Sony MZ-E45 User Manual

MZ-E44/E45

SERVICE MANUAL

Ver 1.1 1999.01

Photo : MZ-E44 (SILVER)

US and foreign patents licensed from Dolby Laboratories Licensing Corporation

MD Section

Audio playing system

Minidisc digital audio system

Laser diode properties

Material : GaAlAs Wavelength : λ =790nm Emission duration : continuous

Laser output : less than 44.6 µW* * This output is the value measured at a distance of 200 mm from the

objective lens surface on the optical pick-up block with 7mm aperture.

Revolutions

400 rpm to 900 rpm (CLV)

Error correction

Advanced Cross Interleave Reed Solomon Code (ACIRC)

Sampling frequency

44.1kHz

Coding

Adaptive Transform Acoustic Coding (ATRAC)

Modulation system

EFM (Eight to Fourteen Modulation)

Number of channels

2 stereo channels 1 monaural channel

Frequency response

20 to 20,000 Hz ± 3 dB

Wow and Flutter

Below measurable limit

Outputs

Headphones : stereo mini-jack, maximum output level 5mW+5mW, load impedance 16 ohm

Photo : MZ-E45 (GRAY)

SPECIFICATIONS

US Model

AEP Model

UK Model

Australian Model

Tourist Model

MZ-E44

E Model

MZ-E44/E45

Model Name Using Similar Mechanism NEW MD Mechanism Type MT-MZE44-140 Optical Pick-up Mechanism Type ODX-1A/1B

General

Power requirements

Rechageable battery (supplied) Nickel metal hydride rechargeable battery NH-9WM (N) One LR6 (size AA) alkaline battery (not supplied) Sony AC Power Adaptor AC-E15L (not supplied) connected at the DC IN 1.5V jack

Battery operation time

Batteries Playback Nickel metal hydride Approx. Rechargeable battery (NH-9WM (N)) 5.5 hours One LR6 (size AA) Approx. Sony alkaline dry batteries 8.5 hours Nickel metal hydride (NH-9WM (N)) + Approx. One LR6 (size AA) 16 hours

Dimensions

Approx. 87 x 17.8 x 91.5 mm (w/h/d) (3 1/2 x 23/32 x 3 5/8 in) not including projecting parts and controls

Mass

Approx. 115 g (4.1 oz.) the player only Approx. 155 g (5.5 oz.) incl. a premastered MD and a nickel metal hydride rechargeable battery NH-9WM (N)

Supplied accessories

Battery charger (1) Rechargeable battery (1) Rechargeable battery carrying case (1) Headphones with a remote control (1) Dry battery case (1) Handstrap (1) Carrying pouch (1) LR6 (size AA) alkaline battery (1) (Tourist model only)

MICROFILM

Design and specifications are subject to change without notice.

PORTABLE MINIDISC PLAYER

TABLE OF CONTENTS

Specifications ........................................................................... 1

1. SERVICING NOTE....................................................... 2

2. GENERAL

Location and Function of Controls .................................... 3

3. DISASSEMBLY

3-1. Upper Panel Assy ....................................................... 4

3-2. Bottom Panel Assy ..................................................... 4

3-3. Main board.................................................................. 4

3-4. Belt Assy, Front Panel Assy........................................ 5

3-5. Mechanism Deck Section ........................................... 5

3-6. Optial Pick-up Block Assy ......................................... 6

4. TEST MODE................................................................... 7

This Mini Disc player is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the bottom exterior.

IN NO EVENT SHALL SELLER BE LIABLE FOR ANY DIRECT, INCIDENTAL OR CONSEQUENTIAL DAMAGES OF ANY NATURE, OR LOSSES OR EXPENSES RESULTING FROM ANY DEFECTIVE PRODUCT OR THE USE OF ANY PRODUCT.

“MD WALKMAN” is a trademark of Sony Corporation.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

5. ELECTRICAL ADJUSTMENTS............................ 10

6. DIAGRAMS

6-1. Explanation of IC Terminals..................................... 13

6-2. Block Diagram.......................................................... 15

6-3. Printed Wiring Boards .............................................. 18

6-4. Schematic Diagram................................................... 21

7. EXPLODED VIEWS

7-1. Panel Section ............................................................ 28

7-2. Main Section............................................................. 29

7-3. Mechanism Deck Section ......................................... 30

8. ELECTRICAL PARTS LIST ................................ 31

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270°C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be damaged by heat.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

SECTION 1

SERVICING NOTE

When repairing this device with the power on, if you remove the main board, this device stops working. In this case, you work without the device stopping by fastening the hook of the Open/Close detection switch (S801) with tape.

Chassis ASSY

Main board

Tape

Open/Close switch (S801)

– 2 –

LOCATION AND FUNCTION OF CONTROLS

Main Unit

SECTION 2

GENERAL

1 MD operate buttons

” • + (PLAY • FF ) = (REW ) p (STOP)

2 HOLD switch 3 VOLUME +/– buttons 4 EJECT button

!º

5 OPERA TE lamp 6 Battery compartment 7 External battery terminal (+/–) 8 DIGIT AL MEGA BASS s witc h 9 AVLS s witc h !º 2 / REMOTE jack

Headphones with Remote Control

1 Headphones 2 MD operate switch and buttons

” • + (PLAY • FF) = (REW) p (STOP)

3 VOL +/– button 4 Display indicator 5 DISPLAY button 6 PLAYMODE button 7 P (PAUSE) b utton 8 HOLD c switch 9 p (STOP) b utton

– 3 –

SECTION 3

DISASSEMBLY

The equipment can be removed using the following procedure.

Upper panel ASSY

set Main board Belt ASSY, Front panel ASSY

Bottom panel ASSY

Note : Follow the disassembly procedure in the numerical order given.

Mechanism deck section

Optical pick-up block ASSY

3-1. UPPER PANEL ASSY

Screws (M1.4) pan precision

Upper panel ASSY

Screws (M1.4) pan precision

Main section

3-2. BOTTOM PANEL ASSY

Screws (M1.4)

pan precision

Bottom panel ASSY

Screws (M1.4) pan precision

Main sectio

3-3. MAIN BOARD

Remove solder

Battery case ASSY

Switch unit (CN801)

Screw (M1.4)

pan precision

board (CN551)

Flexible board

(CN501)

!º

Flexible (CLV)

Remove solder

Screw (M1.4x2)

toothed lock

Screw

Screw tapping (M1.7)

Remove solder

Main board

Screws (M1.4x2)

toothed lock

– 4 –

3-4. BELT ASSY, FRONT PANEL ASSY

)

Boss

Claws

Belt ASSY

Boss

Claws

Main section

Front panel ASSY

Screw

(M1.4) pan precision

3-5. MECHANISM DECK SECTION

Boss

Mechanism deck section

Remove claws

Claw

Remove claws

Step screws

Chassis ASSY (main section

– 5 –

3-6. OPTICAL PICK-UP BLOCK ASSY

)

Optical pick-up block ASSY

OP flexible board

NOTE

When replacing the optical block, the OP flexible board protective sheet (SW) is necessary. Before replacing, check where the sheet (SW) is pasted onto the old OP flexible board and paste it on the new OP flexible board in the same way.

Screw precision

Main shaft

Chassis ASSY (MD section

Pasting on the sheet (SW) :

Paste on aligning the sheet (SW) center section with the edge of the OP flexible board as in the figure and folding the excess over onto the opposite side.

OP flexible board

Optical pick-up ASSY

5 mm

Sheet (SW)

– 6 –

SECTION 4

” key

p key

VOL + key

VOL – key

(Start ?)

Overall adjustment mode (Auto?)

Adjustment mode (Manu ?)

Servo mode

0 0 0

Audio mode

1 0 0

Servo mode

3 0 0

+, – keys

Display when test mode

is set

Displays of the LCD on the remote commander are shown in parentheses.

TEST MODE

Outline

• In this set, overall adjustment mode is made available by entering test mode to perform automatic adjustment of CD and MO. In the overall adjustment mode, the disc is determined whether it is CD or MO and adjustments are performed in sequence. If a fault is found, the location of the fault is displayed. Also, in servo mode, each adjustment can be automatically made.

Setting the Test Mode

To enter the test mode, two methods are available :

1. Entering method with key input. Turn on the HOLD switch on the set. While holding down the p key on the set, press the following remote commander keys in the following order :

+ n + n = n = n + n = n + n = n P n P

2. Entering method by shorting the test point Solder bridge the test point TAP801 (TEST) on the main board (connect IC801 pin #™ to GND), and turn on the POWER.

[MAIN BOARD] (Conductor side)

Configuration of Test Mode

The test mode has the configuration given below.

Servo Mode

• Set the test mode, press the VOLUME – key and use the ” key to set the servo mode.

• When the servo mode is set, use the + key and the = key to move the optical pick-up to the outer circumference and to the inner circumference respectively.

• When entering another mode, refer to the configuration of test mode.

1. Structure of Servo Mode

Test mode

Short : Test mode Open : Normal mode

Releasing the Test Mode

1. When test mode was entered with key input, turn off the POWER.

2. When test mode was entered by shorting the test point, turn off the POWER and open the solder bridge of TAP801 (TEST MODE) on the main board.

Operation of Setting on Test Mode

When the test mode is set, the LCD displays the following :

LCD on remote commander

V3. 300

• The cycle - the above ROM version display n All lit n All off

- is repeated. (The ROM version is constantly displayed.)

• When the PLAY MODE key is pressed and hold down, the display at that time is held so that display can be checked.

ROM version display

– 7 –

Servo mode

0 0 0

p key

” key

Offset adjustment

+, – keys+, – keys

Laser power

adjustment

(See page 8)

0 1 0

0 2 0

” key

p key

*1 Repeatedly press ” key

to change the mode. (Refer to the following list for a description of each mode.)

011 to 013

” key

021 to 024

” key

(See page 7.)

p key

MO adjustment

0 3 0

p key

+, – keys

Low reflection

CD adjustment

0 4 0

p key

+, – keys

CD adjustment

0 5 0

p key

+, – keys

” key

031 to 039

” key

041 to 048

” key

051 to 058

” key

2. Description of Each Mode 010 Offset adjustment

Mode Description

011 FE offset 012 TE offset 013 All servo ON

020 Laser power adjustment

Mode Description

021 MO power A 022 MO power E 023 CDL power 024 CD power

030 MO adjustment

Mode Description

031 MO EF balance 032 MO EF gain 033 MO ABCD gain 034 MO focus gain 035 MO tracking gain 036 MO RF gain 037 MO ADIP gain 038 MO focus bias E 039 CD focus bias A

p key

Sled movement

0 6 0

p key

+, – keys

Automatic

adjustment

0 7 0

p key

+, – keys

NV relation

0 9 0

p key

+, – keys

Retern the Offset adjustment (0 1 0)

” key

061 , 062

” key

071, 072,

073, 074

” key

091, 092,

093

” key

*1 : Repeatedly press ” key

to change the mode. (Refer to the following list for a description of each mode.)

040 Lower reflection CD adjustment

Mode Description

041 Lower reflection CD EF balance 042 Lower reflection CD EF gain 043 Lower reflection CD ABCD gain 044 Lower reflection CD focus gain 045 Lower reflection CD tracking gain 046 Lower reflection CD RF offset 047 Lower reflection CD RF gain 048 Lower reflection CD focus bias

050 CD adjustment

Mode Description

051 CD EF balance 052 CD EF gain 053 CD ABCD gain 054 CD focus gain 055 CD tracking gain 056 CD RF offset 057 CD RF gain 058 CD focus bias

– 8 –

+ 16 hidden pages