Sony MZ-E90 User Manual

MICROFILM

MZ-E60

SERVICE MANUAL

(Photo: Silver)

US and foreign patents licensed from Dolby Laboratories Licensing Corporation.

SPECIFICATIONS

System

Audio playing system

MiniDisc digital audio system

Laser diode properties

Material: GaAlAs Wavelength: λ = 790 nm Emission duration: continuous Laser output: less than 44.6 µW (This output is the value measured at a distance of 200 mm from the objective lens surface on the optical pick-up block with 7 mm aperture.)

Revolutions

800 rpm to 1,800 rpm

Error correction

Advanced Cross Interleave Reed Solomon Code (ACIRC)

Sampling frequency

44.1 kHz

Coding

Adaptive TRansform Acoustic Coding (ATRAC)

Modulation system

EFM (Eight to Fourteen Modulation)

Number of channels

2 stereo channels 1 monaural channel

Frequency response

20 to 20,000 Hz ± 3 dB

Wow and Flutter

Below measurable limit

Outputs

Headphones: stereo mini-jack, maximum output level 5 mW + 5 mW, load impedance 16 ohms

US Model

Canadian Model

AEP Model

E Model

Model Name Using Similar Mechanism MZ-E90 MD Mechanism T ype MT-MZE60-169 Optical Pick-up Mechanism Type LCX-2E

General

Power requirements

One LR6 (size AA) battery (not supplied)

Battery operation time

You can check the battery condition with the battery indication which is displayed while using the player. t Battery power decreasing

r Weak battery

e The battery has gone out. “LOW BATT”

flashes in the display on the remote control, and the power goes off.

Battery Life

Approximately 12 hours of playback can be expected with one LR6 (size AA) alkaline battery (not supplied).

Note

The battery life may shorter depending on operating conditions and temperature of the location.

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PORTABLE MINIDISC PLAYER

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Dimensions

Approx. 81 × 25 × 74 mm (w/h/d) (3 1/4 × 1 × 3 in.) not including projecting parts and controls

Mass

Approx. 95 g (3.4 oz.) the player only Approx. 136 g (4.8 oz.) incl. a premastered MD and a LR6 (size AA) alkaline battery

Supplied accessories

Headphones with a remote control (1) Carrying pouch (1)

Design and specifications are subject to change without notice.

Precautions for Laser Diode Emission Check

When checking the emission of the laser diode during adjustments, never view directly downwards as this may lead to blindness.

Precautions for Using Optical Pick-up (LCX-2E)

As the laser diode inside the optical pick-up damages by static electricity easily, solder the laser tap of the Optical pick-up flexible board when handling. Also take the necessary measures to prevent damages by static electricity. Handle the Optical pickup flexible board with care as it breaks easily.

This MiniDisc player is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the bottom exterior.

IN NO EVENT SHALL SELLER BE LIABLE FOR ANY DIRECT, INCIDENTAL OR CONSEQUENTIAL DAMAGES OF ANY NATURE, OR LOSSES OR EXPENSES RESULTING FROM ANY DEFECTIVE PRODUCT OR THE USE OF ANY PRODUCT.

“MD WALKMAN” is a trademark of Sony Corporation.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270°C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be damaged by heat.

Laser tap

Optical Pick-up flexible board

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!!

LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT . NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS D ANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

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TABLE OF CONTENTS

1. SERVICING NOTE......................................................... 4

2. GENERAL.........................................................................5

Playing an MD right away! ................................................... 5

3. DISASSEMBLY...............................................................7

3-1. Panel Assy, Upper .................................................................7

3-2. Holder Assy........................................................................... 7

3-3. Mechanism Deck .................................................................. 8

3-4. Main Board ........................................................................... 8

3-5. Service Assy, OP ................................................................... 9

4. TEST MODE................................................................... 10

4-1. General ................................................................................ 10

4-2. Setting the Test Mode ......................................................... 10

4-2-1. How to Set the Test Mode ........................................... 10

4-2-2. Operations when the Test Mode is Set ........................10

4-2-3. How to Release the Test Mode .................................... 10

4-3. Test Mode Structure............................................................ 10

4-4. Manual Mode ...................................................................... 11

4-4-1. Outline of the Function ............................................... 11

4-4-2. How to Set the Manual Mode...................................... 11

4-5. Overall Adjustment Mode................................................... 11

4-5-1. Outline of the Function ............................................... 11

5. ELECTRICAL ADJUSTMENTS..............................12

5-1. General ................................................................................ 12

5-2. Notes for Adjustment .......................................................... 12

5-2-1. Jigs............................................................................... 12

5-2-2. Adjustment Sequence .................................................. 12

5-2-3. Power ........................................................................... 12

5-3. Reset NV ............................................................................. 12

5-3-1. How to Reset NV ........................................................12

5-4. Overall Adjustment Mode................................................... 12

5-4-1. Overall Adjustment Mode Structure............................12

5-4-2. Overall CD and MO Adjustment Method ................... 12

5-4-3. Overall CD and MO Adjustment Items....................... 13

6. DIAGRAMS..................................................................... 14

6-1. IC Pin Description .............................................................. 14

6-1-1. IC801 RU6915MF-0006 (System Control)................. 14

6-2. Block Diagrams .................................................................. 17

6-2-1. MD Block Diagram ..................................................... 17

6-2-2. Servo, System Control Block Diagram ....................... 19

6-3. Printed Wiring Boards and Schematic Diagrams................ 21

6-3-1. Printed Wiring Board – Main Board – ........................ 21

6-3-2. Schematic Diagram – Main Board (1/4) – .................. 25

6-3-3. Schematic Diagram – Main Board (2/4) – .................. 27

6-3-4. Schematic Diagram – Main Board (3/4) – .................. 29

6-3-5. Schematic Diagram – Main Board (4/4) – .................. 31

6-4. IC Block Diagrams ............................................................. 33

7. EXPLODED VIEWS..................................................... 37

7-1. Main Unit Section ............................................................... 37

7-2. Mechanism Deck Section ................................................... 38

8. ELECTRICAL PARTS LIST...................................... 39

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SECTION 1

SERVICING NOTE

1) When repairing this device with the power on, if you remove the main board or open the upper panel assy, this device stops working. In this case, you can work without the device stopping by fastening the hook of the OPEN/CLOSE switch (MAIN board S809) with tape.

MAIN board S809

2) This set is designed to perform automatic adjustment for each adjustment and write its value to EEPROM. Therefore, when EEPROM (MAIN board IC802) has been replaced in service, be sure to perform automatic adjustment and write resultant values to the new EEPROM. Refer to section 4 Test Mode (page 10) for details.

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SECTION 2

GENERAL

This section is extracted from instruction manual.

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– 6 –

SECTION 3

DISASSEMBLY

Note : This set can be disassemble according to the following sequence.

Set Panel Assy, Upper Holder Assy Mechanism Deck

Note : Follow the disassembly procedure in the numerical order given.

3-1. PANEL ASSY, UPPER

4 screws(1.4),MI

Main Board

Service Assy, OP

5 panel assy, upper

3 screws(1.4),M

3-2. HOLDER ASSY

2 shaft

3 holder assy

1 shaf

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3-3. MECHANISM DECK

1 sheet (BLIND)

2 screw (MD), step

6 CN551

7 mechanism dec

3-4. MAIN BOARD

Note : When installing, fit the knobs (HOLD, MB) and the switchs (S806, 807, 808).

5 CN501

claw

S808

2 screws(1.7x2.5)

1 screws(1.7x2.5)

S806

S807

4 MAIN board

knobs (MB)

knob (HOLD)

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3-7. SERVICE ASSY, OP

)

5 service assy, OP

4 M 1.4

3 M 1.4

1 washer

2 gear (SA

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SECTION 4

TEST MODE

4-1. GENERAL

• When entered in the TEST MODE, this set provides the Overall

Adjustment mode which allows CD and MO discs to be automatically adjusted. In the Overall Adjustment mode , the system discriminates between CD and MO discs, performs adjustments in sequence automatically , and displays the faulty location if any fault is found. In the Manual mode, selected adjustments can be performed automatically.

• The attached remote control is used to operate the TEST MODE.

Unless otherwise specified in the text, the key means that on the remote control.

4-2. SETTING THE TEST MODE

4-2-1. How to set the TEST MODE

To set the TEST MODE, two methods are available. 1 Solder bridge and short TAP801 (TEST) on the main board.

Then turn on the power.

MAIN BOARD (SIDE B)

CN501

L501

C518

CN551

815

TAP801

TP518

Remote control LCD

888

All on

All off

004 V1.100

Microprocessor version display

• Press and hold down PLAY MODE to hold the current display while the key is being pressed.

4-2-3. How to release the TEST MODE

When method 1 was used:

Turn off the power and open the solder bridge on T AP801 on the main board. Note: The solder should be removed clean. The remaining

solder may make a short with the chassis and other part.

When method 2 was used:

Turn off the power.

4-3. TEST MODE STRUCTURE

Test Mode (Display Check Mode)

TAP801

2 In the normal mode, operate the keys on the set and those on the

remote control as specified below: Turn on HOLD switch on the set. Holding down x (STOP) key on the set, press the keys on the remote control in the following sequence:

> N t > N t . t . t > N t . t > N t . t X t X

4-2-2. Operations when the TEST MODE is set

When the TEST MODE is entered, the system switches to the display check mode within the TEST MODE. From this mode, the other Test modes can be accessed. When the TEST MODE is set, the LCD repeats a cycle of the following displays:

key

Manual Mode

key

Overall Adjustment Mode

key

Servo Mode

Audio Mode

Power Mode

OP Alignment Mode

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+ 22 hidden pages