Information in this document is subject to
change without notice.
Sony, VAIO and CLIE are trademarks or regis-
tered trademarks of Sony. Microsoft,Windows,
Windows Media, Outlook, Bookshelf and other
Microsoft products are trademarks or registered
trademarks of Microsoft Corporation in the
United States and other countries. The word
Bluetooth and the Bluetooth logo are trademarks
of Bluetooth SIG, Inc. AMD, AMD logo, AMD
Duron and combinations there of, 3DNow!, are
trademarks of Advanced Micro Devices, Inc. Intel
Inside logo, Pentium and Celeron are trademarks
or registered trademarks of Intel Corporation.
Transmeta, the Transmeta logo, Crusoe Proces-
sor, the Crusoe logo and combinations there of
are trademarks of Transmeta Corporation in the
USA and other countries. Graffiti, HotSync,
PalmModem, and Palm OS are registered trade-
marks, and the Hotsync logo and Palm are trade-
marks of Palm, Inc. or its subsidiaries. (M) and
Motrola are trademarks of Motrora, Inc. Other
Motrola products and services with (R) mark like
Dragomball are the trademarks of Motrola, Inc.
All other names of systems, products and services
in this manual are trademarks or registered trade-
marks of their respective owners. In this manual,
the (TM) or (R) mark are not specified.
Caution Markings for Lithium/Ion Battery - Thefollowing or similar texts shall be provided onbattery pack of equipment or in both the operat-ing and the service instructions.
CAUTION: Danger of explosion if battery is in-correctly replaced. Replace only with the sameor equivalent type recommended by the manu-facturer. Discard used batteries according to themanufacturer’s instructions.
CAUTION: The battery pack used in this devicemay present a fire or chemical burn hazard if mis-treated. Do not disassemble, heat above 100°C(212°F) or incinerate. Dispose of used batterypromptly. Keep away from children.
CAUTION: Changing the back up battery.
•Overcharging, short circuiting, reverse charg-ing, multilati on or incineration of the cells mustbe avoided to prevent one or more of the fol-lowing occurrences; release of toxic materials,release of hydrogen and/or oxygen gas, rise insurface temperature.
•If a cell has leaked or vented, it should be re-placed immediately while avoiding to touch itwithout any protection.
Service and Inspection Precautions
1.Obey precautionary markings andinstructions
Labels and stamps on the cabinet, chassis, andcomponents identify are as requiring special pre-cautions. Be sure to observe these precautions,as well as all precautions listed in the operatingmanual and other associated documents.
2.Use designated parts only
The set’s components possess important safetycharacteristics, such as noncombustibility and theability to tolerate large voltages. Be sure that re-placement parts possess the same safety charac-teristics as the originals. Also remember that the
mark, which appears in circuit diagrams and
parts lists, denotes components that have particu-larly important safety functions; be extra sure touse only the designated components.
3.Always follow the original designwhen mounting parts and routingwires
The original layout includes various safety fea-tures, such as inclusion of insulating materials(tubes and tape) and the mounting of parts abovethe printer board. In addition, internal wiring hasbeen routed and clamped so as to keep it awayfrom hot or high-voltage parts. When mountingparts or routing wires, therefore, be sure to du-plicate the original layout.
4.Inspect after completing service
After servicing, inspect to make sure that all
screws, components, and wiring have been returned to their original condition. Also check the
area around the repair location to ensure that repair work has caused no damage, and confirm
safety.
5.When replacing chip components...
Never reuse components. Also remember that the
negative side of tantalum capacitors is easily damaged by heat.
6.When handling flexible print
boards...
•The temperature of the soldering-iron tip
should be about 270°C.
•Do not apply the tip more than three times to
the same pattern.
•Handle patterns with care; never apply force.
Caution: Remember that hard disk drives
are easily damaged by vibration. Always
handle with care.
Win XP HomeWin XP HomeXP ProXP HomeWin XP ProWin XP HomeWin XP ProWin XP HomeWin XP Home
VGN-S170B∗VGN-S170P∗VGN-S170∗
PM-2.0A or PM-1.8
or PM-1.7A
or PM-1.5 or Cel M-1.4
855PM855PM855PM855PM855PM855PM855PM855PM855PM
M9+X (32MB) or
M11-P (64MB)
13.3 WXGA (Brighter) or
13.3 WXGA
40GB or 60GB or
80GB(4.2Krpm) or
80GB(5.4Krpm)
512MBx2 or 512MBx1 or
256MBx2 or 256MBx1
9.5 DVD-RW or
9.5 DVD/CD-RW
802.11b/g or None802.11b/g or None802.11b/g or None802.11b/g802.11b/g802.11b/g802/11b.g802.11b/g802.11b/gPCGA-AC16V6PCGA-AC16V6PCGA-AC16V6PCGA-AC16V6PCGA-AC16V6PCGA-AC16V6PCGA-AC16V6PCGA-AC16V6PCGA-AC16V6
VGP-BPS2 or VGP-BPL2VGP-BPS2 or VGP-BPL2VGP-BPS2 or VGP-BPL2VGP-BPS2, VGP-BPL2VGP-BPS2, VGP-BPL2VGP-BPS2, VGP-BPL2VGP-BPS2, VGP-BPL2VGP-BPS2, VGP-BPL2 VGP-BPS2, VGP-BPL2
Win XP Pro(SMB)Win XP ProWin XP HomeWin XP ProWin XP ProWin XP ProWin XP ProWin XP ProWin XP Pro