Sony VAIO PCGZ505LE User Manual

Information in this document is subject to change without notice.

Sony and VAIO are trademarks of Sony. Intel logo and Intel Inside
logo are registered trademarks of Intel Corporation. Pentium MMX
is a trademark of Intel Corporation. Microsoft, MS-DOS, W indows,
the W indows 95 and W indows 98 log o are trademarks of Microsoft
Corporation.

All other trademarks are trademarks or registered trademarks of
their respective owners. Other tr ademarks and trade names may be
used in this document to refer to the entitles claiming the marks and
names or their produces. Sony Corporation disclaims any proprietary
interest in trademarks and trade names other than its own.

Caution Markings for Lithium/Ion Battery - The following or similar
texts shall be provided on battery pack of equipment or in both the
operating and the service instructions.

CAUTION: Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer. Discard used batteries according to the
manufacturer’s instructions.

CAUTION: The battery pack used in this de vice may present a f ire
or chemical burn hazard if mistreated. Do not disassemble, heat
above 100°C (212°F) or incinerate.
Dispose of used battery promptly.
Keep away from children.

CAUTION: Changing the back up battery.

• Overcharging, short circuiting, reverse charging, multilation or
incineration of the cells must be avoided to prev ent one or more of
the following occurrences; release of toxic materials, release of
hydrogen and/or oxygen gas, rise in surface temperature.

• If a cell has leaked or vented, it should be replaced immediately
while avoiding to touch it without any protection.

Service and Inspection Precautions

1. Obey precautionary markings and instructions

Labels and stamps on the cabinet, chassis, and components identify areas
requiring special precautions. Be sure to observe these precautions, as well
as all precautions listed in the operating manual and other associated
documents.

2. Use designated parts only

The set’s components possess important safety characteristics, such as
noncombustibility and the ability to tolerate large voltages. Be sure that
replacement parts possess the same safety characteristics as the originals.
Also remember that the 0 mark, which appears in circuit diagrams and
parts lists, denotes components that have particularly important safety
functions; be extra sure to use only the designated components.

3. Always follow the original design when mounting
parts and routing wires

The original layout includes various safety features, such as inclusion of
insulating materials (tubes and tape) and the mounting of parts above the
printer board. In addition, internal wiring has been routed and clamped so
as to keep it away from hot or high-voltage parts. When mounting parts or
routing wires, therefore, be sure to duplicate the original layout.

4. Inspect after completing service

After servicing, inspect to make sure that all screws, components, and wiring
have been returned to their original condition. Also check the area around
the repair location to ensure that repair work has caused no damage, and
confirm safety.

5. When replacing chip components...

Never reuse components. Also remember that the negati ve side of tantalum
capacitors is easily damaged by heat.

6. When handling flexible print boards...

•The temperature of the soldering-iron tip should be about 270C.

•Do not apply the tip more than three times to the same pattern.

•Handle patterns with care; never apply force.

Caution: Remember that hard disk drives are easily damaged by
vibration. Always handle with care.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

Confidential

PCG-Z505LE/Z505LEK/Z505LS/Z505LSK (UC)

— 2 —

TABLE OF CONTENTS

Section Title Page

CHAPTER 1. REMOVAL

1-1. Flowchart ......................................................................... 1-1

1-2. Main Electrical Parts Location Diagram ......................... 1-1

1-3. Removal ........................................................................... 1-2

1. Keyboard Unit..................................................................1-2

2. Palm Rest Assembly ........................................................ 1-2

3. SWX-47 Board, Touch Pad, and Speaker Unit................ 1-3

4. Modular Jack, Harness (DC Jack), and RO-36 Board ..... 1-3

5. HDD, and SWX-48 Board ............................................... 1-4

6. DC Fan ............................................................................. 1-4

7. IFX-122 Board, CNX-106 Board,

and PC Card Connector ................................................... 1-5

8. Main Board Assembly (MBX-42 Board),
IFX-123 Board, V/L Rechargeable Battery,

and Memory Module ....................................................... 1-5

9. Display Assembly ............................................................ 1-6

10.Bezel Housing Assembly ................................................. 1-6

11.LEX-20 Board, Inverter Unit, and LCD Unit .................. 1-7

(to 1-7)

CHAPTER 2. SELF DIAGNOSTICS

2-1. Note..................................................................................2-1

2-2. Necessary Tools ............................................................... 2-1

2-3. Starting up the Service Diagnostics ................................. 2-1

2-4. Outline of Service Diagnostics Functions ....................... 2-2

2-5. Inspecting W indo ws......................................................... 2-5

(to 2-5)

CHAPTER 3. BLOCK DIAGRAM............................... 3-1

(to 3-2)

CHAPTER 4. FRAME HARNESS DIAGRAM........ 4-1

(to 4-2)

CHAPTER 5. EXPLODED VIEWS AND

PARTS LIST

5-1. Main Section.................................................................... 5-1

5-2. LCD Section – Made by HI – .......................................... 5-3

(to 5-4)

• Abbreviations
UC : US model / Canadian model

— 3 —

Confidential

PCG-Z505LE/Z505LEK/Z505LS/Z505LSK (UC)

1-1. Flowchart

POWER

OFF

KEYBOARD

UNIT

P1-2

PALM REST

ASSY

P1-2

SWX-47
BOARD

P1-3

MODULAR

JACK

P1-3

SWX-48
BOARD

P1-4

DC FAN

P1-4

IFX-122
BOARD

P1-5

DISPLAY

ASSY

P1-6

SPEAKER

UNIT

P1-3

P1-3

LEX-20

BOARD

P1-7

RO-36

BOARD

P1-5

V/L

RECHARGEABLE

BATTERY

LCD

UNIT

P1-7

MAIN BOARD

ASSY

P1-5

P1-7

INVERTER

UNIT

TOUCH PAD

P1-3

P1-3

P1-4

BEZEL

HOUSING

ASSY

P1-6

HARNESS

(DC JACK)

CNX-106

BOARD

P1-5

HDD

PC CARD

CONNECTOR

P1-5

IFX-123
BOARD

P1-5

CHAPTER 1.

REMOVAL

• P XX means pages that appears in this manual.

• Remember that hard disk drives are easily damaged by vibration. Always handle with care.

• When the thermal sheet (Part No. 4-645-921-01) of the computer reaches a certain temperature, it becomes soft, which

increases the contact. Therefore, it may be diff icult to disassemble the f an at r oom temperatur e. In this case, use a dryer or
soldering iron to heat up the plate metal contacting the fan.
In addition, replace the old thermal sheet with a new one in order to keep the heating performance.

1-2. Main Electrical Parts Location Diagram

V/L Rechargeable Battery

CNX-106 Board

PC Card Connector

IFX-122 Board

Harness (DC Jack)

Keyboard Unit

SWX-47 Board

Memory Module

Speaker Unit

RO-36 Board

LEX-20 Board

Touch Pad

HDD

1-1 PCG-Z505LE/Z505LEK/Z505LS/Z505LSK (UC)

LCD Unit

Main Board Assy (MBX-42 Board)

DC Fan

SWX-48 Board

Inverter Unit

Modular Jack

Speaker Unit

IFX-123 Board

Confidential

1-3.Removal

1. Keyboard Unit

4

5 Keyboard Unit (US)

3

2

2. Palm Rest Assembly

q; Palm Rest ASSY

1 Cover

(DL)

3 Cover (BBL)

3 Escutcheon (AU)

3 Escutcheon (MU)

1 +B 2X5 (X2)

8

1 +B 2X5 (X4)

Radiation (NN)

5 +B 2X5

9

9

6 +B 2X5

9

5 +B 2X5

2 Cover (BPL)

2 Cover (BPR)

Confidential

4 +B 2X5 (X3)

1 Cover (DR)

3 Cover (BBR)

7 Escutcheon (F)

4 +B 2X5 (X2)

1-2PCG-Z505LE/Z505LEK/Z505LS/Z505LSK (UC)

3. SWX-47 Board, Touch Pad, and Speaker Unit

7 Escutcheon (PAD)

0 Touch Pad

9 Insulating Sheet (PAD)

6 Button (PAD)

5 +B 2X3.5 (X2)

4 SWX-47 Board

1 +B 2X3.5 (X2)

8

qs Speaker Unit

Double Stick Tape
Bracket (SPK)

Cushion (T4)

Flexible Flat Cable (12 Core)

3

2

Flexible Flat Cable (8 Core)

qs Speaker Unit

Double Stick Tape

Bracket (SPK (R))
Flexible PWB

4. Modular Jack, Harness (DC Jack), and RO-36 Board

7 Harness (DC Jack)

4 +B 2X3.5

5 Holder (Wire)

6

8 RO-36 Board

2

FPC (CNX-73)

1 +B 2X4

3 Modular Jack

Insuluting Sheet
(WJ)

Confidential

1-3 PCG-Z505LE/Z505LEK/Z505LS/Z505LSK (UC)