APPENDIXCOMPONENT OVERVIEW FUNCTIONAL OVE R VIEWABOUTABOUTTROUBLESHOOTING MEASUREME NT POINTS
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ABOUT
ABOUT Contents
SEMC Troubleshooting Manual
K630 - V640 - K660
General information
The purpose of this document is to provide enhanced technic al information for Sony Ericsson
repair technicians in order to assist during service, repair and troubleshooting operations on Sony
Ericsson mobile phones. It should be used as a c omplement to other repair instructions and tools
as notified by the local Sony Ericsson repre sentative.
To search for components throughout the entire document use the “search” function in Adobe
Acrobat Reader 7.0 (or later version) and enter the component name or other word. Use zoom to
enlarge.
For easier navigation of the document you can use the bookmarks that appear in the Bookmarks
tab on the left side of the Adobe Acrobat Reader window. Each bookmark jumps to a page in the
document.
Disclaimer
This document is Sony Ericsson confidential and should be t reated as confi dential in accordance
with the agreement with Sony Ericsson. This document is intended for use by authorized service
technicians only. Sony Ericsson is not to be held responsible for any damages or losses caused
intentionally or unintentionally due to unauthorise d use of the information in this document.
Revision History
Rev. Date Changes / Comments
1
06/20/2008 Initital revision.
ABOUT 2 Connectivity Connectivity 40
General Information 2
Contents 2 Imaging Top 42
TROUBLESHOOTING 3 Imaging Camera 44
Equipment List 3 Access Top 45
On/Off Problems 9 Access GMS & UMTS 46
Flash Problems 9 Access Bluetooth 47
Dead Phone Problems 10 Audio Top 48
Display Problems 11 Audio Analog 49
Display Illumination Problems 11 Audio Digital 50
Key Problems 12 FM Radio 51
LED Problems 12 Test 52
Main and VGA Camera Problems 13 Squid RF Module - Radio Top 53
Vibrator Problems 13 Squid RF Module - Radio Cont UMTS 54
Charging Problems 14 Squid RF Module - Radio Duplex 55
USB/VBUS Charging Problems 14 Squid RF Module - Radio Top UMTS 56
SIM Problems 15 Squid RF Module - Radio Receiver UMTS 57
Memory Stick Problems 15 Squid RF Module - Radio Synthesizer UMTS 58
Audio Internal Problems 16 Squid RF Module - Radio Power Amplifi er UMTS 59
Audio External Problems 16 Thor RF Module - Top 60
FM Radio Problems 17 Thor RF Module - GSM/EDGE Tx + FEM 61
Bluetooth Problems 17 Thor RF Module - GSM/EDGE Rx + Synth 62
GSM Network Problems 18
WCDMA Network Problems 18 COMPONENT OVERVIEW 63
System Connector Protection Test 19 Front Side 63
Current Consumption Test 19 Back Side 64
Battery and Current Calibration Test 21
Backup Capacitor Test 21 FUNCTIONAL OVERVIEW 65
Charging Test - ASIC Revision Test 22 Technical Description 65
Reference Measurement Points 23 Block Diagram Access 75
MEASUREMENT POINTS
Front Side 24 APPENDIX 77
Back Side 25 Replaceable Parts 77
Top Schematic 26 Components - B2100, B3100, L2200 78
Application & System Performance Top 27 Components - L2401-04, N1002, N1200 79
System Top 28 Components - N1210, N1400 80
System Control - Clocks & Resets 29 Components - N2203, N2204, N2205 81
System Memories 30 Components - N3100, N3101, S2400-03 82
PoP IF 31 Components - V2202, V2206, V2405 83
Power Top 32 Components - V2420-21, V3101-10, V4201 83
Power Regulators & Charging 33 Components - X1001-03, X1200, X1201-03 84
Power Camera 34 Components - X2200, X2402 85
Power ASICs 35 Components - X2403, X2490, X4200, X4310 86
Power Memories 36 Components - X4300 87
Connectivity Top 37 Troubleshooting Software Documentation 88
Connectivity ADC & I2C 38 Troubleshooting Fixture Setup Instructions 95
Connectivity Cards 39
24
Connectivity Keypad 41
Imaging Display 43
Block Diagram Application 76 ME
ABOUT
1215-3608 rev. 1
2 (96)
TROUBLESHOOTING Equipment List
SEMC Troubleshooting Manual
K630 - V640 - K660
K630, V640 and K660 Equipment List
K630 and V640
TRS Fixture Kit
K630 and V640
Location: CSPN-Repair Instructions-Electrical- K630, V640 -Equipment List
K660
Location: CSPN-Repair Instructions-Electrical-
K660
-Equipment List
Dummy Battery
K630 and V640
Location: CSPN-Repair Instructions-Electrical- K630, V640 -Equipment List
Part number: NTZ 112 533
K660
Location: CSPN-Repair Instructions-Electrical-
K660
-Equipment List
Part number: NTZ 112 533
Instruments
Power Supply Channel 1 VBATT
Agilent 6632B or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
TROUBLESHOOTING
Note: Additional information about the equipment used for TRS can be found in the Repair
Tools Catalogue on CSPN or on the following location: CSPN – Repair Instructions – Electrical –
K630, V640 – Equipment List.
K660
Instrument Settings:
Voltage: 3.8 Volt
Limiter: 2A
Note: During the calibration the accurate voltage from the VBATT must be within ±0.015 V. If
this is not fulfilled it will result in a faulty calibration. (For more information about
recommended power supply units, see the Repair Tool Catalogue on CSPN under the Mechanical
level. The Power Supply Channel 1 VBATT must allow reverse current.
Note: Maximal cable length between the Power Supply Channel 1 VBATT and the dummy
battery must be maximum 1m. The cable must have a capacity for at least 16A.
Note: It is very important to follow instrument settings instructions when performing the
Battery Calibration Test.
Power Supply Channel 2 DCIO/SEPI
Agilent 6632B or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Instrument Settings:
Voltage: 5.0 Volt
Limiter: 2A
Note: It is very important to follow instrument setting instructions when performing the
Current Calibration Test.
Note: Additional information about the equipment used for TRS can be found in the Repair
Tools Catalogue on CSPN or on the following location: CSPN – Repair Instructions – Electrical –
K660– Equipment List.
Oscilloscope
Tektronix TDS 2012 or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Digital Multimeter (DMM)
Fluke 83 or similar
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TROUBLESHOOTING Equipment List
SEMC Troubleshooting Manual
K630 - V640 - K660
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
The 0, 64 mm Test Probes is recommended by Sony Ericsson when DMM is in use see picture 1.
Picture 1
Spectrum Analyzer
HP 8595E or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
RF probe
HP 85024A or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Mobile Phone Tester
Yokogawa VC230 or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Part number: LTN 214 1484
See Picture 3.
FM Signal Generator
Agilent E4433B or similar
Location: -
RF Adaptor
Adaptor 33 N-BNC-50-1
Adaptor to Signal Generator RF Output
See Picture 2
Location: -
Picture 2
Picture 3
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TROUBLESHOOTING Equipment List
SEMC Troubleshooting Manual
K630 - V640 - K660
Cables
USB Computer Cable
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
See Picture 4.
Picture 4
DSU-60/USB Cable
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Part number: KRY 101 1413
RF Test Cable Flexible
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Part number: RPM 119 885
See Picture 5.
Power Cable RED to Power Supply Channel 1 VBATT
Maximum Length: 1m
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Power Cable BLACK to Power Supply Channel 1 VBATT
Maximum Length: 1m
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Customized Power Supply Channel 2 DCIO/SEPI Cable
To perform Current Calibration the phone must be supplied directly through the system
connector. Customize the cable according to following instructions:
STEP 1:
Take the CST-75 battery charger and cut off the charger according to Picture 7.
Picture 7
TROUBLESHOOTING
Picture 5
SEPI Interface Cable – A1
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Part number: KRY 101 1119/1
See Picture 6.
Picture 6
Note: Cable length must be exact 1.3m.
STEP 2:
Connect the CST-75 charger Red or White wire to the Plus Output and the Black wire to the
Minus (GND) Output at Power Supply Channel 2 DCIO/SEPI according to Picture 8.
Picture 8
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TROUBLESHOOTING Equipment List
SEMC Troubleshooting Manual
K630 - V640 - K660
STEP 3:
Cut off isolation material from inside of the charger plug according to Picture 9.
Picture 9
STEP 4:
Connect DCIO and SEPI Interface Cable – A1 cables according to Picture 10.
Picture 10
Power Supply Channel 2 DCIO/SEPI Cable Connection Setups
Correct DCIO/SEPI Cable setup when TRS Fixture is used.
Picture 12
TROUBLESHOOTING
Note: Example of DCIO/SEPI and K750 TRS Fixture Setup.
Correct DCIO/SEPI Cable setup when the Dummy Battery is used.
Picture 13
Wrong setup.
Picture 11
Picture 14
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TROUBLESHOOTING
Equipment ListEquipEquipment Listment List
SEMC Troubleshooting Manual
K630 - V640 - K660
Customized FM Radio Cable
STEP 1:
Use Cable according to Picture 15
Picture 15
Product Name: Test lead BNC-4mm 1,5m
Product Description: Test lead with 4 mm lab plugs at one end and a BNC plug at the other.
Manufacturer: PMK Germany
Location: http://www.elfa.se/en/
or other supplier.
Part number: 46-310-40 (Note: This is ELFA part number)
STEP 2:
Cut the Red lab plug according to Picture 16
Picture 16
STEP 4:
Use only wire connected to Pin2 and cut all other wires according to Picture 18.
Use a digital multimeter instrument (DMM) and perform diode measurement to select the wire
connected to Pin2 at hands free system connector plug.
Picture 18
STEP 5:
Connect by soldering cable from Picture 16 and cable from Picture 18 according to Picture 19.
Picture 19
TROUBLESHOOTING
STEP 3:
Use any Portable Handsfree (PHF) Cable and cut according to Picture 17
Picture 17
Note: Minimum Cable length 40 cm.
Test Cards
Local SIM
Any functional Local SIM Card, see Picture 20
Picture 20
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TROUBLESHOOTING Equipment List
SEMC Troubleshooting Manual
K630 - V640 - K660
Test SIM GSM/UMTS
One Test SIM GSM/UMTS is needed to perform Current Consumption Test, see Picture 21.
Location: To buy a Test SIM GSM/UMTS, please contact your supplier of test equipment.
Picture 21
Sony Memory Stick M2
Any functional Memory Stick Micro M2 Card, see Picture 22
Picture 22
SMK RF Probe
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Part number: SXA 109 6356
TROUBLESHOOTING System Connector Protect io n Test - Current Cons u mpt io n Test
SEMC Troubleshooting Manual
K630 - V640 - K660
System Connector Protection Test
Perform Diode and Ohm measurements with a Multimeter
Connect the black probe at ground (Pin 9 on the system connector, X2400)
Pin 1
Diode
Pin at
X2400
1 0L 27K No Action
2 0.0 1.4 No Action
3 2.0 12K
4 1.0 1K
5 0.0 82
6 0.0 82
7 0L 0L Not connected Not connected
8 1.4 1.5K
9 0 0 No Action No Action
10 0L 430K No Action
Measurements
/ Volt
Measurements
/ Ohm
11 0L 470K No Action
12 0L 80K
Pin 9GND Pin 12
Ohm
SL 4 Action SL 5 Action
D2405 if lower than 27KΩ
R2433 if higher than 27KΩ
L2400 and L3301
If higher than 1.4Ω
N3101 if lower than
12KΩ L2401 if higher
than 12KΩ
N3101 if lower than
1KΩ L2402 if higher
than 1KΩ
N3101 if lower than
82Ω L2403 if higher
than 82Ω
N3101 if lower than
82Ω L2404 if higher
than 82Ω
V2420 if lower than
1.5KΩ
L2407 If higher than 12KΩ
L2408 if higher than 1KΩ
L2410 if higher than 82Ω
L2409 if higher than 82Ω
L2405, R2440, R2436
if higher than 1.5KΩ
D2405 if lower than 430KΩ
R2432 if higher than
D2405 if lower than
470KΩ R2431 if higher
than 470KΩ
V2421 if lower than
80KΩ
430KΩ
Current Consumption Test
Step 1:
Insert Local SIM Card and use the phone with the Normal SW (SSW) and dummy battery connected to
Power Supply Channel 1 VBATT according to Picture 1.
Instrument settings: Voltage: 3.8 Volt, Limiter 3A.
Measure the current when the Phone is off. Check the current consumption at Power Supply Channel 1
VBATT.
Picture 1
Current consumption in off mode should be less than 1mA.
If more than 1mA go to Dead Phone problems part 1 TRS guide.
Step 2:
Start the phone:
Measure the deep sleep current max 6mA typical between 0-3mA.
Make sure that the operator is running with deep sleep. (This operation can be switched off by operator if
the network is busy).
If the phone is using more than 6mA, then go to EMMA III and perform Software Update Contents Refresh
(SUCR).
Step 3 with Mobile Phone Tester Instrument
Insert Test SIM Card and use the phone with the Normal SW (SSW) and dummy battery connected to Power
Supply Channel 1 VBATT according to Picture 1.
Instrument settings: Voltage: 3.8 Volt, Limiter 3A.
Use the Mobile Phone Tester Instrument in signalling mode directly connected to the phone with the RF
Connector or use Shield Box if not possible. Phone Display must be on during these tests to get correct
current measurements.
Perform Radio TX measurements at GSM and WCDMA Band and compare the result with limits according to
the text below.
Transmitter current 850 MHz at Ch: 128 power level 5. Typical 400mA
Transmitter current 900 MHz at Ch: 1 power level 5. Typical 385mA
Transmitter current 1800 MHz at Ch: 512 power level 0. Typical 365mA
Transmitter current 1900 MHz at Ch: 512 power level 0. Typical 365mA
Transmitter current WCDMA BAND I Low RX Ch: 10562 at 23dBm output power Max 850mA
TROUBLESHOOTING
If the current consumption is not correct, the fault could be fixed by running SERP calibration if not then go
to GSM and WCDMA Network problems TRS guides.
If the current consumptions are equal to test limits then go to Charging Test.
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TROUBLESHOOTING Current Consum pt io n Test
SEMC Troubleshooting Manual
K630 - V640 - K660
Step 4 with Fault Trace SW application:
-
Flash the phone with ITP SW
-
Use the TRS Fixture
-
Connect the:
Power Supply Channel 1 VBATT:
Instrument settings: Voltage: 3.8 Volt, Limiter 3A
Power Supply Channel 2 DCIO/SEPI
Instrument settings: Voltage: 5 Volt, Limiter 2A
-Connect DCIO/SEPI Cable to the phone
Perform the following tests:
-Max TX Power GSM 850 MHz
Fault Trace SW settings:
TX and RX GSM
GSM Mode Settings:
TX Switched
GSM Radio Settings:
Select Band: GSM 850
Channel: 128
Power Level: 5
-Max TX Power WCDMA BAND I
Fault Trace SW settings:
TX and RX WCDMA
Radio Settings:
Select Band: BAND I
Fast Select Channels: Ch LOW
Modes: Max Pwr 23dBm
Compare the current consumption during Max TX Power Tests with the current consumption limits below.
Transmitter current GSM 850 MHz at Ch: 128 power level 5. Typical 175mA
Transmitter current GSM 900 MHz at Ch: 1 power level 5. Typical 185mA
Transmitter current GSM 1800 MHz at Ch: 512 power level 0. Typical 170mA
Transmitter current GSM 1900 MHz at Ch: 512 power level 0. Typical 145mA
Transmitter current in WCDMA BAND I RX Ch Low: 10562 Max power level 23 dBm and Rx on 575mA
Tolerance: ±10%
If the current consumption is not correct, the fault could be fixed by running SERP calibration. If it does not
work then go to GSM and WCDMA Network problems TRS guides.
If the current consumptions are equal to the sheet go to Charging Test.
TROUBLESHOOTING
-Max TX Power GSM 900 MHz
Fault Trace SW settings:
TX and RX GSM
GSM Mode Settings:
TX Switched
GSM Radio Settings:
Select Band: GSM 900
Channel: 1
Power Level: 5
-Max TX Power GSM 1800 MHz
Fault Trace SW settings:
TX and RX GSM
GSM Mode Settings:
TX Switched
GSM Radio Settings:
Select Band: GSM 900
Channel: 512
Power Level: 0
-Max TX Power GSM 1900 MHz
Fault Trace SW settings:
TX and RX GSM
GSM Mode Settings:
TX Switched
GSM Radio Settings:
Select Band: GSM 900
Channel: 512
Power Level: 0
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TROUBLESHOOTING Batter y a nd Cu rrent Calibration Test - Backup Capacitor Test
SEMC Troubleshooting Manual
K630 - V640 - K660
Battery and Current Calibration Test
Use the Phone with the ITP SW
Instrument settings for the Battery Calibration Test
Power Supply Channel 1 VBATT:
X Volt according to the Fault Trace SW Test Instructions:
Fault Trace SW-Logic-Phone Power-Battery Calibration and follow test instructions.
Limiter: 2A.
Power Supply Channel 2 DCIO/SEPI:
5.0 Volt
Limiter: 2A
If the test Is performed at the Core Level then use dummy battery according to the Equipment
List. If the TRS Fixture is used no dummy battery is needed.
Note: Maximal cable length between Power Supply Channel 1 VBATT and the dummy battery
or the TRS Fixture must be 1m. The cable must have a capacity for at least 16A.
Measure the voltage at the Backup capacitor by using Fault Trace SW- Logic - ADC Values –
Read ADC Value (Reading 1).
Step2:
This step should be done 30 seconds after Step 1. Measure the voltage at the Backup capacitor
by using Fault Trace SW - Logic – ADC Values - ADC Channels – Read ADC Value
(Reading 2).
Step3:
Compare the difference between Reading 1 and Reading 2 with the reference table below. If the
Reading 1 value is between 50 and 680 go to Interval 1, if between 681 and 800 go to Interval
2, if between 801 and 880 go to Interval 3 and compare with the Reading 2 – Reading 1 Min and
Max Limits.
TROUBLESHOOTING
Instrument settings for the Current Calibration Test
If the test is performed at the Core Level then use dummy battery according to the Equipment
List. If the TRS Fixture is used no dummy battery is needed.
Note: The Power Supply Channel 1 VBATT must allow reverse current.
Note: Maximal cable length between Power Supply Channel 1 VBATT and the dummy battery
or the TRS Fixture must be 1m. The cable must have a capacity for at least 16A.
Note: Length of the Power Supply Channel 2 DCIO/SEPI customized cable must be exactly
1,3m.
Power Supply Channel 1 VBATT:
3.8 Volt
Limiter 2A
Power Supply Channel 2 DCIO/SEPI:
5.0 Volt
Limiter: 2A
Limits Table for the Current Calibration Test
Measured Current Name Min Max Unit
100mA
800mA
DCIO Current 50 150 mA
DCIO Current 725 875 mA
Reference Table:
Min Max Unit
Absolute readout Reading 1 50 880 Dec
Reading 1 (Dec) Reading 2 – Reading 1 (Dec)
Min Max
Interval 1 (50 – 680) 20 210
Interval 2 (681 – 800) 5 30
Interval 3 (801 – 880) 0 10
Note: The upper table contains the absolute limits for the readouts. The lower table contains
the allowed delta between the first and the second readout, separated in time with 30 seconds.
If reading is out of the test limits then replace C2217 Backup capacitor.
If problem is not solved then SL 5 Replace N2000 SL 4 Escalate.
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TROUBLESHOOTING
Charging Test - ASIC Revision Test
SEMC Troubleshooting Manual
K630 - V640 - K660
Charging Test
To perform this test use:
-Phone with the Normal SW (SSW)
-Dummy Battery connected to Power Supply Channel 1 VBATT
-Fault Trace SW choose General – Asic Revisions – Read All
Reference return value can be found in the table below.
TROUBLESHOOTING
Power Supply Channel 1 VBATT must allow
If the charging current is Not equal to the reference table go to Charging problems TRS
Guide.
If the charging current is equal to reference table then insert the normal battery and test the
charging current to define if the phone battery is working properly.
Measure the voltage at the battery to define the current level.
If the battery is receiving the right current, then the phone and the battery are working
properly.
reverse current.
ASIC Description Part Number Return Value (hex)
D2000 CPU (Anja) 1200-0186 0x2C8
N2000 Power Management (Vera) 1000-8142 0xC5
N1400 Bluetooth:
Firmware Revision
Chip ID
1200-6182
0x5,0x1
0x0,0x0,0x0,0x0
Will always return 0
on STLC because
Chip ID is not
supported.
N1400 FM Radio 1200-6182 0x800
1215-3608 rev. 1
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TROUBLESHOOTING
V
o
V
h
V
o
A
V
a
A
V
V
oltages to N2000WCDMA N1210
MPMP 92 (PBA GND)MP 63 (X2200 Pin 3)MP 89 (TP2200)MP 87 (TP2202)MP 26 (C2242) Power sup 3.80 VUse Fault Trace SW to activate and deactivate WCDMA Radi
Pnone Off0.00V3.8V3.8V0.00V3.8VVCC_WPAWPAVCCDCDC_ENVccAVDDE18
Phone On0.00V3.8V3.8V0.00V3.8VWCDMA Radio Off0.00V0.00V0.00V2.8V1.8V
Phone Off0.00V Power sup 0.00 VoltVGA Camera On1.8V2.8V1.8V13MHz19MHz
Phone On1.8V Power sup 3.80 Volt
VAUDIO26VANA25VDDE18VBT27VDIGUse Fault Trace SW to activate and deactivate Bluetoot
0.00V0.00V0.00V0.00V0.00V Power sup 0.00 VoltMPMP 69 (ST1401)MP 66 (C1408)MP 73 (C1409)MP 64 (C1412)MP 10 (R2118)MP 22 (ST2105)Power sup 3.80 Volt
Bluetooth On2.7V1.8V2.7V1.8V26MHz32.768kHz
VCORE12VccAVDD_LPVBACKUPMPMP 68 (C3304)MP 65 (C3305)MP 67 (R3301)Power sup 3.80 Volt
0.00V0.00V2.2V2.2V Power sup 0.00 VoltVBATIVDDE18RTCCLK
C2217 Completely charged
Memory Card
Memory Card inserted
RTCCLKPhone Off0.00V
Main Camera
Use Fault Trace SW to activate and deactivate Main Camera. Main Camera must be connected to the PB
RTCCLKMain Camera Off0.00V0.00V0.00V0.00V0Hz0Hz
GA Camer
Use Fault Trace SW to activate and deactivate VGA Camera. VGA Camera must be connected to the PB
VCORE18VGA Camera Off0.00V0.00V0.00V0Hz0Hz
TROUBLESHOOTING
MCLK 26MHz from N1200
MPMP 9 (R2106)
ChargingPhone On26MHz Power sup 3.80 Volt
Charging off 1:
DCIO/SEPI not connected.
Charging off 2:
DCIO/SEPI connected.
MPMP 126 (C2201)MP 28 (C2241)MP 109 (V2202 Pin2)MP 106 (R2201) Power sup 3.8 Volt
Charging off 10.00V3.6V3.2V3.8VCharger voltage 0.0 VoltMPMP 25 (ST2201)Power sup 3.80 Volt
Charging off 25.0V4.7V4.7V3.8VCharger voltage 5.0 Volt VBUS
Charging 100mA5.0V4.8V3.8V3.8VCharger voltage 5.0 Volt
Charging 800mA4.5V4.3V2.3V4.2VCharger voltage 5.0 Volt
Charging 100mA: Use
Fault Trace SW:
Start Current Calibration----->
Set VBATT to 3.8
Note: The Current Calibration
Test must be repeted if current
consumtion going under 50mA
at Power Supply Channel 2
when you performing this
measurements.
DCIODCIO_INTCHREGCHSENSEPUSB cable connected to PC
Charging 800mA: Use
Fault Trace SW:Start
Current Calibration-->Set
VBATT to 3.8V-->Perform Step1
Note: The Current Calibration
Test must be repeted if current
consumtion going under 725mA
at Power Supply Channel 2 when
you performing this
measurements.
Phone Off0Hz Power sup 3.80 Volt
BUS
USB Cable disonnected from the
phone
USB Cable connected to the
phone
The K630, V640 and K660 are using the U360 platform provided by Ericsson Mobile Platform
(EMP)
Baseband Part
Analog Baseband Controller
Power Management
N2000 (Vera)
This component is not replaceable on SL 4 because Baseband calibration is required.
The analog baseband controller is a mixed digital and analog device
that supports the following circuitry:
• Power management circuitry
• Voltage regulation circuitry
• Eight Low Dropout (LDO) regulators and low power regulator
• 600 mA integrated Buck regulator
• Boost step-up DC/DC converter for White Light Emitting Diode (WLED) driving
• Battery charging and communication circuitry
• Battery fuel gauging circuitry
• Analog-to-Digital Converter (ADC)
• SIM interface
• Six programmable LED drivers
• Accurate band gap reference
• Vibrator driver
• Real Time Clock (RTC)
• Eight-byte One-Time Programmable (OTP) memory
• Pulse Code Modulation (PCM) voice coder/decoder
• PCM audio coder/decoder
• Microphone interface
• Stereo line input
• Earphone driver
• Earpiece driver
• 8-Ω speaker driver / Stereo line output
The analog baseband controller is controlled by an I2C™ interface. It also comprises
the main power management circuits, equipped with a number of converters and
regulators for generating the required supply voltages.
FUNCTIONAL OVE R VIEW
1215-3608 rev. 1
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FUNCTIONAL OVERVIEW
Technical Description
Functional Blocks of the Analog Baseband Controller.Connection Diagram
SEMC Troubleshooting Manual
K630 - V640 - K660
FUNCTIONAL OVE R VIEW
1215-3608 rev. 1
67 (96)
FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
K630 - V640 - K660
Charger Control
A programmable charger is used for battery charging.
Limits can be set for the output voltage at CHSENSE- and the output current from DCIO
through the sense resistor to CHSENSE-.
The programmable charger is enabled or disabled by the assertion/negation of the
external signal DCIO. Parts of the programmable charger are activated and deactivated
depending on the level of VBAT. The rest of the programmable charger is activated and
deactivated through I2C.
The programmable charger supports the following functions:
• Constant current charging
• Constant voltage charging
• Trickle charging
• PWM controlled charging
• Over-voltage and over current detection
• Watchdog termination
• DCIO assertion/removal detection
• Voltage and current measure functions
• Low resistive path (reverse mode)
The programmable charger is able to control the voltage and limit the current to a load
seen at CHSENSE-. The programmable charger can also be run in PWM mode to turn
the charging on and off in accordance with the particular period and duty cycle. When the
charging is on, it is set to the current and voltage selected by I2C.
A low resistive path from VBAT to DCIO can be formed when DCIO is not detected. When
this setting is done in the appropriate registers, a lowering of CHREG to 0 V turns on the
external pass device. The pass device is automatically turned off when an external source
is detected on DCIO, or when the watchdog termination block times out. The watchdog
termination block must be active when the external switch is enabled, both in normal
charging mode and in the low resistive path mode. The watchdog is set through the serial
interface, and if it has not been set again before timeout, the watchdog turns off the
external switch. The watchdog is disregarded during trickle charging.
When no battery is present, the system can be booted and supplied from DCIO by
applying the correct voltage on DCIO.
Resistance Identification and Temperature Measurement
The resistance identification mode utilizes the constant current source to feed the battery
data output while monitoring the voltage at the battery data node with general purpose
ADC. The conversion is started through I2C.
Resistance Identification (A) and Temperature Measurement (B)
SIM Interface
The SIM interface supplies level shifting between the digital baseband controller and the
SIM/USIM card. Moreover, hard-wired SIM deactivation functionality manages removal of
a SIM card that has not been powered down.
Block Diagram of the SIM Interface.
FUNCTIONAL OVE R VIEW
USB Charger
The analog baseband controller contains a standalone USB charger. The USB charger
has a separate input and incorporates full functionality during low VBAT.
The programmable charger supports the following functions:
• Trickle charging
• Constant current charging
• Watchdog termination
• Trickle LED indication
• VBUS assertion/removal detection
CODEC Overview
The CODEC is encoding analog audio signals and analog voice signals into digital signals
using ADCs. This is done in the coder section of the CODEC, also named the TX path
(transfer section). The CODEC is also decoding digital audio signals and digital voice
signals into analog signals using DACs. This is done in the decoder section of the
CODEC, also named the RX path (receiver section).
1215-3608 rev. 1
68 (96)
FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
K630 - V640 - K660
CODEC Block Schematic
CODEC CCO Voltage Source
There is an internal voltage source CCO that provides the necessary drive current for
electret microphones. The voltage source is I²C programmable to 2.2 V or 2.4 V. The
source can be disabled during standby. A typical use case with a microphone connected
to MIC1 and the CCO is shown in picture below.
Earphone Amplifier
The earphone amplifiers (BEARP and BEARN) are mainly intended to be differentially
configured and drive a low impedance dynamic transducer (earpiece) but they can also
be single ended configured. The BEARP and BEARN amplifiers can be powered down by the I2C.
The amplifiers can exhibit high impedance to 1.4 V or low impedance to ground when powereddown. Fifty-one gains are available for BEARP and BEARN: from +15 dB down to –60 dB in
1.5 dB steps. When the BEARP and BEARN outputs are operating in differential mode, an I²C
selectable bit must invert one of the inputs.
FUNCTIONAL OVE R VIEW
1215-3608 rev. 1
69 (96)
FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
K630 - V640 - K660
Digital Baseband Controller (CPU)
D2000 (Anja)
This component is not replaceable on SL 4 because Baseband calibration is required.
The Digital Baseband Controller is divided in two subsystems:
-Application
-Access
Access Subsystem
All modem functionality in the digital baseband controller resides in the Access
subsystem. This includes EDGE/GPRS/GSM interface, WCDMA interface, USB, and other
peripheral modules. The control CPU is an ARM926 and a DSP is used for signal processing and
layer one control code. The main communication between the blocks in the Access subsystem is
done through the Advanced High-performance bus (AHB) matrix, which is a set of control buses
connecting the different parts together. A block called Syscon is responsible for distributing
clocks and resets to all parts of the Access subsystem. This block is under SW control. The
Access subsystem is connected to the Shared EMIF, an interface for communication with an
external SDRAM. The interface has 39 signals (including one chip select) and supports memory
sizes up to 512 Mbit. The Shared EMIF is shared between the Access subsystem and the
Application subsystem.
Application Subsystem
Functional blocks of the Digital Baseband Controller
The Application subsystem contains functionality related to functions such as MMI,
graphics, audio and memory media. The control CPU is an ARM926 with three external
memory interfaces, one shared with the Access subsystem and two dedicated for the
Application subsystem. The Application subsystem contains several blocks. The main
communication between the blocks is done through the Advanced High performance bus (AHB)
matrix, which is a set of control buses connecting the different parts. A block called Syscon is
responsible for distributing clocks and resets to all parts of the Application subsystem. This
block is under SW control. The Application subsystem is connected to the Shared EMIF that is
used for code execution or data storage. In addition, a dedicated EMIF and a Flash IF are also
available. The Application EMIF is a general interface for communication with, for example
external SDRAM, PSRAM, NOR flash, NAND flash and companion chips. The Application EMIF
has a total of 56 signals (including a maximum of 7 chip selects if GPIO is used) and can
be set in several different modes to support different types of memory combinations.
FUNCTIONAL OVE R VIEW
Keypad
The keypad interface block supports up to 30 keys with 65 columns and 6 rows and operates in
both scan and idle mode. The keypad scan is performed by software. Any transition in the state
of the column inputs is written directly to the register. The keypad interface differentiates
between single key presses, simultaneous presses of any keys with a function key, and any key
releases. The period between successive scans is programmable over the range 5 ms to 80 ms,
in 5 ms steps. During scan mode, the keypad generates an interrupt whenever a valid keypad
state change occurs (including a release of any pressed keys). The scan function is disabled
during system power-up. The keypad is able to detect at least four simultaneous key presses.
Not all combinations are supported.
1215-3608 rev. 1
70 (96)
FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
K630 - V640 - K660
RF System Control
The access subsystem of the digital baseband controller controls the overall radio system. In
both EDGE/GSM/GPRS and WCDMA air interface mode, the digital baseband controller controls
the radio system through a 3-wire serial bus.
The digital baseband controller also manages PA band control and the antenna switch
mechanism in the front end module. The 26 MHz VCXO clock residing in the GSM/EDGE
transceiver is turned on only when required. The digital baseband controller initiates turning on
of the clock. The EDGE/GSM/GPRS RF system requires control, which is temperature dependent.
The temperature within the RF system is estimated by a voltage measurement performed by
the analog baseband controller N2000 (Vera).
The control flow for the RF system.
Radio Modules
GSM/GPRS/EDGE Radio Module
N1200 (Thor)
The GSM/GPRS/EDGE transceiver use a digital interface that is shared between receive
and transmit data. The receive interface is based on I and Q data and the transmitter
interface is based on envelope and frequency data. The quad band GSM/GPRS/EDGE
transceiver has the following general features:
The GSM/EDGE transceiver has the following features:
• Individual low-noise amplifiers for the 850, 900, 1800 and 1900 MHz frequency bands
with a common quadrature mixer
• Fully integrated VCO with dividers to generate both receive and transmit frequencies
• I and Q baseband receive channel amplifiers with on-chip antialiasing filtering
• I and Q receiver sigma-delta A to D converters
• Digital interface for the receive I and Q channel
• Multi modulus prescaler for direct VCO modulation in transmit mode
• Integrated phase detector with programmable charge pump
• Transmit output buffer with controllable output power level
• Transmit baluns integrated
• Digital interface for the transmit frequency and amplitude modulation
• 3-wire serial bus interface for control, configuration, and test
• Deep power down function
• Programmable power level to power amplifier (PA)
Radio Part
Antenna
The mobile system antenna interface connects the Wideband Code Division Multiple
Access (WCDMA) and Global System for Mobile Communication (GSM) input/output to
the antenna of the Mobile Phone. It is a bi-directional RF interface containing signals in the
range 800 MHz to 2.2 GHz. The mobile system antenna interface is the interface between the
Mobile Phone Radio Frequency (RF) input/output and the mobile system antenna. The interface
handles the GSM 850, EGSM 900, GSM 1800, GSM 1900 and WCDMA Band I, RF inputs/outputs.
Mobile System Antenna Interface:
Block diagram of the GSM/EDGE Transceiver
FUNCTIONAL OVE R VIEW
1215-3608 rev. 1
71 (96)
FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
K630 - V640 - K660
The module is shielded using fence and lid technology. The main components contained are
transceiver ASIC, PA module, Front End Module and X-tal.
Frequency Generation
The 26 MHz reference signal is used as the reference for the on-chip synthesizer. To
cover the required frequency range, the integrated Voltage Controlled Oscillator (VCO)
operates at twice the frequency for band 1800/1900, and at four times the desired
frequency for band 850/900.
Transmitter
The transmitter block consists of the following sub-blocks:
A separate block is used to convert the digital bit streams from the baseband into parallel
words to be used in the DACs and the Sigma Delta modulator. This block also includes
programmable delays for optimizing delays between the different modulation paths.
The combined DAC and LP-filter is used to convert the digital words of the digital block
into analog signals.The second FM-path is used to add the high frequency part of the FM to the
VCO. It alsoincludes an auto-tuning block that compensates VCO gain variations.
The AM-block converts the differential voltage from the DAC to a single-ended output that
drives the PA. The output is scaled according to the desired output power, and an offset
can be added for PA linearization. The TX-buffer is used to drive the PA with the correct power
level. A divide by 2 or 4 block is used to generate the correct output frequency from the 4 GHz
VCO.
with high dynamic range. The digital output signals are sent over a serial interface to the
digital base-band circuit for further processing and detection.
Frequency Range: 824,2 MHZ – 848,8 MHZ
Channel Range: 128 – 251
Power Level: Min: 19 – Max 5
GSM 900:
Frequency Range: 890,2 MHZ – 914,8 MHZ
Channel Range: 1 - 124
Power Level: Min: 19 – Max 5
EGSM 900:
Frequency Range: 880,2 MHZ – 889,8 MHZ
Channel Range: 975 - 1023
Power Level: Min: 19 – Max 5
DCS 1800:
Frequency Range: 1710,2 MHZ – 1784,8 MHZ
Channel Range: 512 – 885
Power Level: Min: 15 – Max 0
PCS 1900:
Frequency Range: 1850,2 MHZ – 1909,8 MHZ
Channel Range: 512 - 810
Power Level: Min: 15 – Max 0
WCDMA Radio Module N1210 (Squid)
RF 3100 is an integrated transceiver intended for the Universal Mobile
Telecommunication System (UMTS). The circuit is specially designed for the Frequency
Division Duplex (FDD) mode of the Wideband Code Division Multiple Access (WCDMA)
that operates in Band I (TX 1920-1980 MHz, RX 2110-2170 MHz).
The baluns, loop filters and most of the passive components are included in the package.
The WCDMA transceiver has the following features:
System in Package solution
Single band application (UMTS band I)
High Speed Downlink Packet Access (HSDPA) capability
Variable duplex in band I
Fully integrated TX baluns, loop filters and decoupling capacitors
Low noise, wide dynamic range for zero IF RX and TX
RX 87 dB gain control range in increments of 1 dB
TX 80 dB gain analog control range; 1 dB minimum resolution
RX 99 dB voltage gain
Maximum TX output power at least +5dBm average
Integrated RX channel filters (band I)
RX & TX fully integrated fractional-N synthesizer with AFC control capability
RX & TX fully integrated RF VCO with integrated supply voltage regulator
Supply voltage from 2.6 V to 3.0 V
3-wire serial interface bus
HVQFN40 package
Lead-free
FUNCTIONAL OVE R VIEW
Receiver
The receiver is a homodyne receiver with direct conversion of the received radio channel
to baseband I and Q channels. The analog signals are converted to digital bitstreams in a
sigma delta A/D converter. The receiver block consists of a front-end with separate LNAs for
each band and a common quadrature mixer. The front-end block is followed by a baseband
block with active antialiasing filters that also suppress blocking signals and interferers. After the
baseband block is a fully integrated Analog to Digital Converter of sigma delta structure
Frequency Generation
The transmitter and receiver frequency synthesizers and the VCOs are fully integrated in
the WCDMA radio circuit. The signal from the crystal oscillator is used as a reference for
the synthesizers. The two synthesizers are controlled through the serial bus from the
access subsystem of the digital baseband controller.
1215-3608 rev. 1
72 (96)
FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
K630 - V640 - K660
WCDMA Transceiver Block Diagram
Bluetooth and FM Radio
The STLC2592 circuit N1400 combines Bluetooth and FM tuner functionality into one.
Bluetooth
The Bluetooth implementation is compliant with Bluetooth specification 2.1 + EDR.
The Bluetooth
MHz. The same band is used for both transmission and reception. This gives 79 frequency
channels.
Receiver
The first stage of the receiver is an external antenna filter, which suppresses unwanted
frequencies. The receiver is of a “near-zero” IF receiver architecture. The local oscillator is
generated by a frequency synthesizer, which allows the receiver to be set at frequencies in
intervals of 1 MHz. The synthesizer is controlled from the logic part.
The received signal is sampled in the logic for later signal processing.
Transmitter
The synthesizer generates the TX frequency which modulated by the BT baseband block. It is
then amplified. The BT system is a class 1 device with maximum of +4 dBm output power
(minimum setting is about -50 dBm).
TM
transceiver has frequency channels with 1 MHz separation from 2402 to 2480
Transmitter
The TX IQ modulator has differential voltage I and Q inputs. It converts input signals to
RF output frequency and is designed to achieve LO and image suppression.
The transmit output stage provides at least +5 dBm at maximum power control at the
single-ended 50 Ω output. Gain is set through the 3-wire bus.
Two 10-bit DACs are used to control the DC/DC converter and the PA gain. These DACs
are controlled through the 3-wire bus.
Receiver
The front-end receiver converts the aerial RF signal from WCDMA band I down to a Zero
Intermediate Frequency (ZIF). The first stage consists of one single-ended low noise
amplifier (LNA) with a 16 dB gain step. This LNA is followed through an external filter by
an IQ down-mixer which consists of a mixer in parallel driven by quadrature out-of-phase
LO signals. The In phase (I) and Quadrature phase (Q) ZIF signal are then low pass
filtered to provide protection from high frequency offset interferer fed into the channel
filter.
The front-end zero IF I and Q outputs are applied to the integrated low-pass channel filter
with a provision for 4 x 8 dB gain steps in front of the filter. The filter is a self-calibrated 6
pole, 2 zero filter with a cut-off frequency around 2.15 MHz and a second order group
delay compensation (2 poles, 2 zeroes). Once filtered, the zero IF I and Q signals are
further amplified with provision of 31 x 1 dB steps and DC offset compensation. The zero
IF output buffer provides close rail-to-rail output signals.
FM Radio
FM Receiver
The receiver uses a digital low-IF architecture. The receive (RX) section integrates a low noise
amplifier (LNA) supporting the worldwide FM broadcast band (76 to 108 MHz). An automatic
gain control (AGC) circuit controls the gain of the LNA to optimize sensitivity and rejection of
strong interferers. An image-reject mixer down converts the RF signal to low-IF. The
quadrature mixer output is amplified, filtered and digitized with high resolution analog-to-digital
converters (ADCs). This advanced architecture allows the use of digital signal processing (DSP)
to perform channel selection, FM demodulation and stereo audio processing.
Tuning
The receiver uses frequency synthesizer technology including a completely integrated VCO. The
frequency synthesizer generates the quadrature local oscillator signal used to downconvert the
RF input to a low intermediate frequency. The VCO frequency is locked to the reference clock
and adjusted with an automatic frequency control (AFC) servo loop during reception. The tuning
frequency is defined as:
Freq (MHz) = Spacing (kHz) × Channel + Bottom of Band (MHz)
External Connectors
External units are connected to the transceiver by means of a 12-pin connector on the bottom
of the phone. The pin numbering is starting from the right when looking at the system
connector with the front up.
FUNCTIONAL OVE R VIEW
1215-3608 rev. 1
73 (96)
System connector pin out:
FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
K630 - V640 - K660
1
Vbus2SP
Ref
3
Mic+
/
Aux in
L
4
Mic-
/
Au x in
R
5
Sp
L
/
DBG
TX
6
Sp
R
/
DBG
RX
7
Video
/
Strobe
8
AID
/
ACB
/
Vpp
Flash
9
GND10D+
DTMS
11
D-
/
DFMS
12
/
DCIO
Clocks
Clock Distribution
The clocking for the access and application subsystems is separated. This means that
they can wake up or go to sleep mode independently. The access subsystem is clocked by the
26 MHz Voltage Controlled Crystal Oscillator (VCXO) located in the GSM/EDGE module N1200
(Thor). When the access subsystem has a job to do, the Master Clock (MCLK) signal is
requested from the RF part. Most other clocks needed within the access subsystem are
generated from the MCLK. Some minor parts like sleep timer and cable detect use the 32 kHz
real-time clock. The 32 kHz real-time clock clocks the application subsystem, and all other
internal clocks needed within the application subsystem are generated from this clock. However,
when audio is transferred between the application and the access subsystems, the MCLK is
used.
Master Clock
(26 MHz)
The 26.00 MHz VCXO-based MCLK is distributed as a square wave signal from the
GSM/EDGE circuit. In order to have full control over the load on the MCLK, only the access side
of the digital baseband controller is allowed to request the MCLK. However, by indirect means
also the application side CPU can issue the request. A VCXO-based square wave is also
distributed to the WCDMA circuit, but is turned on only upon a command from the digital
baseband controller.
Real-time Clock
(32. 768 KHz)
A 32.768 kHz crystal oscillator provides a low frequency clock whenever the phone has power.
This clock is used to keep the Real-Time Clock (RTC) block functioning, so that the phone can
keep track of the time and date. The low frequency clock is generated in the analog baseband
controller N2000 (Vera) and distributed to the digital baseband controller D2000 (Anja), and if
necessary to external devices like Bluetooth, FM radio and A-GPS.
N2000 VERA, Analog Baseband Controller,
Audio Part
PCM/
Vol
Vol
I2S
Vol
Vol
Inter-
face 1
PCM/I2S
Inter-face
0
PGA
Rx
APP UART TX
CTMS
CFMS/
Tx
ID_source
A
D
C
AID
I2CDAT
I2CCLK
VDDE18
CAM_LDO_EN
S4300
I2CDAT
Interface
Power
Management
MEGA_STDBY
VCAMSD28
VCAMSD13
VCAMSD18
i2CDAT
C
I2
L
K
C
MAIN CAMERA
Interface
2M Pix
Camera
Sensor
STROBE
Power Management
VDDE18
CAMRESn
CIF_STDBY
KEYPAD
KEYBI[0-4]
KEYBO(0-5)
+
VMC18
M2
MSDETECT
MSDETECT
Memory Stick
VBOOST
AMPCTRL
VBATi
-
1
4
7
*
AUDIO PA
VDD
SHDN
2
5
8
0
N3100
C
3
6
9
#
KB_LED
KB_LED1
KB_LED2
FUNCTIONAL OVE R VIEW
N3101
MicP
RX
RX
RX
PGA
RX
PGA
PGA
PGA
TX
TX
TX
PGA
TX
PGA
PGA
AID/ACB/
VPP Flash
I
D
R
PGADAC
PGADAC
PGADAC
PGADAC
CCO
ADC
ADC
ADC
ADC
FM AUDIO
_
o
u
t
Title/Description
Prepared By
Content responsible if other than preparer
Approved by
MicN
SpL
SpR
Tjate3
FM RADIO RF
DCIO
Security classDocument type
BLOCK DIAGRAM APPLICATION
Document number
DateRevision
Remarks
X2400
SYSTEM CONNECTOR
SPREF
Mic+/AUXinL
Mic-/AUXinR
SPL
SPR
VBUS
VIDEO/STROBE
AID/ACB/VPP/RID
D+/DTMS
D-/DFMS
DCIO
GND
BLOCK DIAGRAM
Sheet
1234-5678 rev. 1
76 (100)
Electrical Part list
APPENDIX Replaceable Parts
SEMC Troubleshooting Manual
K630 - V640 - K660
The list contains only components that are possible to replace on the main board. Pos. number refer
to the components position number on the board.
Some components are noted as MSL X. These components are moisture-sensitive and are rated at
various levels (MSL):
Level 1:Unlimited floor life; does not require dry pack or re-baking.
Level 2:1 year floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked after being
opened if floor life is exceeded.
Level 2A: 4 week floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked after being
opened if floor life is exceeded.
Level 3:168 hours floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked after being
opened if floor life is exceeded.
Level 4:72 hours floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked after being
opened if floor life is exceeded.
Level 5:48 hours floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked
after being opened if floor life is exceeded.
Level 5A: 24 hours floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked
after being opened if floor life is exceeded.
Level 6:6 hours floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked
after being opened if floor life is exceeded.
NOTE! RF Calibration by using SERP can only be done by authorized repair centers.
Fence modification according to Working Instruction Electrical.
F=Front side, B=Back side.
Side Pos.Description Part Number CommentsPage
F B2100 Osc XO 32.768 kHz LC 1200-3231
B B3100 Microphone RLC509429/5 78
B C2217 0.07F 3.3V Capacitor RJE3551335/7
F C3145, C3146 Capacitor Ceramic 470,0 nF
F L2200 Ind WW 4.7 uH +-20%
B L2401, L2402,
L2403, L2404,
B N1002 PA Module. 22 TERMINAL
B N1200 RF-Module Thor
B N1210 RF-Module Squid
+/-10% 6,3 V
3.6X2.8X1.2
Filter 0.0 Hz 0402 REG70618/20
LGA
Pre-bumped
Pre -bumped
RJC5163026/47
1200-0119
RYT101988/1
1203-6579 Calibration required (SERP)
1204-1674 Calibration required (SERP)
K660 ONLY
Require calibration (SERP)
MSL1
K660 ONLY
MSL1
MSL1
MSL3
Calibration Required (SERP) 79
MSL R5A
Special Soldering Process Required
- Authorized Repair Centers Only
MSL R5A
Special Soldering Process Required
- Authorized Repair Centers Only
78
78
79
79
80
F=Front side, B=Back side.
Side Pos.Description Part Number CommentsPage
B N1400 Module Bluetooth + FM
STLC2592
B N2203 2ch-LDO, Vout1=2.8V,
B N2204 LDO1.2 V, 200mA, low
B N2205 IC Vreg 1200-0107 81
F N2400 1-Bit Level Translator RYT109914/1
F N3100 IC Amp RYT1017841/1 82
B N3101 EMI filter and ESD ROP1013074/1
B S100 Shield Can Fence with lid 1200-0085
B S2400,
S2402, S2403
B V2202 TRANS
F V2206 Diode V schotty RKZ123905/2 83
F V2405 MOSFET Complementary N
B V2420, V2421 Zener Diode voltage
F&B V3101,V3102,
V3103,V3104,
V3105,V3106,
V3107,V3108,
V3109,V3110
F V4201 Schotty Diode RKZ323907/1 83
F&B X1001,
X1002, X1003
B X1200 Conn Antenna RPT79947 84
B X1201,
X1202, X1203
B X2200 Battery Connector SND10620 85
B X2402 Con X Keyboard connector RNV799036 85
B X2403 SIM card reader SXA1096432 86
B X2490 MS-Micro Pico holder RNK87147/2 86
F X4200 B to B connector, female, 22
F X4300 Conn Socket 1200-0374
B X4310 Conn (Camera Socket) RNV799011 86
Vout2=1.8V, WL-CSP6
noice, CS 5
Input Switch side push RMD10116/9 82
V;DUAL_PMOSFET;BYX10
1603_A;REQ318
P 20 V (D S)
regulator 15V 5%
Zener diode RKZ223911/1
Antenna Pin Connector SND90158
POGO Pin
(For Antenna)
pin
1200-6182
RYT113997/4 81
RYT1137816/3
RYN122910/1 83
RYN901918/2 83
RKZ223905/2
SND10625
RNV799046 86
K660 ONLY
MSL3
Special Soldering Process Required
- Authorized Repair Centers Only
MSL1
K660 ONLY
MSL1
1215-3608 rev. 1
80
81
82
83
83
84
84
87
APPENDIX
77 (96)
APPENDIX Component s
- B2100, B3100, L2200
B2100 Osc. XO 32.768 kHz LC 1200-3231B3100 Microphone RLC509429/5
SEMC Troubleshooting Manual
K630 - V640 - K660
L2200 Ind WW 4.7 uH +-20% 1200-0119
䇼
䇼Dimensions䇽
䇼䇼
䇽
䇽䇽
㪫㫆㫃㪼㫉㪸㫅㪺㪼 䋺㫧㪇㪅㪉
䇼
䇼Recommended Pad Layout䇽
䇼䇼
㫄㫄㩷䋺㩷㪫㪠㪥㪬㫄㫄㩷䋺㩷㪫㪠㪥㪬
䇽
䇽䇽
APPENDIX
1215-3608 rev. 1
78 (96)
APPENDIX
Component s - L2401- 04, N1002, N1200
SEMC Troubleshooting Manual
K630 - V640 - K660
L2401-04 Filter 0.0 Hz 0402 REG70618/20
Dimension Equivalent Circuit
0.25±0.1
0.5±0.05
1.0±0.05
0.5±0.05
(in mm)
(Resistance element becomes dominant
N1200 RF Module Thor 1203-6579
at high frequencies.)
N1002 PA Module 22 Terminal LGA RYT101988/1
APPENDIX
1215-3608 rev. 1
79 (96)
APPENDIX
Component s - N1210, N1400
N1210 RF Module Squid 1204-1674N1400 Module Bluetooth + FM STLC2592 1200-6182
C1ENEnable Input. Set this digital input high for normal operation. For shutdown, set this pin low.
C2V
CON
C3FBFeedback Analog Input. Connect to the output at the output lter capacitor.
B3SGNDAnalog and Control Ground
A3PGNDPower Ground
A2SWSwitch node connection to the internal PFET switch and NFET synchronous rectier.
Power Supply Voltage Input to the internal PFET switch.
Analog Supply Input.
Voltage Control Analog input. V
CON
controls V
in PWM mode.
OUT
Connect to an inductor with a saturation current rating that exceeds the maximum Switch Peak
Current Limit specication of the LM3208.
N2204 LDO 1.2V, 200mA Low Noice CS 5 RYT1137816/3
(TOP VIEW)
PIN DESCRIPTIONS
C3C1
INOUT
B2
GND
A3A1
NREN
TPS799xx
NAMEYZU
INC3Input supply.
GNDB2Ground
ENA1
NRA3
FBA3
OUTC1
DESCRIPTION
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into
shutdown mode. EN can be connected to IN if not used.
Fixed voltage versions only; connecting an external capacitor to this pin bypasses noise generated
by the internal bandgap. This allows output noise to be reduced to very low levels.
Adjustable version only; this is the input to the control loop error amplifier, and is used to set the
output voltage of the device.
Output of the regulator. A small capacitor (total typical capacitance ≥ 2.0μF ceramic) is needed from
this pin to ground to assure stability.
Block Diagram
APPENDIX
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APPENDIX
Components - N3100, N3101, S2400 -03
SEMC Troubleshooting Manual
K630 - V640 - K660
N3100 IC Amp RYT109914/1
PIN CONNECTIONS
9−Pin Flip−Chip CSP
A1
INMOUTAINP
B1
VM_PVMV
C1
BYPASSOUTBSHUTDOWN
A2
B2
C2
S2400-03 Input Side Switch Push RMD 10116/9
A3
B3
p
C3
(Top View)
PIN DESCRIPTION
PinTypeSymbolDescription
A1IINMNegative input of the first amplifier, receives the audio input signal. Connected to the
A2OOUTANegative output of the NCP2892. Connected to the load and to the feedback resistor Rf.
A3IINPPositive input of the first amplifier, receives the common mode voltage.
B1IVM_PPower Analog Ground.
B2IVMCore Analog Ground.
B3IV
C1IBYPASSBypass capacitor pin which provides the common mode voltage (Vp/2).
C2OOUTBPositive output of the NCP2892. Connected to the load.
C3ISHUTDOWNThe device enters in shutdown mode when a low level is applied on this pin.
p
feedback resistor R
Positive analog supply of the cell. Range: 2.2 V−5.5 V.
Using this software you can control most parts and functions of all Sony Ericsson mobile phones. It is a
GUI (Graphical User Interface) for the commands implemented in the ITP (Integrated Test Program).
The software communicates with the phone through standard serial communication over a USB/RS232
interface (SEPI).
Note: The Troubleshooting Software application is to be used with the Troubleshooting Manual and the
Troubleshooting fixture kit.
The functions in the Troubleshooting Software application are divided into three main sections:
Communication Settings, Radio Control and Base Band Controls. These main sections are
presented under six different tabs.
All settings and functions are collected under these six main tabs.
Communication Settings
All settings for the communication between the Troubleshooting Software application and the phone
are presented under the Communication Settings Tab.
Base Band Controls
Note: Some parts of Base Band Control functions may not be implemented since they are not
supported by the ITP SW.
Note: There are some differences in the user interface depending on the phone project file loaded.
Some functions may not be available for all products.
The functions for Base Band Control are presented under the following four different tabs:
Audio and FM Radio
Used for setting Audio Loop mode and test the functionality of the FM Radio.
Logic
Used to:
-Read out of the ADC channels
-Control or Test of SIM and Memory Stick Card
-Perform of Battery and Current Calibration
-Check Radio and Display temperature
-Etc.
Radio Controls
Note: Some parts of Radio Control functions may not be implemented since they are not supported by
the ITP SW.
Note: There are some differences in the user interface depending on the phone project file loaded.
Some functions may not be available on all products.
All Radio Control Functions implemented in the Troubleshooting Software are presented under the Tx
and Rx tab. The main radio functions of the mobile phone presented in this tab are:
xGSM radio part
xWCDMA radio part
xBluetooth radio part
In the GSM and the WCDMA radio control part the following radio functions can be controlled:
Transmitter (TX) and Receiver (RX)
In the Bluetooth radio control part only the Transmitter (TX) function is supported.
GPIO Manager
Used to control GPIO ports at the Access and Application CPU.
Note: It is very important to follow the GPIO activation sequence according to the Troubleshooting
Guide instructions when the GPIO manager is used to avoid Hardware or SW function interruption.
MMI
Used for:
-Main and VGA Camera Tests
-Camera Door Test
-Keyboard Scan Test
-Vibrator Test
-LED and Backlight Tests
-Xenon Flash Test
-Display Test
APPENDIX
-Etc.
General
Used to:
-Read out Software and Product Data Information flashed into the phone
-Perform ASIC Revision test
-Perform available Self tests
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APPENDIX
Troubleshootin g S o ftware Docume nt at ion
SEMC Troubleshooting Manual
K630 - V640 - K660
Equipment Setup
Note: During calibration the accurate voltage from VBATT must be within ±0.015 V. If this is not
fulfilled it will cause a faulty calibration. For more information about recommended power supply units,
see the Repair Tool Catalogue in CSPN under the Mechanical level. The Power Supply Channel 1 VBATT
must allow reverse current.
Note:
Instructions for Customization of Power Supply Channel 2 DCIO/SEPI Cable
To perform Current Calibration the phone must be powered directly through the system connector.
Customize the cable according to following instructions: Take the CST-75 battery charger and cut off
the charger according to picture 1. Length of the cable must be exact 1.3m. Connect the CST-75
charger Red or White cable to the Positive (+) Output at Power Supply and the Black cable to the
Negative (GND) Output at the Power Supply according to picture 2. Cut off isolation material from
inside of the charger plug according to picture 3.
Picture 1
Before starting calibration test, the phone must be flashed with ITP Software.
Power Supply Channel 2 DCIO/SEPI Cable Connection Setup
Note: The Power Supply Channel 1 (VBATT) must allow reverse current.
Note: The maximal cable length between the Power S upply Cha nnel 1 VBATT and the dummy battery
must not exceed 1m. The cable must have a capacity for at least 16A.
Picture 4
Correct DCIO and SEPI A1 Cable setup when the Troubleshooting Fixture is used.
Picture 5
Picture 2
Picture 3
Correct DCIO and SEPI A1 Cable setup when a Dummy Battery is used.
Picture 6
APPENDIX
This setup between DCIO and SEPI A1 Cable is WRONG!
Note: Voltage and Current settings for the Power Supply Channel 1 VBATT and 2 DCIO/SEPI can be
found in the Equipment List included in the Product Specific Troubleshooting Manual.
Note: Instructions about the Troubleshooting fixture connections with the External RF connector,
Display, SIM Card, Memory Stick Card, Keyboard etc. can be found in Troubleshooting Fixture
Connection Instruction included in the Product Specific Troubleshooting Manual.
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APPENDIX
Troubleshootin g S o ftware Docume nt at ion
SEMC Troubleshooting Manual
K630 - V640 - K660
System Requirements
Note: Before start using the Troubleshooting Software, the phone must be flashed with ITP SW.
The system requirements for running the application are:
- At least a Pentium III 500 MHz, with 128 MB of RAM
- Win2000 or Win XP
- One free USB connector
- USB Computer Cable
- At least 1024x768 display resolution. (1152x864 is recommended.)
- SEPI Drivers must be installed
- SEPI BOX
- SEPI A1 Cable
- Phone Specific Dummy Battery
- Phone Specific TRS Fixture
- CST-75 Charger cable
GSM Radio Settings
Used for Channel and Power Level control of the selected GSM Band. The TX and RX frequency value
for selected band and channel will be presented in the TX and RX frequency box.
1. Select the desired GSM band. Available options are GSM 850 (Ch 128…251), GSM 900 (Ch
3. Use default value or select desired power level.
Note: Any GSM band not used by the Mobile Phone will be unavailable in the GSM Radio Settings.
GSM RSSI measurements
This measurement is only possible to perform when RX Switched mode is selected. Use the Mobile
Phone Tester instrument for feeding a signal to the mobile phone’s receiver. For Instrument and
Phone’s settings go to Troubleshooting Manual – GSM Network problems.
1. Select RX Switched Mode.
2. Select desired GSM band and Channel.
3. Go to GSM RSSI Measurements and Start RSSI Test.
- One Dual or Two Single Channel Power Supplies
TX and RX - Tab
Communication Functions
Note: Some parts of the Communications functions may not be implemented since they are not
supported by ITP Software.
Note: There are some differences in the user interface depending on the phone project file loaded.
Some functions may not be available on all products.
GSM
GSM Mode Settings
Used for selecting of the GSM radio mode. The following Radio Modes are available:
-TX and RX Switched
-TX and RX Static
Note: In the TX Switched mode all parameters are available (Band, Channel and Power Level). In the
TX Static mode the control of Power Level is hidden and the transmitter works with a predefined DAC
value. This is done to protect the power amplifier against overheating.
Note: The RSSI Test can be performed differently from product to product due to the limited ITP
Software support.
WCDMA
Note: Unused WCDMA Bands will not be available in the WCDMA Radio Settings.
Note: For some products the TX and RX WCDMA Channels range can be reduced due to the limited
product functionality or Test Instrument limitation. This is done to avoid wrong and incorrect
measurement results.
Radio Settings
APPENDIX
Used for TX and RX Channels control of the selected WCDMA Band. The TX and RX Channels frequency
for selected band will be presented in the TX and RX frequency box.
1. Select the desired WCDMA band. Available options are Band I (TX Ch 9612…9888, RX Ch
10562…10838), BAND II (TX Ch 9262…9538, RX Ch 9662…9938), BAND IV (TX Ch 1312…1513, RX
Ch 1537…1738), BAND V (TX Ch 4132…4233, RX Ch 4357…4458) and BAND VIII (TX Ch
2712…2863, RX Ch 2937…3088)
2. Use default value or select desired TX or RX channel.
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APPENDIX
Troubleshootin g S o ftware Docume nt at ion
SEMC Troubleshooting Manual
K630 - V640 - K660
Fast select channels
Set High Channel: The High Channel for selected WCDMA Band will be set by the Troubleshooting SW.
Set Mid Channel: The Mid Channel for selected WCDMA Band will be set by the Troubleshooting SW.
Set Low Channel: The Low Channel for selected WCDMA Band will be set by the Troubleshooting SW.
Modes
Max Pwr 23dBm set the Phone to transmit with maximum power at the selected Band and TX
Channel. The limit is 23dBm.
Min Pwr Max -50dBm set the Phone to transmit with minimum power at the selected Band and TX
Channel. The limit is -50dBm.
Read RSSI set the Phone in RX mode at the selected Band and RX Channel.
Out Pwr level x dBm set the Phone in TX mode at the desired power level value at the selected Band
and TX Channel (Power level range to choose is: from -50dBm to 23dBm).
INP/OUT Pwr check set the Phone to transmit with maximum power and switch the receiver On at
the selected Band and TX/RX Channel
Reset output set the Phone in WCDMA Off mode.
Rx on
Read measurement read the RSSI and report the result at Phone reported power. This function can
only be used when the Receiver is On.
VCXO Control
Used to fine tune the VCXO to MCLK frequency by calibrating the DAC that sets the VCXO control
voltage. It is also used to verify the VCXO tuning range. When transmission is in Switched TX mode
you are allowed to calibrate the VCXO oscillator controlling the DAC value on the AFC pin.
1.Switch the GSM tester to GSM900, Ch1.
2.Read the stored VCXO value from the GDFS by clicking the "Read from GD" button.
3.Start transmitting by clicking the "TX Switched" mode button.
4.To apply the VCXO DAC value you set, click the "Set VCXO" button.
5.Check your GSM tester.
6.Set the frequency error as close to 0 Hz as possible by using the up/down arrows and then click
the "Set VCXO" button again.
7.The button "Mean Value" sets the value to 1024.
8.When the procedure is finished, click on "Save VCXO" button to store the calibrated value in
GDFS.
VCO Calibration (RX)
Uses the default values in the TP to adjust the varactor diode to a pre-determined operating point, so
that the loop voltage of the RXVCO (measured with an ADC) is within the valid range, and the optimal
value is chosen. The optimal value is defined as: The CVCO value that gives loop voltages within the
limits for both high and low channel and that has the lowest maximum loop voltage.
The optimum value is stored in GDFS.
Note: The RSSI Measurement can be performed differently from product to product due to the limited
ITP Software support.
VCO and VCXO Functions
Note: These calibrations are only possible to perform when RX static mode is selected.
Note: These calibrations may not be possible to implement for all products due to limitations in ITP
Software.
VCO Calibration (TX)
Uses the default values in the TP to adjust the varactor diode to a pre-determined operating point, so
that the loop voltage of the TXVCO (measured with an ADC) is within the valid range and the optimal
value is chosen. The optimal value is defined as: The CVCO value that gives loop voltages within the
limits for both high and low channel and that has the lowest maximum loop voltage.
The optimum value is stored in GDFS.
Audio and FM Radio - Tab
Audio & Radio Functions
Note: Some parts of Audio and FM Radio may not be possible to implement for all products due to
limitations in ITP Software.
Note: There are some differences in the user interface depending on the phone project file loaded.
Some functions may not be available on all products.
Audio Loop Test
1. Select desired Audio Loop Test
2. Click "Apply Audio Loop" to start the test.
3. To switch off the loop, select OFF from Audio Output and click "Apply Audio Loop".
APPENDIX
Audio input:
-Mic1 is the internal microphone.
-Aux1 is the input from the system connector.
Loop mode:
-Analogue, where the loop is set before and after the AD/DA conversions.
-Digital/DSP loop, where the DSP signal processing also affects to the audio signal.
-CPU/PCM loop, where the loop is set between the PCM audio signals.
-Dictaphone loop.
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Troubleshootin g S o ftware Docume nt at ion
SEMC Troubleshooting Manual
K630 - V640 - K660
Audio output:
-Earphone is the internal Earpiece speaker of the unit.
-AUX earphone connected to the system connector.
-Loudspeaker is the internal loudspeaker of the unit.
-OFF is used to switch off the currently used Audio Loop.
Examples of different Audio Loop Test setups in Fault Trace SW.
Picture 9 Picture 10
Examples of different FM Radio Test setups in the Troubleshooting Software
Picture 11 Picture 12
K850 Project FM Radio Setup K800 Project FM Radio Setup
Logic – Tab
K800 Project Setup K850 Project Setup
Note: Audio output and input pins can be used by disconnecting the blue SEPI connector from the
phone after the audio loop has been applied. Now the Portable Handsfree can be connected to the
System Connector. After function test operation, disconnect the PHF or external audio device from the
System Connector and connect the SEPI cable to proceed with other Audio Loop Tests.
FM Radio
-To activate the FM radio, click at the Set FM Radio button.
-To turn off the FM radio, click at the Turn OFF FM Radio button.
Audio output
Used for selecting Audio Output from the FM Radio. Most common Audio Outputs for all projects are
AUX Stereo (Portable Handsfree, PHF) or Loudspeaker.
Frequency in MHz
Frequency range box for the FM Radio. The frequency value can be selected in two different ways:
-The first one is with up/down spin buttons
-The second one is to type it directly into the Frequency field.
When typing directly into the Frequency field, the Frequency Span should be 100 KHz when changing
from one frequency to another. The Frequency Range used in the Troubleshooting Software is from
87.50 MHz to 108.00 MHz.
Logic Functions
Note: Some of the Logic functions may not be possible to implement for all products due to limitations
in the ITP Software.
Note: There are some differences in the user interface depending on the phone project file loaded.
Some functions may not be available on all products.
Battery Calibration
Note: To perform this test only Power Supply channel 1 is needed. Make sure that the correct voltage
values are set for each test step, otherwise the test will fail.
The Battery Calibration test is similar to the Battery Calibration test performed in the factory
environment.
1. Click 1. Battery Calibration.
2.Click SET VBATT to 3.2 Volt.
3.Adjust Power Supply channel 1 (the dummy battery) to 3.2 V.
4.Click VBAT1.
5.Click SET VBATT to 4.1 Volt.
6. Adjust Power Supply channel 1 to 4.1 V and click VBAT2.
7.Adjust Power Supply channel 1 to 3.8 V and click SET VBATT to 3.8 Volt.
8. The test result (Passed or Failed) will now be displayed.
When the measured values are within the limits the calibration will be passed otherwise the test will be
failed. The compensation factor will be calculated and stored in the GDFS.
APPENDIX
More information about the test limits can be found in the product specific Troubleshooting Manual and
in the Read Limits Table in the Battery and Current Calibration Test document.
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APPENDIX
Troubleshootin g S o ftware Docume nt at ion
SEMC Troubleshooting Manual
K630 - V640 - K660
Current Calibration
The Current Calibration test is similar to the Current Test for the charging algorithm in the factory
environment.
Note: For a correct and accurate result, perform the Battery Calibration Test before current
calibration. To perform this test you will need both channel 1 and 2 from the Power Supply.
1. Click 2. Current Calibration.
2.Adjust channel 1 (the dummy battery) to 3.8 V.
3. Click button SET VBATT to 3.8 Volt.
4.Note the measured current for channel 2 (the customized charger with SEPI).
5.Type in the measured current (in mA) in the text box.
In this example the current is measured to 114 mA.
6. Press Enter.
7. The phone will switch to charging with 800mA. Note the measured current value result at Power
Supply Channel 2 DCIO/SEPI.
8. Type the new value in the text box.
9. Press Enter.
10. The test result (Passed or Failed) will now be displayed.
Memory stick test checks the communication with the Memory stick card.
The test result (Passed or Failed) will be displayed in the info box.
Note: A Memory stick card must be inserted and a Memory card reader connected to run this test.
End Calibration
Ends the calibration and no data will be stored.
Go Idle for 2 sec
The unit will be set to IDLE mode for 2 seconds.
Reboot Phone
IPT command KILL will be send and the phone will restart.
Radio Temperature
The value of the Radio Temperature will be displayed in the info box.
Display Temperature
The value of the Display Temperature will be displayed in the info box.
GPIO Manager Functions
When the measured values are within the limits the calibration will be passed otherwise the test will be
failed. The compensation factor will be calculated and stored in the GDFS.
More information about the test limits can be found in the product specific Troubleshooting Manual and
in the Read Limits Table in the Battery and Current Calibration Test document.
ADC Values
1. Select the desired ADC Channel.
2.Click Read ADC value.
- The measured value will be presented in both hex and decimal info boxes.
- N/A means that the General Purpose port is not used by this phone or this port is not supported by
ITP.
- If a port is missing in the Troubleshooting SW that port is not supported by the ITP SW.
SIM Card Control
This section controls the SIM interface in the phone.
SIM VCC: Voltage for the SIM Card will be activated.
SIM RESET, SIM DATA and SIM CLOCK: Activate the Reset, Data and Clock signals for the SIM Card.
SIM Com Test: Checks the communication with the SIM Card.
The test result (Passed or Failed) will be displayed in the info box.
Set GPIO port at Access and/or Application CPU to High or Low and Read Out status of the port.
MMI – Tab
Functions
Note: Some parts of MMI functions may not be possible to implement for all products due to
limitations in the ITP Software.
Note: There are some differences in the user interface depending on the phone project file loaded.
Some functions may not be available on all products.
Display Pattern
APPENDIX
Activate different test patterns on the display.
LED and Backlight
Activate/Deactivate LEDs and Backlights on the phone.
Misc
Activate/Deactivate tests such as:
Note: A SIM card must be inserted and a card reader connected to run this test.
-Main Camera Test
-VGA Camera Test
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APPENDIX
Troubleshootin g S o ftware Docume nt at ion
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K630 - V640 - K660
-Camera Door Test
-Vibrator Test
-Keyboard Scan Test
-Etc.
Note: When one test has been deactivated the phone will be restarted.
General – Tab
Functions
Note: Some parts of General functions may not be possible to implement for all products due to
limitations in ITP Software.
Note: There are some differences in the user interface depending on the phone project file loaded.
Some functions may not be available on all products.
Software Information
This function is used to display the following information stored into the phone:
-ITP version
Fault Trace SW Error Messages
1.
...timeout when reading
Check the following items:
-Connection between Power Supply Channel 2 (DCIO) and SEPI A1 cable (Se picture 4, 5 and 6).
-If the SEPI BOX works properly (The Green LED at the SEPI BOX must be on).
-If the USB cable between SEPI BOX and PC is connected properly.
-If the phone has been flashed with the correct ITP version.
-If VBATT and DCIO Power Supply instruments are on.
2.
...timeout when writing
...timeout when reading
Check if the correct COM Port is selected in Troubleshooting Software - Communication Settings Tab
3.
...Port has not been succesfully opened timeout
-IMEI number
-OTP number
-CID number
-PAF status
-Lock Status
-Etc.
Note: The OTP number must match the IMEI number otherwise the IMEI has been changed.
Note: Some of these functions may not be available for all products due to security reasons.
Product Data
This function displays production data stored in the phone, such as:
-First Identification (Serial Nr.)
-PBA Nr.
-PBA Rev.
-DPY Nr. (Sales Unit)
-Etc.
- Check if COM Port is connected
- Check if the correct Phone Project File is loaded
- Restart the Troubleshootinge Software application and try again
4.
Command failed due to:
…. Error_NotValidParameter, ERR
or
CERR: Error_CommandDoesNotExist, ERR
-Check if the correct Phone Project File is loaded
-Check if the phone has been flashed with the correct ITP version.
APPENDIX
ASIC Revisions
This function displays the types and revisions of the different ASICs. To find out more information
about which components are included in this test go to the ASIC Revision Test document included
in the product specific Troubleshooting Manual.
Self Test
This function runs available self tests on the Phone.
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Troubleshooting Fixture Setup Instructions
Front side overview of the TRS Fixture, see
picture 1.
Connect Power Supply Channel 1 VBATT (Black
and Red plugs) according to picture 4.
APPENDIX Troubleshooting Fixt u re S etu p In st ructions
Place the PBA by using Guide Pin mounted
inside the TRS Fixture according to picture 7.
SEMC Troubleshooting Manual
K630 - V640 - K660
Connect the Keypad Flex Cable to the board-toboard connector mounted on the PBA when
Keypad is in use according to picture 10.
Picture 1
Back side overview of the TRS Fixture, see
picture 2.
Picture 2
Picture 4
Insert SIM Card if needed according to picture 5.
Picture 5
Picture 7
Connect Display if needed according to picture 8.
Picture 8
Picture 10
To switch Keypad between K630/V640 and K660,
unscrew 4 screws marked with “RED” arrows,
from the TRS Fixture see picture 11.
Picture 11
Open the TRS Fixture according to picture 3.
Picture 3
Insert Memory Card if needed according to
picture 6.
Picture 6
Close the TRS Fixture according to picture 9.
Picture 9
Disconnect the Keypad Flex Cable on the
backside according to picture 12.
Picture 12
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APPENDIX
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Connect Power Supply Channel 2 DCIO/SEPI
Cable according to picture 13.
APPENDIX
Connect FM Radio Cable if needed according to
picture 16.
Troubleshooting Fix t ure S et up In st ructions
The Pin mounted inside the TRS Fixture marked
with a RED arrow can be used as MP TRS
Fixture GND or grounding for the oscilloscope
probe, see picture 19.
SEMC Troubleshooting Manual
K630 - V640 - K660
Picture 13
Secure the DCIO/SEPI Cable by using the screw
according the picture 14.
Picture 14
Picture 16
Connect Main Camera directly on the PBA if
needed according to picture 17.
Picture 17
Picture 19
The GND pins on the backside of the TRS
Fixture can be used as MP TRS Fixture GND or
as grounding for the oscilloscope probe, see
picture 20.
Picture 20
Connect RF Test Cable Flexible if needed
according to picture 15.
Picture 15
Connect VGA Camera directly on the PBA if
needed according to picture 18.
Picture 18
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APPENDIX
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