Sony CXD1852Q Datasheet

MPEG1 Decoder
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Description
The CXD1852Q is a single-chip MPEG1 decoder with a built-in CD-ROM decoder which allows decoding of MPEG1 system, video and audio layers. A built-in CD-ROM decoder enables direct connection with a CD-DSP. Combining this chip with a control microcomputer and 4-Mbit DRAM, etc. allows configuration of a MPEG1 decoding system for video CD players, etc.
Features
Supply voltage: 3.3 ± 0.3V
Input and output voltages: LVTTL compatible
5V can be applied as the input voltage (excluding
some pins)
Allows decoding of MPEG1 system, video and
audio layers
Built-in CD-ROM decoder allows direct connection
with a CD-DSP
CD-ROM decoded output can be transferred to
and stored in an external DRAM
RGB and YCbCr video data output allowed
Built-in video sync generator
Audio data output can support various DAC
Supports various special playback modes
Video CD PAL high resolution still picture can be
decoded with a single 4-Mbit DRAM
8-bit parallel and 4-line serial host interfaces
CD-DA through operation allowed
CXD1852Q
120 pin QFP (Plastic)
Structure
Silicon gate CMOS IC
Applications
Video CD players, MPEG1 decoder boards, etc.
Block Diagram
CD-DSP
I/F
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
CD-ROM
Decoder
To each circuit block
Host
interface
I/F
Host
MPEG
System
Decoder
DRAM
Controler
DRAM
I/F
MPEG
Audio
Decoder
MPEG
Video
Decoder
Video Postprocessor
&
Sync Generator
Signal
Video Sync
Audio
I/F
Video
I/F
– 1 –
E96656-PS
1. Pin Configuration
CXD1852Q
VSS
XTL0O
XTL0I
DD
V HA2 HA3 HD0 HD1 HD2 HD3 HD4 HD5 HD6
DD
V
VSS HD7
MA3 MA4 MA2 MA5 MA1
SS
V
MA6 MA0
BC
TCKI
TDI
TENA1
TDO
VST
10 11 12 13 14 15 16 17 18 19 20 21 22
25 26 27 28 29 30
23 24
HA1
119120
HA0
118
XRST
117
HRW
XHIRQ
116
115
XHDT
114
XHCS
113
DOIN
112
BCKI
111
DATI
110
LRCI
109
C2PO
108
DD
V
XTL2I
106
107
SS
V
XTL2O
105
104
DD
BCKO
FSXI
V
103
102
101
LRCO
100
DATO
99
DOUT
98
XSGRST
CLK0O
97
CSYNC
96
FID/FHREF
CBLNK/FSC
95
94
93
1
2 3 4 5 6 7 8 9
HSYNC
VSYNC
92
91
SS
V
DD
V
90 89
DCLK B/Cb7
88
B/Cb6
87
B/Cb5
86
B/Cb4
85 84
B/Cb3 B/Cb2
83 82
B/Cb1
81
B/Cb0 G/Y7
80
G/Y6
79
G/Y5
78
G/Y4
77
G/Y3
76
SS
V
75
VDD
74
G/Y2
73
G/Y1
72
G/Y0
71
R/Cr7
70
R/Cr6
69
R/Cr5
68
R/Cr4
67
R/Cr3
66 65
R/Cr2 R/Cr1
64
R/Cr0
63
XVOE
62
SS
V
61
313233
SS
V
MA7
34
MA8
35
XRAS
37
36
XMWE
XCAS2/MA9
38
MD7
XCAS0
39
40
MD8
41 42
MD6
MD9
43
MD5
44
MD10
45
DD
V
– 2 –
46
SS
V
MD4
47
48
MD11
49
MD3
50
MD12
51
MD2
52
MD13
MD1
53
54
MD14
55
MD0
56
MD15
57
OSDB
OSDEN
58
59
OSDR
OSDG
60
DD
V
2. Pin Description
Pin No. Symbol I/O Description
CXD1852Q
2 3
5, 6, 119, 120
7 to 13, 16
17 to 21, 23, 24, 32, 33
34 35
36
VDD VSS XTL0O
XTL0I
HA0 to HA3
HD0 to HD7
MA0 to MA8
XRAS XMWE
XCAS2/ MA9
O
I
I
I/O
O
O O
O
+3.3V power supply Connect to ground. Video decoder master clock. Input the clock to XTL0I or connect an
oscillator between XTL0I and XTL0O. The recommended frequencies are 27MHz, 28.6363MHz (NTSC 8fsc) and 35.4686MHz (PAL 8fsc).
When the host interface operates in parallel mode, these pins are the register address inputs. In serial mode, HA0 is the serial data input, and HA1 to HA3 should be fixed to low level.
When the host interface operates in parallel mode, these pins are the register data I/Os. In serial mode, HD0 is the serial data output, and HD1 to HD7 should be fixed to low level.
DRAM address signal outputs. Connect to the DRAM address pins so that the numbers match.
Row address strobe signal output. Connect to the DRAM RAS signal pin. DRAM write enable signal output. Connect to the DRAM WE signal pin. Used when connecting 8 Mbits of DRAM. Connect to the upper word
(256K to 512K-1) DRAM CAS signal pin (for both the upper and lower bytes) when the DRAM configuration is 256 Kwords × 16 bits × 2, and to the MA9 pin (for two DRAMs) when the DRAM configuration is 512 Kwords × 8 bits × 2.
37
38 to 43, 46 to 55
56
57 to 59
62
63 to 70
71 to 73, 76 to 88
81 to 88
XCAS0
MD0 to MD15
OSDEN OSDB,
OSDG, OSDR
XVOE
R/Cr0 to R/Cr7
G/Y0 to G/Y7
B/Cb0 to B/Cb7
O
I/O
I
I
I
O
DRAM column address strobe signal output. Connect to the lower word (0 to 256K-1) DRAM CAS signal pin (for both the upper and lower bytes) when the DRAM configuration is 256Kwords × 16 bits × 2, and to all DRAM CAS signal pins in all other cases.
DRAM data signal I/Os. Connect to the DRAM data pins so that the numbers match.
OSD enable signal. The enabled polarity is changed by the register settings.
OSD data inputs. When the signal input to the OSDEN pin is enabled, the color registered in the color table which is specified by these three inputs (3 bits) is output as the image data.
Video output enable signal. Image data output and DCLK output are enabled when this pin is low, and disabled when this pin is high (high impedance). Note that the output control register must be set to output enable for output to be enabled.
Image data outputs. The output data format (RGB, YCbCr, etc.) and the correspondence between the pins and output data can be changed by setting the registers.
89
DCLK
I/O
Dot clock (DCLK) signal. The DCLK frequency is normally 13.5MHz. DCLK can be input from this pin, or frequency divided from the clock input and output from this pin.
– 3 –
Pin No. Symbol I/O Description
Horizontal sync signal. When using the built-in sync generator, the dot
92
HSYNC
I/O
clock (DCLK) is frequency divided and output. When not using the sync generator, this pin is an input.
Vertical sync signal. When using the built-in sync generator, the dot clock
93
VSYNC
I/O
(DCLK) is frequency divided and output. When not using the built-in sync generator, this pin is an input.
Field identification signal (FID) and horizontal sync phase reference signal (FHREF). The signal to be used is set in the register. When set to FID, this pin is an output if using the built-in sync generator, and an input if not
94
FID/FHREF
I/O
using the built-in sync generator. High corresponds to odd fields. When set to FHREF, this pin outputs the signal obtained by frequency dividing XTL0. When XTL0 is 8fsc, this signal is equivalent to the HSYNC cycle, and can be used for phase comparison with the HSYNC signal.
Composite blanking signal (CBLNK) and fsc signal. The signal to be used is set in the register. When set to CBLNK, this pin is an output if using the built-in sync generator, and an input if not using the built-in sync generator. When set to fsc, this pin outputs the signal obtained by frequency dividing
95
CBLNK/ FSC
I/O
XTL0. The frequency division ratio can be selected from 1/8 or 1/16.
CXD1852Q
96
97
98
99 100 101 102
103
106
107
109 110
CSYNC
XSGRST
CLK0O DOUT
DATO LRCO BCKO
FSXI
XTL2O
XTL2I
C2PO LRCI
Composite sync signal obtained by frequency dividing DCLK. This pin
O
cannot be input. Sync generator reset signal input. The built-in sync generator is initialized
I
by setting this pin low. Output for clock obtained by frequency dividing XTL0. The frequency
O
division ratio can be selected from 1, 1/2, 1/4 or 1/8. Audio digital output.
O
Audio serial data output to DAC.
O
L/R clock output to DAC.
O
Bit clock output to DAC.
O
Audio interface clock input. Input 256fs (11.2896MHz), 384fs
I
(16.9344MHz), 512fs (22.5792MHz), or 768fs (33.8688MHz), etc. Master clock for CD-ROM and audio decoders. Input the clock to XTL2I or
O
connect an oscillator between XTL2I and XTL2O. The recommended frequency is 45MHz. Note that this clock is for the internal circuits, and the
I
input and output are not synchronized. C2 pointer input from CD-DSP. Indicates that the DATI input contains an
I
error. LR clock input from CD-DSP. Indicates the L or R channel of DATI.
I 111 112 113 114
115
DATI BCKI DOIN XHCS
XHDT
I/O
Serial data input from CD-DSP.
I
Bit clock input from CD-DSP. This clock strobes the DATI input.
I
Digital data input from CD-DSP.
I
Chip select signal input during register access.
I
Wait signal output during register access. This pin is valid only when the host interface operates in parallel mode. This pin functions as an open drain, and should therefore be pulled up. It should be pulled up when the host interface operates in serial mode as well.
– 4 –
Pin No. Symbol I/O Description
CXD1852Q
116
117
118
25 26 27 28 29 30
HRW
XHIRQ
XRST BC
TCKI TDI TENA1 TDO VST
R/W signal input when the host interface operates in parallel mode. Serial
I
clock input in serial mode. Interrupt request signal output. This pin functions as an open drain, and
O
should therefore be pulled up. Hardware reset signal input. All operation is initialized by setting this pin
I
low. Test. Leave open.
Test. Leave open.
Test. Leave open.
Test. Leave open.
Test. Leave open.
Test. Connect to ground.
– 5 –
3. Electrical Characteristics
3-1. Absolute Maximum Ratings (Ta = 25°C, VSS = 0V)
CXD1852Q
Item Supply voltage Input pin voltage Input pin voltage Output pin voltage Output pin voltage I/O pin voltage Allowable power dissipation Operating temperature Storage temperature
1
XTL0I and XTL2I pins
2
Input pins other than those in ∗1above.
3
XTL0O and XTL2O pins
4
Output pins other than those in ∗3above.
Symbol Rating Unit Remarks VDD VI VI VO VO VI/O PD Topr Tstg
–0.5 to +4.6
–0.5 to VDD + 0.5
–0.5 to +5.5
–0.5 to VDD + 0.5
–0.5 to +5.5 –0.5 to +5.5
1.0
–20 to +75
–55 to +150
V V V V V
V W °C °C
1234
3-2. Recommended Operating Conditions (Ta = –20 to +75°C, VSS = 0V)
Item Supply voltage High level input voltage High level input voltage Low level input voltage Input rise time Input fall time Operating temperature
1
XTL0I and XTL2I pins
2
I/O pins and input pins other than those in ∗1above.
Symbol Min. VDD VIH VIH VIL Tr Tf Topr
3.0
2.2
2.2 0 0 0
–20
Typ.
3.3 — — — — — —
Max.
3.6
VDD
5.0
0.8 50 50 75
Unit Remarks
V
1
V
2
V
V ns ns °C
– 6 –
CXD1852Q
3-3. DC Characteristics (Ta = –20 to +75°C, VSS = 0V, VDD = 3.3 ±0.3V)
Item
Average operating supply current
Input leak current High level output voltage High level output voltage Low level output voltage Low level output voltage
Output leak current Feedback resistance
Logic threshold value High level output voltage Low level output voltage
1
Input pins other than XTL0I and XTL2I
2
I/O pins and output pins other than XTL0O and XTL2O
3
Oscillators (between XTL0I and XTL0O, and between XTL2I and XTL2O)
4
XTL0I and XTL2I pins
5
XTL0O and XTL2O pins
Symbol
IDD II
VOH VOH VOL VOL
IOZ RFB
LVth VOH VOL
Measurement conditions Min.
VI = 0 to 5.0V IOH = –2mA IOH = –100µA IOL = 4mA IOL = 100µA VO = 0 to 5.0V,
output disabled status VI = 0V or VI = VDD
–40
VDD – 0.8
— — —
–40
250k
— IOH = –12mA IOL = 12mA
VDD/2
Typ.
— —
VDD – 0.4
0.04 —
1M
VDD/2
— —
Max.
100
40 — —
0.4 —
40
2.5M — —
VDD/2
Unit Remarks
mA
1
µA
2
V
2
V
2
V
2
V
2
µA
3
4
V
5
V
5
V
3-4. Clock Signal AC Characteristics
tCX0
tWLX0
XTL0I tWHX0
tCX2
tWLX2
XTL2I tWHX2
Item XTL0I frequency XTL0I cycle XTL0I high level interval XTL0I low level interval XTL2I frequency XTL2I cycle XTL2I high level interval XTL2I low level interval
1
When using in combination with the XTL0O pin as an oscillator, the maximum oscillation frequency is 50MHz.
2
When using in combination with the XTL2O pin as an oscillator, the maximum oscillation frequency is 50MHz.
Symbol Min. fX0
tCX0 tWHX0 tWLX0
fX2
tCX2 tWHX2 tWLX2
33.3 10 10
44.7 —
8 8
Typ.
— — — —
45.1584
22.2 — —
Max.
60 — — —
45.4 — — —
Unit Remarks
MHz
ns ns ns
MHz
ns ns ns
11
22
– 7 –
3-5. Host Interface AC Characteristics
3-5-1. Serial Mode (write, read)
XHCS
CXD1852Q
tSCS tWLSK tCSK
HRW
(SCK)
tSSI tHSI
HA0
(SI)
HD0 (SQ)
Item Serial clock frequency Serial clock cycle Serial clock high level interval Serial clock low level interval Chip select setup time Chip select hold time Serial input setup time
tWHSK
tDSQtLZSQ
Symbol Min. fSK
tCSK tWHSK tWLSK tSCS tHCS tSSI
— 500 100 100
0
500
30
Max.
2 — — — — — —
tHCS
tOHSQ
Unit Remarks
MHz
ns ns ns ns ns ns
tHZSQ
Serial input hold time Serial output enable time Serial output determination time Serial output hold time Serial output disable time
tHSI tLZSQ tDSQ tOHSQ tHZSQ
30
0
5 0
— 15 40 — 15
ns ns ns ns ns
– 8 –
3-5-2. Parallel Mode, Register Write
HA0 to 3
tSA
tWCSH
XHCS
XHRW
CXD1852Q
tHA
tWWL1
XHDT
HD0 to 7
Item Address setup time Address hold time Chip disable time Write pulse width Write pulse hold time Wait signal delay time HD output disable time (for WR) HD input setup time HD input hold time
tDWA1
Symbol Min.
tSA tHA tWCSH tWWL1 tHW1 tDWA1 tHZQ2 tSD1 tHD1
20 20 20 60 10 — — 25 25
tHW1
tSD1 tHD1tHZQ2
Max.
— — — — — 15 15 — —
inputoutput
Unit Remarks
ns ns ns ns ns ns ns ns ns
12
32, 41, 4522
1
Specified for the edge of XHCS or HRW, whichever is later.
2
Specified for the edge of XHCS or HRW, whichever is earlier.
3
Interval during which both XHCS and HRW are low.
4
Applies only to access resulting in wait status.
5
Do not apply data while output is enabled.
– 9 –
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