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Description
The CXD1852Q is a single-chip MPEG1 decoder
with a built-in CD-ROM decoder which allows
decoding of MPEG1 system, video and audio layers.
A built-in CD-ROM decoder enables direct connection
with a CD-DSP. Combining this chip with a control
microcomputer and 4-Mbit DRAM, etc. allows
configuration of a MPEG1 decoding system for video
CD players, etc.
Features
• Supply voltage: 3.3 ± 0.3V
• Input and output voltages: LVTTL compatible
• 5V can be applied as the input voltage (excluding
some pins)
• Allows decoding of MPEG1 system, video and
audio layers
• Built-in CD-ROM decoder allows direct connection
with a CD-DSP
• CD-ROM decoded output can be transferred to
and stored in an external DRAM
• RGB and YCbCr video data output allowed
• Built-in video sync generator
• Audio data output can support various DAC
• Supports various special playback modes
• Video CD PAL high resolution still picture can be
decoded with a single 4-Mbit DRAM
• 8-bit parallel and 4-line serial host interfaces
• CD-DA through operation allowed
CXD1852Q
120 pin QFP (Plastic)
Structure
Silicon gate CMOS IC
Applications
Video CD players, MPEG1 decoder boards, etc.
Block Diagram
CD-DSP
I/F
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
CD-ROM
Decoder
To each circuit block
Host
interface
I/F
Host
MPEG
System
Decoder
DRAM
Controler
DRAM
I/F
MPEG
Audio
Decoder
MPEG
Video
Decoder
Video Postprocessor
&
Sync Generator
Signal
Video Sync
Audio
I/F
Video
I/F
– 1 –
E96656-PS
1. Pin Configuration
CXD1852Q
VSS
XTL0O
XTL0I
DD
V
HA2
HA3
HD0
HD1
HD2
HD3
HD4
HD5
HD6
DD
V
VSS
HD7
MA3
MA4
MA2
MA5
MA1
SS
V
MA6
MA0
BC
TCKI
TDI
TENA1
TDO
VST
10
11
12
13
14
15
16
17
18
19
20
21
22
25
26
27
28
29
30
23
24
HA1
119120
HA0
118
XRST
117
HRW
XHIRQ
116
115
XHDT
114
XHCS
113
DOIN
112
BCKI
111
DATI
110
LRCI
109
C2PO
108
DD
V
XTL2I
106
107
SS
V
XTL2O
105
104
DD
BCKO
FSXI
V
103
102
101
LRCO
100
DATO
99
DOUT
98
XSGRST
CLK0O
97
CSYNC
96
FID/FHREF
CBLNK/FSC
95
94
93
1
2
3
4
5
6
7
8
9
HSYNC
VSYNC
92
91
SS
V
DD
V
90
89
DCLK
B/Cb7
88
B/Cb6
87
B/Cb5
86
B/Cb4
85
84
B/Cb3
B/Cb2
83
82
B/Cb1
81
B/Cb0
G/Y7
80
G/Y6
79
G/Y5
78
G/Y4
77
G/Y3
76
SS
V
75
VDD
74
G/Y2
73
G/Y1
72
G/Y0
71
R/Cr7
70
R/Cr6
69
R/Cr5
68
R/Cr4
67
R/Cr3
66
65
R/Cr2
R/Cr1
64
R/Cr0
63
XVOE
62
SS
V
61
313233
SS
V
MA7
34
MA8
35
XRAS
37
36
XMWE
XCAS2/MA9
38
MD7
XCAS0
39
40
MD8
41 42
MD6
MD9
43
MD5
44
MD10
45
DD
V
– 2 –
46
SS
V
MD4
47
48
MD11
49
MD3
50
MD12
51
MD2
52
MD13
MD1
53
54
MD14
55
MD0
56
MD15
57
OSDB
OSDEN
58
59
OSDR
OSDG
60
DD
V
2. Pin Description
Pin No.SymbolI/ODescription
CXD1852Q
2
3
5, 6, 119,
120
7 to 13,
16
17 to 21,
23, 24,
32, 33
34
35
36
VDD
VSS
XTL0O
XTL0I
HA0 to HA3
HD0 to HD7
MA0 to MA8
XRAS
XMWE
XCAS2/
MA9
O
I
I
I/O
O
O
O
O
+3.3V power supply
Connect to ground.
Video decoder master clock. Input the clock to XTL0I or connect an
oscillator between XTL0I and XTL0O. The recommended frequencies are
27MHz, 28.6363MHz (NTSC 8fsc) and 35.4686MHz (PAL 8fsc).
When the host interface operates in parallel mode, these pins are the
register address inputs. In serial mode, HA0 is the serial data input, and
HA1 to HA3 should be fixed to low level.
When the host interface operates in parallel mode, these pins are the
register data I/Os. In serial mode, HD0 is the serial data output, and HD1
to HD7 should be fixed to low level.
DRAM address signal outputs. Connect to the DRAM address pins so that
the numbers match.
Row address strobe signal output. Connect to the DRAM RAS signal pin.
DRAM write enable signal output. Connect to the DRAM WE signal pin.
Used when connecting 8 Mbits of DRAM. Connect to the upper word
(256K to 512K-1) DRAM CAS signal pin (for both the upper and lower
bytes) when the DRAM configuration is 256 Kwords × 16 bits × 2, and to
the MA9 pin (for two DRAMs) when the DRAM configuration is 512 Kwords
× 8 bits × 2.
37
38 to 43,
46 to 55
56
57 to 59
62
63 to 70
71 to 73,
76 to 88
81 to 88
XCAS0
MD0 to
MD15
OSDEN
OSDB,
OSDG,
OSDR
XVOE
R/Cr0 to
R/Cr7
G/Y0 to
G/Y7
B/Cb0 to
B/Cb7
O
I/O
I
I
I
O
DRAM column address strobe signal output. Connect to the lower word
(0 to 256K-1) DRAM CAS signal pin (for both the upper and lower bytes)
when the DRAM configuration is 256Kwords × 16 bits × 2, and to all
DRAM CAS signal pins in all other cases.
DRAM data signal I/Os. Connect to the DRAM data pins so that the
numbers match.
OSD enable signal. The enabled polarity is changed by the register
settings.
OSD data inputs. When the signal input to the OSDEN pin is enabled, the
color registered in the color table which is specified by these three inputs
(3 bits) is output as the image data.
Video output enable signal. Image data output and DCLK output are
enabled when this pin is low, and disabled when this pin is high (high
impedance). Note that the output control register must be set to output
enable for output to be enabled.
Image data outputs. The output data format (RGB, YCbCr, etc.) and the
correspondence between the pins and output data can be changed by
setting the registers.
89
DCLK
I/O
Dot clock (DCLK) signal. The DCLK frequency is normally 13.5MHz.
DCLK can be input from this pin, or frequency divided from the clock input
and output from this pin.
– 3 –
Pin No.SymbolI/ODescription
Horizontal sync signal. When using the built-in sync generator, the dot
92
HSYNC
I/O
clock (DCLK) is frequency divided and output. When not using the sync
generator, this pin is an input.
Vertical sync signal. When using the built-in sync generator, the dot clock
93
VSYNC
I/O
(DCLK) is frequency divided and output. When not using the built-in sync
generator, this pin is an input.
Field identification signal (FID) and horizontal sync phase reference signal
(FHREF). The signal to be used is set in the register. When set to FID, this
pin is an output if using the built-in sync generator, and an input if not
94
FID/FHREF
I/O
using the built-in sync generator. High corresponds to odd fields. When set
to FHREF, this pin outputs the signal obtained by frequency dividing XTL0.
When XTL0 is 8fsc, this signal is equivalent to the HSYNC cycle, and can
be used for phase comparison with the HSYNC signal.
Composite blanking signal (CBLNK) and fsc signal. The signal to be used
is set in the register. When set to CBLNK, this pin is an output if using the
built-in sync generator, and an input if not using the built-in sync generator.
When set to fsc, this pin outputs the signal obtained by frequency dividing
95
CBLNK/
FSC
I/O
XTL0. The frequency division ratio can be selected from 1/8 or 1/16.
CXD1852Q
96
97
98
99
100
101
102
103
106
107
109
110
CSYNC
XSGRST
CLK0O
DOUT
DATO
LRCO
BCKO
FSXI
XTL2O
XTL2I
C2PO
LRCI
Composite sync signal obtained by frequency dividing DCLK. This pin
O
cannot be input.
Sync generator reset signal input. The built-in sync generator is initialized
I
by setting this pin low.
Output for clock obtained by frequency dividing XTL0. The frequency
O
division ratio can be selected from 1, 1/2, 1/4 or 1/8.
Audio digital output.
(16.9344MHz), 512fs (22.5792MHz), or 768fs (33.8688MHz), etc.
Master clock for CD-ROM and audio decoders. Input the clock to XTL2I or
O
connect an oscillator between XTL2I and XTL2O. The recommended
frequency is 45MHz. Note that this clock is for the internal circuits, and the
I
input and output are not synchronized.
C2 pointer input from CD-DSP. Indicates that the DATI input contains an
I
error.
LR clock input from CD-DSP. Indicates the L or R channel of DATI.
I
111
112
113
114
115
DATI
BCKI
DOIN
XHCS
XHDT
I/O
Serial data input from CD-DSP.
I
Bit clock input from CD-DSP. This clock strobes the DATI input.
I
Digital data input from CD-DSP.
I
Chip select signal input during register access.
I
Wait signal output during register access. This pin is valid only when the
host interface operates in parallel mode. This pin functions as an open
drain, and should therefore be pulled up. It should be pulled up when the
host interface operates in serial mode as well.
– 4 –
Pin No.SymbolI/ODescription
CXD1852Q
116
117
118
25
26
27
28
29
30
HRW
XHIRQ
XRST
BC
TCKI
TDI
TENA1
TDO
VST
R/W signal input when the host interface operates in parallel mode. Serial
I
clock input in serial mode.
Interrupt request signal output. This pin functions as an open drain, and
O
should therefore be pulled up.
Hardware reset signal input. All operation is initialized by setting this pin
I
low.
Test. Leave open.
—
Test. Leave open.
—
Test. Leave open.
—
Test. Leave open.
—
Test. Leave open.
—
Test. Connect to ground.
—
– 5 –
3. Electrical Characteristics
3-1. Absolute Maximum Ratings(Ta = 25°C, VSS = 0V)
CXD1852Q
Item
Supply voltage
Input pin voltage
Input pin voltage
Output pin voltage
Output pin voltage
I/O pin voltage
Allowable power dissipation
Operating temperature
Storage temperature
∗1
XTL0I and XTL2I pins
∗2
Input pins other than those in ∗1above.
∗3
XTL0O and XTL2O pins
∗4
Output pins other than those in ∗3above.
SymbolRatingUnitRemarks
VDD
VI
VI
VO
VO
VI/O
PD
Topr
Tstg
Item
Supply voltage
High level input voltage
High level input voltage
Low level input voltage
Input rise time
Input fall time
Operating temperature
∗1
XTL0I and XTL2I pins
∗2
I/O pins and input pins other than those in ∗1above.
SymbolMin.
VDD
VIH
VIH
VIL
Tr
Tf
Topr
3.0
2.2
2.2
0
0
0
–20
Typ.
3.3
—
—
—
—
—
—
Max.
3.6
VDD
5.0
0.8
50
50
75
UnitRemarks
V
∗1
V
∗2
V
V
ns
ns
°C
– 6 –
CXD1852Q
3-3. DC Characteristics(Ta = –20 to +75°C, VSS = 0V, VDD = 3.3 ±0.3V)
Item
Average operating
supply current
Input leak current
High level output voltage
High level output voltage
Low level output voltage
Low level output voltage
Output leak current
Feedback resistance
Logic threshold value
High level output voltage
Low level output voltage
∗1
Input pins other than XTL0I and XTL2I
∗2
I/O pins and output pins other than XTL0O and XTL2O
∗3
Oscillators (between XTL0I and XTL0O, and between XTL2I and XTL2O)
∗4
XTL0I and XTL2I pins
∗5
XTL0O and XTL2O pins
Symbol
IDD
II
VOH
VOH
VOL
VOL
IOZ
RFB
LVth
VOH
VOL
Measurement conditionsMin.
—
VI = 0 to 5.0V
IOH = –2mA
IOH = –100µA
IOL = 4mA
IOL = 100µA
VO = 0 to 5.0V,
output disabled status
VI = 0V or VI = VDD
–40
VDD – 0.8
—
—
—
–40
250k
—
IOH = –12mA
IOL = 12mA
VDD/2
—
Typ.
—
—
—
VDD – 0.4
—
0.04
—
1M
VDD/2
—
—
Max.
100
40
—
—
0.4
—
40
2.5M
—
—
VDD/2
Unit Remarks
mA
∗1
µA
∗2
V
∗2
V
∗2
V
∗2
V
∗2
µA
∗3
Ω
∗4
V
∗5
V
∗5
V
3-4. Clock Signal AC Characteristics
tCX0
tWLX0
XTL0ItWHX0
tCX2
tWLX2
XTL2ItWHX2
Item
XTL0I frequency
XTL0I cycle
XTL0I high level interval
XTL0I low level interval
XTL2I frequency
XTL2I cycle
XTL2I high level interval
XTL2I low level interval
∗1
When using in combination with the XTL0O pin as an oscillator, the maximum oscillation frequency is 50MHz.
∗2
When using in combination with the XTL2O pin as an oscillator, the maximum oscillation frequency is 50MHz.
SymbolMin.
fX0
tCX0
tWHX0
tWLX0
fX2
tCX2
tWHX2
tWLX2
—
33.3
10
10
44.7
—
8
8
Typ.
—
—
—
—
45.1584
22.2
—
—
Max.
60
—
—
—
45.4
—
—
—
Unit Remarks
MHz
ns
ns
ns
MHz
ns
ns
ns
∗1
∗1
∗2
∗2
– 7 –
3-5. Host Interface AC Characteristics
3-5-1. Serial Mode (write, read)
XHCS
CXD1852Q
tSCStWLSKtCSK
HRW
(SCK)
tSSItHSI
HA0
(SI)
HD0
(SQ)
Item
Serial clock frequency
Serial clock cycle
Serial clock high level interval
Serial clock low level interval
Chip select setup time
Chip select hold time
Serial input setup time
tWHSK
tDSQtLZSQ
SymbolMin.
fSK
tCSK
tWHSK
tWLSK
tSCS
tHCS
tSSI
—
500
100
100
0
500
30
Max.
2
—
—
—
—
—
—
tHCS
tOHSQ
UnitRemarks
MHz
ns
ns
ns
ns
ns
ns
tHZSQ
Serial input hold time
Serial output enable time
Serial output determination time
Serial output hold time
Serial output disable time
tHSI
tLZSQ
tDSQ
tOHSQ
tHZSQ
30
0
—
5
0
—
15
40
—
15
ns
ns
ns
ns
ns
– 8 –
3-5-2. Parallel Mode, Register Write
HA0 to 3
tSA
tWCSH
XHCS
XHRW
CXD1852Q
tHA
tWWL1
XHDT
HD0 to 7
Item
Address setup time
Address hold time
Chip disable time
Write pulse width
Write pulse hold time
Wait signal delay time
HD output disable time (for WR)
HD input setup time
HD input hold time
tDWA1
SymbolMin.
tSA
tHA
tWCSH
tWWL1
tHW1
tDWA1
tHZQ2
tSD1
tHD1
20
20
20
60
10
—
—
25
25
tHW1
tSD1tHD1tHZQ2
Max.
—
—
—
—
—
15
15
—
—
inputoutput
UnitRemarks
ns
ns
ns
ns
ns
ns
ns
ns
ns
∗1
∗2
∗3
∗2, ∗4
∗1, ∗4
∗5
∗2
∗2
∗1
Specified for the edge of XHCS or HRW, whichever is later.
∗2
Specified for the edge of XHCS or HRW, whichever is earlier.
∗3
Interval during which both XHCS and HRW are low.
∗4
Applies only to access resulting in wait status.
∗5
Do not apply data while output is enabled.
– 9 –
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