Model Name Using Similar MechanismNEW
MD Mechanism TypeMT-MZE75-167
Optical Pick-up Mechanism TypeODX-1B
General
Power requirements
Nickel metal hydride rechargeable battery NH-14WM (supplied)
One LR6 (size AA) alkaline battery (not supplied)
Sony AC Power Adaptor (not supplied) connected at the DC IN
1.5V jack
Battery operation time
BatteriesPlayback
Ni-MHApprox.
Rechargeable battery (NH-14WM)16 hours
One LR6 (size AA)Approx.
Sony alkaline batteries22 hours
One LR6 (size AA) and aApprox.
Ni-MH (NH-14WM)42 hours
Dimensions
Approx. 86 x 16.3 x 75.4 mm (w/h/d)
not including projecting parts and controls
Mass
Approx. 98 g the player only
Approx. 141 g incl. a premastered MD and a nickel
metal hydride rechargeable battery NH-14WM (N)
Supplied accessories
Battery charger (1)
Rechargeable battery (1)
Rechargeable battery carrying case (1)
Headphones with a remote control (1)
Dry battery case (1)
Carrying pouch (1)
AC plug adaptor (Tourist model) (1)
Design and specifications are subject to change without notice.
This Mini Disc player is classified as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT label is located on the
bottom exterior.
IN NO EVENT SHALL SELLER BE
LIABLE FOR ANY DIRECT,
INCIDENTAL OR CONSEQUENTIAL
DAMAGES OF ANY NATURE, OR
LOSSES OR EXPENSES RESULTING
FROM ANY DEFECTIVE PRODUCT
OR THE USE OF ANY PRODUCT.
“MD WALKMAN” is a trademark of Sony
Corporation.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
6. DIAGRAMS
6-1. Explanation of IC Terminals..................................... 10
8. ELECTRICAL PARTS LIST................................... 28
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHO WN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
SECTION 1
SERVICING NOTE
When repairing this device with the power on, if you remove the main board, this device stops working.
In this case, you work without the device stopping by fastening the hook of the Open/Close detection switch (S801).
Mechanism deck section
* Replacement of CXD2661GA-2 (IC601) used
Open/Close detection switch (S801)
– 2 –
in this set requires a special tool. Therefore, it
cannot be replaced.
LOCATION AND FUNCTION OF CONTROLS
Main Unit
SECTION 2
GENERAL
9
8
7
6
5
4
1 i 1 jack
2 OPEN button
3 OPERATE indicator
4 >B button
5 . button
6 x button
7 i 2 jack
Note : Follow the disassembly procedure in the numerical order given.
3-1. UPPER PANEL ASSY, “PANEL ASSY, BOTTOM”
Upper panel ASSY
3
Screw (1.7)
5
Main unit
4
Claw
Main board
1
Screws (1.4)
2
Press the OPEN button
Optical pick-up block ASSY
6
Screws (1.4
3-2. BELT, ORNAMENTAL
1
Move it away
from projection
Claw
7
Panel ASSY, bottom
Belt, ornamental
– 4 –
2
Main uni
3-3. MAIN BOARD
1
Screws (M1.4 toothed lock)
Main board
2
Screw (HP), step
3
CLV fexble board
3-4. OPTICAL PICK-UP BLOCK ASSY
OP flexible board
4
Optical pick-up block ASSY
4
Main unit
5
OP flexble board
3
Shaft (Main)
Screw (M1.4) precision pan
Double sided
adhesive tape
OP flexible board
Note :Put the OP flexible board to a correct
5
6
2
Chissis ASSY
1
position of c hassis ASSY .
– 5 –
SECTION 4
R818
R
SP806
4
5
S
8
V
T
T
TEST MODE
Outline
• In this set, overall adjustment mode is made available by entering test mode to perform automatic adjustment of CD and MO.
In the overall adjustment mode, the disc is determined whether
it is CD or MO and adjustments are performed in sequence. If a
fault is found, the location of the fault is displayed. Also, in servo
mode, each adjustment can be automatically made.
• Operation in the test mode is performed with the Remote Commander. A key having no particular description in the text, indicates a Remote Commander key .
Setting the Test Mode
T o enter the test mode, two methods are available :
1. Entering method with key input.
Turn on the HOLD switch on the set. While holding down the x
key on the set, press the following remote commander keys in
the following order :
B/> t B/> t . t . t B/> t .t
B/> t . t X t X
2. Entering method by shorting the test point
Solder bridge the test point TAP805 (TEST) on the main board
(connect IC801 pin ed to GND), and turn on the POWER.
[MAIN BOARD] (SIDE B)
TP8061
61
356540
TP852
3
C565
SP805
07
UME+
R807
X801
SP804
52
R802
R801
R808
10
15
R804
20
70
75
1
5
IC801
RB801
30
TAP805
(TEST)
218025
C805
Test mode
Short : Test mode
Open : Normal mode
Releasing the Test Mode
1. When test mode was entered with key input, turn off the POWER.
2. When test mode was entered by shorting the test point, turn off
the POWER and open the solder bridge of TAP805 (TEST
MODE) on the main board.
Operation of Setting on Test Mode
When the test mode is set, the LCD displays the following :
F
100V1. 000
LCD on remote commander
ROM version display
• The cycle - the above ROM version display t All lit t All off
- is repeated.
(The ROM version is constantly displayed.)
• When the PLAY MODE key is pressed and hold down, the display at that time is held so that display can be checked.
60
55
TP811
50
45
41
RB802
SHUF
DIGITAL S
2
LIMIT
Configuration of Test Mode
The test mode has the configuration given below.
VOL
+ key
x key
Overall
adjustment
mode (Auto?)
VOL
– key
x key
Display when test mode
is set
Adjustment
mode
(Manu ?)
Displays of the LCD on the remote commander
are shown in parentheses.
x key
B/>
key
B/>
key
(044 Start ?)
x key
Servo mode
0 0 0
Audio mode
1 0 0
Power mode
3 0 0
+, – keys
+, – keys
VOL +, – keys
Servo Mode
• Set the test mode, press the VOLUME – key and use the B/>
key to set the servo mode.
• When the servo mode is set, use the B/> key and the .
key to move the optical pick-up to the outer circumference and
to the inner circumference respectively.
• When entering another mode, refer to the configuration of test
mode.
1. Structure of Servo Mode
S
A
Servo mode
0 0 0
x key
x key
1
B/> key
Offset adjustment
0 1 0
VOL
+, – keys
Laser power
adjustment
VOL
+, – keys
23
(See page 7.)
B/> key
011 to 013
x key
*1
B/> key
0 2 0
021 to 023
x key
*1
*1 Repeatedly press B/> key
to change the mode.
(Refer to the following list for
a description of each mode.)
B/>
key
B/>
key
– 6 –
(See page 6.)
1
x key
x key
x key
x key
23
MO adjustment
0 3 0
VOL
+, – keys
Low reflection
CD adjustment
0 4 0
VOL
+, – keys
CD adjustment
0 5 0
VOL
+, – keys
Sled movement
0 6 0
x key
x key
x key
B/> key
031 to 039,
03a to 03c
B/> key
041 to 047
B/> key
051 to 059,
B/> key
*1
B/> key
*1
B/> key
05a to 05c
*1
B/> key
2. Description of Each Mode
010 Offset adjustment
ModeDescription
011VC offset, FE offset, ABCD offset
012Not used
013Not used
020 Laser power adjustment
ModeDescription
021MO power (GRV)
022MO power (LPIT)
023CD power (HPIT)
030 MO adjustment
ModeDescription
031MO EF balance
032MO EF gain
033MO ABCD gain
034MO focus gain
035MO tracking gain
036MO RF gain
037––––––––––––
038––––––––––––
039––––––––––––
to change the mode.
(Refer to the following list
for a description of each
mode.)
040 Lower reflection CD adjustment
ModeDescription
041Lower reflection CD EF balance
042Lower reflection CD tracking offset
043Lower reflection CD ABCD gain
044Lower reflection CD focus gain
045Lower reflection CD tracking gain
046Lower reflection CD focus bias
047––––––––––––
050 CD adjustment
ModeDescription
051CD EF balance
052CD tracking offset
053CD ABCD gain
054CD focus gain
055CD tracking gain
056CD focus bias
057––––––––––––
058––––––––––––
059––––––––––––