SkyJiarun SJR-BTM308-C Datasheet

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Bluetooth Module Datasheet
Model: SJR-BTM308-C
Version: V1.1
2018-07-05
Sky Jiarun Technologies Co., Ltd.
Tel: (0755)85279490
E-mail: sales@tianjiarun.com
Fuyong, Baoan, Shenzhen
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List of Contents
1 Introduction
2 Key Features
3 Applications
4 Block Diagram
5 General specifications
6 Module Package Information
6.1 Pinout Diagram and package dimensions
6.2 Module Pin descriptions
7 Electrical Characteristics
7.1 Absolute Maximum Ratings
7.2 Recommended Operating Conditions
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8 Recommended reflow temperature profile
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1 Introduction

Sky Jiarun Technologies
5.0 modules SJR-BTM308-C which is a high performance, cost effective, low power and compact solution. The Bluetooth module provides a complete 2.4GHz Bluetooth system based on the QCC3008 QFN chipset which is a single chip radio and baseband IC for Bluetooth 2.4GHz systems,. This module is fully qualified single-chip dual mode Bluetooth@v5.0 system.
introduces the pioneer of the Bluetooth

2 Key Features

Bluetooth Profiles
Bluetooth v5.0 specification support Qualcomm® Bluetooth® Low Energy secure connection A2DP v1.3.1 AVRCP v1.6 HFP v1.7 HSP v1.2 SPP v1.2 DID v1.3 HOGP v1.0 PXP v1.0.1 FMP v1.0 BAS v1.0 QTIL's proximity pairing and QTIL's proximity connection
Music Enhancements
aptX, aptX Low Latency, SBC, and AAC audio codecs Qualcomm TrueWireless™Stereo (TWS), which allows two devices to be
configured as a stereo pair
Configurable Signal Detection to trigger events 1 bank of up to 10-stage Speaker Parametric EQ 6 banks of up to 5-stage User Parametric EQ for music enhancement Qualcomm® meloD™Expansion audio processing: 3D stereo widening  Compander to compress or expand the dynamic range of the audio Post Mastering to improve DAC fidelity Dual I²S outputs with crossover
Additional Functionality
Support for multi-language programmable audio prompts Multipoint support for A2DP connection to 2 A2DP sources for music playback Talk-time extension, which automatically reduces processor functions to extend
use when a low battery condition is detected
Slim module with 13.5mm x 21mm x 2.0mm
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3 Applications

Model Name
SJR-BTM308-C
Product Description
Bluetooth 5.0 Class2 Module
Bluetooth Standard
Bluetooth 5.0
Chipset
QCC3008 QFN
Dimension
13.5mm x 21mm x 2.0mm
Operating Conditions
Voltage
2.8~4.2V
Temperature
-10+70
Storage Temperature
-40+85
Electrical Specifications
Frequency Range
24022480MHz
Maximum RF Transmit Power
9dBm
π/4 DQPSK Receive Sensitivity
-92dBm
8DPSK Receive Sensitivity
-82dBm
Stereo Headsets
Wired Stereo headsets and headphones
Portable Bluetooth Stereo speakers

4 Block Diagram

5 General specifications

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6 Module Package Information

6.1 Pinout Diagram and package dimensions

Unit:MM
Recommended PCB layout footprint
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6.2 Module Pin descriptions

Pin#
Pin Name
Pin Type
Description 1
GND
Ground
Ground
2
AIO_0
Analogue input/output
Analogue programmable input/ output line 0.
3
NCNCNC
4NCNC
NC
5
UART_RTS/PIO_16
Bidirectional with strong pull-up
UART request to send, active low Alternative function:
■ PIO_16 Programmable input/output line 16.
7
6
UART_CTS/PIO_17
Bidirectional with strong pull-down
UART clear to send active low Alternative function:
■ PIO_17 Programmable input/output line 17.
7NCNC
NC
8
NCNCNC
9
NCNCNC
10
NCNCNC
11
NCNCNC
12
SPI_PCM
Input with weak pull-down
SPI/I2S# select input
■ 0=I2S/PIO interface
■ 1=SPI
13
GND
Ground
Ground
14
SPI_MISO
Bidirectional with weak pull-down
SPI data output Alternative function:
■ PIO_3: Programmable input/output line 3.
■ I2S1_SD_OUT: I2S1 synchronous data output
15
SPI_MOSI
Bidirectional with weak pull-down
SPI data input Alternative function:
■ PIO_2: Programmable input/output line
■ SPDIF_IN: SPDIF input
■ I2S1_SD_IN:I2S1 synchronous data input
16
SPI_CLK
Bidirectional with weak pull-down
SPI clock Alternative function:
■ PIO_5: Programmable input/output line
■ I2S1_CLK: I2S1 synchronous data clock
17
SPI_CSB
Bidirectional with weak pull-down
Chip select for SPI,active low Alternative function:
■ PIO_4: Programmable input/output line 4.
■ I2S1_WS: I2S1 word select
18
GND
Ground
Ground
19
GND
Ground
Ground
20
BT_Reset
Input with strong pull-up
Reset if low. Pull low for minimum 5 ms to cause a reset
21
GND
Ground
Ground
22
LED_1
Bidirectional
Open-drain output
23
LED_0
Bidirectional
Open-drain output
24
PWR
CMOS Input
Regulator enable and multifunction button. A high input (tolerant to VBAT voltages) enables the on-chip regulators, which can then be latched on internally and the button used as a multifunction input.
25
GND
Ground
Ground
26
VBUS
Charge input
Charge input. Typically connected charger
27
CHG_EXT
Exernal battery charger control
External battery charger transistor base control when using external charger boost. Otherwise leave unconnected.
28
VBAT_SENSE
CMOS Input
Battery charger sense input.
29
VBAT
Power Input
Positive supply for BT Module,or battery positive terminal
8
30
GND
Ground
Ground
31
1V8
Power output
Auxiliary regulator output (1.8V out)
32
VDD_PADS
Power output
3.3V Positive supply output
33
3V3_USB
Power output
3.3V bypass linear regulator output
34
GND
Ground
Ground
35
USB_N
Bi-directional
USB data minus
36
USB_P
Bi-directional
USB data plus with selectable internal
1.5kΩ pull-up resistor
37
GND
Ground
Ground
38
PIO_9
Bidirectional with strong pull-down
Programmable input/output line 9. Alternative function:
■ UART_CTS: UART clear to send, active low
■ I2S2_SD_IN: I²S2 synchronous data input
39
PIO_0
Bidirectional with strong pull-up
Programmable input/output line 0. Alternative function:
■ UART_RX: UART data input
40
PIO_1
Bidirectional with strong pull-up
Programmable input/output line 1. Alternative function:
■ UART_TX: UART data output
41
PIO_8
Bidirectional with strong pull-up
Programmable input/output line 8. Alternative function:
■ UART_RTS: UART request to send, active low
■ I2S2_SD_IN: I²S2 synchronous data input
42
PIO_7
Bidirectional with strong pull-down
Programmable input/output line 7.
■ I2S2_WS: I2S2 word select
43
PIO_6
Bidirectional with strong pull-down
Programmable input/output line 6.
■ I2S2_SD_OUT: I2S2 synchronous data output
44
PIO_21
Bidirectional with weak pull-down
Programmable input/output line 21.
45
PIO_18
Bidirectional with weak pull-down
Programmable input/output line 18.
46
LED_2
Bidirectional
Open-drain output
47
GND
Ground
Ground
48
MIC_BIAS
Analogue
Microphone bias
49
LINE/MIC_AN
Analogue in
Microphone input negative, channel A
50
LINE/MIC_AP
Analogue in
Microphone input positive, channel A
51
LINE_BN
Analogue in
Line-in negative, channel B
52
LINE_BP
Analogue in
Line-in positive, channel B
53
GND
Ground
Ground
54
SPK_RN
Analogue OUT
Speaker output negative, right
55
SPK_RP
Analogue OUT
Speaker output positive, right
56
SPK_LN
Analogue OUT
Speaker output negative, left
57
SPK_LP
Analogue OUT
Speaker output positive, left
58
GND
Ground
Ground
59
RF_IN
RF
Bluetooth 50Ω transmitter output/receive input
60
GND
Ground
Ground
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7 Electrical Characteristics

Rating
Minimum
Maximum
Storage temperature
-40
+85
Operating Condition
Minimum
Maximum
Operating temperature range
-10℃+70
Supply voltage: VBAT
+2.8V
+4.2V

7.1 Absolute Maximum Ratings

7.2 Recommended Operating Conditions

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8 Recommended reflow temperature profile

The module Must go through 125℃baking for at least 9 hours before SMT AND IR reflow process!
若拆封后未立即上线,天嘉润科技建议让下次上线前务必以
125
℃烘烤9小时以上!
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Record of Changes
IMPORTANT NOTICE
Data
Revision
Description
2018-01-30
V1.0
Original publication of this document.
2018-07-05
V1.1
Fix PIN definition.
Sky Jiarun Technologies Co.,Ltd (SJR) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current. All products are sold subject to the SJR terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
SJR warrants performance of its products to specifications applicable at the time of sale in accordance with SJR’s standard warranty. Testing and other quality
control techniques are utilized to the extent SJR deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
In order to minimize risks associated with customer applications, adequate design and operating safeguards must be used by the customer to minimize
inherent or procedural hazards. SJR products are not authorized for use as critical components in life support devices or systems without the express written approval of an officer of the company. Life support devices or systems are devices or systems that are intended for surgical implant into the body, or support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided, can be reasonably expected to result in a significant injury to the user. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
SJR assumes no liability for applications assistance or customer product design. SJR does not warrant or represent that any license, either express or implied, is
granted under any patent right, mask work right, or other intellectual property right of SJR covering or relating or any combination, machine, or process in which such products or services might be or are used.
Tel: (0755) 85279490
Fax :( 0755) 85279683
Web: www.tianjiarun.com
E-mail: sales@tianjiarun.com
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