Softing Data Flow commModule MBP Hardware Manual

Hardware Manual
commModule MBP
Version: EN-022018-1.00
© Softing Industrial Automation GmbH
Disclaimer of liability
The information contained in these instructions corresponds to the technical status at the time of printing of it and is passed on with the best of our knowledge. The information in these instructions is in no event a basis for warranty claims or contractual agreements concerning the described products, and may especially not be deemed as warranty concerning the quality and durability pursuant to Sec. 443 German Civil Code. We reserve the right to make any alterations or improvements to these instructions without prior notice. The actual design of products may deviate from the information contained in the instructions if technical alterations and product improvements so require.
It may not, in part or in its entirety, be reproduced, copied, or transferred into electronic media.
Softing Industrial Automation GmbH
Richard-Reitzner-Allee 6 85540 Haar / Germany http://industrial.softing.com
+ 49 89 4 56 56-340 + 49 89 4 56 56-488 info.idn@softing.com support.automation@softing.com
The latest version of this manual is available in the Softing download area at: http://industrial.softing.com/en/downloads.html
Table of Contents
Table of Contents
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Introduction
commModule MBP
Interface
Electrical specifications
...................................................................................... 5
............................................................................................................... 51.1 About this document
............................................................................................................... 51.2 Related documentation
............................................................................................................... 51.3 Conventions used
............................................................................................................... 51.4 Document history
...................................................................................... 6
............................................................................................................... 62.1 Diagram
............................................................................................................... 62.2 Intended use
...................................................................................... 7
............................................................................................................... 73.1 Orientation
............................................................................................................... 73.2 Pin number and signal description
............................................................................................................... 93.3 Pullups and pulldowns
............................................................................................................... 93.4 Flash programming and debugging interface
............................................................................................................... 93.5 Fault Disconnect Equipment
............................................................................................................... 93.6 Simulate enable
...................................................................................... 10
Chapter 5
Chapter 6
Chapter 7
............................................................................................................... 104.1 Protocol select
............................................................................................................... 104.2 Operating conditions
............................................................................................................... 104.3 Port input and output
Environmental specifications
Mechanical specification
Special conditions for safe use
...................................................................................... 12
............................................................................................................... 125.1 Temperature
............................................................................................................... 125.2 MTBF calculation
............................................................................................................... 135.3 Certifications
...................................................................................... 14
............................................................................................................... 146.1 Module dimensions
............................................................................................................... 156.2 Host PCB layout
............................................................................................................... 176.3 Mounting process
............................................................................................................... 176.4 ESD handling precautions
............................................................................................................... 176.5 Packaging and labeling
...................................................................................... 18
............................................................................................................... 187.1 Galvanic isolation
............................................................................................................... 187.2 Safety block diagram
............................................................................................................... 197.3 Installation
............................................................................................................... 197.4 Isolation and creepage distances
© Softing Industrial Automation GmbH 3
Table of Contents
............................................................................................................... 207.5 Label
............................................................................................................... 207.6 Maintenance and spare parts
Chapter 8
CE Compliance
............................................................................................................... 228.1 ATEX EC type examination certificate
............................................................................................................... 278.2 IECEx Certificate of Conformity
............................................................................................................... 358.3 Declaration of Conformity
...................................................................................... 21
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© Softing Industrial Automation GmbH
Chapter 1 - Introduction
CAUTION
This symbol indicates a potentially hazardous situation which, if not avoided, may result in minor or moderate injury.
Note
This symbol is used to call attention to notable information that should be followed during installation, use, or servicing of this device.
Hint
This symbol is used when providing you with helpful user hints.
Document version
Modifications compared to previous version
1.00 - initial version
none
1

Introduction

1.1 About this document

This document is addressed to hardware engineers, giving them a detailed description about the electrical, mechanical and functional specifics of the single-sided communication module, commModule MBP.

1.2 Related documentation

For further details about the commModule MBP and the configuration workflow of the firmware see the following document:
commScript PD Customization Guide

1.3 Conventions used

The following conventions are used throughout Softing customer documentation:

1.4 Document history

© Softing Industrial Automation GmbH
5
commModule MBP - Hardware Manual
CAUTION
The commModule MBP is certified for the use in hazardous areas when used in accordance with its specification and operating conditions. See also Operating conditions for use in
hazardous environment .
2

commModule MBP

The commModule MBP is a surface mountable fieldbus communication module with minimum footprint. It is typically integrated into an intelligent field device mapping industrial intrinsic safe fieldbus Profibus PA
and Foundation Fieldbus to the field device.

2.1 Diagram

The block diagram below shows the design of the commModule MBP:
12

2.2 Intended use

This product has been designed to be integrated as a system component by a qualified hardware engineer.
6
© Softing Industrial Automation GmbH
Chapter 3 - Interface
Signal Name
Pin No.
I/O*
Description
TXD9_PB7
1DOTX Interface signal for HART
#RTS9_PB5
2DOLow active RTS signal for HART
RXD9_PB6
3DIRX Interface signal for HART
GPIO_PA4
4
GPIO
For future use
GPIO_PE6
5
GPIO, AI
For future use
#CTS9_PB4
6DILow active CTS signal for HART
3V15
7
VCC
Do not use. Internal supply voltage
GND
8
Ground
Ground
GPIO_PE2
9
GPIO
For future use
GPIO_PE5
10
GPIO, AI
For future use
GPIO_PE7
11
GPIO, AI
For future use
GPIO_PE1
12
GPIO
For future use
PROT_SEL_P27 / TCK
13DIProtocol Select: FF/PA, Programming interface
TDO14DBG
Programming interface
GND
15
Ground
Ground
3

Interface

This section describes the signals available on the module via the PCB solder pads on the edge of the PCB.

3.1 Orientation

Top view on commModule
The position of Pin 1 is marked on the label.

3.2 Pin number and signal description

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commModule MBP - Hardware Manual
RXD7_P92
16DIRX Interface signal for Debug Console (PD 33k)
TXD7_P90
17DOTX Interface signal for Debug Console
DA118AO
For future use
GND
19
Ground
Ground
3V_OUT
20POPower Output 3.15V
6V2_OUT
21POPower Output 6.2V
SIM_EN_P31
22
DBG
Simulate Enable
GPIO_P23
23
GPIO
For future use
GPIO_P22
24
GPIO
For future use
GPIO_P21
25
GPIO
For future use
GPIO_P20
26
GPIO
For future use
GPIO_PC6
27
GPIO
For future use
GPIO_PC7
28
DBG/GPIO
For future use
GPIO_PC5
29
GPIO
For future use
GPIO_PC4
30
GPIO
For future use
EMLE
31
DBG
Programming Interface
TDI32DBG
Programming interface
GPIO_PD2
33
GPIO
For future use
#RESET
34
DBG
Programming interface
FINED
35
DBG
Programming interface (do not pullup)
GND
36
Ground
Ground
FB_P_NF
37FBDo not use
FIELDBUS_N
38FBFieldbus
FIELDBUS_P
39FBFieldbus
FDE_PO
40FBFDE, connect to Pin 41
FDE_PI
41FBFDE, connect to Pin 40
FDE_NO
42FBFDE, connect to Pin 43
FDE_NI
43FBFDE, connect to Pin 42
* AI = Analog Input, AO = Analog Output, DI = CMOS Digital Input, DO = CMOS Digital Output, GPIO = General Purpose CMOS Digital Input/Output, PO = Power Output, DBG = Programmer Interface, FB = Fieldbus, PD Pulldown, PU Pullup
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© Softing Industrial Automation GmbH

3.3 Pullups and pulldowns

Signal Name
Description
14-pin Renesas Fine Interface
TDO
Not required for debugging. Only used for internal flash programming with Renesas Flash Programmer
5
TDI
Not required for debugging. Only used for internal flash programming with Renesas Flash Programmer
11
FINEC
Programming Interface
1
FINED
Programming Interface
7
PC7
Programming Interface
10
#RESET
Programming Interface
13
GND
Ground
2, 12, 14
3V15
Internal supply voltage
8
EMLE
Programming Interface
4
CAUTION
The memory blocks are reserved for the firmware. They must not be modified as this will invalidate the software license and damage the commModule MBP. Only programming project files provided by Softing shall be used to reprogram the module.
Weak pullups are provided on all GPIO pins. Pullups for TDO and TDI are not included on the CommModule MBP and must be included on the application base board (pullup to Pin 7 of CommModule MBP).
RXD7_P92: internal pulldown 33k

3.4 Flash programming and debugging interface

The following signals of the microcontroller are required for flash programming.
See the commModule MBP Evaluation Kit manual for details. The usage of this interface is detailed in document "E1/E20 Emulator – additional document for User’s Manual (RX User System Design) from Renesas".
Chapter 3 - Interface

3.5 Fault Disconnect Equipment

External fault disconnect equipment (FDE) can be optionally added using the assigned FDE pins.
If not in use, connect signal FDE_PO to FDE_PI and signal FDE_NO to FDE_NI.

3.6 Simulate enable

Fieldbus conformance testing requires switching the application to simulation mode. Simulation mode is enabled by signaling low on pin SIM_EN_P31.
For the registration of the final device by the FieldComm Group this signal must be accessible to the fieldbus testing personnel.
© Softing Industrial Automation GmbH
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commModule MBP - Hardware Manual
Fieldbus Protocol
PROT_SEL_P27
description
Fieldbus Foundation FF
High (internal pullup)
Leave open The commModule MBP is operating in Foundation Fieldbus (FF) mode.
Profibus PA
Low
connect to GND The commModule MBP is operating in Profibus PA mode.
Parameter
Symbol
Min
Max
Unit
Test Conditions
DI: input low voltage
V
IL
Vcc x 0.2
V
DI: input high voltage
VIHVcc x 0.8
V
DO: output low voltage
V
OL
0.5
V
IOL = 1mA
DO: output high voltage
VOHVcc – 0.5
V
IOH = -1mA
4

Electrical specifications

4.1 Protocol select

This pin is scanned during start-up.

4.2 Operating conditions

Unless otherwise noted, all specifications apply over the specified operating temperature range.

4.3 Port input and output

The communication module has the following port input and port output specification at Vcc = 3.2V± 4%.
Analog Input
The commModule MBP incorporates a 12bit-A/D converter with a reference voltage of 3.0V
Power Output:
The power budget to supply a connected system from fieldbus is limited. It is dependent on the rated current from fieldbus, which is adjustable in software from IN = 10mA to 26mA.
Available output power:
P
= approx. 90mW on 6V2_OUT, with I
omax
or:
P
= approx. 70mW on 3V_OUT, with I
omax
When both power outputs are used, the available power budget is between 70 and 90mW. The slew rate is controlled. The rise time is 1.43ms. The output current is not limited on the commModule MBP.
10
PO_6V2
PO_3V_OUT
= I
– 10mA
N
= (IN – 10mA) / 0.7
© Softing Industrial Automation GmbH
Chapter 4 - Electrical specifications
Note
If the available power budget is exceeded the commModule MBP may reset.
Parameter
Nom
Min
Max
Unit
3V_OUT Io = 1mA
3.2
3.1
3.3
V
6V2_OUT (internal series resistance 10 Ohms) Io = 1mA
6.2
6.05
6.3
V
Fieldbus:
Physical Layer according to IEC 61158-2 type 3 voltage mode, 31.25kBit/s. Rated current adjusted in software to In = 10mA up to 26mA. Powered from Fieldbus 9V to 32V (non hazardous location).
Use in hazardous locations: Limitation on fieldbus power supply applies for different use cases. See also Operating conditions for use
in hazardous environment .
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© Softing Industrial Automation GmbH
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