
Table of Contents LI-7000
iv
4-1 SOYO COMBO SETUP.................................................51
4-2 STANDARD CMOS SETUP..........................................55
4-3 ADVANCED BIOS FEATURES.....................................58
4-4 ADVANCED CHIPSET FEATURES..............................62
4-5 INTEGRATED PERIPHERALS.....................................64
4-6 POWER MANAGEMENT SETUP ................................68
4-7 PNP/PCI CONFIGURATION SETUP.............................71
4-8 PC HEALTH STATUS....................................................74
4-9 LOAD OPTIMIZED DEFAULTS...................................76
4-10 LOAD FAIL-SAFE DEFAULTS.....................................77
4-11 SUPERVISOR PASSWORD...........................................78
4-12 USER PASSWORD........................................................79
4-13 IDE HDD AUTO DETECTION .....................................80
CHAPTER 5 DRIVERS INSTALLATION ............................................81
CHAPTER 6 SIGMATEL AUDIO DRIVER INSTALLATION..............86
CHAPTER 7 REALTEK LAN DRIVER INSTALLATION....................89
Introduction LI-7000
1
Chapter 1
INTRODUCTION
1-1 KEY FEATURES
Ø LPX Form Factor 36.3(d) x 31.5(w) x 8.5(H) cm
Ø 150W (Max.) SFX Switching Power Supply
Ø Screw less & Wire-Free Front Panel
Ø Detachable Logo Plate
Ø 1 x FDD, 1 x HDD (hidden), 1 x CD-ROM drive bay
Ø Detachable Drive Bracket
Ø Riser Card for 1 x PCI and 1 x AMR slot Expansion
1-2 LI-7000 SYSTEM ILLUSTRATION
Figure 1. Front Panel
USB Ports
IR WindowsLINE-OUT LINE-IN MIC JACK
LAN LED
Power Button
CD-ROM Mounting Bay
Power LED
HDD LED
Floppy Drive Mounting Bay
Detachable Loge Plate
Introduction LI-7000
2
Figure 2. Back Panel
Figure 3. Inside Look
Serial Port
Game Port
Parallel Port
Mouse
Keyboard
LINE-OUT
LAN
TV-OUT
S-OUT
VGA Port
Socket 370 CPU
FDD
150W SFX Power Supply
CD-ROM
HDD
Riser Card
Introduction LI-7000
3
1. SY-7IWL-T Motherboard Layout
2. Front Panel Board
3. Riser Card
USBLINE-OUT
LINE-IN
MIC JACK
IR Module
To 7IWL-T Motherboard
PCI Slot
AMR Slot
Riser Card
PRT
PS/2 KB
Connector
PS/2 Mouse
Connector
PCI Slot
AMR
3V
Lithium
Battery
LPC
W83627HF
-AW
TV-Out
Chip
LAN Chip
Realtek
8139B
IDE 2 IDE 1
1
1
1
FDC
ATX Power
LINE-OUT
J2
J3
1
Socket 370
JP5
Jumper
CMOS Clear
DIMM 1
DIMM 2
COM1COM2
1
4
4
CODEC
AC97
Intel
FW82801
JP1
1
3
J8
1
3
CPUFAN
1
1
4
1
2
910
VGA
S-Video
Connector
AV onnector for
TV-Out
LAN
Connector
Game Port
Front Panel
Connector
JP15
JP10
Buzzer
Intel
FW82810
1
2
20
2
9
10
Introduction LI-7000
4
1-3 UNPACKING
When unpacking the System, check for the following items:
u The LI-7000 System
u The Quick Start Guide
u The Installation CD-ROM
u SOYO 3-in-1 Bonus Pack CD-ROM (Norton
AntiVirus, Ghost and Virtual Drive)
u Power Cord
Like most electronic equipment, your Motherboard and other components
and devices may be damaged by electrostatic discharge. To avoid
permanent damage to components ground yourself while working by using
a grounding strap. Otherwise, ground yourself frequently by touching the
unpainted portion of the computer chassis to drain the static charges.
Motherboard Description LI-7000
5
Chapter 2
MOTHEBOARD DESCRIPTION
2-1 INTRODUCTION
The SY-7IWL-T AGP/PCI/AMR Motherboard is a high-performance
Socket 370 processor supported Custom LPX form-factor system board.
SY-7IWL-T uses the FW82810 Chipset technology and supports Socket
370 processors. This Motherboard is fully compatible with industry
standards and adds many technical enhancements.
2-2 KEY FEATURES
Ø Supports Intel Celeron™ processors (300A-500MHz)
Ø Supports 100 & 66 MHz Front Side Bus Frequency
Ø Auto detect CPU bus Frequency (66/100)
Ø Auto-detect CPU voltage
Ø Chipset integrated 3D AGP Accelerator
Ø Easy CPU settings in BIOS with the “SOYO COMBO Setup”
Ø PC98, ACPI
Ø Ultra DMA33/66 (ATA 33/66)
Ø Supports ACPI Suspend Indicator
Ø Power-on by modem, alarm, PS/2 Keyboard and Mouse
Ø Supports Wake-On-LAN Function
Ø Supports Onboard PCI LAN Realtek 8139B 10/100Mb/s
Ø Supports TV-out (NTSC/PAL)
Ø Supports AC97 Codec software audio
Ø Supports onboard hardware monitoring and includes Hardware
Doctor™ utility
Ø Power failure resume
Motherboard Description LI-7000
6
Ø Fan speed control
Ø Battery Low voltage Detect
Ø Support 7 sets of voltage monitoring
Ø Supports multiple-boot function
Ø Y2K Complaint
Ø Supports Audio Modem Riser slot (AMR 1.0 compliant)
Ø 1 x 32-bit bus mastering PCI slot
Ø 2 x USB ports onboard
Ø 1 x IrDA Device
Ø ATX power connector
Ø Hardware Random Number Generator (RNG) for enabling enhanced
platform security
Ø RTC hardware to handle Y2K Century Rollover
* If the user wants to use a Modem Riser card (MR) make sure to use a
Secondary
mode
MR,
PRIMARY
mode MRs are
NOT
Supported.
Motherboard Description LI-7000
7
2-3 HANDLING THE MOTHERBOARD
To avoid damage to your Motherboard, follow these simple rules while
unpacking:
Ø Before handling the Motherboard, ground yourself by grasping an
unpainted portion of the system's metal chassis.
Ø Remove the Motherboard from its anti-static packaging. Hold the
Motherboard by the edges and avoid touching its components.
Ø Check the Motherboard for damage. If any chip appears loose, press
carefully to seat it firmly in its socket.
Warning: Do not apply power if the Motherboard appears
damaged. If there is damage to the board, contact your dealer
immediately.
2-4 ELECTROSTATIC DISCHARGE PRECAUTIONS
Make sure to ground yourself before handling the Motherboard or other
system components. Electrostatic discharge can easily damage the
components. Note that you must take special precautions when handling
the Motherboard in dry or air-conditioned environment.
To protect your equipment from electrostatic discharge, take the following
precautions:
Ø Do not remove the anti-static packaging until you are ready to install.
Ø Ground yourself before removing any system component from its
protective anti-static packaging. (To ground yourself, grasp the expansion
slot covers or other unpainted portions of the computer chassis.)
Ø Frequently ground yourself while working or use a grounding strap.
Ø Handle the Motherboard by its edges and avoid touching its
components.
Motherboard Description LI-7000
8
2-5 SY-7IWL-T MOTHERBOARD COMPONENTS
ABCDEFGHIJKLMNO
P
Q
R
S
TUX
Y
V
Z
Motherboard Description LI-7000
9
A Winbond W83627HF-AW LPC I/O Chip
B Power-On by Keyboard Jumper
C Game Port Connector
D COM1/COM2 Connector
E Realtek 8139B LAN Chip
F AC97 Codec Chip
G CD-IN Connector
H Front panel connectors
I Floppy Disk Drive (FDD) Port
J ATX Power Supply Connector
K Bus Mastering E-IDE/ATAPI Ports
L 3V Lithium Battery
M CMOS Clear Jumper
N Buzzer
O Riser-Card Slot
P Socket 370 Connector
Q Power-button & Front Panel LED Connector
R Speaker Connector
S CPU Cooling Fan Connector
T Intel FW82810 GMCH Chip
U DIMM Sockets
V Intel 82802AB 4Mb FWH Chip
W TV-Out Chip
X TV-Out Signal Format Jumper
Y Intel FW82801 ICH Chip
Z Back panel Connectors
Motherboard Description LI-7000
10
2-6 CHIPSET
To compliment the Intel® Celeron processor, the Intel® 810 chipsets
delivers a balanced platform solution for value computing. The 810
chipset is a highly-integrated three-chip solution consisting of a Graphics
& Memory Controller (Intel 82810), an I/O Controller (Intel82801), and a
Firmware Hub (Intel 82802).
The ICH is a highly integrated multifunctional I/O Controller Hub that
provides the interface to the PCI Bus and integrates many of the functions
needed in today PC platforms. The ICH communicates with the host
controller over a dedicated hub interface. There are two versions of the
ICH (82801AA: ICH and 82801AB: ICH0). These devices are pin
compatible and are in 241-pin packages.
The Intel® 82802 Firmware Hub (FWH) component is part of the Intel®
810 chipset. The FWH is key to enabling future security and
manageabilily infrastructures for the PC platform.
Intel has developed technology that enhances the performance and
exceptional value of the Intel® Celeron™ processor-powered PC. Built on
the strong foundation of Intel® 440BX AGPset technology, the Intel® 810
chipset has re-engineered the Value PC, providing next generation features
and great graphics performance at a lower cost.
Richer, more robust 2D and 3D graphics are optimized thanks to an
integrated chipset design that utilizes second-generation graphics
technology. This integrated chipset offers innovative features with
compelling performance while lowering overall system costs.
A new design with big benefits
At the core of the 810 chipset is a memory controller with built-in graphics
Motherboard Description LI-7000
11
technology. The 82810 chip optimizes system memory arbitration, similar
to AGP technology, resulting in a more responsive and cost-effective
system.
The 82810 Graphics Memory Controller Hub (GMCH) features Intel®
graphics technology and software drivers, using Direct AGP (integrated
AGP) to create vivid 2D and 3D effects and images. The 82810 chip
features integrated Hardware Motion Compensation to improve soft DVD
video quality and a digital video out port that enables connection to
traditional TVs or the new space-saving digital flat panel displays.
Intel® Dynamic Video Memory Technology (D.V.M.T.) is an architecture
that offers breakthrough performance for the Value PC segment through
efficient memory utilization and Direct AGP. The system OS uses the Intel
software drivers and intelligent memory arbiter to support richer graphics
applications.
The System Manageability Bus allows networking equipment to monitor
the 810 chipset platform. Using ACPI specifications, the system
manageability function enables low-power sleep mode and conserves
energy when the system is idle.
The 82801 I/O Controller Hub (ICH) employs the Intel® Accelerated Hub
Architecture to make a direct connection from the graphics and memory to
the integrated AC97 controller, the IDE controllers, dual USB ports, and
PCI add-in cards.
The Accelerated Hub Architecture provides twice the bandwidth of the
PCI bus at 266 MB per second. This allows a wider flow of rich
information from the I/O controller to the memory controller, with
optimized arbitration rules allowing more functions to run concurrently,
enabling more life-like audio and video.
Motherboard Description LI-7000
12
The Integrated Audio-Codec 97 controller enables software audio and
modem by using the processor to run sound and modem software. By
reusing existing system resources, this feature adds flexibility, and
improves sound quality.
The 82802 Firmware Hub (FWH) stores system BIOS and video BIOS,
eliminating a redundant nonvolatile memory component. In addition, the
82802 contains a hardware Random Number Generator (RNG). The
Intel® RNG provides truly random numbers to enable fundamental
security building blocks supporting stronger encryption, digital signing,
and security protocols.
Intel 810 chipset re-engineers the Value PC by providing a platform that
will bring next generation features and great graphics performance to
Value PC while reducing overall platform cost.
PRODUCT HIGHLIGHTS
Ø Enhances performance and exceptional value of the Intel® Celeron™
processor-powered PC
Ø Built on strong foundation of Intel® 440Bx technology
Ø Provides next generation features
Ø Provides great graphics performance at a lower cost
Ø Optimizes 2D and 3D graphics through integrated chipset design
utilizing second-generation graphics technology
Ø Innovative features with compelling performance while lowering
system costs
FEATURES BENEFITS
Ø Intel® Accelerated Hub Architecture Increased I/O performance
allows better concurrency for richer multimedia applications
Ø Integrated graphics/AC97 controller, more flexibility and better audio
quality
Ø Intel® 3D graphics with Direct AGP Vivid 2D and 3D graphics,
Motherboard Description LI-7000
13
efficient use of system memory for graphics, O/S and applications
Ø Optional 4MB of dedicated display cache video memory Enables
SKU differentiation with increased 3D graphics performance
improvement over Direct AGP
Ø Low-power sleep modes Energy Savings
Ø One software driver code base More stable platform, higher quality
graphics, reduced OEM support costs
Ø Intel® Random Number Generator (RNG) Enables ISV's to
strengthen security products
Ø Digital Video Out port Allows connection of traditional TV or new
digital flat panel displays; compatible with DVI specification
Ø Soft DVD MPEG 2 playback with Hardware Motion Compensation
Life-like video and audio
Ø 100-MHz System Bus capable Flexibility for performance headroom
Ø 2 USB ports Plug and Play
Ø Multiple Intel® 810 chipset SKUs for Value PC price points Lower
platform and manufacturing costs with single motherboard design
Product Package
Ø 82810 Graphics Memory Controller Hub 421 Ball Grid Array
(BGA)
Ø 82801 Integrated Controller Hub 241 Ball Grid Array (BGA)
Ø 82802 Firmware Hub 32-pin PLCC or 40-pin TSOP
2-6.1 Accelerated Graphics Port (A.G.P.)
A.G.P. is a high-performance bus for graphics-intensive applications, such
as 3D applications. A.G.P., while based on the PCI Local Bus
Specifications, Rev 2.1, is independent of the PCI bus and is intended for
exclusive use with graphical display devices. A.G.P. overcomes certain
limitations of the PCI bus related to handling a large amount of graphics
data with the following features:
l Pipelined memory read and write operations that hide memory access
Motherboard Description LI-7000
14
latency
l Demultiplexing of address and data on the bus for near 100 percent
bus efficiency
l AC timing for 133 MHz data transfer rates, allowing real data
throughput in excess of 500 MB/sec
2-6.2 Universal Serial Bus (USB)
The motherboard has two USB ports; one USB peripheral can be
connected to each port. For more than two USB devices, an external hub
can be connected to either port. The motherboard fully supports the
universal host controller interface (UHCI) and used UHCI-compatible
software drivers.
Specification USB features include:
l Self-identifying peripherals that can be plugged in while the
computer is running
l Automatic mapping of function to driver and configuration
l Support for isochronous and asynchronous transfer types over the
same set of wires
l Support for up to 127 physical devices
l Guaranteed bandwidth and low latencies appropriate for telephony,
audio, and other applications
l Error-handling and fault-recovery mechanisms built into the protocol
¿
Note
Computer systems that have an unshielded cable attached to a USB port
may not meet FCC Class B requirements, even if no device or a low-speed
USB device is attached to the cable. Use shielded cable that meets the
requirements for a full-speed USB device.
Motherboard Description LI-7000
15
2-6.3 IDE Support
The motherboard has two independent bus-mastering PCI IDE interfaces.
These interfaces support PIO Mode3, PIO Mode 4, ATAPI devices (e.g.,
CD-ROM), and Ultra DMA/33 synchronous-DMA mode transfers. The
BIOS supports logical block addressing (LBA) and extended cylinder head
sector (ECHS) translation modes. The BIOS automatically detects the IDE
device transfer rate and translation mode.
Programmed I/O operations usually require a substantial amount of
processor bandwidth. However, in multitasking operating systems, the
bandwidth freed by bus mastering IDE can be devoted to other tasks while
disk transfers are occurring.
The motherboard also supports laser servo (LS-120) drives. LS-120
technology allows the user to perform read/write operations to LS-120
(120MB) and conventional 1.44MB and 720KB diskettes. An optical
servo system is used to precisely position a dual-gap head to access the
diskett’s 2,490 tracks per inch (tpi) containing up to 120 MB of data
storage. A conventional diskette uses 135 tpi for 1.44 MB of data storage.
LS-120 drivers are ATAPI-compatible and connect to the motherboard’s
IDE interface. (LS-120 drives are also available with SCJSI and parallel
port interfaces.) Some versions of Windows 95 and Windows NT
operating systems recognize the LS-120 drive as a bootable device in both
120 MB and 1.44 MB mode.
Connection of an LS-120 drive and a standard 3.5-inch diskette drive is
allowed. The LS-120 drive can be configured as a boot device if selected
as Drive A in the BIOS setup program.
¿
Note
If you connect at LS-120 drive to an IDE connector and configure it as
the :boot: drive and configure a standard 3.5-inch diskette drive as a “ B”
drive, the standard diskette drive is not seen by the operating system.
When the LS-120 drive is configured as the “ boot: device, the system will
recognize it as both the A and B drive
Motherboard Description LI-7000
16
2-6.4 Real-Time Clock, CMOS SRAM, and Battery
The real-time clock is compatible with DS1287 and MC146818
components. The clock provides a time-of-day clock and a multicentury
calendar with alarm features and century rollover. The real-time clock
supports 256 bytes of battery-backed CMOS SRAM in two banks that are
reserved for BIOS use.
The time, date, and CMOS values can be specified in the Setup program.
The CMOS values can be returned to their defaults by using the Setup
program.
2-7 I/O INTERFACE CONTROLLER
The motherboard uses the Winbond W83627HF-AW I/O controller which
features:
l Single diskette drive interface
l Two serial ports
l FIFO supports on both serial and diskette interfaces
l One parallel port with Extended Capabilities Port (ECP) and
Enhanced Parallel Port (EPP) support
l PS/2 style mouse and keyboard interfaces
l PCI PME interface
l Intelligent auto power management, including:
Ø Shadowed write-only registers for ACPI compliance
Ø Programmable wake-up event interface
The Setup program provides configuration option for the I/O controller.
2-7.1 Serial Ports
The motherboard has one 9-pin D-Sub serial port connector located on the
back panel. The NS16C5450-compatible UARTs support data transfers at
speeds up to 115.2 Kbits/sec with BIOS support.
2-7.2 Parallel Port
The connector for the multimode bi-directional parallel port is a 25-pin DSub connector located on the back panel of the motherboard. In the Setup
Motherboard Description LI-7000
17
program, there are four options for parallel port operation:
l Compatible (standard mode)
l Bi-directional (PS/2 compatible)
l Bi-directional EPP. A driver from the peripheral manufacturer is
required for operation. See Section 6.2 for EPP compatibility.
l Bi-directional high-speed ECP
2-7.3 Diskette Drive Controller
The I/O controller is software compatible with the 82077 diskette drive
controller and supports both PC-AT and PS/2 modes. In the Setup
program, the diskette drive interface can be configured for the following
diskette drive capacities and sizes.
l 360 KB, 5.25-inch
l 1.2 MB, 5.25-inch
l 720 KB, 3.5-inch
l 1.2 MB. 3.5-inch (driver required)
l 1.25-1.44 MB, 3.5-inch
l 2.88 MB, 3.5-inch
2-7.4 PS/2 Keyboard and Mouse Interface
PS/2 keyboard and mouse connectors are located on the back panel of the
motherboard. The +5 V lines to these connectors are protected with a fuse
circuit that, like a self-healing fuse, reestablishes the connection after an
over-current condition is removed.
¿
Note
The mouse and keyboard can be plugged into either PS/2 connector.
Power to the computer should be turned off before a keyboard or mouse is
connected or disconnected.
The keyboard controller contains code, which provides the traditional
keyboard and mouse control functions, and also supports Power On/Reset
password protection. Power On/Reset password can be specified in the
BIOS Setup program.
Motherboard Description LI-7000
18
The keyboard controller also supports the hot-key sequence
<Ctrl><Alt><Del>, software reset. This key sequence resets the
computer’s software by jumping to the beginning of the BIOS code and
running the Power On Self Test (POST).
2-7.5 Infrared Support
The IR connection can be used to transfer files to or from portable devices
like laptops, PDAs, and printers.
2-8 AUDIO SUBSYSTEM
2-8.1 Audio Connector
The audio connectors include the following:
l Back panel connectors: stereo line-level output (Line Out), stereo
line-level input (Line In), and Mic In
2-8.1.1 CD Line - in Connector
A1 x 4-pin ATAPI-style connector is available for connecting an internal
CD-ROM drive to the audio mixer. The connector is designed for use with
cables that are compatible with ATAPI CD-ROM drivers
2-9 HARDWARE MONITOR
The optional hardware monitor subsystem provides low-cost
instrumentation capabilities. The features of the hardware monitor
subsystem include:
Ø An integrated ambient temperature sensor
Ø Fan speed sensors, which monitor the fan 1 and fan 2 connectors
Ø Power supply voltage monitoring to detect levels above or below
acceptable values
When suggested ratings for temperature, fan speed, or voltage are
exceeded, an interrupt is activated. The hardware monitor component
connects to the SMBus.
Motherboard Description LI-7000
19
2-10 WAKE ON LAN TECHNOLOGY
Wake on LAN technology enables remote wakeup of the computer
through a network. The LAN subsystem, whether onboard or as a PCI bus
network adapter, monitors network traffic at the Media Independent
Interface. Upon detecting a Magic Packet= frame, the LAN subsystem
asserts a wakeup signal that powers up the computer. Depending on the
LAN implementation, the motherboard board supports Wake on LAN
technology in one of two ways:
Ø Through the Wake on LAN technology connector
Ø Through the PCI bus PME# signal (for PCI2.2 compliant LAN
designs)
The Wake on LAN technology connector can be used with PCI bus
network adapters that have a remote wake up connector, Network adapters
that are PCI 2.2 compliant assert the wakeup signal through the PCI bus
signal PME# (pin A19 on the PCI bus connectors).
Note:This motherboard supports remote wakeup using the PME#
signal; the WOL connector is not supported.
The onboard LAN subsystem also supports remote wakeup using the
PME# signal.
*
CAUTION
For Wake on LAN, the 5-V standby line for the power supply must be
capable of delivering +5V ±5 % at 720 mA. Failure to provide adequate
standby current when implementing Wake on LAN can damage the power
supply.
Motherboard’s Hardware Installation LI-7000
20
Chapter 3
MOTHERBOARD’ S HARDWARE INSTALLATION
3-1 PREPARATIONS
Gather and prepare all the following hardware equipment to complete the
installation successfully:
u CeleronTM Socker370 processor with CPU cooling fan*
u SDRAM module
u Monitor
u Keyboard
u Mouse
u Speaker(s) (optional)
u Disk Drives: HDD, CD-ROM, Floppy drive…
u External Peripherals: Printer, Plotter, and Modem (optional)
u Internal Peripherals: Modem Riser cards (optional)
Note: If you want to use an external speaker connected to "Line-out" port,
please make sure to use an "amplified speaker" that can generate
proper output sound volume.
*Please use appropriate fan and heatsink to avoid the mechanical
conflict with drive bracket.
Motherboard’s Hardware Installation LI-7000
21
3-2 MOTHERBOARD INSTALLATION GUIDE
We will now begin the installation of the Motherboard. Please follow the
step-by-step procedure designed to lead you to a complete and correct
installation.
Warning: Turn off the power to the Motherboard, system
chassis, and peripheral devices before performing any work on
the Motherboard or system.
BEGIN THE INSTALLATION
Motherboard’s Hardware Installation LI-7000
22
3-2.1 CPU Installation
To perform the installation of your new SY-7IWL-T Motherboard, follow
the steps below:
Mark your CPU Frequency:
Record the working frequency of
your CPU that should be clearly marked on the CPU cover.
300MHz (66 x 4.5) 333MHz (66 x 5.0) 366MHz (66 x 5.5) 400MHz (66 x 6.0)
433MHz (66 x 6.5) 466MHz (66 x7..0) 500MHz (66 x7.5)
This Motherboard is designed to support processors with 100MHz FSB.
However, Socket 370 processors with 100MHz FSB are not available at
present.
CPU Mount Procedure:
To mount the Celeron TM processor that you
have purchased separately, follow these instructions.
1. Lift the socket handle up to a vertical position.
2. Align the blunt edge of the CPU with the matching pinhole
distinctive edge on the socket.
Motherboard’s Hardware Installation LI-7000
23
3. Seat the processor in the socket completely and without forcing.
4. Then close the socket handle to secure the CPU in place.
Remember to connect the CPU Cooling Fan to the
appropriate power connector on the Motherboard. The fan is
a key component that will ensure system stability. The fan
prevents overheating, therefore prolonging the life of your
CPU.
Motherboard’s Hardware Installation LI-7000
24
3-2.2 SDRAM Memory Module Installation
Your board comes with two DIMM sockets, and supports up to 512MB
main memory using industry standard Synchronous DRAM (SDRAM),
single or double-sided, 3.3V unbuffered DIMM modules from 8MB to
256MB. Registered DIMMs or DIMMs populated with 4 bit wide
SDRAM devices are not supported. PC100 compliant DIMM module is
required regardless of 66 or 100MHz FSB speed.
1
84
1
84
DIMM 2
DIMM 1
Motherboard’s Hardware Installation LI-7000
25
Memory Configuration Table
Number of Memory
Modules
DIMM 1 DIMM 2
1
Double-sided/
Single-sided
Double-sided/
Single-sided
2
Double-sided/
Single-sided
Double-sided/
Single-sided
RAM Type
SDRAM¹
Memory Module Size (MB)
8/16/32/64/256 Mbytes
Note: PC100 Compliant DIMM module is required regardless of 66 or
100 MHz FSB speed.
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