SONY XR-3750 Service Manual
XR-3750
SERVICE MANUAL
SPECIFICA TIONS
Saudi Arabia Model
Model Name Using Similar Mechanism XR-4800
T ape Transport Mechanism Type MG-25F-136
MICROFILM
FM/MW/SW CASSETTE CAR STEREO
TABLE OF CONTENTS
1. GENERAL
Location of Controls ....................................................... 3
Resetting the Unit ........................................................... 4
Detaching the Front Panel............................................... 4
Setting the Clock ............................................................. 4
Dismounting the Unit...................................................... 4
Installation....................................................................... 5
Connection ...................................................................... 6
2. DISASSEMBLY ......................................................... 8
3. ASSEMBLY OF MECHANISM DECK........... 10
4. MECHANICAL ADJUSTMENTS....................... 13
5. ELECTRICAL ADJUSTMENTS
Test Mode........................................................................ 13
Tape Deck Section .......................................................... 13
Tuner Section .................................................................. 14
6. DIAGRAMS
6-1. IC Pin Function Description ........................................... 17
6-2. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 20
6-3. Printed Wiring Board – MAIN Section –...................... 21
6-4. Schematic Diagram – MAIN Section (1/2) –................. 23
6-5. Schematic Diagram – MAIN Section (2/2) –................. 25
6-6. Printed Wiring Board – PANEL Section – .................... 27
6-7. Schematic Diagram – PANEL Section –....................... 29
7. EXPLODED VIEWS................................................ 33
8. ELECTRICAL PARTS LIST ............................... 36
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
– 2 –
SECTION 1
GENERAL
This section is extracted from
instruction manual.
– 3 –
– 4 –
– 5 –
– 6 –
– 7 –
SECTION 2
k
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
COVER ASS’Y
1
2
2
1
3
cover ass’y
2
1
SUB PANEL, MECHANISM DECK (MG-25F-136)
3
connector
(CN351)
2
sub panel
1
three screws
(PTT2.6
×
8)
5
screw
(PTT2.6
4
flexible flat cable
(CN301)
×
6)
6
mechanism dec
(MG-25F-136)
1
three screws
(PTT2.6
×
8)
– 8 –
MAIN BOARD, HEAT SINK
3
two ground point
screws
4
main board
5
two screws
(PTT 2.6
×
8)
2
rubber cap (25)
5
three screws
(PTT 2.6
5
6
heat sink
×
10)
1
screw
(PTT2.6
two screws
(PTT 2.6
×
8)
×
8)
1
two screws
(PTT2.6
×
8)
– 9 –
SECTION 3
w
ASSEMBLY OF MECHANISM DECK
Note: Follow the disassembly procedure in the numerical order given.
5
Fit projection on C part.
HOUSING
2
Install the hanger onto
two claws of the housing.
4
Fit claw on B part.
3
Put the housing
under
A
part.
housing
C
part
7
Holder the hanger by bending the claw.
1
Install the catch to the hanger.
hanger
6
Fit projaction on D part.
8
Hold the hanger by
bending the claw.
A
part
ARM (SUCTION)
B
part
projection
D
part
2
Move the arm (suction) in the arro
direction and fit on projection.
1
Fit the arm (suction) on the shaft.
– 10 –
LEVER (LDG-A) / (LDG-B)
shaft
A
shaft
1
Fit the lever (LDG-A) on
shafts A – C and install it.
B
shaft
C
3
type-E stop ring 2.0
shaft
A
2
Fit the lever (LDG-B) on
A
shafts
install it.
and B and
shaft
B
GEAR (LDG-FT)
hole
hole
4
Align hole in the gear (LDG-D)
with hole the lever (LDG-A)
gear (LDG-D)
lever (LDG-A)
gear (LDG-FB)
2
tensiton spring (LD-2)
5
gear (LDG-FT)
1
2
3
tensiton spring (LD-1)
6
polyethylene washer
Move the lever (LDG-B)
in the arrow direction.
– 11 –
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