Sony MZ-B100 User Manual

MZ-B100
SERVICE MANUAL
Ver 1.0 2001.10
US and foreign patents licensed from Dolby Laboratories Licensing Corporation

SPECIFICATIONS

Tourist Model
Model Name Using Similar Mechanism NEW
Mechanism Type MT-MZB100-171
Optical Pick-up Name LCX-4R
System
Audio playing system
MiniDisc digital audio system
Laser diode properties
Material: GaAlAs Wavelength: λ = 790 nm Emission duration: continuous Laser output: less than 44.6 µW (This output is the value measured at a distance of 200 mm from the lens surface on the optical pick-up block with 7 mm aperture.)
Recording and playback time
When using MDW-80 Maximum 160 min. in monaural. Maximum 320 min. in stereo
Revolutions
350 rpm to 2,800 rpm (CLV)
Error correction
ACIRC (Advanced Cross Interleave Reed Solomon Code)
Sampling frequency
44.1 kHz
Sampling rate converter
Input: 32 kHz/44.1 kHz/48 kHz
Coding
ATRAC (Adaptive TRansform Acoustic Coding) ATRAC3 — LP2/LP4
Modulation system
EFM (Eight to Fourteen Modulation)
Speaker
28 mm (1 1/8 in.) dia.
Frequency response (digital/analog input)
20 to 20,000 Hz ± 3 dB
Wow and Flutter
Below measurable limit
Inputs
Microphone: stereo mini-jack (minimum input level 0.25 mV) Line in1): stereo mini-jack for analog input (minimum input level 39 mV) optical (digital) mini-jack for optical (digital) input
Outputs
i : stereo mini-jack (dedicated remote control jack)
Maximum output (DC)
Headphones: 5 mW + 5 mW (16 ohm) Speaker: 70 mW
2)
– Continued on next page –
9-873-341-01
2001J0200-1
© 2001.10
PORTABLE MINIDISC RECORDER
Personal Audio Company
Published by Sony Engineering Corporation
MZ-B100
General
Power requirements
DC 3V LR6 (size AA) alkaline dry battery (world model only)
Battery operation time
Battery life
When recording
Recording mode Approx. hours Stereo 9 LP2 Stereo 12.5 LP4 Stereo 15 MONO 12
1)
2)
3)
4)
When playing
Recording mode Speaker Stereo 25.5 34.5 LP2 Stereo 27 39.5 LP4 Stereo 30 43 MONO 30 43
1)
2)
3)
3)
Dimensions
Approx. 105.7 × 80.0 × 24.9 mm (w/h/d) (4 1/4 × 3 1/8 × 1 in.) not incl. projecting parts and controls.
Mass
Approx. 160 g (5.7 oz) (main unit only)
Supplied accessories
Remote control (1) Headphones (1) Carrying pouch (1) Hand strap (1) Sony LR6 (size AA) alkaline dry battery (1)
1)
The LINE IN (OPTICAL) jack is used to connect either a digital (optical) cable or a line (analog) cable.
2)
Measured in accordance with JEITA.
Design and specifications are subject to change without notice.
1)
2)3)
(Unit: approx.hours) (JEITA4))
The battery life may be shorter due to operating conditions and the temperature of the location. When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan). Recording time may differ according to the alkaline batteries. When recorded with the built-in microphones. Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries Association) standard.
When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan). Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries Association) standard. When played using the built-in speaker. When played using headphones.
1)
(Unit: approx.hours) (JEITA2))
3)
Headphones
4)
TABLE OF CONTENTS
1. SERVICING NOTES ....................................................... 3
2. GENERAL .......................................................................... 4
3. DISASSEMBLY
3-1. Panel (Lower) ASSY..................................................... 6
3-2. Main Board ................................................................... 6
3-3. Cabinet (Belt) Section ................................................... 7
3-4. Key Board Unit ............................................................. 7
3-5. Mechanism Deck .......................................................... 8
3-6. Optical Pick-up Block (LCX-4R) ................................. 9
3-7. Holder ASSY .............................................................. 10
3-8. Motor, DC (Sled) (M602) ........................................... 10
3-9. “Motor, DC (Spindle) (M601)”, “Motor, DC (Over Write Head Up/Down) (M603)”... 11
4. TEST MODE .................................................................... 12
5. ELECTRICAL ADJUSTMENTS ............................... 19
6. DIAGRAMS
6-1. Explanation of IC Terminals ....................................... 24
6-2. Block Diagrams (Main Section (1/3) .......................... 30
6-3. Block Diagrams (Main Section (2/3) .......................... 31
6-4. Block Diagrams (Main Section (3/3) .......................... 32
6-5. Printed Wiring Board (Main Section (1/2)) ................ 33
6-6. Printed Wiring Board (Main Section (2/2)) ................ 34
6-7. Schematic Diagram (Main Section (1/4)) ................... 35
6-8. Schematic Diagram (Main Section (2/4)) ................... 36
6-9. Schematic Diagram (Main Section (3/4)) ................... 37
6-10. Schematic Diagram (Main Section (4/4)) ................... 38
7. EXPLODED VIEW
7-1. Panel (Lower) Section ................................................. 42
7-2. Panel (Upper Lid) Section .......................................... 43
7-3. Cabinet (Belt) Section ................................................. 44
7-4. Mechanism Deck Section (MT-MZB100-171) ........... 45
8. ELECTRICAL PARTS LIST ....................................... 46
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam­aged by heat.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
SECTION 1
p

SERVICING NOTES

MZ-B100
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (LCX-4R)
The laser diode in the optical pick-up block may suffer electrostatic break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform measures against electrostatic break-down sufficiently before the operation. The flexible board is easily damaged and should be handled with care.
• When repairing this device with the power on, if you remove the MAIN board or open the upper panel assy, this device stops work­ing. In this case, you can work without the device stopping by fasten­ing the hook of the open/close detect switch (S804).
S804
• This set is designed to perform automatic adjustment for each adjustment and write its value to EEPROM. Therefore, when EEPROM (IC802) has been replaced in service, be sure to per­form automatic adjustment and write resultant values to the new EEPROM. (Refer to Section 5 Electrical Adjustment. (page 19))
• Replacement of CXD 2671-209GA (IC801) used in this set re­quires a special tool.
laser-ta
OPTICAL PICK-UP FLEXIBLE BOARD
z
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
• Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.
• Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
3
MZ-B100
LOCATION AND FUNCTION OF CONTROLS
– Front of the recorder –
1
2
3456 78 qj qk ql
9q;qaqsqdqfqg qh w; wa ws wd wf wgwh
SECTION 2

GENERAL

How to attach the hand strap.
This section is extracted from instruction manual.
1 SPEED CONTROL dial 2 .REVIEW/AMS/>CUE/AMS
3 VOR indicator 4 DISPLAY button 5 PLAY MODE button 6 EDIT/ENTER button 7 EASY SEARCH +/– buttons 8 Display window 9 x STOP button 0 N PLAY (play) button
qa X PAUSE button qs z REC button qd REC indicator
– Back of the recorder –
(search /AMS) buttons
The N PLAY button has a tactile dot.
qf TRACK MARK button qg REC MODE switch qh GROUP button qj Speaker qk DC IN 3V jack ql Microphones w; i (headphones) jack wa OPEN switch ws HOLD switch wd VOL control
The VOL control has a tactile dot.
wf VOR button wg SYNCHRO REC ON/OFF switch wh ERASE button
1
2
3
1 Battery compartment 2 CLOCK SET button 3 SOUND button 4 LINE IN (OPTICAL) jack
5 MIC (PLUG IN POWER) jack
The MIC (PLUG IN POWER) jack
has a tactile dot.
6 MIC SENS (H/L) switch
4
5
6
4
– The display window –
MZ-B100
1 2 456 7
1 Character information display
Displays the disc and track names,
date, error messages, track numbers,
recording level, etc.
2 Group indication 3 Play mode indication 4 Disc indication
Shows that the disc is rotating for
recording, playing or editing an MD.
5 VOR indication
3
qdqsqaq;98
6 Battery level indication 7 SYNC (synchro-recording) indication 8 Playback level meter 9 V-UP indication 0 STEREO (stereo), LP2 (LP2 stereo),
LP4 (LP4 stereo), MONO (monaural)
indication
qa Pause indication qs SOUND indication qd REC indication
– The remote control –
1 Stereo mini plug 2 SOUND button 3 TRACK MARK button 4 HOLD switch
5 X (pause) button
A
B
C
D
E
Slide to lock the controls of the remote
control.
F
G H
I
J
6 Headphones 7 x (stop) button 8 >N buttons
The >N buttons has a tactile dot.
9 .REVIEW/AMS 0 VOL control
The VOL control has a tactile dot.
5
MZ-B100
SECTION 3

DISASSEMBLY

z
The equipment can be removed using the following procedure.
Set Main board Cabinet (belt) section Key board unit
Note : Follow the disassembly procedure in the numerical order given.

3-1. PANEL (LOWER) ASSY

Panel (lower) ASSY
Mechanism deck
Optical pick-up block Holder ASSY Motor, DC (sled) (M602) Motor, DC (spindle) (M601) ,
Motor, DC (over write head up/down) (M603)
Panel (upper lid) ASSY
S301
S809
3
2
Screws
(ES lock)
Panel (lower) ASSY
z
Caution during assembly Position the SYNCHRO REC knob and the S809, position the MIC SENS knob and the S301 respectively.

3-2. MAIN BOARD

MIC SENS knob
Hold knob
4
CN701
Main board
5
1
Screws (B1.7x4)
SYNCHRO REC knob
2
Screws (ES lock)
Panel (upper lid) ASSY
6
CN501
2
CN801
3
Remove solder
(4 places)
1
1
Screws
z
Caution during assembly Position the hold knob and the S801 respectively
Screws
6

3-3. CABINET (BELT) SECTION

)
r
MZ-B100

3-4. KEY BOARD UNIT

1
Screws
(ES lock)
3
2
Open
Panel (upper lid) ASSY
1
Screws (ES lock
Cabinet (belt) section
2
Cover (REC)
9
Claws
Key board unit
0
Panel (upper lid) ASSY
MIC101
MIC201
7
Remove solde
(2 places)
6
Remove solder
(4 places)
1
Screws
5
Screw
4
Speaker
3
Screws (B2.0)
5
Screws
8
Remove solder
(2 places)
7
MZ-B100

3-5. MECHANISM DECK

Set chassis ASSY
Cabinet (front)
Mechanism deck (MT-MZB100-171)
9
8
Screws
(ES lock)
1
Screws
(ES lock)
5
Screw
(ES lock)
2
Screws
7
(ES lock)
6
Cabinet (belt)
4
3
Screws (ES lock)
Screws (ES lock)
8

3-6. OPTICAL PICK-UP BLOCK (LCX-4R)

1
washer (0.8-2.5)
3
screw (M1.4)
4
spring, rack
2
gear (SA)
5
screw (M1.4)
6
spring, thrust detent
8
Pull off “screw, lead”
MZ-B100
7
B
Optical pick-up block (LCX-4R)
over write head section
9
Opening the over write head toward the direction (LCX-4R) toward the direction
Note: Do not open the entire assy forcibly,
when opening the over write head.
A
A
, remove the optical pick-up block
B
.
9
MZ-B100

3-7. HOLDER ASSY

5
Remove the holder assy in the direction of arrow D.
1
Open the holder assy.
A
D
C
B
2
Push the convex portion toward the direction B and open the holder assy toward the direction A to erect uprightly.
3
Remove the concave portion in the direction of arrow C.

3-8. MOTOR, DC (SLED) (M602)

4
two screws (M1.4)
5
motor, DC (sled) (M602)
3
gear (SA)
4
boss
2
washer (0.8-2.5)
1
Remove six solders of motor flexible board.
10
5
motor, DC (spindle) (M601)
4
three screws (M1.4)
1
Remove six solders of motor flexible board.
qa
motor, DC (over write head up/down) (M603)
6
two screws (M1.4)
qs
chassis assy, gear
9
screw (M1.2)
0
gear (HA)
gear (HA)
chassis assy, gear
2.65 mm
motor, DC (over write head up/down) (M603)
8
gear (HB)
7
washer (0.8-2.5)
2
washer (0.8-2.5)
3
gear (HC)
Note: Press-fit the gear (HA) up to the
position of the motor, DC (over write head up/down) (M603) as shown below.

3-9. “MOTOR, DC (SPINDLE) (M601)”, “MOTOR, DC (OVER WRITE HEAD UP/DOWN) (M603)”

MZ-B100
11
MZ-B100
SECTION 4

TEST MODE

[Outline]
• This set provides the Overall adjustment mode (Assy mode) that allows CD and MO disc to be automatically adjusted when in the test mode. In this overall adjustment mode, the protect switch is detected to judge the disc, CD or MO, and each adjustment is automatically executed in order. If a fault is found, the system displays its location. Also, the manual mode allows each indi­vidual adjustment to be automatically adjusted.
• The keys in the description refer to the keys on both set and remote commander unless otherwise specified.
[Setting Method of Test Mode]
There are two different methods to set the test mode: 1 Short SL801 (TEST) on the MAIN board with a solder bridge
(connect pin 202 of IC801 to the ground). Then, turn on the power.
MAIN BOARD (SIDE A)
C518
4440
R801
C517
R817
R804
SL801(TEST) OPEN: NORMAL MODE SHORT: TEST MODE
R803
C808
R812
C806
1
IC804
4
8
5
C805
2 In the normal mode, turn on the HOLD switch on the set. While
pressing the N key on the set, press the following set keys in the following order:
> t > t . t . t > t . t > t . t X t X
[Operation in Setting the Test Mode]
• When the test mode becomes active, first the display check mode is selected. (Press x key once, when the display check mode is not active.)
• Other mode can be selected from the display check mode.
• When the test mode is set, the LCD repeats the following dis­play.
LCD display
All lit
All off
Microprocessor version display
V0.000
R802
R819
C817
R820
R830
C816
C823
R825
R828
R827 R829
C821
R811
R810
SL801 SHORT: TEST MODE OPEN: NORMAL MODE
*
IC801
X801
R821
When the X key is pressed and hold down, the display at that time is held so that display can be checked.
[Releasing the Test Mode]
For test mode set with the method 1: Turn off the power and open the solder bridge on SL801 (TEST) on the MAIN board.
Note: Remove the solders completely. Remaining could be shorted with
the chassis, etc.
For test mode set with the method 2: Turn off the power.
Note: If electrical adjustment (see page 19) has not been finished com-
pletely, always start in the test mode. (The set cannot start in nor­mal mode.)
12
MZ-B100
[Configuration of Test Mode]
[Test Mode $Display Check Mode%]
Press the
> or
[EASY SEARCH +]
key
[Manual Mode]
Press the
x key
[Servo Mode] [Audio Mode] [Power Mode]
[OP Alignment Mode]
Press the
. or
[EASY SEARCH --]
key
[Overall Adjustment Mode]
Press the
Press the N or
Press the
x key
x key
[REC]
key on the set
[Sound Skip Check Result Display Mode]
Press the
[DISPLAY]
key
[Self-Diagnosis Display Mode]
Press the
Press the
on the remote commander for several seconds.
x key
[TRACK MARK]
key
[Key Check Mode]
Quit the key check or open the upper panel
[Manual Mode]
Mode to adjust or check the operation of the set by function. Normally, the adjustment in this mode is not executed.
Transition method in Manual Mode
1. Setting the test mode. (See page 12)
2. Press the mode where the LCD display as shown below.
> or [EASY SEARCH +] key activates the manual
LCD display
Manual
[Major item switching]
N
key x key
[Medium item switching]
N
key
x
key
[Minor item switching]
[EASY SEARCH +]
[EASY SEARCH --]
[EASY SEARCH +]
[EASY SEARCH --]
N
key: Unit place of mode number
increase.
key: 100th place of
mode number increase.
key: 100th place of
mode number decrease.
key: 10th place of
mode number increase.
key: 10th place of
mode number decrease.
[Adjusted value variation]
[EASY SEARCH +]
[EASY SEARCH --]
key: Increases the
key: Decreases the
[Adjusted value write]
X
key: When adjusted value is
changed: Adjusted value is written. When adjusted value is not changed: That item is adjusted automatically.
adjusted value
adjusted value
3. The optical pick-up moves outward or inward while the > or . key is pressed for several seconds respec­tively.
4. Each test item is assigned with a 3-digit mode number; 100th place is a major item, 10th place is a medium item, and unit place is a minor item.
13
MZ-B100
r
5. Set the mode No. to 011. The display changes a shown below
each time the [DISPLAY] key is pressed.
Address & Adjusted Value Display
LCD display
C68S01
011
address
Jitter Value & Adjusted Value Display
LCD display
0FFJ01
jitter value
Block Error Value & Adjusted Value Display
LCD display
adjusted value
mode number
011
adjusted value
mode number
063B01
011
block error value
ADIP Error Value & Adjusted Value Display
LCD display
adjusted value
mode number
059A01
011
ADIP error value
Item Title Display
LCD display
LrefPw 01
item title
adjusted value
mode number
011
adjusted value
mode number
[Overall Adjustment Mode]
Mode to adjust the servo automatically in all items. Normally, automatic adjustment is executed in this mode at the repair. Adjust the CD first, when performing adjustment.
Configuration of overall adjustment
> key . key
Title
display
N key
protect switch ON
protect switch OFF
x key
x key
x key
x key
CD overall
adjusting
All item
OK
CD overall
adjustment
MO overall
adjusting
MO overall
adjustment
OK
> key
NG item exists or
OK
NG item exists
x key
or
CD overall
adjustment
NG
x key
MO overall adjustment
NG
[Test mode $display check mode%]
For further information, refer to the Section 5 Electrical Adjust­ment. (See page 19)
However in the power mode (mode number 700s), only the power adjustment value is displayed.
Power Supply Adjusted Value
LCD display
AD 85
731
fixed display mode numbe
adjusted value
6. Quit the manual mode, and press mode (display check mode).
14
x key to return to the test
MZ-B100
[Sound Skip Check Result Display Mode]
This set can display and check the error count occurring during record and play.
• Setting method of Sound Skip Check Result Display Mode
1. Setting the test mode. (See page 12)
2. Press the N or [REC] key on the set activates the sound skip
check result display mode where the LCD displays as shown below.
LCD dispaly
P**R**
000
Total of record system error count
Total of play system error count
3. When N key is pressed, the total of error count is displayed
on the LCD, and each time the > key is pressed, the error count descents one by one as shown below. Also, when . key is pressed, the error count ascends by one. If
[REC] key on the set is pressed, the error count during record
is displayed.
P**R**
EIB **
Stat**
Adrs**
BEmp**
######
000
000
000
000
000
000
4. When [REC] key on the set is pressed, the total of error count
is displayed on the LCD, and each time the > key is pressed, the error count descents one by one as shown below. Also, when . key is pressed, the error count ascends by one. If N key is pressed, the error count during play is dis­played.
P**R**
Bovr**
BFul**
Rtry**
######
**
: Sound skip check items counter (hexadecimal)
######
: 6-digit address (hexadecimal) where a sound skipped last
000
000
000
000
000
Error code
Cause of error Description of error
EIB Sound error correction error
Playback
Recording BFul Buffer capacity lowers and data are
Stat Decorder status error
Adrs Cannot access the address
BEmp Buffer becomes empty
BOvr Buffer becomes full and sounds are
dumped
forcibly written
Rtry Retry count over
5. Quit the sound skip check result display mode, and press the x key to return to the test mode (display check mode).
**
: Sound skip check items counter (hexadecimal)
######
: 6-digit address (hexadecimal) where a sound skipped
last
15
MZ-B100
[Self-Diagnosis Display Mode]
This set uses the self-diagnosis system in which if an error oc­curs in recording/playback mode, the error is detected by the model control and power control blocks of the microprocessor and information on the cause is stored as history in EEPROM. By viewing this history in test mode, it helps you to analyze a fault and determine its location. Total recording time has been recorded as optical pick-up using time, and it is compared with the total recording time in the self-diagnosis display mode to find when an error occurred. Clear both total recording time and the time in self-diagnosis display mode, when the optical pick-up was replaced.
1. Setting the test mode. (See page 12)
2. Press the [DISPLAY] key activates the self-diagnosis display
mode where the LCD display as shown below.
LCD dispaly
1st0**
000
history code
** : Self-Diagnosis Data
3. Then, each time > key is pressed, LCD display descends
by one as shown below. Also, the LCD display ascends by one when . key is pressed.
000
1st0**
000
1st1**
000
1st2**
000
N 0**
000
N 1**
000
N 2**
000
N-10**
1
4. Quit the self-diagnosis display mode, and press the
return to the test mode (display check mode).
1
000
N-11**
000
N-12**
000
N-20**
000
N-21**
000
N-22**
000
R ####
x key to
16
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