Sony SSCT-100-D, SSWGV-100-D, SSZX-100-D, SSZX-100-DP, SSZX-80-DP Service manual

SS-CT100D/WGV100D/ZX80DP/
ZX100D/ZX100DP
SERVICE MANUAL
Ver. 1.0 2006.05
Photo: SS-CT100D Photo: SS-WGV100D Photo: SS-ZX100D
SS-CT100D is center speaker in FST-ZX80D/ZX100D/LBT-ZX80D/ZX100D.
SS-WGV100D is subwoofer in FST-ZX100D/LBT-ZX100D.
SS-ZX100D is front and surround speakers in FST-ZX80D/ZX100D/LBT-ZX80D/ZX100D.
SS-ZX80DP is package speaker of front and surround speakers in FST-ZX80D/LBT-ZX80D.
SS-ZX100DP is package speaker of front and surround speakers in FST-ZX100D/LBT-ZX100D.
SS-ZX80DP SS-ZX100DP Front Speaker SS-ZX100D Surround Speaker SS-ZX100D
E Model
Front/Surround speaker SS-ZX100D
Speaker system 2-way, bass-reflex type,
magnetically shielded Speaker units Woofer 22 cm, cone type Tweeter 5 cm, cone type × 2 Nominal impedance 6 ohms Dimensions (w/h/d) Approx. 308 × 365 ×
480 mm Mass Approx. 10.0 kg net per
speaker
Center Speaker SS-CT100D
Speaker system Full range, 2-unit,
bass-reflex type,
magnetically shielded Speaker units Full range 8 cm, cone type × 2 Nominal Impedance 16 ohms Dimensions (w/h/d) Approx. 268 × 107 ×
117 mm Mass Approx. 1.6 kg
SPECIFICATIONS
Subwoofer SS-WGV100D
Subwoofer system 1-way, 1-unit,
bass-reflex type,
magnetically shielded Speaker units Subwoofer: 20 cm, cone type Nominal impedance 8 ohms Dimensions (w/h/d) (Approx.)
281 × 362 × 338.5 mm Mass (Approx.) 6.8 kg
Design and specifications are subject to change without notice.
JIG When disassembling the set, use the following jig (for speaker removal). Part No.: J-2501-238-A JIG FOR SPEAKER REMOVAL
9-887-256-01
2006E05-1 © 2006.05
SPEAKER SYSTEM
Sony Corporation
Home Audio Division Published by Sony Techno Create Corporation
SS-CT100D/WGV100D/ZX80DP/ZX100D/ZX100DP
Subwoofer (SS-WGV100D)
SUBWOOFER ON/OFF 1 SUBWOOFER LEVEL 2
ALPHABETICAL ORDER
A – Z
SECTION 1
GENERAL
Notes on chip component replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ˚C. Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
This section is extracted from instruction manual.
1 2
2
SS-CT100D/WGV100D/ZX80DP/ZX100D/ZX100DP
SECTION 2
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
2-1. FRONT PANEL BLOCK (SS-WGV100D)
1
Insert a flat-tip screwdriver into a recess in the bottom of the set to raise the front panel assy a little.
3
Raise the front panel assy a little by little from bottom to top of the set.
2
Insert the jig (J-2051-238-A) into a space made by inserting the screwdriver, and raise the front panel assy gradually.
4
front panel block
3
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