The purpose of this document is to provide enhanced technical information for Sony Ericsson
repair technicians in order to assist during service, repair and troubleshooting operations on Sony
Ericsson mobile phones. It should be used as a complement to other repair instructions and tools
as notifi ed by the local Sony Ericsson representative.
To search for components throughout the entire document use the “search” function in Adobe
Acrobat Reader 7.0 (or later version) and enter the component name or other word. Use zoom to
enlarge.
For easier navigation of the document you can use the bookmarks that appear in the Bookmarks
tab on the left side of the Adobe Acrobat Reader window. Each bookmark jumps to a page in the
document.
Instruments used
Power supply ........................ Agilent 6632B
This document is Sony Ericsson confi dential and should be treated as confi dential in accordance
with the agreement with Sony Ericsson. This document is intended for use by authorized service
technicians only. Sony Ericsson is not to be held responsible for any damages or losses caused
intentionally or unintentionally due to unauthorised use of the information in this document.
Revision Hi st o ry
Rev.DateChanges / Co mments
16/29/2007Initital revision.
CONTENTS
ABOUT 2
General Information 2
Contents 2
FUNCTION OVERVIEW 3
Description 3
General 3
Mechanical Design 3
RF Parts 3
Logic/Audio Part 5
Antenna 5
Bluetooth 5
IR 6
FM Radio 6
External Connections 6
High Level 7
Radio 8
Baseband 9
Data and Signals 10
Acoustics 11
Power Distribution 12
Baseband Top - Radio Top - Bluetooth - FM Radio 13
Radio - Top 14
Radio - Power Supply 15
Radio - UMTS 16
Radio - GSM 17
Radio - Bluetooth 18
Baseband - Logic Top 19
Baseband - System Control Top 20
Baseband - System Control Clocks and Resets 21
Baseband - System Control Test 22
Baseband - Power Top 23
Baseband - Regulators and Charging 24
Baseband - Power Camera 25
Baseband - Power ASICs 26
Baseband - Power Memories 27
Baseband - Operation & Ser vices Top 28
Baseband - Operation & Ser vices Memories 29
Baseband - Operation & Ser vices GPIO 30
Baseband - Operation & Ser vices ADC & DAC 31
Baseband - Operation & Ser vices MS Pico & SIM 32
Baseband - Operation & Ser vices Connectivity 33
Baseband - UMTS Access Top 34
Baseband - UMTS Access WCDMA 35
Baseband - UMTS Access GSM 36
Baseband - MMI Top 37
Baseband - MMI Keypad 38
Baseband - MMI Display 39
Baseband - MMI Audio 40
Baseband - MMI Camera 41
Baseband - MMI FM Radio 42
COMPONENT OVERVIEW 43
Front Side B - C 43
Front Side D - Z 44
Back Side A - Z 45
Flash Problems - Audio Internal Problems 53
Audio External Problems - Camera Problems 54
FM Radio Problems - Vibrator Problems 55
Memory Stick Problems - Bluetooth Problems 56
Network Problems - Display Problems 57
Test Current Consumptions 58
Tes t Char g i ng 58
Test the ASIC Revisions 59
Test Backup Capacitor 59
Test the Joystick Switch S2504 and Diodes V2503, V2506-09 60
Test the Diode V2500 61
Test the Protection Diodes V2510 to V2514 61
Test the diode V2504 and Switch S2500 62
Test the Switches S2505 & S2506 62
Test the Switch S2502 63
Test the Switches S2503 & S2507 63
Joystick and Other Keys Problems 64
Test the System Connector Protections 64
Reference MP 65
APPENDIX 66
K800 Mechanical Parts List 66
K810 Mechanical Par ts List 70
Part List Main Board 73
Components A1200 74
Components A1300 83
Components B2100, B4100 90
Components C2217, D1400 91
Components D2301, D2304 92
Components H2300, D3100, D3101 93
Components N2000, N2200 94
Components N2202, N2203, N2300 95
Components N2600, N3100, N4100 96
Components N4202, S2500, S2502 97
Components S2504, S2505, S2506 98
Components V2201, V2202 99
Components V2220, V2301, V2552 100
Components V2500, V4101, V2504 101
Components V3101, V3102 102
Components V3103, V3110 103
Components V3113, X1000 104
Components X1002, X2200 105
Components X2301, X2302 106
Components X2501, X2505, X2510 107
Components X2550, X3102 108
Keyboard K800 109
Keyboard K810 110
Display 111
VGA Camera KNC20116 112
Camera Module KNC20125 112
Xenon Flash Module 113
SI Can’t Power On 114
SI Can’t Power On 115
SI Joystick Switch Replacement 116
SI Support Pad for Camera Switch 116
SI Problem with Front Spare Part 117
SI Problem with On/Off Button 117
SI Emma 3 White Screen Patch 118
SIActivate Sporadic Behaviour 118
SI Pre-Confi guration Change 119
SI Vincenne Replacement 120
SI Emma 3 Important Start-Up Operation, SI New Soft ware 120
Tor q ue Se t t ings 121
Placing in a Shield Box 121
ABOUT
1202-3085 rev. 2
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FUNCT I ON OVERVIEW
Description
SEMC Electrical Repair Manual
K800 - K810
DESCRIPTION
1 General
The Sony Ericsson Mobile Communication phone K800 is a 3G dual mode mobile phone
supporting WCDMA and triple band GSM/GPRS in the 900, 1800 and 1900 frequency bands. The
phone is a GPRS class 10 terminal supporting voice, circuit switched (CS) and packet switched
(PS) data. This Sony Ericsson dual mode 3G product is designed to be compatible with all
mandatory GSM phase 2+ recommendations.
The phone has an in-built antenna, a 3.2 Mega Pixel Camera with a lens cover and an associated
xenon fl ash, a VGA-Camera for Video Call, a Display, and a slot for a Memory Stick M2 external
memory.
There is only one size of battery. A connector at the bottom of the phone makes it possible
to connect various accessories like chargers and hands-free units. A USB cable can also be
connected to the bottom connector. The external antenna connector can be used to connect to an
external antenna, disconnecting the internal phone antenna.
The electronic functions are divided into RF parts, logic/audio parts, opto-electronic parts,
Bluetooth parts, an IR transceiver, and an FM radio. The electronics parts consists of the main
PCB with components placed on both sides, the Key-Flexible-PCB that has Key-Matrix-circuit/
LEDs, loudspeaker box with the internal antenna, ear speaker, microphone, vibrator, 3.2 mega
pixel camera, xenon fl ash module, VGA camera, the Display, Bluetooth module, and FM radio
parts. The RF parts are mainly housed in separate modules.
Antenna
RFLogic / audio
Flash
VGA Camera
2.1 Mechanical Design
The phone is built up around a core unit consisting of a plastic frame with the BT antenna
mounted on which the assembled PCB, the cameras, the vibrator, a plastic LCD holder and
the LCD, a plastic keyboard support plate and the keyboard dome foil, the loud speaker box
with loudspeaker and antenna, and the xenon fl ash module are mounted. This core unit is then
snapped and screwed in the front cover together with the keys, joystick, and the M2 cover. The
antenna cover with the sliding camera lens cover is then mounted. The battery fi ts in a dedicated
cavity and is covered with a battery cover.
Dimensions
Length106mm
Width47mm
Thickness18mm (22mm across the lens cover)
Weight115g
2.2 RF parts
2.2.1 GSM 900
The GSM 900 part of the transceiver is including E-GSM and has a frequency range spanning
from 925.2 to 959.8 MHz for the receiver, and from 880.2 to 914.8 MHz for the transmitter. This
gives 174 channels with 200kHz channel separation. The TX – RX frequency separation is always
45MHz.
2.2.2 GSM 1800
FUNCTION OVERVIEW
3.2 MPix Camera
Transmitter
Receiver
3,6V battery
Figure 1. Block diagram of the K800.
Baseband
Control
DC and Return
Bluetooth
IR
CPU
TDMA/CDMA
DSP
AF part
Display
Keyboard
FM radio
External connector
2 Transceiver
This description provides only a simple general description of the transceiver section and its
components.
The GSM 1800 part of the transceiver has a frequency range spanning from 1805.2 to 1879.8
MHz for the receiver, and from 1710.2 to 1784.8 MHz for the transmitter. This gives 374 channels
with 200kHz channel separation. The TX – RX frequency separation is always 95MHz.
2.2.3 GSM 1900
The GSM 1900 part of the transceiver has a frequency range spanning from 1930.2 to 1989.8
MHz for the receiver, and from 1850.2 to 1909.8 MHz for the transmitter. This gives 299 channels
with 200kHz channel separation. The TX – RX frequency separation is always 80MHz.
2.2.4 WCDMA
The WCDMA part of the transceiver has a frequency range spanning from 2110 to 2170 MHz for
the receiver, and from 1920 to 1980 MHz for the transmitter. This gives 12 channels with 5MHz
channel separation. The TX – RX frequency separation is always 190MHz.
2.2.5 RF architecture
VCXO
A voltage controlled crystal oscillator (VCXO) running at 13 MHz is used as a reference for all
frequencies generated in the transceiver.
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FUNCT I ON OVERVIEW
Description
SEMC Electrical Repair Manual
K800 - K810
Antenna
The internal antenna is common for all GSM bands and the WCDMA band. There is an antenna
switch between the antenna and the RF electronics allowing usage of an external antenna.
GSM 900/1800/1900
One synthesizer is used for both RX and TX operation. Direct conversion is used for RX and TX.
In TX mode, the PLL works directly on the transmitted frequency, whereas the RX VCOs operates
at the double received frequency. The LO is then divided by two just before entering the RX mixer.
The main component for the frequency synthesis and up-conversion is the GSM RF ASIC. A
direct modulation concept is used and the base-band chip has, together with the GSM RF ASIC,
all the required functions for direct modulation. The use of direct modulation means that no
intermediate frequency (IF) in the transmitter chain is needed. The receiver is of direct conversion
type, i.e. a homodyne receiver (the RX VCOs operates at two times the received frequency).
Thus, there is no need for any other LOs than a “main loop” in this radio.
The modulated transmitter signal is amplifi ed by a power amplifi er before being routed to the front
end module and the antenna.
The front end module contains all necessary functions for separating GSM and WCDMA, and
routing WCDMA signals to and from the WCDMA RF module. It also contains a TX/RX switch for
GSM for routing the received GSM RF signal to the correct GSM receiver input, and routing the
GSM TX signal to the antenna. Band selection fi ltering for GSM RX is also done in the front end
module.
All the GSM parts including the front end module are housed in a separate module.
WCDMA
The WCDMA receiver ASIC contains the receiver chain, the RF synthesizer and the circuitry
needed for the13 MHz crystal reference oscillator, plus the 2.3GHz RF synthesizer. The
transmitter ASIC is also used to generate the IF signal (4*190MHz) needed in Rx receiver.
The receive signal from the duplexer reaches then the LNA (integrated into the WCDMA RX ASIC)
and the amplifi ed signal is fi ltered by means of an external inter stage SAW fi lter. The fi ltered
signal returns into the WCDMA RX ASIC to be down converted to the IF frequency, 190MHz, by
means of a mixer. The fi rst local oscillator signal is generated in the WCDMA RX ASIC and is
190MHz higher than the input signal, so it ranges between 2300 and 2360MHz.
The IF signal is fi ltered by an external IF SAW fi lter, then amplifi ed and demodulated. After
demodulation, a chain of amplifi ers and low pass fi lters will render the analog I and Q signals.
High pass fi ltering (needed to remove DC offset) is provided externally using series capacitors.
The analog I and Q signals are then processed by the WCDMA signal processor, that contains the
4-bit, analog to digital converters. The sampling rate is 15.36MHz, which is four times the chip rate
(3.84MHz).
2.2.8 GSM/DCS/PCS Transmitter
The I and Q signals generated from the baseband is modulating the output frequency directly, this
is done in the dedicated GSM/DCS/PCS RF ASIC.
An output power control loop, controlled by the logic, is regulating the output power of the power
amplifi er during the burst.
The transmitter has a dedicated GSM/GPRS output power control block with a logarithmic 8 bit
DAC in a mixed signal ASIC, and one dual band power amplifi er. The DAC is controlled by a serial
bus from the GSM/GPRS baseband controller ASIC.
nd
The PA control block applies a transfer function (2
order low pass) to the reference value from
the DAC. This new value becomes an internal reference value. The regulator in the PA control
block measures I
the difference between the I
(feed current to the power amplifi er) and calculates the error signal by taking
PA
and the internal reference signal. This error signal is integrated
PA
(PI-regulator) and then adjusts the PA regulator voltage to cancel the error. The PAREG signal is
fi ltered by a low-pass to give a smooth ramping signal.
2.2.9 WCDMA Transmitter
FUNCTION OVERVIEW
2.2.6 GSM/DCS/PCS Receiver
The fi rst stage of the receiver is a band selection fi lter, which suppresses unwanted frequencies.
The receiver is a homodyne receiver. The local oscillator frequency is generated by a frequency
synthesizer, which allows the receiver to be set at frequencies in intervals of 200 kHz. The
synthesizer is controlled from the logic/audio part. The receiver chip also contains A/D converters,
and thus I and Q samples are sent to the logic/audio parts as serial data.
2.2.7 WCDMA Receiver
The receiver is of classical super-heterodyne type, with intermediate frequency at 190MHz.
The signal picked up from the antenna is sent, through the antenna switch (which is used to switch
among GSM TX/RX, DCS TX/RX, PCS TX/RX and UMTS) to the WCDMA duplexer.
The main purpose of the WCDMA duplexer is to route the received signal from the antenna
towards the receiver, while simultaneously allowing the transmitter signal from the PA to go to the
antenna and limiting the leakage from the PA to the LNA inside the receiver ASIC.
QVGAVGA
6 bit2 bit
HGBUFFERBIAS
3 bit
Buff gain,
1 bit
PA-DAC
8 bit
Po we r con tro l DA C,
8 bit
PA -
Module
DC/DC for PA
Figure 2. WCDMA transmitter.
The picture above shows in a generalized the way how the WCDMA transmitter works. A TX
ASIC is able to generate a dynamic range of more than 81dB while the power amplifi er work as an
amplifi er with fi xed amplifi cation.
The VGA, QVGA and “HGBufferbias” plus “Buffgain” are all inside the TX ASIC.
1202-3085 rev. 2
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FUNCT I ON OVERVIEW
Description
SEMC Electrical Repair Manual
K800 - K810
The TX ASIC is the main component for controlling the power. The VGA is able to handle at least
50dB power dynamic in 1dB steps while the QVGA handles 1dB in 0.25dB steps.
“Buffgain” is a programmable PA buffer in which the bias current is optimized and fi nally is the buffer
possible to be used in low gain mode, which generates about 30dB lower output power compared
with the highest output setting.
The PA has also a variable voltage created by a DC/DC converter. By changing the PA voltage it’s
possible to have a better effi ciency and it’s done with the reference signal from a DAC.
It’s also possible to change the bias current in the PA by tuning a DAC.
By combining the variable voltage and bias current it’s possible to have the best current effi ciency
and still cope with the linear performance demands.
2.3 Logic/Audio Part
2.3.1 Functions
The purpose of the logic part is to control and monitor the transmission and reception functions of
the mobile phone and to maintain contact with the mobile phone system. The logic therefore has
links to all the relevant parts of the radio. Its functions, with reference to the radio, include selection
of radio channel and control of the transmitter power and the overall radio timing. It also generates
the base-band modulation after encryption, channel coding and demodulates the received baseband signal including equalization, decryption and channel decoding.
2.5 BLUETOOTH
TM
The Bluetooth implementation is compliant with Bluetooth specifi cation 2.0 + EDR
2.5.1 RF part
TM
The Bluetooth
transceiver has frequency channels with 1 MHz separation from 2402 to 2480
MHz. The same band is used for both transmission and reception. This gives 79 frequency
channels.
2.5.2 Frequency generation
TM
The Bluetooth
transceiver uses the 13 MHz system clock as reference clock to the synthesizer.
One synthesizer is used for both RX and TX. To separate the receiver from the transmitter an
integrated antenna switch is used.
2.5.3 Receiver
The fi rst stage of the receiver is an external antenna fi lter, which suppresses unwanted
frequencies. The receiver is of a “near-zero” IF receiver architecture. The local oscillator is
generated by a frequency synthesizer, which allows the receiver to be set at frequencies in
intervals of 1 MHz. The synthesizer is controlled from the logic part.
The received signal is sampled in the logic for later signal processing.
2.5.4 Transmitter
FUNCTION OVERVIEW
Its functions, with reference to the audio parts, include volume control of the earphone and
loudspeaker. Speech codec and PCM A/D and D/A are also performed here, together with the
appropriate audio frequency fi ltering.
The external tasks of the logic part include monitoring and control of links with the control unit and
power supply and also the communication to the SIM/USIM and external units connected to the
external connectors.
The Logic/Audio part also includes a 32.768 kHz XTAL used for the real time clock.
2.4 Antenna
The in-built antenna is made as a pattern on a fl exible printed circuit foil supported by a plastic
carrier containing the loudspeaker and attached to PCB. This HDA type antenna is fed via 2
contacts springs, one grounded and one connected to RF signal.
The antenna signal is also accessible through the external antenna connector located at the upper
part on back of the phone.
The synthesizer generates the TX frequency which modulated by the BT baseband
block. It
is then amplifi ed. The BT system is a class 1 device with maximum of +4 dBm output power
(minimum setting is about -50 dBm).
2.5.5 Logic/Audio part
The purpose of the logic part is to control and monitor the transmission and reception functions of
TM
the Bluetooth
transceiver in the mobile phone. The logic therefore has links with all the relevant
parts of the radio. Its functions, with reference to the radio, include selection of radio channel and
control of radio timing. It also generates the data to be sent over the link after burst building and
channel coding. The logic/audio part also demodulates the received base-band signal including
channel decoding.
Its functions, with reference to the audio parts, include a PCM interface.
2.5.6 Antenna
The antenna is in-built and located in the bottom part of the phone. The antenna is in contact with
the PCB by means of two metal springs.
1202-3085 rev. 2
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2.6 IR
The IR transceiver is IrDA compatible.
FUNCT I ON OVERVIEW
Description
SEMC Electrical Repair Manual
K800 - K810
2.7 FM radio
The FM radio receiver is a stereo radio able to decode RDS information.
2.7.1 RF part
The FM radio can tune to the US/European broadcast FM frequency band, 87.5 – 108 MHz
2.7.2 Frequency generation
The FM radio receiver uses a 32.768 kHz reference clock to tune the local oscillator.
2.7.3 Receiver
The RF signal to the FM radio is fi rst fed into a low noise amplifi er. The amplifi ed signal is then
mixed with the local oscillator. The IF is of low frequency-type.
The signal is then further amplifi ed, limited and demodulated. The demodulated signal is fed into a
decoding circuitry where the right and left audio signals and RDS information are separated.
2.7.4 Logic part
The logic part of the FM radio controls the frequency tuning system, and various settings within
the FM radio system. It also handles the communication, including transfer of RDS data, with the
CPU of the mobile phone. The communication with the CPU is over a two-wire I
2
C interface.
FUNCTION OVERVIEW
2.7.5 Antenna
The cord to the portable hands-free headset functions as the antenna for the FM radio.
2.8 External Connectors
External units are connected to the transceiver by means of a 12-pin connector on the bottom of
the phone. The pin numbering is starting from the left when looking at the system connector with
the back of the phone up.