Sony TMRRF-815-R Service manual

TMR-RF815R
SERVICE MANUAL
Ver 1.0 2000. 06
COMPONENT MODEL NAME FOR MDR-RF815RK
Headphones MDR-RF815R Transmitter TMR-RF815R
AEP Model
UK Model
SPECIFICATIONS
General
Carrier frequency
863.5 – 864.5 MHz Channel Ch1, Ch2, Ch3 Modulation FM stereo Frequency response
20 – 20,000 Hz
Transmitter
Power source DC 9 V: supplied AC power
adaptor
Audio input phono jacks/stereo mini jack Dimensions Approx. 150 mm dia × 108 mm
(6 × 4 1/3 in.) (w/h)
Mass Approx. 190 g (6.2 oz.)
Design and specifications are subject to change without notice.
TRANSMITTER
Setting up the
SECTION 1

GENERAL

A To connect to a headphones jack
This section is extracted from instruction manual.
transmitter 1
Connect the transmitter to audio/video equipment. Select one of the hookups below depending on the jack type:
Transmitter
OFF ON
FILTERNOISE
Right channel (red)
Connecting cord (supplied)
Unimatch plug adaptor (supplied)
to headphones jack (stereo phone jack)
RBAL
AUDIO IN
CD Walkman, MD Walkman, WALKMAN*, VCR, etc.
to AUDIO IN A jacks
DC IN 9V
123
CHANNEL
Left channel (white)
to headphones jack (stereo mini jack)
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly­soldered connections. Check the entire board surface for solder splashes and bridges.
2. Check the interboard wiring to ensure that no wires are "pinched" or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors, that were installed during a previous repair. Point them out to the customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs of deterioration. Point them out to the customer and recommend their replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270˚C during repairing.
• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
— 2 —
SECTION 2
r

DISASSEMBLY

Note : Follow the disassembly procedure in the numerical order given.

2-1. CABINET (UPPER)

2
Cabinet (upper)
1
Four screws (P 2
× 8)

2-2. TX-BASE BOARD

2
TX-BASE board
Cabinet assy, lowe
1
— 3 —
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