• HBD-E2100 is the amplifi er, video, HDMI, BD/DVD/CD system, USB, LAN,
wireless LAN, Bluetooth, NFC and FM tuner section in BDV-E2100.
• HBD-E3100 is the amplifi er, video, HDMI, BD/DVD/CD system, USB, LAN,
wireless LAN, Bluetooth, NFC and FM tuner section in BDV-E3100.
• HBD-E3200 is the amplifier, video, HDMI, BD/DVD/CD system, USB, LAN,
wireless LAN, Bluetooth, NFC and FM tuner section in BDV-E3200.
• HBD-E4100 is the amplifi er, video, HDMI, BD/DVD/CD system, USB, LAN,
wireless LAN, Bluetooth, NFC and FM tuner section in BDV-E4100.
• HBD-E6100 is the amplifi er, video, HDMI, BD/DVD/CD system, USB, LAN,
wireless LAN, Bluetooth, NFC and FM tuner section in BDV-E6100.
US Model
HBD-E2100/E3100
Canadian Model
Singapore Model
HBD-E2100/E3100/E4100/E6100
AEP Model
Taiwan Model
HBD-E2100/E4100/E6100
UK Model
HBD-E2100/E3100/E4100
Chinese Model
HBD-E4100/E6100
E Model
HBD-E2100/E3100/E3200/E4100/E6100
Argentina Model
BDV-E2100/E4100
Australian Model
HBD-E2100/E6100
Russian Model
Saudi Arabia Model
Model Name Using Similar MechanismBDP-S3100
Mechanism TypeBPX-7
Optical Pick-up Block NameKEM480AAA
Amplifi er Section
US model only:
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
(FTC)
Front L + Front R: With 3 ohms loads, both channels driven, from
180 Hz - 20,000 Hz;
rated 50 watts per channel
minimum RMS power, with no more than 1%
total harmonic distortion from 250 milliwatts to
rated output.
BDV-E6100/BDV-E4100/BDV-E3100/BDV-E3200
BDV-E2100 (Except UK model):
POWER OUTPUT (rated)
Front L/Front R: 75 W + 75 W (at 3 ohms, 1 kHz, 1% THD)
POWER OUTPUT (reference)
Front L/Front R/Surround L/Surround R:
125 W (per channel at 3 ohms, 1 kHz)
Center: 250 W (at 6 ohms, 1 kHz)
Subwoofer: 250 W (at 6 ohms, 80 Hz)
Inputs (Analog)
AUDIO IN Sensitivity: 1 V/400 mV
MIC 1/2 Sensitivity: 10 mV (Singapore model)
Inputs (Digital)
TV (Audio Return Channel/OPTICAL)
Supported formats: LPCM 2CH
(up to 48 kHz), Dolby Digital, DTS
BDV-E2100 (UK model)
POWER OUTPUT (rated)
Front L/Front R: 75 W + 75 W (at 3 ohms, 1 kHz, 1% THD)
POWER OUTPUT (reference)
Front L/Front R/Surround L/Surround R:
100 W (per channel at 3 ohms, 1 kHz)
Center: 200 W (at 6 ohms, 1 kHz)
Subwoofer: 200 W (at 6 ohms, 80 Hz)
BDV-E4100/ BDV-E6100 (Chinese model)
POWER OUTPUT
Front L/Front R/Surround L/Surround R:
75 W (per channel at 3 ohms, 1 kHz)
Center: 150 W (at 6 ohms, 1 kHz)
Subwoofer: 150 W (at 6 ohms, 80 Hz)
Inputs (Analog)
AUDIO IN Sensitivity: 1 V/400 mV
Inputs (Digital)
TV (Audio Return Channel/OPTICAL)
Supported formats: LPCM 2CH (up to 48 kHz),
Dolby Digital, DTS
HDMI Section
Connector Type A (19 pin)
BD/DVD/CD System
Signal format system NTSC/PAL (except US, PX and Canadian models)
NTSC (US, PX and Canadian models)
USB Section
(USB) port: Type A (For connecting USB memory, memory
card reader, digital still camera, and digital video
camera)
LAN Section
LAN (100) terminal 100 BASE-TX Terminal
Wireless LAN Section
Standards Compliance IEEE 802.11 b/g/n
Frequency and Channel US, Canadian, Argentina and Taiwan models:
2.4 GHz band: channels 1–11
Other models:
2.4 GHz band: channels 1–13
Frequency band 2.4000 GHz - 2.4835 GHz
Communication system Bluetooth Specification version 3.0
Output Bluetooth Specification Power Class 2
Maximum communication range
Line of sight approx. 10 m
(except US, PX and Canadian models)
Line of sight approx. 10 m (33ft)
(US, PX and Canadian models)
Frequency band 2.4 GHz band
Supported Codecs3) SBC4), AAC
Transmission range (A2DP)
20 Hz – 20,000 Hz (Sampling frequency
44.1 kHz, 48 kHz)
1)
The actual range will vary depending on factors such as obstacles
between devices, magnetic fields around a microwave oven, static
electricity, cordless phone, reception sensitivity, antenna’s perfor mance, operating system, software application, etc.
2)
Bluetooth standard profiles indicate the purpose of Bluetooth
communication between devices.
3)
Codec: Audio signal compression and conversion format
4)
Subband Codec
2)
A2DP 1.2 (Advanced Audio Distribution
Profile)
AVRCP 1.3 (Audio Video Remote Control
Profile)
1)
1)
BLU-RAY DISC/DVD RECEIVER
Page 2
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
FM Tuner Section
System PLL quartz-locked digital synthesizer
Tuning range 87.5 MHz - 108.0 MHz (50 kHz step)
(except US, PX and Canadian models)
87.5 MHz - 108.0 MHz (100 kHz step)
(US, PX and Canadian models)
Antenna (aerial) FM wire antenna (aerial)
General
Power requirements US and Canadian models:
120 VAC, 60 Hz
Taiwan model:
120 V AC, 50/60 Hz
Latin-American, 110 – 240 V AC area in
E model and PX models:
110 V – 240 V AC, 50/60 Hz
Saudi Arabia model:
127 V – 240 V AC, 50/60 Hz
Other models:
220 V – 240 V AC, 50/60 Hz
Power consumption On: 95 W
Standby: 0.3 W
Dimensions (w/h/d) (approx.)
430 mm × 50.5 mm × 296 mm
(17 in × 2 in × 11
Mass (approx.) 2.7 kg (5 lb 16 oz)
Design and specifications are subject to change without notice.
• Standby power consumption: 0.3 W.
• Over 85% power efficiency of amplifier block is achieved with the full digital amplifier, S-Master.
• This system incorporates with Dolby* Digital and Dolby Pro Logic adaptive matrix surround
decoder and the DTS** Digital Surround System.
* Manufactured under license from Dolby Laboratories.
Dolby, Pro Logic, and the double-D symbol are trademarks of Dolby Laboratories.
** Manufactured under license under U.S. Patent Nos: 5,956,674; 5,974,380; 6,226,616;
• This system incorporates High-Defi nition Multimedia Interface (HDMI
The terms HDMI and HDMI High-Defi nition Multimedia Interface, and the HDMI Logo are
trademarks or registered trademarks of HDMI Licensing LLC in the United States and other
countries.
• Java is a trademark of Oracle and/or its affi liates.
• “DVD logo” is a trademark of DVD Format/ Logo Licensing Corporation.
• “Blu-ray Disc”, “Blu-ray”, “Blu-ray 3D”, “BD-LIVE”, “BONUSVIEW”, and logos are trademarks of the Blu-ray Disc Association.
• “Blu-ray Disc”, “DVD+RW”, “DVD-RW”, “DVD+R”, “DVD-R”, “DVD VIDEO”, and “CD”
logos are trademarks.
• “BRAVIA” is a trademark of Sony Corporation.
• “AVCHD 3D/Progressive” and the “AVCHD 3D/Progressive” logo are trademarks of Panasonic
Corporation and Sony Corporation.
, “XMB”, and “xross media bar” are trademarks of Sony Corporation and Sony Computer
•
Entertainment Inc.
• “Playstation” is a registered trademark of Sony Computer Entertainment Inc.
• “Sony Entertainment Network logo” and “Sony Entertainment Network” are trademarks of Sony
Corporation.
• Music and video recognition technology and related data are provided by Gracenote®.
Gracenote is the industry standard in music recognition technology and related content delivery.
For more information, please visit www.gracenote.com.
cenote apply to this product and service. See the Gracenote website for a nonexhaustive list of
applicable Gracenote patents. Gracenote, CDDB, MusicID, MediaVOCS, the Gracenote logo
and logotype, and the “Powered by Gracenote” logo are either registered trademarks or trademarks of Gracenote, Inc. in the United States and/or other countries.
• Wi-Fi®, Wi-Fi Protected Access® and Wi-Fi Alliance® are registered marks of the Wi-Fi
Alliance.
• Wi-Fi CERTIFIED™, WPA™, WPA2™ and Wi-Fi Protected Setup™ are marks of the Wi-Fi
Alliance.
• The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the United States and
in other countries.
• Android is a trademark of Google Inc.
• The Bluetooth
and any use of such marks by Sony Corporation is under license. Other trademarks and trade
names are those of their respective owners.
• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and
Thomson.
• This product incorporates proprietary technology under license from Verance Corporation and
is protected by U.S. Patent 7,369,677 and other U.S. and worldwide patents issued and pending
as well as copyright and trade secret protection for certain aspects of such technology. Cinavia
is a trademark of Verance Corporation. Copyright 2004-2010 Verance Corporation. All rights
reserved by Verance. Reverse engineering or disassembly is prohibited.
®
word mark and logos are registered trademarks owned by Bluetooth SIG, Inc.
¾ in) incl. projecting parts
TM
) technology.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
• Windows Media is either a registered trademark or trademark of Microsoft Corporation in the
United States and/or other countries.
This product is protected by certain intellectual property rights of Microsoft Corporation. Use
or distribution of such technology outside of this product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
Content owners use Microsoft
tellectual property, including copyrighted content. This device uses PlayReady technology to
access PlayReady-protected content and/or WMDRM-protected content. If the device fails to
properly enforce restrictions on content usage, content owners may require Microsoft to revoke
the device’s ability to consume PlayReady-protected content. Revocation should not affect unprotected content or content protected by other content access technologies. Content owners may
require you to upgrade PlayReady to access their content. If you decline an upgrade, you will not
be able to access content that requires the upgrade.
• DLNA™, the DLNA Logo and DLNA CERTIFIED™ are trademarks, service marks, or certifi -
cation marks of the Digital Living Network Alliance.
• Opera® Devices SDK from Opera Software ASA. Copyright 1995-2013 Opera Software ASA.
All rights reserved.
• All other trademarks are trademarks of their respective owners.
• Other system and product names are generally trademarks or registered trademarks of the manufacturers. ™ and ® marks are not indicated in this document.
®
PlayReady™ content access technology to protect their in-
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
ATTENTION AU COMPOSANT AYANT RAPPORT
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
À LA SÉCURITÉ!
2
Page 3
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
HBD-E2100/E3100/ E3200/E4100/E6100
Ver. 1.5
To Exposed Metal
Parts on Set
AC
1.5 kΩ0.15 μF
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
8. ELECTRICAL PARTS LIST .............................. 82
This appliance is classified as a
CLASS 3R LASER product.
Visible and invisible laser radiation
is emitted when the laser protective
housing is opened, so be sure to
avoid direct eye exposure.
This marking is located on the laser
protective housing inside the
enclosure.
4
This appliance is classified as a
CLASS 1 LASER product. This
marking is located on the rear
exterior.
The nameplate is located on the
bottom exterior.
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Page 5
HBD-E2100/E3100/E3200/E4100/E6100
SECTION 1
SERVICING NOTES
Ver. 1.5
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press the [
2. Touch the [FUNCTION] sensor to select “BD/DVD”.
3. Touch the [x] and [Z] sensors simultaneously and hold down
until “D. OFF” displayed on the fluorescent indicator tube
(around 5 seconds).
Note: When “D. LOCK” is displayed, the disc tray lock is not released by
turning power on/off with the [
ABOUT THE LENS CLEANING
Do not do the lens cleaning with the cotton bud etc. It causes the
trouble.
] button to turn on the system.
?/1
] button.
?/1
NOTE OF REPLACING THE IC101, IC102, IC103,
IC203, IC204, IC601, IC706, IC801 AND IC1001 ON
THE MB1002 BOARD
IC101, IC102, IC103, IC203, IC204, IC601, IC706, IC801 and
IC1001 on the MB1002 board cannot exchange with single. When
these parts on the MB1002 board are damaged, exchange the entire
mounted board.
NOTE OF REPLACING THE IC102 AND IC103 ON
THE MB1002 BOARD
Replacement of IC102 and IC103 on the MB1002 board used in
this unit requires a special tool.
TEST DISC
Part No.DescriptionLayer
J-6090-199-ABLX-104Single Layer
J-6090-200-ABLX-204Dual Layer
J-2501-307-ACD (HLX-A1)
J-2501-305-AHLX-513Single Layer (NTSC)
J-2501-306-AHLX-514Dual Layer (NTSC)
J-6090-077-AHLX-506Single Layer (PAL)
J-6090-078-AHLX-507Dual Layer (PAL)
Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-
989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.
Operation and Display:
1. BLX-104
Procedure:
1. Select 23.976Hz/1080p.
2. Play “4.Motion picture”.
3. Check whether player can play back or not.
4. Check each outputs.
Video:
Composite/S Video/component/HDMI.
Audio:
Speaker out.
* When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz)
can use instead of 1080/24p.
However this is temporary correspondence.
2. BLX-204
Procedure:
1. Select 1080i (59.94Hz or 50Hz).
2. Play “4.Motion picture”.
3. Check whether player can play back or not (Check the picture
and sound output).
3. CD (HLX-A1)
Procedure:
Check whether player can play back or not (Check the sound output).
4. HLX-513/514 (NTSC), HLX-506/507 (PAL)
Procedure:
1. After displayed Main Menu, select “1.Video Signal”.
2. Play “1.Color bar 100%” (Check the picture and sound output).
3. Return to Menu.
4. Play “Demonstration 4:3” or “Demonstration 16:9” (Check the
picture and sound output).
5
Page 6
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
NOTE OF REPLACING THE OPTICAL DEVICE
(KEM480AAA) OR MB1002 BOARD
The password will be supplied to only service HQ, and
service center name, q’ty and all of software registered
information should be maintained by service HQ, and
Audio will ask to report the registration information.
Optical device (KEM480AAA) for BD requires precise read out
functions and secure contents protection system for more than past
DVD/CD.
Therefore, in the case repaired as follows, the writing work of the
OP data is necessary.
• When the optical device (KEM480AAA) is replaced (The
MB1002 board doesn’t replace).
• When both the optical device (KEM480AAA) and MB1002
board are replaced.
• When the MB1002 board is replaced (The optical device
(KEM480AAA) doesn’t replace) (In this case, do the work of
“3. Optical device (KEM480AAA) replacement” other than
the replacement of new optical device).
Note: The servo adjustment is done while writing the OP data. The manual
adjustment is unnecessary.
LD ON TIME history doesn’t carry over.
Do not touch any optical block parts, turn table and during replac-
ing. BD laser diode is very sensitive.
1. Preparation
1-1. ESD Countermeasure
It is necessary to confi rm the state of static electricity in the work
space before the repair is started.
The static electricity resistance of the BD laser is weaker than that
of the DVD/CD laser.
Do work space and worker’s ESD countermeasures to prevent destruction by ESD.
1-2. Jig
• Digital camera (Recommend with macro mode)
• USB memory
• PC
• Barcode decoder (Refer to “1-3. Barcode decoder
(BDPRdec)”)
1-3. Barcode decoder (BDPRdec)
Jig name : BDPRdec.exe
Release : 2011.8.25
Version : 3.0.0.0
Software contents :
• BDPRdec.exe : Barcode decoder software
• SavePath.ini : Decoded fi le destination setting fi le (Ini-
tial destination is “C:\BD\BuData.txt”)
• TasmanBars.dll : Decode dll
• Uninst.exe : Uninstall the “BDPRdec.exe” from PC
Install procedure:
1. Unzip the barcode decoder fi les to any PC folder.
2. Check the attached 2D code photo (OK_sample.JPG) drag &
drop onto “BDPRdec.exe”.
When the barcode decoder is used for the fi rst time, the pass-
word is necessary. It is unnecessary since the second times.
Note 1: The password will be supplied to only service headquarters, and
service center name/q’ty/all of software registered information
should be maintained by service headquarters.
Note 2: Do not change the decoded fi le name “BuData.txt”.
3. When “.NET frame work requirements” is displayed, down-
load following applications from Microsoft download site.
• Microsoft .NET Framework Version 2.0 Redistributable Pack-
Case 1 Drag & drop 2D code photo onto “BDPRdec.exe”.
Case 2 Drag & drop BU data fi le onto “BDPRdec.exe”.
Data fi le name be changed to specify format and end of
7 character are defi ned.
You can also enter the fi le path at the prompt.
6
Page 7
HBD-E2100/E3100/E3200/E4100/E6100
2. Pass-fail judgment of the optical device (KEM480AAA)
Perform pass-fail judgment to judge whether the repair of the optical device (KEM480AAA) is necessary.
2-1. Flow of drive section check
Ver. 1.5
Confirm whether
BD (BLX-104) can be
reproduced
YES
Confirm whether
DVD (HLX-513)/
CD (HLX-A1) can be
reproduced
Note: Refer to “2-11. OPTICAL PICK-UP BLOCK (KEM480AAA), WIRE (FLAT TYPE)” (page 20) about how to remove the COVER, DRIVE.
Confirm whether the
NO
NO
drive voltage is the
following values
Q205 pin 1 : 12 V
Q206 pin 1 : 5 V
YES
Confirm OP FFC cable
(Part No. 1-846-347-11)
and SPD FFC cable
(Part No. 1-846-349-61),
and replace it when it
has been damaged
Then, confirm whether
this unit operates
normally
YES
OK
Confirm F201, F202,
NO
F203 on the MB1002
board, and replace it
when it is open.
NONO
Confirm whether the
optical device IOP
is normal in the
service mode
(Refer to “2-2. Flow
of optical device
IOP check”)
Replace the
optical device
(KEM480AAA)
(Refer to “3. Optical
device (KEM480AAA)
replacement”)
2-2. Flow of optical device IOP check
Turn the power on,
and change function
to “BD/DVD”
Press the buttons on
the remote commander
in order of [DISPLAY],
[0], [2], [1] [SUBTITLE],
and enter the service
mode
Press the buttons on
the remote commander
in order of [8], [7], [3],
[ ], and the
dIOP value is displayed
Confirm whether
value is the
specification value
Specification value:
BD : ±6 mA
DVD/CD: ±9 mA
YES
OK
NO
Replace the
optical device
(Refer to “3. Optical
device (KEM480AAA)
replacement”)
7
Page 8
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
3. Optical device (KEM480AAA) replacement
Flow of replacement:
Note: The photo in fl ow is an image.
Barcode label on
new optical device
(KEM480AAA)
bottom side
Take photo (JPEG)
by digital camera
Change photo into
the text data with
the barcode decoder
Save the text data
to USB memory
(memory capacity
need not be 8GB)
Connect USB memory
with front USB connector
on this unit, and read the
text data by the service mode
Procedure:
1. Remove the INSULATOR (4 pieces) and broken optical device (KEM480AAA) from LOADING ASSY.
2. Take photo of the barcode on new optical device
(KEM480AAA) bottom side by digital camera.
3. Assemble the INSULATOR (4 pieces) to new optical device
(KEM480AAA), fi x (Torque value: 2 kgf) it to LOADING
ASSY with screw, and assemble this unit.
4. Drag & drop the taken photo by step 2 to “BDPRdec.exe”, and
make the text data (File name: BuData.txt).
5. Save the text data to USB memory.
6. Connect USB memory with front USB connector on this unit,
and turn the power on.
– Front view –
(E2100)
\/1
Front USB connector
(E3100/E4100/E6100)
\/1
Front USB connector
7. Press the [FUNCTION] button on the remote commander to
select “BD/DVD”.
8. Press the buttons on the remote commander in order of
[DISPLAY], [0], [2], [1], [SUBTITLE], and enter the service
mode.
9. Press the buttons on the remote commander in order of [8], [1],
[ENTER], and execute “[1] Drive OP data Write”. BDV must
select Mode 1.
10. Turn the power off after writing the OP data.
11. Turn the power on, and enter the service mode again.
12. Press the buttons on the remote commander in order of [8], [7],
[3], [ENTER], and the dIOP value is displayed.
13. Confi rm value is the following specifi cation value, and turn the
power off.
Specifi cation value:
BD : 6 mA
DVD/CD : 9 mA
14. Turn the power on, confi rm playback performance of the BD
(BLX-104)/DVD (HLX-514)/CD (HLX-A1).
15. Completely assemble this unit, and complete the repair.
8
Page 9
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
NOTE OF REPLACING MB1002 BOARD OR WLAN/
BT COMBO CARD
When the MB1002 board or WLAN/BT COMBO card are replaced, please execute the below service mode.
1. Please update FW to M16.R.157
2. Whenever replace MB1002 board or WLAN/BT COMBO
CARD please execute “Reset to Factory Default Settings”
from XMB.
Procedure:
[Home menu
Setup Resetting Reset to Factory Default
Settings All Settings]
Next, go to service menu and execute “(1) Bluetooth Enable” and
“(3) Write Bluetooth device address to Registry”.
Finally check one touch NFC listening function at normal power
on.
Note: The operation in this mode must use a remote commander
and TV monitor.
1. Connect this unit with TV monitor.
2. Press the
Press button in order of the [DISPLAY] [0] [2] [1]
3.
(\/1) button to turn the power on.
[SUBTITLE] on the remote commander.
(Make the interval when each button is pressed within two
seconds)
4. Enter the BD service mode. The OSD menu on TV monitor can
be operated by remote commander.
5. Press [m] and Enter Diag.
6. Press [,] and Enter Bluetooth Device Test (Screen 1).
7. Enter (1) Bluetooth Enable, wait until the display show
“ Status : Bluetooth Enable Successful ” (Screen 2).
8. Enter (3) Write Bluetooth device address to Registry, wait until
the display show “Bluetooth Device Address” and “Status :
Write Successfull” (Screen 3).
9. Enter [RETURN] to the selection of test category.
(Screen 1)
Diag
Category: Bluetooth Device Test
NOTE THE BD DRIVE (BPX-7) PARTS REPLACING
The mechanism blocks except optical device of BD drive (BPX-7)
are chiefl y composed of the following parts.
• HOLDER, CHUCK ASSY
• LOADING ASSY
• COVER, DRIVE
These parts are produced by two venders, it is not compatible.
Therefore, HOLDER, CHUCK ASSY and LOADING ASSY
are supplied by one pair as repair parts. Please exchange both
HOLDER, CHUCK ASSY and LOADING ASSY at the same
time.
COVER, DRIVE need not be exchanged at the same time.
Note 1: The laser caution label is not pasted to LOADING FOR SER-
VICE. Please peel off an original laser caution label, and paste
it to LOADING FOR SERVICE when you use LOADING FOR
SERVICE.
LABEL, LASER CAUTION
LOADING FOR SERVICE
HOLDER, CHUCK ASSY
LOADING ASSY
(Screen 2)
(Screen 3)
Diag
Category: Bluetooth Device Test
[1] Bluetooth Enable
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry
[4] Bluetooth Inquiry Test
Status : Bluetooth Enable Successful!
HELP: [UP][DOWN][ENT][RET]
Diag
Category: Bluetooth Device Test
[1] Bluetooth Enable
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry
[4] Bluetooth Inquiry Test
Bluetooth device address : 00:01:36:23:FD:CF
Status : Write Successful!
HELP: [UP][DOWN][ENT][RET]
COVER, DRIVE
/LPLWVDPSOHLQVWDWHRIODVHUFDXWLRQODEHO
If laser caution label is a condition of the figure below,
Note 2:
it is acceptable.
9
Page 10
HBD-E2100/E3100/E3200/E4100/E6100
–
Ver. 1.5
MODEL IDENTIFICATION
- Rear view -
Part No.
ModelPart No.
E2100
E3100
E4100
E6100
E3200
4-438-896-0[]
4-438-896-1[]
4-438-896-2[]
4-438-896-3[]
4-438-896-6[]
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
NOTE OF REPLACING THE IC3102 AND IC3302 ON
THE AMP BOARD AND THE COMPLETE AMP BOARD
When IC3102 and IC3302 on the AMP board and the complete
AMP board are replaced, it is necessary to spread the compound
(GREASE (G-747)) 1KG) (Part No. 7-640-004-33 ) between parts
and heat sink.
Spread the compound referring to the fi gure below.
– AMP Board (Component Side) –
IC3102IC3302
C402
C504 C503
(To both ends of each capacitor)
800 :/2 W
C207
C201
IC3302IC3102
10
Page 11
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
CHECKING METHOD OF NETWORK OPERATION
It is necessary to check the network operation, when replacing the
MB1002 board. Check the operation of wireless and wired LAN,
according to the following method.
1. Checking Method of Wireless LAN Operation
Check that access point is recognized surely.
Necessary Equipment:
Wireless access point with router function (AP)
Procedure:
1. Press the [HOME] button on the remote commander to enter
the home menu.
2. Press the [m]/[M]/[<]/[,] buttons on the remote command-
er to select “Network Settings”“Internet Settings”, and press
] button on the remote commander.
the [
3. Press the [m]/[M] buttons on the remote commander to select
“Wireless Setup (built-in)”, and press the [ ] button on the
remote commander.
4. The system starts searching for access points, and displays a
list of up available network name (SSID).
5. Check that access point (SSID) is displayed on the searching
result.
Note: Refer to the instruction manual about details of the setting method.
2. Checking method of wired LAN operation
Check that access point is recognized surely.
Procedure:
1. Connect the main unit to the router or the hub, etc. with the
LAN cable.
2. Press the [HOME] button on the remote commander to enter
the home menu.
Press the [m]/[M]/[<]/[,] buttons on the remote commander
3.
to select “Network Settings”“Internet Settings”, and press
the [ ] button on the remote commander.
4. Press the [m]/[M] buttons on the remote commander to select
“Wired Setup”, and press the [ ] button on the remote commander.
5. Press the [m]/[M] buttons on the remote commander to select
“Auto”, and press the [ ] button on the remote commander.
6. Press the [,] button on the remote commander.
7. Press the [m]/[M] buttons on the remote commander to select
“Save & Connect”, and press the [ ] button on the remote
commander.
8. When “Internet Settings is now complete.” appears, then press
the [ ] button on the remote commander.
9. Press the [HOME] button on the remote commander to enter
the home menu.
10. Press the [m]/[M]/[<]/[,] buttons on the remote commander
to select “Network Settings”“Network Connection Diagnostics”,
and press the [ ] button on the remote commander.
11. Press the [<]/[,] buttons on the remote commander to select “IPV4” or “IPV6”, and press [ ] button on the remote
commander.
12. Press the [<]/[,] buttons on the remote commander to
select “Start”, and press the [ ] button on the remote commander.
13. Check that IP address can be acquired.
Note: Refer to the instruction manual about details of the setting method.
11
Page 12
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
Note 1: After the case is removed, this work is done.
Note 2: Please prepare the thin wire (clip etc. processed to the length of 8 cm or more).
1 Remove the case.
(Illustration of disassembly is omitted.)
hole
– Side view –
Insert the clip etc.
processed to the
length of 8 cm or
more in the hole
on the side of the
chassis and push.
• Abbreviation
AR
AUS : Australian model
CH : Chinese model
CND : Canadian model
E3 : 240 V AC area in E model
E12 : 220 – 240 V AC area in E model
E32 : 110 – 240 V AC area in E model
E51 : Chilean and Peruvian models
EA : Saudi Arabia model
MX6 : Latin-American model
PX : PX model
RU : Russian model
SAF : South African model
SP : Singapore model
TH : Thai model
TW : Taiwan model
: Argentina model
Page 13
DISASSEMBLY
• This set can be disassembled in the order shown below.
• Abbreviation
AR : Argentina model
AUS : Australian model
CH : Chinese model
CND : Canadian model
E3 : 240 V AC area in E model
E12 : 220 – 240 V AC area in E model
E32 : 110 – 240 V AC area in E model
E51 : Chilean and Peruvian models
EA : Saudi Arabia model
MX6 : Latin-American model
PX : PX model
RU : Russian model
SAF : South African model
SP : Singapore model
TH : Thai model
TW : Taiwan model
This illustration sees the loading assy (T) from bottom side.
Note:
3 wire (flat type) (9 core)
4 Through the hole
terminal face
Fold
loading assy (T)
1 flexible flat cable (45 core)
Fold
2 Through the hole
5 tape, FFC
terminal face
loading assy (T)
9 cover, drive
7 tape, non-halogene
8
6 wire (flat type)
(5 core)
Under the
guide
20
Under the guide
(Fold area)
Page 21
HBD-E2100/E3100/E3200/E4100/E6100
SECTION 3
TEST MODE
Ver. 1.5
COLD RESET
The cold reset clears certain data in this system without initialize
Personal Information and some BD operation data. Execute this
mode when returning the unit to the customers.
Procedure:
1. Press the [
] button to turn the power on.
?/1
2. Press the [x] and [VOL –] buttons simultaneously and hold
down (around 5 seconds).
3. The message “WAIT” appears then “RESET” appears on fl uo-
rescent indicator tube, then becomes standby states.
DEMO MODE
This mode let you lock the disc tray. When this mode is activated,
the disc will not eject when the [
] button is pressed. The message
Z
“D. LOCK” will be displayed on the fluorescent indicator tube.
Procedure:
1. Press the [
] button to turn the power on.
?/1
2. Press the [FUNCTION] button to select the “BD/DVD”.
3. Insert a disc.
4. During stop condition, press the [x] and [Z] buttons
simultaneously and hold down (around 5 seconds) until
“D. LOCK” displayed on the fluorescent indicator tube.
Releasing method:
Press the [x] and [Z] buttons simultaneously and hold down
(around 5 seconds) until “D. OFF” displayed on the fl uorescent
indicator tube.
FACTORY INITIALIZE
Return all of the unit setting to their factory defaults.
Note 1: Disconnect the following connections when you use this mode.
USB LANNote 2: The operation in this mode must use a remote commander and TV
monitor.
Procedure:
1. Press the [
] button to turn the power on.
?/1
2. Press the [HOME] button on the remote commander, and the
home menu is displayed.
3. Select “Setup” “Resetting”, and press the [
] button on the
remote commander.
Easy Network Settings
Resetting
PANEL TEST
Procedure:
1. Press the [
] button to turn the power on.
?/1
2. Press button in order of the [DISPLAY] [0] [0] [1]
[SUBTITLE] on the remote commander (Make the interval
when each button is pressed within two seconds).
3. All segments in fl uorescent indicator tube are lighted up. And
half segments in fl uorescent indicator tube are lighted up, oth-
ers half segments in fl uorescent indicator tube are lighted up,
then all segments in fl uorescent indicator tube are lighted up.
This operation is repeated.
4. In the state of step 3, press the [VOL +] button on the remote
commander and model information is displayed on the fl uores-
cent indicator tube.
Each time the [VOL +] button on the remote commander is
pressed, the display changes from destination information,
STR version, special mode in this order, and returns to the
model information display.
5. In the state of step 3, press the [FUNCTION] button on the
remote commander and “K 0” is displayed on the fluorescent
indicator tube.
“K 0” value increases whenever a button or sensor on the unit
is pressed. However, once a button or sensor has been pressed,
it is no longed taken into account.
All button and sensors on the unit are pressed, “OK” and “K 9”
are alternately displayed on the fluorescent indicator tube.
Releasing method:
To release from this mode, press the [
?/1
] button.
4. Select “Initialize Personal Information”, and press the [
button on the remote commander.
Reset to Factory Default Settings
Initialize Personal Information
Delete personal data when disposing
5. Select “OK”, and press the [ ] button on the remote commander.
Initialize Personal Information
The information below will be deleted.
Do you want to proceed?
- Playback history
- Internet video utilization information
OK
Cancel
]
21
Page 22
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6. The message “Close” appears, and press the [
] button on the
remote commander.
Initialize Personal Information
Initialization complete.
Close
7. Select “Reset to Factory Default Settings”, and press the [
button on the remote commander.
Reset to Factory Default Settings
Restore each setting to the factory d
Initialize Personal Information
8. Select “All Settings”, and press the [ ] button on the remote
commander.
BD SERVICE MODE
Note: The operation in this mode must use a remote commander and TV
monitor.
Setting method of the BD service mode:
1. Connect this unit with TV monitor.
2. Press the [
] button to turn the power on.
?/1
3. Press button in order of the [DISPLAY] [0] [2] [1]
[SUBTITLE] on the remote commander. (Make the interval
when each button is pressed within two seconds)
4. Enter the BD service mode. The OSD menu on TV monitor
can be operated by remote commander.
1. Main Functions
• Diag
Performs unit test of devices installed on the board.
• Log
Error log is displayed. Displayed contents can also be saved in
]
an USB memory device.
• Factory Initialize
Restores the unit to its factory settings.
• Network
Checks the wired network connection.
• Version Up
• System Information
Displays the system information of the unit.
Displays information such as the software version, drive infor-
mation, etc.
• EMC Test Mode
Not used.
• Drive
Write drive OP data and check drive.
• HDD Mode
Not used.
Reset to Factory Default Settings
Screen Settings
Audio Settings
BD/DVD Viewing Settings
Parental Control Settings
System Settings
Network Settings
All Settings
9. Select “Start”, and press the [ ] button on the remote commander.
All Settings
Restore all settings to the factory default
settings. The system will turn off after
reset.
Start
Cancel
10. Initialization ends when the message “HELLO” on the
fl uorescent indicator tube disappears.
This is the top menu of service mode.
Each function is accessed from this screen.
Operation:
[1] Moves to Diag screen
[2] Moves to Log screen
[3] Moves to Factory Initialize screen
[4] Moves to Network screen
[5] Moves to Version Up (DISC version update) screen
[6] Moves to System Information screen
[7] Moves to EMC test mode screen (Not used)
[8] Moves to Drive screen
[9] Moves to HDD mode (Not used)
]/[m] Moves the cursor
[
M
[ ] Moves to the screen of the item selected with the cursor
(Screen 1)
Diag
Category:
Diag
Device Test
Category: Device Test
USB Host
Device:
Front USB Media check ... OK
Checking...
* Cursor is not displayed when the menu is fi rst displayed.
Service Mode Menu
[1] Diag
[1] Diag
[2] Log
[3] Factory Initialize
[4] Network
[5] Version Up
[6] System Information
[7] EMC Test Mode
[8] Drive
9] HDD mod
HELP : [UP] [DOWN] [ENT] [NUM]
HELP (currently available keys, etc.) is displayed
4. Diag (Device Test)
This screen is used to test devices mounted on the board.
Screen 1: Selects the test category
Operation:
[<]/[,] Selects the category
[m]/[ ] Moves to the selected category
[RETURN] Returns to the service top menu
(Screen 2)
HELP: [RIGHT] [UP] [ENT] [RET]
• Device Test: List of devices
USB Host : USB media check (front). Only one time.
5. Diag (Video/Audio Test)
This screen performs video and audio tests.
Screen 1: When video test category is selected
Operation:
[ ] Shows Color Bar
[
]/[RETURN] Returns to the selection of test category
M
Screen 2: When audio test category is selected
Operation:
] Generate TONE Sound
[
[
]/[RETURN] Returns to the selection of test category
M
• Video test:
Outputs a color bar (HDMI).
• Audio test:
TONE sound output (speaker & HDMI).
Diag
Category: Video Test
Screen 2: Device test
Selects the device to test after selecting Device Test in screen 1.
Operation:
[<]/[,] Selects the device to test
[ ] Executes the test
[M] Returns to selection of test category
[RETURN] Returns to selection of test category
• List of test categories
Device Test
Video Test
Audio Test
Audio Input Test
Wireless LAN Test
Mic Test (Not used)
HDMI Input Test (Not used)
Transcorder Test (Not used)
Bluetooth Device Test
24
(Screen 1)
(Screen 2)
[ENT] Show Color Bar
Diag
Category: Audio Test
HELP:[UP][ENT][RET]
[ENT] Generate TONE Sound
HELP: [UP] [ENT] [RET]
Page 25
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6. Diag (Audio Input Test)
This screen performs audio input test.
Screen 1: Select Audio Input Test Category
Operation:
[<]/[,] Selects the category
[m]/[ ] Activate the selected category
[RETURN] Returns to the service top menu
Screen 2: Select Input Device
After “Audio Input Test” selects in Screen 1, the device to test is
chosen.
Operation:
[M]/[m] Selects Device
[ ] Activate and Start Test/Stop
[RETURN] Returns to the selection of test category
• Device Test : Device List
Digital Input1 : CXD90019R-BA is inputted from Optical
Digital Input2 : CXD90019R-BA is inputted from ARC
Analog Input : CXD90019R-BA is inputted from AUDIO
• Audio Input Test
CXD90019R-BA is inputted from DIR/analog and outputs
LineOut (8ch) L and R.
Check tone sound by speaker connected with LineOut (8ch) L and
R.
(Input; LPCM 48kHz 2ch)
Diag
Category:
Diag
(Screen 1)
Audio Input Test
Category: Audio Input Test
Device:
[ENT] Start Input Sound
Digital Input 1
Digital Input 2
Analog Input
7. Diag (Wireless LAN Test)
This screen performs wireless LAN test.
Screen 1: Selects the Wireless LAN test category
Operation:
]/[,] Selects the category
[
<
[m]/[ ] Moves to the selected category
[RETURN] Returns to the service top menu
Screen 2: Wireless LAN test
[1] Show WLAN Hwinfo
[2] Connect to AccessPoint
[3] Start display RSSI value.
[4] Start Ping Test
Operation:
[M]/[m] Selects the test
[ ] Executes the test
[RETURN] Returns to selection of test category
Screen 2 : Select [1] Show WLAN HwInfo
• Viewing the display
Serial : Serial Number
Hard : Hardware Version
Mac : Mac Address
Screen 3 : Select [2] Connect to AccessPoint
Connect Access Point only with the following AP settings.
CERT: NO-ENCRYPT
WEPKEY: abcdef1234
PMK: ABCDE12345
SSID: SONY-Test-R
IPADDR: 192.168.1.100
NETMASK: 255.255.255.0
BROADCAST: 192.168.1.10
When connect to AP, Status is “Connected!”
When cannot connect to AP, Status is “can’t Connect!”
Screen 4 : Select [3] Start Display RSSI Value
Display RSSI value.
Screen 5 : Select [4 ] Start Ping Test
Ping Test.
IP address use the value of “192.168.1.10”.
(Screen 2)
HELP: [LEFT] [RIGHT] [UP] [DOWN] [ENT] [RET]
[ ]
Diag
Category: Audio Input Test
Device:
[ENT] Stop Input Sound
HELP: [LEFT] [RIGHT] [UP] [DOWN] [ENT] [RET]
Digital Input 1
Digital Input 2
Analog Input
[ ]
25
Page 26
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
(Screen 1)
(Screen 2)
(Screen 3)
(Screen 4)
Diag
Category: Wireless LAN Test
Diag
Diag
Category: Wireless LAN Test
[1] Show WLAN HwInfo
[2] Connect to AccessPoint
[3] Start Display RSSI Value
[4] Start Ping Test
Serial : 200912313165535
Hard : 22
Mac : 00:01:36:23:FD:CF
HELP: [UP][DOWN][ENT][RET]
Diag
Category: Wireless LAN Test
[1] Show WLAN HwInfo
[2] Connect to AccessPoint
[3] Start Display RSSI Value
[4] Start Ping Test
[1] Show WLAN HwInfo
[2] Connect to AccessPoint
[3] Stop Display RSSI Value
[4] Start Ping Test
RSSI Value : 60
HELP: [UP][DOWN][ENT][RET]
8. Diag (MIC Input Test)
This screen performs MIC input test.
Note: Not used for the servicing.
9. Diag (HDMI Input Test)
This screen performs HDMI input test.
Note: Not used for the servicing.
10. Diag (Transcoder Test)
Note: Not used for the servicing.
11. Diag (Bluetooth Device Test)
This screen performs Bluetooth Device Test.
Screen 1: Select Bluetooth Device Test Category
Operation:
[<]/[,] Selects the category
[m]/[ ] Activate the selected category
[RETURN] Returns to the service top menu
Screen 2: Select Bluetooth Device Test
Operation:
[1] Bluetooth Enable
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry.
[4] Bluetooth Inquiry Test
[M]/[m] Selects Device
[ ] Activate and Start Test
[RETURN] Returns to the selection of test category
Screen 2: Select [1] Bluetooth Enable
• Viewing the Status display, if
Successful: “Bluetooth Enable Successful!”
Fail: “Bluetooth Enable Fail!”
Screen 3 : Select [2] Bluetooth Disable
• Viewing the Status display, if
Successful: “Bluetooth Disable Successful!”
Fail: “Bluetooth Disable Fail!”
Screen 4 : Select [3] Store Bluetooth device address to
Registry
Display will show : Bluetooth device address : “xx:xx:xx:xx:xx:xx”
• Viewing the Status display, if
Successful: “Write Successful!”
Fail: “Write Fail!”
(Screen 5)
26
Diag
Category: Wireless LAN Test
[1] Show WLAN HwInfo
[2] Connect to AccessPoint
[3] Stop Display RSSI Value
[4] Start Ping Test
Ping To : 192.168.1.10
PING 192.168.1.10 OK!
HELP: [UP][DOWN][ENT][RET]
Page 27
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
(Screen 1)
(Screen 2)
(Screen 3)
(Screen 4)
Diag
Category: Bluetooth Device Test
Diag
Category: Bluetooth Device Test
[1] Bluetooth Enable
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry
[4] Bluetooth Inquiry Test (not used)
Status : Bluetooth Enable Successful!
Status : Bluetooth Enable Fail!
HELP: [UP][DOWN][ENT][RET]
Diag
Category: Bluetooth Device Test
[1] Bluetooth Enable
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry
[4] Bluetooth Inquiry Test (not used)
Status : Bluetooth Disable Successful!
Status : Bluetooth Disable Fail!
HELP: [UP][DOWN][ENT][RET]
Diag
Category: Bluetooth Device Test
[1] Bluetooth Enable
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry
[4] Bluetooth Inquiry Test (not used)
Bluetooth device address : 00:01:36:23:FD:CF
Status : Write Successful!
Status : Write Fail!
HELP: [UP][DOWN][ENT][RET]
12. Log: Error Log (Output of each Log)
This screen displays the contents of each log.
Note: Do not refer to the displayed date.
Screen 1: Selects log
Operation:
[1]/[ ] Moves to the Error Log output screen
[RETURN] Returns to the top menu of the service mode
Screen 2: Displays the Error Log
Operation:
[<] Returns to the previous page
[,] Moves to the next page
[RETURN] Returns to the screen (Screen 1) that selects the log
type
[RED] Writes the log contents to an USB memory device
There is a possibility that this mode cannot be correctly executed. Never use this mode.
14. Network (Network Test Diagnosis Screen: Ifconfi g)
Network menu for the wired ethernet.
Screen 1: Ifconfi g Test
Operation:
[
] Activate Ifconfi g (Display network setting)
[,] Select ping test
[RETURN] Returns to the top menu of the service mode
Screen 2: Ping Test
Operation:
[<] Select Ifconfi g test
[RETURN] Returns to the top menu of the service mode
(The details of a Ping test are “14. Network (Network Test Diagnosis Screen: Ping)”)
Screen 3: Ifconfi g Test Active
Display Ifconfi g command results.
Operation:
[ ] Ifconfi g retry
[,] Select Ping Test
[RETURN] Returns to the top menu of the service mode
Network
Test: Ifconfig Ping
15. Network (Network Test Diagnosis Screen: Ping)
Ping test for the wired ethernet.
Screen 1: Ping Test
Operation:
[<] Select Ifconfi g test
[m] Ping execution preparation
[RETURN] Returns to the top menu of the service mode
Screen 2: The IP address of the Ping point is set up
(IP address input mode)
When “Ping to :>” is reversed, the [ ] button is pressed and IP
is inputted.
Operation:
[ ] Finish to input
[RETURN] Finish to input
[<] Finish to input and Select Ifconfi g Test
[0] to [9] Input Character sting ‘0-9’
Screen 3: Ping Test Active
When [START] is reversed, the [
] button is pressed and execute
ping.
Operation:
] Activate ping test
[
[M] The IP address of the ping point is set up
[RETURN] Returns to the top menu of the service mode
Network
Ifconfig
Test:
Ping To :
Ping
[START]
(Screen 1)
(Screen 2)
Network
Test: Ifconfig Ping
Ping To:
Network
HELP : [DOWN][ENT][(NUM)]
(Screen 3)
Test: Ifconfig Ping
IP 192. 168. 11. 2 MAC 00-16-01-85-21-A3
HELP : [DOWN][ENT][(NUM)]
HELP : [ENT]: Re/Exe [RIGHT]
[START]
(Screen 1)
(Screen 2)
(Screen 3)
Network
Test: Ifconfig
Ping to :> 192. 168. 200. 13
Test: Ifconfig
PING 192. 168. 200. 13 OK!
HELP: [ENT] : Start [UP] [LEFT]
Ping
[ENT] : Release
[RET] : Release
Network
Ping
Ping to : 192. 168. 200. 13
[START]
28
Page 29
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
16. Version Up Test (Disc Update)
This screen performs version update test.
Operation:
]/[ ] Activate the selected category.
[
m
[RETURN] Return to Service Top Menu.
Screen 1: Select to Start Update
Operation:
[ENT] Start Update
[RETURN] Return to Top Menu
Screen 2: Insert Update Disc
Operation:
] Tray Close and Check start
[
[RETURN] Cancel
Screen 3/ Screen 4
Operation:
Mounting and checking the disc
If disc OK, upgrading will start
Screen 5
Operation:
Wait until the display bar show 100%.
(Screen 1)
Version Update
[ENT] Start Update
[RET] Return to Top Menu
HELP: [ENT][RET]
(Screen 2)
Version Update
Insert Update Disc
[ENT] Tray Close and Check start
[RET] Cancel
HELP: [ENT][RET]
(Screen 3)
Version Update
Now, mounting and checking…
(Screen 5)
Software Update
Software update has started.
Never turn off while performing update.
When the update is complete, the unit will automatically turn off.
17. System Information (System Information Display)
This screen displays system information.
Screen 1: Basic Information
Operation:
[,] Drive information (delta IOP of a drive is measured)
and wireless device information (not used) displayed
(go to Screen 2)
[RETURN] Returns to the top menu of the service mode
Screen 2: Drive and Wireless Information Menu
Operation:
[<] Basic Information displayed (go to Screen 1)
[RETURN] Returns to the top menu of the service mode
When delta IOP is measured, it becomes impossible to use the Version Up function.
Contents List:
Main LSIname
Model
Destination
Sequence Number
MAC
IP
IFCON IFCON Version
Bootloader Bootloader Version
Host Main Host Main Version
MicroBE MicroBE Version
Host Sub Host Sub Version
Middleware Middleware Version
ADSP ADSP Version
ADSP Coeff ADSP Coeff Version
IF Model
IF Dest
WLAN module Serial
WLAN module hw Version
WLAN module MAC Address
Drive Firm Revision
CD DIOP Delta IOP
DVD DIOP Delta IOP
BD DIOP Delta IOP
CD LD TIME LD Time
DVD LD TIME LD Time
Bluetooth Device Address
55%
(Screen 4)
Version Update
Upgrading, do not shut down the power!
29
Page 30
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
(Screen 1)
System Information
Main LSIname:
Model:
Destination:
Sequence Number:
MAC:
IP:
IF-con Block0 Version:
Bootloader Version:
Host Main Version:
MicroBE Version:
Host Sub Version:
Middleware Version:
ADSP Version:
ADSP Coeff Version:
(Screen 1)
Drive
[1] Drive OP data Write
Drive OP data Write
Insert USB StorageDevice ...
Remove DISC and Close tray.
Disc : Load
Mode: 1
[ENT] Start
HELP : [RET] [RIGHT]
(Screen 2)
System Information
IF_MODEL:
IF_DEST:
WLAN module Serial:
WLAN module hw version:
WLAN module MAC Address:
Drive Firm Revision:
CD DIOP:
DVD DIOP:
BD DIOP:
CD LD TIME:
DVD LD TIME:
Bluetooth Device Address:
HELP : [RET] [LEFT]
18. Drive
This menu is used to operate the drive using drive-related diagnostic and tools.
Screen 1: Selecting items under *Drive
Operation:
[
]/[m] Selects the category
M
[m]/[ ] Activate the selected category
[RETURN] Returns to the top menu of the service mode
[1] Drive OP data Write
[2] Servo Parameter Check Menu
[3] Servo Signal Check Menu
[4] S-Curve Check Menu
[5] Readability Check Menu
[6] OP Position Check Menu
[7] OP Check Menu
[8] Load Eject Aging
[9] Spindle Control Check Menu
[10] FA Test Mode
(Screen 2)
(Screen 3)
HELP: [ENT] [RET]
Drive OP data Write
Insert USB StorageDevice ...
Remove DISC and Close tray.
[ENT] Start
NG - USB is not find
OK - OP data write
HELP: [ENT] [RET]
Screen 2: To start OP data Write
Operation:
] Starts
[
Screen 3: Show OP data Write result
Operation:
NG - USB is not fi nd
OK - OP data write
• Drive Test
For drive operating check. Service is only use Drive OP data write
to rewrite OP data after change of new CPU.
30
Page 31
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
CONFIRMATION ITEM
1. Playback Operation Confi rmation
1-1. Test Disc
Part No.DescriptionLayer
J-6090-199-ABLX-104Single Layer
J-6090-200-ABLX-204Dual Layer
J-2501-307-ACD (HLX-A1)
J-2501-305-AHLX-513Single Layer (NTSC)
J-2501-306-AHLX-514Dual Layer (NTSC)
J-6090-077-AHLX-506Single Layer (PAL)
J-6090-078-AHLX-507Dual Layer (PAL)
Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-
989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.
Operation and Display:
1. BLX-104
Procedure:
1. Select 23.976Hz/1080p.
2. Play “4.Motion picture”.
3. Check whether player can play back or not.
4. Check each outputs.
Video:
Composite/S Video/component/HDMI.
Audio:
Speaker out.
* When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz)
can use instead of 1080/24p.
However this is temporary correspondence.
* When the output of HDMI is 1080p, the signal of Composite/S
Video/Component are not output.
It is necessary to lower the output of HDMI to 1080i or less.
2. Networking Confi rmation
Confi rm it according to the following procedure when you confi rm
the connection of the network.
Note: Do not execute “Network Connection Diagnostics” of “Network
Settings” of the home menu with only the router connected.
Procedure:
1. Connect the router with the unit with LAN cable.
2. Turn on the power of the unit and the router.
3. Press the [HOME] button on the remote commander, and the
home menu is displayed.
4. Select “Setup” “Network Settings” “Network Connec-
tion Status”, and press the [
] button on the remote com-
mander.
5. Confi rm IP address are displayed in “IP Address”, “Subnet
Mask” and “Default Gateway”.
Physical Connection:XXXX
Internet Access:XXXX
IP Address Setting:XXXX
IP Address:XXX.XXX.XXX.XXX
Subnet Mask:XXX.XXX.XXX.XXX
Default Gateway:XXX.XXX.XXX.XXX
DNS Settings:XXXX
Primary DNS:XXX.XXX.XXX.XXX
Secondary DNS:XXX.XXX.XXX.XXX
MAC Address:XXX.XXX.XXX.XXX
2. BLX-204
Procedure:
1. Select 1080i (59.94Hz or 50Hz).
2. Play “4.Motion picture”.
3. Check whether player can play back or not.
(Check the picture and sound output)
3. CD (HLX-A1)
Procedure:
Check whether player can play back or not.
(Check the sound output)
4. HLX-513/514 (NTSC), HLX-506/507 (PAL)
Procedure:
1. After displayed Main Menu, select “1.Video Signal”.
2. Play “1.Color bar 100%”.
(Check the picture and sound output)
3. Return to Menu.
4. Play “Demonstration 4:3” or “Demonstration 16:9”.
(Check the picture and sound output)
1-2. Playback operation confi rmation
Confi rm operation in each signal/output mode of test disc (BLX-
104/204) according to the content of the repair.
Note: “AV Sync.” doesn’t operate.
31
Page 32
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
SECTION 4
ELECTRICAL CHECK
FM AUTO STOP CHECK
generator
SET
+
75 :
Procedure:
1. Turn the power on.
2. Input the following signal from Signal Generator to FM antenna input directly.
Carrier frequency : A = 87.5 MHz, B = 98 MHz, C = 108 MHz
Deviation : 75 kHz
Modulation : 1 kHz
ANT input : 35 dBu (EMF)
Note: Please use 75 ohm “coaxial cable” to connect SG and the set. You
cannot use video cable for checking.
Please use SG whose output impedance is 75 ohm.
3. Set to FM tuner function and scan the input FM signal with
automatic scanning.
4. Confi rm that input Frequency of A, B and C detected and auto-
matic scanning stops.
The stop of automatic scanning means “The station signal is received in good condition”.
32
Page 33
HBD-E2100/E3100/E3200/E4100/E6100
SECTION 5
TROUBLESHOOTING
Ver. 1.5
Check that harness is inserted normally at CN301 and
CN202. When harness is inserted normally, exchange the
switching regulator (SWR1).
No
Check that the output voltages of the switching regulator
(SWR1) are the following value.
CN301 pin 1: 12 V (FEUNSW12V)
CN301 pin 2: 12 V (ICUNSW12V)
CN301 pin 3: 12 V (UNSW12V)
No
Exchange the damaged fuse or thermistor. Exchange the
complete MB1002 board, when the power is not turned on,
even if you exchange fuses.
No
Yes
Yes
Check that the following fuses and thermistor are not damaged.
TH802/F802/F201/F202/F203
Exchange the complete MB1002 board.
No
Check the following power control signal in the power on state.
(Normally voltage: +3.3 V)
MB1002 board IC801 pin 36 to 38
(PCONT1 to PCONT3)
Power supply IC is damaged. Exchange the power supply IC.
No
Check each voltage with reference to the schematic diagrams,
and check that there is no problem in them.
Yes
Check the related IC on the MB1002 board.
Yes
Pin 25 (PCONT_FL)
Insert normally the harness and power ON again.
No
Check that harness is inserted normally at CN101
Yes
Switching supply board damage. Exchange the complete
• Abbreviation
AR : Argentina model
AUS : Australian model
CH : Chinese model
CND : Canadian model
E3 : 240 V AC area in E model
E12 : 220 – 240 V AC area in E model
E32 : 110 – 240 V AC area in E model
E51 : Chilean and Peruvian models
EA : Saudi Arabia model
MX6 : Latin-American model
PX : PX model
RU : Russian model
SAF : South African model
SP : Singapore model
TH : Thai model
TW : Taiwan model
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• f : Internal component.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
• MB1002 board is multi-layer printed board. However, the
patterns of intermediate-layers have not been included in
this diagrams.
• Abbreviation
AR : Argentina model
AUS : Australian model
CH : Chinese model
CND : Canadian model
E3 : 240 V AC area in E model
E12 : 220 – 240 V AC area in E model
E32 : 110 – 240 V AC area in E model
E51 : Chilean and Peruvian models
EA : Saudi Arabia model
MX6 : Latin-American model
PX : PX model
RU : Russian model
SAF : South African model
SP : Singapore model
TH : Thai model
TW : Taiwan model
• Indication of transistor.
C
Q
B
E
Q
B
CE
• Lead layouts
* Replacement of IC102 and IC103 on the MB1002 board used
in this unit requires a special tool.
Note: When the AMP board is replaced, spread the compound
referring to “NOTE OF REPLACING THE IC3102 AND
IC3302 ON THE AMP BOARD AND THE COMPLETE
AMP BOARD” on servicing notes (page 10).
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
These are omitted.
These are omitted.
surface
CSP (Chip Size Package) Lead layout of conventional IC
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• f : internal component.
• C : panel designation.
Note: The components identifi ed by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specifi ed.Note: Les composants identifi és par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spécifi é.
• A
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
* : Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
• Circled numbers refer to waveforms.
• Signal path.
F : AUDIO
f : TUNER
L : USB
E : VIDEO
d : LAN
J: DISC PLAY
N : MIC
• Abbreviation
AR : Argentina model
AUS : Australian model
CH : Chinese model
CND : Canadian model
E3 : 240 V AC area in E model
E12 : 220 – 240 V AC area in E model
E32 : 110 – 240 V AC area in E model
E51 : Chilean and Peruvian models
EA : Saudi Arabia model
MX6 : Latin-American model
PX : PX model
RU : Russian model
SAF : South African model
SP : Singapore model
TH : Thai model
TW : Taiwan model
• The voltage and waveform of CSP (chip size package)
: B+ Line.
under no-signal conditions.
no mark : TUNER
tolerances.
tolerances.
cannot be measured, because its lead layout is different
from that of conventional IC.
* Replacement of IC102 and IC103 on the MB1002 board used
in this unit requires a special tool.
Note: When the AMP board is replaced, spread the compound
referring to “NOTE OF REPLACING THE IC3102 AND
IC3302 ON THE AMP BOARD AND THE COMPLETE
AMP BOARD” on servicing notes (page 10).
IC706 RN5B701-0001 (MB1002 BOARD (5/6)) (except AEP and UK models)
FRF1
FRF2
GNDRF
AGC
AMP
AGC
AMP
AGC
DET
X2
17
VDDRF
20
1
FM LNA
2
3
GND
19
VDD
18
Filter
ADC
ADC
X1
16
15
Digital Signal Processing
Digital
MixerFMDemodulator
Digital
AGC
Image
Control
CP1
RSSI
Calculation
Station
Detector
Digital Filters
Stereo
Decoder
IIS
Generator
IISD
LRCK
BCLK
DAC
LOUT
ROUT
IISD14
LRCK/LOUT
13
BCLK/ROUT
12
62
CP2
Serial Interface/Registers
6
7CK8
LA
IIC/RDSI
11
10
9
GND
DA
VDD
5
GNDRF
Clock
Generator
XOSC
4
LOSC
Page 63
HBD-E2100/E3100/E3200/E4100/E6100
IC706 RN5B701-0002 (MB1002 BOARD (5/6)) (AEP and UK models)
Ver. 1.5
FRF1
FRF2
GNDRF
CP2
AGC
AMP
AGC
AMP
AGC
DET
X2
17
Filter
GNDRF
VDD
18
Clock
Generator
VDDRF
20
1
FM LNA
2
3
4
GND
19
LOSC
5
X1
16
ADC
ADC
XOSC
IC1001 H27U2G8F2CTR-BCR (MB1002 BOARD (1/6))
CP1
15
Digital Signal Processing
Digital
MixerFMDemodulator
Digital
AGC
Image
Control
RSSI
Calculation
Detector
Digital Filters
Serial Interface/Registers
6
Station
IIC/RDSI
7CK8
LA
Stereo
Decoder
RDS
Decoder
IIS
Generator
9
VDD
10
IISD
LRCK
BCLK
GND
DAC
11
LOUT
ROUT
DA
IISD14
LRCK/LOUT
13
BCLK/ROUT
12
1NC
2NC
3NC
4NC
5NC
6NC
7RY / BY
8RE
9CE
10NC
11NC
12VCC
13VSS
14NC
15NC
16CLE
17ALE
18WE
19WP
20NC
21NC
22NC
23NC
24NC
I/O
Control circuit
Logic control
RY/BY
Status register
Address register
Command register
Control circuitMemory cell array
Row address decoder
Row address buffer decoder
HV generator
Column buffer
Column decoder
Data register
Sense amp
48 NC
47 NC
46 NC
45 NC
44 IO8
43 IO7
42 IO6
41 IO5
40 NC
39 NC
38 NC
37 VCC
36 VSS
35 NC
34 NC
33 NC
32 IO4
31 IO3
30 IO2
29 IO1
28 NC
27 NC
26 NC
25 NC
63
Page 64
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
• IC Pin Function Descriptions
MB1002 BOARD (1/6), (3/6), (4/6) IC101 CXD90019R-BA (BD DECODER)
Pin No.Pin NameI/ODescription
P1TRINBIInput of Tracking Signal (B)
P2TRINAIInput of Tracking Signal (A)
P3HAVCODecoupling Pin for Reference Voltage of Main and Sub Beams
P4AVDD33_1-3.3 V Power Pin
P5INBIInput of Main Beam Signal (B)
P6INAIInput of Main Beam Signal (A)
P7INDIInput of Main Beam Signal (D)
P8INCIInput of Main Beam Signal (C)
P9INGIInput of Main Beam Signal (G)
P10INHIInput of Main Beam Signal (H)
P11INFIInput of Main Beam Signal (F)
P12INEIInput of Main Beam Signal (E)
P13V14OOutput of Voltage Reference (1.4 V)
P14AUX1I/O
P15MPXOUT1O
P16MPXOUT2O
P17MPXOUT3O
P18RFIPIDifferential Input of AC Coupling RF SUM Signal (Positive)
P19RFINIDifferential Input of AC Coupling RF SUM Signal (Negative)
P20RFIP2IDifferential Input of AC Coupling RF SUM Signal (Positive)
P21RFIN2IDifferential Input of AC Coupling RF SUM Signal (Negative)
P22AVDD12_2-1.2 V Power Pin
P23AVDD33_3-3.3 V Power Pin
P24FOOOFocus servo output. PDM output of focus servo compensator.
P25TROOTracking servo output. PDM output of tracking servo compensator.
P26TLOOTilt servo output
P27DVCC12_K_1-1.2V Digital Power
P28FEOSCENI/O
P29FEGAINSW3ORead gain switch 3.
P30FECFREQI/O
P31FECMODI/O
P32FEGAINSW1ORead gain switch 1.
P33FEGAINSW2ORead gain switch 2.
P34FEFMOI/O
P35FEFMO2OFeed motor 2 control. DAC output.
P36DVCC33_IO_1-3.3V Digital IO Power
P37FEFMO3I/O
P38FEFMO4I/O
P39FETRAYPWMOTray DAC / PWM control input. Controlled by uP.
P40FEDMOODisk motor control output. DAC output.
P41FEFGIMotor Hall sensor input.
P42DVCC12_K_2-1.2V Digital Power
Auxiliary Input
Alternative function: Signal Monitoring
Multiplexer Output 1 for Signal Monitoring. The pin is not allowed to pull-up in circuit layout.
Alternative function: Internal monitored signal output / General output.
Multiplexer Output 2 for Signal Monitoring. The pin is not allowed to pull-up in circuit layout.
Alternative function: Internal monitored signal output / General output.
Multiplexer Output 3 for Signal Monitoring. The pin is not allowed to pull-up in circuit layout.
Alternative function: Internal monitored signal output / General output.
High frequency modulation enable signal output, or LDD serial interface CLK or I2C SCL.
The pin is spike-free at power-on stage.
Frequency selection signal output, or LDD serial interface data or I2C SDA.
The pin is spike-free at power-on stage.
High frequency modulation mode selection signal output, or LDD serial interface command
enable.
The pin is spike-free at power-on stage.
Feed motor 4 control. DAC output.
Alternative function: Auxiliary servo input
Feed motor 3 control. DAC output.
Alternative function: Auxiliary servo input
Feed motor 4 control. DAC output.
Alternative function: Auxiliary servo input
64
Page 65
HBD-E2100/E3100/E3200/E4100/E6100
Pin No.Pin NameI/ODescription
P43FEGIO0I/O
P44FEGIO1I/OPC RS232 serial receive data. The pin is spike-free at power-on stage.
P45FEGIO5OGeneral IO
P46DVCC33_IO_2-3.3V Digital IO Power
P47FEGIO7I/O
P48FEGIO6O
P49FEGIO4O
P50FEGIO9I/O
P51FEGIO10I/OPC RS232 serial receive data. The pin is spike-free at power-on stage.
P52FEGIO11I/OPC RS232 serial transmit data. The pin is spike-free at power-on stage.
P53FETRAYIN_IA logical Low indicates the Tray is IN
P54FEGIO3I/O
P55USB_DM_P1I/OUSB port1 differential serial data bus (minus)
P56USB_DP_P1I/OUSB port1 differential serial data bus (plus)
P57USB_VRT_P1-USB port1 reference resistor
P58AVDD33_USB_P1-3.3V Analog power for USB port1
P59EFPWRQ-2.5 V power for E-fuse programming
P60DVCC12_K_3-1.2V Digital Power
P61DVCC33_IO_3-3.3V Digital IO Power
P62SCLIUSB over current Protection indication
P63SDAIUSB PCONT
P64SPDIF_IN1IHDMI ARC SPDIF input
P65NFD0I/ONAND Flash Data input/output bit0
P66NFD1I/ONAND Flash Data input/output bit1
P67NFD2I/ONAND Flash Data input/output bit2
P68NFD3I/ONAND Flash Data input/output bit3
P69NFD4I/ONAND Flash Data input/output bit4
P70NFD5I/ONAND Flash Data input/output bit5
P71NFD6I/ONAND Flash Data input/output bit6
P72DVCC33_IO_4-3.3V Digital IO Power
P73NFD7I/ONAND Flash Data input/output bit7
P74NFRBNI/ONAND Flash ready / busy
P75NFRENI/ONAND Flash read enable
P76NFCENI/ONAND Flash chip enable
P77NFCLEI/ONAND Flash command latch enable
P78NFALEI/ONAND Flash address latch enable
P79NFWENI/ONAND Flash write enable
P80DVCC12_K_4-1.2V Digital Power
P81DDRVCCK_1-1.2V Digital Power
P82RDQ4I/OMemory data bit 4
P83RDQ6I/OMemory data bit 6
P84RDQ2I/OMemory data bit 2
P85DDRVCCIO_1-1.5V Digital IO Power
P86RDQ0I/OMemory data bit 0
P87RDQ11I/OMemory data bit 11
P88RDQ9I/OMemory data bit 9
P89RDQ13I/OMemory data bit 13
P90RDQ15I/OMemory data bit 15
LDD serial interface data. The pin is spike-free at power-on stage.
The pin is not allowed to pull-up in circuit layout.
General IO
General IO. The pin is spike-free at power-on stage. The pin is not allowed to pull-up in
circuit layout.
Read gain switch 6. The pin is not allowed to pull-up in circuit layout.
General IO
Read gain switch 4
General IO
General IO. The pin is spike-free at power-on stage.
General IO
LED Control Output. Initial 0 Output. The pin is spike-free at power-on stage.
General IO
Ver. 1.5
65
Page 66
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
Pin No.Pin NameI/ODescription
P91RDQM1OMemory data mask bit 1
P92DDRVCCK_2-1.2V Digital Power
P93DDRVREFIMemory VREF
P94RDQS0I/OMemory positive data strobe bit 0
P95RDQS0_I/OMemory negative data strobe bit 0
P96DDRVCCIO_2-1.5V Digital IO power
P97RCLK0_OMemory clock 0 negative
P98RCLK0OMemory clock 0 positive
P99RDQM0OMemory data mask bit 0
P100RDQS1I/OMemory positive data strobe bit 1
P101RDQS1_I/OMemory negative data strobe bit 1
P102DDRVCCIO_3-1.5V Digital IO power
P103RDQ12I/OMemory data bit 12
P104RDQ14I/OMemory data bit 14
P105RDQ10I/OMemory data bit 10
P106RDQ8I/OMemory data bit 8
P107RDQ1I/OMemory data bit 1
P108DDRVCCIO_4-1.5V Digital IO Power
P109RDQ3I/OMemory data bit 3
P110RDQ7I/OMemory data bit 7
P111RDQ5I/OMemory data bit 5
P112DDRVCCK_3-1.2V Digital Power
P113AVDD33_MEMPLL-3.3 V Analog Power for MEMPLL
P114TP_MEMPLL-Test Pin
P115TN_MEMPLL-Test Pin
P116RCKEOMemory clock enable
P117RA10OMemory address bit 10
P118RBA1OMemory bank address bit 1
P119RA4OMemory address bit 4
P120RA1OMemory address bit 1
P121RA6OMemory address bit 6
P122RA8OMemory address bit 8
P123DDRVCCIO_5-1.5V Digital IO Power
P124RA11OMemory address bit 11
P125RA12OMemory address bit 12
P126RRAS_OMemory row address strobe
P127RCAS_OMemory column address strobe
P128RCS_OMemory chip select
P129DDRVCCIO_6-1.5V Digital IO Power
P130RWE_OMemory write enable
P131RA0OMemory address bit 0
P132RA13OMemory address bit 13
P133RA9OMemory address bit 9
P134RRESETOMemory reset
P135RA7OMemory address bit 7
P136RA2OMemory address bit 2
P137RA5OMemory address bit 5
P138RA3OMemory address bit 3
P139RBA2OMemory bank address bit 2
P140RBA0ORBA0
P141RODTOMemory on die termination enable
P142RCSX_OMemory chip select
P143DDRVCCIO_7-1.5V Digital IO Power
66
Page 67
HBD-E2100/E3100/E3200/E4100/E6100
Pin No.Pin NameI/ODescription
P144RDQ20I/OMemory data bit 20
P145RDQ22I/OMemory data bit 22
P146RDQ18I/OMemory data bit 18
P147DDRVCCIO_8-1.5V Digital IO power
P148RDQ16I/OMemory data bit 16
P149RDQ27I/OMemory data bit 27
P150RDQ25I/OMemory data bit 25
P151RDQ29I/OMemory data bit 29
P152RDQ31I/OMemory data bit 31
P153RDQM3OMemory data mask bit 3
P154DDRVCCK_4-1.2V Digital Power
P155DDRVREFIMemory VREF
P156DDRVCCIO_9-1.5V Digital IO Power
P157RDQS2I/OMemory positive data strobe bit 2
P158RDQS2_I/OMemory negative data strobe bit 2
P159RCLK1_OMemory clock 1 negative
P160RCLK1OMemory clock 1 positive
P161DDRVCCIO_A-1.5V Digital IO Power
P162RDQM2OMemory data mask bit 2
P163RDQS3I/OMemory positive data strobe bit 3
P164RDQS3_I/OMemory negative data strobe bit 3
P165RDQ28I/OMemory data bit 28
P166RDQ30I/OMemory data bit 30
P167RDQ26I/OMemory data bit 26
P168RDQ24I/OMemory data bit 24
P169RDQ17I/OMemory data bit 17
P170DDRVCCIO_B-1.5V Digital IO power
P171RDQ19I/OMemory data bit 19
P172RDQ23I/OMemory data bit 23
P173RDQ21I/OMemory data bit 21
P174DDRVCCK_5-1.2V Digital Power
P175DVCC12_K_5-1.2V Digital Power
P176AVDD33_LDO-Line driver 3.3V analog power
P177AVDD12_LDO-1.2 V standby power
P178OPWRSBI/OPower Control
P179GPIO8I/OICE1_TDO
P180GPIO7I/OICE1_TCK
P181GPIO6I/OICE1_TMS
P182GPIO5I/OICE1_TDI
P183GPIO4-Not used
P184DVCC33_IO_STB_1-3.3V Digital IO Power for Stand-By Module
A2DQU5I/OData Input/output: Bi-directional data bus.
A3DQU7I/OData Input/output: Bi-directional data bus.
A4NO_USE-Not used
A5NO_USE-Not used
A6NO_USE-Not used
A7DQU4I/OData Input/output: Bi-directional data bus.
A8VDDQ-DQ Power Supply: 1.5V +/-0.075V
A9VSS-Ground
B1VSSQ-DQ Ground
B2VDD-Power Supply: 1.5V +/-0.075
B3VSS-Ground
B4NO_USE-Not used
B5NO_USE-Not used
B6NO_USE-Not used
Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered in write data. For the x16, DQSL: corresponds to the data on DQL0-DQL7; DQSU corre-
B7
B8DQU6I/OData Input/output: Bi-directional data bus.
B9VSSQ-DQ Ground
C1VDDQ-DQ Power Supply: 1.5V +/-0.075V
C2DQU3I/OData Input/output: Bi-directional data bus.
C3DQU1I/OData Input/output: Bi-directional data bus.
C4NO_USE-Not used
C5NO_USE-Not used
C6NO_USE-Not used
C7DQSUI/O
C8DQU2I/OData Input/output: Bi-directional data bus.
C9VDDQ-DQ Power Supply: 1.5V +/-0.075V
D1VSSQ-DQ Ground
D2VDDQ-DQ Power Supply: 1.5V +/-0.075V
D3DMUI
D4NO_USE-Not used
D5NO_USE-Not used
D6NO_USE-Not used
D7DQU0I/OData Input/output: Bi-directional data bus.
D8VSSQ-DQ Ground
D9VDD-Power Supply: 1.5V +/-0.075
E1VSS-Ground
E2VSSQ-DQ Ground
E3DQL0I/OData Input/output: Bi-directional data bus.
E4NO_USE-Not used
E5NO_USE-Not used
E6NO_USE-Not used
DQSUI/O
sponds to the data on DQU0-DQU7. The data strobe DQS, DQSL and DQSU are paired with
differential signals DQS, DQSL and DQSU, respectively, to provide differential pair signaling
to the system during reads and writes. DDR3 SDRAM supports differential data strobe only
and does not support single-ended.
Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered in write data. For the x16, DQSL: corresponds to the data on DQL0-DQL7; DQSU corresponds to the data on DQU0-DQU7. The data strobe DQS, DQSL and DQSU are paired with
differential signals DQS, DQSL and DQSU, respectively, to provide differential pair signaling
to the system during reads and writes. DDR3 SDRAM supports differential data strobe only
and does not support single-ended.
Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM
is sampled HIGH coincident with that input data during a Write access. DM is sampled on
both edges of DQS. For x8 device, the function of DM or TDQS/ TDQS is enabled by Mode
Register A11 setting in MR1.
70
Page 71
HBD-E2100/E3100/E3200/E4100/E6100
Pin No.Pin NameI/ODescription
Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM
E7DMLI
E8VSSQ-DQ Ground
E9VDDQ-DQ Power Supply: 1.5V +/-0.075V
F1VDDQ-DQ Power Supply: 1.5V +/-0.075V
F2DQL2I/OData Input/output: Bi-directional data bus.
F3DQSLI/O
F4NO_USE-Not used
F5NO_USE-Not used
F6NO_USE-Not used
F7DQL1I/OData Input/output: Bi-directional data bus.
F8DQL3I/OData Input/output: Bi-directional data bus.
F9VSSQ-DQ Ground
G1VSSQ-DQ Ground
G2DQL6I/OData Input/output: Bi-directional data bus.
G3
G4NO_USE-Not used
G5NO_USE-Not used
G6NO_USE-Not used
G7VDD-Power Supply: 1.5V +/-0.075
G8VSS-Ground
G9VSSQ-DQ Ground
H1VREFDQ-Reference voltage for DQ
H2VDDQ-DQ Power Supply: 1.5V +/-0.075V
H3DQL4I/OData Input/output: Bi-directional data bus.
H4NO_USE-Not used
H5NO_USE-Not used
H6NO_USE-Not used
H7DQL7I/OData Input/output: Bi-directional data bus.
H8DQL5I/OData Input/output: Bi-directional data bus.
H9VDDQ-DQ Power Supply: 1.5V +/-0.075V
J1NC-No Connect: No internal electrical connection is present.
J2VSS-Ground
J3
J4NO_USE-Not used
J5NO_USE-Not used
J6NO_USE-Not used
J7CKI
J8VSS-Ground
J9NC-No Connect: No internal electrical connection is present.
K1ODTI
K2VDD-Power Supply: 1.5V +/-0.075
DQSLI/O
RASICommand Input: RAS (along with CS) defi ne the command being entered.
is sampled HIGH coincident with that input data during a Write access. DM is sampled on
both edges of DQS. For x8 device, the function of DM or TDQS/ TDQS is enabled by Mode
Register A11 setting in MR1.
Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered in write data. For the x16, DQSL: corresponds to the data on DQL0-DQL7; DQSU corresponds to the data on DQU0-DQU7. The data strobe DQS, DQSL and DQSU are paired with
differential signals DQS, DQSL and DQSU, respectively, to provide differential pair signaling
to the system during reads and writes. DDR3 SDRAM supports differential data strobe only
and does not support single-ended.
Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered in write data. For the x16, DQSL: corresponds to the data on DQL0-DQL7; DQSU corresponds to the data on DQU0-DQU7. The data strobe DQS, DQSL and DQSU are paired with
differential signals DQS, DQSL and DQSU, respectively, to provide differential pair signaling
to the system during reads and writes. DDR3 SDRAM supports differential data strobe only
and does not support single-ended.
Clock: CK is differential clock input. All address and control input signals are sampled on the
crossing of the positive edge of CK. Output (read) data is referenced to the crossing of CK.
On Die Termination: ODT (registered HIGH) enables termination resistance internal to the
DDR3 SDRAM. When enabled, ODT is only applied to each DQ, DQS, DQS and DM/TDQS,
NU/TDQS (When TDQS is enabled via Mode Register A11=1 in MR1) signal for x8 confi gura-
tions. The ODT pin will be ignored if the Mode Register (MR1) is programmed to disable ODT.
Ver. 1.5
71
Page 72
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
Pin No.Pin NameI/ODescription
K3
K4NO_USE-Not used
K5NO_USE-Not used
K6NO_USE-Not used
K7
K8VDD-Power Supply: 1.5V +/-0.075
K9CKEI
L1NC-No Connect: No internal electrical connection is present.
CASICommand Input: CAS (along with CS) defi ne the command being entered.
CKI
Clock: CK is differential clock input. All address and control input signals are sampled on the
crossing of the negative edge of CK. Output (read) data is referenced to the crossing of CK.
Clock Enable: CKE HIGH activates, and CKE LOW deactivates, internal clock signal and device input buffers and output drivers. Talking CKE LOW provides Precharge Power-Down and
Self Refresh operation (all banks idle), or Active Power-Down (Row Active in any bank). CKE
is asynchronous for self refresh exit. After V
initialization sequence, it must be maintained during all operations (including Self-Refresh).
CKE must be maintained high throughout read and write accesses. Input buffers, excluding
CK, CK, ODT and CKE are disabled during power-down. Input buffers, excluding CKE, are
disabled during Self-Refresh.
REFCA
has become stable during the power on and
L2
L3
L4NO_USE-Not used
L5NO_USE-Not used
L6NO_USE-Not used
L7A10I
L8ZQ-Reference Pin for ZQ calibration
L9NC-No Connect: No internal electrical connection is present.
M1VSS-Ground
M2BA0I
M3BA2I
M4NO_USE-Not used
M5NO_USE-Not used
M6NO_USE-Not used
M7NC-No Connect: No internal electrical connection is present.
M8VREFCA-Reference voltage for CA
M9VSS-Ground
N1VDD-Power Supply: 1.5V +/-0.075
N2A3I
N3A0I
N4NO_USE-Not used
N5NO_USE-Not used
N6NO_USE-Not used
N7A12I
CSI
WEICommand Input: WE (along with CS) defi ne the command being entered.
Chip Select: All commands are masked when CS is registered HIGH. CS provides for external
Rank selection on system with multiple Ranks. CS is considered part of the command code.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Autoprecharge: A10 is sampled during Read/Write commands to determine whether Autoprecharge should be performed to the accessed bank after the Read/Write operation. (HIGH:
Autoprecharge; LOW: No Autoprecharge)
A10 is sampled during a Precharge command to determine the Percharge applies to one bank
(A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the bank is selected
by bank adresses.
Bank Address Inputs: BA0 defi ne to which bank an Active, Read, Write or Precharge com-
mand is being applied. Bank address also determines if the mode register or extended mode
register is to be accessed during a MRS cycle.
Bank Address Inputs: BA2 defi ne to which bank an Active, Read, Write or Precharge com-
mand is being applied. Bank address also determines if the mode register or extended mode
register is to be accessed during a MRS cycle.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address
for Read/Write commands to select one location out of the memory array in the respective
bank. The address inputs also provide the op-code during Mode Register Set commands.
Burst Chop: A12 is sampled during Read and Write commands to determine if burst chop (onthe-fl y) will be performed. (HIGH: no burst chop, LOW: burst chopped).
72
Page 73
HBD-E2100/E3100/E3200/E4100/E6100
Pin No.Pin NameI/ODescription
N8BA1I
N9VDD-Power Supply: 1.5V +/-0.075
P1VSS-Ground
P2A5I
P3A2I
P4NO_USE-Not used
P5NO_USE-Not used
P6NO_USE-Not used
P7A1I
P8A4I
P9VSS-Ground
R1VDD-Power Supply: 1.5V +/-0.075
R2A7I
R3A9I
R4NO_USE-Not used
R5NO_USE-Not used
R6NO_USE-Not used
R7A11I
R8A6I
R9VDD-Power Supply: 1.5V +/-0.075
T1VSS-Ground
T2
T3A13I
T4NO_USE-Not used
T5NO_USE-Not used
T6NO_USE-Not used
T7NC-No Connect: No internal electrical connection is present.
T8A8I
T9VSS-Ground
RESETI
Bank Address Inputs: BA1 defi ne to which bank an Active, Read, Write or Precharge com-
mand is being applied. Bank address also determines if the mode register or extended mode
register is to be accessed during a MRS cycle.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Active Low Asynchronous Reset: Reset is active when RESET is LOW, and inactive when
RESET is HIGH. RESET must be HIGH during normal operation. RESET is CMOS rail to rail
signal with DC high and low at 80% and 20% of VDD, example, 1.20V for DC high and 0.30V
for DC low.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
33TAS5538_SDAI/OTwo-way data bus with the DAMP processor
34TAS5538_SCLI/OSerial data transfer clock signal output to the DAMP processor
35DC_DETISpeaker DC detection signal input terminal "L": speaker DC is detected
36PCONT1OPower supply on/off control signal output terminal "H": power on
37PCONT2OPower supply on/off control signal output terminal “H”: power on
38PCONT3OPower supply on/off control signal output terminal "H": power on
39EPMOEPM for update used
40PCONT_STA516OSTA516 IC Power Control, "H": power on
41NO_USE-No used
42FAN_ONOPower supply on/off control signal output terminal for fan motor "H": power on
43NO_USE-No used
44CEIChip enable signal input terminal
45ST_SDAI/OTwo-way data bus with the FM receiver
46ST_SCLI/OSerial data transfer clock signal output to the FM receiver
47BD_IF_STARTOReady signal output to the BD decoder "H": ready
48TAS5538_XPDNOPower down signal output to the power amplifi er "L": power down
49BD_IF_REQIRequest signal input from the BD decoder “H”: request
Fan motor speed control signal output terminal control by DA converter
Port output higher, speed slower
System reset signal input from the reset signal generator and reset switch "L": reset
For several hundreds msec. After the power supply rises, "L" is input, then it change to
"H"
Power supply on/off control signal output terminal for fl uorescent indicator tube driver
"H": power on
74
Page 75
HBD-E2100/E3100/E3200/E4100/E6100
Pin No.Pin NameI/ODescription
50STA516_XPDNODAMP Driver Standby Control
51TAS5538_XRSTOReset signal output to the DAMP processor "L": reset
52TAS5538_XMUTEOMuting on/off control signal output to DAMP processor "L": muting on
66BD_TEMPITemperature detection signal input terminal
67STA516_TH_WARNIThermal warning for temperature of the IC STA516 more than 130 °C
68FL_CSOChip select signal output to the fl uorescent indicator tube driver
69ASEL0OAudio selection signal output terminal
70ASEL1OAudio selection signal output terminal
71WOL_WLANIWOL wake up detect port input from BD decoder “H”: detect
72NFC_RFDETIRF signal input from the NFC module “H”: detect
73ST_RDS_INTIRDS interrupt signal input from the FM receiver
74NAND_RESETOReset signal output to the NAND fl ash "L": reset
75BD_SDI (IF_SDO)OSerial data output to the BD decoder
76BD_SDO (IF_SDI)ISerial data input from the BD decoder
77BD_SCLKISerial data transfer clock signal input from the BD decoder
78BD_CSOChip select signal output to the BD decoder
79NFC_DATAI/OSerial DATA input / output with the NFC module
80NFC_SPICLKOSerial interface clock output to the NFC module
81BD_RESETO
82JIG MODE1I/OJig mode selection signal input from the BD decoder
83OPWRSBIPower control signal input from the BD decoder
84FE_EJECTOEject key input detection signal output to the BD decoder
85UPG_STATUSIUPG status signal input from the BD decoder
86NO_USE-No used
87KEY2_EJIKey input terminal
88KEY1_EJIKey input terminal
89KEY0IPower key input terminal
90NO_USE-No used
91MODELIModel setting terminal Fixed at "L" in this unit
92DESTINATIONIDestination setting
93PCONT_WOL_STANDBYOPower Control for WOL / WOW function
94AVSS-Ground terminal
95NO_USE-No used
96VREFIReference voltage (+3.3V) input terminal
97AVCC-Power supply terminal (+3.3V)
98NFC_SELO
99PVDD_VOL_SELONo used
100NO_USE-No used
DRIVE_SD / POWER_
DET
IShut down signal input from the power amplifi er "L": detect
Reset signal output to the BD decoder and EEPROM "L": reset
Data transfer direction and data transfer completion notifi cation signal output to the NFC
module
Ver. 1.5
75
Page 76
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
SECTION 7
EXPLODED VIEWS
Note:
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine service. Some delay should be anticipated
when ordering these items.
• The mechanical parts with no reference
number in the exploded views are not supplied.
• Color Indication of Appearance Parts Example:
KNOB, BALANCE (WHITE) . . . (RED)
• Abbreviation
AR : Argentina model
AUS : Australian model
CH : Chinese model
CND : Canadian model
E3 : 240 V AC area in E model
E12 : 220 – 240 V AC area in E model
Parts Color Cabinet’s Color
E32 : 110 – 240 V AC area in E model
E51 : Chilean and Peruvian models
EA : Saudi Arabia model
MX6 : Latin-American model
PX : PX model
RU : Russian model
SAF : South African model
SP : Singapore model
TH : Thai model
TW : Taiwan model
The components identifi ed by mark 0
or dotted line with mark 0 are critical for
safety.
Replace only with part number specifi ed.
Les composants identifi és par une marque 0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant le numéro spécifi é.
The components identifi ed by mark 9 con-
tain confi dential information.
Strictly follow the instructions whenever the
components are repaired and/or replaced.
Les composants identifi és par la marque 9 contiennent des informations confi den-
tielles.
Suivre scrupuleusement les instructions
chaque fois qu’un composant est remplacé
et / ou réparé.
7-1. CASE SECTION
3
not supplied
not supplied
4
1
2
A
1
A
front panel section
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
1 3-077-331-71 +BV3 (3-CR)
2 4-438-897-02 CASE (US)
2 4-438-897-12 CASE (EXCEPT US)
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine service. Some delay should be anticipated
when ordering these items.
• RESISTORS
All resistors are in ohms.
METAL: Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor.
F: nonfl ammable
• Abbreviation
AR : Argentina model
AUS : Australian model
CH : Chinese model
CND : Canadian model
E3 : 240 V AC area in E model
E12 : 220 – 240 V AC area in E model
E32 : 110 – 240 V AC area in E model
E51 : Chilean and Peruvian models
EA : Saudi Arabia model
MX6 : Latin-American model
PX : PX model
RU : Russian model
SAF : South African model
SP : Singapore model
TH : Thai model
TW : Taiwan model
When indicating parts by reference number, please include the board name.
SECTION 8
The components identifi ed by mark 0
or dotted line with mark 0 are critical for
safety.
Replace only with part number specifi ed.
Les composants identifi és par une marque 0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant le numéro spécifi é.
The components identifi ed by mark 9 con-
tain confi dential information.
Strictly follow the instructions whenever the
components are repaired and/or replaced.
Les composants identifi és par la marque 9 contiennent des informations confi den-
tielles.
Suivre scrupuleusement les instructions
chaque fois qu’un composant est remplacé
et / ou réparé.
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
D3101 6-503-967-01 DI STPS1H100A
D3102 6-503-967-01 DI STPS1H100A
Note: When the IC3102 and IC3302 on the AMP board are replaced, spread the
compound referring to “NOTE OF REPLACING THE IC3102 and IC3302 ON THE
AMP BOARD AND THE COMPLETE AMP BOARD” on servicing notes (page 10).
D3106 6-503-967-01 DI STPS1H100A
D3107 6-503-967-01 DI STPS1H100A
D3108 6-503-967-01 DI STPS1H100A
D3151 6-503-761-01 DI RB751S40, 115
D3301 6-503-967-01 DI STPS1H100A
D3302 6-503-967-01 DI STPS1H100A
D3303 6-503-967-01 DI STPS1H100A
D3304 6-503-967-01 DI STPS1H100A
D3305 6-503-967-01 DI STPS1H100A
D3306 6-503-967-01 DI STPS1H100A
D3307 6-503-967-01 DI STPS1H100A
D3308 6-503-967-01 DI STPS1H100A
D3351 6-503-761-01 DI RB751S40, 115
D3503 6-503-761-01 DI RB751S40, 115
Note: IC101, IC102 and IC103 on the MB1002 board cannot
exchange with single. When these parts on the MB1002
board are damaged, exchange the entire mounted board.
(ANTENNA FM)
87
Page 88
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
MB1002
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
IC201 6-716-462-01 IC BD00GA3WEFJ-E2
IC203 (Not supplied) IC TPS54295PWPR
IC204 (Not supplied) IC TPS54295PWPR
IC205 6-719-190-01 IC RT7256ALZSP
IC403 6-709-888-01 IC TC7WHU04FK
IC406 6-720-030-01 IC TPS2065CDBVR
IC408 6-718-999-01 IC MM1839A50NRE
IC520 6-718-188-01 IC BD80GA3WEFJ-E2
IC601 (Not supplied) IC TPIC2060ADFDRG4
IC701 1-843-541-11 OPTICAL RECEIVER JACK
(TV DIGITAL IN OPTICAL)
IC703 8-759-596-39 IC SN74LV4052APWR
IC704 6-710-554-01 IC PCM1808PWR
IC706 (Not supplied) IC RN5B701-0001 (EXCEPT AEP, UK)
IC706 (Not supplied) IC RN5B701-0002 (AEP, UK)
IC710 6-719-070-01 IC MM3411A50URE
IC801 (Not supplied) IC R5F3650KCDFB
IC803 6-713-333-01 IC PST8429UL
IC804 6-719-061-01 IC MM1839A33NRE
IC805 6-719-061-01 IC MM1839A33NRE
IC1001 (Not supplied) IC H27U2G8F2CTR-BCR
< RESISTOR >
0 R101 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
R103 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
R105 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
R106 1-218-941-11 METAL CHIP 100 5% 1/16W
R107 1-218-941-11 METAL CHIP 100 5% 1/16W
R108 1-208-668-11 METAL CHIP 240 0.5% 1/16W
R109 1-208-668-11 METAL CHIP 240 0.5% 1/16W
R110 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
R111 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
R112 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
R113 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
R114 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
R115 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
R116 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
R117 1-218-933-11 METAL CHIP 22 5% 1/16W
R118 1-218-933-11 METAL CHIP 22 5% 1/16W
R203 1-218-953-11 METAL CHIP 1K 5% 1/16W
R204 1-208-695-11 METAL CHIP 3.3K 0.5% 1/16W
* R209 1-250-499-11 METAL CHIP 1.5K 1% 1/16W
R210 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R26 1-216-813-11 METAL CHIP 220 5% 1/10W
R28 1-216-833-11 METAL CHIP 10K 5% 1/10W
< DIODE >
D01 6-503-605-01 DI UDZVTE-172.0B
D02 6-500-400-01 DIODE BAV99-215
D03 6-500-400-01 DIODE BAV99-215
D04 6-503-040-01 DI DZ2J300M0L
D05 6-503-891-01 DI 1L0353B14E0MKT01
D06 6-503-890-01 DI 1L0353W34A0MKT01
< IC >
IC01 6-600-665-01 IC GP1UE27XK0VF
IC02 6-719-198-01 IC MM3411A33URE
IC03 6-719-197-01 IC MM3411Z41URE
< JUMPER RESISTOR >
JR02
JR03 1-216-296-11 SHORT CHIP 0
JR04 1-216-296-11 SHORT CHIP 0
JR05 1-216-296-11 SHORT CHIP 0
JR06 1-216-296-11 SHORT CHIP 0
JR07 1-216-295-91 SHORT CHIP 0
JR08 1-216-296-11 SHORT CHIP 0
JR09 1-216-296-11 SHORT CHIP 0
JR10 1-216-296-11 SHORT CHIP 0
JR11 1-216-296-11 SHORT CHIP 0
< FLUORESCENT INDICATOR TUBE >
1-216-296-11 SHORT CHIP 0
R29 1-216-813-11 METAL CHIP 220 5% 1/10W
R30 1-216-813-11 METAL CHIP 220 5% 1/10W
0 M1 1-855-244-11 DC FAN
0 SWR1 1-798-453-11 SWITCHING REGULATOR (3L392W-1)
(US, CND, AEP, UK, SAF, SP, TW, AUS, TH, CH)
Note 2: Wires (fl at type) for service is all straight.Please bend it referring go “HOW TO BEND FFC” on
page 14 when you install it in the unit.
91
Page 92
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
Ref. No. Part No. Description Remark
0 SWR1 1-798-453-21 SWITCHING REGULATOR (3L392W)
(E3, E51, PX, EA, E12, E32, RU, MX6, AR)
92
Page 93
HBD-E2100/E3100/E3200/E4100/E6100
REVISION HISTORY
Clicking the version allows you to jump to the revised page.
Also, clicking the version at the top of the revised page allows you to jump to the next revised page.
Ver.DateDescription of Revision
1.02012.12New
1.12013.04Addition of E3, Latin-American and Taiwan models. (HBD-E2100)
Addition of
Addition of Russian, E12, E3, Saudi Arabia, Singapore, Chinese, Thai, Taiwan and Latin-American
models. (HBD-E4100)
Addition of Russian, E3, South African, Saudi Arabia, Singapore, Australian, Thai and Taiwan models.
(HBD-E6100)
Change of MB1002 board (Suffi x 12).
Change P/N for Ref. No. 58 in Page 77.
Change P/N and description for Q3101, Q3202, Q3302 and Q3555 in AMP board.
Delete Servicing Notes for IC102 and IC103 in MB1002 board.
Change description for J702 in MB1002 board.
Add safety mark for DC, FAN.
Delete IC707, C732, C736, R784 and R7015 in MB1002 board.
Add R7014 in MB1002 board.
Change P/N and description for D3101, D3102, D3103, D3104, D3105, D3106, D3107, D3108,
D3301, D3302, D3303, D3304, D3305, D3306, D3307 and D3308 in AMP board.
Change P/N for Ref. No. 108 in page 78 and 90.
1.22013.07Addition of Chinese model. (HBD-E6100)
Change of MB1002 board (Suffi
Change of AMP board (Suffi x 12).
Change of P/N and description for C3027, C3029, C3117, C3120, C3140, C3141, C3317, C3322, C3340
and C3341 in AMP board.
Change of P/N for C3014, C3025, C3031, C3032, C3033, C3041, C3042, C3051, C3115, C3122, C3136,