SKY77762 Power Amplifier Module for CDMA/ WCDMA/
HSDPA/ HSUPA/ HSPA+/ LTE – Band II (1850–1910 MHz)
Applications
• WCDMA handsets
• HSDPA
• HSUPA
• HSPA+
• LTE
- Band 25
(1850 MHz–1915 MHz)
- Band 39
(1850 MHz–1920 MHz)
• CDMA2000
• EVDO
Features
• Low voltage positive bias
supply 3.0 V to 4.5 V
• Good linearity
• High efficiency
- 46% at28.6dBm
• Large dynamic range
• Small, low profile package
- 3 mm x 3 mm x 0.9mm
- 10-padconfiguration
• Power down control
• InGaP
• Supports low collector
voltage operation
• Digital Enable
• No V
REF required
• CMOS compatible control
signals
• Integrated Directional
Coupler
Description
The SKY77762 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module
developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient
module packs full 1850-1910 MHz bandwidth coverage into a single compact package. Because of
high efficiencies attained throughout the entire power range, the SKY77762 delivers unsurpassed
talk-time advantages. The SKY77762 meets the stringent spectral linearity requirements of High
Speed Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), and Long Term
Evolution (LTE) data transmission with high power added efficiency. An integrated directional coupler
eliminates the need for any external coupler.
The Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all amplifier
active circuitry, including input and interstage matching circuits. The silicon CMOS support die,
providing precision biasing for the MMIC affords a true CMOS-compatible control interface. Output
match into a 50-ohm load, realized off-chip within the module package, optimizes efficiency and
power performance.
The SKY77762 is manufactured with Skyworks' InGaP GaAs Heterojunction Bipolar Transistor (HBT)
process which provides for all positive voltage DC supply operation and maintains high efficiency and
good linearity. While primary bias to the SKY77762 can be supplied directly from any suitable battery
with an output of 3.2 V to 4.2 V, optimal performance is obtained with VCC2 sourced from a DC-DC
power supply adjusted within 0.5 V to 3.6 V based on target output power levels. Power down
executes by setting VENABLE to zero volts. No external supply side switch is needed as typical "off"
leakage is a few microamperes with full primary voltage supplied from the battery.
Figure 1. SKY77762 Functional Block Diagram
Electrical Specifications
RF Input Power
PIN
— 0 10
dBm
Supply Voltage
No RF
V
—
3.4
6.0
Volts
With RF — —
4.6
Enable Control Voltage
VEN
—
1.8
4.2
Volts
V
— 1.8
4.2
V
— 1.8
4.2
Case Temperature1
Operating
T
–30
25
+110
°C
Storage
T
–40 — +150
Case Operating Temperature (TCASE) refers to the temperature of the GROUND PAD at the underside of the package.
WCDMA
P
28.60 — —
HSDPA 27.60 — —
HSUPA 25.00 — —
LTE 27.60 — —
CDMA2000 28.25 — —
Operating Frequency
ƒO
1850
1880
1910
MHz
Supply Voltage2
V
3.0
3.4
4.5
Volts
VCC2
0.5— 3.6
Low
VEN_L
0.00
0.00
0.50
High
V
1.35
1.80
3.10
Mode Control Voltage
Low
V
0.0
0.0
0.5
Volts
V
0.0
0.0
0.5
High
V
1.35
1.8
3.1
VMODE1
1.35
1.8
3.1
Case Operating Temperature3
T
–20
+25
+85
°C
Equivalent to –30 °C to +75 °C Ambient Operating Temperature.
The following tables list the electrical characteristics of the
SKY77762 Power Amplifier. Table 1 lists the absolute maximum
ratings and Table 2 shows the recommended operating
conditions. Electrical specifications for nominal operating
Table 1. Absolute Maximum Operating Conditions
No damage assuming only one parameter set at limit at a time with all other parameters set at nominal value.
Parameter Symbol Minimum Nominal Maximum Unit
CC1
VCC2
conditions are listed in Table 4. Table 3 presents a truth table for
the power settings. Tables 5 through 8 provide the standard test
configurations for WCDMA (STC1), HSDPA (STC2), and HSUPA
(STC3, STC4) respectively.
Mode Control Voltage
1
RF Output Power1
Enable Control Voltage
MODE0
MODE1
CASE
STG
Volts
Table 2. Recommended Operating Conditions
Parameter Symbol Minimum Nominal Maximum Unit
OUT_MAX
CC1
EN_H
MODE0
MODE1
MODE0
dBm
Volts
CASE
1
For VCC< 3.4 V, output power back-off= 0.5 dB.
2
Specifications in Table 4 are specified at VCC1 = 3.2 V to 4.2 V.
3
Table 3. Modes of Operation
Power DownMode
Low
Low
Low
On
Standby Mode
Low — —
On
High Power Mode (17.0 dBm ≤ P
≤ 28.6 dBm)
High
Low — On
Medium Power Mode (7.0 dBm ≤ POUT≤ 17.0 dBm)
High
High
Low
On
Low Power Mode (P
≤7.0dBm)
High
High
High
On
VCC2 = 0.8 V
VCC2 = 1.5 V
GHIGH
POUT= 28.6 dBm
25.0
28.6
32.0
Rx Band Gain
RxG
P
=28.6 dBm
— — –1
dB
RxG
P
=28.6 dBm
— — –2
RxG
P
=28.6 dBm
— — –7
Power Added Efficiency
PAE
P
=7.0 dBm, V
= 0.8 V
11
13
—
%
PAE
P
=17.0dBm, V
= 1.5 V
22
26
—
PAE
P
= 28.6 dBm
43
46
—
I
P
=7.0 dBm, V
= 0.8 V
—
46
60
ICC_MED
POUT=17.0dBm, VCC2= 1.5 V
—
126
150
ICC_HIGH
POUT=28.6dBm
—
458
500
IQ_LOW
Low Power Mode
—
24
35
Enable Control Current
IEN — —
20
40
µA
Mode Control Current
I
— —
20
40
µA
I
— —
20
40
Total Supply Current in Power Down Mode
IPD
VCC = 4.5 V
V
= Low
— 1 10
µA
ICC1Current
I
— — — 10
mA
P
=7.0 dBm
—
–43
–39
dBc
POUT= 17.0 dBm
—
–45
–39
POUT=28.6 dBm
—
–41
–39
POUT=7.0 dBm
—
–67
–51
P
=28.6
—
–55
–51
Power Setting ENABLE VMODE0 VMODE1 VCC
OUT
OUT
Table 4. Electrical Specifications for Nominal Operating Conditions (1 of 2)
Per Table 2 over dynamic range up to 28.6 dBm output power for STC1 modulation, unless otherwise specified.
Characteristics Symbol Condition Minimum Typical Maximum Unit
Gain1 GLOW POUT = 7.0 dBm
12.0
16.5 19.0 dB
GMED POUT = 17.0 dBm
_GPS
_ISM
LOW
MED
HIGH
Total Supply Current
CC_LOW
Quiescent Current
IQ_MED Medium Power Mode — 35 45
MODE0
MODE1
CC1_HIGH
Adjacent Channel Leakage power Ratio2 5 MHz offset ACLR5
OUT
OUT
OUT
OUT
OUT
OUT
OUT
VEN = Low
MODE0 = Low
V
MODE1
OUT
CC2
CC2
20.0 24.5 28.0
CC2
mA
mA
10 MHz offset ACLR10
POUT = 17.0 dBm — –63 –51
OUT
Table 4. [continued] Electrical Specifications for Nominal Operating Conditions (2 of 2)
Adjacent Channel Leakage power Ratio3
EUTRA offset
ACLR
P
≤(P
– MPR4)
—
–40 — dBc
UTRA offset
ACLR1
— –42 —
ACLR2
— — —
Adjacent Channel Leakage power Ratio3
EUTRA offset
ACLR_EUTRA
POUT≤ (POUT_MAX – MPR4)
—
–36.5 — dBc
Band 25 (1850–1915 MHz)
UTRA offset
ACLR1_UTRA
— –41.0 — ACLR2
— –43.0 —
Band 39 (1850-1920 MHz)
UTRA offset
ACLR1
— –41 —
ACLR2
— –43 —
5,6
1.25 MHz offset
ACPR1
P
=28.25dBm
—
–48 — dBc
1.98 MHz offset
ACPR2 —
–55 —
Second
f02
—
–53
–35
Third
f03 — –50
–43
Tx Noise in Rx Bands
1
Rx Band II
1930 MHz–1990 MHz
— — –135.0
dBm/Hz
GPS Rx
1574 MHz–1577 MHz
— — –137.0
ISM Rx
2400 MHz–2483.5 MHz
— — –144.5
EVM
EVM1
P
= P
— — 3.75
%
EVM2
P
= P
– 3
— — 3.25
TON
— — — 20
TOFF
— — — 20
RF
TON
— — — 6
TOFF_RF — — — 6
Coupling Factor
CPL
POUT = POUT_MAX
–22
–20
–18
dB
CPL_IN 50 Ω terminated
Daisy-chain
VSWR CPL
and CPL
ports
VEN = Low
— — 1.6:1
Insertion Loss
— — 0.25
dB
Input Voltage Standing Wave Ratio
VSWR — —
1.6:1
1.85:1
—
Stability (Spurious output)1
S
6:1 VSWR All phases
— — –70
dBc
Ruggedness – no damage
1,7
Ru
POUT≤ 28.6 dBm
10:1 — —
VSWR
Per Table 2 over dynamic range up to 28.6 dBm output power for STC1 modulation, unless otherwise specified.
Characteristics Symbol Condition Minimum Typical Maximum Unit
CPL_OUT / POUT Power Ratio Variation Over Output VSWR 2.5:1 VSWR at POUT
all VSWR phases
_IN
_OUT
698 MHz to 2620 MHz
dBc
µs
— ±0.30— dB
1
Overconditions
2
ACLR is expressed as a ratio of total adjacent power to WCDMA modulated in-band, both measured in 3.84 MHz bandwidth at specified offsets.
3
LTE: ACLR is measured with QPSK modulation with 20 MHz bandwidth and 18 resource blocks. (Maximum Power Reduction = 0 dBm per 3GPP TS36.101.
4
MPR is the maximum power reduction as defined in 3GPP TS36.101
5
ACPR is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
6
For CDMA2000 test configured as [PCD @ –7.40 dB, DCCH–9600 bps @ –15.35 dB; SCHO–9600 bps @ –15.63 dB] and other test configurations that yield a peak-to-average up to 4.02 dB
for CCDF = 1%, up to 1 dB power back off from the maximum listed for IS95 may be required to meet specified maximum ACP performance under worst-case conditions.
7
All phases, time = 10 seconds.
Table 5. Standard Test Configuration – STC1 WCDMA Mode
βc βd β
β
β
DPCCH
15 kbps 0 256 Q 8/15 — — — —
–6.547
DPDCH
60 kbps
16
64 I —
15/15 — — — –1.087
βc βd β
β
β
DPCCH
15 kbps 0 256
Q
12/15— — — —
–7.095
DPDCH
60 kbps
16
64 I —
15/15 — — — –5.157
HS-DPCCH
15 kbps
64
256 Q — — 24/15 — —
–3.012
βc βd β
β
β
DPCCH
15 kbps 0 256 Q 8/15 — — — —
–19.391
DPDCH
960 kbps 1 4 I —
15/15 — — — –13.931
HS- DPCCH
15 kbps
64
256 Q — — 8/15 — —
–19.391
E-DPCCH
15 kbps 1 256 I — — —
10/15 — –17.338
E-DPDCH
960 kbps 2 4 I — — — — 71.5/15
–0.371
βc βd β
β
β
DPCCH
15 kbps 0 256 Q 6/15 — — — —
–12.499
DPDCH
960 kbps 1 4 I —
15/15 — — — –4.540
HS- DPCCH
15 kbps
64
256 Q — — 2/15 — —
–22.041
E-DPCCH
15 kbps 1 256 I — — —
12/15 — –6.478
E-DPDCH
960 kbps 2 4 I — — — — 15/15
–4.425
Parameter Level Spread Code Spread Factor I/Q
Table 6. Standard Test Configuration – STC2 HSDPA Mode
Parameter Level Spread Code Spread Factor I/Q
Table 7. Standard Test Configuration – STC3 HSUPA Mode
Parameter Level Spread Code Spread Factor I/Q
hs
hs
hs
ec
ec
ec
ed Relative Power (dB)
ed Relative Power (dB)
ed Relative Power (dB)
Table 8. Standard Test Configuration – STC4 HSUPA Mode
Parameter Level Spread Code Spread Factor I/Q
hs
ec
ed Relative Power (dB)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing
design circuitry. To accommodate the interface testing of the
SKY77762, the evaluation board schematic and assembly
diagrams are included for analysis and design. Figure 2 shows
Figure 2. Evaluation Board Schematic
the basic schematic of the board for the 1850MHz to 1910MHz
rangeshown in Figure 3. Figure 4 is a schematic of the recommended application shown in Figure 5.
Figure 3. Evaluation Board Assembly Diagram
Figure 4. SKY77762 Schematic for Recommended Application Diagram
The SKY77762 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount solder
attachment to a printed circuit board. Figure 6 is a mechanical
drawing of the pad layout for this package. Figure 7 provides a
recommended phone board layout footprint for the PAM to help
the designer attain optimum thermal conductivity, good
grounding, and minimum RF discontinuity for the 50-ohm
terminals.
Figure 6. Dimensional Diagram for 3 mm x 3 mm x 0.9 mm Package – SKY77762 Specific
Figure 7. Phone PCB Layout Diagram – 3 mm x 3 mm, 10-Pad Package – SKY77762
Figure 8 shows the pad functions and the pad numbering
convention, which starts with pad 1 in the upper left and
increments counter-clockwise around the package. Typical case
markings are illustrated in Figure 9.
Figure 8. SKY77762 Pad Names and Configuration (Top View)
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77762 is capable of withstanding an MSL3/260 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
should not exceed 260 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 260 °C for more than 10 seconds. For
details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD-020.
Production quantities of this product are shipped in the standard
tape-and-reel format (Figure 10).
Electrostatic Discharge (ESD) Sensitivity
The SKY77762 meets class 1C JESD22-A114 Human Body Model
(HBM), class IV JESD22-C101 Charged-Device Model (CDM), and
class A JESD22-A115 Machine Model (MM) electrostatic
discharge (ESD) sensitivity classification.
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the ESD handling
precautions listed below.
Figure 9. Typical Case Markings
Package Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
Figure 10. Dimensional Diagram for Carrier Tape Body Size 3 mm x 3 mm x 0.75 / 0.90 mm – MCM
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by
Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
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information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of
Sale.
THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A
PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY
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SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION,
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POSSIBILITY OF SUCH DAMAGE.
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damages resulting from such improper use or sale.
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
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