Sony MX-E501 User Manual

MZ-E501

SERVICE MANUAL

Ver 1.2 2001. 12
With SUPPLEMENT-1

US and foreign patents licensed from Dolby
Laboratories Licensing Corporation

AEP Model

Hong Kong Model

Model Name Using Similar Mechanism MZ-E500

MD Mechanism Type MT-MZE500-174

Optical Pick-up Mechanism Type LCX-4E

Audio playing system

MiniDisc digital audio system

Laser diode properties

Material: GaAlAs
Wavelength: λ = 790 nm
Emission duration: continuous
Laser output: less than 44.6 µW*
* This output is the value measured at a distance of 200 mm from the

objective lens surface on the optical pick-up block with 7 mm aperture.

Revolutions

Approx. 300 rpm to 2,700 rpm

Error correction

ACIRC (Advanced Cross Interleave Reed Solomon Code)

Sampling frequency

44.1 kHz

Coding

ATRAC (Adaptive TRansform Acoustic Coding)
ATRAC3: LP2
ATRAC3: LP4

Modulation system

EFM (Eight to Fourteen Modulation)

Number of channels

2 stereo channels
1 monaural channel

Frequency response

20 to 20,000 Hz ± 3 dB

Wow and Flutter

Below measurable limits

SPECIFICATIONS

Outputs

Headphones/earphones: stereo mini-jack, maximum output level 5 mW +
5 mW, load impedance 16 ohms

Power requirements

Nickel Cadmium rechargeable battery
One NC-6WM (supplied): 1.2V, 600 mAh
One LR6 (size AA) battery (not supplied)
External power jack: Power rating 3V DC
AC power adaptor for the battery charging stand (supplied): AC230~240V,
50Hz

Battery operation time

See “When to replace or recharge the battery”

Dimensions

Approx. 74.5 × 80.5 × 17.9 mm (w/h/d) (3 × 3 1/4× 23/32 in.)
(not including projecting parts and controls)

Mass

Approx. 80 g (2.8 oz) (the player only)

Supplied accessories

Headphones/earphones with a remote control (1)
Battery charging stand (assembly needed)(1)
AC power adaptor*
Rechargeable battery (1)
Rechargeable battery carrying case (1)
Dry battery case (1)
Carrying pouch (1)
AC plug adaptor (1) (world model only)

US and foreign patents licensed from Dolby Laboratories.

Design and specifications are subject to change without notice.

9-873-162-03

2001L1600-1

© 2001.12

PORTABLE MINIDISC PLAYER

Sony Corporation

Personal Audio Company

Published by Sony Engineering Corporation

MZ-E501

TABLE OF CONTENTS

1. SERVICING NOTE···················································· 3

2. GENERAL ·································································· 4

3. DISASSEMBLY

3-1. Case Assy, Holder Assy ·················································· 5
3-2. Mechanism Deck ···························································· 6
3-3. Bracket Assy ··································································· 6
3-4. Main Board ····································································· 7
3-5. Optical Pick-up Assy (LCX-4E)····································· 7

4. TEST MODE ······························································ 8

5. ELECTRICAL ADJUSTMENTS ··························· 12

6. DIAGRAMS

6-1. Block Diagram ······························································ 17
6-2. Printed Wiring Board – Main Section (Side A) – ········· 18
6-3. Printed Wiring Board – Main Section (Side B) – ········· 19
6-4. Schematic Diagram – Main Section (1/3) –·················· 20
6-5. Schematic Diagram – Main Section (2/3) –·················· 21
6-6. Schematic Diagram – Main Section (3/3) –·················· 22
6-7. IC Block Diagrams ······················································· 23
6-8. IC Pin Function Description ·········································25

7. EXPLODED VIEWS

7-1. Main Section ································································· 31
7-2. Mechanism Deck Section ············································· 32

8. ELECTRICAL PARTS LIST ·································· 33

CAUTION

Use of controls or adjustments or performance of
procedures other than those specified herein may result in
hazardous radiation exposure.

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270°C during
repairing.

• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or
unsoldering.

Notes on chip component replacement

• Nev er reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam­aged by heat.

Unleaded solder

Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.

2

SECTION 1

Open/Close detection switch (S809)

SERVICING NOTES

MZ-E501

NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
(LCX-4E)

The laser diode in the optical pick-up block may suffer electrostatic
break-down easily. When handling it, perform soldering bridge to
the laser-tap on the flexible board. Also perform measures against
electrostatic break-down sufficiently before the operation. The
flexible board is easily damaged and should be handled with care.

When repairing this device with the power on, if you remove the
main board, this device stops working.
In this case, you work without the device stopping by fastening the
hook of the Open/Close detection switch (S809).

* Replacement of CXD2671-205GA (IC601) used in this set

requires a special tool.

OPTICAL PICK-UP FLEXIBLE BOARD

laser-tap

3

MZ-E501

LOCATION AND FUNCTION OF CONTROLS

SECTION 2

GENERAL

This section is extracted from
instruction manual.

VOL+/–

>N

.

GROUP

x

X

3 Color Info-LED

PLAYMODE RPT/ENT

DISPLAY SOUND

VOL+

VOL–

1N>

.

x

HOLD

./N>

VOL +/–

GROUP

x

3 Color Info-LED

HOLD

4

r

Disassemble the unit in the order as shown below.

MZ-E501

SECTION 3

DISASSEMBLY

Case assy, Holder assySet

Mechanism deck

Note : Follow the disassembly procedure in the numerical order given.

3-1. CASE ASSY, HOLDER ASSY

1

screws (1.4), MI

3

Move it away

from the projection

2

Bracket assy MAIN board

Optical pick-up assy (LCX-4E)

case assy

1

screws (1.4), MI

hold assy

3

from the projection

case (rear)

Move it away

5

MZ-E501

y

d

3-2. MECHANISM DECK

6

(CN551)

MOTER FLEXIBLE board

4

1

step screw (MD)

mechanism deck

5

OP FLEXIBLE boar

(CN501)

3-3. BRACKET ASSY

3

2

screw (1.7)

4

bracket (L) assy

claw

3

claw

1

screw (1.7)

2

bracket (R) ass

3

claw

6

3-4. MAIN BOARD

g

7

battery case assy

1

screw (1.7)

5

Remove the soldering

2

claw

6

MAIN board

4

ornamental strip

5

Remove the soldering

MZ-E501

3

battery case lid

3-5. OPTICAL PICK-UP ASSY (LCX-4E)

optical pick-up assy (LCX-4E)

1

washer

2

gear (SA)

case (rear)

5

3

screw (MI 1.4)

4

thrust detent sprin

7

MZ-E501

SECTION 4

TEST MODE

4-1. GENERAL

• When entered in the TEST MODE, this set provides the Overall
Adjustment mode which allows CD and MO discs to be auto­matically adjusted. In the Overall Adjustment mode, the system
discriminates between CD and MO discs, performs adjustments
in sequence automatically, and displa ys the faulty location if an y
fault is found. In the Manual mode, selected adjustments can be
performed automatically.

• The attached remote control is used to operate the TEST MODE.
Unless otherwise specified in the text, the key means that on the
remote control.

4-2. SETTING THE TEST MODE

4-2-1. How to set the TEST MODE

To set the TEST MODE, two methods are available.
1 Solder bridge and short TAP601 (TEST) on the main board.

Then turn on the power . Press the x b utton or close the upper
panel.

MAIN BOARD (SIDE B)

Remote control LCD

All on

All off

012 V1.110

Microprocessor
version
display

• Press and hold down X to hold the current display while the key
is being pressed.

4-2-3. How to release the TEST MODE

When method 1 was used:
Turn off the power and open the solder bridge on TAP601 on the
main board.
Note : The solder should be removed clean. The remaining solder

may make a short with the chassis and other part.
When method 2 was used:
Turn off the power.
Note : If electrical adjustment (see page 12) has not been finished

completely, always start in the test mode. (The set cannot

start in normal mode)

TAP601

OPEN : Normal mode
SHORT : Test mode

2 In the normal mode, operate the keys on the set and those on the

remote control rapidly as specified below:
Turn on HOLD switch on the set. Holding down x (STOP)
key on the set, press the keys on the remote control in the
following sequence:

> N t > N t . t . t > N

t . t > N t . t X t X

Note : When you press an incorrect switch by mistake, remove your

hands from the switches and perform all the operations once
again from the very beginning.

4-2-2. Operations when the TEST MODE is set

When the TEST MODE is entered, the system switches to the
display check mode within the TEST MODE. From this mode, the
other Test modes can be accessed.
When the TEST MODE is set, the LCD repeats a cycle of the
following displays:

4-3. TEST MODE STRUCTURE

Test Mode
(Display Check Mode)

+

key

VOL

Manual Mode

x

key

+

key

VOL

–

VOL

key

.

DISPLAY key

DISPLAY key

(Press and hold down about 3 sec)

Terminate key checking or open
the top panel.

–

VOL

or

x

x

>B

x

key

key

key

key

Overall Adjustment Mode

Self-diagnostic Display Mode

key

Sound Skip Check Result Display Mode

Servo Mode

Audio Mode

Power Mode

OP Alignment Mode

Key Check Mode

8

MZ-E501

4-4. MANUAL MODE
4-4-1. Outline of the function

The Manual mode is designed to perform adjustments and
operational checks on the set’s operation according to each
individual function.
Usually, no adjustments are made in this mode.
However, the Manual mode is used to clear the memory before
performing automatic adjustments in the Overall Adjustment mode.

4-4-2. How to set the Manual mode

1. Set the TEST MODE and press VOL+ key to set the Manual mode.
Remote control LCD display

000 Manual

2. During each test, press and hold down > N key or .
key for a while to move the optical pickup on the sled outer or
inner perimeter.

3. Each test item is assigned with a three-digit item number. The
100th place is a major item, 10th place is a middle item, and unit
place is a minor item.

+

key : 100th place of mode number

Change Major
Item

> N

VOL

increase

–

key : 100th place of mode number

VOL

decrease

x

keykey

4. During each test mode, the display is changed from one to
another each time DISPLAY key is pressed.

• Address & Adjusted Value Display
LCD display

011 C68S5E

mode number

adress

• Jitter Value & Adjusted Value Display
LCD display

adjusted value

011 OFEJ5E

mode number

jitter value

• Block Error Value & Adjusted Value Display
LCD display

adjusted value

011 063B5E

block error value

mode number

• ADIP Error Value & Adjusted Value Display
LCD display

adjusted value

Change Middle
Item

> N

key

Change Minor
Item

x

+

key : 10th place of mode number

VOL

increase

–

key : 10th place of mode number

VOL

decrease

key

key : Unit place of mode number

> N

increase

.

key : Unit place of mode number

decrease

+

VOL
VOL

key : Up

–

key : Down

Change Adjustment
Value

Write Adjustment
Value

X

key : When adjusted value is changed :

Adjusted value is written.
When adjusted value is not changed :
That item is adjusted automatically.

011 072A5E

ADIP error value

mode number

• Focus Drive Voltage Value &
Adjusted Value Display

adjusted value

011 000F5E

forcus drive
voltage value

mode number

• Item Title Display
LCD display

adjusted value

011 LrefPw 5 E

item title

mode number

Note: In the Power mode, the item title display is only displayed.

5. To terminate the Manual mode and return to the TEST MODE,
press x key.

4-5. OVERALL ADJUSTMENT MODE

adjusted value

4-5-1. Outline of the function

This mode is designed to adjust the servo system automatically by
going through all the adjustment items.
The power adjustment manual setting is performed in this mode also.
Usually, this mode is used to perform automatic adjustments when
servicing the set.

For further information, refer to section 5. ELECTRICAL
ADJUSTMENTS. (See page 12)

9

MZ-E501

4-6. SELF-DIAGNOSTIC DISPLAY MODE
4-6-1. Outline of the function

The Self-diagnostic system is used in this set. If an error occurs
during playback, this system detects the fault through the
microprocessor’s mechanism and power control blocks and stores
the cause in EEPROM in a history format.
This history, which can be viewed in the TEST MODE, provides
the means of locating the fault in troubleshooting.

4-6-2. Self-diagnostic mode

1. Set the TEST MODE.

2. With all the LCD display segments blinking on the set, press
DISPLAY key and the Self-diagnostic mode is entered.

001 1 Adrs

History code

Error display code

Simplified contents

3. Hereinafter, each time > N key is pressed, the reference
information display changes as follows:

0XX 1 # # # #

0XX N # # # #

0XX N1 # # # #

0XX N2 # # # #

0XX R

• Press . key to go back to the previous display.

• Contents of the history codes

History code number Contents

1 The first error that occurred.

N The last error that occurred.
N-1 The first error from the last one.
N-2 The second error from the last one.

R

T otal recording time ( – – – – is displayed
for MZ-E501)

– – – –

• Description of the error display codes

Contents of fault

No error

Servo system error

TOC error
Power system error

Offset error

4-6-3. Clearing the error display code

After servicing, reset the error display code.

1. Set the TEST MODE.

2. Pressing the DISPLAY key on the remote control activates the
self-diagnosis display mode.

3. To reset the error display code, press X key (2 times)on the
remote control when the code is displayed. (except “R - - - -” )
(All the data on the 1st, N, N-1 and N-2 will be reset)

Display code

00
01
02
03
04
11
12
22
31
32
33
34

No error
Access target address illegally specified
HIGH TEMP
FOCUS ERROR
SPINDLE ERROR
TOC ERROR
READ DATA ERROR
LOWBATT
OFFSET ERROR
FE_ABCD_OFFSET_ERR
TE_OFFSET_ERR
X1_TE_OFFSET_ERR

Meaning of code

Simplified

contents

– – – –

Adrs

Temp

Fcus

Spdl
TOC
Data
LBat

Ofst

ABCD

TE

X1TE

Description

No error
An attempt to access an abnormal address.
HIGH TEMP
Focus off-center.
Abnormal rotation of disc
Faulty TOC contents
Data could not be read at SYNC
Instantaneous interruption detected.
Offset error
FE ABCD Offset error
TE Offset error
X1 TE Offset error

10

MZ-E501

4-7. Sound Skip Check Result Display Mode

This set can display and check the error count occurring during
play.

• Setting method of Sound Skip Check Result Display Mode

1. Setting the test mode.

2. Pressing the > N key activates the sound skip check result
display mode where the LCD displays as shown below.
LCD display

000 P**R##

Total of record system
error count

Total of play system error count

3. When > N key is pressed, the total of error count is
displayed on the LCD, and each time the > N key is pressed,
the error count descents one by one as shown below . Also, when

. key is pressed, the error count ascends one by one.

000 P**R00

000 EIB **

000 Stat**

4-8. KEY CHECK MODE

4-8-1. Outline of the function

This mode is used to check to make sure that each of the keys
(including the slide switch) on the set operates normally .(The 1 kHz
signal is outputted from the L and R channels of head phones)

4-8-2. Setting the Key Check mode

1. Set the TEST MODE. Press and hold down DISPLAY key (for
more than 3 sec) to set the Key Check mode.

LCD display

000 0F

2. When each key on the set and on remote control is pressed, its
name is displayed on the LCD. (The operated position is
displayed for 4 sec after the slide switch is operated. If any other
key is pressed during this display , the LCD switches to its name
display)

Example: When > N key on the set is pressed:
LCD display

000 FF 0F

Example: When > N key on the remote control is pressed:
LCD display

000 Adrs**

000 BEmp**

000 ######

P**R00 : Total of play system error and record system error count
** : Sound skip check items counter (hexadecimal)
##### : 6-digit address (hexadecimal) where a sound skipped last

Error code

Cause of error

Playback

4. Press the x key to terminate the sound skip check result display
mode and to return to the test mode. (Display check mode)

EIB
Stat
Adrs
BEmp

Description of error
Sound error correction error
Decorder status error
Cannot access the address
Buffer becomes empty

000 rPLAY XX

XX: AD v alue of the remote control key (he xadecimal 00 to FF)

3. When all the keys on the set and on the remote control are
considered as OK, the following displays are shown for 2 sec.
(The key pressed to enter the Key Check mode has been check ed
even if it is not pressed in this mode)

Example: When the keys on the set are considered as OK:
LCD display

888 SET OK OF

Example: When the keys on the remote control are considered

as OK:

LCD display

888 RMC OK OX

4. When all the key have been checked or when the top panel is
opened during this checking, the system terminates the Key
Check mode and return to the TEST MODE.

11

MZ-E501

SECTION 5

ELECTRICAL ADJUSTMENTS

5-1. GENERAL

In this set, CD and MO discs can be automatically adjusted by setting
the Overall Adjustment mode within the TEST MODE,
Before performing these automatic adjustments, it is necessary to
clear the memory and adjust the power in the Manual mode.

5-2. NOTES FOR ADJUSTMENT

5-2-1. Jigs

• CD disc TDYS-1 (part code: 4-963-646-01)

• MO disc PTDM-1 (part code: J-2501-054-A)

or commercially available MO disc (recorded)

• Digital voltmeter

5-2-2. Adjustment sequence

The adjustments should be always performed in the following
sequence:

1 Reset NV (Clear the memory)

2 Manual power adjustments

3 Electrical offset adjustments

(Do not enter the disc)

4 Overall CD adjustments

5 Overall MO adjustments

Manual mode

Overall adjustment mode

5-4. MANUAL POWER ADJUSTMENTS

5-4-1. Adjustment sequence

The adjustments should be always performed in the following
sequence:

1 Vc PWM Duty (L) adjustment (item No.:762)

r

2 Vc PWM Duty (H) adjustment (item No.:763)

r

3 VLL PWM Duty adjustment (item No.:764)

5-4-2. Vc PWM Duty (L) adjustment method

1. Confirm that the power voltage is at 1.5 V DC.

2. Set the TEST MODE.

3. To set the overall adjustment mode, press VOL– key.
LCD display

000 Assy 00

4. Press PLAY MODE key, and item No. will change to 762.
LCD display

762 VclPWM XX

6 RESUME clear

5-2-3. Power

The power is supplied with 1.5 V DC from the battery case.

Manual mode

5-3. RESET NV

5-3-1. How to reset NV

1. Set the TEST MODE.

2. Set the Manual mode and set the item No. 021, Reset NV.
LCD display

021 Res NV CC

3. Press X key on the remote control.
LCD display

021 Res OK?

4. Press X key on the remote control again.
LCD display

021 Res ***

5. Connect a digital voltmeter to TP901 (VC) on the main board
and adjust VOL+ key (voltage up) and VOL– key (voltage
down) on the remote control.

Adjustment value:2.36V
Standard value:2.35 to 2.365V

MAIN BOARD (SIDE B)

digital voltmeter

TP901 (VC)

6. Press X key to write the adjustment value. Item No.will change
to 763.

After reset is completed.

021 Reset!

5. Press x key to terminate the Manual mode and return to the
TEST MODE.

12

MZ-E501

5-4-3. Vc PWM Duty (H) adjustment method

1. Set the Manual mode and set the item No. to 763.
LCD display

763 VchPWM XX

2. Connect a digital voltmeter to TP901(VC) on the main board
and adjust VOL+ key and VOL– key on the remote control.

Adjustment value:2.75V
Standard value:2.74 to 2.755V

MAIN BOARD (SIDE B)

digital voltmeter

TP901 (VC)

3. Press X key to write the adjustment value.
The adjustment completion display appears as follows.

LCD display

000 ADJ OK

5-4-5.Electrical offset adjustment method
Note: Doing adjustment by the state that a disc does not enter.

1. Confirm the power voltage is 1.5V.

2. Set to the test mode.

3. Press the VOL– key activates the overall adjustment mode.
LCD display

000 Assy11

4. Press the DISPLAY key.
LCD display

030 Ofst**

5. If result of electrical offset adjustment is OK,the following display
appears.
LCD display

030 OfstOK

3. Press X key to write the adjustment value.(Item No. will change
to 764)

5-4-4. VLL PWM Duty adjustment method

1. Set the Manual mode and set the item No. to 764.
LCD display

764 Vl PWM XX

2. Connect a digital voltmeter to TP904 (VL) on the main board
and adjust VOL+ key and VOL– key on the remote control.

Adjustment value:2.23V
Standard value:2.22 to 2.235V

MAIN BOARD (SIDE B)

digital voltmeter

TP904 (VL)

5-5. OVERALL ADJUSTMENT MODE

5-5-1. Overall adjustment mode structure

TEST MODE
(Display Check Mode)

VOL – key

Overall Adjustment
Title Display(ASSY**)

.

key

> N

key

Note: The overall adjustments should be always performed in the

sequence of CD t MO adjustments.

5-5-2. Overall CD and MO adjustment method

1. Set the TEST MODE and press VOL– key to set the Overall
Adjustment mode.

LCD display

CD overall
Adjustment

> N

MO overall
Adjustment

x

key

x

key

key

000 Assy11

2. Insert CD disc in the set, and press . key to set the Overall
CD Adjustment mode.
Automatic adjustments are made.

LCD display

XXX CD RUN

XXX: Item No. for which an adjustment is being executed.

13

MZ-E501

3. If NG in the overall CD adjustments, return to Reset NV and
perform from the electrical offset adjustment again.

LCD display

000 XXX NG

XXX: NG item No.

4. If OK through the overall CD adjustments, then perform overall
MO adjustments.

LCD display

XXX CD OK

5. Insert MO disc in the set, and press > N key to set the
Overall MO Adjustment mode. Automatic adjustments are made.

LCD display

XXX MO RUN

XXX: Item No. for which an adjustment is being executed.

6. If NG in the overall MO adjustments, return to Reset NV and
perform the adjustment again.

LCD display

000 XXX NG

XXX: NG item No.

7. If OK through the overall MO adjustments, press x key to
return to the TEST MODE and terminate the Overall Adjustment
mode.

LCD display

000 MO OK

5-5-3.Resume clear method

1. Setting the test mode.

2. Set the Manual mode and set the item No.043(RESUME Clear).
LCD display

5-5-4. Overall CD and MO adjustment items

1. Overall offset adjustment

Item No.

GRV setting • Sarvo OFF • Head UP

030

Laser ON/OFF electrical offset difference

035

measurement

Completed

2. Overall CD adjustment items

Item No.

VC,VR power voltage High/Low selection

761

HPIT setting • Sarvo OFF

300

SLED move to inside

561

SLED move to outside

562

High reflection CD electrical offset adjustment

Laser ON • Focus UP • VC correction ALFA offset

312

adjustment
IJ offset adjustment

313

FE offset adjustment

314

Focus servo ON

320

TE offset adjustment 1

324

TE gain adjustment

321

TWPP gain adjustment

328

TE offset adjustment 1

324

TE offset adjustment 2

332

Tracking servo ON

330

ABCD gain adjustment

336

KF gain correction

337

RF gain adjustment

338

FCS gain adjustment

344

TRK gain adjustment

345

Two-axis sensitivity adjustment (inside)

521

Two-axis sensitivity adjustment (outside)

522

Focus bias adjustment

341

HPIT setting • servo OFF

300

Completed

Contents

Contents

HPIT adjustment

043 Resume CC

3. Press the X key.
LCD display

043 Res ***

LCD display

043 Res Clr

14

After reset is completed

3. Overall MO adjustment items

Item No.

VC,VR power voltage High/Low selection

761

R_GV setting

100

Low reflect MO offset adjustment

Laser ON • Focus UP • VC correction ALFA offset

112

adjustment
IJ offset adjustment

113

FE offset adjustment

114

Wpp denominator adjustment

118

LPIT adjustmet

LPIT setting • servo OFF

200

SLED move to inside

561

Focus servo ON

220

TE offset adjustment 1

224

TE gain adjustment

221

TE offset adjustment 1

224

TE offset adjustment 2

232

Contents

MZ-E501

Item No.

230
236
237
238
244
245

100
562
120
122
121
122
123
124
130
131
136
137
139
144
145
134
131
132
149
138
100

Contents
Tracking servo ON
ABCD gain adjustment
KF gain adjustment
RF gain adjustment
FCS gain adjustment
TRK gain adjustment

READ GRV adjustment 1
R GRV setting • servo OFF
SLED move to outside
Focus servo OFF
TON offset adjustment
TE gain adjustment
TON offset adjustment
TEIN offset adjustment
TWPP offset adjustment
Tracking servo ON
TWPP offset adjustment
ABCD gain adjustment
KF gain adjustment
ADIP BPF fo adjustment
FCS gain adjustment
TRK gain adjustment
TWPP gain adjustment
TWPP offset adjustment 1
TWPP offset adjustment 2
TWPP OP offset adjustment
RF gain adjustment
R GRV setting • Servo OFF

15

MZ-E501

SECTION 6
DIAGRAMS

Note on Printed Wiring Boards: MAIN SECTION

• X : parts extracted from the component side.

• : Pattern from the side which enables seeing.

(The other layers' patterns are not indicated.)
Caution:

Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.

• Main boards is four-layer pritnted board.
However, the patterns of layer 2 and 3 have not been
included in this diagrams.

* Replacement of IC601 used in this set requires a special

tool.

• Lead Layouts

Lead layout of
conventional IC

Note on Schematic Diagram: MAIN SECTION

• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in Ω and 1/
specified.

f

•

Note: The components identified by mark 0 or dotted

: internal component.

line with mark 0 are critical for safety.
Replace only with part number specified.

CSP (chip size package)

4

W or less unless otherwise

surface

r

WAVEFORMS

IC501 1 TE

1

IC501 ed (RF OUT)

2

IC501 rs (FE)

3

X601 (OSCO)

4

22.1 ns

Approx.

12 mVp-p

Approx.

1.2 Vp-p

Approx.

10 mVp-p

2.7 V

• : B+ Line.

• Power voltage is dc 1.5V and fed with regulated dc power

supply from battery terminal.

• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAY

• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc­tion tolerances.

• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc­tion tolerances.

• Circled numbers refer to waveforms.

• Signal path.

F : Audio (Analog)
J : Audio (Digital)

* Replacement of IC601 used in this set requires a special

tool.

• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.

16

6-1. BLOCK DIAGRAM

MZ-E501

Jx Jy

Jx

Ix

Ix Iy

a

cd

b

F

PD

OPTICAL PICK-UP BLOCK

Iy

Ix

Jx

Jy

A

B

C

D

MINIDISC

(LCX-4E)

LD

S0
S1

AVCC

TRACKING

COIL

FOCUS

COIL

MINIDISC

MECHANISM BLOCK

M902

(SLED)

M901

(SPINDLE)

LD-A

LD-K

AVCC

MAIN BOARD

CN501

VREF

6

Iy

9

Ix

10

Jx

14

Jy

15

A

16

B

17

C

7

D

8

MON

18

VIF

5

LASER

AUTO POWER

12

CONTROL

Q501

13

S0

S1

SLED1+

SLED1-

SLED2+

SLED2-

CLVU

CLVV

CLVW

11
19

20

2

1

4

3

5

7

6
8

1

2

3

4

VL

TRK+

TRK-

FCS+

FCS-

CN551

UNREG

RF AMP,FOCUS/TRACKING ERROR AMP

IC501

VREF

4

Iy

8

Ix

9

Jx

10
11
12
14

5
6

13

7

18

22
40

20

RF AMP,

Jy

FOCUS

A

ERROR,

B

TRACKING

C

ERROR

D

A-C

TPP/WPP

D-C

PD-I

DVDD
AVCC

PD-O

APC

FOCUS/TRACKING COIL DRIVE,

SPINDLE/SLED MOTOR DRIVE

SERIAL

S-MONITOR

PEAK

/BOTM

I/F

RF OUT

PEAK

BOTM

ABCD

ADIP IN

ADIP

PD-NI

OFTRK

XRST
SBUS

SCK

S MON

33

29
28

41

FE

42

TE

1
44

21

19
31

VC

26

25
23
24

43

IC551

42
41

40
39

33

PRE

32 24

DRIVER

35

10

7 19

PRE

DRIVER

8

14

PRE

15

DRIVER

12

29

PRE

31

DRIVER

54
51

52

53

48
45

PRE

46

DRIVER

49
44

HI-BRIDGE

CONTROL

HI-BRIDGE

CONTROL

HI-BRIDGE

CONTROL

HI-BRIDGE

CONTROL

3 PHASE

CONTROL

BIAS

HEADPHONE AMP

IC301

29

RFI

37

44

PEAK
BOTM

45

ABCD

46

FE

47

TE

56

ADFG

74

APCREF

78
49

VC

12

VREF MON

217

OFTRK

221

XRF RST
SSB DATA

160
161

SSB CLK

9

S MON

194

PD S0

195

EEPROM

PDS1

IC801

XCS

4DI3DO2SK1

38

37

25

TAP601
(TEST)

18

16
17
20

26
27

1

56

55

2
3
4
5
6

219

XCS NV

181

SCK0
S00

180

SI0

179

SLD1MON

100

SLD2MON

101

TFDR

81

TRDR

88

XTEST

3

FFDR

82

FRDR

80

98

SLDV
SRDR

96

SFDR

97

SLDW

99

SLCW

102

XCS NV
SI0

93

SPCU
SCK0

94

SPCV
S00

SPCW

95

90

SPD W

89

SPD V

87

SPD U

88

SPDL PWM

220

XRST MTR DRV

DIGITAL SIGNAL PROCESSOR,

DIGITAL SERVO SIGNAL PROCESSOR,

EFM/ACIRC ENCODER/DECODER,

SHOCK PROOF MEMORY CONTROLLER,

16M BIT D-RAM, SYSTEM CONTROL

IC601

AOUT L

AOUT R

BEEP

XHP STB

MUTE

RMC DTCK

REC KEY

SET KEY2

TSB MST VDD

OPR LED R PWM
OPR LED G PWM

HOLD SW

XAVLS

SET KEY 1

WK DET

HALF LOCK SW

DIFVDD0
DIFVDD1

TSB SLV VDD

MIFVDD0
MIFVDD1
MIFVDD2

TSB SLV CHK

MIFVDD3

OSCI

OSCO

RMC KEY

VB MON

VC PWM
VL PWM

FS4

VLON

SLEEP

FFCLR

XRST

AVDD

AVD1
AVD2

VDI00
VDI01
VDI02

MCU VDD0

DSP VDD0
DSP VDD1

MCU VDD1

DSP VDD2

DSP VDD3
MCU VDD2
MCU VDD3

30

UNREG

183

240
218

142

RMC VDD

18
14

141

167
163

227
224

13
17

19

VIF

76
103
143

154
176
196

210

241

24

25

20

10

165
164

86
234
235
236

8

21

23
119
139
151
231

6
59
73
84
91

113
153
222

UNREG

X601

45.1584MHz

AVDD

DVDD

22 2

RCH

21

IN B

+B

1

VCC

20

VIF

15
18

STB
MUTE

17

S809

(OPEN/CLOSE

DETECT)

DVDD

• Signal path

J : Audio (Digital)
F : Audio (Analog)

BEEP

GROUP

POWER SUPPLY

VD

5

XWK4

2

XWK1

7

VRMC

4

XWK3

6

VSTB

3

XWK2

26

INM1
RF1

27
23

RF2

22

INM2

56

CLK

1

VLON

55

SLEEP

54

FFCLR

46

XRST

36

VC

34

VC

45

VC2

OUT B

BEEP OUT A

BEEP OUT B

VREF IN

S806

IC901

VC OUT

S805

VOL

VLO

VCO

VIF

VA

VG

LG

VL
VL

VB

4

RCH

24
23

REFERENCE

VOLTAGE

13

SWITCHING

Q301

D801

(INFO)

LED SWITCH

ON

OFF

S803

S804

.

VOL

-

+

-

VL

1044

VC

35

VIF

42

AVDD

41

19

D903

18

L906

9

11

16

L2
L2

12

50

32

L1

28

L1

33

D902

L902

L901

D901

Q801

>

VDD

S802

S808
HOLD

N

VG

UNREG

RCH

RGND

RMC

VDD

S801

x

LCH

KEY

DATA

J301

i

RECHAGEABLE

BATTERY
NC-6WM

1PC, 1.2V 600mAh

DRY BATTERY

SIZE "AA"

(IEC DESIGNATION LR6)

1PC, 1.5V

• RCH is omitted due to same as LCH

1717

MZ-E501

6-2. PRINTED WIRING BOARD – MAIN SECTION (SIDE A) –

A

B

C

12

MAIN BOARD

345678910

(SIDE A)

E

*

IC 601

CSP (Chip Size Package)

S801

x

S806

GROUP

IC 301

• Semiconductor

Location

Ref. No. Location

D101 C-9
D201 C-10
D801 E-7
D855 D-10
D902 F-9
D903 F-10

IC301 B-9
IC501 F-4
IC601 B-4
IC901 E-9

Q301 A-8
Q501 F-3

D

DRY BATTERY

SIZE "AA"

(IEC DESIGNATION LR6)

E

1PC, 1.5V

F

G

S803

.

OFF

S808
HOLD

ON

S804
VOL–

IC 901

(INFO)

11

S805

+

VOL

E

IC 501

S802

>N

(11)

1-681-868-

11

(11)

1818

6-3. PRINTED WIRING BOARD – MAIN SECTION (SIDE B) –

MZ-E501

A

B

C

12

MAIN BOARD

J301

COM

R

RGND

R-KEY

345678910

TP904

(VL)

TO
OPTICAL
PICK-UP

BLOCK

(LCX-4E)

C609

TAP601

(TEST)

IC 801

• Semiconductor

Location

Ref. No. Location

D901 E-2

IC551 F-5
IC801 B-9

Q801 C-3

TO MOTOR FLEXIBLE BOARD

(M901 : SPINDLE MOTOR)

(SIDE B)

L

(M902 : SLED MOTOR)

D

E

F

G

S809

(OPEN/CLOSE

DETECT SWITCH)

R-DATA

RVDD

TP901

(VC)

IC 551

1-681-868-

11

(11)

RECHARGEABLE BATTERY

NC-6WM

1PC, 1.2V 600mAh

1919

MZ-E501

6-4. SCHEMATIC DIAGRAM – MAIN SECTION (1/3) –

• See page 16 for Waveforms. • See page 25, 26 for IC Pin Function Description.

OPR_LED_G_H
OPR_LED_G_L

OPR_LED_R_H
OPR_LED_R_L

TAP602

2020

MZ-E501

6-5. SCHEMATIC DIAGRAM – MAIN SECTION (2/3) –

• See page 23, 24 for IC Block Diagrams.

C956

IC B/D

IC B/D

0.1

2121

MZ-E501

6-6. SCHEMATIC DIAGRAM – MAIN SECTION (3/3) –

• See page 23 for IC Block Diagrams.

(INFO)

IC B/D

2222

6-7. IC BLOCK DIAGRAMS

IC301 TA2131FL (EL)

STB

18 17 16 15 14 13

PW
SW

19

TC MT

20

VCC

INR

21

INL

22

MUTE

MTSWBST

SW

BST SW

ADD

BEEP

BEEP IN

GND

V REF

BST1

VREF IN

12

11

10

9

MZ-E501

VREF

LPF1

BST NF1

LPF2

IC551 SC111257FCR2

42 41

PGNDW

43

WO

44

VMVW

45

VO

46

PGNDUV

47

UO

48

VMU

49

GND2

50

CPW1

51

CPAIP

CPAIM

VC VG

PRE DRIVER

BEEP

OUTB

BEEP

OUTA

PW

23

A

PW

B

BST2

8

7

BST NF2

BST OUT

24

BST

AGC

654321

+B

CPBIP

40

39 38 37 36 35

OUTL

CPBIM

PWR

GND

CPAO

OUTR

CPB0

DET

VM3

RO3

PGND3

34 33 32 31 30 29

VC VG

PRE DRIVER PRE DRIVER

VC VC

H-BRIDGE

CONTROL

AGC IN

FO3

VM34

RO4

PGND4

H-BRIDGE
CONTROL

FO4

VC VG

VM4

28

27

R14

26

F14

R13

25

24

F13

VG

VG

23

VC

VC

22

21

GND1

CPV1

CPU1

COM

CPWO

CPVO

52

53

VC VC

54

55

3 PHASE

56

1

CPUO

CONTROL

2

3 4

V1

W1

U1

5 6

PWM

VC

BIAS

OE

H-BRIDGE
CONTROL

VC VG

PRE DRIVER PRE DRIVER

7

8

9 10

RO1

VM1

PGND1

FO1

11

VC

VM12

H-BRIDGE
CONTROL

VG

12

RO2

13

PGND2

14

FO2

PWM24

20

F11

19

R11

18

F12

17

R12

16

VM2

15

23

MZ-E501

IC901 XPC18A32FCR2

NC

43

VD

44

VC2

45

46

XRST

CRST

47

48

RSTREF

49

VREF

VB

50

GND

51

CLKSEL

52

VAIFON

53

FFCLR

54

SLEEP

55

CLK

56

VIF

VA

VAFB

42 41

VC

VC

40

VDFB

39 38 37 36 35

SERIAL PASS

REGULATOR VA

SERIAL PASS

REGULATOR VD

SERIAL PASS

REGULATOR VIF

VC

VC

BANDGAP

REFERENCE

VSTB VC VB

CONTROL

XRST (INT)

VIFFB

VSTB

GND

VC VB

VC

VCO

34 33 32 31 30 29

VG

POWER

SWITCH 1

VC

VC

VCOUT

VG

VG

PWER

SWITCH 2

L1

STEP-UP

PRE DRIVEER

START-UP

NC

STEP-UP

PRE DRIVEER

PWM

STEP-UP

DC/DC

CONVERTOR

STEP-UP

PRE DRIVEER

PGND1

VG

VC

VCVBVBVG

VC

VG

VG

PGND1

VG

L1

28

27

RF1

INM1

26

DTC1

25

DTC2

24

RF2

23

INM2

22

PWM1

21

PWM2

20

VG

19

18

LG

PGND2

17

L2

16

NC

15

1

VLON

2

XWK1

3 4

XWK2

XWK3

5

XWK4

6

VSTV

7

VRMC

8

GND

9 10

VL

VLO

12

13

PGND2

14

PGND2

11

L2

VL

24

6-8. IC PIN FUNCTION DESCRIPTION

• IC501 SN761057DBT (RF AMP, FOCUS/TRACKING ERROR AMP)

Pin No. Pin Name I/O Description

1 TE O Tracking error signal output to the system controller (IC601)
2 REXT I Connect terminal to the external resistor for ADIP amp control
3 WPPLPF I Connect terminal to the external capacitor for TPP/WPP low-pass filter
4 VREF O Reference voltage output terminal (+1.1V)
5 C I Signal (C) input from the optical pickup detector
6 D I Signal (D) input from the optical pickup detector
7 D-C I Signal (D) input from the optical pickup detector (AC input)
8 IY I I-V converted RF signal (IY) input from the optical pickup detector

9 IX I I-V converted RF signal (IX) input from the optical pickup detector
10 JX I I-V converted RF signal (JX) input from the optical pickup detector
11 JY I I-V converted RF signal (JY) input from the optical pickup detector
12 A I Signal (A) input from the optical pickup detector
13 A-C I Signal (A) input from the optical pickup detector (AC input)
14 B I Signal (B) input from the optical pickup detector
15 TON-C I Connect terminal to the external capacitor for TON hold

16 CIG I

17 CDN I

18 PD-I I Light amount monitor input terminal (invert input)
19 PD-NI I Light amount monitor input terminal (non-invert input)
20 PD-O O Light amount monitor output terminal
21 ADIP O ADIP duplex FM signal (66.15kHz ± 3kHz) output to the system controller (IC601)
22 DVDD I Power supply terminal (+1.9V) (digital system)
23 SBUS I/O SSB serial data input/output with the system controller (IC601)
24 SCK I SSB serial clock signal input from the system controller (IC601)
25 XRST I Reset signal input from the system controller (IC601) “L”: reset
26 OFTRK I Off track signal input from the system controller (IC601)
27 DGND I Ground terminal (digital system)

28 BOTM O

29 PEAK O

30 VREF I Connect terminal to the external capacitor for the internal reference voltage
31 VC O Middle point voltage (+1.2V) generation output terminal
32 CCSL2 I Connect terminal to the external capacitor for TPP/WPP low-pass filter (not used in this set)
33 RF OUT O Playback EFM RF signal output to the system controller (IC601)
34 AGND I Ground terminal (analog system)

35~37 EQ, LP, PS I Connect terminal to the external capacitor for the RF equalizer

38 AVCC I Power supply terminal (analog system) (+2.2V)

39, 40 OFC2, OFC-1 I Connect terminal to the external capacitor for RF AC coupling

41 ABCD O Light amount signal (ABCD) output to the system controller (IC601)
42 FE O Focus error signal output to the system controller (IC601)
43 S-MON O Servo signal monitor output to the system controller (IC601)
44 ADIP-IN I ADIP duplex FM signal (66.15kHz ± 3kHz) input terminal, 3 times speed

Connect terminal to the external capacitor for the low-pass filter of NPP divider
denominator (Not used in this set)

Connect terminal to the external capacitor for the low-pass filter of CSL divider
denominator (Not used in this set)

Bottom hold signal output of the light amount signal (RF/ABCD) to the system controller
(IC 601)

Peak hold signal output of the light amount signal (RF/ABCD) to the system controller
(IC 601)

MZ-E501

25

MZ-E501

• IC601 CXD2671-205GA (SYSTEM CONTROL)

Pin No.

1
2
3
4
5
6
7
8

9
10
11
12 VREF MON I Clear reference voltage monitor
13

14
15 VL MON I VL voltage monitor
16
17
18
19
20
21

22 AVSS

23 VDIOSC
24
25
26
27
28
29
30
31
32
33

34 ASYI I Playback EFM comparison slice level input

35
36
37
38

39 PCO O Phase comparison output for the playback EFM system master PLL

40
41

42 FILO O Filter output for the playback EFM system master PLL

43 CLTV I Internal VCO control voltage input for the playback EFM system master PLL
44 PEAK

45 BOTM
46 ABCD I Light amount signal input

Pin Name

OPR_LED_G_H
OPR_LED_G_L

XTEST
OPR_LED_R_H
OPR_LED_R_L

MCUVDD0

MIFVSS3

XRST

S MON

VB MON

SET KEY 1
SET KEY 2

HIDC MON

WK DET

REC KEY

HALF LOCK SW

RMC KEY

AVDD

OSCI

OSCO
VSIOSC
DAVDD

VREFL Built-in DAC VREF (L-ch)
AOUTL
AOUTR

VREFR
DA VSS

ASYO

AVD1

BIAS

RFI

AVS1

PDO
FILI

I/O Description

O

High intensity green LED control (open)

O

Low intensity green LED control (open)

I

Input terminal for the test mode detection

O

High intensity red LED control (open)

O

Low intensity red LED control (open)

—

Power supply (for microcomputer block)

—

Ground (for microcomputer I/F)

I

System reset terminal

I

Servo signal monitor

I

Voltage monitor of UNREG power supply

I

Not used (connected to ground)CHG MON

I

Set key detection 1
Not used (connected to RMC VDD)

I

I

Not used (connected to ground)

I

Set KEY WAKE detection

I

Not used (connected to RMC VDD)

I

Signal input for OPEN SW detection

I

Remote control key detection

—

Power supply (for the analog circuit block)

—

Ground (for the analog circuit block)

—

Power supply (for OSC cell)

I

Input to the X’tal oscillator circuit

O

Output from the X’tal oscillator circuit

—

Ground (for OSC cell)

—

Built-in DAC VCC

—

O

Built-in DAC (L-ch) output

O

Built-in DAC (R-ch) output

I

Built-in DAC VREF (R-ch)

—

Ground (for the built-in DAC)

O

Playback EFM duplex signal output

—

AVDD

I

Bias input for the playback EFM comparison

I

Playback EFM RF signal input

—

AVSS

O

Phase comparison output for the analog PLL

I

Filter input for the playback EFM system master PLL

I

Peak hold signal input of the light amount signal

I

Bottom hold signal input of the light amount signal

26

MZ-E501

Pin No.

47 FE I Focus error signal input
48 AUX1 I Support signal input (A/D input)
49 VC I Middle point voltage input
50 ADIO O Not used (open)
51 ADRT I A/D converter the upper limit voltage input
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86

87

88

89
90

Pin Name

AVD2

AVS2

ADRB

SE
TE

DCHG

APC

DSPVDD0

DSPVSS0

XTSL

DIN1

DOUT
PWMLP O Not used (open)
PWMLN
PWMRP O Not used (open)

DADT/PWMRN O Not used (open)

ADDT

LRCK O Not used (open)

XBCK O Not used (open)

FS256

MVCI

DSPVDD1

ADFG

F0CNT

DIFVDD0

DIFVSS0

APCREF O

LDDR O Not used (open)

TRDR O Tracking servo drive PWM signal output (–)

TFDR O Tracking servo drive PWM signal output (+)
FFDR O Focus servo drive PWM signal output (–)

FRDR O Focus servo drive PWM signal output (+)

MCUVDD1

FGIN I Not used (open)

FS4 O 176.4kHz clock signal output

SPRD/SPDU/

RTG0

SPFD/SPVS/

PWM3

SPDV/RTG1 O Brushless spindle motor 3-phase drive logic output (V)/RTG output 1

SPDW/RTG2 O Brushless spindle motor 3-phase drive logic output (W)/RTG output 2

I/O Description

—

AVDD

—

AVSS

I

A/D converter the lower limit voltage input

I

Sled error signal input

I

Tracking error signal input

—

Connecting analog power supply of the low impedance

I

Error signal input for the laser digital APC

—

Power supply (for DSP block)

—

Ground (for DSP block)
X’tal oscillation frequency selection

I
I

Not used (connected to ground)

O

Not used (open)

O

Not used (open)

I

Not used (connected to ground)

O

Not used (open)

I

Not used (connected to ground)

—

Power supply (for DSP block)

I

ADIP duplex FM signal (20.05±1KHz) input

O

Not used (open)

—

Power supply (for DSP I/F)

—

Ground (for DSP I/F)
Output to the reference PWM for the laser APC

—

Power supply (for the microcomputer block)

Spindle servo drive output (PWM– or inertia)/Brushless spindle motor 3-phase drive logic

O

output (U)/RTG output 0

Spindle servo drive output (PWM+ or PWM absolute value)/Brushless spindle motor absolute

O

value PWM output/PWM3

27

MZ-E501

Pin No.

91
92
93 SPCU I Brushless spindle motor drive comparison signal input (U)
94 SPCV I Brushless spindle motor drive comparison signal input (V)
95 SPCW I Brushless spindle motor drive comparison signal input (W)
96 SRDR/SL1F O Sled servo drive PWM signal output (–)
97 SFDR/SLVF O Sled servo drive PWM signal output (+)
98 SLDV O

99 SLDW O
100 SLCU I Brushless sled motor 3-phase drive comparate input (U)/2-phase drive comparate input (1)
101 SLCV I Brushless sled motor 3-phase drive comparate input (V)/2-phase drive comparate input (2)
102 SLCW I Brushless sled motor 3-phase drive comparate input (W)/2-phase comparate output (2–)
103 DIFVDD1
104 DIFVSS1
105 EFMO O Not used (open)
106 MNT0 O DSP monitor output (0)
107 MNT1 O DSP monitor output (1)
108 MNT2 O DSP monitor output (2)
109 MNT3 O DSP monitor output (3)
110 SENSE O Not used (open)
111
112 RECP O Not used (open)
113 DSPVDD3

114 to

117
118 DRAMVSS0
119 DRAMVDD0

120 to

138
139 DRAMVDD1
140 DRAMVSS1
141 TSB MST VDD
142 RMC DTCK I/O TSB master data input/output
143 TSB SLV VDD
144 TSB SLVI I TSB slave signal input
145 TSB SLVO O Not used (open)
146 TDI I Data input terminal for JTAG
147 TMS I Test mode control input terminal for JTAG
148 TCK I Clock input terminal for JTAG
149 XTRST I Reset input terminal for JTAG
150 TDO O Data output terminal for JTAG
151 JTAGVDD
152 JTAGVSS
153 MCUVDD2
154 MIFVDD0
155 MIFVSS0

Pin Name

DSPVDD2

DSPVSS1

TX O

NC

NC — Not used (open)

I/O Description

—

Power supply (for DSP block)

—

Ground (for DSP block)

Brushless sled motor 3-phase logic output (V)/2-phase drive logic output (1–)
Brushless sled motor 3-phase drive logic output (W)/2-phase drive logic output (2+)

—

Power supply (for DSP I/F)

—

Ground (for DSP I/F)

Not used (open)

—

Power supply (for DSP block)

—

Not used (open)

—

Ground (for the external D-RAM)

—

Power supply (for the external D-RAM)

—

Power supply (for the external D-RAM)

—

Ground (for the external D-RAM)

—

Power supply (for TSB master communication)

—

I/F power supply (for TSB slave communication)

—

Power supply terminal for JTAG

—

Ground terminal for JTAG

—

Power supply (for the microcomputer block)

—

Power supply (for the microcomputer I/F block)

—

Ground (for the microcomputer I/F block)

28

MZ-E501

Ver 1.2 2001.12

Pin No.

156, 157 TEST1, TEST0 I Terminal 1, 0 for the main test

158 EVA I EVA/FLASH chip discrimination terminal
159 OPR LED O Operation LED control (Not used in this set)
160 SSB DATA I/O Input/output of SSB serial data
161 SSB CLK — SSB serial clock
162 MCUVSS0
163 OPR_LED_R_PWM O Operation LED (R) control PWM
164 VL PWM —
165 VC PWM — PWM for the system power supply voltage control

166
167

168
169 CLK SEL O Not used (open)

170

171 GND SW O Not used (open)
172 SET CODE0 O Set code 0
173 SET CODE1 O Set code 1
174 SET CODE2 O
175 SET CODE3 O
176 MIFVDD1
177 MIFVSS1
178 AOUT SEL O HP/LINE changeover signal output Not used (open)
179 SI0
180 SO0 O

181 SCK0 O
182 XGUM ON I
183 BEEP O Beep sound output
184 NC
185 VD. SEL O

186 XMUTE O
187 LCD_RST_AUX O

188-189 NC O Not used (open)

190 X PATCH I
191 OPT DET I Not used (open)

192 XJACK DET I Not used (open)
193 XMIC DET I Not used (open)

194, 195 PD S0, PD S1 O PD IC mode changeover 0, 1

196 MIFVDD2

197 to

199

200, 201 HD CON 1, 2 O Not used (open)

202 NC O Not used (open)

203 XCS ADA O Not used (open)

204 XPD ADA O Not used (open)
205 XCS LCD O Not used (open)

Pin Name

SPDL_AUX_PWM

OPR_LED_G_PWM

NC O Not used (open)

OPEN CLOSE

SW

MODE1 to 3 O

I/O Description

—

Ground (for the microcomputer block)

PWM for the laser power supply voltage control

O Spindle auxiliary control PWM
O Operation LED (G) control PWM

Not used (open)

I

Set code 2
Set code 3

—

Power supply (for the microcomputer I/F block)

—

Ground (for the microcomputer I/F block)

I

Serial data input (CH0)
Serial data output (CH0)
Serial clock signal output (CH0)
Not used (open)

—

Not used (open)
Not used (open)
Not used (open)
Not used (open)

Not used (connected to ground)

—

Power supply (for the microcomputer I/F block)

Not used (open)

29

MZ-E501

Pin No.

206 LCD STB O Not used (open)
207 LCD RST O Not used (open)
208 REC LED O Not used (open)
209 LD ON O Not used (open)
210 TSB SLV CHK I TSB slave check
211
212

213 MCUVSS1
214 CAV CLV SW O Not used (open)
215 XOPT CTL O Not used (open)
216 CS RTC O Not used (open)
217 OFTRK I Off track signal input
218 MUTE O Analog mute “H”: muting ON
219 XCS NV O NV RAM chip select

220

221 XRF RST O TIARA reset
222 MCUVDD3
223 SPDL MON I Spindle monitor

224 XAVLS I AVLS SW detection

225, 226

227 XHOLD SW I HOLD switch detection
228 SYNC REC I Not used (open)
229 TSB_SSB_CTL O TSB/SSB switching
230 PROTECT I
231 FLASHVDD
232 FLASHVSS
233 SLD MON I Sled monitor
234 VLON O Laser power supply control
235 SLEEP O SLEEP request
236 FFCLR O Input latch output for the start signal
237 CHG GAIN O Not used (open)
238 CHG O Not used (open)

239

240
241 MIFVDD3
242 MIFVSS2
243 TEST2 O Not used (open)

244 NC

Pin Name

K-TAI_MON I Not used (open)

K-TAI_SW I Not used (open)

XRST MTR

DRV

SOUND 1, 2

TUN REG ON O Not used (open)

XHP STBY O HP Amp power supply control

I/O Description

—

Ground (for the microcomputer block)

O NADESHIKO2 reset

—

Power supply (for the microcomputer block)

I

Not used (open)

Not used (open)

—

Power supply for FLASH

—

Ground terminal for FLASH

—

Power supply (for the microcomputer I/F block)

—

Ground (for the microcomputer I/F block)

—

Not used (open)

30

NOTE:

• -XX, -X mean standardized parts, so they may
have some differences from the original one.

• Items marked “*” are not stocked since they
are seldom required for routine service. Some
delay should be anticipated when ordering these
items.

• The mechanical parts with no reference number
in the exploded views are not supplied.

7-1. MAIN SECTION

6

not
supplied

SECTION 7

EXPLODED VIEWS

• Hardware (# mark) list and accessories and
packing materials are given in the last of this
parts list.

• Color Indication of Appearance Parts Example:
KNOB, BALANCE (WHITE) . . . (RED)

Parts of Color Cabinet’s Color

8

not
supplied

6

↑ ↑

18

The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.

MT-MZE500-174

9

10

11

10

10

MZ-E501

Ver 1.2 2001.12

22

21

1

5

2

6

17

12

13

20

10

19

7

3

4

not
supplied

14

16

15

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

1 3-232-193-01 LID, BATTERY CASE (SILVER)
1 3-232-193-11 LID, BATTERY CASE (PINK)
1 3-232-193-21 LID, BATTERY CASE (BLUE)
1 3-232-193-31 LID, BATTERY CASE (YELLOW)
2 X-3380-732-1 TERMINAL ASSY, BATTERY

3 3-232-180-01 BUTTON (OPEN)
4 3-224-025-01 TERMINAL BOARD (MINUS)
5 3-232-179-01 STRIP, ORNAMENTAL (SILVER)
5 3-232-179-11 STRIP, ORNAMENTAL (PINK)
5 3-232-179-21 STRIP, ORNAMENTAL (BLUE)

9 3-049-051-01 SCREW (MD), STEP
10 3-318-382-02 SCREW (1.7), TAPPING
11 X-3380-734-1 BRACKET (L) ASSY
12 X-3380-735-1 BRACKET (R) ASSY

∗ 13 A-3021-503-A MAIN BOARD, COMPLETE

14 X-3380-733-1 CASE ASSY, BATTERY
15 4-989-078-01 SPRING (OPEN), TENSION
16 X-3380-896-1 CASE ASSY (SILVER)
16 X-3380-897-1 CASE ASSY (PINK)
16 X-3380-898-1 CASE ASSY (BLUE)

5 3-232-179-31 STRIP, ORNAMENTAL (YELLOW)
6 4-218-233-09 SCREW (1.4), MI
7 X-3380-870-1 HOLDER ASSY (S)
8 X-3380-740-1 LID ASSY, UPPER (SILVER)
8 X-3380-741-1 LID ASSY, UPPER (PINK)

8 X-3380-742-1 LID ASSY, UPPER (BLUE)
8 X-3380-743-1 LID ASSY, UPPER (YELLOW)

16 X-3380-899-1 CASE ASSY (YELLOW)
17 3-232-194-01 PLATE, ELECTROSTATIC
18 3-232-178-01 BUTTON (B), CONTROL
19 4-225-074-01 TERMINAL BOARD
20 3-241-062-01 SHEET (BATT CASE)

21 3-234-918-01 SHEET (FITTING R)
22 3-234-920-01 SHEET (JACK)

31

MZ-E501

7-2. MECHANISM SECTION

65

55

M901

64

51

59

60

53

54

56

57

M902

61

58

62

63

52

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

51 1-680-453-11 MOTOR FLEXIBLE BOARD
52 3-222-392-01 SCREW (M1.4), TAPPING
53 3-222-394-01 CHASSIS
54 3-224-779-01 SPRING, THRUST DETENT
55 4-222-216-01 GEAR (SA)

56 3-338-645-51 WASHER
57 4-218-233-01 SCREW (1.4), MI
58 4-218-233-13 SCREW (1.4), MI
59 4-222-208-01 GEAR (SB)
60 3-043-237-02 BEARING (N)

61 4-222-203-01 SCREW, LEAD

0 62 X-3379-869-1 OPTICAL PICK-UP ASSY (LCX-4E)

63 3-222-391-01 SPRING (M), RACK
64 3-225-278-11 SCREW, TAPPING
65 X-3379-529-1 BASE ASSY, MOTOR

M901 8-835-706-01 MOTOR, DC SSM18A/C-NP (SPINDLE)
M902 1-763-399-11 MOTOR, DC (SLED)(WITH PULLY)

The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.

32

MZ-E501

SECTION 8

ELECTRICAL PARTS LIST

NOTE:

• Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.

• -XX, -X mean standardized parts, so they
may have some difference from the original
one.

• Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

∗ A-3021-503-A MAIN BOARD, COMPLETE

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

4-225-074-03 TERMINAL BOARD

< CAPACITOR >

C101 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C102 1-126-210-11 ELECT CHIP 220uF 20% 4V
C103 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V
C104 1-164-942-11 CERAMIC CHIP 0.0068uF 10.00% 16V
C201 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V

C202 1-126-210-11 ELECT CHIP 220uF 20% 4V
C203 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V
C204 1-164-942-11 CERAMIC CHIP 0.0068uF 10.00% 16V
C301 1-135-201-11 TANTALUM CHIP 10uF 20% 4V
C302 1-107-820-11 CERAMIC CHIP 0.1uF 16V

C303 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C304 1-135-181-11 TANTALUM CHIP 4.7uF 20% 6.3V
C305 1-125-838-11 CERAMIC CHIP 2.2uF 10% 6.3V
C306 1-104-847-11 TANTAL. CHIP 22uF 20.00% 4V
C501 1-164-931-11 CERAMIC CHIP 100PF 10.00% 16V

C502 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C503 1-164-940-11 CERAMIC CHIP 0.0033uF 10.00% 16V
C504 1-164-940-11 CERAMIC CHIP 0.0033uF 10.00% 16V
C505 1-164-943-11 CERAMIC CHIP 0.01uF 10.00% 16V
C508 1-164-938-11 CERAMIC CHIP 0.0015uF 10.00% 16V

C509 1-164-940-11 CERAMIC CHIP 0.0033uF 10.00% 16V
C510 1-164-850-11 CERAMIC CHIP 10PF 0.50PF 16V
C511 1-164-850-11 CERAMIC CHIP 10PF 0.50PF 16V
C513 1-164-850-11 CERAMIC CHIP 10PF 0.50PF 16V
C515 1-107-820-11 CERAMIC CHIP 0.1uF 16V

C516 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C519 1-164-940-11 CERAMIC CHIP 0.0033uF 10.00% 16V
C524 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V
C526 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C527 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V

C529 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V
C530 1-164-939-11 CERAMIC CHIP 0.0022uF 10.00% 16V
C551 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C552 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C557 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V

C558 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C559 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C561 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C601 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C603 1-107-820-11 CERAMIC CHIP 0.1uF 16V

• CAPACITORS:
uF: µF

• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable

• COILS
uH: µH

C604 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C605 1-115-156-11 CERAMIC CHIP 1uF 10V
C606 1-119-750-11 TANTAL. CHIP 22uF 20.00% 6.3V
C607 1-115-156-11 CERAMIC CHIP 1uF 10V
C608 1-107-820-11 CERAMIC CHIP 0.1uF 16V

C609 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C610 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V
C611 1-164-943-11 CERAMIC CHIP 0.01uF 10.00% 16V
C612 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V
C613 1-164-935-11 CERAMIC CHIP 470PF 10.00% 16V

C615 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C616 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C617 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C618 1-109-982-11 CERAMIC CHIP 1uF 10.00% 10V
C698 1-107-820-11 CERAMIC CHIP 0.1uF 16V

C699 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C802 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C803 1-164-935-11 CERAMIC CHIP 470PF 10.00% 16V
C804 1-164-943-11 CERAMIC CHIP 0.01uF 10.00% 16V
C806 1-119-923-11 CERAMIC CHIP 0.047uF 10.00% 10V

C807 1-119-923-11 CERAMIC CHIP 0.047uF 10.00% 10V
C808 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C810 1-164-943-11 CERAMIC CHIP 0.01uF 10.00% 16V
C851 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C853 1-164-942-11 CERAMIC CHIP 0.0068uF 10.00% 16V

C854 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C901 1-137-739-11 TANTALUM 22uF 20% 6.3V
C903 1-104-752-11 TANTAL. CHIP 33uF 20.00% 6.3V
C905 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C907 1-109-982-11 CERAMIC CHIP 1uF 10.00% 10V

C908 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C909 1-164-943-11 CERAMIC CHIP 0.01uF 10.00% 16V
C910 1-164-937-11 CERAMIC CHIP 0.001uF 10.00% 16V
C911 1-135-201-11 TANTALUM CHIP 10uF 20% 4V
C913 1-104-752-11 TANTAL. CHIP 33uF 20.00% 6.3V

C915 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C917 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C918 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C919 1-135-201-11 TANTALUM CHIP 10uF 20% 4V
C920 1-119-750-11 TANTAL. CHIP 22UF 20.00% 6.3V

C921 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C952 1-128-964-11 TANTAL. CHIP 100uF 20% 6.3V
C953 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C954 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C955 1-107-820-11 CERAMIC CHIP 0.1uF 16V

• SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , uPC... , µPC... ,
uPD..., µPD...

When indicating parts by reference number,
please include the board name.

The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.

MAIN

33

MZ-E501

MAIN

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

C956 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C963 1-107-820-11 CERAMIC CHIP 0.1uF 16V

< CONNECTOR >

∗ CN501 1-778-168-11 CONNECTOR, FFC/FPC (ZIF) 20P
∗ CN551 1-793-124-11 CONNECTOR, FPC (ZIP) 8P

< DIODE >

D101 8-719-064-91 DIODE 02DZ2.4-Z(TPH3)
D201 8-719-064-91 DIODE 02DZ2.4-Z(TPH3)
D801 8-719-085-54 LED KPTB-1612SURKSGC (INFO)
D855 8-719-066-17 DIODE FTZ6.8E-T148
D901 8-719-081-33 DIODE MA2YD1500LS0

D902 8-719-081-33 DIODE MA2YD1500LS0
D903 8-719-049-09 DIODE 1SS367-T3SONY

< FERRITE BEAD >

FB801 1-414-228-11 FERRITE 0uH
FB802 1-414-228-11 FERRITE 0uH

< IC >

IC301 8-759-598-15 IC TA2131FL(EL)
IC501 8-759-689-67 IC SN761057DBT
IC551 8-759-698-62 IC SC111257FCR2

@ IC601 8-752-413-13 IC CXD2671-205GA

IC801 8-759-566-18 IC AK6480BH-E2

IC901 8-759-698-61 IC XPC18A32FCR2

< JACK >

J301 1-793-288-71 JACK (i)

< COIL >

L503 1-469-570-11 INDUCTOR 10uH
L901 1-419-258-11 INDUCTOR 68uH
L902 1-419-646-11 INDUCTOR 47uH
L904 1-414-398-31 INDUCTOR 10uH
L906 1-419-258-11 INDUCTOR 68uH

< TRANSISTOR >

Q301 8-729-042-27 TRANSISTOR 2SC4738F-Y/GR(TPL3)
Q501 8-729-922-10 TRANSISTOR 2SA1577-T106-QR
Q801 8-729-429-44 TRANSISTOR XP1501-TXE

< RESISTOR >

R104 1-218-929-11 RES-CHIP 10 5% 1/16W
R105 1-218-977-11 RES-CHIP 100K 5% 1/16W
R204 1-218-929-11 RES-CHIP 10 5% 1/16W
R205 1-218-977-11 RES-CHIP 100K 5% 1/16W
R301 1-218-935-11 RES-CHIP 33 5% 1/16W

R302 1-218-963-11 RES-CHIP 6.8K 5% 1/16W
R303 1-218-981-11 RES-CHIP 220K 5% 1/16W
R501 1-218-971-11 RES-CHIP 33K 5% 1/16W
R503 1-218-953-11 RES-CHIP 1K 5% 1/16W
R505 1-208-895-11 METAL CHIP 2.2K 0.5% 1/16W

R515 1-208-895-11 METAL CHIP 2.2K 0.5% 1/16W
R516 1-208-895-11 METAL CHIP 2.2K 0.5% 1/16W
R517 1-208-895-11 METAL CHIP 2.2K 0.5% 1/16W
R519 1-218-977-11 RES-CHIP 100K 5% 1/16W
R521 1-242-967-11 RES-CHIP 1 5% 1/16W

R552 1-216-296-11 SHORT 0
R553 1-216-296-11 SHORT 0
R554 1-216-296-11 SHORT 0
R555 1-216-296-11 SHORT 0

R601 1-218-929-11 RES-CHIP 10 5% 1/16W
R602 1-218-935-11 RES-CHIP 33 5% 1/16W
R603 1-218-943-11 RES-CHIP 150 5% 1/16W
R605 1-218-965-11 RES-CHIP 10K 5% 1/16W
R606 1-218-977-11 RES-CHIP 100K 5% 1/16W

R607 1-218-977-11 RES-CHIP 100K 5% 1/16W
R609 1-218-981-11 RES-CHIP 220K 5% 1/16W
R612 1-218-959-11 RES-CHIP 3.3K 5% 1/16W
R613 1-218-945-11 RES-CHIP 220 5% 1/16W
R614 1-218-953-11 RES-CHIP 1K 5% 1/16W

R615 1-202-974-11 RES-CHIP 3.3M 5% 1/16W
R802 1-218-990-11 SHORT 0
R804 1-218-973-11 RES-CHIP 47K 5% 1/16W
R806 1-218-977-11 RES-CHIP 100K 5% 1/16W
R807 1-218-959-11 RES-CHIP 3.3K 5% 1/16W

R808 1-218-959-11 RES-CHIP 3.3K 5% 1/16W
R811 1-218-963-11 RES-CHIP 6.8K 5% 1/16W
R812 1-218-965-11 RES-CHIP 10K 5% 1/16W
R813 1-218-967-11 RES-CHIP 15K 5% 1/16W
R814 1-218-971-11 RES-CHIP 33K 5% 1/16W

R815 1-218-975-11 RES-CHIP 68K 5% 1/16W
R817 1-218-941-11 RES-CHIP 100 5% 1/16W
R818 1-218-941-11 RES-CHIP 100 5% 1/16W
R819 1-218-989-11 RES-CHIP 1M 5% 1/16W
R820 1-218-935-11 RES-CHIP 33 5% 1/16W

R822 1-218-947-11 RES-CHIP 330 5% 1/16W
R827 1-218-989-11 RES-CHIP 1M 5% 1/16W
R828 1-218-967-11 RES-CHIP 15K 5% 1/16W
R829 1-218-985-11 RES-CHIP 470K 5% 1/16W
R830 1-218-975-11 RES-CHIP 68K 5% 1/16W

R831 1-218-985-11 RES-CHIP 470K 5% 1/16W
R833 1-218-990-11 SHORT 0
R901 1-218-969-11 RES-CHIP 22K 5% 1/16W
R903 1-218-957-11 RES-CHIP 2.2K 5% 1/16W
R909 1-218-965-11 RES-CHIP 10K 5% 1/16W

R910 1-218-965-11 RES-CHIP 10K 5% 1/16W
R920 1-208-911-11 METAL CHIP 10K 0.5% 1/16W
R921 1-218-979-11 RES-CHIP 150K 5% 1/16W
R946 1-208-919-11 METAL CHIP 22K 0.5% 1/16W

R948 1-208-939-11 METAL CHIP 150K 0.5% 1/16W
R950 1-218-953-11 RES-CHIP 1K 5% 1/16W

< COMPOSITION CIRCUIT BLOCK >

RB301 1-233-970-11 RES, NETWORK (CHIP TYPE) 33K
RB302 1-233-966-11 RES, NETWORK (CHIP TYPE) 6.8K
RB551 1-233-959-11 RES, NETWORK (CHIP TYPE) 470
RB552 1-233-973-11 RES, NETWORK (CHIP TYPE) 100K
RB553 1-233-967-11 RES, NETWORK (CHIP TYPE) 10K

34

@Replacement of IC601 used in this set

requires a special tool.

MZ-E501

Ver 1.1 2001.11

MAIN

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

< SWITCH >

S801 1-786-033-11 SWITCH, TACTILE (x)
S802 1-786-033-11 SWITCH, TACTILE (>N)
S803 1-786-033-11 SWITCH, TACTILE (.)
S804 1-786-033-11 SWITCH, TACTILE (VOL-)
S805 1-786-033-11 SWITCH, TACTILE (VOL+)

S806 1-786-033-11 SWITCH, TACTILE (GROUP)
S808 1-762-078-11 SWITCH, SLIDE (HOLD)
S809 1-762-498-11 SWITCH, PUSH (1 KEY)(OPEN/CLOSE DETECT)

< VIBRATOR >

X601 1-795-002-11 VIBRATOR, CERAMIC 45.1584MHz

∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

MISCELLANEOUS

∗∗∗∗∗∗∗∗∗∗∗∗∗∗

51 1-680-453-11 MOTOR FLEXIBLE BOARD

0 62 X-3379-869-1 OPTICAL PICK-UP ASSY (LCX-4E)

M901 8-835-706-01 MOTOR, DC SSM18A/C-NP (SPINDLE)
M902 1-763-399-11 MOTOR, DC (SLED)(WITH PULLY)

1-251-895-11 BATTERY CASE
1-476-211-21 REMOTE CONTROL UNIT (RM-MC10L)

0 1-476-277-11 ADAPTOR, AC (AC-MZR55) (Hong Kong)
0 1-476-763-11 CHARGE UNIT (Hong Kong)
0 1-476-763-14 CHARGE UNIT (AEP,French)

0 1-476-857-11 ADAPTOR, AC (AC-ES305) (AEP,French)

1-528-299-61 BATTERY, NI-CD (NC-6WM)
3-008-521-01 CASE, BATTERY CHARGE
3-220-749-01 CASE, CARRYING
3-231-629-11 MANUAL, INSTRUCTION

3-231-629-21 MANUAL, INSTRUCTION

3-231-629-31 MANUAL, INSTRUCTION

3-231-629-41 MANUAL, INSTRUCTION

3-231-629-51 MANUAL, INSTRUCTION

3-231-629-61 MANUAL, INSTRUCTION

ACCESSORIES

∗∗∗∗∗∗∗∗∗∗∗∗

(ENGLISH,CHINESE) (Hong Kong)

(ENGLISH,FRENCH) (AEP,French)

(GERMAN,ITALIAN) (AEP)

(SPANISH,PORTUGUESE) (AEP)

(DUTCH,SWEDISH) (AEP)

(FINNISH,RUSSIAN) (AEP)

3-232-198-01 ATTACHMENT (STAND)(SILVER)
3-232-198-11 ATTACHMENT (STAND)(PINK)
3-232-198-21 ATTACHMENT (STAND)(BLUE)
3-232-198-31 ATTACHMENT (STAND)(YELLOW)
8-953-304-90 RECEIVER MDR-E805SP SET

The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.

35

MZ-E501

MEMO

36

SERVICE MANUAL

Ver 1.2 2001. 12

SUPPLEMENT-1

Subject : 1. Schematic diagram and printed wiring

board are changed.

MZ-E501

AEP Model

Hong Kong Model

(ECN-DAB01214)

MZ-E501

How to distinguish the sets

Parts code of printed wiring board are changed.

Before change

Part No. Description

1-681-868-11 MAIN BORD

Location of parts code on changed printed wiring board.

Part No. Description

1-681-868-12 MAIN BORD

After change

MAIN BOARD

(SIDE B)

Before change: 1-681-868-11
After change:

1-681-868-12

2

2-1. BLOCK DIAGRAM

MZ-E501

SECTION 2
DIAGRAMS

Jx Jy

Jx

Ix

Ix Iy

a

cd

b

F

PD

OPTICAL PICK-UP BLOCK

Iy

Ix

Jx

Jy

A

B

C

D

MINIDISC

(LCX-4E)

LD

S0
S1

AVCC

TRACKING

COIL

FOCUS

COIL

MINIDISC

MECHANISM BLOCK

M902

(SLED)

M901

(SPINDLE)

LD-A

LD-K

AVCC

MAIN BOARD

CN501

VREF

6

Iy

9

Ix

10

Jx

14

Jy

15

A

16

B

17

C

7

D

8

MON

18

VIF

5

LASER

AUTO POWER

12

CONTROL

2

1

4

3

5

7

6
8

1

2

3

4

Q501

VL

TRK+

TRK-

FCS+

FCS-

CN551

UNREG

13

S0

S1

SLED1+

SLED1-

SLED2+

SLED2-

CLVU

CLVV

CLVW

11
19

20

RF AMP,FOCUS/TRACKING ERROR AMP

IC501

VREF

4

Iy

8

Ix

9

Jx

10
11
12
14

5
6

13

7

18

22
40

20

RF AMP,

Jy

FOCUS

A

ERROR,

B

TRACKING

C

ERROR

D

A-C

TPP/WPP

D-C

PD-I

DVDD
AVCC

PD-O

APC

FOCUS/TRACKING COIL DRIVE,

SPINDLE/SLED MOTOR DRIVE

SERIAL

S-MONITOR

PEAK

/BOTM

I/F

RF OUT

PEAK

BOTM

ABCD

ADIP IN

ADIP

PD-NI

OFTRK

XRST

SBUS

SCK

S MON

33

29
28

41

FE

42

TE

1
44

21

19
31

VC

26

25
23
24

43

IC551

42
41

40
39

33

PRE

32 24

DRIVER

35

10

7 19

PRE

DRIVER

8

14

PRE

15

DRIVER

12

29

PRE

31

DRIVER

54
51

52

53

48
45

PRE

46

DRIVER

49
44

HI-BRIDGE

CONTROL

HI-BRIDGE

CONTROL

HI-BRIDGE

CONTROL

HI-BRIDGE

CONTROL

3 PHASE

CONTROL

BIAS

HEADPHONE AMP

IC301

29

RFI

37

44

PEAK
BOTM

45

ABCD

46

FE

47

TE

56

ADFG

74

APCREF

78
49

VC

12

VREF MON

217

OFTRK

221

XRF RST
SSB DATA

160
161

SSB CLK

9

S MON

194

PD S0

195

EEPROM

PDS1

IC801

XCS

4DI3DO2SK1

38

37

25

TAP601
(TEST)

18

16
17
20

26
27

1

56

55

2
3
4
5
6

219

XCS NV

181

SCK0
S00

180

SI0

179

SLD1MON

100

SLD2MON

101

TFDR

81

TRDR

88

XTEST

3

FFDR

82

FRDR

80

98

SLDV
SRDR

96

SFDR

97

SLDW

99

SLCW

102

XCS NV
SI0

93

SPCU
SCK0

94

SPCV
S00

SPCW

95

90

SPD W

89

SPD V

87

SPD U

88

SPDL PWM

220

XRST MTR DRV

DIGITAL SIGNAL PROCESSOR,

DIGITAL SERVO SIGNAL PROCESSOR,

EFM/ACIRC ENCODER/DECODER,

SHOCK PROOF MEMORY CONTROLLER,

16M BIT D-RAM, SYSTEM CONTROL

IC601

AOUT L

AOUT R

BEEP

XHP STB

MUTE

RMC DTCK

REC KEY

SET KEY2

TSB MST VDD

OPR LED R PWM
OPR LED G PWM

HOLD SW

XAVLS

SET KEY 1

WK DET

HALF LOCK SW

DIFVDD0
DIFVDD1

TSB SLV VDD

MIFVDD0
MIFVDD1
MIFVDD2

TSB SLV CHK

MIFVDD3

OSCI

OSCO

RMC KEY

VB MON

VC PWM

VL PWM

FS4

VLON

SLEEP

FFCLR

XRST

AVDD

AVD1
AVD2

VDI00
VDI01
VDI02

MCU VDD0

DSP VDD0
DSP VDD1

MCU VDD1

DSP VDD2

DSP VDD3
MCU VDD2
MCU VDD3

30

UNREG

183

240
218

142

RMC VDD

18
14

141

167
163

227
224

13
17

19

VIF

76
103
143

154
176
196

210

241

24

25

20

10

165
164

86
234
235
236

8

21

23
119
139
151
231

6
59
73
84
91

113
153
222

UNREG

X601

45.1584MHz

AVDD

DVDD

22 2

R-CH

21

IN B

+B

1

VCC

20

VIF

15
18

STB

MUTE

17

S809

(OPEN/CLOSE

DETECT)

POWER SUPPLY

DVDD

IC901

VD

5

XWK4

2

XWK1

7

VRMC

3

XWK2

26

INM1
RF1

27
23

RF2

22

INM2

56

CLK

1

VLON

55

SLEEP

54

FFCLR

46

XRST

36

VC

34

VC

45

VC2

¥

Signal path

J : Audio (Digital)
F : Audio (Analog)

¥

R-CH is omitted due to same as L-CH

BEEP

GROUP

VLO

VCO

VC OUT

XWK3

VSTB

OUT B

BEEP OUT A

BEEP OUT B

VREF IN

S806

1044

35

42

VIF

41

VA

19

VG

18

LG

9

VL

11

VL

16

L2
L2

12

32

L1

28

L1

33

50

VB

4
6

S805

VOL

VL

VC

VIF

AVDD

4

R-CH

24
23

REFERENCE

VOLTAGE

13

SWITCHING

Q301

D801

(INFO)

LED SWITCH

ON

OFF

S803

S804

.

VOL

+

-

-

D903

L906

D902

L902

L901

D901

SWITCH

Q902,903

SWITCH

Q901

VDD

Q801

S802

>

B+

VOLTAGE

DETECTOR

IC903

OUT

S808
HOLD

N

VG

UNREG

IN

R-CH

31

RGND

RMC

VDD

S801

x

L-CH

KEY

DATA

J301

i

RECHAGEABLE

BATTERY
NC-6WM

1PC, 1.2V 600mAh

DRY BATTERY

SIZE "AA"

(IEC DESIGNATION LR6)

1PC, 1.5V

33

MZ-E501

2-2. PRINTED WIRING BOARD – MAIN SECTION (SIDE A) –

12

34567891011121314

A

B

C

D

E

F

(IEC DESIGNATION LR6)

DRY BATTERY

SIZE "AA"

1PC, 1.5V

MAIN BOARD

(SIDE A)

*

IC 601

CSP (Chip Size Package)

S808

HOLD

ON

OFF

S804
VOL-

S801

S803

S806

GROUP

E

C301

12

131518

IC 301

1924

10

7

• Semiconductor

Location

156

Ref. No. Location

D101 C-13
D201 C-13
D801 G-10
D855 E-13
D902 H-13
D903 G-14

IC301 B-12
IC501 H-5
IC601 C-6
IC901 G-12

Q301 B-11
Q501 H-3
Q901 G-11
Q902 F-11
Q903 F-11

G

H

(INFO)

S805

VOL+

E

IC 501

S802

1-681-868-

12

(12)

I

Note on Printed Wiring Boards

IC 901

• X : parts extracted from the component side.

• : Pattern from the side which enables seeing.

(The other layers' patterns are not indicated.)
Caution:

Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.

• Main boards is four-layer pritnted board.
However, the patterns of layer 2 and 3 have not been
included in this diagrams.

* Replacement of IC601 used in this set requires a special tool.

• Lead Layouts

Lead layout of
conventional IC

CSP (chip size package)

surface

44

2-3. PRINTED WIRING BOARD – MAIN SECTION (SIDE B) –

MZ-E501

A

B

C

D

E

12

MAIN BOARD

J301

COM

R

RGND

R-KEY

R-DATA

34567891011121314

TO

OPTICAL

PICK-UP

BLOCK

(LCX-4E)

IC 801

• Semiconductor

Location

Ref. No. Location

D901 F-3

IC551 H-6
IC801 C-12
IC903 H-5

Q801 D-4

(SIDE B)

L

TO MOTOR FLEXIBLE BOARD

(M901 : SPINDLE MOTOR)

(M902 : SLED MOTOR)

3

5

4

1

F

G

H

I

S809

(OPEN/CLOSE

DETECT SWITCH)

RVDD

IC 903

IC 551

RECHARGEABLE BATTERY

NC-6WM

1PC, 1.2V 600mAh

1-681-868-

12

(12)

Note on Printed Wiring Boards

• X : parts extracted from the component side.

• : Pattern from the side which enables seeing.

(The other layers' patterns are not indicated.)
Caution:

Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.

• Main boards is four-layer pritnted board.
However, the patterns of layer 2 and 3 have not been
included in this diagrams.

55

MZ-E501

2-4. SCHEMATIC DIAGRAM – MAIN SECTION (1/3) –

• See page 11, 12 for IC Pin Function Description.

r

WAVEFORMS

1234

Approx.

12 mVp-p

Approx.

1.2 Vp-p

Approx.

10 mVp-p

X601 (OSCO)IC501 rs (FE) IC501 ed (RF OUT)IC501 1 TE

22.1 ns

2.7 V

Note on Schematic Diagram

• All capacitors are in µF unless otherwise noted.
pF: µµF 50 WV or less are not indicated except
for electrolytics and tantalums.

• All resistors are in Ω and
otherwise specified.

f

•

: internal component.

1

4

/

W or less unless

• : B+ Line.

• Power voltage is dc 1.5V and fed with regulated

dc power supply from battery terminal.

• Voltages and waveforms are dc with respect to
ground under no-signal conditions.
no mark : PLAY

66

• Voltages are taken with a VOM (Input imped-

ance 10 MΩ).
Voltage variations may be noted due to normal
production tolerances.

• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal
production tolerances.

• Circled numbers refer to waveforms.

• Signal path.

F : Audio (Analog)
J : Audio (Digital)

* Replacement of IC601 used in this set requires

a special tool.

• The voltage and waveform of CSP (chip size

package) cannot be measured, because its lead
layout is different from that of conventional IC.

MZ-E501

2-5. SCHEMATIC DIAGRAM – MAIN SECTION (2/3) –

• See page 9, 10 for IC Block Diagrams.

IC B/D

IC B/D

Note on Schematic Diagram

• All capacitors are in µF unless otherwise noted. pF: µµF

50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in Ω and

specified.

• : B+ Line.

• Power voltage is dc 1.5V and fed with regulated dc power

supply from battery terminal.

• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAY

• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc­tion tolerances.

1

4

/

W or less unless otherwise

77

MZ-E501

2-6. SCHEMATIC DIAGRAM – MAIN SECTION (3/3) –

• See page 9 for IC Block Diagrams.

IC B/D

Note on Schematic Diagram

• All capacitors are in µF unless otherwise noted. pF: µµF

50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in Ω and

specified.

• C : panel designation.

• : B+ Line.

• Power voltage is dc 1.5V and fed with regulated dc power

supply from battery terminal.

• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAY

• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc­tion tolerances.

• Signal path.

F : Audio (Analog)
J : Audio (Digital)

1

4

/

W or less unless otherwise

88

6-7. IC BLOCK DIAGRAMS

IC301 TA2131FL (EL)

STB

18 17 16 15 14 13

PW
SW

19

TC MT

20

VCC

INR

21

INL

22

MUTE

MTSWBST

SW

BST SW

ADD

BEEP

BEEP IN

GND

V REF

BST1

VREF IN

12

11

10

9

MZ-E501

VREF

LPF1

BST NF1

LPF2

IC551 SC111257FCR2

42 41

PGNDW

43

WO

44

VMVW

45

VO

46

PGNDUV

47

UO

48

VMU

49

GND2

50

CPW1

51

CPAIP

CPAIM

VC VG

PRE DRIVER

BEEP

OUTB

BEEP

OUTA

PW

23

A

PW

B

BST2

8

7

BST NF2

BST OUT

24

BST

AGC

654321

+B

CPBIP

40

39 38 37 36 35

OUTL

CPBIM

PWR

GND

CPAO

OUTR

CPB0

DET

VM3

RO3

PGND3

34 33 32 31 30 29

VC VG

PRE DRIVER PRE DRIVER

VC VC

H-BRIDGE

CONTROL

AGC IN

FO3

VM34

RO4

PGND4

H-BRIDGE
CONTROL

FO4

VC VG

VM4

28

27

R14

26

F14

R13

25

24

F13

VG

VG

23

VC

VC

22

21

GND1

CPV1

CPU1

COM

CPWO

CPVO

52

53

VC VC

54

55

3 PHASE

56

1

CPUO

CONTROL

2

3 4

V1

W1

U1

5 6

PWM

VC

BIAS

OE

H-BRIDGE
CONTROL

VC VG

PRE DRIVER PRE DRIVER

7

8

9 10

RO1

VM1

PGND1

FO1

11

VC

VM12

H-BRIDGE
CONTROL

VG

12

RO2

13

PGND2

14

FO2

PWM24

20

F11

19

R11

18

F12

17

R12

16

VM2

15

9

MZ-E501

IC901 XPC18A32FCR2

NC

43

VD

44

VC2

45

46

XRST

CRST

47

48

RSTREF

49

VREF

VB

50

GND

51

CLKSEL

52

VAIFON

53

FFCLR

54

SLEEP

55

CLK

56

VIF

VA

VAFB

42 41

VC

VC

40

VDFB

39 38 37 36 35

SERIAL PASS

REGULATOR VA

SERIAL PASS

REGULATOR VD

SERIAL PASS

REGULATOR VIF

VC

VC

BANDGAP

REFERENCE

VSTB VC VB

CONTROL

XRST (INT)

VIFFB

VSTB

GND

VC VB

VC

VCO

34 33 32 31 30 29

VG

POWER

SWITCH 1

VC

VC

VCOUT

VG

VG

PWER

SWITCH 2

L1

STEP-UP

PRE DRIVEER

START-UP

NC

STEP-UP

PRE DRIVEER

PWM

STEP-UP

DC/DC

CONVERTOR

STEP-UP

PRE DRIVEER

PGND1

VG

VC

VCVBVBVG

VG

VG

PGND1

VC

VG

L1

28

27

RF1

INM1

26

DTC1

25

DTC2

24

RF2

23

INM2

22

PWM1

21

PWM2

20

VG

19

18

LG

PGND2

17

L2

16

NC

15

1

VLON

2

XWK1

3 4

XWK2

XWK3

5

XWK4

6

VSTV

7

VRMC

8

GND

9 10

VL

VLO

12

13

PGND2

14

PGND2

11

L2

VL

10

6-8. IC PIN FUNCTION DESCRIPTION

• IC501 SN761057DBT (RF AMP, FOCUS/TRACKING ERROR AMP)

Pin No. Pin Name I/O Description

1 TE O Tracking error signal output to the system controller (IC601)
2 REXT I Connect terminal to the external resistor for ADIP amp control
3 WPPLPF I Connect terminal to the external capacitor for TPP/WPP low-pass filter
4 VREF O Reference voltage output terminal (+1.1V)
5 C I Signal (C) input from the optical pick-up detector
6 D I Signal (D) input from the optical pick-up detector
7 D-C I Signal (D) input from the optical pick-up detector (AC input)
8 IY I I-V converted RF signal (IY) input from the optical pick-up detector

9 IX I I-V converted RF signal (IX) input from the optical pick-up detector
10 JX I I-V converted RF signal (JX) input from the optical pick-up detector
11 JY I I-V converted RF signal (JY) input from the optical pick-up detector
12 A I Signal (A) input from the optical pick-up detector
13 A-C I Signal (A) input from the optical pick-up detector (AC input)
14 B I Signal (B) input from the optical pick-up detector
15 TON-C I Connect terminal to the external capacitor for TON hold

16 CIG I

17 CDN I

18 PD-I I Light amount monitor input terminal (invert input)
19 PD-NI I Light amount monitor input terminal (non-invert input)
20 PD-O O Light amount monitor output terminal
21 ADIP O ADIP duplex FM signal (66.15kHz ± 3kHz) output to the system controller (IC601)
22 DVDD Power supply terminal (+1.9V) (digital system)
23 SBUS I/O SSB serial data input/output with the system controller (IC601)
24 SCK I SSB serial clock signal input from the system controller (IC601)
25 XRST I Reset signal input from the system controller (IC601) “L”: reset
26 OFTRK I Off track signal input from the system controller (IC601)
27 DGND I Ground terminal (digital system)

28 BOTM O

29 PEAK O

30 VREF I Connect terminal to the external capacitor for the internal reference voltage
31 VC Middle point voltage (+1.2V) generation output terminal
32 CCSL2 I Connect terminal to the external capacitor for TPP/WPP low-pass filter (not used in this set)
33 RF OUT O Playback EFM RF signal output to the system controller (IC601)
34 AGND I Ground terminal (analog system)

35~37 EQ, LP, PS I Connect terminal to the external capacitor for the RF equalizer

38 AVCC Power supply terminal (analog system) (+2.2V)

39, 40 OFC2, OFC-1 I Connect terminal to the external capacitor for RF AC coupling

41 ABCD O Light amount signal (ABCD) output to the system controller (IC601)
42 FE O Focus error signal output to the system controller (IC601)
43 S-MON O Servo signal monitor output to the system controller (IC601)
44 ADIP-IN I ADIP duplex FM signal (66.15kHz ± 3kHz) input terminal, 3 times speed

Connect terminal to the external capacitor for the low-pass filter of NPP divider
denominator (Not used in this set)

Connect terminal to the external capacitor for the low-pass filter of CSL divider
denominator (Not used in this set)

—

Bottom hold signal output of the light amount signal (RF/ABCD) to the system controller
(IC 601)

Peak hold signal output of the light amount signal (RF/ABCD) to the system controller
(IC 601)

—

—

MZ-E501

11

MZ-E501

• IC601 CXD2671-207GA (SYSTEM CONTROL)

Pin No.

1
2
3
4
5
6
7
8

9
10
11
12 VREF MON I Clear reference voltage monitor
13

14
15 VL MON I VL voltage monitor
16
17
18
19
20
21

22 AVSS

23 VDIOSC
24
25
26
27
28
29
30
31
32
33

34 ASYI I Playback EFM comparison slice level input

35
36
37
38

39 PCO O Phase comparison output for the playback EFM system master PLL

40
41

42 FILO O Filter output for the playback EFM system master PLL

43 CLTV I Internal VCO control voltage input for the playback EFM system master PLL
44 PEAK

45 BOTM
46 ABCD I Light amount signal input

Pin Name

OPR_LED_G_H
OPR_LED_G_L

XTEST
OPR_LED_R_H
OPR_LED_R_L

MCUVDD0

MIFVSS3

XRST

S MON

VB MON

SET KEY 1
SET KEY 2

HIDC MON

WK DET

REC KEY

HALF LOCK SW

RMC KEY

AVDD

OSCI

OSCO
VSIOSC
DAVDD

VREFL Built-in DAC VREF (L-ch)
AOUTL
AOUTR

VREFR
DA VSS

ASYO

AVD1

BIAS

RFI

AVS1

PDO
FILI

I/O Description

O

High intensity green LED control (open)

O

Low intensity green LED control (open)

I

Input terminal for the test mode detection

O

High intensity red LED control (open)

O

Low intensity red LED control (open)

—

Power supply (for microcomputer block)

—

Ground (for microcomputer I/F)

I

System reset terminal

I

Servo signal monitor

I

Voltage monitor of UNREG power supply

I

Not used (connected to ground)CHG MON

I

Set key detection 1
Not used (connected to RMC VDD)

I

I

Not used (connected to ground)

I

Set KEY WAKE detection

I

Not used (connected to RMC VDD)

I

Signal input for OPEN SW detection

I

Remote control key detection

—

Power supply (for the analog circuit block)

—

Ground (for the analog circuit block)

—

Power supply (for OSC cell)

I

Input to the X’tal oscillator circuit

O

Output from the X’tal oscillator circuit

—

Ground (for OSC cell)

—

Built-in DAC VCC

—

O

Built-in DAC (L-ch) output

O

Built-in DAC (R-ch) output

I

Built-in DAC VREF (R-ch)

—

Ground (for the built-in DAC)

O

Playback EFM duplex signal output

—

AVDD

I

Bias input for the playback EFM comparison

I

Playback EFM RF signal input

—

AVSS

O

Phase comparison output for the analog PLL

I

Filter input for the playback EFM system master PLL

I

Peak hold signal input of the light amount signal

I

Bottom hold signal input of the light amount signal

12

MZ-E501

Pin No.

47 FE I Focus error signal input
48 AUX1 I Support signal input (A/D input)
49 VC I Middle point voltage input
50 ADIO O Not used (open)
51 ADRT I A/D converter the upper limit voltage input
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86

87

88

89
90

Pin Name

AVD2

AVS2

ADRB

SE
TE

DCHG

APC

DSPVDD0

DSPVSS0

XTSL

DIN1

DOUT
PWMLP O Not used (open)
PWMLN
PWMRP O Not used (open)

DADT/PWMRN O Not used (open)

ADDT

LRCK O Not used (open)

XBCK O Not used (open)

FS256

MVCI

DSPVDD1

ADFG

F0CNT

DIFVDD0

DIFVSS0

APCREF O

LDDR O Not used (open)

TRDR O Tracking servo drive PWM signal output (–)

TFDR O Tracking servo drive PWM signal output (+)
FFDR O Focus servo drive PWM signal output (–)

FRDR O Focus servo drive PWM signal output (+)

MCUVDD1

FGIN I Not used (open)

FS4 O 176.4kHz clock signal output

SPRD/SPDU/

RTG0

SPFD/SPVS/

PWM3

SPDV/RTG1 O Brushless spindle motor 3-phase drive logic output (V)/RTG output 1

SPDW/RTG2 O Brushless spindle motor 3-phase drive logic output (W)/RTG output 2

I/O Description

—

AVDD

—

AVSS

I

A/D converter the lower limit voltage input

I

Sled error signal input

I

Tracking error signal input

—

Connecting analog power supply of the low impedance

I

Error signal input for the laser digital APC

—

Power supply (for DSP block)

—

Ground (for DSP block)
X’tal oscillation frequency selection

I
I

Not used (connected to ground)

O

Not used (open)

O

Not used (open)

I

Not used (connected to ground)

O

Not used (open)

I

Not used (connected to ground)

—

Power supply (for DSP block)

I

ADIP duplex FM signal (20.05±1KHz) input

O

Not used (open)

—

Power supply (for DSP I/F)

—

Ground (for DSP I/F)
Output to the reference PWM for the laser APC

—

Power supply (for the microcomputer block)

Spindle servo drive output (PWM– or inertia)/Brushless spindle motor 3-phase drive logic

O

output (U)/RTG output 0

Spindle servo drive output (PWM+ or PWM absolute value)/Brushless spindle motor absolute

O

value PWM output/PWM3

13

MZ-E501

Pin No.

91
92
93 SPCU I Brushless spindle motor drive comparison signal input (U)
94 SPCV I Brushless spindle motor drive comparison signal input (V)
95 SPCW I Brushless spindle motor drive comparison signal input (W)
96 SRDR/SL1F O Sled servo drive PWM signal output (–)
97 SFDR/SLVF O Sled servo drive PWM signal output (+)
98 SLDV O

99 SLDW O
100 SLCU I Brushless sled motor 3-phase drive comparate input (U)/2-phase drive comparate input (1)
101 SLCV I Brushless sled motor 3-phase drive comparate input (V)/2-phase drive comparate input (2)
102 SLCW
103 DIFVDD1
104 DIFVSS1
105 EFMO O Not used (open)
106 MNT0 O DSP monitor output (0)
107 MNT1 O DSP monitor output (1)
108 MNT2 O DSP monitor output (2)
109 MNT3 O DSP monitor output (3)
110 SENSE O Not used (open)
111
112 RECP O Not used (open)
113 DSPVDD3

114 to

117
118 DRAMVSS0
119 DRAMVDD0

120 to

138
139 DRAMVDD1
140 DRAMVSS1
141 TSB MST VDD
142 RMC DTCK I/O TSB master data input/output
143 TSB SLV VDD
144 TSB SLVI I TSB slave signal input
145 TSB SLVO O Not used (open)
146 TDI I Data input terminal for JTAG
147 TMS I Test mode control input terminal for JTAG
148 TCK I Clock input terminal for JTAG
149 XTRST I Reset input terminal for JTAG
150 TDO O Data output terminal for JTAG
151 JTAGVDD
152 JTAGVSS
153 MCUVDD2
154 MIFVDD0
155 MIFVSS0

Pin Name

DSPVDD2

DSPVSS1

TX O

NC

NC — Not used (open)

I/O Description

—

Power supply (for DSP block)

—

Ground (for DSP block)

Brushless sled motor 3-phase logic output (V)/2-phase drive logic output (1–)
Brushless sled motor 3-phase drive logic output (W)/2-phase drive logic output (2+)

—

Brushless sled motor 3-phase drive comparate input (W)/2-phase comparate output (2–)

—

Power supply (for DSP I/F)

—

Ground (for DSP I/F)

Not used (open)

—

Power supply (for DSP block)

—

Not used (open)

—

Ground (for the external D-RAM)

—

Power supply (for the external D-RAM)

—

Power supply (for the external D-RAM)

—

Ground (for the external D-RAM)

—

Power supply (for TSB master communication)

—

I/F power supply (for TSB slave communication)

—

Power supply terminal for JTAG

—

Ground terminal for JTAG

—

Power supply (for the microcomputer block)

—

Power supply (for the microcomputer I/F block)

—

Ground (for the microcomputer I/F block)

14

MZ-E501

Pin No.

156, 157 TEST1, TEST0 I Terminal 1, 0 for the main test

158 EVA I EVA/FLASH chip discrimination terminal
159 OPR LED O Operation LED control (Not used in this set)
160 SSB DATA I/O Input/output of SSB serial data
161 SSB CLK — SSB serial clock
162 MCUVSS0
163 OPR_LED_R_PWM O Operation LED (R) control PWM
164 VL PWM —
165 VC PWM — PWM for the system power supply voltage control

166
167

168
169 CLK SEL O Not used (open)

170

171 GND SW O Not used (open)
172 SET CODE0 O Set code 0
173 SET CODE1 O Set code 1
174 SET CODE2 O
175 SET CODE3 O
176 MIFVDD1
177 MIFVSS1
178 AOUT SEL O HP/LINE changeover signal output Not used (open)
179 SI0
180 SO0 O

181 SCK0 O
182 XGUM ON I
183 BEEP O Beep sound output
184 NC
185 VD. SEL O

186 XMUTE O
187 LCD_RST_AUX O

188,189 NC O Not used (open)

190 X PATCH I
191 OPT DET I Not used (open)

192 XJACK DET I Not used (open)
193 XMIC DET I Not used (open)

194, 195 PD S0, PD S1 O PD IC mode changeover 0, 1

196 MIFVDD2

197 to

199

200, 201 HD CON 1, 2 O Not used (open)

202 NC O Not used (open)

203 XCS ADA O Not used (open)

204 XPD ADA O Not used (open)
205 XCS LCD O Not used (open)

Pin Name

SPDL_AUX_PWM

OPR_LED_G_PWM

NC O Not used (open)

OPEN CLOSE

SW

MODE1 to 3 O

I/O Description

—

Ground (for the microcomputer block)

PWM for the laser power supply voltage control

O Spindle auxiliary control PWM
O Operation LED (G) control PWM

Not used (open)

I

Set code 2
Set code 3

—

Power supply (for the microcomputer I/F block)

—

Ground (for the microcomputer I/F block)

I

Serial data input (CH0)
Serial data output (CH0)
Serial clock signal output (CH0)
Not used (open)

—

Not used (open)
Not used (open)
Not used (open)
Not used (open)

Not used (connected to ground)

—

Power supply (for the microcomputer I/F block)

Not used (open)

15

MZ-E501

Pin No.

206 LCD STB O Not used (open)
207 LCD RST O Not used (open)
208 REC LED O Not used (open)
209 LD ON O Not used (open)
210 TSB SLV CHK I TSB slave check
211
212

213 MCUVSS1
214 CAV CLV SW O Not used (open)
215 XOPT CTL O Not used (open)
216 CS RTC O Not used (open)
217 OFTRK I Off track signal input
218 MUTE O Analog mute “H”: muting ON
219 XCS NV O NV RAM chip select

220

221 XRF RST O TIARA reset
222 MCUVDD3
223 SPDL MON I Spindle monitor

224 XAVLS I AVLS SW detection

225, 226

227 XHOLD SW I HOLD switch detection
228 SYNC REC I Not used (open)
229 TSB_SSB_CTL O TSB/SSB switching
230 PROTECT I
231 FLASHVDD
232 FLASHVSS
233 SLD MON I Sled monitor
234 VLON O Laser power supply control
235 SLEEP O SLEEP request
236 FFCLR O Input latch output for the start signal
237 CHG GAIN O Not used (open)
238 CHG O Not used (open)

239

240
241 MIFVDD3
242 MIFVSS2
243 TEST2 O Not used (open)

244 NC

Pin Name

K-TAI_MON I Not used (open)

K-TAI_SW I Not used (open)

XRST MTR

DRV

SOUND 1, 2

TUN REG ON O Not used (open)

XHP STBY O HP Amp power supply control

I/O Description

—

Ground (for the microcomputer block)

O NADESHIKO2 reset

—

Power supply (for the microcomputer block)

I

Not used (open)

Not used (open)

—

Power supply for FLASH

—

Ground terminal for FLASH

—

Power supply (for the microcomputer I/F block)

—

Ground (for the microcomputer I/F block)

—

Not used (open)

16

MZ-E501

SECTION 2

ELECTRICAL PARTS LIST

NOTE:

• Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.

• -XX, -X mean standardized parts, so they
may have some difference from the original
one.

• Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

* A-3021-503-A MAIN BOARD, COMPLETE

*********************

4-225-074-03 TERMINAL BOARD

< CAPACITOR >

C101 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C102 1-126-246-11 ELECT CHIP 220uF 20% 4V
C103 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V
C104 1-164-942-11 CERAMIC CHIP 0.0068uF 10.00% 16V
C201 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V

C202 1-126-246-11 ELECT CHIP 220uF 20% 4V
C203 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V
C204 1-164-942-11 CERAMIC CHIP 0.0068uF 10.00% 16V
C301 1-135-201-11 TANTALUM CHIP 10uF 20% 4V
C302 1-107-820-11 CERAMIC CHIP 0.1uF 16V

C303 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C304 1-135-210-11 TANTALUM CHIP 4.7uF 20% 10V
C305 1-125-838-11 CERAMIC CHIP 2.2uF 10% 6.3V
C306 1-104-847-11 TANTAL. CHIP 22uF 20.00% 4V
C501 1-164-931-11 CERAMIC CHIP 100PF 10.00% 50V

C502 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C503 1-164-940-11 CERAMIC CHIP 0.0033uF 10.00% 16V
C504 1-164-940-11 CERAMIC CHIP 0.0033uF 10.00% 16V
C505 1-164-943-11 CERAMIC CHIP 0.01uF 10.00% 16V
C508 1-164-938-11 CERAMIC CHIP 0.0015uF 10.00% 50V

C509 1-164-940-11 CERAMIC CHIP 0.0033uF 10.00% 16V
C510 1-164-850-11 CERAMIC CHIP 10PF 0.50PF 50V
C511 1-164-850-11 CERAMIC CHIP 10PF 0.50PF 50V
C513 1-164-850-11 CERAMIC CHIP 10PF 0.50PF 50V
C515 1-107-820-11 CERAMIC CHIP 0.1uF 16V

C516 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C519 1-164-940-11 CERAMIC CHIP 0.0033uF 10.00% 16V
C524 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V
C526 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C527 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V

C529 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V
C530 1-164-939-11 CERAMIC CHIP 0.0022uF 10.00% 50V
C551 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C552 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C557 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V

C558 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C559 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C561 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C601 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C603 1-107-820-11 CERAMIC CHIP 0.1uF 16V

• CAPACITORS:
uF: µF

• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable

• COILS
uH: µH

C604 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C605 1-115-156-11 CERAMIC CHIP 1uF 10V
C606 1-119-750-11 TANTAL. CHIP 22uF 20.00% 6.3V
C607 1-115-156-11 CERAMIC CHIP 1uF 10V
C608 1-107-820-11 CERAMIC CHIP 0.1uF 16V

C609 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C610 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V
C611 1-164-943-11 CERAMIC CHIP 0.01uF 10.00% 16V
C612 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V
C613 1-164-935-11 CERAMIC CHIP 470PF 10.00% 50V

C615 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C616 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C617 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C618 1-109-982-11 CERAMIC CHIP 1uF 10.00% 10V
C698 1-107-820-11 CERAMIC CHIP 0.1uF 16V

C699 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C802 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C803 1-164-935-11 CERAMIC CHIP 470PF 10.00% 50V
C804 1-164-943-11 CERAMIC CHIP 0.01uF 10.00% 16V
C806 1-119-923-11 CERAMIC CHIP 0.047uF 10.00% 10V

C807 1-119-923-11 CERAMIC CHIP 0.047uF 10.00% 10V
C808 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C810 1-164-943-11 CERAMIC CHIP 0.01uF 10.00% 16V
C851 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C853 1-164-942-11 CERAMIC CHIP 0.0068uF 10.00% 16V

C854 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C901 1-137-739-11 TANTALUM 22uF 20% 6.3V
C903 1-104-752-11 TANTAL. CHIP 33uF 20.00% 6.3V
C905 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C907 1-109-982-11 CERAMIC CHIP 1uF 10.00% 10V

C908 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C909 1-164-943-11 CERAMIC CHIP 0.01uF 10.00% 16V
C910 1-164-937-11 CERAMIC CHIP 0.001uF 10.00% 50V
C911 1-135-201-11 TANTALUM CHIP 10uF 20% 4V
C913 1-104-752-11 TANTAL. CHIP 33uF 20.00% 6.3V

C914 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C915 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C916 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C917 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C918 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V

C919 1-135-201-11 TANTALUM CHIP 10uF 20% 4V
C920 1-119-750-11 TANTAL. CHIP 22UF 20.00% 6.3V
C921 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V
C952 1-128-964-11 TANTAL. CHIP 100uF 20% 6.3V
C953 1-107-820-11 CERAMIC CHIP 0.1uF 16V

• SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , uPC... , µPC... ,
uPD..., µPD...

When indicating parts by reference number,
please include the board name.

The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.

MAIN

17

MZ-E501

MAIN

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

C954 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C955 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C956 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C963 1-107-820-11 CERAMIC CHIP 0.1uF 16V

< CONNECTOR >

* CN501 1-778-168-11 CONNECTOR, FFC/FPC (ZIF) 20P
* CN551 1-793-124-21 CONNECTOR, FPC (ZIP) 8P

< DIODE >

R302 1-218-963-11 RES-CHIP 6.8K 5% 1/16W
R303 1-218-981-11 RES-CHIP 220K 5% 1/16W
R501 1-218-971-11 RES-CHIP 33K 5% 1/16W
R503 1-218-953-11 RES-CHIP 1K 5% 1/16W
R505 1-208-691-11 METAL CHIP 2.2K 0.5% 1/16W

R515 1-208-691-11 METAL CHIP 2.2K 0.5% 1/16W
R516 1-208-691-11 METAL CHIP 2.2K 0.5% 1/16W
R517 1-208-691-11 METAL CHIP 2.2K 0.5% 1/16W
R519 1-218-977-11 RES-CHIP 100K 5% 1/16W
R521 1-242-967-11 RES-CHIP 1 5% 1/16W

D101 8-719-056-72 DIODE 02DZ2.4-Z(TPH3)
D201 8-719-056-72 DIODE 02DZ2.4-Z(TPH3)
D801 8-719-085-54 DIODE KPTB-1612LSURKSGC (INFO)
D855 8-719-066-17 DIODE FTZ6.8E-T148
D855 8-719-068-83 DIODE MAZL068D0LS0-TX/L

D901 8-719-081-33 DIODE MA2YD1500LS0
D902 8-719-081-33 DIODE MA2YD1500LS0
D903 8-719-049-09 DIODE 1SS367-T3SONY

< FERRITE BEAD >

FB801 1-414-228-11 FERRITE 0uH
FB802 1-414-228-11 FERRITE 0uH

< IC >

IC301 8-759-598-15 IC TA2131FL(EL)
IC501 8-759-689-67 IC SN761057DBT
IC551 8-759-698-62 IC SC111257FCR2

@ IC601 8-752-413-15 IC CXD2671-207GA

IC801 8-759-566-18 IC AK6480BH-E2

IC901 8-759-698-61 IC XPC18A32FCR2
IC903 8-759-186-89 IC XC61AN0802MR

< JACK >

J301 1-793-288-81 JACK (i)

R601 1-208-635-11 RES-CHIP 10 5% 1/16W
R602 1-218-935-11 RES-CHIP 33 5% 1/16W
R603 1-218-943-11 RES-CHIP 150 5% 1/16W
R605 1-218-965-11 RES-CHIP 10K 5% 1/16W
R606 1-218-977-11 RES-CHIP 100K 5% 1/16W

R607 1-218-977-11 RES-CHIP 100K 5% 1/16W
R609 1-218-981-11 RES-CHIP 220K 5% 1/16W
R612 1-218-959-11 RES-CHIP 3.3K 5% 1/16W
R613 1-218-945-11 RES-CHIP 220 5% 1/16W
R614 1-218-953-11 RES-CHIP 1K 5% 1/16W

R615 1-202-974-11 RES-CHIP 3.3M 5% 1/16W
R802 1-218-990-11 SHORT 0
R804 1-218-973-11 RES-CHIP 47K 5% 1/16W
R806 1-218-977-11 RES-CHIP 100K 5% 1/16W
R807 1-218-959-11 RES-CHIP 3.3K 5% 1/16W

R808 1-218-959-11 RES-CHIP 3.3K 5% 1/16W
R811 1-218-963-11 RES-CHIP 6.8K 5% 1/16W
R812 1-218-965-11 RES-CHIP 10K 5% 1/16W
R813 1-218-967-11 RES-CHIP 15K 5% 1/16W
R814 1-218-971-11 RES-CHIP 33K 5% 1/16W

R815 1-218-975-11 RES-CHIP 68K 5% 1/16W
R817 1-218-941-11 RES-CHIP 100 5% 1/16W
R818 1-218-941-11 RES-CHIP 100 5% 1/16W
R819 1-218-989-11 RES-CHIP 1M 5% 1/16W
R820 1-218-935-11 RES-CHIP 33 5% 1/16W

< COIL >

L503 1-469-570-11 INDUCTOR 10uH
L901 1-419-258-11 INDUCTOR 68uH
L902 1-419-646-11 INDUCTOR 47uH
L904 1-414-398-11 INDUCTOR 10uH
L906 1-419-258-11 INDUCTOR 68uH

< TRANSISTOR >

Q301 8-729-037-52 TRANSISTOR 2SC4738F-Y/GR(TPL3)
Q501 8-729-922-10 TRANSISTOR 2SA1577-T106-QR
Q801 8-729-429-44 TRANSISTOR XP1501-TXE
Q901 6-550-075-01 TRANSISTOR UMZ8NTR
Q902 8-729-037-92 TRANSISTOR 2SD2216J-R(TX).SO

Q903 8-729-037-92 TRANSISTOR 2SD2216J-R(TX).SO

< RESISTOR >

R104 1-208-635-11 RES-CHIP 10 5% 1/16W
R105 1-218-977-11 RES-CHIP 100K 5% 1/16W
R204 1-208-635-11 RES-CHIP 10 5% 1/16W
R205 1-218-977-11 RES-CHIP 100K 5% 1/16W
R301 1-218-935-11 RES-CHIP 33 5% 1/16W

R822 1-218-947-11 RES-CHIP 330 5% 1/16W
R827 1-218-989-11 RES-CHIP 1M 5% 1/16W
R828 1-218-967-11 RES-CHIP 15K 5% 1/16W
R829 1-218-985-11 RES-CHIP 470K 5% 1/16W
R830 1-218-975-11 RES-CHIP 68K 5% 1/16W

R831 1-218-985-11 RES-CHIP 470K 5% 1/16W
R833 1-218-990-11 SHORT 0
R901 1-218-969-11 RES-CHIP 22K 5% 1/16W
R903 1-218-957-11 RES-CHIP 2.2K 5% 1/16W
R906 1-218-989-11 RES-CHIP 1M 5% 1/16W

R907 1-218-979-11 RES-CHIP 150K 5% 1/16W
R909 1-218-965-11 RES-CHIP 10K 5% 1/16W
R910 1-218-965-11 RES-CHIP 10K 5% 1/16W
R911 1-218-973-11 RES-CHIP 47K 5% 1/16W
R913 1-218-989-11 RES-CHIP 1M 5% 1/16W

R914 1-218-977-11 RES-CHIP 100K 5% 1/16W
R915 1-218-977-11 RES-CHIP 100K 5% 1/16W
R916 1-218-989-11 RES-CHIP 1M 5% 1/16W
R920 1-208-707-11 METAL CHIP 10K 0.5% 1/16W
R946 1-208-715-11 METAL CHIP 22K 0.5% 1/16W

R948 1-208-939-11 METAL CHIP 150K 0.5% 1/16W
R950 1-218-953-11 RES-CHIP 1K 5% 1/16W

@Replacement of IC601 used in this set

requires a special tool.

18

MZ-E501

MAIN

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

< COMPOSITION CIRCUIT BLOCK >

RB301 1-233-970-11 RES, NETWORK (CHIP TYPE) 33K
RB302 1-233-966-11 RES, NETWORK (CHIP TYPE) 6.8K
RB551 1-233-959-11 RES, NETWORK (CHIP TYPE) 470
RB552 1-233-973-11 RES, NETWORK (CHIP TYPE) 100K
RB553 1-233-967-11 RES, NETWORK (CHIP TYPE) 10K

< SWITCH >

S801 1-786-033-21 SWITCH, TACTILE (x)
S802 1-786-033-21 SWITCH, TACTILE (>N)
S803 1-786-033-21 SWITCH, TACTILE (.)
S804 1-786-033-21 SWITCH, TACTILE (VOL−)
S805 1-786-033-21 SWITCH, TACTILE (VOL+)

S806 1-786-033-21 SWITCH, TACTILE (GROUP)
S808 1-762-078-11 SWITCH, SLIDE (HOLD)
S809 1-762-498-21 SWITCH, PUSH (1 KEY) (OPEN/CLOSE DETECT)

< VIBRATOR >

X601 1-795-002-11 VIBRATOR, CERAMIC 45.1584MHz

**************************************************************

19

MZ-E501

REVISION HISTORY

Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised
page.

Ver. Date Description of Revision

1.2 2001.12 Supplement-1:Change of board (1-681-868-11→1-681-868-12)

Correction of IC pin function description and exploded views

(ECN-DAB01214)

1.1 2001.11 AEP, French model addition

1.0 2001.07 New

(ENG-01021)