MAXIMUM RATINGS*
Symbol Parameter Value Unit
VCC DC Supply Voltage (Referenced to GND) -0.5 to +20 V
VIN DC Input Voltage (Referenced to GND) -0.5 to VCC +0.5 V
V
OUT
DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V
IIN DC Input Current, per Pin ±10 mA
PD Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750
500
mW
PD Power Dissipation per Output Transistor 100 mW
Tstg Storage Temperature -65 to +150 °C
TL Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
260 °C
*
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC DC Supply Voltage (Referenced to GND) 3.0 18 V
VIN, V
OUT
DC Input Voltage, Output Voltage (Referenced to GND) 0 VCC V
TA Operating Temperature, All Package Types -55 +125 °C
This device contains protection circuitry to guard against damage due to high static voltages or electric
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, VIN and V
OUT
should be constrained to the range
GND≤(VIN or V
OUT
)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC).
Unused outputs must be left open.