Skyworks SKY77762-11 Schematic [ru]

DATA SHEET
SKY77762 Power Amplifier Module for CDMA/ WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE – Band II (1850–1910 MHz)

Applications

WCDMA handsets
HSDPA
HSUPA
HSPA+
- Band 25
(1850 MHz–1915 MHz)
- Band 39
(1850 MHz–1920 MHz)
CDMA2000
EVDO

Features

Low voltage positive bias
supply 3.0 V to 4.5 V
Good linearity
High efficiency
- 46% at 28.6 dBm
Large dynamic range
Small, low profile package
- 3 mm x 3 mm x 0.9 mm
- 10-pad configuration
Power down control
InGaP
Supports low collector
voltage operation
Digital Enable
No V
REF required
CMOS compatible control
signals
Integrated Directional
Coupler

Description

The SKY77762 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full 1850-1910 MHz bandwidth coverage into a single compact package. Because of high efficiencies attained throughout the entire power range, the SKY77762 delivers unsurpassed talk-time advantages. The SKY77762 meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), and Long Term Evolution (LTE) data transmission with high power added efficiency. An integrated directional coupler eliminates the need for any external coupler.
The Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all amplifier active circuitry, including input and interstage matching circuits. The silicon CMOS support die, providing precision biasing for the MMIC affords a true CMOS-compatible control interface. Output match into a 50-ohm load, realized off-chip within the module package, optimizes efficiency and power performance.
The SKY77762 is manufactured with Skyworks' InGaP GaAs Heterojunction Bipolar Transistor (HBT) process which provides for all positive voltage DC supply operation and maintains high efficiency and good linearity. While primary bias to the SKY77762 can be supplied directly from any suitable battery with an output of 3.2 V to 4.2 V, optimal performance is obtained with VCC2 sourced from a DC-DC power supply adjusted within 0.5 V to 3.6 V based on target output power levels. Power down executes by setting VENABLE to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery.
Figure 1. SKY77762 Functional Block Diagram

Electrical Specifications

RF Input Power
PIN
— 0 10
dBm
Supply Voltage
No RF
V
3.4
6.0
Volts
With RF — —
4.6
Enable Control Voltage
VEN
1.8
4.2
Volts
V
— 1.8
4.2
V
— 1.8
4.2
Case Temperature1
Operating
T
30
25
+110
°C
Storage
T
40 — +150
Case Operating Temperature (TCASE) refers to the temperature of the GROUND PAD at the underside of the package.
WCDMA
P
28.60 — —
HSDPA 27.60 — —
HSUPA 25.00 — —
LTE 27.60 — —
CDMA2000 28.25 — —
Operating Frequency
ƒO
1850
1880
1910
MHz
Supply Voltage2
V
3.0
3.4
4.5
Volts
VCC2
0.5 — 3.6
Low
VEN_L
0.00
0.00
0.50
High
V
1.35
1.80
3.10
Mode Control Voltage
Low
V
0.0
0.0
0.5
Volts
V
0.0
0.0
0.5
High
V
1.35
1.8
3.1
VMODE1
1.35
1.8
3.1
Case Operating Temperature3
T
20
+25
+85
°C
Equivalent to –30 °C to +75 °C Ambient Operating Temperature.
The following tables list the electrical characteristics of the SKY77762 Power Amplifier. Table 1 lists the absolute maximum ratings and Table 2 shows the recommended operating conditions. Electrical specifications for nominal operating

Table 1. Absolute Maximum Operating Conditions

No damage assuming only one parameter set at limit at a time with all other parameters set at nominal value.

Parameter Symbol Minimum Nominal Maximum Unit
CC1
VCC2
conditions are listed in Table 4. Table 3 presents a truth table for the power settings. Tables 5 through 8 provide the standard test configurations for WCDMA (STC1), HSDPA (STC2), and HSUPA (STC3, STC4) respectively.
Mode Control Voltage
1
RF Output Power1
Enable Control Voltage
MODE0
MODE1
CASE
STG
Volts

Table 2. Recommended Operating Conditions

Parameter Symbol Minimum Nominal Maximum Unit
OUT_MAX
CC1
EN_H
MODE0
MODE1
MODE0
dBm
Volts
CASE
1
For VCC < 3.4 V, output power back-off = 0.5 dB.
2
Specifications in Table 4 are specified at VCC1 = 3.2 V to 4.2 V.
3

Table 3. Modes of Operation

Power Down Mode
Low
Low
Low
On
Standby Mode
Low — —
On
High Power Mode (17.0 dBm P
28.6 dBm)
High
Low — On
Medium Power Mode (7.0 dBm POUT 17.0 dBm)
High
High
Low
On
Low Power Mode (P
7.0 dBm)
High
High
High
On
VCC2 = 0.8 V
VCC2 = 1.5 V
GHIGH
POUT = 28.6 dBm
25.0
28.6
32.0
Rx Band Gain
RxG
P
= 28.6 dBm
— — –1
dB
RxG
P
= 28.6 dBm
— — –2
RxG
P
= 28.6 dBm
— — –7
Power Added Efficiency
PAE
P
= 7.0 dBm, V
= 0.8 V
11
13
%
PAE
P
= 17.0 dBm, V
= 1.5 V
22
26
PAE
P
= 28.6 dBm
43
46
I
P
= 7.0 dBm, V
= 0.8 V
46
60
ICC_MED
POUT = 17.0 dBm, VCC2 = 1.5 V
126
150
ICC_HIGH
POUT = 28.6 dBm
458
500
IQ_LOW
Low Power Mode
24
35
Enable Control Current
IEN — —
20
40
µA
Mode Control Current
I
— —
20
40
µA
I
— —
20
40
Total Supply Current in Power Down Mode
IPD
VCC = 4.5 V
V
= Low
— 1 10
µA
ICC1 Current
I
— — — 10
mA
P
= 7.0 dBm
43
39
dBc
POUT = 17.0 dBm
–45
39
POUT = 28.6 dBm
41
39
POUT = 7.0 dBm
67
51
P
= 28.6
–55
51
Power Setting ENABLE VMODE0 VMODE1 VCC
OUT
OUT

Table 4. Electrical Specifications for Nominal Operating Conditions (1 of 2)

Per Table 2 over dynamic range up to 28.6 dBm output power for STC1 modulation, unless otherwise specified.

Characteristics Symbol Condition Minimum Typical Maximum Unit
Gain1 GLOW POUT = 7.0 dBm
12.0
16.5 19.0 dB
GMED POUT = 17.0 dBm
_GPS
_ISM
LOW
MED
HIGH
Total Supply Current
CC_LOW
Quiescent Current
IQ_MED Medium Power Mode 35 45
MODE0
MODE1
CC1_HIGH
Adjacent Channel Leakage power Ratio2 5 MHz offset ACLR5
OUT
OUT
OUT
OUT
OUT
OUT
OUT
VEN = Low
MODE0 = Low
V
MODE1
OUT
CC2
CC2
20.0 24.5 28.0
CC2
mA
mA
10 MHz offset ACLR10
POUT = 17.0 dBm –63 –51
OUT

Table 4. [continued] Electrical Specifications for Nominal Operating Conditions (2 of 2)

Adjacent Channel Leakage power Ratio3
EUTRA offset
ACLR
P
(P
MPR4)
40 — dBc
UTRA offset
ACLR1
— –42 —
ACLR2
— — —
Adjacent Channel Leakage power Ratio3
EUTRA offset
ACLR_EUTRA
POUT (POUT_MAX – MPR4)
36.5 — dBc
Band 25 (1850–1915 MHz)
UTRA offset
ACLR1_UTRA
— –41.0 — ACLR2
— –43.0
Band 39 (1850-1920 MHz)
UTRA offset
ACLR1
— –41
ACLR2
— –43
5,6
1.25 MHz offset
ACPR1
P
= 28.25 dBm
48 — dBc
1.98 MHz offset
ACPR2 —
–55 —
Second
f02
53
35
Third
f03 — –50
–43
Tx Noise in Rx Bands
1
Rx Band II
1930 MHz–1990 MHz
— — –135.0
dBm/Hz
GPS Rx
1574 MHz–1577 MHz
— — –137.0
ISM Rx
2400 MHz–2483.5 MHz
— — –144.5
EVM
EVM1
P
= P
— — 3.75
%
EVM2
P
= P
3
— — 3.25
TON
— — — 20
TOFF
— — — 20
RF
TON
— — — 6
TOFF_RF — — — 6
Coupling Factor
CPL
POUT = POUT_MAX
–22
20
18
dB
CPL_IN 50 terminated
Daisy-chain
VSWR CPL
and CPL
ports
VEN = Low
— — 1.6:1
Insertion Loss
— — 0.25
dB
Input Voltage Standing Wave Ratio
VSWR — —
1.6:1
1.85:1
Stability (Spurious output)1
S
6:1 VSWR All phases
— — –70
dBc
Ruggedness – no damage
1,7
Ru
POUT 28.6 dBm
10:1 — —
VSWR

Per Table 2 over dynamic range up to 28.6 dBm output power for STC1 modulation, unless otherwise specified.

Characteristics Symbol Condition Minimum Typical Maximum Unit
_EUTRA
_UTRA
_UTRA
_UTRA
EUTRA offset ACLR_EUTRA POUT ≤ (POUT_MAX – MPR4) –37 dBc
_UTRA
_UTRA
Adjacent Channel Power Ratio
OUT
OUT
OUT_MAX
Harmonic Suppression
POUT ≤ 28.6 dBm
POUT = 28.6 dBm
POUT = 28.6 dBm
POUT = 28.6 dBm
OUT
OUT_MAX
OUT
OUT_MAX
Rise / Fall Time DC
_DC
_DC
_RF
CPL_OUT / POUT Power Ratio Variation Over Output VSWR 2.5:1 VSWR at POUT
all VSWR phases
_IN
_OUT
698 MHz to 2620 MHz
dBc
µs
±0.30 dB
1
Over conditions
2
ACLR is expressed as a ratio of total adjacent power to WCDMA modulated in-band, both measured in 3.84 MHz bandwidth at specified offsets.
3
LTE: ACLR is measured with QPSK modulation with 20 MHz bandwidth and 18 resource blocks. (Maximum Power Reduction = 0 dBm per 3GPP TS36.101.
4
MPR is the maximum power reduction as defined in 3GPP TS36.101
5
ACPR is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
6
For CDMA2000 test configured as [PCD @ –7.40 dB, DCCH–9600 bps @ –15.35 dB; SCHO–9600 bps @ –15.63 dB] and other test configurations that yield a peak-to-average up to 4.02 dB
for CCDF = 1%, up to 1 dB power back off from the maximum listed for IS95 may be required to meet specified maximum ACP performance under worst-case conditions.
7
All phases, time = 10 seconds.

Table 5. Standard Test Configuration – STC1 WCDMA Mode

βc βd β
β
β
DPCCH
15 kbps 0 256 Q 8/15 — — — —
–6.547
DPDCH
60 kbps
16
64 I —
15/15 — — — –1.087
βc βd β
β
β
DPCCH
15 kbps 0 256
Q
12/15 — — — —
7.095
DPDCH
60 kbps
16
64 I —
15/15 — — — –5.157
HS-DPCCH
15 kbps
64
256 Q — — 24/15 — —
–3.012
βc βd β
β
β
DPCCH
15 kbps 0 256 Q 8/15 — — — —
–19.391
DPDCH
960 kbps 1 4 I —
15/15 — — — –13.931
HS- DPCCH
15 kbps
64
256 Q — — 8/15 — —
19.391
E-DPCCH
15 kbps 1 256 I — — —
10/15 — –17.338
E-DPDCH
960 kbps 2 4 I — — — — 71.5/15
–0.371
βc βd β
β
β
DPCCH
15 kbps 0 256 Q 6/15 — — — —
–12.499
DPDCH
960 kbps 1 4 I —
15/15 — — — –4.540
HS- DPCCH
15 kbps
64
256 Q — — 2/15 — —
22.041
E-DPCCH
15 kbps 1 256 I — — —
12/15 — –6.478
E-DPDCH
960 kbps 2 4 I — — — — 15/15
–4.425
Parameter Level Spread Code Spread Factor I/Q

Table 6. Standard Test Configuration – STC2 HSDPA Mode

Parameter Level Spread Code Spread Factor I/Q

Table 7. Standard Test Configuration – STC3 HSUPA Mode

Parameter Level Spread Code Spread Factor I/Q
hs
hs
hs
ec
ec
ec
ed Relative Power (dB)
ed Relative Power (dB)
ed Relative Power (dB)

Table 8. Standard Test Configuration – STC4 HSUPA Mode

Parameter Level Spread Code Spread Factor I/Q
hs
ec
ed Relative Power (dB)

Evaluation Board Description

The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77762, the evaluation board schematic and assembly diagrams are included for analysis and design. Figure 2 shows
Figure 2. Evaluation Board Schematic
the basic schematic of the board for the 1850 MHz to 1910 MHz range shown in Figure 3. Figure 4 is a schematic of the recommended application shown in Figure 5.
Figure 3. Evaluation Board Assembly Diagram
Figure 4. SKY77762 Schematic for Recommended Application Diagram
Figure 5. SKY77762 Recommended Application Diagram

Package Dimensions

The SKY77762 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 6 is a mechanical drawing of the pad layout for this package. Figure 7 provides a
recommended phone board layout footprint for the PAM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50-ohm terminals.
Figure 6. Dimensional Diagram for 3 mm x 3 mm x 0.9 mm Package – SKY77762 Specific
Figure 7. Phone PCB Layout Diagram – 3 mm x 3 mm, 10-Pad Package – SKY77762

Package Description

Personnel Grounding
- Wrist Straps
- Conductive Smocks, Gloves and Finger Cots
- Antistatic ID Badges
Protective Workstation
- Dissipative Table Top
- Protective Test Equipment (Properly Grounded)
- Grounded Tip Soldering Irons
- Solder Conductive Suckers
- Static Sensors
Facility
- Relative Humidity Control and Air Ionizers
- Dissipative Floors (less than 1,000 Mto GND)
Protective Packaging and Transportation
- Bags and Pouches (Faraday Shield)
- Protective Tote Boxes (Conductive Static Shielding)
- Protective Trays
- Grounded Carts
- Protective Work Order Holders
Figure 8 shows the pad functions and the pad numbering convention, which starts with pad 1 in the upper left and increments counter-clockwise around the package. Typical case markings are illustrated in Figure 9.
Figure 8. SKY77762 Pad Names and Configuration (Top View)
otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly.
The SKY77762 is capable of withstanding an MSL3/260 °C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 °C per second; maximum temperature should not exceed 260 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 260 °C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020.
Production quantities of this product are shipped in the standard tape-and-reel format (Figure 10).

Electrostatic Discharge (ESD) Sensitivity

The SKY77762 meets class 1C JESD22-A114 Human Body Model (HBM), class IV JESD22-C101 Charged-Device Model (CDM), and class A JESD22-A115 Machine Model (MM) electrostatic discharge (ESD) sensitivity classification.
To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the ESD handling precautions listed below.
Figure 9. Typical Case Markings

Package Handling Information

Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken,
Figure 10. Dimensional Diagram for Carrier Tape Body Size 3 mm x 3 mm x 0.75 / 0.90 mm – MCM

Ordering Information

SKY77762 Power Amplifier Module
SKY77762-11
EN20-D957-001 REV A
A
December 27, 2011
Initial Release – Information
B
March 9, 2012
Revise: Figure 1–3, 6, 7; Table 4 and footnotes 4, 5 Add: Figures 4, 5
C
May 5, 2012
Revise: Data Sheet status from ADVANCE to PRELIMINARY; Features list (p1); Description (p1); Tables 2, 4;
D
August 1, 2012
Revise: Add footnote 3 to Table 2
E
August 3, 2012
Revise: Change Data Sheet status from PRELIMINARY to FINAL; Table 4; Order Information Table (last page)
F
September 20, 2012
Revise: Features list (p1); Tables 2, 4
Product Name Manufacturing Part Number Evaluation Board Part Number

Revision History

Revision Date Description
Figures 4, 5

References

Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.
Standard SMT Reflow Profiles: JEDEC Standard J–STD–020
Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A114 Human Body Model (HBM)
Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A115 Machine Model (MM)
Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-C101 Charged Device Model (CDM).
Copyright © 2011, 2012, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
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