SIMCom SIM7600G-H User Manual

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SIM7600G-H,SIM7600G-H

SIMCom Wireless Solutions Limited

Building B, SIM Technology Building, No.633, Jinzhong Road

Changning District, Shanghai P.R. China

Tel: 86-21-31575100

support@simcom.com

www.simcom.com

LTE/HSPA/GSM/GNSS MODULE

miniPCIE User manual

SIM7600G-H User manual

Document Title:

SIM7600G-H User manual

Version:

V1.03

Date:

2020-05-09

Status:

Released

Document Control ID:

SIM7600G-H User manual

GENERAL NOTES

SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT

APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM.

THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO

SIMCOM BY THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH

FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE

CUSTOMER’S POSSESSION. FURTHERMORE, SYSTEM VALIDATION OF THIS PRODUCT

OF THE CUSTOMER OR THE CUSTOMER’S SYSTEM INTEGRATOR. ALL SPECIFICATIONS

SUPPLIED HEREIN ARE SUBJECT TO CHANGE.

IC Caution:

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the

following two conditions:

This device may not cause interference, and

(1)

This device must accept any interference, including interference that may cause undesired operation of

(2)

the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts

de licence. L'exploitation est autorisée aux deux conditions suivantes:

l'appareil ne doit pas produire de brouillage, et

(1)

(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est

susceptible d'en compromettre le fonctionnement

This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with minimum distance 20cm between the radiator &

your body.

Ce matériel est complété par une exposition de rayonnements IC pour un environnement naturel. Ce

matériel doit être installé et se faire avec une distance minimale de 20cm entre les radiateurs et les

autresYour body shop.

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For a host manufacture’s using a certified modular, if (1) the module’s IC number is not visible when

installed in the host, or (2) if the host is marketed so that end users do not have straightforward

commonly used methods for access to remove the module so that the IC number of the module is

visible; then an additional permanent label referring to the enclosed module: “Contains Transmitter

Module IC: 23761-8PYA008” or “Contains IC: 23761-8PYA008” must be used.

This radio transmitter IC: 23761-8PYA008 has been approved by Imovation,Science and Economic

Development Canada to operate with the antenna types listed below,with the maximm permissible gain

indicated.Antenna types not included in this list that have gain greater than the maximm gain indicated for

any type listed are strictly prohibilted for use with this device.

Antenna List:

Type: Dipole antenna with non-standard SMA connector(50ohm);

Model: MF25D

Antenna Gain:

Band 2:1.87dBi, Band 4:3.12dBi, Band 5:0.91dBi, Band 12:0.95dBi,

Band13:2.23dBi, Band 25:1.87dBi, Band 26:0.91dBi, Band 41:2.9dBi,

Band 66:3.12dBi

Single Module

Declaration of Conformity

SIMCom Wireless Solutions Limited, hereby declares that this LTE /HSPA/GSM/GNSS MODULE in

compliance with the essential requirements and other relevant provisions of Directive 2014/53/EU.

In accordance with Article 10(2) and Article 10(10),This product is allowed to be used in all EU member

states.

FCC Statement

This device complies with part 15 of the FCC Rules. Operation is subject to the following two

conditions:

(1) This device may not cause harmful interference, and

(2) this device must accept

any interference received, including interference that may cause undesired operation.

Any Changes or modifications not expressly approved by the party responsible for compliance

could void the user's authority to operate the equipment.

The modular can be installed or integrated in mobile or fix devices only. This modular cannot be

installed in any portable device.

FCC Radiation Exposure Statement

This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled

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environment. This transmitter must not be co-located or operating in conjunction with any other

antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm

between the radiator and user body.

If the FCC identification number is not visible when the module is installed inside another device,

then the outside of the device into which the module is installed must also display a label

referring to the enclosed module. This exterior label can use wording such as the following:

“Contains Transmitter Module FCC ID: 2AJYU-8PYA007 Or Contains FCC ID: 2AJYU-8PYA007”

When the module is installed inside another device, the user manual of the host must contain

below warning statements;

1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions:

(1) This device may not cause harmful interference.

(2) This device must accept any interference received, including interference that may cause

undesired operation.

2. Changes or modifications not expressly approved by the party responsible for compliance

could void the user's authority to operate the equipment.

The devices must be installed and used in strict accordance with the manufacturer's instructions

as described in the user documentation that comes with the product.

Any company of the host device which install this modular with Single modular approval should

perform the test of radiated emissionand spurious emission according to FCC part 15C : 15.247

and 15.209 requirement,Only if the test result comply with FCC part 15C : 15.247 and 15.209 requirement，then the host can be sold legally.

THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY

OF SIMCOM WIRELESS SOLUTIONS LIMITED COPYING, TO OTHERS AND USING THIS DOCUMENT,

ARE FORBIDDEN WITHOUT EXPRESS AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE

PATENT , A UTILITY MODEL OR DESIGN. ALL SPECIFICATION SUPPLIED HEREIN ARE SUBJECT TO

CHANGE WITHOUT NOTICE AT ANY TIME.

manufacturer information:

SIMCom Wireless Solutions Limited

No.633, Jinzhong Rd,Changning Dist., Shanghai, P.R.China

Tel: +86 21 31575100

Email: simcom@simcom.com

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For more information, please visit:

https://www.simcom.com/download/list-863-en.html

For technical support, or to report documentation errors, please visit:

https://www.simcom.com/ask/ or email to: support@simcom.com

importer information:

importer Name：XXXX

importer Address:XXXX

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Version History

Date

Version

Description of change

Author

2019-3-29

1.00

Original

Xutao.Jiang

2019-10-21

1.01

Update current consumption

Xutao.Jiang

2020-04-22

1.02

Modify the Format

Xiong Yuqing

2020-05-09

1.03

Add Sim7600NA/NA-H frequency band Change Table 2

Xutao.Jiang Qiang.Zhang

SIM7600G-H User manual

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Version History

Contents

................................................................................................................................................................

Table Index

Figure Index

1 Introduction

1.1 Product Outline............................................................................................................................................... 13

1.2 Hardware Interface Overview.......................................................................................................................14

1.3 Functional Overview...................................................................................................................................... 15

2 Package Information

2.1 Pin Assignment Overview............................................................................................................................. 17

2.2 Pin Description................................................................................................................................................20

2.3 Mechanical Information................................................................................................................................. 24

2.4 Footprint Recommendation.......................................................................................................................... 25

3 Interface Application

3.1 Power Supply..................................................................................................................................................26

3.1.1 Power Supply Design Guide.............................................................................................................27

3.1.2 Recommended Power Supply Circuit..............................................................................................28

3.1.3 Voltage Monitor....................................................................................................................................29

3.2 Power on/Power off/Reset Function............................................................................................................30

3.2.1 Power on...............................................................................................................................................30

3.2.2 Power off...............................................................................................................................................31

3.2.3 Reset Function.................................................................................................................................... 33

3.3 UART Interface............................................................................................................................................... 34

3.3.1 UART Design Guide...........................................................................................................................34

3.3.2 RI and DTR Behavior......................................................................................................................... 36

3.4 USB Interface..................................................................................................................................................37

3.5 HSIC interface.................................................................................................................................................38

3.6 SGMII Interface...............................................................................................................................................39

3.6.1 Reference schematic with AR8033..................................................................................................39

3.6.2 Reference schematic with BCM89820............................................................................................ 40

3.7 USIM Interface................................................................................................................................................40

3.7.1 USIM Application Guide..................................................................................................................... 41

3.8 PCM Interface................................................................................................................................................. 43

3.8.1 PCM timing...........................................................................................................................................43

3.8.2 PCM Application Guide...................................................................................................................... 45

3.9 SD Interface.....................................................................................................................................................45

3.10 I2C Interface..................................................................................................................................................47

3.11 SDIO Interface.............................................................................................................................................. 48

....................................................................................................................................................

............................................................................................................................................................

........................................................................................................................................................

.....................................................................................................................................................

.....................................................................................................................................

..................................................................................................................................

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3.12 SPI Interface................................................................................................................................................. 48

3.13 Network status..............................................................................................................................................49

3.14 Flight Mode Control......................................................................................................................................50

3.15 Other interface..............................................................................................................................................51

3.15.1 Sink Current Source.........................................................................................................................51

3.15.2 ADC..................................................................................................................................................... 52

3.15.3 LDO.....................................................................................................................................................52

4 RF Specifications

4.1. GSM/UMTS/LTE RF Specifications........................................................................................................... 53

4.2. LTE Antenna Design Guide......................................................................................................................... 54

4.3. GNSS.............................................................................................................................................................. 56

4.3.1 GNSS Technical specification...........................................................................................................56

4.3.2 GNSS Application Guide....................................................................................................................57

5 Electrical Specification

5.1 Absolute maximum ratings............................................................................................................................59

5.2 Operating conditions......................................................................................................................................59

5.3 Operating Mode..............................................................................................................................................60

5.3.1. Operating Mode Definition................................................................................................................60

5.3.2. Sleep mode.........................................................................................................................................61

5.3.3. Minimum functionality mode and Flight mode.............................................................................. 62

5.4 Current Consumption.....................................................................................................................................62

5.5 ESD Notes.......................................................................................................................................................63

6 SMT Production Guide

6.1 Top and Bottom View of MODULE.............................................................................................................. 64

6.2 Label Information............................................................................................................................................65

6.3 Typical SMT Reflow Profile...........................................................................................................................65

6.4 Moisture Sensitivity Level (MSL)................................................................................................................. 66

6.5 Stencil Foil Design Recommendation.........................................................................................................67

........................................................................................................................................

.............................................................................................................................

..............................................................................................................................

7 Packaging

8 Appendix

8.1 Coding Schemes and Maximum Net Data Rates over Air Interface..................................................... 71

8.2 Related Documents........................................................................................................................................71

8.3 Terms and Abbreviations...............................................................................................................................73

8.4 Safety Caution.................................................................................................................................................75

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Table Index

TABLE1 : MODULE FREQUENCY BANDS.............................................................................................................13

TABLE2 : GENERAL FEATURES.............................................................................................................................. 15

TABLE3 : PIN DEFINITION.........................................................................................................................................18

TABLE 4 : IO PARAMETERS DEFINITION..............................................................................................................20

TABLE 5 : PIN DESCRIPTION...................................................................................................................................20

TABLE 6 : VBAT PINS ELECTRONIC CHARACTERISTIC.................................................................................. 26

TABLE 7 : RECOMMENDED TVS LIST....................................................................................................................28

TABLE 8 : POWER ON TIMING AND ELECTRONIC CHARACTERISTIC........................................................31

TABLE 9 : POWER OFF TIMING AND ELECTRONIC CHARACTERISTIC......................................................32

TABLE 10 : RESET PIN ELECTRONIC CHARACTERISTIC............................................................................... 33

TABLE 11 : KEY DIFFERENCES BETWEEN HSIC AND HS-USB.....................................................................38

TABLE 12 : USIM ELECTRONIC CHARACTERISTIC IN 1.8V MODE (USIM_VDD=1.8V)........................... 40

TABLE 13 : USIM ELECTRONIC CHARACTERISTIC 3.0V MODE (USIM_VDD=2.95V).............................. 41

TABLE 14 : AMPHENOL USIM SOCKET PIN DESCRIPTION.............................................................................43

TABLE 15 : PCM FORMAT..........................................................................................................................................43

TABLE 16 : PCM TIMING PARAMETERS................................................................................................................44

TABLE 17 : SD/MMC ELECTRONIC CHARACTERISTIC AS 2.85V (SD_DATA0-3，SD_CLK AND SD_CMD)

..................................................................................................................................................................................45

TABLE 18 : SD/MMC/EMMC ELECTRONIC CHARACTERISTIC AS 1.8V (SD_DATA0-3，SD_CLK AND

SD_CMD) ............................................................................................................................................................. 46

TABLE 19 : NETLIGHT PIN STATUS........................................................................................................................ 49

TABLE 20 : FLIGHTMODE PIN STATUS..................................................................................................................50

TABLE 21 : SINK CURRENT ELECTRONIC CHARACTERISTIC...................................................................... 51

TABLE 22 : ADC1 AND ADC2 ELECTRONIC CHARACTERISTICS..................................................................52

TABLE 23 : ELECTRONIC CHARACTERISTIC......................................................................................................52

TABLE 24 : CONDUCTED TRANSMISSION POWER.......................................................................................... 53

TABLE 25 : OPERATING FREQUENCIES...............................................................................................................53

TABLE 26 : E-UTRA OPERATING BANDS..............................................................................................................53

TABLE 27 : CONDUCTED RECEIVE SENSITIVITY..............................................................................................54

TABLE 28 : REFERENCE SENSITIVITY (QPSK)...................................................................................................54

TABLE 29 : TRACE LOSS...........................................................................................................................................54

TABLE 30 : RECOMMENDED TVS...........................................................................................................................56

TABLE 31 : ABSOLUTE MAXIMUM RATINGS........................................................................................................59

TABLE 32 : RECOMMENDED OPERATING RATINGS........................................................................................ 59

TABLE 33 : 1.8V DIGITAL I/O CHARACTERISTICS*............................................................................................ 59

TABLE 34 : OPERATING TEMPERATURE..............................................................................................................60

TABLE 35 : OPERATING MODE DEFINITION........................................................................................................61

TABLE 36 : CURRENT CONSUMPTION ON VBAT PINS (VBAT=3.8V)............................................................62

TABLE 37 : THE ESD PERFORMANCE MEASUREMENT TABLE (TEMPERATURE: 25℃, HUMIDITY:

45%)........................................................................................................................................................................ 63

TABLE 38 : THE DESCRIPTION OF LABEL INFORMATION.............................................................................. 65

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TABLE 39 : MOISTURE SENSITIVITY LEVEL AND FLOOR LIFE..................................................................... 66

TABLE 40 : TRAY SIZE................................................................................................................................................68

TABLE 41 : SMALL CARTON SIZE........................................................................................................................... 69

TABLE 42 : BIG CARTON SIZE................................................................................................................................. 70

TABLE 43 : CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE.................. 71

TABLE 44 : RELATED DOCUMENTS.......................................................................................................................71

TABLE 45 : TERMS AND ABBREVIATIONS............................................................................................................73

TABLE 46 : SAFETY CAUTION................................................................................................................................. 75

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Figure Index

FIGURE 2 : PIN ASSIGNMENT OVERVIEW...........................................................................................................17

FIGURE 3 : DIMENSIONS (UNIT: MM).....................................................................................................................24

FIGURE 4 : FOOTPRINT RECOMMENDATION (UNIT: MM)...............................................................................25

FIGURE 5 : VBAT VOLTAGE DROP DURING BURST EMISSION (GSM/GPRS)...........................................26

FIGURE 6 : POWER SUPPLY APPLICATION CIRCUIT.......................................................................................27

FIGURE 7 : LINEAR REGULATOR REFERENCE CIRCUIT................................................................................28

FIGURE 8 : SWITCHING MODE POWER SUPPLY REFERENCE CIRCUIT...................................................29

FIGURE 9 : REFERENCE POWER ON/OFF CIRCUIT.........................................................................................30

FIGURE 10 : POWER ON TIMING SEQUENCE.................................................................................................... 31

FIGURE 11 : POWER OFF TIMING SEQUENCE...................................................................................................32

FIGURE 12 : REFERENCE RESET CIRCUIT.........................................................................................................33

FIGURE 13 : UART FULL MODEM........................................................................................................................... 34

FIGURE 14 : UART NULL MODEM...........................................................................................................................34

FIGURE 15 : REFERENCE CIRCUIT OF LEVEL SHIFT...................................................................................... 35

FIGURE 16 : LEVEL MATCHING CIRCUIT............................................................................................................. 35

FIGURE 17 : RI BEHAVIOUR（SMS AND URC REPORT）...............................................................................36

FIGURE 18 : RI BEHAVIOUR（VOICE CALL）.................................................................................................. 36

FIGURE 19 : USB REFERENCE CIRCUIT..............................................................................................................37

FIGURE 20 : REFERENCE SGMII CIRCUIT WITH AR8033................................................................................39

FIGURE 21 : REFERENCE SGMII CIRCUIT WITH BCM89820..........................................................................40

FIGURE 22 : USIM INTERFACE REFERENCE CIRCUIT.................................................................................... 41

FIGURE 23 : USIM INTERFACE REFERENCE CIRCUIT WITH USIM_DET................................................... 42

FIGURE 24 : AMPHENOL SIM CARD SOCKET.....................................................................................................43

FIGURE 25 : PCM_SYNC TIMING............................................................................................................................44

FIGURE 26 : EXT CODEC TO MODULE TIMING..................................................................................................44

FIGURE 27 : MODULE TO EXT CODEC TIMING..................................................................................................44

FIGURE 28 : AUDIO CODEC REFERENCE CIRCUIT..........................................................................................45

FIGURE 29 : SD REFERENCE CIRCUIT................................................................................................................ 46

FIGURE 30 : EMMC REFERENCE CIRCUIT..........................................................................................................47

FIGURE 31 : I2C REFERENCE CIRCUIT................................................................................................................48

FIGURE 32 : NETLIGHT REFERENCE CIRCUIT.................................................................................................. 49

FIGURE 33 : FLIGHT MODE SWITCH REFERENCE CIRCUIT..........................................................................50

FIGURE 34 : ISINK REFERENCE CIRCUIT............................................................................................................51

FIGURE 35 : ANTENNA MATCHING CIRCUIT (MAIN_ANT)...............................................................................55

FIGURE 36 : ANTENNA MATCHING CIRCUIT (AUX_ANT).................................................................................55

FIGURE 37 : ACTIVE ANTENNA CIRCUIT..............................................................................................................57

FIGURE 38 : PASSIVE ANTENNA CIRCUIT (DEFAULT)..................................................................................... 57

FIGURE 39 : TOP AND BOTTOM VIEW OF MODULE.........................................................................................64

FIGURE 40 : LABEL INFORMATION........................................................................................................................ 65

FIGURE 41 : THE RAMP-SOAK-SPIKE REFLOW PROFILE OF MODULE.....................................................66

FIGURE 42 : STENCIL FOIL....................................................................................................................................68

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FIGURE 43 : PACKAGING DIAGRAM......................................................................................................................68

FIGURE 44 : TRAY DRAWING...................................................................................................................................68

FIGURE 45 : SMALL CARTON DRAWING.............................................................................................................. 69

FIGURE 46 : BIG CARTON DRAWING.................................................................................................................... 70

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Standard

Frequency

SIM7600G

SIM7600G-H

SIM7600NA

SIM7600NA-H

GSM

850MHz

900MHz

1800M Hz

1900M Hz

WCDMA

B19

LTE

FDD B1

FDD B2

√

FDD B3

FDD B4

√

FDD B5

√

FDD B7

FDD B8

FDD B12

√

FDD B13

√

1 Introduction

This document describes the electronic specifications, RF specifications, interfaces, mechanical

characteristics and testing results of the SIMCom module. With the help of this document and other

software application notes/user guides, users can understand and use module to design and develop

applications quickly.

1.1 Product Outline

Aimed at the global market, the module support GSM, WCDMA, LTE-TDD and LTE-FDD. Users can choose

the module according to the wireless network configuration. The supported radio frequency bands are

described in the following table.

Table1: Module frequency bands

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FDD B14

√

FDD B18

FDD B19

FDD B20

FDD B25

√

FDD B26

√

FDD B28

FDD B66

√

FDD B71

√

TDD B34

TDD B38

TDD B39

TDD B40

TDD B41

√

1.2 Hardware Interface Overview

The interfaces are described in detail in the next chapters include:

● Power Supply

● USB2.0 Interface

● UART Interface

● MMC/SD Interface

● SDIO Interface

● USIM Interface

● SPI Interface

● GPIO

● ADC

● LDO Power Output

● Current Sink Source

● PCM Interface

● SPI Interface

● I2C Interface

● HSIC Interface

● SGMII Interface

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1.3 Functional Overview

Feature

Implementation

Power supply

Single supply voltage 3.4～4.2V, Recommend supply voltage 3.8V

Power saving

Current in sleep mode : <5mA

Radio frequency bands

Please refer to the table 1

Transmitting power

LTE power class: 3 (24+1/-2dBm)

Data Transmission Throughput

LTE CAT 4 :150 Mbps (DL)

50 Mbps (UL)

Antenna

LTE main antenna.

LTE auxiliary antenna

GNSS antenna

GNSS

GNSS engine (GPS,GLONASS,BD,QZSS and GALILEO)

Protocol: NMEA 0183

SMS

MT, MO, CB, Text and PDU mode

SMS storage: USIM card or ME(default)

Transmission of SMS alternatively over CS or PS.

USIM interface

Support identity card: 1.8V/ 3V

USIM application toolkit

Support SAT class 3, GSM 11.14 Release 98

Support USAT

Phonebook management

Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN

Audio feature

Support PCM interface

Only support PCM master mode and short frame sync, 16-bit linear data

formats

UART interface

A full modem serial port by default

Baud rate: 300bps to 4Mbps(default:115200bps)

Autobauding baud rate: 9600,19200,38400,57600,115200bps

Can be used as the AT commands or data stream channel

Support RTS/CTS hardware handshake

Multiplex ability according to GSM 07.10 Multiplexer Protocol

MMC/SD

Support MMC and SD cards with 2.85 V on SD port

SDIO

Support SDIO with 1.8 V only on SDIO port

USB

USB 2.0 high speed interface, Can used be send AT command, Software

update, GNSS NMEA,USB voice function etc.

Firmware upgrade

Firmware upgrade over USB interface or FOTA

Physical characteristics

Size:30*30*2.9m Weight:5.7 g

Temperature range

Normal operation temperature: -30°C to +80°C

Extended operation temperature: -40°C to +85°C*

Storage temperature -45°C to +90°C

antenna type

Dipole(SMA connector)

Table2: General features

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max. output power

LTE Band 2: 23.20 dBm

LTE Band 4: 23.67 dBm

LTE Band 5: 25.30 dBm

LTE Band 12: 24.35 dBm

LTE Band 13: 22.06 dBm

LTE Band 25: 23.46 dBm

LTE Band 26: 24.16 dBm

LTE Band 41: 23.16 dBm

LTE Band 66: 23.08 dBm

frequency range

Tx:

LTE Band2:1850~1910MHz,LTE Band4:1710MHz~1755MHz

LTE Band5:824~849MHz,LTE Band12:699~716MHz

LTE Band13:777~787MHz,LTE Band25:1850~1915MHz

LTE Band26:814~849MHz,LTE Band41:2496MHz~2690MHz

LTE Band66:1710MHz~1780MHz

Rx:

LTE Band2:1930~1990MHz,LTE Band4:2110MHz~2155MHz

LTE Band5:869~894MHz,LTE Band12:729~746MHz

LTE Band13:746~756MHz,LTE Band25:1930~1995MHz

LTE Band26:859~894MHz,LTE Band41:2496MHz~2690MHz

LTE Band66:2110MHz~2200MHz

GPS: 1575.42MHz; BDS: 1559MHz~1563MHz

Module is able to make and receive voice calls, data calls, SMS and make LTE traffic in -40℃ ~ +85℃.

The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the

normal operating temperature range and still within the extreme operating temperature range.

NOTE

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2 Package Information

2.1 Pin Assignment Overview

All functions of the MODULE will be provided through 135 pads that will be connected to the users’ platform.

The following Figure is a high-level view of the pin assignment of the MODULE.

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Figure 2: Pin assignment overview

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Table3: Pin definition

Pin No.

Pin name

Pin No.

Pin name

GND

PWRKEY

RESET

GND

SPI_CLK*

SPI_MISO*

SPI_MOSI*

SPI_CS*

GND

USB_VBUS

USB_DN

USB_DP

GND

VDD_1V8

USB_ID

USIM_DATA

USIM_RST

USIM_CLK

USIM_VDD

SD_CMD

SD_DATA0

SD_DATA1

SD_DATA2

SD_DATA3

SD_CLK

SDIO_DATA1

SDIO_DATA2

SDIO_CMD

SDIO_DATA0

SDIO_DATA3

SDIO_CLK

GPIO3*

GPIO6*

HSIC_STROBE

HSIC_DATA

GND

VBAT

GND

DBG_TXD

GND

VDD_AUX

ISINK

ADC2

ADC1

SD_DET

STATUS

GPIO43*

NETLIGHT

GPIO41*

USIM_DET*

FLIGHTMODE*

SCL

SDA

GND

AUX_ANT

GND

VBAT

GND

RTS

CTS

RXD

69RI70

DCD

TXD

DTR

PCM_OUT

PCM_IN

PCM_SYNC

PCM_CLK

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GND

GNSS_ANT

GND

MAIN_ANT

COEX1●*

COEX2*

BOOT_CFG0●*

COEX3●*

GPIO77

RESERVED

GND

GPIO4

GPIO2

GPIO1

GPIO_54

GND

RESERVED

100

RESERVED

101

RESERVED

102

RESERVED

103

RESERVED

104

RESERVED

105

RESERVED

106

DBG_ RXD

107

RESERVED

108

SGMII_RST_N

109

SGMII_INT_N

110

GND

111

RESERVED

112

SGMII_RX_P

113

SGMII_RX_M

114

SGMII_TX_M

115

SGMII_TX_P

116

SGMII_MDIO

117

SGMII_MDC

118

GND

119

GPIO_19

120

GND

121

GND

122

GND

123

GND

124

GND

125

GND

126

GND

127

GND

128

GND

129

GND

130

GND

131

GND

132

GND

133

GND

134

GND

135

GND

● Means Before the normal power up, COEX1, COEX3 or BOOT_CFG0 cannot be pulled up,

otherwise module will not be powered up normally.

* Means that pins has MUX function.

NOTE

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2.2 Pin Description

Pin type

Description

Power input

Power output

Analog input

AIO

Analog input/output

I/O

Bidirectional input /output

Digital input

Digital output

DOH

Digital output with high level

DOL

Digital output with low level

Pull up

Pull down

Pin name

Pin No.

Default status

Description

Comment

Power supply

VBAT

38,39, 62,63

Power supply, voltage range:

3.4～4.2V.

VDD_AUX

LDO power output for other external circuits with Max 150mA current output. Its output voltage is 2.85V by default.（The voltage can be configured from 1.7V to

3.05V by AT command）.

If used SGMII function ,this pin used for SGMII function. If unused, keep it open.

VDD_1V8

1.8 output with Max 50mA current output for external circuit, such as level shift circuit.

If unused, keep it open.

GND

1,2,5, 10,14,37, 40,41,43, 57,58,60, 61,64,65, 77,78,80, 81,93,96, 110,118,1 20,121,1 22,123,1 24,125,1 26,127,1 28,129,1 30,131,1 32,133,1

Ground

Table 4: IO parameters definition

SIM7600G-H User manual

Table 5: Pin description

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System Control

PWRKEY

DI,PU

System power on/off control input, active low.

The high voltage is

0.8V;

RESET

DI, PU

System reset control input, active low.

RESET has been pulled up to 1.8V via 40Kohm resistor internally.

SD interface

SD_CMD

I/O,PD

SDIO command

If unused, keep them open.

SD_DATA0

I/O,PD

SDIO data

SD_DATA1

I/O,PD

SD_DATA2

I/O,PD

SD_DATA3

I/O,PD

SD_CLK

26DOSDIO clock

SD_DET

DI,PU

SD card insertion detect H: SD card is removed L: SD card is inserted

USIM interface

USIM_DATA

I/O,PU

USIM Card data I/O, which has been pulled up via a 10KR resistor to USIM_VDD internally. Do not pull it up or down externally.

All lines of USIM

interface should be

protected against

ESD.

USIM_RST

DO,PD

USIM Reset

USIM_CLK

DO,PD

USIM clock

USIM_VDD

PO,PD

Power output for USIM card, its output Voltage depends on USIM card type automatically. Its output current is up to 50mA.

SPI interface

SPI_CLK*

6DOSPI clock output

Default SPI Optional: BT uart function

SPI_MISO*

SPI master in/slave out data

SPI_MOSI*

SPI master out/slave in data

SPI_CS*

9DOSPI chip-select output

USB

USB_VBUS

Valid USB detection input with

3.0~5.25V detection voltage

USB_DN

AI, AO

Negative line of the differential, bi-directional USB signal.

USB_DP

AI, AO

Positive line of the differential, bi-directional USB signal.

USB_ID

16AIHigh-speed USB ID input

Keep it open.

SGMII interface

SGMII_RX_P

112AISGMII receive – positive

If unused, keep them

open. SGMII_RX_M

113AISGMII receive - negative

SGMII_TX_M

114AOSGMII transmit - negative

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SIM7600G-H User manual

SGMII_TX_P

115AOSGMII transmit– positive

SGMII_RST_N

108DOEthernet PHY reset

External 1.5K pull-up resistor from

3.3V/2.5V to MDIO_DATA and 10K pull-up resistor from VDD_1V8 to ETH_INT_N are needed when the Ethernet PHY is connected.

If unused, please

keep them open.

SGMII_INT_N

109

DI,PU

Ethernet PHY interrupt

SGMII_MDIO

116

DIO

Management data input/output-data

SGMII_MDC

117

Management data input/output-clock

UART interface

RTS

DOH

Request to send

If unused, keep them

open.

CTS

67DIClear to Send

RXD

68DIReceive Data

RI69DOH

Ring Indicator

DCD

DOH

Carrier detects

TXD

DOH

Transmit Data

DTR

DI,PU

DTE get ready

DBG_UART

DBG_TXD

42DOLog output

If unused, keep them

open.

DBG_RXD

106DILog input

I2C interface

SCL

55ODI2C clock output

If unused, keep

open, or else pull

them up via 2.2KΩ

resistors to 1.8V.

SDA

56ODI2C data input/output

SDIO interface

SDIO_DATA1

I/O

SDIO data1

It can be used for WLAN function. If unused, please keep them open.

SDIO_DATA2

I/O

SDIO data2

SDIO_CMD

I/O

SDIO command

SDIO_DATA0

I/O

SDIO data0

SDIO_DATA3

I/O

SDIO data3

SDIO_CLK

SDIO clock

HSIC interface

HSIC_STROBE

I/O

HSIC strobe wakeup

If use, please refer to document [27]

Otherwise please keep them open.

HSIC_DATA

I/O

HSIC data

PCM interface

PCM_OUT

DO,PD

PCM data output.

If unused, please

keep them open. PCM_IN

DI,PD

PCM data input.

PCM_SYNC

I/O,PD

PCM data frame sync signal.

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SIM7600G-H User manual

PCM_CLK

I/O,PU

PCM data bit clock.

GPIO

NETLIGHT

DO,PU

LED control output as network status indication.

If unused, keep them open.

STATUS

DO,PU

Operating status output. High level: Power on and firmware ready Low level: Power off

GPIO4

IO,PD

Default: GPIO

GPIO2

IO,PD

Default: GPIO

GPIO1

IO,PD

Default: GPIO

GPIO_54

IO,PD

Default: GPIO

GPIO_19

119

IO,PD

Default: GPIO

RF interface

MAIN _ANT

AIO

MAIN antenna soldering pad

GNSS_ANT

79AIGNSS antenna soldering pad

AUX_ANT

59AIAuxiliary antenna soldering pad

Other interface

ISINK

45PIGround-referenced current sink.

If unused, please keep them open. ADC1

47AIAnalog-digital converter input 1

ADC2

46AIAnalog-digital converter input 2

RESERVED

88,89,90, 91,92,99, 100,101, 102,103, 104,105, 107,111

Reserved for future use

Please keep them open.

Mux function interface

COEX1●*

I/O

RF synchronizing between Wi-Fi and LTE.

Default:COEX1●* Option:WLAN_EN●

COEX2*

I/O

RFsynchronizing between Wi-Fi and LTE.

Default:COEX2* Option: WoWWAN●

COEX3●*

I/O

RF synchronizing between Wi-Fi and LTE.

Default:COEX3* Option:BT_PCM_CL K●

BOOT_CFG0●*

DI,PD

Boot configuration input. Module will be forced into USB download mode by connect 85 pin to VDD_1V8 during power up.

Default: BOOT_CFG0●* Option:COEX_RXD● Do place 2 test points for debug.

DO NOT PULL UP BOOT_CFG0 DURING NORMAL POWER UP!

FLIGHTMODE*

DI,PU

Flight Mode control input. High level(or open): Normal Mode Low level: Flight Mode

Default: FLIGHTMODE*

Option:BT_PCM_IN●

GPIO3*

33IOGPIO

Default:GPIO3* Option:WL_PWR_E

N●

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SIM7600G-H User manual

GPIO6*

34IOGPIO

Default:GPIO6* Option:WL_SLP_CL K●

USIM_DET*

Default: GPIO Optional: USIM card detecting input. H: USIM is removed L: USIM is inserted

Default:USIM_DET* Option:BT_EN●

GPIO77*

87IOGPIO

Default:GPIO77* Option:BT_PCM_OU

T●

GPIO43*

I/O,PD

GPIO

Default:GPIO43* Option:COEX_TXD●

GPIO41*

I/O,PD

GPIO

Default:GPIO41* Option:BT_PCM_SY NC●

2.3 Mechanical Information

The following figure shows the package outline drawing of MODULE.

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Figure 3: Dimensions (Unit: mm)

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2.4 Footprint Recommendation

SIM7600G-H User manual

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Figure 4: Footprint recommendation (Unit: mm)

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SIM7600G-H User manual

The test condition: The voltage of power supply for VBAT is 3.8V, Cd=100 µF tantalum capacitor

(ESR=0.7Ω) and Cf=100nF (Please refer to Figure 6—Application circuit).

Symbol

Description

Min.

Typ.

Max.

Unit

VBAT

Module power voltage

3.4

3.8

4.2

VBAT(peak)

Module power peak current in normal mode.

-2-

VBAT(average)

Module power average current in normal mode

Please refer to the table 34

VBAT(sleep)

Power supply current in sleep mode

VBAT(power-off)

Module power current in power off mode.

--20

NOTE

3 Interface Application

3.1Power Supply

The power supply pins of MODULE include 4 pins (pin 62&63, pin 38&39) named VBAT.

The 4 VBAT pads supply the power to RF and baseband circuits directly. On VBAT pads, the ripple current

up to 2A typically, due to GSM/GPRS emission burst (every 4.615ms), may cause voltage drop. So the

power supply for these pads must be able to provide sufficient current up to more than 2A in order to avoid

the voltage drop is more than 300mV.

The following figure shows the VBAT voltage ripple wave at the maximum power transmit phase.

Figure 5: VBAT voltage drop during burst emission (GSM/GPRS)

Table 6: VBAT pins electronic characteristic

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SIM7600G-H User manual

If the power supply for VBAT pins can support up to 2A, more than 300uF capacitors are

recommended .Otherwise users must use a total of 1000uF capacitors typically, in order to avoid of the

voltage drop more than 300mV. user could only power pin 62, 63 or only power pin 38, 39, for these pins are connected inside the

MODULE.

NOTE

3.1.1 Power Supply Design Guide

Make sure that the voltage on the VBAT pins will never drop below 3.4V, even during a transmit burst, when

current consumption may rise up to 2A. If the voltage drops below 3.4V, the RF performance may be

affected.

Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band can be

used for EMC.

These capacitors should be put as close as possible to VBAT pads. Also, users should keep VBAT trace on

circuit board wider than 2 mm to minimize PCB trace impedance. The following figure shows the

recommended circuit.

Recommend Bead for vbat filter are BLM21PG300SN1D and MPZ2012S221A。

Figure 6: Power supply application circuit

In addition, in order to guard for over voltage protection, it is suggested to use TVS.

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Table 7: Recommended TVS list

No.

Manufacturer

Part Number

Power dissipation

Package

JCET

ESDBW5V0A1

DFN1006-2L

WAYON

WS05DPF-B

DFN1006-2L

WILLSEMI

ESD5611N

DFN1006-2L

WILLSEMI

ESD56151W05

SOD-323

PRISEMI

PESDHC2FD4V5BH

4.5V

DFN1006-2L

WAYON

WS4.5DPV

4.5V

DFN1610-2L

If user chooses TVS, please pay attention to Clamping Voltage in your datasheet . For example when

the surge input is 100V,the Clamping Voltage is less than 10V.

*If vbat is higher than 3.8V, do not choose NO. 5 and NO. 6.

NOTE

SIM7600G-H User manual

3.1.2 Recommended Power Supply Circuit

It is recommended that a switching mode power supply or a linear regulator power supply is used. It is

important to make sure that all the components used in the power supply circuit can resist a peak current up

to 2A.

The following figure shows the linear regulator reference circuit with 5V input and 3.8V output.

Figure 7: Linear regulator reference circuit

If there is a big voltage difference between input and output for VBAT power supply, or the efficiency is

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The Switching Mode power supply solution for VBAT must be chosen carefully against Electro Magnetic

Interference and ripple current from depraving RF performance.

Under-voltage warning function and under-voltage power-off function are disabled by default. For more

information about these AT commands, please refer to Document [1].

NOTE

extremely important, then a switching mode power supply will be preferable. The following figure shows the

switching mode power supply reference circuit.

Figure 8: Switching mode power supply reference circuit

3.1.3 Voltage Monitor

To monitor the VBAT voltage, the AT command “AT+CBC” can be used.

For monitoring the VBAT voltage outside or within a special range, the AT command “AT+CVALARM” can

be used to enable the under-voltage warning function.

If users need to power off MODULE, when the VBAT voltage is out of a range, the AT command

“AT+CPMVT” can be used to enable under-voltage power-off function.

Note: Under-voltage warning function and under-voltage power-off function are disabled by default. For

more information about these AT commands, please refer to Document [1].

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Module could be automatically power on by connecting PWRKEY pin to ground via 0R resistor directly.

NOTE

3.2Power on/Power off/Reset Function

3.2.1 Power on

MODULE can be powered on by pulling the PWRKEY pin down to ground.

The PWRKEY pin has been pulled up with a diode to 1.8V internally, so it does not need to be pulled up

externally. It is strongly recommended to put a100nF capacitor, an ESD protection diode, close to the

PWRKEY pin as it would strongly enhance the ESD performance of PWRKEY pin. Please refer to the

following figure for the recommended reference circuit.

Figure 9: Reference power on/off circuit

The power-on scenarios are illustrated in the following figure.

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Figure 10: Power on timing sequence

Symbol

Parameter

Min.

Typ.

Max.

Unit

The time of active low level impulse of PWRKEY pin to

power on MODULE

100

500-ms

on(status)

The time from power-on issue to STATUS pin output

high level(indicating power up ready )

1516-

s T

on(uart)

The time from power-on issue to UART port ready

1314-

on(vdd_aux)

The time from power-on issue to VDD_AUX ready

2.5-s

on(usb)

The time from power-on issue to USB port ready

1112-

VIHInput high level voltage on PWRKEY pin

0.6

0.8

1.8

VILInput low level voltage on PWRKEY pin

-0.300.5

NOTE

SIM7600G-H User manual

Table 8: Power on timing and electronic characteristic

3.2.2 Power off

The following methods can be used to power off MODULE.

● Method 1: Power off MODULE by pulling the PWRKEY pin down to ground.

● Method 2: Power off MODULE by AT command “AT+CPOF”.

● Method 3: over-voltage or under-voltage automatic power off. The voltage range can be set by AT

command “AT+CPMVT”.

● Method 4: over-temperature or under-temperature automatic power off.

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If the temperature is outside the range of -30~+80℃, some warning will be reported via AT port. If the temperature is outside the range of -40~+85℃, MODULE will be powered off automatically.

For details about “AT+CPOF” and “AT+CPMVT”, please refer to Document [1].

Symbol

Parameter

Time value

Unit Min.

Typ.

Max.

off

The active low level time pulse on PWRKEY pin to

power off MODULE

2.5--s

off(status)

The time from power-off issue to STATUS pin output low

level(indicating power off )*

2526-

s T

off(uart)

The time from power-off issue to UART port off

1415-

off(usb)

The time from power-off issue to USB port off

2728-

off-on

The buffer time from power-off issue to power-on issue

0--

The STATUS pin can be used to detect whether MODULE is powered on or not. When MODULE has

NOTE

These procedures will make MODULE disconnect from the network and allow the software to enter a safe

state, and save data before MODULE be powered off completely.

The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.

Figure 11: Power off timing sequence

Table 9: Power off timing and electronic characteristic

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been powered on and firmware goes ready, STATUS will be high level, or else STATUS will still low

level.

3.2.3 Reset Function

This function is only used as an emergency reset, when AT command “AT+CPOF” and the PWRKEY

pin all have lost efficacy.

Symbol

Description

Min.

Typ.

Max.

Unit

reset

The active low level time impulse on RESET pin to

reset MODULE

100

200

500

ms VIHInput high level voltage

1.17

1.8

2.1

NOTE

MODULE can be reset by pulling the RESET pin down to ground.

SIM7600G-H User manual

The RESET pin has been pulled up with a 40KΩ resistor to 1.8V internally, so it does not need to be pulled

up externally. It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the

RESET pin. Please refer to the following figure for the recommended reference circuit.

Figure 12: Reference reset circuit

Table 10: RESET pin electronic characteristic

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VILInput low level voltage

-0.300.8

3.3UART Interface

MODULE provides a 7-wire UART (universal asynchronous serial transmission) interface as DCE (Data

Communication Equipment). AT commands and data transmission can be performed through UART

interface.

3.3.1 UART Design Guide

The following figures show the reference design.

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Figure 13: UART full modem

Figure 14: UART null modem

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The MODULE UART is 1.8V voltage interface. If user’s UART application circuit is 3.3V voltage interface,

the level shifter circuits should be used for voltage matching. The TXB0108RGYR provided by Texas

Instruments is recommended. The following figure shows the voltage matching reference design.

Figure 15: Reference circuit of level shift

User can use another level shifter circuits as follow

Figure 16: level matching circuit

To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect MODULE to

the RS-232-C interface, for example SP3238ECA, etc.

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User needs to use high speed transistors such as MMBT3904.

MODULE supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600,

115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. The default band rate is

115200bps.

NOTE

3.3.2 RI and DTR Behavior

The RI pin can be used to interrupt output signal to inform the host controller such as application CPU.

Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report coming,

and then it will change to low level.

Figure 17: RI behaviour（SMS and URC report）

Normally RI will be kept at a high level until a voice call, then it will output periodic rectangular wave with

5900ms low level and 100ms high level. It will output this kind of periodic rectangular wave until the call is

answered or hung up.

Figure 18 : RI behaviour（voice call）

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For more details of AT commands about UART, please refer to document [1] and [22].

NOTE

DTR pin can be used to wake MODULE from sleep. When MODULE enters sleep mode, pulling down DTR

can wake MODULE.

3.4USB Interface

The MODULE contains a USB interface compliant with the USB2.0 specification as a peripheral, but the

USB charging function is not supported.

MODULE can be used as a USB device. MODULE supports the USB suspend and resume mechanism

which can reduce power consumption. If there is no data transmission on the USB bus, MODULE will enter

suspend mode automatically, and will be resumed by some events such as voice call, receiving SMS, etc.

Figure 19: USB reference circuit

Because of the high bit rate on USB bus, more attention should be paid to the influence of the junction

capacitance of the ESD component on USB data lines. Typically, the capacitance should be less than 1pF. It

is recommended to use an ESD protection component such as ESD9L5.0ST5G provided by On

Semiconductor (www.onsemi.com ).

D3 is suggested to select the diode with anti-ESD and voltage surge function, or user could add a TVS for

surge clamping. The recommend TVS please refer to table 7.

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The USB_DN and USB_DP nets must be traced by 90Ohm+/-10% differential impedance.

SIMcom recommend add USB test pads on customer’s EVB board for Product Debug.

HSIC

USB2.0

Signal-ended signaling at 1.2 V

Differential signaling

Two signals – STROBE, DATA

Four wires – Ground, D+, D-, VBUS

Double data rate signaling

Data inferred from differential signaling

HS-USB 480 Mbps only

HS/FS/LS support

Maximum trace length of 10 cm

Maximum cable length of 5 m

No HS chirp protocol

HS chirp protocol

Lower power consumption (digital)

Higher power consumption (analog)

No concept of disconnect

Hot plug/play support

The module HSIC default work as HSIC to LAN function, if user have any other questions ,please

contact simcom for more details.

NOTE

3.5HSIC interface

HSIC is a 2-signal source synchronous serial interface which uses 240MHz DDR signaling to provide

High-Speed 480Mbps USB transfers which are 100% host driver compatible with traditional USB

cable-connected topologies. Full-Speed (FS) and Low-Speed (LS) USB transfers are not directly supported

by the HSIC interface (a HSIC enabled hub can provide FS and LS support, as well as IC_USB support)

The differences between HSIC and USB2.0 are listed below:

Table 11: Key differences between HSIC and HS-USB

module implements a HSIC interface compliant with the HSIC1.0 specification which can be used to

connect to the external IC.

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3.6SGMII Interface

MODULE provides a SGMII interface with an Ethernet MAC embedded, users could add a PHY to connect

to the Ethernet, and the PHY device could be controlled by the MDIO interface and other dedicated signals.

Two Ethernet PHY are supported: AR8031/AR8033 (Qualcomm) and BCM89820 (Broadcom). The

AR8031/AR8033 is used for the industrial field and the BCM89820 is dedicated for the automotive field.

Main features of SGMII:

 Ethernet Mac integrated in the module

IEEE 802.3 Ethernet 10/100/1000Mbps, SGMII IF

  Supports IEEE 1588, Precision Time Protocol (PTP)

Full duplex rated to 1 Gbps

  Half/full duplex for 10/100 Mbps  Can be connected to external Ethernet PHY like AR8031/AR8033(industrial 10/100/1000Mbps),

BCM89820(automotive 10/100Mbps)

 Uses 8B10B encoding of data with effective baud data rate of 1 Gbps, data rate is always 1.25 Gbps

(or DDR clock is always at 625 MHz)

Main features of MDIO:

Host mode only

  Dual voltage: 1.8 V or 2.85 V operation

Default signal frequency: 6.25MHz

  MDIO_DATA is OD-gate, and requires an external 1.5 kΩ pull-up resistor to VMDIO.

For the AR8031/AR8033, User should provide 3.3V to power the external Ethernet PHY system and the current should be more than 200mA.

3.6.1 Reference schematic with AR8033

Figure 20: Reference SGMII circuit with AR8033

For the BCM89820, Users should provide 3.3V and 1.2V to power the external Ethernet PHY system and the data interface of PHY. The current of 3.3V and 1.2V should be more than 100mA and 150mA.

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3.6.2 Reference schematic with BCM89820

The module SGMII function default closed. If user need, please contact SIMCom for more details or

refer to document [28]

Symbol

Parameter

Min.

Typ.

Max.

Unit

USIM_V DD

LDO power output voltage

1.75

1.8

1.95

V VIHHigh-level input voltage

0.65*USIM_VDD

USIM_VDD +0.3

VILLow-level input voltage

-0.300.35*USIM_VDD

VOHHigh-level output voltage

USIM_VDD -0.45

USIM_VDD

VOLLow-level output voltage

000.45

NOTE

Figure 21: Reference SGMII circuit with BCM89820

SIM7600G-H User manual

3.7USIM Interface

MODULE supports both 1.8V and 3.0V USIM Cards.

Table 12: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V)

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Table 13: USIM electronic characteristic 3.0V mode (USIM_VDD=2.95V)

Symbol

Parameter

Min.

Typ.

Max.

Unit

USIM_V DD

LDO power output voltage

2.75

2.95

3.05

V VIHHigh-level input voltage

0.65*USIM_VDD

USIM_VDD +0.3

VILLow-level input voltage

-0.300.25*USIM_VDD

VOHHigh-level output voltage

USIM_VDD -0.45

USIM_VDD

VOLLow-level output voltage

000.45

USIM_DATA has been pulled up with a 10KΩ resistor to USIM_VDD in MODULE. A 100nF capacitor on

USIM_VDD is used to reduce interference. For more details of AT commands about USIM, please refer

to document [1].USIM_CLK is very important signal, the rise time and fall time of USIM_CLK should be

less than 40ns, otherwise the USIM card might not be initialized correctly.

NOTE

3.7.1 USIM Application Guide

SIM7600G-H User manual

It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST

(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the USIM peripheral circuit

should be close to the USIM card socket. The following figure shows the 6-pin SIM card holder reference

circuit.

Figure 22: USIM interface reference circuit

The USIM_DET pin is used for detection of the USIM card hot plug in. User can select the 8-pin USIM card

holder to implement USIM card detection function.

The following figure shows the 8-pin SIM card holder reference circuit.

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Figure 23: USIM interface reference circuit with USIM_DET

If the USIM card detection function is not used, user can keep the USIM_DET pin open.

SIM card circuit is susceptible, the interference may cause the SIM card failures or some other situations,

so it is strongly recommended to follow these guidelines while designing:

Make sure that the SIM card holder should be far away from the antenna while in PCB layout.



SIM traces should keep away from RF lines, VBAT and high-speed signal lines.



The traces should be as short as possible.



Keep SIM holder’s GND connect to main ground directly.



Shielding the SIM card signal by ground.

  Recommended to place a 0.1～1uF capacitor on USIM_VDD line and keep close to the holder.

The rise/fall time of USIM_CLK should not be more than 40ns.



Add some TVS and the parasitic capacitance should not exceed 60pF.



Recommended USIM Card Holder

It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by Amphenol. User

can visit http://www.amphenol.com for more information about the holder.

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Figure 24: Amphenol SIM card socket

Signal

Description

USIM_VDD

USIM Card Power supply.

USIM_RST

USIM Card Reset.

USIM_CLK

USIM Card Clock.

GND

Connect to GND.

VPP

USIM_DATA

USIM Card data I/O.

For more details about PCM AT commands, please refer to document [1].

Characteristics

Specification

Line Interface Format

Linear(Fixed)

Data length

16bits(Fixed)

PCM Clock/Sync Source

Master Mode(Fixed)

PCM Clock Rate

2048 KHz (Fixed)

PCM Sync Format

Short sync(Fixed)

Data Ordering

MSB

NOTE

Table 14: Amphenol USIM socket pin description

3.8PCM Interface

SIM7600G-H User manual

MODULE provides a PCM interface for external codec, which can be used in master mode with short sync

and 16 bits linear format.

Table 15: PCM format

3.8.1 PCM timing

MODULE supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec.

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Figure 25: PCM_SYNC timing

Parameter

Description

Min.

Typ.

Max.

Unit

T(sync)

PCM_SYNC cycle time

–

125–μs

T(synch)

PCM_SYNC high level time

–

488–ns

T(syncl)

PCM_SYNC low level time

–

124.5

–

μs

T(clk)

PCM_CLK cycle time

–

488–ns

T(clkh)

PCM_CLK high level time

–

244–ns

T(clkl)

PCM_CLK low level time

–

244–ns

T(susync)

PCM_SYNC setup time high before falling edge of

PCM_CLK

–

244–ns

T(hsync)

PCM_SYNC hold time after falling edge of

PCM_CLK

–

244–ns

T(sudin)

PCM_IN setup time before falling edge of

PCM_CLK

60––

ns T(hdin)

PCM_IN hold time after falling edge of PCM_CLK

10––

T(pdout)

Delay from PCM_CLK rising to PCM_OUT valid

––60

Figure 26: EXT codec to MODULE timing

SIM7600G-H User manual

Table 16: PCM timing parameters

Figure 27: Module to EXT codec timing

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T(zdout)

Delay from PCM_CLK falling to PCM_OUT

HIGH-Z

–

160-ns

3.8.2 PCM Application Guide

Symbol

Parameter

Min.

Typ.

Max.

Unit

VIHHigh-level input voltage

0.65*2.85

2.85+0.3

VILLow-level input voltage

-0.300.25*2.85

VOHHigh-level output voltage

0.75*2.85

2.85

VOLLow-level output voltage

000.15*2.85

The following figure shows the external codec reference design.

SIM7600G-H User manual

Figure 28: Audio codec reference circuit

3.9SD Interface

MODULE provides a 4-bit SD/MMC/eMMC interface with clock rate up to 200 MHz.

When connected to a SD or MMC card, the voltage of SD interface is 1.8/2.85V, which is compatible with

Secure Digital Physical Layer Specification version 3.0 and SDIO Card Specification version 3.0.It supports

up to 128GB SD cards.

When connected to a eMMC card, the interface voltage will be a sigle 1.8V, which is compatible with eMMC

Specification, version 4.5. It supports up to 128GB eMMC cards.

Table 17: SD/MMC electronic characteristic as 2.85V (SD_DATA0-3，SD_CLK and SD_CMD)

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Symbol

Parameter

Min.

Typ.

Max.

Unit

VIHHigh-level input voltage

0.7*1.8

1.8+0.2

VILLow-level input voltage

-0.300.3*1.8

VOHHigh-level output voltage

1.8-0.4

1.8

VOLLow-level output voltage

000.45

Table 18: SD/MMC/eMMC electronic characteristic as 1.8V (SD_DATA0-3，SD_CLK and SD_CMD)

Users should provide 2.85V to power SD card system and the current should more than 350mA, which is showed below as VCC_SD. ESD/EMI components should be arranged beside SD card socket. Refer to the following application circuit.

Figure 29: SD reference circuit

Users should provide 2.85V to power eMMC card system and 1.8V to power the SDIO_DATA/CMD/CLK

signals. The source of 2.85V should be able to provide more than 500mA* which showed below as

VCC_eMMC, as the source of 1.8V should be able to provide more than 300mA* which showed below as

VCCQ_1V8. ESD/EMI components should be arranged close to the eMMC card. Refer to the following

application circuit.

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Figure 30: eMMC reference circuit

For the current of VCC_eMMC and VCCQ_1V8, users should better refer to the related datasheet of

eMMC which is used. The listed current of 500mA and 300mA are just for your reference.

NOTE

SIM7600G-H User manual

SD/MMC/eMMC card layout guide lines:

● Protect SD card signals from noisy signals (clocks, SMPS, etc.).

● Up to 200 MHz clock rate, 50 Ω nominal, ±10% trace impedance

● CLK to DATA/CMD length matching < 1 mm

● Total routing length < 50 mm

● Spacing to all other signals = 2x line width

● Bus capacitance < 10 pF

3.10 I2C Interface

MODULE provides a I2C interface compatible with I2C specification, version 5.0, with clock rate up to 400

kbps. Its operation voltage is 1.8V.

The following figure shows the I2C bus reference design.

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Figure 31: I2C reference circuit

SDA and SCL do not have pull-up resistors in MODULE. So, 2 external pull up resistors are needed in

application circuit.

“AT+CRIIC and AT+CWIIC” AT commands could be used to read/write register values of the I2C

peripheral devices. For more details about AT commands please refer to document [1].

Special software version for CAT4 MODULEs supports this function.

NOTE

SIM7600G-H User manual

3.11 SDIO Interface

MODULE provides a 4 bit 1.8V SDIO interface for WLAN solution with W58 module.

The SDIO interface can be used for WLAN solution.

3.12 SPI Interface

Module provides a SPI interface as a master only. It provides a duplex, synchronous, serial communication

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SIM7600G-H User manual

For more details of the AT commands about the SPI, please refer to document [1].

The value of the resistor named “R” depends on the LED characteristic.

NETLIGHT pin status

Module status

Always On

Searching Network; Call Connect(include VOLTE,SRLTE)

NOTE

link with peripheral devices. Its operation voltage is 1.8V, with clock rates up to 50 MHz

3.13 Network status

The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the following

figure.

Figure 32: NETLIGHT reference circuit

Table 19: NETLIGHT pin status

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SIM7600G-H User manual

200ms ON, 200ms OFF

Data Transmit; 4G registered;

800ms ON, 800ms OFF

2G/3G registered network

OFF

Power off ;Sleep

NETLIGHT output low level as “OFF”, and high level as “ON”.

FLIGHTMODE pin status

Module operation

Input Low Level

Flight Mode: RF is closed

Input High Level

AT+CFUN=0: RF is closed AT+CFUN=1:RF is working

NOTE

3.14 Flight Mode Control

The FLIGHTMODE pin can be used to control MODULE to enter or exit the Flight mode. In Flight mode, the

RF circuit is closed to prevent interference with other equipments and minimize current consumption.

Bidirectional ESD protection component is suggested to add on FLIGHTMODE pin, its reference circuit is

shown in the following figure.

Figure 33: Flight mode switch reference circuit

Table 20: FLIGHTMODE pin status

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SIM7600G-H User manual

Symbol

Description

Min.

Typ.

Max.

Unit

ISINK

Voltage tolerant

0.5-VBAT

ISINK

Current tolerant

0-40

The sinking current can be adjusted to meet the design requirement through the AT command “AT+

CLEDITST =<0>, <value>”.The “value” ranges from 0 to 8, on behalf of the current from 0mA to 40mA

by 5mA step.

NOTE

3.15 Other interface

3.15.1 Sink Current Source

The ISINK pin is VBAT tolerant and intended to drive some passive devices, such as LCD backlight and

white LED, etc. Its output current can be up to 40mA and be set by the AT command “AT+ CLEDITST”.

Table 21: Sink current electronic characteristic

ISINK is a ground-referenced current sink. The following figure shows its reference circuit.

Figure 34: ISINK reference circuit

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Characteristics

Min.

Typ.

Max.

Unit

Resolution

–15–

Bits

Conversion time

–

442–ms

Input Range

0.1

1.7

Input serial resistance

1––

MΩ

“AT+CADC” and “AT+CADC2” can be used to read the voltage of the ADC1 and ADC2 pins, for more

details, please refer to document [1].

Symbol

Description

Min.

Typ.

Max.

Unit

VDD_AUX

Output voltage

1.7

2.85

3.05

IOOutput current

--150

For more details of AT commands about VDD_AUX, please refer to document [1].

NOTE

3.15.2 ADC

MODULE has 2 dedicated ADC pins named ADC1 and ADC2.They are available for digitizing analog

signals such as battery voltage and so on. These electronic specifications are shown in the following table.

Table 22: ADC1 and ADC2 electronic characteristics

3.15.3 LDO

MODULE has a LDO power output, named VDD_AUX. its output voltage is 2.85V by default, Users can

switch the LDO on or off by the AT command “AT+CVAUXS” and configure its output voltage by the AT

command “AT+CVAUXV”.

Table 23: Electronic characteristic

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4 RF Specifications

Frequency

Power

Min.

LTE-FDD B2

23dBm +/-2.7dB

<-40dBm

LTE-FDD B4

23dBm +/-2.7dB

<-40dBm

LTE-FDD B5

23dBm +/-2.7dB

<-40dBm

LTE-FDD B12

23dBm +/-2.7dB

<-40dBm

LTE-FDD B13

23dBm +/-2.7dB

<-40dBm

LTE-FDD B25

23dBm +/-2.7dB

<-40dBm

LTE-FDD B26

23dBm +/-2.7dB

<-40dBm

LTE-FDD B66

23dBm +/-2.7dB

<-40dBm

LTE-TDD B41

23dBm +/-2.7dB

<-40dBm

Frequency

Receiving

Transmission

The LTE Operating frequencies are shown in the following table 24. Note: Operating frequencies of LTE TDD B41 for the MODULE is 200MHz BW, 2496～ 2690 MHz

GPS

1574.4 ～1576.44 MHz

GLONASS

1598 ～1606 MHz

1559 ～1563 MHz

E-UTRA Operating Band

Uplink (UL) operating band

Downlink (DL) operating band

Duplex Mode

4.1. GSM/UMTS/LTE RF Specifications

Table 24: Conducted transmission power

SIM7600G-H User manual

Table 25: Operating frequencies

Table 26: E-UTRA operating bands

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1850~1910 MHz

1930~1990 MHz

FDD

1710~1755MHz

2110~2155MHz

FDD

824～849 MHz

869～894MHz

FDD

699~716MHz

728~746MHz

FDD

777~787MHz

746~757MHz

FDD

1850~1915MHz

1930~1995MHz

FDD

814~849MHz

859~894MHz

FDD

1710~1780MHz

2110~2200MHz

FDD

2496~2696 MHz

TDD

Table 27: Conducted receive sensitivity

Frequency

Receive sensitivity(Typical)

Receive sensitivity(MAX)

LTE FDD/TDD

See table 26.

3GPP

E-UTR A band

1.4 MHz Standar d

3 MHz Standar d

5 MHz Standar d

10 MHz Standar d

15 MHz Standard

20 MHz Standar d

Duplex Mode

-102.7

-99.7

-98

-95

-93.2

-92

FDD

-104.7

-101.7

-100

-97

-95.2

-94

FDD

-103.2

-100.2

-98

-95

FDD

-101.7

-98.7

-97

-94

FDD

-97

-94

FDD

-101.2

-98.2

-96.5

-93.5

-91.7

-90.5

FDD

-102.7

-99.7

-97.5

-94.5

-92.7

FDD

-104.7

-101.7

-100

-97

-95.2

-94

FDD

41--

-99

-96

-94.2

-93

TDD

Frequency

Loss

SIM7600G-H User manual

Table 28: Reference sensitivity (QPSK)

4.2. LTE Antenna Design Guide

Users should connect antennas to MODULE’s antenna pads through micro-strip line or other types of RF

trace and the trace impedance must be controlled in 50Ω. SIMCom recommends that the total insertion loss

between the antenna pads and antennas should meet the following requirements:

Table 29: Trace loss

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SIM7600G-H User manual

700MHz-960MHz

<0.5dB

1710MHz-2170MHz

<0.9dB

2300MHz-2650MHz

<1.2dB

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit

should be added. The following figure is the recommended circuit.

Figure 35: Antenna matching circuit (MAIN_ANT)

In above figure, the components R1, C1, C2 and R2 are used for antenna matching, the values of

components can only be achieved after the antenna tuning and usually provided by antenna vendor. By

default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component D1 is a TVS

for ESD protection, and it is optional for users according to application environment.

The RF test connector is used for the conducted RF performance test, and should be placed as close as to

the MODULE’s MAIN_ANT pin. The traces impedance between MODULE and antenna must be controlled

in 50Ω.

In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4 are

0Ωresistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is optional for

users according to application environment.

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Figure 36: Antenna matching circuit (AUX_ANT)

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Two TVS are recommended in the table below.

Package

Part Number

Vender

0201

LXES03AAA1-154

Murata

0402

LXES15AAA1-153

Murata

SIMCom suggests the LTE auxiliary antenna to be kept on, since there are many high bands in the

designing of LTE-TDD, such as band41. Because of the high insert loss of the RF cable and layout

lines, the receiver sensitivity of these bands above will have risk to meet the authentication without the

diversity antenna. For more details about auxiliary antenna design notice, please refer to document

[25].

NOTE

Table 30: Recommended TVS

SIM7600G-H User manual

4.3. GNSS

MODULE merges GNSS (GPS/GLONASS/BD) satellite and network information to provide a

high-availability solution that offers industry-leading accuracy and performance. This solution performs well,

even in very challenging environmental conditions where conventional GNSS receivers fail, and provides a

platform to enable wireless operators to address both location-based services and emergency mandates.

4.3.1 GNSS Technical specification

Tracking sensitivity: -159 dBm（GPS）/-158 dBm（GLONASS）/-159 dBm（BD）



 Cold-start sensitivity: -148 dBm

 Accuracy (Open Sky): 2.5m (CEP50)

 TTFF (Open Sky) : Hot start <1s, Cold start<35s

 Receiver Type: 16-channel, C/A Code

 GPS L1 Frequency: 1575.42±1.023MHz

 GLONASS: 1597.5~1605.8 MHz

 BD: 1559.05~1563.14 MHz

 Update rate: Default 1 Hz

 GNSS data format: NMEA-0183

 GNSS Current consumption : 100mA (GSM/UMTS/LTE Sleep ,in total on VBAT pins)

 GNSS antenna: Passive/Active antenna

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If the antenna is active type, the power should be given by main board because there is no power

supply on the GPS antenna pad. If the antenna is passive, it is suggested that the external LNA should

be used.

4.3.2 GNSS Application Guide

Users can adopt an active antenna or a passive antenna to MODULE. If using a passive antenna, an

external LNA is a must to get better performance.

The following figures are the reference circuits.

Figure 37: Active antenna circuit

Figure 38: Passive antenna circuit (Default)

In above figures, the components C1, L1 and L2 are used for antenna matching. Usually, the values of the

components can only be achieved after antenna tuning and usually provided by antenna vendor. C2 is used

for DC blocking. L3 is the matching component of the external LNA, and the value of L3 is determined by

the LNA characteristic and PCB layout. Both VDD of active antenna and V_LNA need external power

supplies which should be considered according to active antenna and LNA characteristic. LDO/DCDC is

recommended to get lower current consuming by shutting down active antennas and LNA when GNSS is

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SIM7600G-H User manual

GNSS is closed by default and can be started by AT+CGPS. The AT command has two parameters, the

first is on/off, and the second is GNSS mode. Default mode is standalone mode.

AGPS mode needs more support from the mobile telecommunication network. Please refer to

document [24] for more details.

NOTE

not working.

GNSS can be tested by NMEA port. NMEA sentences can be obtained through UART or USB automatically.

NMEA sentences include GSV, GGA, RMC, GSA, and VTG. Before using GNSS, user should configure

MODULE in proper operating mode by AT command. Please refer to related documents for details.

MODULE can also get position location information through AT directly.

Note: GNSS is closed by default and can be started by AT+CGPS. The AT command has two parameters,

the first is on/off, and the second is GNSS mode. Default mode is standalone mode.

AGPS mode needs more support from the mobile telecommunication network. Please refer to document

[24] for more details.

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SIM7600G-H User manual

Parameter

Min.

Typ.

Max.

Unit

Voltage at VBAT

-0.5-6.0

Voltage at USB_VBUS

-0.5-5.85

Voltage at digital pins (RESET,SPI,Keypad,GPIO,I2C,UART,PCM)

-0.3-2.1

V Voltage at digital pins (SD,USIM)

-0.3-3.05

Voltage at PWRKEY

-0.3-1.8

Parameter

Min.

Typ.

Max.

Unit

Voltage at VBAT

3.4

3.8

4.2

Voltage at USB_VBUS

3.0

5.0

5.25

Parameter

Description

Min.

Typ.

Max.

Unit

VIHHigh-level input voltage

1.17

1.8

2.1

VILLow-level input voltage

-0.300.63

VOHHigh-level output voltage

1.35

1.8VVOLLow-level output voltage

0-0.45

5 Electrical Specification

5.1 Absolute maximum ratings

Absolute maximum rating for digital and analog pins of MODULE are listed in the following table:

Table 31: Absolute maximum ratings

5.2 Operating conditions

Table 32: Recommended operating ratings

Table 33: 1.8V Digital I/O characteristics*

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High-level output current(no pull down resistor)

-2-

Low-level output current(no pull

up resistor)

--2-

Input high leakage current (no pull down resistor)

--1

Input low leakage current(no pull up resistor)

-1--

These parameters are for digital interface pins, such as SPI, GPIOs (NETLIGHT, FLIGHTMODE,

STATUS, USIM_DET, SD_DET), SDIO, I2C, UART, PCM, COEXn, and BOOT_CFG0.

The operating temperature of MODULE is listed in the following table.

Parameter

Min.

Typ.

Max.

Unit

Normal operation temperature

-302580

℃

Extended operation temperature*

-402585

℃

Storage temperature

-4525+90

℃

Module is able to make and receive voice calls, data calls, SMS and make GSM/ UMTX/LTE traffic in

-40 ℃ ~ +85 ℃ . The performance will be reduced slightly from the 3GPP specifications if the

temperature is outside the normal operating temperature range and still within the extreme operating

temperature range.

NOTE

SIM7600G-H User manual

Table 34: Operating temperature

5.3 Operating Mode

5.3.1. Operating Mode Definition

The table below summarizes the various operating modes of MODULE product.

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Table 35: Operating mode Definition

Mode

Function

Normal operation

LTE Sleep

In this case, the current consumption of MODULE will be reduced to

the minimal level and the MODULE can still receive paging message

and SMS.

LTE Idle

Software is active. Module is registered to the network, and the

MODULE is ready to communicate.

LTE Talk

Connection between two subscribers is in progress. In this case, the

power consumption depends on network settings such as DTX off/on,

FR/EFR/HR, hopping sequences, and antenna.

LTE Standby

Module is ready for data transmission, but no data is currently sent or

received. In this case, power consumption depends on network

settings.

LTE Data transmission

There is data transmission in progress. In this case, power

consumption is related to network settings (e.g. power control level);

uplink/downlink data rates, etc.

Minimum functionality mode

AT command “AT+CFUN=0” AT+CSCLK=1 can be used to set the

MODULE to a minimum functionality mode without removing the power

supply. In this mode, the RF part of the MODULE will not work and the

USIM card will not be accessible, but the serial port and USB port are

still accessible. The power consumption in this mode is lower than

normal mode.

Flight mode

AT command “AT+CFUN=4” or pulling down the FLIGHTMODE pin

can be used to set the MODULE to flight mode without removing the

power supply. In this mode, the RF part of the MODULE will not work,

but the serial port and USB port are still accessible. The power

consumption in this mode is lower than normal mode.

Power off

Module will go into power off mode by sending the AT command

“AT+CPOF” or pull down the PWRKEY pin, normally. In this mode the

power management unit shuts down the power supply, and software is

not active. The serial port and USB are is not accessible.

SIM7600G-H User manual

5.3.2. Sleep mode

In sleep mode, the current consumption of MODULE will be reduced to the minimal level, and MODULE can

still receive paging message and SMS.

Several hardware and software conditions must be satisfied together in order to let MODULE enter into

sleep mode:

1. UART condition

2. USB condition

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Before designing, pay attention to how to realize sleeping/waking function and refer to Document [26]

for more details.

GNSS

GNSS supply current

(AT+CFUN=0,with USB connection)

@ -140dBm，Tracking Typical:38ma

LTE sleep/idle mode

LTE supply current (GNSS off，without USB connection)

Sleep mode Typical: 2.04ma Idle mode Typical: 17.3ma

NOTE

3. Software condition

5.3.3. Minimum functionality mode and Flight mode

Minimum functionality mode ceases a majority function of MODULE, thus minimizing the power

consumption. This mode is set by the AT command which provides a choice of the functionality levels.

● AT+CFUN=0: Minimum functionality

● AT+CFUN=1: Full functionality (Default)

● AT+CFUN=4: Flight mode

If MODULE has been set to minimum functionality mode, the RF function and USIM card function will be

closed. In this case, the serial port and USB are still accessible, but RF function and USIM card will be

unavailable.

If MODULE has been set to flight mode, the RF function will be closed. In this case, the serial port and USB

are still accessible, but RF function will be unavailable.

When MODULE is in minimum functionality or flight mode, it can return to full functionality by the AT

command “AT+CFUN=1”.

5.4 Current Consumption

The current consumption is listed in the table below.

Table 36: Current consumption on VBAT Pins (VBAT=3.8V)

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LTE data

LTE-FDD B2

@5MHz 22.1dBm Typical: 676 ma @10MHz 22.4dBm Typical: 723 ma @20MHz 22.3dBm Typical: 759 ma

LTE-FDD B4

@5MHz 22.0dBm Typical: 709 ma @10MHz 22.1dBm Typical:769 ma @20MHz 22.6dBm Typical: 896 ma

LTE-FDD B5

@5MHz 22.2dBm Typical: 619 ma @10MHz 22.1dBm Typical: 628 ma

LTE-FDD B12

@5MHz 22.7dBm Typical: 600 ma @10MHz 22.7dBm Typical: 607 ma

LTE-FDD B13

@5MHz 21.9dBm Typical: 685 ma @10MHz 22.0dBm Typical: 653 ma

LTE-FDD B25

@5MHz 22dBm Typical: 634 ma @10MHz 22dBm Typical: 702 ma @20MHz 22dBm Typical: 781 ma

LTE-FDD B26

@5MHz 22.4dBm Typical: 615 ma @10MHz 22.7dBm Typical:664 ma @15MHz 22.3dBm Typical:713 ma

LTE-FDD B66

@5MHz 22dBm Typical: 707ma @10MHz 22dBm Typical: 728ma @20MHz 22dBm Typical: 795 ma

LTE-TDD B41

@5MHz 21.6dBm Typical:803 ma @10MHz 21.7dBm Typical: 771 ma @20MHz 21.7dBm Typical: 793 ma

Part

Contact discharge

Air discharge

VBAT,GND

+/-5K

+/-10K

Antenna port

+/-4K

+/-8K

Other PADs

+/-0.5K

+/-1K

5.5 ESD Notes

MODULE is sensitive to ESD in the process of storage, transporting, and assembling. When MODULE is

mounted on the users’ mother board, the ESD components should be placed beside the connectors which

human body may touch, such as USIM card holder, audio jacks, switches, keys, etc. The following table

shows the MODULE ESD measurement performance without any external ESD component.

Table 37: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)

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6 SMT Production Guide

The above is the design effect diagram of the module for reference. The actual appearance is subject to

the actual product.

NOTE

6.1 Top and Bottom View of MODULE

SIM7600G-H User manual

Figure 39: Top and bottom view of MODULE

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6.2 Label Information

No.

Description

LOGO

Module part number

Project name

Serial number

International mobile equipment identity

SIM7600G-H User manual

Figure 40: Label information

Table 38: The description of label information

6.3 Typical SMT Reflow Profile

SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only a generic

recommendation and should be adjusted to the specific application and manufacturing constraints.

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For more details about secondary SMT, please refer to the document [21].

Moisture Sensitivity Level (MSL)

Floor Life (out of bag) at factory ambient≤30°C/60% RH or as stated

Unlimited at ≦30℃/85% RH 2

1 year

4 weeks

168 hours

72 hours

48 hours

24 hours

Mandatory bake before use. After bake, it must be reflowed within the

time limit specified on the label.

NOTE

Figure 41: The ramp-soak-spike reflow profile of MODULE

6.4 Moisture Sensitivity Level (MSL)

MODULE is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033. If the

prescribed time limit is exceeded, users should bake MODULE for 192 hours in drying equipment (<5% RH)

at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not heat-resistant, and only can be baked at

45° C.

Table 39: Moisture Sensitivity Level and Floor Life

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IPC / JEDEC J-STD-033 standard must be followed for production and storage.

6.5 Stencil Foil Design Recommendation

The recommended thickness of stencil foil is more than 0.15mm.

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7 Packaging

Length（±3mm

）

Width（±3mm

）

Number

MODULE support tray packaging.

SIM7600G-H User manual

Figure 42 : Stencil Foil

Module tray drawing：

Figure 43: packaging diagram

Table 40: Tray size

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Figure 44: Tray drawing

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242.0

161.0

Small carton drawing：

Length（±10mm

）

Width（±10mm

）

Height（±10mm

）

Number

270

180

120

15*20=300

SIM7600G-H User manual

Table 41: Small Carton size

Big carton drawing：

Figure 45: Small carton drawing

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SIM7600G-H User manual

Length（±10mm

）

Width（±10mm

）

Height（±10mm

）

Number

380

280

300*4=1200

Table 42: Big Carton size

Figure 46: Big carton drawing

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SIM7600G-H User manual

LTE-FDD device category (Downlink)

Max data rate（peak

）

Modulation type

Category 1

10Mbps

QPSK/16QAM/64QAM

Category 2

50Mbps

QPSK/16QAM/64QAM

Category 3

100Mbps

QPSK/16QAM/64QAM

Category 4

150Mbps

QPSK/16QAM/64QAM

LTE-FDD device category (Uplink)

Max data rate（peak

）

Modulation type

Category 1

5Mbps

QPSK/16QAM

Category 2

25Mbps

QPSK/16QAM

Category 3

50Mbps

QPSK/16QAM

Category 4

50Mbps

QPSK/16QAM

NO.

Title

Description

[1]

SIM7500_SIM7600 Series_AT Command Manual_V1.xx

AT Command Manual

[2]

ITU-T Draft new recommendationV.25ter

Serial asynchronous automatic dialing and control

[3]

GSM 07.07

Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME)

[4]

GSM 07.10

Support GSM 07.10 multiplexing protocol

[5]

GSM 07.05

Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment – Data Circuit terminating Equipment (DTE – DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

8 Appendix

8.1 Coding Schemes and Maximum Net Data Rates over Air Interface

Table 43: Coding Schemes and Maximum Net Data Rates over Air Interface

8.2 Related Documents

Table 44: Related Documents

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SIM7600G-H User manual

[6]

GSM 11.14

Digital cellular telecommunications system (Phase 2+); Specification of the SIM Application Toolkit for the Subscriber Identity Module – Mobile Equipment (SIM – ME) interface

[7]

GSM 11.11

Digital cellular telecommunications system (Phase 2+); Specification of the Subscriber Identity Module – Mobile Equipment (SIM – ME) interface

[8]

GSM 03.38

Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information

[9]

GSM 11.10

Digital cellular telecommunications system (Phase 2) ； Mobile Station (MS) conformance specification ； Part 1: Conformance specification

[10]

3GPP TS 51.010-1

Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification

[11]

3GPP TS 34.124

Electromagnetic Compatibility (EMC) for mobile terminals and

ancillary equipment.

[12]

3GPP TS 34.121

Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.

[13]

3GPP TS 34.123-1

Technical Specification Group Radio Access Network; Terminal conformance specification; Radio transmission and reception (FDD)

[14]

3GPP TS 34.123-3

User Equipment (UE) conformance specification; Part 3: Abstract Test Suites.

[15]

Radio

ETSI EN 301 908-1 V13.1.1 (2019); ETSI EN 301 908-2 V13.1.1(2020);ETSI EN 301 908-13 V13.1.1(2019); ETSI EN303 413V1.1.1(2017)

[16]

EMC

ETSI EN 301 489-1 V2.2.3 (2019);EN 301 489-52 V1.1.0 (2016); ETSI EN301 489-19V2.1.1(2019)

[17]

Safety

EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013

[18]

Health

EN 62311:2008

[19]

3GPP TS 51.010-1

Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification

[20]

GCF-CC V3.23.1

Global Certification Forum - Certification Criteria

[21]

2002/95/EC

Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)

[22]

Module secondary-SMT-UGD-V1.xx

Module secondary SMT Guidelines

[23]

SIM7X00 Series_UART_Application Note_V1.xx

This document describes how to use UART interface of SIMCom modules.

[24]

SIM7100_SIM7500_SIM7600

Series_USB

AUDIO_Application

Note_V1.xx

USB AUDIO Application Note [25]

SIM7X00 Series_GPS_Application Note_V1.xx

GPS Application Note [26]

Antenna design guidelines for diversity receiver system

[27]

SIM7100_SIM7500_SIM7600_ Sleep Mode_Application Note_V1.xx

Sleep Mode Application Note [28]

7600CE-LAN-Reference

HSIC Application Note

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Design V1.0

[29]

SIM7600_Series_SGMII-Refer ence_Design_V1.00

SGMII Reference Design

8.3 Terms and Abbreviations

Abbreviation

Description

ADC

Analog-to-Digital Converter

ARP

Antenna Reference Point

BER

Bit Error Rate

BTS

Base Transceiver Station

Coding Scheme

CSD

Circuit Switched Data

CTS

Clear to Send

DAC

Digital-to-Analog Converter

DRX

Discontinuous Reception

DSP

Digital Signal Processor

DTE

Data Terminal Equipment (typically computer, terminal, printer)

DTR

Data Terminal Ready

DTX

Discontinuous Transmission

EFR

Enhanced Full Rate

EGSM

Enhanced GSM

EMC

Electromagnetic Compatibility

ESD

Electrostatic Discharge

ETS

European Telecommunication Standard

EVDO

Evolution Data Only

FCC

Federal Communications Commission (U.S.)

SIM fix dialing phonebook

FDMA

Frequency Division Multiple Access

Full Rate

GMSK

Gaussian Minimum Shift Keying

GNSS

Global Navigation Satellite System

GPRS

General Packet Radio Service

GPS

Global Positioning System

GSM

Global Standard for Mobile Communications

Half Rate

HSPA

High Speed Packet Access

I2C

Inter-Integrated Circuit

IMEI

International Mobile Equipment Identity

Table 45: Terms and Abbreviations

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SIM7600G-H User manual

LTE

Long Term Evolution

Mobile Originated

Mobile Station (GSM engine), also referred to as TE

Mobile Terminated

NMEA

National Marine Electronics Association

PAP

Password Authentication Protocol

PBCCH

Packet Switched Broadcast Control Channel

PCB

Printed Circuit Board

PCS

Personal Communication System, also referred to as GSM 1900

Radio Frequency

RMS

Root Mean Square (value)

RTC

Real Time Clock

SIM

Subscriber Identification Module

SMS

Short Message Service

SPI

serial peripheral interface

SMPS

Switched-mode power supply

TDMA

Time Division Multiple Access

Terminal Equipment, also referred to as DTE

Transmit Direction

UART

Universal Asynchronous Receiver & Transmitter

VSWR

Voltage Standing Wave Ratio

SIM phonebook

Not connect

EDGE

Enhanced data rates for GSM evolution

HSDPA

High Speed Downlink Packet Access

HSUPA

High Speed Uplink Packet Access

ZIF

Zero intermediate frequency

WCDMA

Wideband Code Division Multiple Access

VCTCXO

Voltage control temperature-compensated crystal oscillator

USIM

Universal subscriber identity module

UMTS

Universal mobile telecommunications system

UART

Universal asynchronous receiver transmitter

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8.4 Safety Caution

Marks

Requirements

When in a hospital or other health care facility, observe the restrictions about the use

of mobiles. Switch the cellular terminal or mobile off, medical equipment may be

sensitive and not operate normally due to RF energy interference.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is

switched off. The operation of wireless appliances in an aircraft is forbidden to prevent

interference with communication systems. Forgetting to think much of these

instructions may impact the flight safety, or offend local legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable gases or

fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,

chemical plants or where blasting operations are in progress. Operation of any

electrical equipment in potentially explosive atmospheres can constitute a safety

hazard.

Your cellular terminal or mobile receives and transmits radio frequency energy while

switched on. RF interference can occur if it is used close to TV sets, radios,

computers or other electric equipment.

Road safety comes first! Do not use a hand-held cellular terminal or mobile when

driving a vehicle, unless it is securely mounted in a holder for hands free operation.

Before making a call with a hand-held terminal or mobile, park the vehicle.

GSM cellular terminals or mobiles operate over radio frequency signals and cellular

networks and cannot be guaranteed to connect in all conditions, especially with a

mobile fee or an invalid SIM card. While you are in this condition and need emergent

help, please remember to use emergency calls. In order to make or receive calls, the

cellular terminal or mobile must be switched on and in a service area with adequate

cellular signal strength.

Some networks do not allow for emergency call if certain network services or phone

features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate

those features before you can make an emergency call.

Also, some networks require that a valid SIM card be properly inserted in the cellular

terminal or mobile.

Table 46: Safety Caution

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Antenna requirements

Antenna List: Type: Dipole antenna with non-standard SMA connector(50ohm);

Model: MF25D

Antenna Gain: Band 2:1.87dBi, Band 4:3.12dBi, Band 5:0.91dBi, Band 12:0.95dBi, Band13:2.23dBi, Band 25:1.87dBi, Band 26:0.91dBi, Band 41:2.9dBi, Band 66:3.12dBi

The user must match the MF25D antenna with the non-standard SMA

connector and cannot change the antenna.

This device is intended only for OEM integrators under the following conditions: (For module device use)

The antenna must be installed such that 20 cm is maintained between the

antenna and users, and

The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their endproduct for any additional compliance requirements required with this module installed.

Radiation Exposure Statement

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module)

1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs, et

2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.

Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition aux rayonnements ISED établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps.

FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the

following two conditions:

(1)

This device may not cause harmful interference, and

(2)

this device must accept any interference received, including interference that

may cause undesired operation.

Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device.

FCC Radiation Exposure Statement This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2AJYU-8PYA007 Or Contains FCC ID: 2AJYU-8PYA007”

When the module is installed inside another device, the user manual of the host must contain below warning statements;

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions:

(1)

This device may not cause harmful interference.

(2)

This device must accept any interference received, including interference that

may cause undesired operation.

Changes or modifications not expressly approved by the party responsible

for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product.

Any company of the host device which install this modular with limit modular approval should perform the test of radiated emissionand spurious emission according to FCC Part 22H and 24E, 47 CFR Part 2, 22H, 24(E), 27 and 47 CFR Part 2, 22H, 24(E), 27, 90 requirement,Only if the test result comply with FCC Part 22H and 24E, 47 CFR Part 2, 22H, 24(E), 27 and 47 CFR Part 2,22H, 24(E), 27, 90 requirement, then the host can be sold legally.

IC Warning

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:

(1)

This device may not cause interference, and

(2)

This device must accept any interference, including interference that may cause

undesired operation of the device.

The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device.

IC Radiation Exposure Statement This modular complies with IC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

For a host manufacture's using a certified modular, if (1) the module's IC number is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the IC number of the module is visible; then an additional permanent label referring to the enclosed module: "Contains Transmitter Module IC: " 237618PYA008" or "Contains IC: 23761-8PYA008" must be used.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement

Le modular peut être installé ou intégré dans un mobile ou réparer une seule chose Installation dans n’importe quel appareil portable.

Déclaration de rayonnement IC Ce modular complies avec des radiations émettrices de rayonnement Environnement. Ceci ne doit pas être co-localisé ou opérer avec des autres Ce modular doit être installé et obtenu avec une distance minimale de 20 cm entre les radiateurs et le corps de l’utilisateur. Pour un hôte, on utilise un modular, si (1) le numéro de module est non visible Quand on est installé dans le serveur, or (2) si le propriétaire est commercialisé Straightforward commonly used for the access to remove travail so that the number IC en vue Le module est visible; Ensuite, le label permanent a été attribué au module: "Contient le Module IC:" 23761-8PYA008" ou "contenu IC: 23761-8PYA008" doit" be use

SIMCom SIM7600G-H User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Version History

Contents

Table Index

Figure Index

1 Introduction

1.1 Product Outline

1.2 Hardware Interface Overview

1.3 Functional Overview

2 Package Information

2.1 Pin Assignment Overview

2.2 Pin Description

2.3 Mechanical Information

2.4 Footprint Recommendation

3 Interface Application

3.1Power Supply

3.1.1 Power Supply Design Guide

3.1.2 Recommended Power Supply Circuit

3.1.3 Voltage Monitor

3.2Power on/Power off/Reset Function

3.2.1 Power on

3.2.2 Power off

3.2.3 Reset Function

3.3UART Interface

3.3.1 UART Design Guide

3.3.2 RI and DTR Behavior

3.4USB Interface

3.5HSIC interface

3.6SGMII Interface

3.6.1 Reference schematic with AR8033

3.6.2 Reference schematic with BCM89820

3.7USIM Interface

3.7.1 USIM Application Guide

3.8PCM Interface

3.8.1 PCM timing

3.8.2 PCM Application Guide

3.9SD Interface

3.10 I2C Interface

3.11 SDIO Interface

3.12 SPI Interface

3.13 Network status

3.14 Flight Mode Control

3.15 Other interface

3.15.1 Sink Current Source

3.15.2 ADC

3.15.3 LDO

4 RF Specifications

4.1. GSM/UMTS/LTE RF Specifications

4.2. LTE Antenna Design Guide

4.3. GNSS

4.3.1 GNSS Technical specification

4.3.2 GNSS Application Guide

5 Electrical Specification

5.1 Absolute maximum ratings

5.2 Operating conditions

5.3 Operating Mode

5.3.1. Operating Mode Definition

5.3.2. Sleep mode

5.3.3. Minimum functionality mode and Flight mode

5.4 Current Consumption

5.5 ESD Notes

6 SMT Production Guide

6.1 Top and Bottom View of MODULE

6.2 Label Information

6.3 Typical SMT Reflow Profile

6.4 Moisture Sensitivity Level (MSL)

6.5 Stencil Foil Design Recommendation

7 Packaging

8 Appendix

8.2 Related Documents

8.3 Terms and Abbreviations

8.4 Safety Caution