Skyworks SKY77762-11 Schematic [ru]

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DATA SHEET

SKY77762 Power Amplifier Module for CDMA/ WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE – Band II (1850–1910 MHz)

Applications

• WCDMA handsets

• HSDPA

• HSUPA

• HSPA+

• LTE

- Band 25

(1850 MHz–1915 MHz)

- Band 39

(1850 MHz–1920 MHz)

• CDMA2000

• EVDO

Features

• Low voltage positive bias

supply 3.0 V to 4.5 V

• Good linearity

• High efficiency

- 46% at 28.6 dBm

• Large dynamic range

• Small, low profile package

- 3 mm x 3 mm x 0.9 mm

- 10-pad configuration

• Power down control

• InGaP

• Supports low collector

voltage operation

• Digital Enable

• No V

REF required

• CMOS compatible control

signals

• Integrated Directional

Coupler

Description

The SKY77762 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full 1850-1910 MHz bandwidth coverage into a single compact package. Because of high efficiencies attained throughout the entire power range, the SKY77762 delivers unsurpassed talk-time advantages. The SKY77762 meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), and Long Term Evolution (LTE) data transmission with high power added efficiency. An integrated directional coupler eliminates the need for any external coupler.

The Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all amplifier active circuitry, including input and interstage matching circuits. The silicon CMOS support die, providing precision biasing for the MMIC affords a true CMOS-compatible control interface. Output match into a 50-ohm load, realized off-chip within the module package, optimizes efficiency and power performance.

The SKY77762 is manufactured with Skyworks' InGaP GaAs Heterojunction Bipolar Transistor (HBT) process which provides for all positive voltage DC supply operation and maintains high efficiency and good linearity. While primary bias to the SKY77762 can be supplied directly from any suitable battery with an output of 3.2 V to 4.2 V, optimal performance is obtained with VCC2 sourced from a DC-DC power supply adjusted within 0.5 V to 3.6 V based on target output power levels. Power down executes by setting VENABLE to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery.

Figure 1. SKY77762 Functional Block Diagram

Electrical Specifications

RF Input Power

— 0 10

dBm

Supply Voltage

No RF

—

3.4

6.0

Volts

With RF — —

4.6

Enable Control Voltage

VEN

—

1.8

4.2

Volts

— 1.8

4.2

— 1.8

4.2

Case Temperature1

Operating

–30

+110

°C

Storage

–40 — +150

Case Operating Temperature (TCASE) refers to the temperature of the GROUND PAD at the underside of the package.

WCDMA

28.60 — —

HSDPA 27.60 — —

HSUPA 25.00 — —

LTE 27.60 — —

CDMA2000 28.25 — —

Operating Frequency

ƒO

1850

1880

1910

MHz

Supply Voltage2

3.0

3.4

4.5

Volts

VCC2

0.5 — 3.6

Low

VEN_L

0.00

0.50

High

1.35

1.80

3.10

Mode Control Voltage

Low

0.0

0.5

Volts

0.0

0.5

High

1.35

1.8

3.1

VMODE1

1.35

1.8

3.1

Case Operating Temperature3

–20

+25

+85

°C

Equivalent to –30 °C to +75 °C Ambient Operating Temperature.

The following tables list the electrical characteristics of the SKY77762 Power Amplifier. Table 1 lists the absolute maximum ratings and Table 2 shows the recommended operating conditions. Electrical specifications for nominal operating

Table 1. Absolute Maximum Operating Conditions

No damage assuming only one parameter set at limit at a time with all other parameters set at nominal value.

Parameter Symbol Minimum Nominal Maximum Unit

CC1

VCC2

conditions are listed in Table 4. Table 3 presents a truth table for the power settings. Tables 5 through 8 provide the standard test configurations for WCDMA (STC1), HSDPA (STC2), and HSUPA (STC3, STC4) respectively.

Mode Control Voltage

RF Output Power1

Enable Control Voltage

MODE0

MODE1

CASE

STG

Volts

Table 2. Recommended Operating Conditions

Parameter Symbol Minimum Nominal Maximum Unit

OUT_MAX

CC1

EN_H

MODE0

MODE1

MODE0

dBm

Volts

CASE

For VCC < 3.4 V, output power back-off = 0.5 dB.

Specifications in Table 4 are specified at VCC1 = 3.2 V to 4.2 V.

Table 3. Modes of Operation

Power Down Mode

Low

Standby Mode

Low — —

High Power Mode (17.0 dBm ≤ P

≤ 28.6 dBm)

High

Low — On

Medium Power Mode (7.0 dBm ≤ POUT ≤ 17.0 dBm)

High

Low

Low Power Mode (P

≤ 7.0 dBm)

High

VCC2 = 0.8 V

VCC2 = 1.5 V

GHIGH

POUT = 28.6 dBm

25.0

28.6

32.0

Rx Band Gain

RxG

= 28.6 dBm

— — –1

RxG

= 28.6 dBm

— — –2

RxG

= 28.6 dBm

— — –7

Power Added Efficiency

PAE

= 7.0 dBm, V

= 0.8 V

—

PAE

= 17.0 dBm, V

= 1.5 V

—

PAE

= 28.6 dBm

—

= 7.0 dBm, V

= 0.8 V

—

ICC_MED

POUT = 17.0 dBm, VCC2 = 1.5 V

—

126

150

ICC_HIGH

POUT = 28.6 dBm

—

458

500

IQ_LOW

Low Power Mode

—

Enable Control Current

IEN — —

µA

Mode Control Current

— —

µA

— —

Total Supply Current in Power Down Mode

IPD

VCC = 4.5 V

= Low

— 1 10

µA

ICC1 Current

— — — 10

= 7.0 dBm

—

–43

–39

dBc

POUT = 17.0 dBm

—

–45

–39

POUT = 28.6 dBm

—

–41

–39

POUT = 7.0 dBm

—

–67

–51

= 28.6

—

–55

–51

Power Setting ENABLE VMODE0 VMODE1 VCC

OUT

Table 4. Electrical Specifications for Nominal Operating Conditions (1 of 2)

Per Table 2 over dynamic range up to 28.6 dBm output power for STC1 modulation, unless otherwise specified.

Characteristics Symbol Condition Minimum Typical Maximum Unit

Gain1 GLOW POUT = 7.0 dBm

12.0

16.5 19.0 dB

GMED POUT = 17.0 dBm

_GPS

_ISM

LOW

MED

HIGH

Total Supply Current

CC_LOW

Quiescent Current

IQ_MED Medium Power Mode — 35 45

MODE0

MODE1

CC1_HIGH

Adjacent Channel Leakage power Ratio2 5 MHz offset ACLR5

OUT

VEN = Low

MODE0 = Low

MODE1

OUT

CC2

20.0 24.5 28.0

CC2

10 MHz offset ACLR10

POUT = 17.0 dBm — –63 –51

OUT

Table 4. [continued] Electrical Specifications for Nominal Operating Conditions (2 of 2)

Adjacent Channel Leakage power Ratio3

EUTRA offset

ACLR

≤ (P

– MPR4)

—

–40 — dBc

UTRA offset

ACLR1

— –42 —

ACLR2

— — —

Adjacent Channel Leakage power Ratio3

EUTRA offset

ACLR_EUTRA

POUT ≤ (POUT_MAX – MPR4)

—

–36.5 — dBc

Band 25 (1850–1915 MHz)

UTRA offset

ACLR1_UTRA

— –41.0 — ACLR2

— –43.0 —

Band 39 (1850-1920 MHz)

UTRA offset

ACLR1

— –41 —

ACLR2

— –43 —

5,6

1.25 MHz offset

ACPR1

= 28.25 dBm

—

–48 — dBc

1.98 MHz offset

ACPR2 —

–55 —

Second

f02

—

–53

–35

Third

f03 — –50

–43

Tx Noise in Rx Bands

Rx Band II

1930 MHz–1990 MHz

— — –135.0

dBm/Hz

GPS Rx

1574 MHz–1577 MHz

— — –137.0

ISM Rx

2400 MHz–2483.5 MHz

— — –144.5

EVM

EVM1

= P

— — 3.75

EVM2

= P

– 3

— — 3.25

TON

— — — 20

TOFF

— — — 20

TON

— — — 6

TOFF_RF — — — 6

Coupling Factor

CPL

POUT = POUT_MAX

–22

–20

–18

CPL_IN 50 Ω terminated

Daisy-chain

VSWR CPL

and CPL

ports

VEN = Low

— — 1.6:1

Insertion Loss

— — 0.25

Input Voltage Standing Wave Ratio

VSWR — —

1.6:1

1.85:1

—

Stability (Spurious output)1

6:1 VSWR All phases

— — –70

dBc

Ruggedness – no damage

1,7

POUT ≤ 28.6 dBm

10:1 — —

VSWR

Per Table 2 over dynamic range up to 28.6 dBm output power for STC1 modulation, unless otherwise specified.

Characteristics Symbol Condition Minimum Typical Maximum Unit

_EUTRA

_UTRA

EUTRA offset ACLR_EUTRA POUT ≤ (POUT_MAX – MPR4) — –37 — dBc

_UTRA

Adjacent Channel Power Ratio

OUT

OUT_MAX

Harmonic Suppression

POUT ≤ 28.6 dBm

POUT = 28.6 dBm

OUT

OUT_MAX

OUT

OUT_MAX

Rise / Fall Time DC

_DC

_RF

CPL_OUT / POUT Power Ratio Variation Over Output VSWR 2.5:1 VSWR at POUT

all VSWR phases

_IN

_OUT

698 MHz to 2620 MHz

dBc

µs

— ±0.30 — dB

Over conditions

ACLR is expressed as a ratio of total adjacent power to WCDMA modulated in-band, both measured in 3.84 MHz bandwidth at specified offsets.

LTE: ACLR is measured with QPSK modulation with 20 MHz bandwidth and 18 resource blocks. (Maximum Power Reduction = 0 dBm per 3GPP TS36.101.

MPR is the maximum power reduction as defined in 3GPP TS36.101

ACPR is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.

For CDMA2000 test configured as [PCD @ –7.40 dB, DCCH–9600 bps @ –15.35 dB; SCHO–9600 bps @ –15.63 dB] and other test configurations that yield a peak-to-average up to 4.02 dB

for CCDF = 1%, up to 1 dB power back off from the maximum listed for IS95 may be required to meet specified maximum ACP performance under worst-case conditions.

All phases, time = 10 seconds.

Table 5. Standard Test Configuration – STC1 WCDMA Mode

βc βd β

DPCCH

15 kbps 0 256 Q 8/15 — — — —

–6.547

DPDCH

60 kbps

64 I —

15/15 — — — –1.087

βc βd β

DPCCH

15 kbps 0 256

12/15 — — — —

–7.095

DPDCH

60 kbps

64 I —

15/15 — — — –5.157

HS-DPCCH

15 kbps

256 Q — — 24/15 — —

–3.012

βc βd β

DPCCH

15 kbps 0 256 Q 8/15 — — — —

–19.391

DPDCH

960 kbps 1 4 I —

15/15 — — — –13.931

HS- DPCCH

15 kbps

256 Q — — 8/15 — —

–19.391

E-DPCCH

15 kbps 1 256 I — — —

10/15 — –17.338

E-DPDCH

960 kbps 2 4 I — — — — 71.5/15

–0.371

βc βd β

DPCCH

15 kbps 0 256 Q 6/15 — — — —

–12.499

DPDCH

960 kbps 1 4 I —

15/15 — — — –4.540

HS- DPCCH

15 kbps

256 Q — — 2/15 — —

–22.041

E-DPCCH

15 kbps 1 256 I — — —

12/15 — –6.478

E-DPDCH

960 kbps 2 4 I — — — — 15/15

–4.425

Parameter Level Spread Code Spread Factor I/Q

Table 6. Standard Test Configuration – STC2 HSDPA Mode

Parameter Level Spread Code Spread Factor I/Q

Table 7. Standard Test Configuration – STC3 HSUPA Mode

Parameter Level Spread Code Spread Factor I/Q

ed Relative Power (dB)

Table 8. Standard Test Configuration – STC4 HSUPA Mode

Parameter Level Spread Code Spread Factor I/Q

ed Relative Power (dB)

Evaluation Board Description

The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77762, the evaluation board schematic and assembly diagrams are included for analysis and design. Figure 2 shows

Figure 2. Evaluation Board Schematic

the basic schematic of the board for the 1850 MHz to 1910 MHz range shown in Figure 3. Figure 4 is a schematic of the recommended application shown in Figure 5.

Figure 3. Evaluation Board Assembly Diagram

Figure 4. SKY77762 Schematic for Recommended Application Diagram

Figure 5. SKY77762 Recommended Application Diagram

Package Dimensions

The SKY77762 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 6 is a mechanical drawing of the pad layout for this package. Figure 7 provides a

recommended phone board layout footprint for the PAM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50-ohm terminals.

Figure 6. Dimensional Diagram for 3 mm x 3 mm x 0.9 mm Package – SKY77762 Specific

Figure 7. Phone PCB Layout Diagram – 3 mm x 3 mm, 10-Pad Package – SKY77762

Package Description

• Personnel Grounding

- Wrist Straps

- Conductive Smocks, Gloves and Finger Cots

- Antistatic ID Badges

• Protective Workstation

- Dissipative Table Top

- Protective Test Equipment (Properly Grounded)

- Grounded Tip Soldering Irons

- Solder Conductive Suckers

- Static Sensors

• Facility

- Relative Humidity Control and Air Ionizers

- Dissipative Floors (less than 1,000 MΩ to GND)

• Protective Packaging and Transportation

- Bags and Pouches (Faraday Shield)

- Protective Tote Boxes (Conductive Static Shielding)

- Protective Trays

- Grounded Carts

- Protective Work Order Holders

Figure 8 shows the pad functions and the pad numbering convention, which starts with pad 1 in the upper left and increments counter-clockwise around the package. Typical case markings are illustrated in Figure 9.

Figure 8. SKY77762 Pad Names and Configuration (Top View)

otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly.

The SKY77762 is capable of withstanding an MSL3/260 °C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 °C per second; maximum temperature should not exceed 260 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 260 °C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020.

Production quantities of this product are shipped in the standard tape-and-reel format (Figure 10).

Electrostatic Discharge (ESD) Sensitivity

The SKY77762 meets class 1C JESD22-A114 Human Body Model (HBM), class IV JESD22-C101 Charged-Device Model (CDM), and class A JESD22-A115 Machine Model (MM) electrostatic discharge (ESD) sensitivity classification.

To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the ESD handling precautions listed below.

Figure 9. Typical Case Markings

Package Handling Information

Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken,

Figure 10. Dimensional Diagram for Carrier Tape Body Size 3 mm x 3 mm x 0.75 / 0.90 mm – MCM

Ordering Information

SKY77762 Power Amplifier Module

SKY77762-11

EN20-D957-001 REV A

December 27, 2011

Initial Release – Information

March 9, 2012

Revise: Figure 1–3, 6, 7; Table 4 and footnotes 4, 5 Add: Figures 4, 5

May 5, 2012

Revise: Data Sheet status from ADVANCE to PRELIMINARY; Features list (p1); Description (p1); Tables 2, 4;

August 1, 2012

Revise: Add footnote 3 to Table 2

August 3, 2012

Revise: Change Data Sheet status from PRELIMINARY to FINAL; Table 4; Order Information Table (last page)

September 20, 2012

Revise: Features list (p1); Tables 2, 4

Product Name Manufacturing Part Number Evaluation Board Part Number

Revision History

Revision Date Description

Figures 4, 5

References

Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.

Standard SMT Reflow Profiles: JEDEC Standard J–STD–020

Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A114 Human Body Model (HBM)

Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A115 Machine Model (MM)

Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-C101 Charged Device Model (CDM).

Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.

No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale.

THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.

Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.

Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.

Skyworks, the Skyworks symbol, “Breakthrough Simplicity,” DCR, Helios, HIP3, Innovation to Go, Intera, iPAC, LIPA, Polar Loop, and System Smart are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference.

Skyworks SKY77762-11 Schematic [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual

Applications

Features

Description

Electrical Specifications

Table 1. Absolute Maximum Operating Conditions

No damage assuming only one parameter set at limit at a time with all other parameters set at nominal value.

Table 2. Recommended Operating Conditions

Table 3. Modes of Operation

Table 4. Electrical Specifications for Nominal Operating Conditions (1 of 2)

Per Table 2 over dynamic range up to 28.6 dBm output power for STC1 modulation, unless otherwise specified.

Table 4. [continued] Electrical Specifications for Nominal Operating Conditions (2 of 2)

Per Table 2 over dynamic range up to 28.6 dBm output power for STC1 modulation, unless otherwise specified.

Table 5. Standard Test Configuration – STC1 WCDMA Mode

Table 6. Standard Test Configuration – STC2 HSDPA Mode

Table 7. Standard Test Configuration – STC3 HSUPA Mode

Table 8. Standard Test Configuration – STC4 HSUPA Mode

Evaluation Board Description

Package Dimensions

Package Description

Electrostatic Discharge (ESD) Sensitivity

Package Handling Information

Ordering Information

Revision History

References