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- electrical -
Xperia
E6603 and E6653
1300-1577 Rev 3
Sony Mobile Communications AB – Company Internal
E6633 and E6683
Z5 Dual
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CONTENTS
1 Replaceable Components ............................................................. 3
2 Component Placing ........................................................................ 6
3 Additional Repair info .................................................................. 10
4 Revision History ........................................................................... 15
For general information about electrical repair related issues, refer to
1220-1336: Generic Repair Manual - electrical
Baking prior to repair is required, if the board have been exposed to air more than 12 hours from
PWB package opening. Too long exposure time increase the level of moisture in PWB and the
PWB could delaminate during repair process and result in direct or latent failures and reduce
reliability.
The boards shall be baked in 125°C ±5°C for 4 hours.
Test after electrical replacement: refer to 1273-1772 Mechanical Test Instruction
All Electrical components are RLC level B, Reversed Logistic Classification, See the Spare Part
Handling chapter in Mechanical/Generic Repair Manual 1220-1333.
Do not remove shield can lids (Heat pasta are added and RF performance will be damaged)
1300-1577 Rev 3
Sony Mobile Communications AB – Company Internal
2(16)
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1 Replaceable Components
EXPLANATION OF ABBREVIATIONS USED IN THE COLUMN ‘COMMENTS’ BELOW
COMPONENT LOCATION
P = Primary side
S = Secondary side
REPAIR METHOD
HA = Hot Air (removal & mounting)
ST = Soldering Tool (removal & mounting)
HA/ST = Hot Air for removal - Soldering Tool for mounting
BGA = BGA Station
BH = Bottom Heater
ADDITIONAL INFORMAT ION
1 (2,3,4, etc.) = Proceed to ‘Additional Repair Info’ for further instructions in the indicated section(s).
1300-1577 Rev 3
Sony Mobile Communications AB – Company Internal
3(16)
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1300-1577 Rev 3
Sony Mobile Communications AB – Company Internal
Conn BtB Plug 4p HIROSE/BM22
Conn Leaf Spring Plug 1p WH : 0.8+-0.2
Card Conn SIM Dual nanoSIM connector
LED White 1.63mm x 2.03mm
Filter Ceramic Lo-pass 50.0 MHz 1608
Resistor 0.01 Ohm +/-1% 200.0 mW (1.6x0.
Component Replacement (elect)
Note: Valid for E6633 and E6683
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1300-1577 Rev 3
Sony Mobile Communications AB – Company Internal
Conn BtB Plug 4p HIROSE/BM22
Conn Leaf Spring Plug 1p WH : 0.8+-0.2
Card Conn Other microSD and nanoSIM comb
LED White 1.63mm x 2.03mm
Filter Ceramic Lo-pass 50.0 MHz 1608
Resistor 0.01 Ohm +/-1% 200.0 mW (1.6x0.
Component Replacement (elect)
Note: Valid for E6603 and E6653