
Information in this document is subject to
change without notice.
Sony, VAIO and CLIE are trademarks or registered trademarks of Sony. Microsoft, Windows,
Windows Media, Outlook, Bookshelf and other
Microsoft products are trademarks or registered
trademarks of Microsoft Corporation in the
United States and other countries. The word
Bluetooth and the Bluetooth logo are trademarks
of Bluetooth SIG, Inc. AMD, the AMD logo, other
AMD product names and combinations thereof
are trademarks of Advanced Micro Devices, Inc.
Intel Inside logo, Pentium, Celeron and Core are
trademarks or registered trademarks of Intel Corporation. Transmeta, the Transmeta logo, Crusoe
Processor, the Crusoe logo and combinations
thereof are trademarks of Transmeta Corporation
in the USA and other countries. Graffiti, HotSync, PalmModem, and Palm OS are registered
trademarks, and the Hotsync logo and Palm are
trademarks of Palm, Inc. or its subsidiaries. (M)
and Motrola are trademarks of Motrora, Inc. Other
Motrola products and services with (R) mark like
Dragonball are the trademarks of Motrola, Inc.
All other names of systems, products and services
in this manual are trademarks or registered trademarks of their respective owners. In this manual,
the (TM) or (R) mark are not specified.
The components identified by mark contain
confidential information.
Strictly follow the instructions whenever the
components are repaired and/or replaced.
Caution Markings for Lithium/Ion Battery - The
following or similar texts shall be provided on
battery pack of equipment or in both the operating
and the service instructions.
CAUTION: Danger of explosion if battery is
incorrectly replaced. Replace only with the same
or equivalent type recommended by the manufacturer. Discard used batteries according to the
manufacturer’s instructions.
CAUTION: The battery pack used in this device
may present a fire or chemical burn hazard if mistreated. Do not disassemble, heat above 60°C
(140°F) or incinerate. Dispose of used battery
promptly. Keep away from children.
CAUTION: Changing the back up battery.
z
Overcharging, short circuiting, reverse charging, multilation or incineration of the cells must
be avoided to prevent one or more of the following occurrences; release of toxic materials,
release of hydrogen and/or oxygen gas, rise in
surface temperature.
z
If a cell has leaked or vented, it should be
replaced immediately while avoiding to touch
it without any protection.
Service and Inspection Precautions
1. Obey precautionary markings and
instructions
Labels and stamps on the cabinet, chassis, and
components identify areas requiring special precautions. Be sure to observe these precautions,
as well as all precautions listed in the operating
manual and other associated documents.
2. Use designated parts only
The set’s components possess important safety
characteristics, such as noncombustibility and
the ability to tolerate large voltages. Be sure that
replacement parts possess the same safety characteristics as the originals. Also remember that the
mark, which appears in circuit diagrams and
parts lists, denotes components that have particularly important safety functions; be extra sure to
use only the designated components.
3. Always follow the original design
when mounting parts and routing
wires
The original layout includes various safety features, such as inclusion of insulating materials
(tubes and tape) and the mounting of parts above
the printer board. In addition, internal wiring has
been routed and clamped so as to keep it away
from hot or high-voltage parts. When mounting
parts or routing wires, therefore, be sure to duplicate the original layout.
4. Inspect after completing service
After servicing, inspect to make sure that all
screws, components, and wiring have been
returned to their original condition. Also check
the area around the repair location to ensure that
repair work has caused no damage, and confirm
safety.
5. When replacing chip components...
Never reuse components. Also remember that
the negative side of tantalum capacitors is easily
damaged by heat.
6. When handling flexible print
boards...
z
The temperature of the soldering-iron tip
should be about 270°C.
z
Do not apply the tip more than three times to
the same pattern.
z
Handle patterns with care; never apply force.
Caution: Remember that hard disk drives are
easily damaged by vibration. Always handle
with care.
ATTETION AU COMPOSANT AYANT
RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE
MARQUE SUR LES DIAGRAMMES
SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES
COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉSDANS
CE MANUEL OU DANS LES SUPPÉMENTS
PUBLIÉS PAR SONY.
-2-
Sony Confidential
VPCEG Series (9-890-871-XX)

Model List
Area Lineup
VPCEG24FJ/B
VPCEG24FJ/P
VPCEG24FJ/W
JP
(Japan)
VPCEG2AJ∗
VPCEG34FJ/B
VPCEG34FJ/P
VPCEG34FJ/W
VPCEG35FJ/W
VPCEG3AJ∗
Area Lineup
VPCEG21FX/B
VPCEG21FX/L
VPCEG21FX/P
VPCEG21FX/W
VPCEG23FX/B
VPCEG23FX/L
VPCEG23FX/P
VPCEG23FX/W
VPCEG24FX/B
VPCEG24FX/L
VPCEG24FX/P
VPCEG24FX/W
VPCEG25FX/B
VPCEG25FX/L
VPCEG25FX/P
VPCEG25FX/W
VPCEG26FX/B
VPCEG26FX/L
VPCEG27FM/P
VPCEG27FM/W
U S VPCEG2DFX/P
(United States) VPCEG2DFX/W
VPCEG290X∗
VPCEG32FX/B
VPCEG32FX/P
VPCEG32FX/W
VPCEG33FX/B
VPCEG33FX/L
VPCEG33FX/P
VPCEG33FX/W
VPCEG34FX/B
VPCEG34FX/L
VPCEG34FX/P
VPCEG34FX/W
VPCEG36FX/B
VPCEG36FX/L
VPCEG36FX/P
VPCEG36FX/W
VPCEG37FM/B
VPCEG37FM/L
VPCEG37FM/P
VPCEG37FM/W
VPCEG390X∗
VPCEG3WFX/W
Area Lineup
VPCEG20EL/B
VPCEG20EL/W
VPCEG23EL/L
VPCEG23EL/P
VPCEG23EL/W
VPCEG23FD/B
VPCEG25FD/B
VPCEG25FD/L
VPCEG25FD/P
VPCEG25FD/W
PA VPCEG30EL/B
(Pan-America) VPCEG30EL/W
VPCEG25FL/L
VPCEG33EB/B
VPCEG33EB/P
VPCEG33EB/W
VPCEG33FL/B
VPCEG33FL/P
VPCEG33FL/W
VPCEG35FB/B
VPCEG35FD/B
VPCEG35FD/P
VPCEG35FD/W
VPCEG35FL/B
Area Lin
VPCEG25EA/B
VPCEG25EG/B
VPCEG25EG/W
VPCEG25EN/B
VPCEG25EN/W
VPCEG26EG/B
VPCEG26EG/W
VPCEG27FA/B
VPCEG27FA/W
VPCEG27FG/B
VPCEG27FG/W
VPCEG27FH/B
VPCEG27FH/W
VPCEG28FA/B
VPCEG28FA/W
VPCEG28FG/B
VPCEG28FG/L
VPCEG28FG/P
VPCEG28FG/W
VPCEG28FH/B
VPCEG28FH/P
VPCEG28FH/W
VPCEG28FK/P
VPCEG28FK/W
VPCEG28FN/B
VPCEG28FN/L
VPCEG28FN/P
VPCEG28FN/W
VPCEG28FW/P
AP VPCEG2AEN/B
(Asia-Pacific) VPCEG2AEN/W
VPCEG28FW/W
VPCEG35EA/B
VPCEG35EA/P
VPCEG35EA/W
VPCEG35EG/B
VPCEG35EG/L
VPCEG35EG/P
VPCEG35EG/W
VPCEG35EN/B
VPCEG35EN/W
VPCEG36EG/B
VPCEG36EG/W
VPCEG37FH/B
VPCEG37FH/W
VPCEG38FA/B
VPCEG38FA/W
VPCEG38FG/B
VPCEG38FG/L
VPCEG38FG/P
VPCEG38FG/W
VPCEG38FH/P
VPCEG38FH/W
VPCEG38FK/P
VPCEG38FK/W
VPCEG38FN/B
VPCEG38FN/L
VPCEG38FN/P
VPCEG38FN/W
VPCEG38FW/W
VPCEG3AEN/B
VPCEG3AEN/W
eup
A
rea Lineup
VPCEG200C∗
VPCEG23YC/B
VPCEG23YC/P
VPCEG23YC/W
VPCEG25YC/B
VPCEG25YC/P
VPCEG25YC/W
VPCEG26EC/B
VPCEG26EC/P
VPCEG26EC/W
VPCEG27YC/B
VPCEG27YC/P
VPCEG27YC/W
VPCEG28EC/B
C N VPCEG28EC/W
(China) VPCEG300C∗
VPCEG28EC/P
VPCEG33YC/B
VPCEG33YC/P
VPCEG33YC/W
VPCEG35YC/B
VPCEG35YC/P
VPCEG35YC/W
VPCEG36EC/B
VPCEG36EC/P
VPCEG36EC/W
VPCEG37YC/B
VPCEG37YC/P
VPCEG37YC/W
VPCEG38EC/B
VPCEG38EC/P
VPCEG38EC/W
∗: CTO Model
-3-
Sony Confidential
VPCEG Series (9-890-871-XX)

TABLE OF CONTENTS
Section Title Page
CHAPTER 1. BLOCK DIAGRAM .............................................................................................. 1-1
(to 1-1)
CHAPTER 2. FRAME HARNESS DIAGRAM ................................................................. 2-1
(to 2-1)
CHAPTER 3. EXPLODED VIEWS AND PARTS LIST
Note ............................................................................................................................................................ 3-2
Main Section
MS-1 ...................................................................................................................................................... 3-3
LCD
L-1 .......................................................................................................................................................... 3-4
Accessories
A-1 ......................................................................................................................................................... 3-5
(to 3-5)
CHAPTER 4. OTHERS
4-1. Replacing the CPU .............................................................................................................................. 4-1
4-2. Note for WiMAX Board Replacement ............................................................................................... 4-2
(to 4-2)
SPECIFICATIONS are listed on Page 3-1 of
"CHAPTER 3. EXPLODED VIEWS AND PARTS LIST".
History of the changes is shown as the "Revision
History" at the end of this data.
䊶㪪㪧㪜㪚㪠㪝㪠㪚㪘㪫㪠㪦㪥㪪䈲䇮㩹㪚㪟㪘㪧㪫㪜㪩㩷㪊㪅㩷㪜㪯㪧㪣㪦㪛㪜㪛㩷㪭㪠㪜㪮㪪㩷
㪘㪥㪛㩷㪧㪘㪩㪫㪪㩷㪣㪠㪪㪫㩹䈱㪊㪄㪈䊕䊷䉳䈮ឝタ䈘䉏䈩䈇䉁䈜䇯
䊶ᄌᦝጁᱧ䈲䇮㵰㩷㪩㪼㫍㫀㫊㫀㫆㫅㩷㪟㫀㫊㫋㫆㫉㫐㩷㵱㩷䈫䈚䈩䇮ᧄ䊂䊷䉺ᧃ䈮
⸥タ䈚䈩䈅䉍䉁䈜䇯
-4-
Sony Confidential
VPCEG Series (9-890-871-XX)

CHAPTER 1.
BLOCK DIAGRAM
1. 5W
INTERNAL MIC
Headphone
External MIC
USB 2.0 x3
S0406- - 1
USB Board
1067/1333
DDRIII
1067/1333
SPEAKER
i/o Connector
H
DD 2.5'' SATA
(SATA0)
Slot 0DDRIII
Slot 1
DDRIII 1067/1333 Channel A
DDRIII 1067/1333 Channel B
CR2032 220mA
(Non Rechargeable)
AUDIO CODEC
Conexant
CX20671-21Z
USB2.0
RTC
HD Audio (Azalia)
RTC
Intel CPU
Sandy Bridge DC
FSB: 1066 MHz
FDI
DMI
at 5G
INTEL
PCH
Couga r Point
14 USB 2.0/1.1 ports
ETHERNET
Serial Peripheral I/F(dual output)
(10/100/1000Mb)
High Definition Audio
ACPI 1.1
LPC I/F
6 SATA
PCI EXPRESS GRAPHIC
RGB CRT
USB2.0
NC
PECI
X8601 27Mhz
Nvidia
N12M-GS2
LVDS
HDMI
CRT
DDR3
900MHz
VRAM x 4
14" LCD
1366x768
HDMI
USB 2.0 x1
CAMERA
BlueTooth
Mini-Card
WLAN/WiMAX
Intel Kilmar Peak 2x2
External model
VRAM
1GB/512MB
BD Combo
Supper-Multi
(SATA4)
LED&Switch Board
Switch x 4
LEDx 4
S0405- - 1
i/o Connector
SPI
Flash
4 MB
SPI
SPI
X2001 25Mhz
X2101 32.768K
NPEC795P
Touch
Pad
KBC
Thermal Sensor
P2800
LPC Bus
1-1
(END)
PCI Express
Lid switch
10/100/1000
WOL from S3
Memory Card
Controller Chip
MS&SD Connector
LED&RF SW
RJ45
X3101 25Mhz
RTS5209
Sony Confidential
VPCEG Series (9-890-871-XX)