Sony VAIO PCG-SR9G, VAIO PCG-SR9G/T Service Manual
Confidential
PCG-SR9G/SR9G/T (I)
9-872-097-41
2000G1605-1
Sony Corporation
Information Technology Company
9-872-097-41
PCG-SR9G/SR9G/T (I)
This manual and the constituent data may not be
replicated, copied nor reprinted in whole or in part
without prior written authorization of Sony Corporation.
English
2000G1605-1
© 2000 Sony Corporation
Printed in U.S.A.
VAIO Customer Link (JAPAN)
PCG-SR9G/SR9G
/
T
International Model
SERVICE MANUAL
NOTEBOOK COMPUTER
9-872-097-41
S400
Illust : PCG-SR9G
— 2 —
PCG-SR9G/SR9G/T (I)
Information in this document is subject to change without notice.
Sony and VAIO are trademarks of Sony . Intel logo and Intel Inside
logo are registered trademarks of Intel Corporation. Pentium MMX
is a trademark of Intel Corporation. Microsoft, MS-DOS, Windo ws,
the W indows 95 and W indows 98 log o are trademarks of Microsoft
Corporation.
All other trademarks are trademarks or registered trademarks of
their respective owners. Other tr ademarks and trade names may be
used in this document to refer to the entities claiming the marks and
names or their products. Sony Corporation disclaims any proprietary
interest in trademarks and trade names other than its own.
Service and Inspection Precautions
1. Obey precautionary markings and instructions
Labels and stamps on the cabinet, chassis, and components identify areas
requiring special precautions. Be sure to observe these precautions, as well
as all precautions listed in the operating manual and other associated
documents.
2. Use designated parts only
The set’s components possess important safety characteristics, such as
noncombustibility and the ability to tolerate large voltages. Be sure that
replacement parts possess the same safety characteristics as the originals.
Also remember that the 0 mark, which appears in circuit diagrams and
parts lists, denotes components that have particularly important safety
functions; be extra sure to use only the designated components.
3. Always follow the original design when mounting
parts and routing wires
The original layout includes various safety features, such as inclusion of
insulating materials (tubes and tape) and the mounting of parts above the
printer board. In addition, internal wiring has been routed and clamped so
as to keep it away from hot or high-voltage parts. When mounting parts or
routing wires, therefore, be sure to duplicate the original layout.
4. Inspect after completing service
After servicing, inspect to make sure that all screws, components, and wiring
have been returned to their original condition. Also check the area around
the repair location to ensure that repair work has caused no damage, and
confirm safety.
5. When replacing chip components...
Never reuse components. Also remember that the negati ve side of tantalum
capacitors is easily damaged by heat.
6. When handling flexible print boards...
•The temperature of the soldering-iron tip should be about 270C.
•Do not apply the tip more than three times to the same pattern.
•Handle patterns with care; never apply force.
Caution: Remember that hard disk drives are easily damaged by
vibration. Always handle with care.
Caution Markings for Lithium/Ion Battery - The following or similar
texts shall be provided on battery pack of equipment or in both the
operating and the service instructions.
CAUTION: Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer. Discard used batteries according to the
manufacturer’s instructions.
CAUTION: The battery pack used in this de vice may present a fire
or chemical burn hazard if mistreated. Do not disassemble, heat
above 100°C (212°F) or incinerate.
Dispose of used battery promptly.
Keep away from children.
CAUTION: Changing the back up battery.
• Overcharging, short circuiting, reverse charging, multilation or
incineration of the cells must be avoided to prevent one or mor e of
the following occurrences; release of toxic materials, release of
hydrogen and/or oxygen gas, rise in surface temperature.
• If a cell has leaked or vented, it should be replaced immediately.
Use protection when handling battery.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Confidential
TABLE OF CONTENTS
Section Title Page
PCG-SR9G
/
SR9G/T (I)
Confidential
— 3 —
CHAPTER 1. REMOVAL
1-1. Flowchart ......................................................................... 1-1
1-2. Main Electrical Parts Location Diagram ......................... 1-1
1-3. Removal........................................................................... 1-2
1. Keyboard Unit, Parm Assy .............................................. 1-2
2. Touch pad, Speaker, SWX-55 Board ............................... 1-2
3. HDD................................................................................. 1-3
4. Speaker, IFX-109 Board .................................................. 1-3
5. DC Fan, Heatsink............................................................. 1-4
6. Main Board Assy ............................................................. 1-4
7. MBX-34 Board, IFX-108 Board, DDC-2 Board
V/L Rechargeable Battery ............................................... 1-5
8. CNX-96 Board ................................................................. 1-5
9. Display Assy .................................................................... 1-6
10.Housing (Bezel) Assy ...................................................... 1-6
11.Inverter Unit, ANL-22 Board,
Microphone, LCD Assy................................................... 1-7
(to 1-7)
CHAPTER 2. SELF DIAGNOSTICS
2-1. Precautions....................................................................... 2-1
2-2. Necessary Tools ............................................................... 2-1
2-3. Starting up the Service Diagnostics ................................. 2-1
2-4. Outline of Service Diagnostics Functions ....................... 2-2
(to 2-4)
CHAPTER 3. BLOCK DIAGRAM............................... 3-1
(to 3-2)
CHAPTER 4. FRAME HARNESS DIAGRAM........ 4-1
(to 4-2)
CHAPTER 5. EXPLODED VIEWS AND
PARTS LIST
5-1. Main Section.................................................................... 5-1
5-2. LCD Section – Made by TS –..........................................5-3
(to 5-4)
CHAPTER 1. SPECIFICATIONS............................ 1-1
CHAPTER 2. OVERVIEW
2-1. Locating Controls and Connectors........................ 2-1
CHAPTER 3. SERVICE INFORMATION
3-1. Install Procedure after the
Hard Disk is Replaced ..................................... 3-1
APPENDIX
1-1 PCG-SR9G/SR9G/T (I)
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CHAPTER 1.
REMOVAL
1-1. Flowchart
• P XX refers to page numbers that appear in this manual.
• Remember that hard disk drives are easily damaged by vibration. Always handle with care.
1-2. Main Electrical Parts Location Diagram
P1-7P1-6
P1-4
P1-6
P1-7
P1-7
P1-7
P1-2 P1-4
P1-2
P1-2
P1-2
P1-3
P1-2
P1-3
P1-5P1-3
P1-4
P1-4
P1-5
P1-5
P1-5
P1-5
TOUCH PAD
SPEAKER (R)
V/L
RECHARGEABLE
BATTERY
MICRO
PHONE
DISPLAY
ASSY
HOUSING
(BEZEL)
ASSY
LCD
ASSY
INVERTER
UNIT
POWER
OFF
KEYBOARD
UNIT
FRAME
ASSY
MAIN BOARD
ASSY
SPEAKER (L)
PARM ASSY
SWX-55
BOARD
IFX-109
BOARD
CNX-96
BOARD
HDD
COOLING
DC FAN
MBX-34
BOARD
IFX-108
BOARD
DDC-2
BOARD
ANL-22
BOARD
HDD
Microphone
Touch pad
SWX-55 Board
DC Fan
DC Jack
Modular Jack
(SR9G/T Model)
Inverter Unit
LCD Assy
IFX-109 Board
MBX-34 Board
CNX-96 Board
IFX-108 Board
DDC-2 Board
ANL-22 Board
V/L Rechargeable Battery
Keyboard Unit
Speaker
Speaker
1-2PCG-SR9G/SR9G/T (I)
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1-3. Removal
1. Keyboard Unit, Parm Assy
2. Touch pad, Speaker, SWX-55 Board
A
B
Latch (Key)
Clip or the
like
5
3
2
q; Keyboard Unit
8 Parm Assy
7 FFC (MBX-34-SWX-55)
1 +B 2X6 (X7)
4
9
6
7 Escutcheon (Pad)
9 Touch Pad
qf Housing (Parm Rest) Assy
Jog Window
a
a
Window MS
q; Insulating Sheet (Pad)
5 Bushing (PC Board)
7 FFC (MBX-34-SWX-55)
qd Speaker
7 FFC (SWX-55-Touch Pad)
6 SWX-55 Board
1
3
8
2
qs Speaker Holder
qa Tapping Screw (M2X4)(X2)
4 Tapping Screw (M2X4)
1-3 PCG-SR9G/SR9G/T (I)
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3. HDD
4. Speaker, IFX-109 Board
1 +B 2X4
3 +P 3X4 (X2)
8 HDD
5 +P 3X4
(X2)
4 Bracket (B)
6 Bracket (F)
2
7 FPC (HDD)
1 +B 2X4 (X2)
4 FFC (10p)
7 +B 2X4 (X2)
5 IFX-109
Board
3
2
8 Speaker Holder
0 Duct (L)
9 Speaker
6
1-4PCG-SR9G/SR9G/T (I)
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5. DC Fan, Heatsink
6. Main Board Assy
1 Blind, Screw (X2)
4 Frame Assy
a
6 Heatsink NT
8 DC Fan
2 +B 2X6 (X2)
qa +B 2X4 (X4)
5 +B 2X6 (X2)
9 +B 2X4
0 Escutcheon (LB)
qs Cooling (1)
qd Bushing (FAN)
3 +B 2X6 (X2)
7
qa Main Board Assy
a
a
9 +B 2X4
3
4
5
1
6
7
8
2 +B 2X4
q; +B 2X4 (X2)
(SR9G/T Model)
1-5 PCG-SR9G/SR9G/T (I)
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7. MBX-34 Board, IFX-108 Board, DDC-2 Board, V/L Rechargeable Battery
8. CNX-96 Board
B
C
A
A
Order of releasing the
SO-DIMM
A → C
qs MBX-34 Board
3 IFX-108 Board
2 Insulator IFX-108
7 DDC-2 Board
6 Insulator DDC-2
1 +B 2X4
8 Nut M2
4 Hex Screw (MBX)
9 Hex Screw (MBX)
Memory Module
qa V/L Rechargeable Battery
q;
5 +B 2X4
4 Dial Assy
6 +B 2X4
5 CNX-96 Board
1 +B 2X4
8 Escutcheon (RB) Assy
2 Escutcheon (RF)
7 Cap Modem
(SR9G/T Model)
9 Flexible Print PWB
9 Modular Harness
3 FFC (MBX-34-CNX-96)
(SR9G/T Model)
7 Cover (No Modem)
(SR9G Model)
1-6PCG-SR9G/SR9G/T (I)
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9. Display Assy
10. Housing (Bezel) Assy
4 +B 2.6X4 (X2)
5
3 +B 2X4
2 +B 2X4
6 Display Assy
1
7 +B 2X4
2 +B 2X4 (X2)
4 +B 2X4 (X2)
q; +B 2X4
8 Cover (L)
qa Cover (R)
9 Cover (Screw)
6 Cover (Screw)
3 Cover (Screw)(X2)
5 Housing (Bezel) Assy
1 Cover (Screw)(X2)
Three Claws
Three
Claws
Two Claws
Two Claws
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