15
INSTALLATION & OPERATION
made unnecessarily because the operator was not trained
with the correct operation procedures.
MANY IC DEVICES CAN BE DESTROYED BY HANDLING. CMOS logic devices and Bi-FET opamps are very
static sensitive. They are safe when plugged into their sockets, but removal can expose the inputs to conduct static
electricity from tools, your hands, or other static generating
components. USE PROPER HANDLING PROCEDURES
when removing IC’s from their sockets.
This manual is included with each shipment so that you can
leave a copy with the theatre owner or operator.
SERVICE ACCESS:
The MOD V contains up to 16 plug-in printed circuit cards,
depending on the system configuration. These cards should
be removed ONLY WHEN MAIN POWER HAS BEEN
REMOVED. Plugging in a card with power present can
cause a jolt to the input regulators, causing them to fail. It
should never be necessary to remove the main “Mother
Board” that lies at the rear of the card cage.
To replace LED’s in, or otherwise service the front panel,
the printed circuit card must be detached from the front
panel. First, remove the 50 pin ribbon cable. Then, remove
the 8 screws holding it to standoffs mounted on the rear of
the front panel. It is NOT necessary to remove the knobs on
the Fader pots before attempting to release the card. After
the screws have been removed, slowly and carefully pull the
card back from the front panel so that all and LED’s are
clear of their holes.
To reassemble the unit, follow the directions in reverse.
Before tightening the screws holding the card to the standoffs, make sure the LED’s are seated squarely in their front
panel holes.
P.C. CARD COMPONENT REPLACEMENT:
All IC’s in the MOD V PC cards are socketed and can easily be replaced from the top surface of the boards.
WARNING:
Disconnect the power supply from the AC power line
before replacing components to avoid the danger of electrical shock.
If any of the CMOS logic chips are replaced, use reasonable
care to avoid damage due to static electricity. If the relative
humidity is below 50%, use a grounded workbench and
make sure that the PC board is grounded to it. To prevent
static damage to a chip, do not touch any of the leads unless
you are also touching the workbench, or you are connected
to it through a standard high-resistance grounded wrist
strap. (Such wrist straps are connected to ground through a
1 megaohm or more resistor, greatly reducing danger to personnel due to electric shock.)
Other components that are soldered in place may be
replaced following the instructions covered in this section.
If filter capacitors are to be replaced, fasten them securely
to the board using the original factory installation as a
model. This will prevent them from breaking loose from
vibration in the future.
REPLACEMENT PARTS:
If you have difficulty finding parts for this or any other
SMART product, The SMART Technical Support
Department stands ready to supply you with the required
parts at a fair price. Please contact us at the address on the
title page of this manual.
REPLACEMENT OF COMPONENTS ON PRINTED
CIRCUIT BOARDS:
It is important to use the correct technique for replacing
components mounted on PC boards. Failure to do so will
result in possible circuit damage and/or intermittent problems.
The circuit boards used in the MOD V are the double-sided
plated-through type. This means that there are traces on
both sides of the boards, and that the through-holes contain
a metallic plating in order to conduct current through the
board. Because of the plated-through holes, solder often
creeps 1/16” up into the hole, requiring a sophisticated technique of component removal to prevent serious damage to
the board.
COMPONENT REMOVAL:
If the technician has no practical experience with the
demanding technique of removing components from double-sided PC boards without board damage, it is wiser to cut
each of the leads of the defective component from its body
while the leads are still soldered to the board. The component is then discarded, and each lead is heated independently and pulled out of the board with long nose pliers. Each
hole may be cleared of solder by using solder wick or by
carefully heating with a low-wattage soldering iron and
sucking out the remaining solder with a spring-activated
desoldering tool. THIS METHOD IS THE BEST
METHOD OF CLEARING A PLATED-THROUGH
HOLE OF SOLDER.
Another technique is:
1. Use a 30 watt soldering iron to melt the solder on the
underside (solder side) of the PC board. Do not use a soldering gun or high wattage iron! As soon as the solder is
molten, vacuum it away with a spring activated desoldering
tool like the Edsyn “Soldapult.” Do not overheat the board!
Overheating will almost surely damage the board by causing the conductive foil to separate from the board. Use a
pair of fine needle-nose pliers to wiggle the lead horizontally until it can be observed to move freely in the hole.
2. Repeat step 1 until each lead to be removed has been
cleared of solder and is free to move.
3. Now lift the component out of the holes.
COMPONENT INSTALLATION:
1. Bend the leads of the replacement component until it
will fit easily into the appropriate PC board holes. Using a
good brand of rosin-core solder, solder each lead to the bottom side of the board with a 30 watt soldering iron. Make
sure that the joint is smooth and shiny. If no damage has
been done to the plated through hole, soldering the topside
pad is not necessary. However, if the removal procedure did
not progress smoothly, it would be wise to solder each lead
at the topside to avoid potential intermittent problems.