Information in this document is subject to change without notice.
Sony and VAIO are trademarks of Sony. Intel logo and Intel Inside
logo are registered trademarks of Intel Corporation. Pentium MMX
is a trademark of Intel Corporation. Microsoft, MS-DOS, Windows,
the Windows 95 and Windows 98 logo are trademarks of Microsoft
Corporation.
All other trademarks are trademarks or registered trademarks of
their respective owners. Other trademarks and trade names may be
used in this document to refer to the entitles claiming the marks and
names or their produces. Sony Corporation disclaims any proprietary
interest in trademarks and trade names other than its own.
Caution Markings for Lithium/Ion Battery - The following or similar
texts shall be provided on battery pack of equipment or in both the
operating and the service instructions.
CAUTION: Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer. Discard used batteries according to the
manufacturer’s instructions.
CAUTION: The battery pack used in this device may present a fire
or chemical burn hazard if mistreated. Do not disassemble, heat
above 100°C (212°F) or incinerate.
Dispose of used battery promptly.
Keep away from children.
CAUTION: Changing the back up battery.
• Overcharging, short circuiting, reverse charging, multilation or
incineration of the cells must be avoided to prevent one or more of
the following occurrences; release of toxic materials, release of
hydrogen and/or oxygen gas, rise in surface temperature.
• If a cell has leaked or vented, it should be replaced immediately
while avoiding to touch it without any protection.
Service and Inspection Precautions
1. Obey precautionary markings and instructions
Labels and stamps on the cabinet, chassis, and components identify areas
requiring special precautions. Be sure to observe these precautions, as well
as all precautions listed in the operating manual and other associated
documents.
2. Use designated parts only
The set’s components possess important safety characteristics, such as
noncombustibility and the ability to tolerate large voltages. Be sure that
replacement parts possess the same safety characteristics as the originals.
Also remember that the 0 mark, which appears in circuit diagrams and
parts lists, denotes components that have particularly important safety
functions; be extra sure to use only the designated components.
3. Always follow the original design when mounting
parts and routing wires
The original layout includes various safety features, such as inclusion of
insulating materials (tubes and tape) and the mounting of parts above the
printer board. In addition, internal wiring has been routed and clamped so
as to keep it away from hot or high-voltage parts. When mounting parts or
routing wires, therefore, be sure to duplicate the original layout.
4. Inspect after completing service
After servicing, inspect to make sure that all screws, components, and wiring
have been returned to their original condition. Also check the area around
the repair location to ensure that repair work has caused no damage, and
confirm safety.
5. When replacing chip components...
Never reuse components. Also remember that the negative side of tantalum
capacitors is easily damaged by heat.
6. When handling flexible print boards...
• The temperature of the soldering-iron tip should be about 270C.
• Do not apply the tip more than three times to the same pattern.
• Handle patterns with care; never apply force.
Caution: Remember that hard disk drives are easily damaged by
vibration. Always handle with care.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Confidential
PCG-FX210 (UC)
— 2 —
TABLE OF CONTENTS
Section Title Page
CHAPTER 1. REMOVAL
1-1. Flowchart ......................................................................... 1-1
1-2. Main Electrical Parts Location Diagram ......................... 1-1
1-3. Removal ........................................................................... 1-2
1. Hood Keyboard Assy, Keyboard Unit.............................. 1-2
2. Cooling Unit-2, Lithium Battery, DVD-ROM Drive ....... 1-2
3. HDD, Door Battery .......................................................... 1-3
4. Palm Rest Assy, Touch Pad, CNX-129 Board,
Palm Rest Plate, Bracket Pad ........................................... 1-3
5. Display Assy, Hinge Cover .............................................. 1-4
6. PWS-14 Board, Latch Detector ...................................... 1-5
7. PC Card Connector, Modem Card, MBX-50 Board,
I/O Bracket ....................................................................... 1-5
8. Speaker Unit, SWX-74 Board ......................................... 1-6
9. SO-DIMM ........................................................................ 1-6
10. Modem Card (Removing from the bottom) ..................... 1-7
11. LCD Section – Made by AC – ......................................... 1-8
1. Bezel Housing Assy (14.1 inch) .................................. 1-8
2. Bracket LCD Left, Bracket LCD Right,
LCD Unit (14.1 inch) ................................................... 1-9
3. FPC, Inverter Assy, Display Housing Assy,
LCD Harness ................................................................ 1-9
1-4. Replacing the CPU ........................................................ 1-10
1. Removing the CPU ........................................................ 1-10
2. Installing the CPU .......................................................... 1-10
1-5. Replacing Various Connector on the MBX-50 Board ... 1-11
1. Removing the I/O Bracket ............................................. 1-11
2. Removing the Various Connectors ................................ 1-11
1-6. DIP Switch Setting of the MBX-50 Board .................... 1-12
(to 1-12)
Section Title Page
CHAPTER 2. SELF DIAGNOSTICS.......................... 2-1
(to 2-1)
CHAPTER 3. BLOCK DIAGRAM ............................... 3-1
(to 3-2)
CHAPTER 4. FRAME HARNESS DIAGRAM ........ 4-1
(to 4-2)
CHAPTER 5. EXPLODED VIEWS AND
PARTS LIST............................................ 5-1
5-1. Main Section .................................................................... 5-2
5-2. LCD Section – Made by AC – ......................................... 5-5
5-3. Connector Section ............................................................ 5-7
(to 5-8)
• Abbreviations
UC : US model / Canadian model
— 3 —
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PCG-FX210 (UC)
1-3.Removal
1. Hood Keyboard Assy, Keyboard Unit
3M2X4 Special Head (Black)
4Pull it up sliding it to the right.
8M2X4 Special Head (Black)
q;Keyboard Unit
Four Claws
MBX-50 Board
CON15
6Hood Keyboard Assy
7
5
1
9
2
MBX-50 Board
CON21
2. Cooling Unit-2, Lithium Battery, DVD-ROM Drive
5Rotate the three screws that are built together
with the Cooling Unit-2.
3+B M2 (X2) (Silver)
7DVD-ROM Drive
1+B M2 (X2) (Silver)
1
MBX-50
Board CON4
MBX-50 Board
CON14
4
2+B M2 (X2)
(Silver)
3Plate ground
(SH)
7Cooling Unit-2
9+B M2 (Silver)
6
qaLithium
Battery
5Bracket CD-ROM R
4+B M2 (X2)
(Silver)
Five Claws
2Bracket (CD-ROM L)
6DVD-ROM Door Assy
Lithium
Battery
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PCG-FX210 (UC)
8
Four
Claws
q;
1-2
3. HDD, Door Battery
1M2X6 Special Head (X6) (Gold)
3
1Screw M3X4 (X2) (Gold)
3Bracket HDD
2FPC 50Pin
(for HDD)
MBX-50 Board
CON9
5HDD
2Screw M3X4 (X2) (Gold)
4Door Battery
4FPC 50Pin
(for HDD)
4. Palm Rest Assy, Touch Pad, CNX-129 Board, Palm Rest Plate, Bracket Pad
3Pull it to the front slightly
and raise to remove it.
1M2X4
Special Head
(Black)
PWS-14 Board
BCN2
7CNX-129
Board
Palm Rest Assy
9Touch Pad
8FPC (TP-CNX)
6FPC (SWX-PWX)
5Bracket Pad
4
4Remove by pressing
2
Move down the front
portion slightly downward
and then pull it out.
to rear.
3Palm Rest
Plate
1M2X4 Special
Head (x4) (Black)
2Screw (M2),
0 Number P3 Kind (X4) (Black)
1-3
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PCG-FX210 (UC)
5. Display Assy, Hinge Cover
9M2X6 Special Head (X2) (Gold)
3+B M2 (X2) (Gold)
q;+B 2X12 (Silver)
1Stand the LCD upright
to the MBX-50 board.
7M2.6 Cross
(Hole) Bind
(Black)
4Plate ground
(SH)
qaM2X6 Special
Head (Gold)
2
qs
5M2.6 Cross
Six Claws
(Hole) Bind
(Black)
MBX-50 Board
CON4
8Screw (M2), 0 Number P3 Kind (Black)
qdClose simultaneously both left and right hinges approximately 90°
in the direction of the arrow.
6M2.6 Cross (Hole)
Bind (X2) (Black)
Four Claws
Note : To remove the cover hinge, bend
slightly the center of the display
base facilitates the removal work.
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PCG-FX210 (UC)
qfCover Hinge
qhDisplay Base
qg
Display Assy
1-4
6. PWS-14 Board, Latch Detector
2M2X4 Special Head (X2) (Black)
5Latch Detector
6PWS-14 Board
1
3
MBX-50 Board CON22
4Two Claws
7. PC Card Connector, Modem Card, MBX-50 Board, I/O Bracket
1M2X6 Special Head (Gold)
4+B 2X4 (Silver)
3M2X4 Special Head
(X4) (Black)
2Bracket wire
1
*
CPU
qkI/O Bracket
qjScrew (HEX) (X6) (Silevr)
qaPC Card Connector
qlMBX-50 Board
5Screw (MBX)
(Silver)
q;+B 2X14 (X2)
(Silver)
9
6M2X4 Special Head
(X2) (Black)
7Bracket Bay Connector
8Screw (M2) 0 Number
P3 Kind (X2) (Black)
∗1 When removing the CPU, refer to “ 1-4. Replacing the CPU ”.
∗2 Modem card can be removed from the bottom.
Refer to the subsequent paragraph “ 10. Modem card ” for more details.
1-5
qd
qhSpacer
(MBX) (X2)
qgNUT M2
TYPE2 (X2)
CON4
qfModem Card
qsM2 Grip (X2) (Black)
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PCG-FX210 (UC)
2
*