4.1. Power Supply ...................................................................................................................... 20
4.1.1. Power Supply Pin ................................................................................................................................ 21
4.1.2. Monitoring Power Supply ................................................................................................................... 22
4.2. Power on/off Scenarios ....................................................................................................... 22
4.2.1. Power on SIM800H ............................................................................................................................. 22
4.2.2. Power down SIM800H ........................................................................................................................ 23
4.2.3. Reset Function ..................................................................................................................................... 24
4.3. Power Saving Mode ............................................................................................................ 25
4.5. Serial Port and USB Interface ............................................................................................. 28
4.5.1 Function of Serial Port ........................................................................................................................ 28
4.5.2 Serial Interfaces ................................................................................................................................... 29
5.2.2. Power Supply ...................................................................................................................................... 51
I. Related Documents ............................................................................................................. 62
II. Terms and Abbreviations .................................................................................................... 63
III. Safety Caution ..................................................................................................................... 65
SIM800H _Hardware Design_V2.03 5 2016-10-10
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SIMCOM CONFIDENTIAL FILE
Table Index
TABLE 1: MODULE INFOR M ATI O N ........................................................................................................................... 11
TABLE 2: SIM800H KEY FEATURES ........................................................................................................................... 11
TABLE 3: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE ............................ 13
TABLE 4: OVERVIEW OF OPERATING MODES ........................................................................................................ 13
TABLE 22: PIN DEFINITION OF THE KEYPAD INTERFACE ................................................................................... 42
TABLE 23: PIN DEFINITION OF THE I2C ................................................................................................................... 43
TABLE 24: PIN DEFINITION OF THE GPIO ................................................................................................................ 43
TABLE 25: PIN DEFINITION OF THE ADC ................................................................................................................. 44
TABLE 29: PIN DEFINITION OF THE NETLIGHT ..................................................................................................... 45
TABLE 30: STATUS OF THE NETLIGHT PIN .............................................................................................................. 45
TABLE 31: PIN DEFINITION OF THE STATUS ........................................................................................................... 46
TABLE 32: PIN DEFINITION OF THE LED ................................................................................................................. 46
Note: Every time plug SIM card interval advice is greater than 2s. Otherwise may not be able to correct detection.
4.9. PCM Interface
SIM800H provides a hardware PCM interface:
Table 20: PCM pin definition
Pin name Pin number Description
PCM_CLK 29 PCM clock
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Module
CODEC
PCMIN
PCMSYNC
PCMOUT
PCMCLK
GND
GND
PCM_IN
PCM_OUT
PCM_SYNC
PCM_CLK
Data length
16bits(Fixed)
PCM Clock Rate
256kHz(Fixed)
SIMCOM CONFIDENTIAL FILE
PCM_OUT 30 PCM data output
PCM_SYNC 65 PCM synchrony
PCM_IN 66 PCM data input
SIM800H PCM interface only supply master mode, data length is 16 bits (linear),PCM clock rate is 256kHz.
Table 21: PCM specification
Parameter Specification
Line Interface Format Linear(Fixed)
PCM Clock/Sync Source Master Mode(Fixed)
PCM Sync Format Short sync/Long sync both support
Zero Padding/Sign extension Zero Padding(Fixed)
Data Ordering MSB/LSB both support
Note: Customer can use AT command control PCM interface. For detail, please refer to document [1].
4.9.1. PCM reference circuit
Refer to the following figure for PCM design:
Figure 36: PCM reference circuit
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KBR4
KBR3
KBR2
KBR1
KBR0
KBC0
KBC1
KBC2
KBC3
KBC4
Module
KBR4
KBR0
KBC0
KBC4
20K
Module
20K
SIMCOM CONFIDENTIAL FILE
4.10. Keypad Interface
The keypad interface consists of 5 keypad column outputs and 5 keypad row inputs. with total 5*5*2, which is 50
keys.Module has two connections, which supports 25 keys and anther supports 50 keys.
Figure 37: 25 keys reference circuit
Note:According to the traditional 5*5 to design buttons, when there is spare KBC or KBR, customer can execute AT command
to define as GPIO for details please see the relevant manuals.
Module supports a new key connection, can support 50 keys, which meets full keyboard demand, the connection
diagram is as following:
Figure 38: 50 keys reference circuit
Note:Do not change the 20KΩ resistor in the diagram.
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KBRx
KBCx
20K
<1K
Module
KBRx
KBCx
20K
Module
KBC1
25
Pull up
KBC2
22
Pull up
KBC3
21
Pull up
KBR2
61
Pull down
KBR3
23
Pull down
SIMCOM CONFIDENTIAL FILE
Customer could cascade a less than 1K resistor to enhance the ESD performance, the connection diagram is as
following:
Figure 39: Keypad reference circuit
Whether using a 5*5 keys or 5*5*2 keys, the module can also detect the two buttons pressed. But when using a
5*5*2 button, the same row, column two buttons pressed at the same time can’t be detected, as shown below:
Figure 40: Keypad detected
Table 22: Pin definition of the keypad interface
Pin name Pin number Function Default state
KBC0 20
Keypad matrix column
KBC4 24 Pull up
KBR0 62
KBR1 60 Pull down
Keypad matrix row
KBR4 63 Pull down
Note: Please be sure to increase the ESD protection devices in product design phase, and make sure have ESD protection devices
in the final product.
Pull up
Pull down
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Pin name
Pin number
Reset state
3
Refer to Figure 41
27
Refer to Figure 41
28
Refer to Figure 41
0.29s
PWRKEY
(INPUT)
GPIO1
GPIO2
t<1.9s
0.8s
GPIO3
t<=10us
SIMCOM CONFIDENTIAL FILE
4.11. I2C Bus
The SIM800H provides an I2C interface which is only used in the embedded AT application.
The highest data rate is 400kbit/s
Automatic start and stop bits
Generated response and confirmation automatically
Application hardware I2C protocol
Table 23: Pin definition of the I2C
Pin name Pin number Description
SCL 74 I2C serial bus clock
SDA 75 I2C serial bus data
Notes:
1. This function is not supported in the standard firmware. If customer wants this function, the firmware must be customized.
Please contact SIMCom for more details.
2. If customers design I2C please pull up to VDD_EXT.
4.12. General Purpose Input/Output (GPIO)
SIM800H provides 3 GPIO pins. The output voltage level of the GPIO can be set by AT command “AT +S GPIO”.
The input voltage level of the GPIO can also be read by AT command “AT+ SG P IO ”. For more details, please refer
to document [1].
Table 24: Pin definition of the GPIO
GPIO1
GPIO2
GPIO3
Figure 41: GPIO timing sequences
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Parameter
Min
Typ
Max
Unit
Voltage range
0 - 2.8
V
4.7K
47K
VBAT
Module
PWM
SIMCOM CONFIDENTIAL FILE
4.13. ADC
Table 25: Pin definition of the ADC
Pin name Pin number Description
ADC 50 Analog voltage input
SIM800H provides an auxiliary ADC, which can be used to measure the voltage. Customer can use AT command
“AT+CADC” to read the voltage value. For details of this AT command, please refer to document [1].
Table 26: ADC specification
ADC Resolution - 10 - bits
Sampling rate - - 1.0833 MHz
ADC precision 10 30 mV
4.14. PWM
Table 27: Pin definition of the PWM
Pin name Pin number Description
PWM 26 PWM signal
SIM800H provides a PWM which can be used to drive a vibrator, and a backlight LED for display or keyboard.
PWM output frequency varies from 0~2kHz. Two 7-bit unsigned binary parameters are used for the output period
and for the duty cycle. AT command “AT + SPWM” is used to set the output period and duty cycle of the PWM.
For details, please refer to document [1].
A typical recommended circuit of the PWM driver buzzer is shown in the following figure.
SIM800H _Hardware Design_V2.03 44 2016-10-10
Figure 42: Reference circuit of PWM driver buzzer
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Parameter
Min
Typ
Max
Unit
Working voltage
2.5
2.8
2.9
V
Status
SIM800H behavior
Off
SIM800H is not running
64ms On/ 800ms Off
SIM800H not registered the network
64ms On/ 3000ms Off
SIM800H registered to the network
64ms On/ 300ms Off
GPRS communication is established
Module
NETLIGHT
VBAT
4.7K
47K
R
Network Status Indication
SIMCOM CONFIDENTIAL FILE
Table 28: Buzzer characteristics
Working current 16 mA
Note: PWM pin must be kept at low power level when module is in the power on procedure.
4.15. Network Status Indication
Table 29: Pin definition of the NETLIGHT
Pin name Pin number Description
NETLIGHT 64
The NETLIGHT pin can be used to drive a network status indication LED. The status of this pin is listed in
following table:
Table 30: Status of the NETLIGHT pin
Reference circuit is recommended in the following figure:
Figure 43: Reference circuit of NETLIGHT
4.16. Operating Status Indication
The pin4 is for operating status indication of the module. The pin output is high when module is powered on,
and output is low when module is powered down.
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Pin name
Pin number
Description
STAT U S
4
Operating status indication
Module
ISINK0
VBATVBAT
R
ISINK1
Pin name
Pin number
Description
ISINK0
47
Sink current for LCM module
Pin name
Pin number
Description
SIMCOM CONFIDENTIAL FILE
Table 31: Pin definition of the STATUS
Note: For timing about STATUS, please reference to the chapter “4.2 power on/down scenarios”
4.17. LED Interface
SIM800H provides two LED driver pin. The two pin are open-drain output.
Table 32: Pin definition of the LED
ISINK1 46 Sink current for keypad LED
Reference circuit is recommended in the following figure:
Figure 44: LED driver reference circuit
Table 33: ISINK specification
Pin name Min Typ Max Unit
ISINK0 - 24 mA
ISINK1 60 - 100 mA
Note: Isink0 provide 6-current-level steps of up to 24mA.
4.18. RF Synchronization Signal
The synchronization signal serves to indicate growing power consumption during the transmit burst. The signal
is generated by the RF_SYNC pin.
Table 34: Definition of the RF_SYNC pin
RF_SYNC 5 Transmit synchronization signal
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Transmit burst
RF_SYNC
577us
220us
GND
(Pin41)
R101
GSM_ ANT
C101
C102
GND
(Pin39)
GSM
Antenna
Module
RF connector
D101
SIMCOM CONFIDENTIAL FILE
The timing of the synchronization signal is shown below. High level of the RF_SYNC pin indicates increased
power consumption during transmission.
Figure 45: RF_SYNC signal during transmit burst
4.19. Antenna Interface
There are three antenna ports for SIM800H, GSM antenna port named GSM_ANT, Bluetooth antenna port
named BT_ANT and FM antenna port named FM_ANTP/FM_ANTN, The RF interface of the three antenna
ports has an impedance of 50Ω.
The input impendence of the antenna should be 50Ω, and the VSWR should be less than 2.
It is recommended that the GSM antenna and the BT antenna should be placed as far as possible.
The isolations of the three antenna should be bigger than 30dB
NOTE:About the RF trace layout please refer to“AN_SMT Module_RF_Reference Design_Guide”.
4.19.1. GSM Antenna Interface
There is a GSM antenna pad named GSM_ANT for SIM800H, the connection of the antenna must be decoupled
from DC voltage. This is necessary because the antenna connector is DC coupled to ground via an inductor for
ESD protection.
The external antenna must be matched properly to achieve best performance, so the matching circuit is necessary,
the connection is recommended as following:
SIM800H _Hardware Design_V2.03 47 2016-10-10
Figure 46: GSM antenna matching circuit
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R101
GSM_ANT
C101
C102
GND
(Pin41)
GND
(Pin39)
GSM
Antenna
Module
D101
Vendor
Part number
Packages
1
Marata
LXES03AAA1-154
0201
R201
BT_ANT
(Pin36)
C201
C202
GND
(Pin37)
GND
(Pin35)
BT
Antenna
Module
SIMCOM CONFIDENTIAL FILE
R101,C101,C102 are the matching circuit, the value should be defined by the antenna design. Normally R101 is
0Ω, C101 and C102 are not mounted. The RF connector is used for conduction test. If the space between RF pin
and antenna is not enough, the matching circuit should be designed as in the following figure:
Figure 47: GSM simple antenna matching circuit
Normally R101 is 0Ω, C101 and C102 are not mounted.
D101 in Figure 46 and Figure 47 is used for ESD to protect antenna. In order to avoid damaging the module,
TVS can be used. The TVS suggested can refer to Table 35.
Table 35: Recommended transient voltage suppressor
2 Marata LXES15AAA1-153 0402
4.19.2. Bluetooth Antenna Interface
The SIM800H module provides a Bluetooth antenna pad named BT_ANT.
The external antenna must be matched properly to achieve best performance, so the matching circuit is necessary,
the connection is recommended as in the following figure:
SIM800H _Hardware Design_V2.03 48 2016-10-10
Figure 48: Bluetooth antenna matching circuit
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Moudle
FM_ANTP
R303
C303
C304
R304
R301
C301
C302
R302
FM
Antenna
FM_ANTN
Moudle
GND
L301
R301
R303
C303
C304
C301
C302
FM_ANTP
FM_ANTN
SIMCOM CONFIDENTIAL FILE
R201, C201, C202 are the matching circuit, the value should be defined by the antenna design. Normally R201 is
1.2nH, C202 is 1.5pF and C201 are not mounted.
There are some suggestions for placing components and RF trace lying for GSM and Bluetooth RF traces:
The RF connector is used for conducted test, so keep it as close to pin GSM_ANT as possible;
Antenna matching circuit should be closed to the antenna;
Keep the RF traces as 50Ω;
The RF traces should be kept far away from the high frequency signals and strong disturbing source.
4.19.3. FM Antenna Interface
The module provides 2 FM antenna pad named FM_ANTP and FM_ANTN, these are difference signal. The FM
antenna interface circuit is recommended as following:
Figure 49: FM antenna matching circuit
Normally, R301\R302\R303\R304 are 0Ω, C301\C302\C303\C304 are not mounted.
The earphone is often used for FM antenna, as an example, the pin GND of the 3.5mm earphone is connected to
the FM interface. The circuit is recommended as following:
Normally, R301\R303 are 0Ω, C301\C302\C303\C304\L301 are not mounted.
Figure 50: GND pin of the earphone use to be the FM antenna interface
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GND
GND
GND
USB_DP
GND
GND
GND
GND
GND
GND
GND
GNDGND
GND
GNDGND
GND
GND
GND
VBAT
VBUS
Audio
SIM
FM
antenna
USB
KEY
PCM
UART
GSM
Antenna
I2C
BT Antenna
GND
GND
GND
GND
GND
GNDGND
GND
GNDGND
GND
SIMCOM CONFIDENTIAL FILE
5. PCB Layout
Usually, most electronic products with good performance are based on good PCB layout. A bad PCB layout will
lead to lots of issues, like TDD noise, SIM card not be detected, etc. the final solution for these problems is to
redo PCB layout. Making good PCB layout at beginning will save develop schedule and cost as well.
This section will give some guidelines on PCB layout, in order to eliminate interfere or noise by greatest degree,
and save product development period.
5.1 Pin Assignment
Before PCB layout, we should learn well about pin assignment in order to get reasonable layout with so many
external components. Following figure is the overview of pin assignment of the module.
Figure 51: Pin assignment
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SIMCOM CONFIDENTIAL FILE
5.2 Principle of PCB Layout
During layout, attention should be paid to the following interfaces, like Antenna, power supply, SIM card
interface, audio interface, and so on.
5.2.1 Antenna Interface
The length of trace between pin output and connector should be as short as possible;
Do not trace RF signal over across the board;
The RF signal should be far away from SIM card, power ICs.
5.2.2. Power Supply
Not only VBAT but also return GND are very important in layout;
The positive line of VBAT should be as short and wide as possible;
The correct flow from source to VBAT pin should go though Zener diode then huge capacitor;
Pin 2, Pin 43, Pin 44 and Pin45 are GND signals, and shortest layout to GND of power source
should be designed;
There are 12 GND pads in middle of module; these pads could enhance the GND performances. On
the upper layer of these pads, do not trace any signal if possible.
5.2.3 SIM Card Interface
SIM card holder has no anti-EMI component inside. Thus SIM card interface maybe interfered,
please pay more attention on this interface during layout;
Ensure SIM card holder is far way from antenna or RF cable inside;
Put SIM card holder near the module, as nearer as possible;
Add ESD component to protect SIM_CLK, SIM_DATA, SIM_RST and SIM_VDD signals which
should be far away from power and high-speed-frequency signal.
5.2.4 Audio Interface
The signal trace of audio should far away from antenna and power;
The audio signal should avoid to parallel with VBAT trace.
5.2.5 Others
It is better to trace signal lines of UART bunched, as well as signals of USB.
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SIMCOM CONFIDENTIAL FILE
5.3 Recommended PCB Layout
Based on above principles, recommended layout is shown in the following illustration.
Figure 52: Recommended PCB layout
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Current
0 - 2.0 A VBUS
- - 12 V II* - 4
16
mA
VBAT
Power supply voltage
3.4
4.0
4.4 V VBUS
USB operating voltage
4.3
5.0 7 V
OPER
T
STG
Storage temperature
-45 +90 ℃
VIH
High-level input voltage
2.1 - 3.1 V VIL
Low-level input voltage
-0.3 - 0.7 V VOH
High-level output voltage
2.4
2.8 - V
SIMCOM CONFIDENTIAL FILE
6. Electrical, Reliability and Radio Characteristics
6.1 Absolute Maximum Ratings
The absolute maximum ratings stated in following table are stress ratings under non-operating conditions.
Stresses beyond any of these limits will cause permanent damage to SIM800H.
Table 36: Absolute maximum ratings
Symbol Min Typ Max Unit
VB AT - - 4.5 V
IO* - 4 16 mA
*
These parameters are for digital interface pins, such as keypad, GPIO, I2C, UART, and PCM.
6.2 Recommended Operating Conditions
Table 37: Recommended operating conditions
Symbol Parameter Min Typ Max Unit
T
Operating temperature -40 +25 +85 ℃
6.3 Digital Interface Characteristics
Table 38: Digital interface characteristics
Symbol Parameter Min Typ Max Unit
VOL Low-level output voltage - - 0.4 V
Note: These parameters are for digital interface pins, such as keypad, GPIO, I2C, UART, and PCM.
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Symbol
Parameter
Min
Typ
Max
Unit
2.4 - -
V
- - 0.27
V
1.62
- - V
Symbol
Parameter
Min
Typ
Max
Unit
-
3.0
-
IO
Output current
- - 10
mA
V
RTC-IN
VRTC input voltage
1.2
2.8
3.0 V I
RTC-IN
VRTC input current
-
3.0
5.0
uA
V
RTC-OUT
VRTC output voltage
-
2.8 - V
RTC-OUT
SIMCOM CONFIDENTIAL FILE
6.4 SIM Card Interface Characteristics
Table 39: SIM card interface characteristics
IIH High-level input current -1.0 - 1.0 uA
IIL Low-level input current -1.0 - 1.0 uA
VIH High-level input voltage
VIL Low-level input voltage
VOH High-level output voltage
VOL Low-level output voltage
6.5 SIM_VDD Characteristics
Table 40: SIM_VDD characteristics
VO Output voltage
6.6 VDD_EXT Characteristics
1.4 - - V
0.4 V
2.7 - - V
- - 0.36 V
- - 0.4 V
V
- 1.8 -
Table 41: VDD_EXT characteristics
Symbol Parameter Min Typ Max Unit
VO Output voltage 2.7 2.8 2.9 V
IO Output current - - 50 mA
6.7 VRTC Characteristics
Table 42: VRTC characteristics
Symbol Description Min Typ Max Unit
I
VRTC output current - 2.0 mA
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Symbol
Parameter
Conditions
Min
Typ
Max
Unit
0
( BS-PA-MFRMS=2)
1.57
mA
SIMCOM CONFIDENTIAL FILE
6.8 Current Consumption (VBAT=3.8V)
Table 43: Current consumption
VBAT Voltage 3.4 4.0 4.4 V
Power drop PCL=5 350 mV
PCL=5
Voltage ripple
IVBAT Average current Power down mode 150 200 uA
@ f<200kHz
@ f>200kHz
Sleep mode (AT+CFUN=1):
( BS-PA-MFRMS=9 )
( BS-PA-MFRMS=5)
Idle mode (AT+CFUN=1):
EGSM900
Voice call (PCL=5):
GSM850
EGSM900
DCS1800
PCS1900
Data mode(1Rx,4Tx):
GSM850
EGSM900
DCS1800
PCS1900
1.04
1.14
17.38
221.11
238.44
157.48
159.22
491.79
529.84
333.16
336.28
5
2.0
mV
mV
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Data mode (3Rx,2Tx):
GSM850
IMAX Peak current During Tx burst
Note: In above table the current consumption value is the typical one of the module tested in laboratory. In the mass production
stage, there may be differences among each individual.
EGSM900
DCS1800
PCS1900
Data mode (4Rx,1Tx,):
GSM850
EGSM900
DCS1800
PCS1900
359.75
385.73
250.54
251.30
233.87
249.85
174.13
174.94
mA
mA
mA
mA
2.0 A
mA
mA
mA
mA
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Terms
Contents
Bluetooth specification
Ver sion3.0
Time division multiplex either transmit or receive Frequency
3. -20dB bandwidth
-
0.8 1 MHz
5.1 [M-N] = 2
-46
-20
dBm
6.3 Modulation δf2avg/δf1avg
0.8
0.88
8. Out-of-Band Spurious Emissions
8.1 30-1000MHz (Operation Mode)
-58
-36
dBm
8.3 1800-1900MHz(Operation Mode)
-80
-47
dBm
(Pi/4-DQPSK and 8DPSK)
10.2 ω0 (Pi/4-DQPSK and 8DPSK)
-10
0
10
kHz
10.3 ωi+ω0 (Pi/4-DQPSK and 8DPSK)
-75
0
75
kHz
SIMCOM CONFIDENTIAL FILE
Table 44: Bluetooth characteristics
Channel spacing 1MHz
Number of RF channel 79
Power class 1.5
Operation mode (Rx/Tx)
hopping after one Rx/Tx cycle
Items MinTypMaxUnit
1. Output Power 5.5 7.5 10 dBm
2. Frequency range (Rx/Tx) 2402 - 2480 MHz
4. Adjacent Channel Power
5.2 [M-N] > 2 -51 -40 dBm
6. Modulation characteristics
6.1 Modulation δf1avg 140 165 175 kHz
6.2 Modulation δf2max 115 130 kHz
7. Carrier Frequency Drift
7.1 1slot -25 +25 kHz
7.2 3slot -40 +40 kHz
7.3 5slot -40 +40 kHz
7.4 Maximum drift rate -20 +20 kHz/50us
8.2 1000-12750MHz (Operation Mode) -40 -30 dBm
8.4 5150-5300MHz (Operation Mode) -80 -47 dBm
9. EDR Relative Power
-4 -0.2 1
10. EDR Carrier Frequency Stability and
Modulation Accuracy
10.1 ωi (Pi/4-DQPSK and 8DPSK) -75 0 75 kHz
10.4 RMS DEVM (Pi/4-DQPSK) 6 20 %
10.5 99% DEVM (Pi/4-DQPSK) 10 30 %
10.6 Peak DEVM (Pi/4-DQPSK) 14 35 %
10.7 RMS DEVM (8DPSK) 6 13 %
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Conditions
Min
Typ
Max
Unit
Search
16.4
38.3
107.6
mA
Connect
17.5
24.1
74.8
mA
11.2 2441MHz
-92
-70
dBm
12.3 2MHz ratio (-60dBm input)
-38
-30
dB
12.4 3MHz ratio (-67dBm input)
-45
-40
dB
13.3 2500MHz-3000MHz
-28 0
dBm
13.4 3000MHz-12750MHz
-10
-5 dBm
16.1 Pi/4-DQPSK
-94
-70
dBm
SIMCOM CONFIDENTIAL FILE
10.8 99% DEVM (8DPSK) 10 20 %
10.9 Peak DEVM (8DPSK) 16 25 %
RX characteristics
11. Sensitivity (BER < 0.1%)
11.1 2402MHz -92 -70 dBm
11.3 2480MHz -92 -70 dBm
12. C/I Performance (BER < 0.1%)
12.1 co-channel ratio (-60dBm input) 8 11 dB
12.2 1MHz ratio (-60dBm input) -10 0 dB
12.5 image +/- 1MHz ratio (-67dBm input) -30 -20 dB
13. Blocking performance (BER < 0.1%)
13.1 30MHz-2000MHz -10 -8 dBm
13.2 2000MHz-2400MHz -28 0 dBm
14. Intermodulation performance
(BER < 0.1%, -64dBm input)
15. Maximum Input Level -20 -5 dBm
16. EDR Sensitivity (at 0.01% BER)
16.2 8DPSK -87 -70 dBm
Table 45: Current consumption of Bluetooth
Matches 13.3 17.1 58.4 mA
SIM800H _Hardware Design_V2.03 57 2016-10-10
-39 -30
dBm
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SPK_P/SPK_N/MIC_P/MIC_N
±2KV
±5KV
GSM850,EGSM900
7
29
±3
±4
9
25
±3
±4
14
15
±3
±4
16
11
±5
±6
SIMCOM CONFIDENTIAL FILE
6.9 Electro-Static Discharge
SIM800H is an ESD sensitive component, so attention should be paid to the procedure of handling and
packaging. The ESD test results are shown in the following table.
Table 46: The ESD characteristics (Temperature: 25℃, H um idity: 45 % )
Pin name Contact discharge Air discharge
VB AT ±6KV ±12KV
GND ±6KV ±12KV
RXD, TXD ±2KV ±8KV
Antenna port ±5KV ±10KV
PWRKEY ±2KV ±8KV
6.10 Radio Characteristics
6.10.1. Module RF Output Power
The following table shows the module conducted output power, it is followed by the 3GPP TS 05.05 technical
specification requirement.
Table 47: GSM850 and EGSM900 conducted RF output power
PCL Nominal output power (dBm)
5 33 ±2 ±2.5
6 31 ±3 ±4
8 27 ±3 ±4
10 23 ±3 ±4
11 21 ±3 ±4
12 19 ±3 ±4
Tolerance (dB) for conditions
Normal Extreme
13 17 ±3 ±4
15 13 ±3 ±4
17 9 ±5 ±6
18 7 ±5 ±6
19-31 5 ±5 ±6
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DCS1800,PCS1900
Tolerance (dB) for conditions
Normal
Extreme
0
30
±2
±2.5
6
18
±3
±4
11 8 ±4
±5
12 6 ±4
±5
Frequency
Receive sensitivity(Typical)
Receive sensitivity(Max)
GSM850,EGSM900
< -108dBm
< -106dBm
1930 ~ 1990MHz
1850 ~ 1910MHz
SIMCOM CONFIDENTIAL FILE
Table 48: DCS1800 and PCS1900 conducted RF output power
PCL Nominal output power (dBm)
1 28 ±3 ±4
2 26 ±3 ±4
3 24 ±3 ±4
4 22 ±3 ±4
5 20 ±3 ±4
7 16 ±3 ±4
8 14 ±3 ±4
9 12 ±4 ±5
10 10 ±4 ±5
13 4 ±4 ±5
14 2 ±5 ±6
15 0 ±5 ±6
6.10.2. Module RF Receive Sensitivity
The following table shows the module’s conducted receiving sensitivity, it is tested under static condition.
Table 49: Conducted RF receive sensitivity
DCS1800,PCS1900 < -108dBm < -106dBm
6.10.3. Module Operating Frequencies
The following table shows the module’s operating frequency range; it is followed by the 3GPP TS 05.05
technical specification requirement.
Table 50: Operating frequencies
Frequency Receive Transmit
GSM850
EGSM900
DCS1800
PCS1900
SIM800H _Hardware Design_V2.03 59 2016-10-10
869 ~ 894MHz 824 ~ 849MHz
925 ~ 960MHz 880 ~ 915MHz
1805 ~ 1880MHz 1710 ~ 1785MHz
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SIMCOM CONFIDENTIAL FILE
7. Manufacturing
7.1. Top and Bottom View of SIM800H
Figure 53: Top and bottom view of SIM800H
7.2. Typical Solder Reflow Profile
Figure 54: Typical solder reflow profile of lead-free processes
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Moisture Sensitivity Level
3
168 hours
4
72 hours
5a
24 hours
Mandatory bake before use. After bake, it must be reflowed within the time limit
SIMCOM CONFIDENTIAL FILE
7.3. The Moisture Sensitivity Level
The moisture sensitivity level of SIM800H module is 3. The modules should be mounted within 168 hours after
unpacking in the environmental conditions of temperature <30℃
necessary to bake the module if the above conditions are not met:
Table 51: Moisture sensitivity level and floor life
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as stated
(MSL)
1 Unlimited at ≦30℃/85% R H
2 1 year
2a 4 weeks
5 48 hours
a n d re la tiv
6
specified on the label.
Note: For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed.
7.4. Baking Requirements
SIM800H modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage under
the following conditions: the environment temperature is lower than 40℃
If the condition meets one of the following ones shown below, the modules should be baked sufficiently before
re-flow soldering, and the baking condition is shown in below table; otherwise the module will be at the risk of
permanent damage during re-flow soldering.
If the vacuum package is broken or leakage;
If the vacuum package is opened after 6 months since it’s been packed;
If the vacuum package is opened within 6 months but out of its Floor Life at factory
ambient≦30℃/60% R H or as stated
.
, and the air h
Table 52: Baking requirements
Baking temperature Moisture Time
40℃±5 ℃ <5% 192 hours
120℃±5 ℃ <5% 6 hours
Note: Care should be taken if that plastic tray is not heat-resistant, the modules should be taken out for preheating, otherwise the
tray may be damaged by high-temperature heating.
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AT Command
SIM800 Series UART Port
[5]
GSM 07.10
Support GSM 07.10 multiplexing protocol
Digital cellular telecommunications (Phase 2+); Use of Data
DCE) interface for Short Message Service (SMS) and Cell
Digital cellular telecommunications system (Phase 2+);
Specification of the SIM Application Toolkit for the Subscriber
m (Phase 2+);
[12]
Module secondary-SMT-UGD
Module secondary SMT User Guide
Design_Guide
SIMCOM CONFIDENTIAL FILE
8. Appendix
I. Related Documents
Table 53: Related documents
SN Document name Remark
[1]
[2]
[3]
[4] GSM 07.07
[6] GSM 07.05
[7] GSM 11.14
[8] GSM 11.11
SIM800 Series
Manual
Application Note_V1 01.doc
ITU-T Draft new
recommendation V.25ter
Serial asynchronous automatic dialing and control
Digital cellular telecommunications (Phase 2+); AT command set for
GSM Mobile Equipment (ME)
Terminal Equipment – Data Circuit terminating Equipment (DTE –
Broadcast Service (CBS)
Identity Module – Mobile Equipment (SIM – ME) interface
Digital cellular telecommunications syste
Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
[9] GSM 03.38
[10] GSM 11.10
[11] AN_Serial Port AN_Serial Port
AN_SMT
[13]
SIM800H _Hardware Design_V2.03 62 2016-10-10
Module_RF_Reference
Digital cellular telecommunications system (Phase 2+); Alphabets
and language-specific information
Digital cellular telecommunications system (Phase 2); Mobile
Station (MS) conformance specification; Part 1: Conformance
specification
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AMR
Adaptive Multi-Rate
CS
Coding Scheme
EFR
Enhanced Full Rate
EGSM
Enhanced GSM
ETS
European Telecommunication Standard
Li-ion
Lithium-Ion
PBCCH
Packet Broadcast Control Channel
PCB
Printed Circuit Board
PCL
Power Control Level
RMS
Root Mean Square (value)
RX
Receive Direction
URC
Unsolicited Result Code
SIMCOM CONFIDENTIAL FILE
II. Terms and Abbreviations
Table 54: Terms and abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
CTS Clear to Send
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready
DTX Discontinuous Transmission
ESD Electrostatic Discharge
FR Full Rate
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HR Half Rate
IMEI International Mobile Equipment Identity
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MT Mobile Terminated
PAP Password Authentication Protocol
PCS Personal Communication System, also referred to as GSM 1900
Address: Building A, SIM Technology Building, No. 633, Jinzhong Road, Shanghai, P. R. China
200335
Tel: 86-21-32523300
Fax: 86-21-32523020
Email: simcom@sim.com
Website: www.simcomm2m.com
SIM800H _Hardware Design_V2.03 66 2016-10-10
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