Sony SPP-SS950 Service manual

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Page 1

SPP-SS950

SERVICE MANUAL

Ver 1.2 2000. 06 With SUPPLEMENT-1 (9-925-727-81)

SPECIFICATIONS

General

Spread method Direct-Sequence Spread-Spectrum Access method FDMA-TDD Frequency band 902 – 928 MHz Operation channel 20 channels Supplied Accessories AC power adaptor AC-T37 (1) (US model)

AC power adaptor AC-T47 (1) (E model) Telephone line cords (2) (US model) Telephone line cord (1) (E model) Rechargeable battery pack BP-T18 (1) Directories (2 sheets) Wall bracket/stand (1) Screws (2) (E model)

US Model

E Model

Base unit

Power source DC 9V from AC power adaptor Battery charging time Approx. 12 hours Dimensions Approx. 128 × 58 × 208 mm (w/h/d), antenna

excluded Antenna: 165 mm

Mass Approx. 320 g, wall bracket excluded

Design and specifications are subject to change without notice.

Handset

Power source Rechargeable battery pakc BP-T18 Battery life Standby: Approx. 7 days (RING ON mode)

Approx. 3 weeks (BATT SAVE mode)

Talk: Approx. 4 hours

Dimensions Approx. 58 × 177 × 46 mm (w/h/d), antenna

excluded Antenna: 72 mm

Mass Approx. 250 g, battery included

CORDLESS TELEPHONE

MICROFILM

Page 2

TABLE OF CONTENTS

SERVICING NOTES

1. GENERAL

Setting up the phone ........................................................3

Making and receiving calls.............................................. 3

Speed dialing ................................................................... 4

Paging .............................................................................. 4

Mounting the base unit on a wall .................................... 4

2. DISASSEMBLY..........................................................5

3. 900MHz SYSTEM OPERATION

3-1. Access method ................................................................. 7

3-2. Protocol............................................................................7

4. TEST MODE

4-1. Base Unit Test Mode A.................................................... 10

4-2. Base Unit Test Mode B....................................................10

4-3. Handset Test Mode .......................................................... 1 1

5. ELECTRICAL ADJUSTMENTS

5-1. Base Unit Section ............................................................ 12

5-2. Handset Section ...............................................................13

6. DIAGRAMS

6-1. Schematic Diagram – Base Unit Section –...................... 16

6-2. Printed Wiring board – Base Unit Section – ................... 19

6-3. Printed Wiring Board – Handset Section –...................... 21

6-4. Schematic Diagram – Handset Section – ........................ 23

6-5. IC Pin Function Description ............................................26

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or

unsoldering

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY P ARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

7. EXPLODED VIEWS ................................................ 30

8. ELECTRICAL PARTS LIST................................ 32

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SECTION 1

GENERAL

This section is extracted from instruction manual.

– 3 –

Page 4

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Page 5

SECTION 2

DISASSEMBLY

Note: Follow the disassembly procedure in the numerical order given.

REAR CABINET

two screws (BTP 2.6 × 10)

Remove the battery case lid to direction of the arrow A.

Remove the rear cabinet to direction of the arrow B.

claw

two claws

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HAND MAIN BOARD

screw (BTP 2.6 × 8)

connector

HAND MAIN board

four screws (P 3 × 16)

connector

three screws (BTP 2.6 × 8)

LOWER CABINET

two screws (BTP 2.6 × 8)

lower cabinet

two claws

two screws (BTP 2.6 × 8)

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SECTION 3

900MHz SYSTEM OPERATION

3-1. ACCESS METHOD

1. Transfer format & rate

The transfer format & rate of our system is as follows;

Table 3-1. Transfer method

Access method FDMA-TDD Channel number 20 channel Channel spacing 1.2MHz Modulation method DBPSK Baseband transfer rate 960Kbps Spread method Direct Sequence Spread Spectrum Chip rate 12 chips/bit Data transfer rate 80 Kbps

2. Channel Number & Frequencies

RF channels occupy the frequency band 902 – 928 MHz are numbered 1 to 20. RF channel numbers & center frequencies are specified as follows.

Table 3-2. Channel number & Channel frequency

Channle Channel Center Channel Channel Center Number Frequency (MHz) Number Frequency (MHz)

1 903.6 11 915.6 2 904.8 12 916.8 3 906.0 13 918.0 4 907.2 14 919.2 5 908.4 15 920.4 6 909.6 16 921.6 7 910.8 17 922.8 8 912.0 18 824.0 9 913.2 19 925.2

10 914.4 20 926.4

3-2. PROTOCAL

1. General

This system realizes the TX/RX superframe by TDD system. The relation of master/slave dose not decide identification regarding the protocol between BS and HS, but the initiated side is the master and the requested side is the slave when the RF link has been established.

2. Initial acquistition

In order to establish the RF link between BS and HS, both of BS and HS need to have the same system ID. When “power” is applied to this system, the system have to do Initial Acquisition in order to have the same system ID. It si to exchange a parameter when the HS is parked on the BS, as soon as the system do System Parameters Re-initilization.

3. System parameter re-initilization

This System Parameters Re-initilization can realize that the HS is parked on the BS. So after the BS recoginized to be parked the HS, the BS calculates a system parameter, and then it outputs this data from the ARTO port, and then the system establishs the RF link. In order to establish this link, the HS send the A-Frame to the BS after the HS received the system parameter, and then the BS send the A-Frame to the HS. The process of System Parameters Re-initilization is as follows.

Base Station Handset

(PARK)

(Park Detect)(Park Detect)

System Parameters

A-Frame

System ID

confirmed

A-Frame

Fig. 3-1. System Parameters Re-initialization

System ID

confirmed

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4. Stand-by Mode Operation

(1) HS

When the HS is the stand-by mode (sleep mode), the HS do the intermittent operation for power save, because the HS is the battery operation. This process of stand-by mode operation is as follows.

10 sec

Heart-Beat

10 sec

Heart-Beat Heart-Beat

RX RX RX RX RX

1 sec 1 sec

10 sec

1 sec

2 msec

2 msec 10 msec

10 msec

RXTXRX

Heart Beat (Exchange A-Frame for Link confirmation purpose)

Fig. 3-2. Stand-by mode operation (HS)

(2) BS

The BS is supplied the power by AC line. While the BS is the stand-by, the BS is always a wake state. While the BS monitors the current channel, the BS monitors also the other channel at the same time Because if the current channel can not use by some interference, the system needs the clear channel information as a part of system parameter for a channel hop. If the BS can not receive the A-Frame of Heart-beat from the HS, it become “link error”, and the system become error recovery mode.

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5. Link Establishment

Accoding to the following Fig. 3-1, the requested side for link establishment is the master. The system have to exchange the A-Frame for link establishment, and each system ID should be the same ID, and then the system link is established. The protocol and timing chart of link establishment are as follows.

Master Slave

A-Frame

System ID

confirmed

Fig. 3-3. Link Establishment protocol

A-Frame V-Frame V-Frame V-Frame V-Frame

System ID

confirmed

Master

Time Slot

Master TX

Master RX

Slave RX

Slave TX

Trip Delay

TX RX TX RX TX

A' V

Fig. 3-4. Link Establishment Timing Chart

6. State Change/Tarmination

After the RF link between HS and BS was established, a movement of each state (State: ON-Hook, OFF-Hook, P A GE, InterCom, etc) is sent through supervisory bits.

VA'

7. Error Recovery

In case of the following situation, The system becomes “Error Recovery Mode”.

(1) The system failed to move to “Heart-Beat” during “Stand-by

mode, or failed “link establishment”.

(2) The system failed to keep the link.

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SECTION 4

TEST MODE

4-1. BASE UNIT TEST MODE A

[Start-up]

1. Set [DIALMODE] switch to the P (PULSE) side.

2. With [PAGE] button kept pressed, reset the POWER ON (connect the A C adapter plug) and return [DIALMODE] switch from P (PULSE) side to T (TONE) side, then again to the P (PULSE) side.

3. Release the [PAGE] button, and the Test Mode A will start.

4. When the Test Mode A started, the Dial Test is carried out.

5. If [DIALMODE] switch is changed over from P (PULSE) to T (TONE) side, the base set goes in Test Mode Idle A status.

[Dial Test]

1. When the Test Mode started, a line is connected.

2. “0” is output with 10pps (PLUSE) signal.

3. After 2 seconds, “1” “4” “8” “#” are output with DTMF (TONE) signals.

4. Then, the line is placed in the busy status.

[TDD Test Mode on Each Channel]

1. In the Test Mode Idle A status, the statused of respectiv e blocks are as follows: Radio block – TDD mode (Master timing, 1CH) Audio block – Line busy status

2. Each time [PAGE] button is pressed, channels are changed ov er as follows:

4-2. BASE UNIT TEST MODE B

[Start-up]

1. Set [DIALMODE] switch to the T (TONE) side.

2. With [PAGE] button kept pressed, reset the POWER ON (connect the A C adapter plug) and return [DIALMODE] switc h from T (TONE) side to P (PULSE) side, then again to the T (TONE) side.

3. Release the [PAGE] button, and the Test Mode B will start.

4. In the Test Mode B, two kinds of idle statuses can be selected depending on the[DIALMODE] switch setting.

DIAL MODE switch Idle statuses

T (TONE) side Test Mode Idle B-1 *1

P (PULSE) ise Test Mode Idle B-2 *2

*1: Radio block – TDD mode (Master timing)

Audio block – Line busy status

*2: Radio block – Standby status

Audio block – Line open

[Charging Detection Test, ARTO Pin Output Test, and EEPROM Clear]

1. In the Test Mode Idle B-1 status, if charging is detected, a rectangular wave of 2.4 kHz is output from the IC751 Pin #¢ (ART0 pin).

2. At this time, the contents of the EEPROM memory are all clearered.

Test Mode Idle A → 2CH → 3CH → 4CH → . . . → 20CH (1CH)

↑

3. On the channels 2 to 20, the statuses of respective blocks are as follows: Radio block – TDD mode (Slave timing) Audio block – Line busy status

[Charging Detection Test, ARTO Pin Output Test, and EEPROM Clear]

1. In the Test Mode Idle A status, if charging is detected, a rectangular wave of 2.4 kHz is output from the IC751 Pin #¢ (ARTO pin).

2. At this time, the contents of the EEPROM memory are all cleared.

[Terminating Signal Detection Test]

1. In the Test Mode Idle B-2 status, if a terminating signal is

detected, H → L → . . . are output from the IC751 Pin *ª in synchronization with H → L → . . . of terminating signal detected.

[Continuous Receive Mode, Continuous Transmit Mode and TDD Test Mode with High, Mid, and Low Power]

In the T est Mode Idle B-2 status, each time [PAGE] button is pressed, the mode changes as follows:

[PAGE] button

pressing times

1 CONT. RECEIVE (1CH, LNA ON, AGC ON) 2 CONT. RECEIVE (10CH, LNA ON, AGC ON) 3 CONT. RECEIVE (20CH, LNA ON, AGC ON) 4 CONT. TRANSMIT (1CH, High power) 5 CONT. TRANSMIT (1CH, Mid power) 6 CONT. TRANSMIT (1CH, Low pwer) 7 CONT. TRANSMIT (10CH, High pwer) 8 CONT. TRANSMIT (10CH, Mid pwer)

9 CONT. TRANSMIT (10CH, Low pwer) 10 CONT. TRANSMIT (20CH, High pwer) 11 CONT. TRANSMIT (20CH, Mid pwer) 12 CONT. TRANSMIT (20CH, Low pwer) 13 TDD Mode (Master timing, 1CH, High power) 14 TDD Mode (Master timing, 1CH, Mid power) 15 TDD Mode (Master timing, 1CH, Low power) 16 Return to Test Mode Idle B-2

* In the statuses of 1 – 15, the audio block is placed in the line busy status.

Radio Block

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4-3. HAND SET

[Key Matrix Test Mode and LED Test Mode]

[Start-up]

1. With the po wer supplied, press [TALK] [0] [1] keys simultaneously , and the Test Mode will start.

2. Immediately after the Test Mode started, the ringer sounds for 500 msec, and the handset goes in Test Mode Idle status.

3. In the Test Mode Idle status, the statuses of respective blocks are as follows: Radio block – TDD Mode (Master timing, 1CH) Audio block – Line busy status

4. In the Test Mode Idle status, respective test modes can be executed by key input properly.

5. In respective test modes, the Test Mode Idle status is resumed by entering “0 1 #” keys.

6. In any mode, if “0 0 #” keys are entered, the Test Mode is cancelled and normal operating condition is resumed.

[Continuous Receive Mode]

1. Enter “1 1 #” keys, and the Continuous Receive (1CH, LHA ON, AGC ON) mode is activated.

2. Each time [*] key is pressed, channels are changed over as follows: 1CH → 2CH → 3CH → 4CH → . . . → 20CH

↑

[Continuous T ransmit mode]

1. Enter “2 1 #” keys, and the Continuous Transmit (1CH, High power) mode is activated.

2. Enter “2 2 #” key to activate Continuous Transmit (1CH, Mid power) mode.

3. Enter “2 3 #” key to activate Continuous Transmit (1CH, Low power) mode.

4. In respective modes, each time [*] key is pressed, channels are changed over as follows: 1CH → 2CH → 3CH → 4CH → . . . → 20CH

↑

• Key Matrix Test mode

1. Enter “5 1 #” keys, and the Key Matrix Test mode is activated.

2. If pressing the keys in the order shown below, an acknowledge tone is output. Or, if pressing other keys, and error tone will be output.

[TALK] → [OFF] → [FLASH] → [PGM/VOL] → [SPEEDDIAL] → [REDIAL/PAUSE] → [1] → [2] → [3] → [4] → [5] → [6] → [7] → [8] → [9] → [*] → [0] → [#]

3. When an acknowledge tone or error tone is output, the initial status of key matrix test and LED test mode is activated. From this status, the key matrix test and LED test can be executed with the key input.

• LED Test mode

1. Enter “5 4 #” keys, and the LED Test mode is activated.

2. When LED Test mode started, all LEDs turn on immediately.

[TDD Test Mode on Each Channel]

1. Enter “6 1 #” keys, and the TDD mode (Master timing, 1CH, Line busy status) is activated.

2. Each time [*] key is pressed, channels are changed over as follows: 1CH → 2CH → 3CH → 4 CH → . . . → 20CH

↑

[EEPROM Clear]

Enter “7 1 #” keys, and the contents of EEPROM memory are all cleared.

[Loopback T est Mode]

Key input Test mode

31# Code Forward Loopback (L1) 32# ADPCM Forward Loopback (L2) 33# ADPCM → RADIO Loopback 34# ADPCM Reverse Loopback

[TDD Test Mode with High, Mid, and Low Power]

Key input

41#

42#

43#

44#

Radio block

TDD mode (Master timing, 1CH, High power)

TDD mode (Master timing, 1CH, Mid power)

TDD mode (Master timing, 1CH, Low power)

TDD mode (Slave timing)

Audio block

Line busy status

Standby status

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SECTION 5

ELECTRICAL ADJUSTMENTS

5-1. BASE UNIT SECTION

• Make the set in Test mode (see page 10)

1. Checking RX I&Q Output Level

Setting:

oscilloscope

+ –

Procedure:

1. Place the base unit in the Continous Receive mode (1CH, LNA ON, AGC ON).

2. Set the SSG frequency to the frequency on 1CH + 300 kHz, and the RF output level to –95 dBm.

3. Measure the output level of RXIN, RXIP, RXQN and RXQP with a level meter. At this time, confirm with an oscilloscope that a sine wave of 300 kHz is output.

4. confirm that the measured output level is –25.2 to –20.5 dBV. If IC951 was replaced (there is no ID data), the output level is –30.2 to –25.5 dBV.

5. Also, execute steps 1 through 4 for the channels 10 and 20.

level meter

+ –

TP903: RXIP TP904: RXIN TP905: RXQP TP906: RXQN

TP919: GND

ANTENNA TERMINA

3. Checking TX Output

Setting:

peak power meter

+ –

ANTENNA TERMINA

Procedure:

1. Place the base unit in the Continuous Transmit mode (1CH, High power).

2. Measure the ANT OUT output of the RF module in the base unit using a peak power meter.

3. Confirm that the measured output is 17.7 mW (MIN 5.9 mW).

4. Also, execute steps 1 through 4 for the channels 10 and 20.

* For the frequency on each channel, see page 7.

2. Checking TX Center Frequency

Setting :

• short: TP918 ↔ TP919

frequency counter

+ –

ANTENNA TERMINA

Procedure:

1. Short TP918 and TP919 (GND) on the MAIN board in the base unit.

2. Place the base unit in the Continuous Transmit mode (1CH, High power).

3. Measure the ANT OUT frequency of the RF module in the base unit using a frequency counter.

4. Confirm that the measured freuquency is 903.600 MHz ± 27 kHz.

5. Also, execute steps 1 through 4 for the channels 10 and 20.

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5-2. HANDSET SECTION

• Make the set in Test mode (see page 11)

1. Checking RX I&Q Output Level

Setting:

oscilloscope

+ –

Procedure:

1. Place the handset in the Continuous Receive mode (1CH, LNA, AGC ON).

2. Set the SSG frequency to the frequency on 1CH + 300 kHz, and the RF output level to –95 dBm.

3. Measure the output lvel of RXIN, RXIP, RXQN, and RXQP with a level meter. At this time, confirm with an oscilloscope that a sine wave of 300 kHz is output.

4. confirm that the measured output level is –23.3 to –20.9 dBV. If IC502 was replaced (there is no ID data), the output level is –28.3 to –25.9 dBV.

5. Also, execute steps 1 through 4 for the channels 2 – 20.

level meter

+ –

TP520: RXIP TP521: RXIN TP522: RXQP TP523: RXQP

TP553: GND

ANTENNA TERMINA

3. Checking TX output

Setting:

peak power meter

+ –

ANTENNA TERMINA

Procedure:

1. Place the handset in the Continuous Transmit mode (1CH, High power).

2. Measure the ANT OUT output of the RF module in the handset using a peak power meter.

3. Confirm that the measured output is 29 mW (MIN 17.4 mW).

4. Also, execute steps 1 through 4 for the channels 2 – 20.

* for the frequency on each channel, see page 7.

2. Checking TX Center Frequency

Setting:

• short: TP555 ↔ TP553

frequency counter

+ –

ANTENNA TERMINA

Procedure:

1. Short TP555 and TP553 (GND) on the MAIN board in the base unit.

2. Place the handset in the Continuous Transmit mode (1CH, High power).

3. Measure the ANT OUT frequency of the RF module in the handset using a frequency counter.

4. Confirm that the measured freuquency is 903.600 MHz ± 27 kHz.

5. Also, execute steps 1 through 4 for the channels 2 – 20.

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ADJUSTMENT LOCATION:

[BASE MAIN BOARD] (Conductor Side)

ANTENNA TERMINAL SG : Checking RX I&Q Output level frequency counter : Checking TX Center Frequency peak power meter : Checking TX Output

TP918 and TP919 short: Checking TX Center Frequency



TP903: RXIP



TP904: RXIN

 

TP905: RXQP



TP906: RXQN

 

level meter: Checking RX I & Q Output Level

  

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[HAND MAIN BOARD] (Conductor Side)

ANTENNA TERMINAL SG : Checking RX I&Q Output level frequency counter : Checking TX Center Frequency peak power meter : Checking TX Output

TP555 and TP553 short: Checking TX Center Frequency



TP520: RXIP



TP521: RXIN

 

TP522: RXQP



TP523: RXQN

level meter: Checking RX I & Q Output Level

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Page 16

SPP-SS950

• Wavef orm

1 IC751 oj (XTALI)

SECTION 6

DIAGRAMS

4 Vp-

9.6 MHz

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– 17 –

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Page 17

SPP-SS950

– 19 – – 20 –

Page 18

SPP-SS950

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Page 19

• IC Block Diagram IC401, 701 10497-14

REFCNTL

XCLKONCICLK

RESETB

MCLK

DVSS DVDD DATAI

DATAO

25 26 27 28 29 30 31

16 BIT

REGISTOR

CONTROL

REGISTOR

16 BIT

REGISTOR

2 345 6 7 8

NCNCNCNCNC

• Wavef orm

1 IC501 oj (XTALI)

FRAM

SPKPO

SPKMO

MODULATOR

& FILTER

MODULATOR

& FILTER

AGND

1719 182021222324

VREF

LINEO

MICBIAS

SPP-SS950

VOXRNT VOXSND

15 14

AVDD LINE-IN

AVSS

MICIN

RBIAS

9.6 MHz

2.9 Vp-p

– 23 –

– 24 –

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Page 20

6-5. IC PIN FUNCTION DESCRIPTION

• BASE MAIN BAORD IC751 C7302-11 (RDSSS9M-ASIC)

Pin No. Pin Name I/O Function

1 KEYPADB5 — Not used

2-4 D0-2 — Not used

5 D3 I DIAL MAKE rate selection input H: 40%, L: 33% 6 D4 I Model selection input H: SPP-SS950

7-9 D5-7 — Not used

10-14 KEY PADI0-4 — Not used

15 KEYPADI5 I PAGE key input 16 VSSC — Ground 17 VDDC — Power supply (+5 V) 18 VDDP — Power supplu (+5 V)

19 VSSC — Ground 20, 21 OSC1, 2 — Not used 22, 23 KEYPADB3, 4 — Not used

24 CDCDATAI I CODEC DATA input

25 CDCDATAO I/O CODEC DATA output

26 CDCMCLK O CODEC master CLK output

27 RESETO O Reset signal output

28 CDCICLK O CODEC interface CLK output

29 VDDP — Power supply (+5 V)

30 VSSP — Ground

31 KEYPADB2 O PAGE key output

32 CDCFRAME O CODEC FRAM output

33 ARTI I ART input

34 ARTO O ART output 35, 36 KEYPADB1, 0 — Not used

37 GPIOB7 O RELAY ON/OFF output H: active

38 VDDP — Power supply (+5 V)

39 LCDCS — Not used

40 VDDC — Power supply (+5 V)

41 VSSC — Ground

42 TEST I Test mode select input L: active

43 LNAATN O LNA gain select output H: low gain

44 RXEN O RX enable output H: active

45 VDDA — Power supply (+5 V)

46 VSSA — Ground

47 VDDA — Power supply (+5V)

48 VSSA — Ground

49 TXDATA O TX DATA output

50 VRP O Analog standard voltage output

51 RXIP I RX input (I positive)

52 RXIN I RX input (I negative)

53 RXQP I RX input (Q positive)

54 RXQN I RX input (Q negative)

55 NC — Not used

56 IBIAS I Analog bias input

57 AGND O Analog ground

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Page 21

Pin No. Pin Name I/O Function

58 BATTERY I Battery voltage input (Pull up) 59 AFC — Not used 60 AGC O AGC control output 61 CALLER-ID — Not used 62 PARKP I Charging detection input L: active 63 VDDC — Power supply (+5 V) 64 VSSP — Ground 65 SYNDATA O Synthesizer DATA output 66

SYNTH5MCLK

67, 68 LED3, 4 — Not used

69 LCDRW — Not used 70 LCDRS — Not used 71 SYNCLK O Synthesizer CLK output 72 SYNSTB O Synthesizer strobe output 73 VDDP — Power supply (+5 V) 74 VSSP — Ground 75 SYNEN O Synthesizer power control output H: active 76 NVDI I/O EEPROM SDA input/output 77 NVDO O EEPROM SCL output 78 LED2 — Not used 79 TXEN O TX enable output H: active 80 TXPWRI O PA power select output 81 GPIOB6 I Terminating signal detection input L: active 82 TXRXSEL O TX/RX select output 83 RING OFF — Not used 84 BASEP I HAND/BASE select input H: HAND, L: BASE 85 TXPWRO O PA power select output 86 GPIOB5 — Not used 87 NVCS — Not used 88 AUDPWRP I DTMF/PULSE select switch input H: DTMF, L: PULSE 89 LED1 — Not used 90 VDDC — Power supply (+5 V) 91 VSSC — Ground 92 LCDPWRP — Not used 93 SLEEP — Not used 94 GPIOB4 — Not used 95 NVCLK O Reception muting during dial transmission. L: during dial transmission. 96 RESETI I Power-on reset input. L: active 97 XTALI I 9.6 MHz OSC input 98 XTALO O 9.6 MHz OSC output 99 VDDP — Power supply (+5 V)

100 VSSP — Ground

O Synthesizer REF OSC output

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• HAND MAIN BOARD IC501 C7302-11 (RDSSS9M-ASIC)

Pin No. Pin Name I/O Function

1 KEYPADB5 — Not used

2-5 D0-3 — Not used

6 D4 I Model selection input H: SPP-SS950

7-9 D5-7 — Not used

10-15 KEY PADI0-5 I Key matrix scan input L: KEY ON

16 VSSC — Ground

17 VDDC — Power supply (+3.6 V)

18 VDDP — Power supplu (+3.6 V)

19 VSSP — Ground

20 OSCI — Not used

21 OSCO — Not used

22 KEYPADB3 O Key matrix scan output

23 KEYPADB4 — Not used

24 CDCDATAI I CODEC DATA input

25 CDCDATAO I/O CODEC DATA output

26 CDCMCLK O CODEC master CLK output

27 RESETO O P ower-on reset output

28 CDCICLK O CODEC interface CLK output

29 VDDP — Power supply (+3.6 V)

30 VSSP — Ground

31 KEYPADB2 O Key matrix scan output

32 CDCFRAME O CODEC FRAM output

33 ARTI I ART input

34 ARTO — Not used 35, 36 KEYPADB1, 0 O Key matrix scan output

37 GPIOB — Not used

38 VDDP — Power supply (+3.6 V)

39 LCDCS — Not used

40 VDDC — Power supply (+3.6 V)

41 VSSC — Ground

42 TEST I Test mode select input L: active

43 LNAATN O LNA gain select output H: low gain

44 RXEN O RX enable output H: active

45 VDDA — Power supply (+3.6 V)

46 VSSA — Ground

47 VDDA — Power supply (+3.6 V)

48 VSSA — Ground

49 TXDATA O TX DATA output

50 VRP O Analog standard voltage output

51 RXIP I RX input (I positive)

52 RXIN I RX input (I negative)

53 RXQP I RX input (Q positive)

54 RXQN I RX input (Q negative)

55 NC — Not used

56 IBIAS I Analog bias input

57 AGND O Analog ground

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Page 23

Pin No. Pin Name I/O Function

58 BATTERY I Battery voltage input (Pull up) 59 AFC — Not used 60 AGC O AGC control output 61 CALLER-ID — Not used 62 PARKP I Charging detection input L: active 63 VDDC — Power supply (+3.6 V) 64 VSSP — Ground 65 SYNDATA O Synthesizer DATA output 66

SYNTH5MCLK 67 LCDRS — Not used 68 LED4 — Not used

69, 70 JOG (A), (B) — Not used

71 SYNCLK O Synthesizer CLK output 72 SYNSTB O Synthesizer strobe output 73 VDDP — Power supply (+3.6 V) 74 VSSP — Ground 75 SYNEN O Synthesizer power control output H: active 76 NVDI I/O EEPROM SDA input/output 77 NVDO O EEPROM SCL output 78 LCDRW — Not used 79 TXEN O TX enable output H: active 80 TXPWRI O PA power select output 81 JOG (SW) — Not used 82 TXRXSEL O TX/RX select output 83 RING OFF I RING ON/BATT. SAVE input H: RING ON, L: BATT SAVE 84 BASEP I HAND/BASE select input H: HAND, L: BASE 85 TXPWRO O PA power select output 86 GPIOB5 — Not used 87 NVCS — Not used 88 GPIOA7 — Not used 89 LED1 O TAKE LED output L: LED ON 90 VDDC — Power supply (+3.6 V) 91 VSSC — Ground 92 LCDPWRP — Not used 93 SLEEP — Not used 94 GPIOB4 — Not used 95 NVCLK — Not used 96 RESETI I Power-on reset input L: active 97 XTALI I 96 MHz OSC input 98 XTALO O 96 MHz OSC output 99 VDDP — Power supply (+3.6 V)

100 VSSP — Ground

O Synthesizer REF OSC output

– 29 –

Page 24

SECTION 7

EXPLODED VIEWS

Ver 1.2 2000. 06

NOTE:

• -XX and -X mean standardized parts, so they may have some difference from the original one.

• Color Indication of Appearance Parts Example: KNOB, BALANCE (WHITE) . . . (RED)

↑↑

Parts Color Cabinet's Color

(1) HANDSET SECTION

SP401

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• The mechanical parts with no reference number in the exploded views are not supplied.

• Hardware (# mark) list and accessories and packing materials are given in the last of the electrical parts list.

ANT501

Ref. No. Part No. Description Remark

1 3-014-528-01 CABINET (FRONT) 2 3-372-738-01 GASKET (RECEIVER) (TWN) 3 3-012-365-01 HOLDER (SP) 4 3-012-363-01 CABINET (REAR) 6 3-954-192-01 LABEL (A), NI-CD RECYCLE

Ref. No. Part No. Description Remark

9 3-012-366-01 TERMINAL (HAND), CHARGE

* 10 3-935-519-11 CUSHION (BUZZER)

11 3-012-364-01 LID, BATTERY CASE 12 3-935-520-01 CUSHION (BATTERY) ANT501 1-501-933-11 ANTENNA

* 7 A-3622-106-A HAND MAIN BOARD, COMPLETE

8 1-771-137-11 SWITCH, RUBBER KEY

SP401 1-504-829-11 SPEAKER (28MM)

– 30 –

Page 25

(2) BASESET SECTION

ANT901

Ref. No. Part No. Description Remark

51 X-3374-536-1 CABINET (LOWER) ASSY

* 52 A-3622-107-A BASE MAIN BOARD, COMPLETE (US) * 52 A-3622-108-A BASE MAIN BOARD, COMPLETE (E)

53 3-012-378-01 TERMINAL (BASE), CHARGE 54 3-012-376-01 LENS (CHARGE)

55 3-012-373-01 BUTTON (PAGE)

Ref. No. Part No. Description Remark

56 3-012-371-11 CABINET (UPPER) 57 3-012-374-01 HOLDER (HANDSET) 58 3-012-375-01 HOLDER (ANTENNA) 59 3-007-173-01 LABEL (TERMINAL CAUTION) (/S) ANT901 1-501-932-11 ANTENNA

– 31 –

Page 26

BASE MAIN

SECTION 8

ELECTRICAL PARTS LIST

NOTE:

• Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.

• -XX and -X mean standardized parts, so they may have some difference from the original one.

• RESISTORS All resistors are in ohms. METAL: Metal-film resistor. METAL OXIDE: Metal oxide-film resistor. F: nonflammable

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when order-

Ref. No. Part No. Description Remark

* A-3622-107-A BASE MAIN BOARD, COMPLETE (US) * A-3622-108-A BASE MAIN BOARD, COMPLETE (E)

**************************

7-685-134-19 SCREW +BTP 2.6X8 TYPE2 N-S 7-685-646-79 SCREW +BVTP 3X8 TYPE2 N-S (E)

< CAPACITOR >

C101 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V

! C102 1-162-117-00 CERAMIC 100PF 10% 500V ! C104 1-162-117-00 CERAMIC 100PF 10% 500V ! C105 1-136-193-11 FILM 0.47uF 10% 250V

C109 1-163-251-11 CERAMIC CHIP 100PF 5% 50V

C111 1-115-868-11 ELECT 0.22uF 20% 50V C112 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C113 1-107-823-11 CERAMIC CHIP 0.47uF 10% 16V C115 1-126-960-11 ELECT 1uF 20% 50V C131 1-163-989-11 CERAMIC CHIP 0.033uF 10% 25V

C137 1-164-182-11 CERAMIC CHIP 0.0033uF 10% 50V C138 1-126-963-11 ELECT 4.7uF 20% 50V C191 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C192 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C193 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C194 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C195 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C196 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C197 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V C198 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C199 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C601 1-163-033-00 CERAMIC CHIP 0.022uF 50V C602 1-163-033-00 CERAMIC CHIP 0.022uF 50V C605 1-163-038-00 CERAMIC CHIP 0.1uF 25V C606 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V

C607 1-126-916-11 ELECT 1000uF 20% 6.3V C608 1-164-505-11 CERAMIC CHIP 2.2uF 16V C609 1-126-963-11 ELECT 4.7uF 20% 50V C650 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C651 1-163-038-00 CERAMIC CHIP 0.1uF 25V

C701 1-163-031-11 CERAMIC CHIP 0.01uF 50V C702 1-164-222-11 CERAMIC CHIP 0.22uF 25V C703 1-163-031-11 CERAMIC CHIP 0.01uF 50V C704 1-126-925-11 ELECT 470uF 20% 10V C705 1-164-222-11 CERAMIC CHIP 0.22uF 25V

ing these items.

• SEMICONDUCTORS In each case, u: µ, for example: uA. . : µA. . uPA. . : µPA. . uPB. . : µPB. . uPC. . : µPC. . uPD. . : µPD. .

• CAPACITORS uF: µF

• COILS uH: µH

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

When indicating parts by reference number, please include the board.

Ref. No. Part No. Description Remark

C706 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C707 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C751 1-163-031-11 CERAMIC CHIP 0.01uF 50V C754 1-163-031-11 CERAMIC CHIP 0.01uF 50V C755 1-126-964-11 ELECT 10uF 20% 50V

C756 1-163-031-11 CERAMIC CHIP 0.01uF 50V C757 1-164-222-11 CERAMIC CHIP 0.22uF 25V C758 1-164-222-11 CERAMIC CHIP 0.22uF 25V C759 1-163-031-11 CERAMIC CHIP 0.01uF 50V C760 1-163-031-11 CERAMIC CHIP 0.01uF 50V

C766 1-163-031-11 CERAMIC CHIP 0.01uF 50V C767 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C768 1-163-237-11 CERAMIC CHIP 27PF 5% 50V C790 1-102-514-11 CERAMIC CHIP 22PF 5% 50V C791 1-102-514-11 CERAMIC CHIP 22PF 5% 50V

C901 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C902 1-163-031-11 CERAMIC CHIP 0.01uF 50V C903 1-163-031-11 CERAMIC CHIP 0.01uF 50V C904 1-163-031-11 CERAMIC CHIP 0.01uF 50V C951 1-163-031-11 CERAMIC CHIP 0.01uF 50V

< CONNECTOR >

* CN651 1-506-985-11 PIN, CONNECTOR (PC BOARD) 3P * CN901 1-779-773-11 PIN, CONNECTOR (PC BOARD) * CN902 1-779-774-11 PIN, CONNECTOR (PC BOARD)

< DIODE >

D100 8-719-991-33 DIODE 1SS133T-77 D101 8-719-991-33 DIODE 1SS133T-77

! D102 8-719-109-89 DIODE RD5.6ESB2 ! D103 8-719-109-89 DIODE RD5.6ESB2 ! D104 8-719-991-33 DIODE 1SS133T-77

D105 8-719-157-36 DIODE RD6.8M-B D108 8-719-914-42 DIODE DA204K D109 8-719-914-42 DIODE DA204K D110 8-719-914-42 DIODE DA204K D652 8-719-991-33 DIODE 1SS133T-77

D653 8-719-991-33 DIODE 1SS133T-77 D654 8-719-050-05 DIODE SLR-325VRT31 (CHARGE)

< IC >

IC101 8-759-909-71 IC BA4558F

– 32 –

Page 27

BASE MAIN

Ref. No. Part No. Description Remark

IC601 8-759-482-72 IC uPC29M05HF IC602 8-759-519-46 IC S-80730AN-DT-S IC701 8-759-475-69 IC 10497-14 IC751 8-759-475-70 IC C7302-11

IC951 8-759-487-03 IC S-24C01AFJA-TB-01

< JACK >

J601 1-778-380-11 JACK,DC(POLARITY UNIFIED TYPE)(DC IN 9V)

< JUMPER RESISTOR >

JR11 1-216-296-00 CONDUCTOR, CHIP (3216) JR12 1-216-296-00 CONDUCTOR, CHIP (3216) JR13 1-216-296-00 CONDUCTOR, CHIP (3216) JR14 1-216-296-00 CONDUCTOR, CHIP (3216) JR15 1-216-296-00 CONDUCTOR, CHIP (3216)

JR16 1-216-296-00 CONDUCTOR, CHIP (3216) JR17 1-216-296-00 CONDUCTOR, CHIP (3216) JR18 1-216-296-00 CONDUCTOR, CHIP (3216) JR19 1-216-296-00 CONDUCTOR, CHIP (3216) JR20 1-216-296-00 CONDUCTOR, CHIP (3216)

JR21 1-216-296-00 CONDUCTOR, CHIP (3216) JR24 1-216-296-00 CONDUCTOR, CHIP (3216) JR25 1-216-296-00 CONDUCTOR, CHIP (3216) JR26 1-216-296-00 CONDUCTOR, CHIP (3216) JR27 1-216-296-00 CONDUCTOR, CHIP (3216)

JR28 1-216-296-00 CONDUCTOR, CHIP (3216) JR29 1-216-295-00 CONDUCTOR, CHIP (2012)

< COIL >

L101 1-410-470-11 INDUCTOR 10uH L102 1-410-470-11 INDUCTOR 10uH L601 1-410-468-11 INDUCTOR 6.8uH L602 1-410-468-11 INDUCTOR 6.8uH L750 1-412-945-11 INDUCTOR 3.3uH

< MODULAR JACK >

! MJ101 1-766-250-11 JACK, MODULAR (2C) 6P (LINE)

< PHOTO COUPLER >

! PH101 8-719-156-73 PHOTO COUPLER PS2501-1LA

< TRANSISTOR >

Q101 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q102 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q103 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q171 8-729-016-90 TRANSISTOR 2SA1179R-M5M6-TB Q651 8-729-922-26 TRANSISTOR 2SD1758F5-Q

Q652 8-729-026-49 TRANSISTOR 2SA1037AK-T146-R Q653 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q750 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q751 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q952 8-729-120-28 TRANSISTOR 2SC1623-L5L6

< RESISTOR >

R9 1-216-041-00 METAL CHIP 470 5% 1/10W

! R101 1-215-864-00 METAL OXIDE 150 5% 1W F ! R103 1-215-877-11 METAL OXIDE 22K 5% 1W F

Ref. No. Part No. Description Remark

R104 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R105 1-216-085-00 METAL CHIP 33K 5% 1/10W

R107 1-216-021-00 METAL CHIP 68 5% 1/10W R108 1-216-053-00 METAL CHIP 1.5K 5% 1/10W R109 1-216-049-11 METAL GLAZE 1K 5% 1/10W R110 1-216-073-00 METAL CHIP 10K 5% 1/10W R111 1-216-073-00 METAL CHIP 10K 5% 1/10W

R112 1-216-097-00 METAL GLAZE 100K 5% 1/10W R115 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R121 1-216-025-00 METAL GLAZE 100 5% 1/10W

! R125 1-215-869-11 METAL OXIDE 1K 5% 1W F

R126 1-216-065-00 METAL CHIP 4.7K 5% 1/10W

R127 1-216-089-00 METAL GLAZE 47K 5% 1/10W R128 1-216-097-00 METAL GLAZE 100K 5% 1/10W R129 1-216-081-00 METAL CHIP 22K 5% 1/10W R130 1-216-025-00 METAL CHIP 100 5% 1/10W R132 1-216-065-00 METAL CHIP 4.7K 5% 1/10W

R134 1-216-065-00 METAL CHIP 4.7K 5% 1/10W R135 1-216-101-00 METAL CHIP 150K 5% 1/10W R137 1-216-101-00 METAL CHIP 150K 5% 1/10W R139 1-216-073-00 METAL CHIP 10K 5% 1/10W R141 1-216-025-00 METAL CHIP 100 5% 1/10W

R156 1-216-049-11 METAL GLAZE 1K 5% 1/10W R173 1-216-073-00 METAL CHIP 10K 5% 1/10W R175 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R190 1-216-025-00 METAL GLAZE 100 5% 1/10W R191 1-216-025-00 METAL GLAZE 100 5% 1/10W

R601 1-216-069-00 METAL CHIP 6.8K 5% 1/10W R651 1-249-411-11 CARBON 330 5% 1/4W R653 1-249-393-11 CARBON 10 5% 1/4W F R654 1-216-105-00 METAL GLAZE 220K 5% 1/10W R655 1-216-101-00 METAL CHIP 150K 5% 1/10W

R656 1-216-097-00 METAL GLAZE 100K 5% 1/10W R657 1-216-041-00 METAL CHIP 470 5% 1/10W R658 1-216-089-00 METAL GLAZE 47K 5% 1/10W R659 1-216-101-00 METAL CHIP 150K 5% 1/10W R701 1-414-981-11 INDUCTOR CHIP 680nH

R702 1-218-754-11 METAL CHIP 120K 0.50% 1/10W R703 1-216-009-00 METAL CHIP 22 5% 1/10W R750 1-216-813-11 METAL CHIP 220 5% 1/16W R751 1-216-073-00 METAL CHIP 10K 5% 1/10W R752 1-216-073-00 METAL CHIP 10K 5% 1/10W (E)

R754 1-216-045-00 METAL CHIP 680 5% 1/10W R755 1-216-073-00 METAL CHIP 10K 5% 1/10W R759 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R760 1-216-073-00 METAL CHIP 10K 5% 1/10W R761 1-216-041-00 METAL CHIP 470 5% 1/10W

R762 1-216-073-00 METAL CHIP 10K 5% 1/10W R764 1-216-041-00 METAL CHIP 470 5% 1/10W R765 1-216-001-00 METAL CHIP 10 5% 1/10W R766 1-218-754-11 METAL CHIP 120K 0.50% 1/10W R767 1-216-097-00 METAL GLAZE 100K 5% 1/10W

R768 1-216-049-11 METAL GLAZE 1K 5% 1/10W R769 1-216-065-00 METAL CHIP 4.7K 5% 1/10W R771 1-216-121-00 METAL GLAZE 1M 5% 1/10W R772 1-216-025-00 METAL GLAZE 100 5% 1/10W R781 1-216-041-00 METAL CHIP 470 5% 1/10W

– 33 –

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

Page 28

BASE MAIN HAND MAIN

Ref. No. Part No. Description Remark

R782 1-216-041-00 METAL CHIP 470 5% 1/10W R787 1-216-041-00 METAL CHIP 470 5% 1/10W R790 1-216-041-00 METAL CHIP 470 5% 1/10W R792 1-216-041-00 METAL CHIP 470 5% 1/10W R793 1-216-041-00 METAL CHIP 470 5% 1/10W

R794 1-216-041-00 METAL CHIP 470 5% 1/10W R798 1-216-049-11 METAL GLAZE 1K 5% 1/10W R800 1-216-041-00 METAL CHIP 470 5% 1/10W R801 1-216-041-00 METAL CHIP 470 5% 1/10W R802 1-216-041-00 METAL CHIP 470 5% 1/10W

R803 1-216-041-00 METAL CHIP 470 5% 1/10W R804 1-216-097-00 METAL GLAZE 100K 5% 1/10W R902 1-216-041-00 METAL CHIP 470 5% 1/10W R913 1-216-041-00 METAL CHIP 470 5% 1/10W R914 1-216-041-00 METAL CHIP 470 5% 1/10W

R954 1-216-073-00 METAL CHIP 10K 5% 1/10W R955 1-216-089-00 METAL GLAZE 47K 5% 1/10W R956 1-216-089-00 METAL GLAZE 47K 5% 1/10W R957 1-216-073-00 METAL CHIP 10K 5% 1/10W

< RF UNIT >

RFU901 1-475-242-11 RF UNIT

< RELAY >

! RY101 1-755-150-11 RELAY

< SPARK GAP >

Ref. No. Part No. Description Remark

C403 1-163-031-11 CERAMIC CHIP 0.01uF 50V C404 1-164-222-11 CERAMIC CHIP 0.22uF 25V

C405 1-163-023-00 CERAMIC CHIP 0.015uF 5% 50V C406 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 50V C407 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C409 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C410 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C411 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C412 1-165-320-11 CERAMIC CHIP 0.47uF 10% 16V C413 1-164-222-11 CERAMIC CHIP 0.22uF 25V C414 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C415 1-163-243-11 CERAMIC CHIP 47PF 5% 50V

C416 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C417 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C420 1-102-514-11 CERAMIC CHIP 22PF 5% 50V C421 1-102-514-11 CERAMIC CHIP 22PF 5% 50V C422 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C423 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C424 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C425 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C501 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C502 1-163-237-11 CERAMIC CHIP 27PF 5% 50V

C505 1-163-031-11 CERAMIC CHIP 0.01uF 50V C506 1-163-031-11 CERAMIC CHIP 0.01uF 50V C507 1-162-974-11 CERAMIC CHIP 0.01uF 50V C508 1-163-031-11 CERAMIC CHIP 0.01uF 50V C509 1-124-779-00 ELECT CHIP 10uF 20% 16V

SG101 1-517-224-11 GAP, DISCHARGE (E)

< SWITCH >

SW951 1-692-991-11 SWITCH, SLIDE (DIAL MODE) SW952 1-572-381-21 SWITCH, KEY BOARD (PAGE)

< TRANSFORMER >

! T101 1-429-648-11 TRANSFORMER, LINE

< VIBRATOR >

X752 1-767-566-21 VIBRATOR, CRYSTAL (9.6MHz)

************************************************************

* A-3622-106-A HAND MAIN BOARD, COMPLETE

**************************

7-685-134-19 SCREW +BTP 2.6X8 TYPE2 N-S

< BUZZER >

BZ401 1-544-603-11 BUZZER

< CAPACITOR >

C301 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C302 1-163-031-11 CERAMIC CHIP 0.01uF 50V C303 1-163-031-11 CERAMIC CHIP 0.01uF 50V C305 1-163-031-11 CERAMIC CHIP 0.01uF 50V C307 1-163-031-11 CERAMIC CHIP 0.01uF 50V

C308 1-164-005-11 CERAMIC CHIP 0.47uF 25V C401 1-163-031-11 CERAMIC CHIP 0.01uF 50V C402 1-126-206-11 ELECT CHIP 100uF 20% 6.3V

C510 1-163-031-11 CERAMIC CHIP 0.01uF 50V C511 1-164-222-11 CERAMIC CHIP 0.22uF 25V C512 1-164-222-11 CERAMIC CHIP 0.22uF 25V C513 1-163-031-11 CERAMIC CHIP 0.01uF 50V C514 1-162-919-11 CERAMIC CHIP 22PF 5% 50V

C516 1-163-251-11 CERAMIC CHIP 100PF 5% 50V C523 1-163-031-11 CERAMIC CHIP 0.01uF 50V C585 1-163-031-11 CERAMIC CHIP 0.01uF 50V

< CONNECTOR >

CN301 1-766-180-11 PIN, CONNECTOR (PC BOARD) 2P

* CN302 1-506-985-11 PIN, CONNECTOR (PC BOARD) 3P * CN401 1-506-984-11 PIN, CONNECTOR (PC BOARD) 2P * CN501 1-779-773-11 PIN, CONNECTOR (PC BOARD) * CN502 1-779-774-11 PIN, CONNECTOR (PC BOARD)

< DIODE >

D301 8-719-938-75 DIODE SB05-05CP D302 8-719-938-75 DIODE SB05-05CP D303 8-719-938-75 DIODE SB05-05CP D304 8-719-938-75 DIODE SB05-05CP D305 8-719-914-43 DIODE DAN202K

D306 8-719-066-61 DIODE RD5.6P-T1 D308 8-719-105-91 DIODE RD5.6M-B2 D401 8-719-914-43 DIODE DAN202K D402 8-719-914-43 DIODE DAN202K D404 8-719-105-91 DIODE RD5.6M-B2

D501 8-719-051-89 DIODE SML-010VT-T87 (TALK/BATT LOW) D505 8-719-914-42 DIODE DA204K (TALK)

– 34 –

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

Page 29

HAND MAIN

Ref. No. Part No. Description Remark

< IC >

IC301 8-759-519-46 IC S-80730AN-DT-S IC401 8-759-475-69 IC 10497-14 IC501 8-759-475-70 IC C7302-11 IC502 8-759-487-02 IC S-24C02AFJA-TB-01

< JUMPER RESISTOR >

JR1 1-216-296-00 CONDUCTOR, CHIP (3216) JR2 1-216-296-00 CONDUCTOR, CHIP (3216) JR3 1-216-296-00 CONDUCTOR, CHIP (3216) JR4 1-216-296-00 CONDUCTOR, CHIP (3216) JR7 1-216-295-00 CONDUCTOR, CHIP (2012)

JR8 1-216-295-00 CONDUCTOR, CHIP (2012) JR11 1-216-295-00 CONDUCTOR, CHIP (2012) JR12 1-216-295-00 CONDUCTOR, CHIP (2012) JR13 1-216-296-00 CONDUCTOR, CHIP (3216) JR14 1-216-296-00 CONDUCTOR, CHIP (3216)

JR15 1-216-296-00 CONDUCTOR, CHIP (3216) JR18 1-216-296-00 CONDUCTOR, CHIP (3216) JR20 1-216-296-00 CONDUCTOR, CHIP (3216) JR21 1-216-029-00 METAL CHIP 150 5% 1/10W JR22 1-216-295-00 CONDUCTOR, CHIP (2012)

JR23 1-216-295-00 CONDUCTOR, CHIP (2012)

Ref. No. Part No. Description Remark

R413 1-216-025-00 METAL GLAZE 100 5% 1/10W R414 1-216-025-00 METAL GLAZE 100 5% 1/10W R415 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R501 1-216-121-00 METAL GLAZE 1M 5% 1/10W

R502 1-216-025-00 METAL GLAZE 100 5% 1/10W R506 1-216-001-00 METAL CHIP 10 5% 1/10W R507 1-218-754-11 METAL CHIP 120K 0.50% 1/10W R508 1-218-754-11 METAL CHIP 120K 0.50% 1/10W R509 1-218-756-11 METAL CHIP 150K 0.50% 1/10W

R510 1-216-073-00 METAL CHIP 10K 5% 1/10W R511 1-216-121-00 METAL GLAZE 1M 5% 1/10W R512 1-216-049-11 METAL GLAZE 1K 5% 1/10W R513 1-216-821-11 METAL CHIP 1K 5% 1/16W R527 1-216-073-00 METAL CHIP 10K 5% 1/10W

R528 1-216-097-00 METAL GLAZE 100K 5% 1/10W R529 1-216-073-00 METAL CHIP 10K 5% 1/10W R534 1-216-295-00 CONDUCTOR, CHIP (2012) R539 1-216-295-00 CONDUCTOR, CHIP (2012) R541 1-216-295-00 CONDUCTOR, CHIP (2012)

R542 1-216-296-00 CONDUCTOR, CHIP (3216) R544 1-216-817-11 METAL CHIP 470 5% 1/16W R545 1-216-817-11 METAL CHIP 470 5% 1/16W R546 1-216-821-11 METAL CHIP 1K 5% 1/16W R547 1-216-864-11 METAL CHIP 0 5% 1/16W

< COIL >

L501 1-410-198-51 INDUCTOR CHIP 3.3uH

< MICROPHONE >

MIC401 1-542-118-11 MICROPHONE, ELECTRET CONDENSER

< TRANSISTOR >

Q301 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q302 8-729-026-49 TRANSISTOR 2SA1037AK-T146-R Q303 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q502 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q503 8-729-026-49 TRANSISTOR 2SA1037AK-T146-R

Q504 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q505 8-729-120-28 TRANSISTOR 2SC1623-L5L6

< RESISTOR >

R301 1-216-093-00 METAL CHIP 68K 5% 1/10W R302 1-216-085-00 METAL CHIP 33K 5% 1/10W R303 1-216-097-00 METAL GLAZE 100K 5% 1/10W R304 1-216-069-00 METAL CHIP 6.8K 5% 1/10W R305 1-216-073-00 METAL CHIP 10K 5% 1/10W

R308 1-216-089-00 METAL GLAZE 47K 5% 1/10W R309 1-216-073-00 METAL CHIP 10K 5% 1/10W R310 1-216-049-11 METAL GLAZE 1K 5% 1/10W R311 1-216-097-00 METAL GLAZE 100K 5% 1/10W R312 1-216-089-00 METAL GLAZE 47K 5% 1/10W

R548 1-216-295-00 CONDUCTOR, CHIP (2012) R549 1-216-295-00 CONDUCTOR, CHIP (2012) R550 1-216-295-00 CONDUCTOR, CHIP (2012) R551 1-216-041-00 METAL CHIP 470 5% 1/10W R552 1-216-041-00 METAL CHIP 470 5% 1/10W

R554 1-216-817-11 METAL CHIP 470 5% 1/16W R555 1-216-817-11 METAL CHIP 470 5% 1/16W R556 1-216-817-11 METAL CHIP 470 5% 1/16W R557 1-216-041-00 METAL CHIP 470 5% 1/10W R558 1-216-041-00 METAL CHIP 470 5% 1/10W

R560 1-216-041-00 METAL CHIP 470 5% 1/10W R561 1-216-295-00 CONDUCTOR, CHIP (2012) R570 1-216-073-00 METAL CHIP 10K 5% 1/10W R573 1-216-073-00 METAL CHIP 10K 5% 1/10W R583 1-216-045-00 METAL CHIP 680 5% 1/10W

R584 1-216-833-11 METAL CHIP 10K 5% 1/16W R585 1-216-813-11 METAL CHIP 220 5% 1/16W R586 1-216-073-00 METAL CHIP 10K 5% 1/10W R590 1-216-041-00 METAL CHIP 470 5% 1/10W R591 1-216-041-00 METAL CHIP 470 5% 1/10W

< RF UNIT >

RFU501 1-475-242-21 RF UNIT

< SWITCH >

S501 1-692-991-11 SWITCH, SLIDE (RING ON/BATT SAVE) S502 1-570-909-11 SWITCH, TACTIL (REFLOW TYPE) (TALK)

R401 1-216-017-00 METAL GLAZE 47 5% 1/10W R402 1-218-754-11 METAL CHIP 120K 0.50% 1/10W R403 1-216-053-00 METAL CHIP 1.5K 5% 1/10W R405 1-414-481-11 INDUCTOR CHIP 68nH R409 1-216-029-00 METAL CHIP 150 5% 1/10W

R410 1-216-097-00 METAL GLAZE 100K 5% 1/10W

< VIBRATOR >

X501 1-767-566-21 VIBRATOR, CRYSTAL (9.6MHz)

************************************************************

– 35 –

Page 30

SPP-SS950

Ref. No. Part No. Description Remark

MISCELLANEOUS

***************

8 1-771-137-11 SWITCH, RUBBER KEY ANT501 1-501-933-11 ANTENNA ANT901 1-501-932-11 ANTENNA SP401 1-504-829-11 SPEAKER (28MM)

************************************************************

**************

HARDWARE LIST

**************

#1 7-685-650-79 SCREW +P 3X16 TYPE2 NON-SLIT #2 7-685-135-19 SCREW +B 2.6X10 #3 7-685-134-19 SCREW +BTP 2.6X8 TYPE2 N-S

************************************************************

ACCESSORIES & PACKING MATERIALS

********************************

! 1-467-081-21 ADAPTOR, AC (AC-T37) (US) ! 1-467-498-21 ADAPTOR, AC (AC-T47) (E)

1-528-489-11 BATTERY PACK (BP-T18) 1-696-453-21 CORD (WITH MODULAR PLUG) (LINE) (22cm) 1-696-454-11 CORD (WITH MODULAR PLUG) (LINE) (2m15cm)

3-012-379-01 CASE, WALL HOOK 3-860-219-11 MANUAL, INSTRUCTION

3-860-219-21 MANUAL, INSTRUCTION

3-860-219-31 MANUAL, INSTRUCTION

3-936-680-01 LABEL (ADRESS)

X-3368-367-1 SCREW ASSY (E)

(ENGLISH, SPANISH) (US)

(ENGLISH, SPANISH) (E)

(RUSSIAN, CHINESE) (E)

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

9-925-727-11

Sony Corporation

Personal & Mobile Communication Company

– 36 –

97H057027-1

Published by Quality Assurance Dept.

Page 31

SERVICE MANUAL

1998. 09

SUPPLEMENT-1

File this supplement with the service manual.

Subject:

Argentine model Addition

SPP-SS950

US Model

E Model

(ENG-98016)

Argentine model is almost the same as E model. The difference parts from E model are described in this service manual. Please refer to SPP-SS950 service manual previously issued for the other infomation.

• DIFFERENCE PARTS LIST

Page E model Argentine model

Ref. No. Part No. Description Remark

1-467-498-21 AC ADAPTOR (AC-T47)

Ref. No. Part No. Description Remark

1-418-223-11 AC ADAPTOR (AC-T126)

9-925-727-81

Sony Corporation

Personal & Mobile Communication Company

98IXX002-1

Published by Quality Assurance Dept.

Sony SPP-SS950 Service manual

Specifications and Main Features

Frequently Asked Questions

User Manual

GENERAL

DISASSEMBLY

900MHz SYSTEM OPERATION

TEST MODE

ELECTRICAL ADJUSTMENTS

DIAGRAMS

EXPLODED VIEWS

ELECTRICAL PARTS LIST

SUPPLEMENT-1