Sony HCDGR-8000 Service manual
HCD-GR8000
SERVICE MANUAL
HCD-GR8000 is the compact disc deck receiver.
The mechanical and electrical specifications of HCD-GR8000 is almost same as HCD-GR7 E
model.
So, this manual contains only the points which differ from HCD-GR7 E model.
For the informations not contained in this manual, please refer to the HCD-D60/GR7/GR7J/RX70
service manual (9-960-853-
• HCD-GR8000 is the tuner, deck,
CD and amplifier section in MHCGR8000.
Amplifier section
Rates RMS power output
Reference RMS power output
Peak music power output: 2800 watts
π π
) previously issued.
SPECIFICATIONS
Thai and Argentine
models:
120 + 120 watts
(6 ohms at 1 kHz,
1% THD, AC 240V)
115 + 115 watts
(6 ohms at 1kHz,
1% THD,
AC 120V/AC 230V)
105 + 105 watts
(6 ohms at 1kHz,
1% THD, AC 110V)
Other models:
120 + 120 watts
(6 ohms at 1 kHz,
1% THD, AC 240V)
115 + 115 watts
(6 ohms at 1kHz,
1% THD, AC 120V)
105 + 105 watts
(6 ohms at 1kHz,
1% THD,
AC 220/AC 110V)
Singaporean and
Malaysian models:
145 + 145 watts
(6 ohms at 1kHz,
10% THD,
AC 230V/AC 120V)
Other models:
145 + 145 watts
(6 ohms at 1 kHz,
10% THD,
AC 220V/AC 110V)
General
Power requirements Thai and Argentine models:
Power consumption: 330 watts
Dimensions (w/h/d) Approx. 280 × 330 × 366
Mass Approx. 12kg
E Model
110 - 120V or 220 - 230V or
240V AC, 50/60 Hz
Adjustable with voltage
selector
Other models:
110 - 120V or 220 - 240V
AC, 50/60 Hz Adjustable
with voltage selector
mm
MICROFILM
COMPACT DISC DECK RECEIVER
TABLE OF CONTENTS
6. DIAGRAMS
Circuit Boards Location ····················································· 3
6-8. Schematic Diagram — Main (2/2) Section — ··················· 4
6-9. Schematic Diagram — Main/Trans Section —·················· 7
6-10. Printed Wiring Board —Main/Trans Section — ·············· 11
6-13. Printed Wiring Board — Power AMP Section — ············ 15
6-14. Schematic Diagram — Power AMP Section — ··············· 17
7. EXPLODED VIEWS
(1) Case, MD Assy Section···················································· 19
(2) Front Panel Section ·························································· 20
(3) Chassis Section·································································21
8. ELECTRICAL PARTS LIST ··································· 22
CAUTION
Use of control or adjustments or performance of procedures
other than those specified hereinmay result in hazardous
radiation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on the
rear exterior.
MODEL IDENTIFICATION
— BACK PANEL —
MODEL PART NO.
E 4-993-650-01
SP, MY, TH, AR 4-993-650-21
EA 4-993-650-31
• Abbreviation
EA : Saudi Arabia
MY : Malaysia
SP : Singapore
TH : Thailand
AR : Argentine
Laser component in this product is capable of emitting radiation
exceeding th elimit for Class 1.
The following caution label is located inside the unit.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY .
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pickup block. Therefor , when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
Note on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iro around 270 ˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor whe soldering
or unsoldering.
— 2 —
HCD-GR8000
D
MOTOR (TURN) board
MOTOR (SLIDE) board
CONNECTOR board
BD board
AUDIO board
LEAF SWITCH board
SENSOR board
MOTOR board
• Circuit Boarts Location
CD SW board
PANEL board
HP/MIC board
TC SW board
TRANSFORMER board
DECO board
SECTION 6
DIAGRAMS
TRANSFORMER SW board
POWER (R) board
ENCAPSULATE
COMPONENT
6-8. SCHEMATIC DIAGRAM — MAIN (2/2) SECTION —
(Refer to the HCD-D60/GR7/GR7J/RX70 service manual page 51.)
• Refer to page 11 for Printed Wiring Board (MAIN BOARD)
POWER (L) board
MAIN board
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF 50WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in Ω and 1/4W or less unless otherwise specified.
•B+ : B+ Line.
•B– : B– Line.
• : adjustment for repair.
•Voltages are dc with respect to ground under no-signal
conditions.
no mark: FM TUNER
•Voltages are taken with a VOM (Input impedance 10MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Signal path
: PB (DECK A)
: PB (DECK B)
: PB (DECK B)
— 3 — — 4 — — 5 — — 6 —
Loading...