Skylab M and C Technology SKB501 User Manual

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Skylab M&C Technology Co., Ltd

SKB501 User Manual

Bluetooth Module

SKB501- User Manual

General Description

Ready for Bluetooth 5 and high grade IoT security

The SKB501 is an advanced, highly flexible single chip solution for today’s increasingly demanding ULP

wireless applications for connected devices on our person, connected living environments and the IoT at

large. It is designed ready for the major feature advancements of Bluetooth® 5 and takes advantage of

Bluetooth 5’s increased performance capabilities which include long range and high throughput modes.

Inherent industry-grade security is essential in today’s applications.

Bluetooth 5 – Bluetooth low energy further and faster

The nRF52840 is ready to take advantage of the considerable performance improvements for Bluetooth

low energy with the arrival of the Bluetooth 5 specification. Of greatest importance is the support for longer

range (up to x4 compared to Bluetooth 4.x) and doubling of on-air data-rate, up to 2Mbs from 1Mbs in

Bluetooth 4.x

Wide protocol support with addition of 802.15.4

The 802.15.4 PHY and MAC layers are supported natively on the nRF52840. This allows nRF52840 to be used in a wide range of home and industrial sensor network applications as it supports two of the most popular wireless sensor standards in use today, Bluetooth low energy and 802.15.4 derivatives. This adds to the already existing radio support for Bluetooth low energy.

Applications

◆

Computer peripherals and I/O devices

Mouse

Keyboard

Multi-touch trackpad

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Interactive entertainment devices

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Remote control

3D Glasses

Gaming controller

◆

Advanced wearables

Connected watches

Advanced personal fitness devices

Wearables with wireless payment

Connected Health

Virtual/Augmented Reality applications

◆

IoT

Smart Home sensors and controllers

Industrial IoT sensors and controllers

Bluetooth Module

SKB501- User Manual

Features

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Bluetooth 5 ready multi-protocol radio

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Bluetooth 5 datarate support: 2Mbs, 1Mbs, 500Kbs, 125Kbs

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32-bit ARM Cortex-M4F @ 64MHz

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Up to 111 dB link budget for Bluetooth long range mode

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Programmable output power from +8dBm to -20dBm

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-96dBm Sensitivity for Bluetooth low energy

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RSSI

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Wide supply voltage range +5.5v to 1.7v

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Full selection of interfaces SPI/UART/PWM

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Programmable Peripheral Interface - PPI

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High speed SPI interface 32MHz

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EasyDMA for all digital interfaces

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12bit/200K SPS ADC

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128 bit AES/ECB/CCM/AAR co-processor

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20 General Purpose I/O pins

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SPI Master/Slave

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Two-wire Master (I2C compatible)

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UART (CTS/RTS)

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RoHS compliance (Lead-free)

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FCC,CE compliance

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Skylab M&C Technology Co., Ltd

Application Block Diagram

Bluetooth Module

SKB501- User Manual

SKB501 Block Diagram

Interfaces

Power Supply

Regulated power for the SKB501 is required. The input voltage Vcc range should be 1.7V to 3.6V. Suitable

decoupling must be provided by external decoupling circuitry (10uF and 0.1uF). It can reduce the noise from

power supply and increase power stability.

System Function Interfaces

GPIOs

The general purpose I/O is organized as one port with up to 20 I/Os enabling access and control of up to 19

pins through one port. Each GPIO can be accessed individually with the following user configurable

features: 1、Input/output direction

2、Output drive strength 3、Internal pull-up and pull-down resistors 4、Wake-up from high or low level triggers on all pins 5、Trigger interrupt on all pins 6、All pins can be used by the PPI task/event system; the maximum number of pins that

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Bluetooth Module

SKB501- User Manual

Skylab M&C Technology Co., Ltd

can be interfaced through the PPI at the same time is limited by the number of GPIOTE channels 7、All pins can be individually configured to carry serial interface or quadrature demodulator signals 8、All pins can be configured as PWM signal. 9、There are 6 ADC/LPCOMP input in the 20 I/Os.

Two-wire Interface (I2C Compatible)

The two-wire interface can communicate with a bi-directional wired-AND bus with two lines (SCL, SDA). The protocol makes it possible to interconnect up to 127 individually addressable devices. The interface is capable of clock stretching, supporting data rates of 100 kbps ,250kbps and 400 kbps. The module has 2 TWI ports and they properties like following table.

Instance Master/Slave

TWI0 Master

TWI1 Master

TWI Pin Share Scheme

Note：I2C:Inter－Integrated Circuit

Flash Program I/Os

The module has two programmer pins, respectively SWDCLK pin and SWDIO pin. The two pin Serial Wire

Debug (SWD) interface provided as a part of the Debug Access Port (DAP) offers a flexible and powerful

mechanism for non-intrusive debugging of program code. Breakpoints and single stepping are part of this

support.

Serial Peripheral Interface

The SPI interfaces enable full duplex synchronous communication between devices. They support a

three-wire (SCK, MISO, MOSI) bi-directional bus with fast data transfers. The SPI Master can

communicate with multiple slaves using individual chip select signals for each of the slave devices attached

to a bus. Control of chip select signals is left to the application through use of GPIO signals. SPI Master has

double buffered I/O data. The SPI Slave includes EasyDMA for data transfer directly to and from RAM

allowing Slave data transfers to occur while the CPU is IDLE. The GPIOs are used for each SPI interface

line can be chosen from any GPIOs on the device and configed independently. This enables great flexibility

in device pinout and efficient use of printed circuit board space and signal routing.

The SPI peripheral support SPI mode 0,1,2,and 3.The module have 3 SPI ports and theirs they properties are

as below:

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Skylab M&C Technology Co., Ltd

Bluetooth Module

SKB501- User Manual

Instance Master/Slave

SPI0 Master

SPI1 Master

SPIS1 Slave

SPI Properties

UARTs

The Universal Asynchronous Receiver/Transmitter offers fast, full-duplex, asynchronous serial

communication with built-in flow control (CTS, RTS), support in hardware up to 1 Mbps baud. Parity

checking is supported.

Support the following baudrate in bps unit:

1200/2400/4800/9600/14400/19200/28800/38400/57600/76800/115200.

Note: The GPIOs are used for each SPI/TWI/UART interface line can be chosen from any

GPIOs on the device and configed independently.

Analog to Digital Converter (ADC)

The 12 bit incremental Analog to Digital Converter (ADC) enables sampling of up to 8 external signals

through a front-end multiplexer. The ADC has configurable input and reference prescaling, and sample

resolution (8,10, and 12 bit).

Note: The ADC module uses the same analog inputs as the LPCOMP module. Only one of

the modules can be enabled at the same time.

SKB501 Pin Number

Pin Number Description

P0.28

P0.29

P0.30

P0.31

P0.02

P0.03

ADC Pins

Digital I/O; Analog

Digital I/O;Analog

Digital I/O; Analog

Low Power Comparator (LPCOMP)

In System ON, the block can generate separate events on rising and falling edges of a signal, or sample the

current state of the pin as being above or below the threshold. The block can be configured to use any of the

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Bluetooth Module

SKB501- User Manual

Skylab M&C Technology Co., Ltd

analog inputs on the device. Additionally, the low power comparator can be used as an analog wakeup

source from System OFF or System ON. The comparator threshold can be programmed to a range of

fractions of the supply voltage.

Reset

The reset pin of the SKB501 module is in the internal pull-high state , when the reset pin of the

module is input to a low level , the module will be automatically reset .After the reset pin is used , the param

eters of the current setting will not be ANT .

Module Specifications

Hardware Features

Model

ANTenna Type

Chipset Solution

Voltage

Dimension(L×W×H)

Wireless Features

Wireless Standards

Frequency Range

Data Rates

Modulation

Technique

Wireless Security

Transmit Power

SKB501, SKB501-CSPI, SKB501-XXPI, SKB501-CSEI, SKB501-XXEI

PCB Antenna

nRF52840

1.7V~3.6V

17.4×13.7×1.9 mm

Bluetooth 5

2400MHz---2483.5MHz

1Mbps(Bluetooth 5)

GFSK Modulation(Bluetooth 5)

AES HW Encryption

Tx Power -20 to +8 dBm in 4 dB Steps(Bluetooth

4.2)

Work Mode

Others

Certification

Environment

Central/Peripheral(Bluetooth

4.2)

RoHS

Operating Temperature: -40℃~85℃

Storage Temperature: -40℃~125℃

Operating Humidity: 10%~90% Non-condensing

Storage Humidity: 5%~90% Non-condensing

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Module Pinout and Pin Description

Module Pinout

Bluetooth Module

SKB501- User Manual

SKB501 Module Pinout

7.2 Pin Description

Pin No. Pin Name Description

GND Ground

VCC Main Power Supply 1.7V to 3.6V

P0.05

P0.26

Digital I/O; UART RTS

Digital I/O; I2C_SDA

Remark

Digital I/O

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Skylab M&C Technology Co., Ltd

Bluetooth Module

SKB501- User Manual

P0.27

Digital I/O; I2C_SCL

Digital I/O

P0.28 Digital I/O; Analog input ADC/LPCOMP input 4

P0.29 Digital I/O; Analog input ADC/LPCOMP input 5

P0.30 Digital I/O; Analog input ADC/LPCOMP input 6

P0.31 Digital I/O; Analog input ADC/LPCOMP input 7

GND Ground

P0.02 Digital I/O; Analog input

P0.03 Digital I/O; Analog input

P0.06

P0.07

P0.08

Digital I/O; UART TXD

Digital I/O; UART CTS

Digital I/O; UART RXD

ADC/LPCOMP input 0

ADC/LPCOMP input 1

Digital I/O

P0.10 Digital I/O; Digital I/O;

P0.09 Digital I/O; Digital I/O;

P0.17

P0.19

P0.20

P0.21

RESET

Digital I/O; SPI_CS

Digital I/O; SPI_CLK

Digital I/O; SPI_D0

Digital I/O; SPI_D1

System Reset (Active

Digital I/O

Reset

low)

P0.22

Digital I/O; SPI_D2

Digital I/O

Digital I/O; SPI_D3

P0.23

Digital I/O

SWDCLK

SWDIO

Hardware debug and

Flash program I/O

Hardware Debug and

Flash Program I/O

Digital input

Digital I/O

PCB Footprint and Dimensions

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Skylab M&C Technology Co., Ltd

Bluetooth Module

SKB501- User Manual

SKB501 Recommended PCB Footprint

Manufacturing Process Recommendations

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Skylab M&C Technology Co., Ltd

Bluetooth Module

SKB501- User Manual

SKB501 Typical Lead-free Soldering Profile

Note：The final re-flow soldering temperature map chosen at the factory depends on

additional external factors, for example, choice of soldering paste,size, thickness and

properties of the module`s baseboard etc. Exceeding the maximum soldering temperature

in the recommended soldering profile may permanently damage the module.

Packaging Specification

SKB501 modules are put into tray and 528 units per tray. Each tray is ‘dry’ and vacuum packaging.

SKB501 Packaging

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The module itself not have its own shielding, in order to ensure it complies all requirements, the host in which the module will be installed must provide the shielding

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