SLS SL74HCT74D, SL74HCT74N Datasheet

SL74HCT74

Semiconductor

Dual D Flip-Flop with Set and Reset

High-Performance Silicon-Gate CMOS

The SL74HCT74 is identical in pinout to the LS/ALS74. This device
may be used as a level converter for interfacing TTL or NMOS outputs
to High Speed CMOS inputs.

This device consists of two D flip -flops with individual Set, Reset,
and Clock inputs. Information at a D-input is transferred to the
corresponding Q output on the next positive going edge of the clock
input. Both Q and Q outputs are available from each flip -flop. The Set
and Reset inputs are asynchronous.

• TTL/NMOS Compatible Input Levels

• Outputs Directly Interface to CMOS, NMOS, and TTL

• Operating Voltage Range: 4.5 to 5.5 V

• Low Input Current: 1.0 µA

LOGIC DIAGRAM

ORDERING INFORMATION

SL74HCT74N Plastic

SL74HCT74D SOIC

TA = -55° to 125° C for all packages

PIN ASSIGNMENT

PIN 14 =VCC

PIN 7 = GND

FUNCTION TABLE

Inputs Outputs

Set Reset Clock Data Q Q

L H X X H L

H L X X L H

L L X X H* H*
H H H H L
H H L L H
H H L X No Change
H H H X No Change
H H X No Change

*Both outputs will remain high as long as Set and
Reset are low, but the output states are
unpredictable if Set and Reset go high
simultaneously.
X = don’t care

System Logic

SLS

SL74HCT74

Semiconductor

MAXIMUM RATINGS*

Symbol Parameter Value Unit

VCC DC Supply Voltage (Referenced to GND) -0.5 to +7.0 V
VIN DC Input Voltage (Referenced to GND) -1.5 to VCC +1.5 V

V

DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V

OUT

IIN DC Input Current, per Pin ±20 mA

I

DC Output Current, per Pin ±25 mA

OUT

ICC DC Supply Current, VCC and GND Pins ±50 mA
PD Power Dissipation in Still Air, Plastic DIP+

SOIC Package+

750
500

Tstg Storage Temperature -65 to +150 °C

TL Lead Temperature, 1 mm from Case for 10 Seconds

260 °C

(Plastic DIP or SOIC Package)

*

Maximum Ratings are those values beyond whitch damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C

SOIC Package: : - 7 mW/°C from 65° to 125°C

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Unit

VCC DC Supply Voltage (Referenced to GND) 4.5 5.5 V

VIN, V

DC Input Voltage, Output Voltage (Referenced to GND) 0 VCC V

OUT

TA Operating Temperature, All Package Types -55 +125 °C

tr, tf Input Rise and Fall Time (Figure 1) 0 500 ns

mW

This device contains protection circuitry to guard against damage due to high static voltages or electric
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, VIN and V
GND≤(VIN or V

OUT

)≤VCC.

should be constrained to the range

OUT

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC).
Unused outputs must be left open.

System Logic

SLS