This system incorporates with Dolby* Digital and Dolby Pro Logic (II)
adaptive matrix surround decoder and the DTS** Digital Surround
System.
* Manufactured under license from Dolby Laboratories.
“Dolby”, “Pro Logic”, and the double-D symbol are trademarks of
Dolby Laboratories.
**Manufactured under license from Digital Theater Systems, Inc.
“DTS”, “DTS-ES”, and “DTS Digital Surround” are trademarks of
Digital Theater Systems, Inc.
For the US model
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND
TOTAL HARMONIC
DISTORTION:With 4 ohm loads, both
Amplifier section SA-WSLF10
Stereo mode (rated)86 W + 86 W (4 ohms at
Surround mode (reference) music power output
*Depending on the sound field settings and the source,
there may be no sound output.
InputsVIDEO/SAT:
channels driven, fro m
200 – 20,000 Hz; rated
65 watts per channel
minimum RMS power,
with no more than 0.7 %
total harmonic distortion
from 250 milli watts to
rated output.
Mass (approx.)14 kg (30 lb 14 oz)
Power requirements
North American models: 120 V AC, 60 Hz
Taiwan model:120 V AC, 50/60 Hz
Other models:220-240 V AC, 50/60 Hz
Power consumption120 W
2.7 kg (6 lb) with stand
magnetically sh ie lded
type ×2, 25 mm (1 inch )
dia. balance-dome-type
tweeter
3
1
/8 inches) (w/h/d)
15 × 2
magnetically sh ie lded
type ×2, 25 mm (1 inch )
dia. balance-dome-type
tweeter
1
/2 × 2 1/8 inches) (w/h/d)
9
1
cone type
1
/2 × 23 7/8 × 9 1/2
(9
inches) (w/h/d)
0.3 W (at the Power Saving
mode)
/4 ×
3
/4 ×
/8 inches) dia.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester , such as the Simpson 229 or RCA
WT -540A. Follow the manuf acturers’ instructions to use these
instruments.
2. A battery-operated A C milliammeter . The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter . The “limit” indication
is 0.75 V, so analog meters must have an accurate lo w-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
To Exposed Metal
Parts on Set
Design and specifications are subject to change
without notice.
AC
0.15 µF
1.5 k
Ω
voltmete
(0.75 V)
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
5-22. Printed Wiring Boards – POWER SUPPLY Section –.... 32
5-23. Schematic Diagram – POWER SUPPLY Section – ........ 33
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
6-5. Stand Section ................................................................... 48
7.ELECTRICAL PARTS LIST................................ 49
MODELPART No.
US model2-590-864-0[]
Taiwan model2-590-866-0[]
Singapore model2-590-867-0[]
Australian model2-591-603-0[]
3
SA-WSLF10/SS-CTL10/TSL10/TSL11
• The units that are required for the system operation check during repair service
Units required for
Unit.
need to
checking
Super audio CD/
DVD player : HCD-LF10
Sub woofer :
SA-WSLF10
Front speaker :
SS-TSL10
Center speaker :
SS-CTL10
Surround speaker :
SS-TSL11
Remote commander :
RM-SP320
*1 Only the defective unit. *2 Either one of them.
Units with a mark: The units that are required for the system operation check during repair service
However, there can be a case that some units of the system need to not be brought into repair shop depending on the unit. that became defective.
operation
Super audio CD/
DVD player :
check
HCD-LF10
a
a
a
a
Sub woofer :
SA-WSLF10
a
a
a
a
Front speaker :
SS-TSL10
a*1
a*2
Center
speaker :
SS-CTL10
a
Surround
speaker :
SS-TSL11
a*1
Remote
commander :
RM-SP320
a
a
a
a
a
Remote
sensor :
DIR-R4
Surround
amplifier :
TA-SB500WR
a
a
a
aaaa
IR transmitter :
DIR-T1
IR receiver :
DIR-R1
THE CHECK METHOD OF THE OUTPUT SIGNAL FROM TX BOARD
Procedure:
1. A spectrum analyzer is connected to pin 1 and pin 2 of the output connector (CN803) of TX board.
digital
voltmeter
TX board
pin
10 Ω (0.5%)
1
2
CN803 pin
2. Conf irm that it is spectrum as shown in a f igure with the spectrum analyzer . It is normal if the signal of a 3MHz to 6MHz zone (a center
is 4.5MHz) can be checked.
3. When the output signal from TX board is normal, pin 8 (SDATA), pin 4 (LRCKO) and pin 5 (BCKO) of the input signal connector
(CN801) are investigated.
4
SERVICING POSITION (MAIN Board)
SA-WSLF10/SS-CTL10/TSL10/TSL11
Connect the MAIN board and the VIDEO I/O board
using the extension cable and check the MAIN board.
J-2501-245-A
(1mm/23P/L300)
IC525 on the MAIN board
CAUTION:
Keep your eyes 10 cm or more away from the infrared laser unit (DIR-T1).
Do not view directly the laser beam.
5
SA-WSLF10/SS-CTL10/TSL10/TSL11
SECTION 2
Subwoofer (Rear Panel)
GENERAL
This section is extracted from
instruction manual.
VIDEO
S VIDEO (DVD ONLY)
MONITOR OUTPUT
PHONES
DIR-R4
COMPONENT VIDEOOUT ANTENNA
PB/CBPR/CRSCAN SELECT
Y
VIDEO
VIDEO DIR-T1
IN
IN
AUDIO
AUDIO
IN
IN
OPTICAL
LL
R
VIDEO
DIGITAL IN
R
SAT
A PHONES jack
B MONITOR OUTPUT (VIDEO/S VIDEO)
jacks
C COMPONENT VIDEO OUT jacks
D COMPONENT VIDEO OUT/SCAN
SELECT switch
E AM terminals
F FM 75Ω COAXIAL jack
G SPEAKER jacks
INTERLACESELECTABLE
AM
CENTER FRONT L
FRONT R
(FOR SS-TSL10 , SS-CTL10)
FM
75
COAXIAL
SYSTEM CONNECTOR
SPEAKER
FOR HCD-LF10
H SYSTEM CONNECTOR jack
I DIR-T1 jack
J SAT OPTICAL DIGITAL IN jack
K SAT (VIDEO IN/AUDIO IN (L/R)) jacks
L VIDEO (VIDEO IN/AUDIO IN (L/R)) jacks
M DIR-R4 jack
6
SA-WSLF10/SS-CTL10/TSL10/TSL11
SECTION 3
DISASSEMBLY
HOW TO REMOVE THE FRONT GRILLE (SS-CTL10/TSL10/TSL11)
Raise the front grille gently through the following procedure.
1
Prepare one clip (thickness φ0.8 mm).
2
Bend the leading end by about 3 mm.
3
Insert the clip into a hole in the front grille and raise the front grille.
clip
φ
0.8mm
clip
3mm
Note: The front grille has been stuck with the rubber.
(The sticking location is different depending on the speaker.)
front grille
rubber
7
SA-WSLF10/SS-CTL10/TSL10/TSL11
p
e
SECTION 4
ELECTRICAL ADJUSTMENT
DIAT SIGNAL RF LEVEL ADJUSTMENT
This adjustment is performed in order to adjust the transmission
distance of RF signal for DIAT communication.
Connection:
TX board
TP815
(RF AMP OUT)
Procedure:
1. Connect the oscilloscope to TP815 (RF AMP OUT) and GND
on the TX board.
2. Connect DIR-T1 to DIR-T1 jack (J908).
3. Adjust RV801 on the TX board so that the center of waveform
becomes trigger level 1.05 Vp-p.
(*Trigger position: –4 DIV)
4. Confirm trigger is locked.
5. Adjust RV801 on the TX board so that the center of waveform
becomes 2.2 to 2.4 Vp-p.
• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
f
•
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:Parts on the pattern face side seen from
(Conductor Side)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Indication of transistor
: internal component.
C
Q
B
E
Q
B
CE
These are omitted.
These are omitted.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
•f: internal component.
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : DVD PLAY
(): TUNER (FM/AM)
• Voltages are taken with a V OM (Input impedance 10 MΩ).
Voltage var iations may be noted due to normal production tolerances.
• Waveforms are taken with a oscilloscope.
Voltage var iations may be noted due to normal production tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: AUDIO
L : VIDEO
E: Y
a : CHROMA
r : COMPONENT VIDEO
f: AUX IN (AUDIO)
h : DIGITAL IN
i : AUX IN (VIDEO)
• Abbreviation
AUS: Australian model
SP: Singapore model
TW: Taiwan model
4
W or less unless otherwise
• Circuit Boards Location
S-MASTER board
PLF board
15V-RELAY board
SPK-OUT board
SWITCHING REGULATOR
TX board
TUNER UNIT
COMPONENT boar
VIDEO I/O board
MAIN board
15V-REG board
SA-WSLF10/SS-CTL10/TSL10/TSL11
1212
SA-WSLF10/SS-CTL10/TSL10/TSL11
• Waveform
– MAIN Board –– S-MASTER Board –– VIDEO I/O Board –
IC519 qd (CKOUT (O))
1
IC525 ql (LRCKO)
7
qa
IC305 2
– TX Board –
IC804 tl (OSCO)
wa
IC902 qh (CROUT)
ea
(DVD play mode)
40.6 ns
2 V/DIV, 10 ns/DIV
IC519 qf (BCK (O))
2
163 ns
2 V/DIV, 50 ns/DIV
IC519 qg (LRCK (O))
3
10.4 µs
2 V/DIV, 5 µs/DIV
IC519 w; (XMCK (O))
4
3.8 Vp-p
3.8 Vp-p
3.7 Vp-p
IC525 w; (BCKO)
8
IC526 ek (X2)
9
20.8 µs
2 V/DIV, 10 µs/DIV
326 ns
2 V/DIV, 100 ns/DIV
50 ns
1 V/DIV, 20 ns/DIV
3.6 Vp-p
3.5 Vp-p
1.9 Vp-p
20.4 ns
500 mV/DIV, 10 ns/DIV
IC305 4
qs
20.4 ns
1 V/DIV, 10 ns/DIV
IC108 qf (XFSOOUT)
qd
20.4 ns
1 V/DIV, 10 ns/DIV
IC108 ej (FSOCKO)
qf
1.6 Vp-p
3.8 Vp-p
3.2 Vp-p
40.6 ns
1 V/DIV, 20 ns/DIV
2.8 Vp-p
500 mV/DIV, 20 µs/DIV
IC902 qk (CBOUT)
es
(DVD play mode)
500 mV/DIV, 20 µs/DIV
IC902 w; (CYOUT)
ed
(DVD play mode)
500 mV/DIV, 20 µs/DIV
IC902 wa (YOUT)
ef
(DVD play mode)
H
1.4 Vp-p
1.4 Vp-p
H
2.1 Vp-p
H
2 V/DIV, 50 ns/DIV
IC519 wa (XOUT (O))
5
40.8 ns
2 V/DIV, 20 ns/DIV
IC525 qs (MCLK2)
6
72.2 ns
2 V/DIV, 20 ns/DIV
81 ns
3.4 Vp-p
3.8 Vp-p
3.4Vp-p
20.8 µs
2 V/DIV, 10 µs/DIV
3.8 Vp-p
500 mV/DIV, 20 µs/DIV
IC902 wd (CVBS)
eg
(DVD play mode)
500 mV/DIV, 10 µs/DIV
IC902 wh (COUT)
eh
(DVD play mode)
H
500 mV/DIV, 10 µs/DIV
2.1 Vp-p
H
2.4 Vp-p
H
1.6 Vp-p
SA-WSLF10/SS-CTL10/TSL10/TSL11
1313
SA-WSLF10/SS-CTL10/TSL10/TSL11
5-4. PRINTED WIRING BOARD – MAIN Board (Component Side) –
A
12
(COMPONENT SIDE)
IC512
20
1
11
10
IC511
20
1
11
10
34567
IC513
20
11
1
10
B
C
IC508
5
8
4
1
IC509
4
5
8
1
4
5
8
1
IC507
E
E
IC503
9
16
1
8
1
45
IC510
D
• See page 12 for Circuit Boards Location. : Uses unleaded solder.