SimCom SIM7020C, SIM7020E, SIM7020 Series Hardware Design

SIM7020 _Hardware Design_V1.02
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Document Title
Date
Status
Document Control ID
SIM7020 _Hardware Design
1.02
2018-07-25
Release
SIM7020 _ Hardware Design_V1.02
General Notes
SIMCom offers this information as a service to its customers to support the application and
engineering efforts that use the products designed by SIMCom. The information provided is based
on the requirements specifically from the customers. SIMCom has not undertaken any independent
search for additional relevant information, including any information that may be in the customer’s
possession. Furthermore, the system validation of the product designed by SIMCom within a larger
electronic system remains the responsibility of the customer or the customer’s system integrator.
All specifications supplied herein are subject to change without notice.
Copyright
This document contains the proprietary technical information which is the property of SIMCom
Limited, copying of this document, giving it to others, the using or communication of the contents
thereof are forbidden without the official authority by SIMCom. Offenders are liable to the
payment of the damages. All rights are reserved in the event of grant of a patent or the registration
of a utility model or design. All specifications supplied herein are subject to change without notice
Copyright © SIMCom Wireless Solutions Co., Ltd. 2018
SIM7020_Hardware_Design_V1.02 1 2018-07-25
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Contents

Contents .............................................................................................................................................2
Table Index ........................................................................................................................................4
Figure Index ......................................................................................................................................5
1 Introduction ................................................................................................................................7
1.1 Product Outline .....................................................................................................................7
1.2 Hardware Interface Overview ...............................................................................................7
1.3 Hardware Block Diagram......................................................................................................7
1.4 Functional Overview .............................................................................................................8
2 Package Information................................................................................................................10
2.1 Pin Assignment Overview ...................................................................................................10
2.2 Pin Description .................................................................................................................... 11
2.3 Mechanical Information ......................................................................................................14
2.4 Footprint Recommendation .................................................................................................15
3 Interface Application ...............................................................................................................16
3.1 Power Supply ......................................................................................................................16
3.2 Power Supply Design Guide ...............................................................................................16
3.3 Voltage Monitor...................................................................................................................17
3.4 Power on/Power off/Reset Function ....................................................................................17
3.4.1 Power on .......................................................................................................................17
3.4.2 Power off ......................................................................................................................19
3.4.3 Reset Function ..............................................................................................................20
3.5 UART Interface ...................................................................................................................21
3.5.1 UART Design Guide ....................................................................................................21
3.5.2 RI and DTR Behavior ...................................................................................................23
3.6 USB Interface ......................................................................................................................23
3.7 SIM Interface ......................................................................................................................24
3.7.1 SIM Application Guide ................................................................................................24
3.7.2 Recommended SIM Card Holder .................................................................................25
3.8 Network status .....................................................................................................................26
3.9 ADC ....................................................................................................................................26
3.10 Power Supply Output .......................................................................................................27
4 RF Specifications ......................................................................................................................29
4.1 LTE RF Specifications ........................................................................................................29
4.2 LTE Antenna Design Guide ................................................................................................30
4.3 RF traces note ......................................................................................................................31
4.3.1 RF traces layout ............................................................................................................31
4.3.2 LTE ANT and other system ANT decoupling ..............................................................33
5 Electrical Specifications ...........................................................................................................34
5.1 Absolute maximum ratings .................................................................................................34
5.2 Operating conditions ...........................................................................................................34
SIM7020_Hardware_Design_V1.02 2 2018-07-25
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5.3 Operating Mode ..................................................................................................................35
5.3.1 Operating Mode Definition ..........................................................................................35
5.3.2 Sleep mode ...................................................................................................................36
5.3.3 Minimum functionality mode and Flight mode ............................................................36
5.3.4 Power Saving Mode (PSM) ..........................................................................................37
5.3.5 Extended Mode DRX (e-DRX) ....................................................................................37
5.4 Current Consumption ..........................................................................................................37
5.5 ESD Notes ...........................................................................................................................38
6 SMT Production Guide ............................................................................................................39
6.1 Top and Bottom View of SIM7020 .....................................................................................39
6.2 Typical SMT Reflow Profile ...............................................................................................39
6.3 Moisture Sensitivity Level (MSL) ......................................................................................40
6.4 Baking Requirements ..........................................................................................................40
6.5 Stencil Foil Design Recommendation .................................................................................41
7 Packaging ..................................................................................................................................42
8 Appendix ...................................................................................................................................44
8.1 Related Documents .............................................................................................................44
8.2 Terms and Abbreviations .....................................................................................................46
8.3 Safety Caution .....................................................................................................................48
Contact ............................................................................................................... 错误!未定义书签。
SIM7020_Hardware_Design_V1.02 3 2018-07-25
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Table Index

Table 1: SIM7020 frequency bands and air interface .................................................................7
Table 2: General features ............................................................................................................8
Table 3: Pin definition ............................................................................................................... 11
Table 4: IO parameters definition ............................................................................................. 11
Table 5: Pin description ............................................................................................................12
Table 6: VBAT pins electronic characteristic ............................................................................16
Table 7: Recommended TVS diode list ....................................................................................17
Table 8: Power on timing and electronic characteristic ............................................................18
Table 9: Power off timing and electronic characteristic ............................................................19
Table 10: RESET pin electronic characteristic .........................................................................20
Table 11: Recommended TVS list ............................................................................................23
Table 12: SIM electronic characteristic in 1.8V mode (SIM_VDD=1.8V) ..............................24
Table 13: SIM electronic characteristic 3.0V mode (SIM_VDD=3V)......................................24
Table 14: Amphenol SIM socket pin description ......................................................................26
Table 15: NETLIGHT pin status ...............................................................................................26
Table 16: ADC electronic characteristics ..................................................................................27
Table 17: Electronic characteristic ............................................................................................27
Table 18: Conducted transmission power .................................................................................29
Table19: Maximum Power Reduction (MPR) for UE category NB1 Power Class 3 ...............29
Table 20: E-UTRA operating bands ..........................................................................................29
Table 21: CAT-NB1 Reference sensitivity (QPSK) ..................................................................30
Table 22: Trace loss ..................................................................................................................30
Table 23: Recommended TVS ..................................................................................................31
Table 24: Absolute maximum ratings .......................................................................................34
Table 25: Recommended operating ratings ...............................................................................34
Table 26: 1.8V Digital I/O characteristics* ...............................................................................34
Table 27: Operating temperature ...............................................................................................35
Table 28: Operating mode Definition .......................................................................................35
Table 29: RTC_GPIO0/RTC_EINT characteristics ..................................................................37
Table 30: Current consumption on VBAT Pins (VBAT=3.3V) .................................................37
Table 31: The ESD performance measurement table ................................................................38
Table 32: Moisture Sensitivity Level and Floor Life ................................................................40
Table 33: Baking requirements .................................................................................................40
Table 34: Tray size ....................................................................................................................42
Table 35: Small Carton size ......................................................................................................43
Table 36: Big Carton size ..........................................................................................................43
Table 37: Related Documents ...................................................................................................44
Table 38: Terms and Abbreviations ...........................................................................................46
Table 39: Safety Caution ...........................................................................................................48
SIM7020_Hardware_Design_V1.02 4 2018-07-25
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Figure Index

Figure 1: SIM7020 block diagram ..............................................................................................8
Figure 2: Pin assignment overview ...........................................................................................10
Figure 3: Dimensions (Unit: mm) .............................................................................................14
Figure 4: Footprint recommendation (Unit: mm) .....................................................................15
Figure 5: Power supply application circuit ...............................................................................17
Figure 6: Reference power on/off circuit ..................................................................................18
Figure 7: Power on timing sequence .........................................................................................18
Figure 8: Power off timing sequence ........................................................................................19
Figure 9: Reference reset circuit ...............................................................................................20
Figure 10: UART full modem ...................................................................................................21
Figure 11: UART null modem ..................................................................................................21
Figure 12: Reference circuit of level shift ................................................................................22
Figure 13: TX level matching circuit ........................................................................................22
Figure 14: RX level matching circuit ........................................................................................22
Figure 15: RI behaviour SMS and URC report .................................................................23
Figure 16: USB reference circuit ..............................................................................................23
Figure 17: SIM interface reference circuit ................................................................................25
Figure 18: Amphenol SIM card socket .....................................................................................25
Figure 19: NETLIGHT reference circuit ..................................................................................26
Figure 20Power on sequence of the VDD_EXT ...................................................................27
Figure 21Power on sequence of the VDD_3V3 ....................................................................27
Figure 22: Antenna matching circuit (MAIN_ANT) ................................................................31
Figure 23: RF trace should be far away from other high speed signal lines .............................32
Figure 24: The distance between GND to the inner conductor of SMA ...................................32
Figure 25: Top and bottom view of SIM7020 ...........................................................................39
Figure 26: The ramp-soak-spike reflow profile of SIM7020 ....................................................39
Figure 27: Recommended SMT stencil footprint outline ..........................................................41
Figure 28: packaging diagram ..................................................................................................42
Figure 29: Tray drawing............................................................................................................42
Figure 30: Small carton drawing ...............................................................................................43
Figure 31: Big carton drawing ..................................................................................................43
SIM7020_Hardware_Design_V1.02 5 2018-07-25
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Revision History
Data Version Description of change Author
2018-02-07 1.00 Original
Update figure 1,9,20,21 Update table 2,8,9,10,16, 29,30
2018-04-19 1.01
2018-07-25 1.02
Update chapter 3.5.1 Add chapter 3.5.4, 3.5.5 Add table 28
Update figure 1 Update table 2,6,21,30
Ya.li Ming.zhu
Ming.zhu
Ya. l i Ming.zhu
SIM7020_Hardware_Design_V1.02 6 2018-07-25

1 Introduction

Variants
 
B8
B28
This document describes SIM7020 hardware interface in great detail. The document can help
customer to quickly understand SIM7020 interface specifications, electrical and mechanical details.
With the help of this document and other SIM7020 application notes, customer guide, customers can
use SIM7020 to design various applications quickly.

1.1 Product Outline

The SIM7020 series modules support LTE CAT-NB1.
With a tiny configuration of 17.6*15.7*2.3mm, SIM7020 can meet almost all the space requirements
in customers’ applications, such as smart phone, PDA and other mobile devices. And the physical
dimension is compatible with the packaging of SIM800C.
Table 1: SIM7020 frequency bands and air interface
Standard
Freque
ncy
SIM7020C SIM7020E
B1
B3
B5
HD-FDD
B20

1.2 Hardware Interface Overview

The interfaces are described in detail in the next chapters include:
Power Supply
USB Interface
UART Interface
SIM Interface
ADC
Power Output
GPIOs
Antenna Interface

1.3 Hardware Block Diagram

The block diagram of the SIM7020 module is shown in the figure below.
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Feature
Implementation
Power supply
Power supply voltage 2.1~3.6V,Typ=3.3V
Current in PSM mode: 3.4uA
Radio frequency bands
Please refer to the table 1

1.4 Functional Overview

Table 2: General features
Power saving
Transmitting power
Data Transmission Throughput
Antenna
Current in sleep mode: 236uA (at+cfun=0)
LT E 23dBm
LT E CAT NB1: 26.15Kbps (DL)
LTE CAT NB1: 62.5Kbps (UL)
LTE antenna.
Figure 1: SIM7020 block diagram
SMS
SIM interface Support identity card: 1.8V/ 3V
UA RT 1 interface
SIM7020_Hardware_Design_V1.02 8 2018-07-25
MT, MO, Text and PDU mode
A full modem serial port by default
Baud rate: default:115200bps
Can be used as the AT commands or data stream channel
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Can be used for debugging and upgrading firmware
(Log port can be selected by AT
Size: 17.6*15.7*2.3mm
Support RTS/CTS hardware handshake
UA RT 2 interface
USB
Baud rate: default:115200bps
USB 1.1 interface for debugging
command.)
Firmware upgrade Firmware upgrade over UART2 interface
Physical characteristics
Weight: 1.3g±0.2g
Normal operation temperature: -30°C to + 80°C
Temperature range
Extended operation temperature: -40°C to + 85°C*
Storage temperature -45°C to + 90°C
*Note: The performance will be reduced slightly from the 3GPP specifications if the temperature
is outside the normal operating temperature range and still within the extreme operating
temperature range.
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2
3
4
5
6
7
8
9
10
11
12
1
UART1_TXD
UART1_RXD
UART1_RTS
UART1_CTS
UART1_DCD
UART1_DTR
UART1_RI
GND
VDD_3V3
GPIO0
RTC_GPIO0
RTC_EINT
14
15
16
17
18
19
20
21
13
GND
SIM_DET
SIM_DATA
SIM_CLK
SIM_RST
SIM_VDD
GND
NC
GND
35
36
37
38
39
40
41
42
34
VBAT
STATUS
NETLIGHT
VDD_EXT
PWRKEY
ADC
GND
GND
VBAT
33
32
31
30
29
28
27
26
25
24
23
22
GND
ANT
GND
GND
GPIO1
RESET
GND
USB_DM
USB_DP
USB_VBUS
UART2_RXD
UART2_TXD
SIM7020
TOP VIEW

2 Package Information

2.1 Pin Assignment Overview

Figure 2: Pin assignment overview
SIM7020_Hardware_Design_V1.02 10 2018-07-25
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3
UA RT 1_RTS
24
USB_VBUS
4
UART1_CTS
25
USB_DP
5
UART1_DCD
26
USB_DN
6
UART1_DTR
27
GND
19
GND
40
VDD_EXT
20
NC
41
NETLIGHT
PI
Power input
PO
Power output
AI
Analog input
AIO
Analog input/output
I/O
Bidirectional input /output
DI
Digital input
DO
Digital output
DOH
Digital output with high level
DOL
Digital output with low level
PU
Pull up
Table 3: Pin definition
Pin No.
Pin Name
Pin No.
Pin Name
1 UART1_TXD 22 UART2_TXD
2 UART1_RXD 23 UART2_RXD
7 UA RT 1_RI 28 RESET
8 GND 29 GPIO1
9 VDD_3V3 30 GND
10 GPIO0 31 GND
11 RTC_GPIO0 32 ANT
12 RTC_EINT 33 GND
13 GND 34 VB AT
14 SIM_DET 35 V B AT
15 SIM _D ATA 36 GND
16 SIM_CLK 37 GND
17 SIM_RST 38 ADC
18 SIM_VDD 39 PWRKEY
21 GND 42 STAT U S

2.2 Pin Description

Table 4: IO parameters definition
Pin type Description
SIM7020_Hardware_Design_V1.02 11 2018-07-25
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PD
Pull down
Default status
Power supply
Power supply, voltage range:
2.1-3.6V.
Power output 1.8V for other
PSM mode.
8
2
3
Table 5: Pin description
Pin name Pin No.
VB AT 34 3
VDD_EXT 40
VDD_3V3 9
19
GND
、27、 3
0 33
37
System Control
PWRKEY 39
PI
PO
PO
DIPU
Description Comment
external circuits with Max 50mA current output, such as
If unused, keep it open.
level shift circuit. Not present in
Power output 3.3V for other external circuits with Max 50mA current output. Not present in PSM mode.
Ground
Voltage range
3.3V-3.5V( depend on VBAT). If unused, keep it open.
PWRKEY has been
System power on/off control input, active low. The efficient input level must be below 0.5V.
pulled up to VB AT via
40Kohm resistor
internally.
RESET 28 DIPU
SIM interface
SI M _ D ATA 15 I/OPU SIM Card data I/O
SIM_RST 17 DO SIM Reset
SIM_CLK 16 DO SIM clock
SIM_VDD 18 PO
SIM_DET
SIM7020_Hardware_Design_V1.02 12 2018-07-25
14 DI
System reset control input, active low.
Power output for SIM card, its output Voltage depends on SIM card type automatically. I
SIM card detecting input. (This function do not support yet in standard software.)
RESET has been pulled up to VB AT via 40Kohm resistor internally.
All lines of SIM
interface should be
protected against ESD.
If used, keep a 10kΩ
resistor pulling up to
the VDD_EXT
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Positive line of the differential, bi-directional USB signal.
UA RT 1_RTS
3
DI,PU
Request to send
UART1_CTS
4
DOH
Clear to Send
UA RT 1_RI
7
DOH
Ring Indicator
UART2_TXD
22
DOH
Transmit Data
UART2_RXD
23
DI
P
Receive Data
In PSM, RTC_GPIO0 will
RTC_EINT receive interrupt event.
RTC_EINT can be the wake up
GPIO
LED control output as network status indication.
Operating status output.
Low level: Power off
Do not pull down before power on
Analog-digital converter input. Voltage range: 0.1-1.4V.
If unused, keep them open.
USB
USB_VBUS 24 DI,PD
Valid USB detection input with
2.5~5.25V detection voltage
USB_DP 25 I/O
USB_DN 26 I/O
Negative line of the differential, bi-directional USB signal.
UART interface
UART1_TXD 1 DOH Transmit Data
UART1_RXD 2 DIPU Receive Data
UART1_DCD 5 DOH Data carrier detect
UART1_DTR 6 DIPU Transmit Data
Indicate and Control in PSM Mode
USB interface for
debugging
If unused, keep them
open.
RTC_GPIO0 11 DO
RTC_EINT 12 DI P
change state from low to high if
source for exiting PSM.
NETLIGHT 41 DO
S TAT U S 42 DO
High level: Power on and firmware ready
GPIO0 10 IO
GPIO1 29 IO
RF interface
ANT 32 AI antenna
Other interface
ADC 38 AI
Voltage Domain:
VB AT
If unused, keep them open.
NC 20
SIM7020_Hardware_Design_V1.02 13 2018-07-25
No connection.
Keep it open

2.3 Mechanical Information

The following figure shows the package outline drawing of SIM7020.
Figure 3: Dimensions (Unit: mm)
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2.4 Footprint Recommendation

Figure 4: Footprint recommendation (Unit: mm)
SIM7020_Hardware_Design_V1.02 15 2018-07-25
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Symbol
Description
Min.
Typ .
Max.
Unit
VBAT(peak)
VBAT(average)
f)

3 Interface Application

3.1 Power Supply

The power supply for SIM7020 must be able to provide sufficient current up to more than 500mA
in order to satisfy the power supply current for maximum consumption.
Table 6: VBAT pins electronic characteristic
VB AT Module power voltage 2.1 3.3 3.6 V
I
I
Module power peak current in NB emission 500 - - mA
Module power average current in normal mode
Please refer to the table 32
I
VBAT(sleep)
I
VBAT(PSM)
I
VBAT(power-of
Power supply current in sleep mode
Power supply current in PSM mode - 3.4 - uA
Module power current in power off mode. - - 12 uA

3.2 Power Supply Design Guide

Make sure that the voltage on the VBAT pins will never drop below 2.1V, or module will be work
abnormally.
Note: If the power supply for VBAT pins can support up to500mA, using a total of more than
100uF capacitors is recommended, or else users must using a total of 300uF capacitors typically,
in order to avoid the voltage drop. The module power peak current depends on the total
capacitance. Using a total of 1000uF capacitors in the test that will reduce the peak current to
320mA.
The following figure shows the recommended circuit .These capacitors should be put as close as
possible to VBAT pads. Also, users should keep VBAT trace on circuit board wider than 1 mm to
minimize PCB trace impedance.
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VBAT
VBAT
GND
Module
5.1V 500mW
VBAT
Cb
100uF
1uF
Ce Cc
100uF
Ca
Cd
100uF
100nF
GND
No.
Manufacturer
Part Number
Package
Figure 5: Power supply application circuit
In addition, for ESD protection, it is suggested to add a TVS diodenear the VBAT PINs.
Table 7: Recommended TVS diode list
1 Prisemi PESDHC2FD4V5B DFN1006
2 Prisemi PESDHC3D3V3U SOD323
3 WILLsemi ESD5651N-2/TR DFN1006

3.3 Voltage Monitor

To monitor the VB AT voltage, the AT command “AT+CBC” can be used.
When the VBAT voltage is out of the range, the module will be power off when the overvoltage
power-off function is enabled. The AT command “AT+C B ATC H K=1” can be used to enable the
overvoltage power-off function and the under-voltage power-off function.
Note: Under-voltage warning function and under-voltage power-off function are disabled by
default. For more information about these AT commands, please refer to Document [1].

3.4 Power on/Power off/Reset Function

3.4.1 Power on

SIM7020 can be powered on by pulling the PWRKEY pin to ground.
The PWRKEY pin has been pulled up with a resistance to V B AT internally, so it does not need to
be pulled up externally. It is strongly recommended to put a 100nF capacitor and an ESD protection
diode close to the PWRKEY pin, as it would strongly enhance the ESD performance of PWRKEY
pin. Please refer to the following figure for the recommended reference circuit.
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4.7K
47K
Turn on/
off
impulse
PWRKEY
Power
on
/
off
logic
VBAT
Module
1K
100nF
H L
40K
STATUS
(Output)
T
on
VBAT
PWRKEY
(Input)
T
on(status)
UART Port
不可用
可用
T
on(uart)
不可用
可用
USB Port
T
on(usb)
PWRKEY pin to power on module
STATUS pin output high level(indicating
power up ready )
Figure 6: Reference power on/off circuit
The power-on scenarios are illustrated in the following figure.
Table 8: Power on timing and electronic characteristic
Symbol Parameter Min. Typ. Max. Unit
Ton
The time of active low level impulse of
The time from power-on issue to
T
T
T
SIM7020_Hardware_Design_V1.02 18 2018-07-25
on(stat us)
The time from power-on issue to UART
on(uart)
on(usb)
port ready
The time from power-on issue to USB 4 s
Figure 7: Power on timing sequence
215 800 - ms
440
ms
2
s
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port ready
VIH
Input high level voltage on PWRKEY pin
0.7*VBAT
V
(
Output
)
T
off
( Input
)
T
off(status)
UART Port
UndefinedActive
T
off(uart)
T
on
T
off-on
USB Port
Undefined
Active
T
off(usb)
PWRKEY
STATUS
pulse on PWRKEY pin to power
off issue to STATUS pin output low
T
off(uart)
The time from power-off issue to UART port off
- - 1 s T
off(usb)
The time from power-off issue to USB port off
- - 1
s
off-on
VIL Input low level voltage on PWRKEY pin 0.3*VBAT V

3.4.2 Power off

The following methods can be used to power off SIM7020.
Method 1: Power off SIM7020 by pulling the PWRKEY pin to ground.
Method 2: Power off SIM7020 by AT command “AT + C PO W D=1”.
Method 3: over-voltage or under-voltage automatic power off. The function can be enabled by
AT command “AT+CBATCHK=1”. Default is disabled.
Note: For details about “AT+CPOWD” and “AT+CBATCHK”, please refer to Document [1].
These procedures will make modules disconnect from the network and allow the software to enter a
safe state, and save data before module be powered off completely.
The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.
Table 9: Power off timing and electronic characteristic
Symbol Parameter
T
off
T
off(status)
T
The buffer time from power-off issue to power-on issue 5 - - s
SIM7020_Hardware_Design_V1.02 19 2018-07-25
The active low level time
off module
The time from power-
level(indicating power off )*
Figure 8: Power off timing sequence
Time value
Unit
Min. Typ . Max.
0.8 1 - s
- - 0.5 s
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*Note: The STATUS pin can be used to detect whether module is powered on or not. When module
has been powered on and firmware goes ready, STATUS will be high level, or else STATUS will
still low level.

3.4.3 Reset Function

SIM7020 can be reset by pulling the RESET pin to ground.
Note: This function is only used as an emergency reset. The RESET pin will be ineffectiveness in
the power off mode.
The RESET pin has been pulled up to 1.8V with a 40KΩ resistor internally. So it does not need to
be pulled up externally. It is strongly recommended to put a100nF capacitor and an ESD protection
diode close to the RESET pin. Please refer to the following figure for the recommended reference
circuit.
Figure 9: Reference reset circuit
Table 10: RESET pin electronic characteristic
Symbol Description Min. Typ. Max. Unit
T
reset
VIH Input high level voltage 0.7*VBAT
The active low level time impulse on
RESET pin to reset module
48 - - ms
V
VIL Input low level voltage 0.3*VBAT V
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TXD
RXD
RTS
CTS
UART _DTR
UART _ DCD
UART1_RI
TXD
RXD
RTS CTS
DTR
DCD
RING
MODULE (DCE)
CUSTOMER (DTE)
Serial portSerial port
MODULE
( DCE)
HOST
( DTE )
UARTUART
TXD
RXD
RTS CTS
DTR
DCD
RI
TXD
RXD
RTS
CTS DTR
DCD
RING
Interrupt
Wake up host

3.5 UART Interface

SIM7020 provides a 7-wire UART1 (universal asynchronous serial transmission) interface as DCE
(Data Communication Equipment). AT commands and data transmission can be performed through
UA RT 1 interface.UART2 can be used for debugging and download software.

3.5.1 UART Design Guide

The following figures show the reference design.
Figure 10: UART full modem
Figure 11: UART null modem
The SIM7020 UART is 1.8V voltage interface. If user’s UART application circuit is 3.3V voltage
interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR
provided by Texas Instruments is recommended. The following figure shows the voltage matching
reference design.
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TXD
RXD
RTS
CTS DTR
DCD
RI
A7
A1 A2
A3
A4
A5
A6
MODULE
TXB0108 RGYR
UART
A8
B7
B1 B2
B3
B4
B5
B6
B8
VCCA
OE
VDD_ EXT
100nF
3.3V
100nF
VCCB
GND
TXD_3.3 V
RXD_3.3 V
RTS_3.3V
CTS_3.3V
DTR_3.3 V
DCD_3.3 V
RI_3.3V
47K 47K
RTS_ 3. 3V
VDD_EXT
4.7K
47K
UART1_TXD
4.7K
GSM
VDD_EXT
RXD
VDD
DTE
VDD_EXT
4.7K
47K
4.7K
DTE
UART1_RXD
GSM
VDD_EXT
TXD
VDD
Figure 12: Reference circuit of level shift
Note: When it uses the level shifter IC, the pullupresistance
DCD_3.3V should not be less than 47KΩ.
Also the following reference circuit is recommended:
Figure 13: TX level matching circuit
on TXD_3.3V
Note: The default band rate is 115200bps. The triode conversion circuit is not suitable for high
band rate more than 460800. When using UART2 for downloading software, the band rate is
921600bps, please pay attention to the device’s speed support.
SIM7020_Hardware_Design_V1.02 22 2018-07-25
Figure 14: RX level matching circuit
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Idle
HIGH
LOW
Receiving SMS and any URC
report coming
RI
120ms
USB_VBUS
USB_DM
USB_DP
GND
USB
USB
VBUS
D-
D+
GND
D2D1
0Ω
USB_ID
D3
MODULE HOST

3.5.2 RI and DTR Behavior

The RI pin description:
The RI pin can be used to interrupt output signal to inform the host controller such as application
CPU. Before that, users must use AT command “AT+CFGRI=1” to enable this function.
Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report
coming, then it will output a low level pulse 120ms, in the end, it will become high level.
Figure 15: RI behaviour (SMS and URC report)
Note: For more details of AT commands about UART, please refer to document [1].
The DTR pin description:
After setting the AT command “AT+CSCLK=1”, SIM7020 will enter sleep mode by pulling up the
DTR pin when module is in idle mode. In sleep mode, the UART is unavailable. When SIM7020
enters sleep mode, pulling down DTR can wake up module.\
After setting the AT command “AT+CSCLK=0”, SIM7020 will do nothing when the DTR pin is
pulling up.

3.6 USB Interface

The SIM7020 contains a USB interface compliant with the USB1.1 specification as a peripheral, but
the USB charging function is not supported.
Because of the high speed on USB bus, more attention should be paid to the influence of the junction
capacitance of the ESD component on USB data lines. Typically, the capacitance of the D1 and D2
should be less than 2p F.
Table 11 : Recommended TVS list
No. Manufacturer Part Number Description Package
SIM7020_Hardware_Design_V1.02 23 2018-07-25
Figure 16: USB reference circuit
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1
ON Semi
ESD9L5.0ST5G
TVS 5V 0.5PF 150mW RO
SOD-923
2
TOSHIBA
DF2S6.8UFS
TVS 5V 2PF 150mW RO
SOD-923
3 ON Semi ESD9L5.0ST5G TVS 5V 0.5PF 150mW RO SOD-923
4 TOSHIBA DF2S6.8UFS TVS 5V 2PF 150mW RO SOD-923

3.7 SIM Interface

SIM7020 supports both 1.8V and 3.0V SIM Cards.
Table 12: SIM electronic characteristic in 1.8V mode (SIM_VDD=1.8V)
Symbol Parameter
SIM_V DD
LDO power output voltage
VIH High-level input voltage
VIL Low-level input voltage
VOH High-level output voltage
VOL Low-level output voltage
Min. Typ. Max. Unit
1.75 1.8 1.95 V
0.65*SIM_VDD - SIM_VDD +0.3 V
-0.3 0 0.25*SIM_VDD V
SIM_VDD -0.45 - SIM_VDD V
0 0 0.45 V
Table 13: SIM electronic characteristic 3.0V mode (SIM_VDD=3V)
Symbol Parameter
SIM_V DD
LDO power output voltage
VIH High-level input voltage
VIL Low-level input voltage
VOH High-level output voltage
Min. Typ. Max. Unit
2.75 3 3.05 V
0.65*SIM_VDD - SIM_VDD +0.3 V
-0.3 0 0.25*SIM_VDD V
SIM_VDD -0.45 - SIM_VDD V
VOL Low-level output voltage

3.7.1 SIM Application Guide

It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST
(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com
peripheral circuit should be close to the SIM card socket. The following figure shows the 6-pin
SIM card holder reference circuit.
SIM7020_Hardware_Design_V1.02 24 2018-07-25
0 0 0.45 V
). Note that the SIM
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MODULE
TVS
SIM
_ VDD
SIM
_ CLK
SIM
_ DATA
SIM_ RST
VCC GND
RST VPP
CLK I
/
O
22
Ω
100
nF
C 707 10M 006 512
SIM Socket
22
Ω
22
Ω
22pF
22
pF
22pF
SIM_DET
Figure 17: SIM interface reference circuit
Note: SIM_DATA has been pulled up with a 10 resistor to SIM_VDD in module. A 100nF
capacitor on SIM_VDD is used to reduce interference. For more details of AT commands about
SIM, please refer to document [1].SIM_CLK is very important signal, the rise time and fall time of
SIM_CLK should be less than 40ns, otherwise the SIM card might not be initialized correctly. If
SIM_DET is used, a 10KΩ resistor is necessary to pulling up to the power VDD_EXT.

3.7.2 Recommended SIM Card Holder

It is recommended to use the 6-pin SIM socket such as C707 10M006 512 produced by Amphenol.
User can visit http://www.amphenol.com
for more information about the holder.
SIM7020_Hardware_Design_V1.02 25 2018-07-25
Figure 18: Amphenol SIM card socket
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Pin
Signal
Description
C1
SIM_VDD
SIM Card Power supply.
C2
SIM_RST
SIM Card Reset.
C3
SIM_CLK
SIM Card Clock.
C5
GND
Connect to GND.
C6
VPP
C7
SI M _ D ATA
SIM Card data I/O.
Module
NETLIGHT
VBAT
4.7K
47K
R
NETLIGHT pin status
Module status
64ms ON, 800ms OFF
No registered network
64ms ON, 3000ms OFF
Registered network
64ms ON, 300ms OFF
Data transmit
Table 14: Amphenol SIM socket pin description

3.8 Network status

The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the
following figure.
Figure 19: NETLIGHT reference circuit
Note: The value of the resistor named “R” depends on the LED characteristic.
Table 15: NETLIGHT pin status
OFF
Power off or PSM mode
Note: NETLIGHT output low level as “OFF”, and high level as “ON”.

3.9 ADC

SIM7020 has a dedicated ADC pin. It is available for digitizing analog signals such as battery
voltage and so on. The electronic specifications are shown in the following table.
SIM7020_Hardware_Design_V1.02 26 2018-07-25
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Characteristics
Resolution
10
Bits
Input Range
V
VDD_EXT ( Output)
64msVBAT
PWRKEY
(
Input)
VDD_3V3
( Output)
70msVBAT
PWRKEY
( Input)
VDD_EXT
V
VDD_EXT
Output voltage
1.7
1.8
1.9
V
VDD_3V3
Table 16: ADC electronic characteristics
Min. Typ . Max. Unit
0.1 1.4
Note: “AT+CADC” can be used to read the voltage of the ADC pin, for more details, please refer to
document [1].

3.10 Power Supply Output

SIM7020 has a LDO power output named VDD_EXT. The output voltage is 1.8V. Meanwhile it has a DCDC power output named VDD_3V3, which voltage range is 3.3V-3.5V (depend on VBAT).
Both of them are not present in PSM mode.
Figure 20:Power on sequence of the VDD_EXT
Figure 21:Power on sequence of the VDD_3V3
Table 17: Electronic characteristic
Pin name Description Min. Typ. Max. Unit
IO Output current - - 50 mA
V
VDD_3V3
IO Output current - - 50 mA
SIM7020_Hardware_Design_V1.02 27 2018-07-25
Output voltage 3.2 3.3 V B AT-0.1 V
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SIM7020_Hardware_Design_V1.02 28 2018-07-25
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Frequency
Power
Min.
LT E -FDD B1
23dBm +/-2.7dB
<-40dBm
LT E -FDD B2
23dBm +/-2.7dB
<-40dBm
LT E -FDD B3
23dBm +/-2.7dB
<-40dBm
LT E -FDD B4
23dBm +/-2.7dB
<-40dBm
LT E -FDD B5
23dBm +/-2.7dB
<-40dBm
LT E -FDD B6
23dBm +/-2.7dB
<-40dBm
LT E -FDD B8
23dBm +/-2.7dB
<-40dBm
LT E -FDD B12
23dBm +/-2.7dB
<-40dBm
LT E -FDD B13
23dBm +/-2.7dB
<-40dBm
LT E -FDD B18
23dBm +/-2.7dB
<-40dBm
LT E -FDD B19
23dBm +/-2.7dB
<-40dBm
LT E -FDD B20
23dBm +/-2.7dB
<-40dBm
LT E -FDD B26
23dBm +/-2.7dB
<-40dBm
LT E -FDD B28
23dBm +/-2.7dB
<-40dBm
LT E -FDD B39
23dBm +/-2.7dB
<-40dBm
Modulation
QPSK
MPR
≤ 0.5 dB
0 dB
≤ 0.5 dB
MPR
≤ 1 dB
≤ 1 dB
MPR
≤ 2 dB
1
1920 ~1980 MHz
2110 ~2170 MHz
HD-FDD

4 RF Specifications

4.1 LTE RF Specifications

Table 18: Conducted transmission power
*Note:The max power is tested result single-tone in CAT-NB1. Multi-tone test results please
refer to part 6.2.3F.3 fo r CAT-NB1.
Table 19: Maximum Power Reduction (MPR) for UE category NB1 Power Class 3
Tone positions for 3
Tones allocation
Tone positions for 6
Tones allocation
Tone positions for 12
Tones allocation
0-2 3-5 and 6-8 9-11
0-5 and 6-11
0-11
Table 20: E-UTRA operating bands
E-UTRA UL Freq. DL Freq. Duplex Mode
SIM7020_Hardware_Design_V1.02 29 2018-07-25
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3
1710 ~1785 MHz
1805 ~1880 MHz
HD-FDD
5
824 ~849 MHz
869 ~894 MHz
HD-FDD
18
815 ~830 MHz
860 ~875 MHz
HD-FDD
20
832 ~862 MHz
791 ~821 MHz
HD-FDD
1710MHz-2170MHz
<0.9dB
6 830 ~840 MHz 875 ~885 MHz HD-FDD
8 880 ~915 MHz 925 ~960 MHz HD-FDD
12 699 ~716 MHz 729 ~746 MHz HD-FDD
13 777 ~787 MHz 746 ~756 MHz HD-FDD
19 830 ~845 MHz 875 ~890 MHz HD-FDD
26 814 ~849 MHz 859 ~894 MHz HD-FDD
28 703 ~748 MHz 758 ~803 MHz HD-FDD
Table 21: C AT-NB1 Reference sensitivity (QPSK)
Sensitivity dBm (95% throughput with
Operating band
repetitions )
1, 3,5, 8, 20, 28 -131

4.2 LTE Antenna Design Guide

Users should connect antennas to SIM7000’s antenna pads through micro-strip line or other types of
RF trace and the trace impedance must be controlled in 50Ω.SIMCom recommends that the total
insertion loss between the antenna pads and antennas should meet the following requirements:
Table 22: Trace loss
Frequency Loss
700MHz-960MHz <0.5dB
2300MHz-2650MHz <1.2dB
To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit
should be added. The following figure is the recommended circuit.
SIM7020_Hardware_Design_V1.02 30 2018-07-25
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0201
LXES03AAA1-154
Murata
0402
LXES15AAA1-153
Murata
Figure 22: Antenna matching circuit (MAIN_ANT)
In above figure, the components R1,C1,C2 and R2 are used for antenna matching, the values of
components can only be achieved after the antenna tuning and usually provided by antenna vendor.
By default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component D1 is
a TVS for ESD protection, and it is optional for users according to application environment.
The RF test connector is used for the conducted RF performance test, and should be placed as close
as to the module’s MAIN_ANT pin. The traces impedance between SIM7000 and antenna must be
controlled in 50Ω.
Two TVS are recommended in the table below.
Table 23: Recommended TVS
Package Part Number Ven d er

4.3 RF traces note

4.3.1 RF traces layout

Keep the RF trace from module ant pin to antenna as short as possible
RF trace should be 50 Ω either on the top layer or in the inner layer
RF trace should be avoided right angle and sharp angle.
Put enough GND vias around RF traces.
RF trace should be far away from other high speed signal lines.
SIM7020_Hardware_Design_V1.02 31 2018-07-25
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Figure 23: RF trace should be far away from other high speed signal lines
Avoiding the paroling rout of other system antennas nearly.
There should be some distance from The GND to the inner conductor of the SMA connector. It
is better to keep out all the layers from inner to the outer conductor.
Figure 24: The distance between GND to the inner conductor of SMA
GND pads around the ANT pad should not be hot pad to keep the GND complete.
SIM7020_Hardware_Design_V1.02 32 2018-07-25
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4.3.2 LT E ANT and other system ANT decoupling

Make sure the efficiency of LT E main ANT more than 40%
Keep the decoupling of LTE main ANT to WLAN ANT more than 15dB
Keep the decoupling of LTE main ANT to GNSS ANT more than 30dB
Note: The decoupling value can be provided by ANT adventure. More details can refer to the
document[25].
SIM7020_Hardware_Design_V1.02 33 2018-07-25
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Parameter
Min.
Typ .
Max.
Unit
Voltage at VBAT
-0.5 - 4.5 V Voltage at USB_VBUS
-0.5 - 5.85
V
Voltage at digital pins (GPIO, UART etc)
-0.3 - 2.1
V
Voltage at digital pins (SIM)
-0.3 - 3.05
V
Voltage at PWRKEY/RESET/RTC_EINT/RTC_GPIO0
Parameter
Min.
Typ .
Max.
Unit
Voltage at VBAT
2.1
3.3
3.6
V
Voltage at USB_VBUS
2.5
5.0
5.25
V
Parameter
Description
Min.
Typ.
Max.
Unit
up resistor)
Input high leakage current (no

5 Electrical Specifications

5.1 Absolute maximum ratings

Absolute maximum rating for digital and analog pins of SIM7020 are listed in the following table:
Table 24: Absolute maximum ratings
-0.3 - 3.9

5.2 Operating conditions

Table 25: Recommended operating ratings
Table 26: 1.8V Digital I/O characteristics*
VIH High-level input voltage
VIL Low-level input voltage
VOH High-level output voltage
VOL Low-level output voltage
1.17 1.8 2.1 V
-0.3 0 0.63 V
1.35 - 1.8 V
0 - 0.45 V
IOH
IOL
IIH
IIL
SIM7020_Hardware_Design_V1.02 34 2018-07-25
High-level output current(no pull down resistor)
Low-level output current(no pull
pull down resistor)
Input low leakage current(no pull up resistor)
4 mA
4 mA
5 uA
5 uA
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Parameter
Min.
Typ .
Max.
Unit
Normal operation temperature
-30
25
80
Extended operation temperature*
-40
25
85
Storage temperature
-45
25
+90
Mode
Function
active. Module is registered to the network, and the module
module to a minimum functionality mode without removing the power
this mode is lower than
without removing the power supply. In this mode, the RF part of
*Note: These parameters are for digital interface pins, such as GPIOs (including NETLIGHT,
STATU S , SIM_DET), UART.
The operating temperature of SIM7020 is listed in the following table.
Table 27: Operating temperature
℃ ℃ ℃
*Note: The performance will be reduced slightly from the 3GPP specifications if the temperature
is outside the normal operating temperature range and still within the extreme operating
temperature range.

5.3 Operating Mode

5.3.1 Operating Mode Definition

The table below summarizes the various operating modes of SIM7020 product.
Table 28: Operating mode Definition
In this case, the current consumption of module will be reduced to the
LTE Sleep
minimal level and the module can still receive paging message and
SMS.
LTE Idle
Software is
is ready to communicate.
Module is ready for data transmission, but no data is currently sent or
LTE Standby
Normal operation
received. In this case, power consumption depends on network
settings.
There is data transmission in progress. In this case, power consumption
LTE Data
transmission
is related to network settings (e.g. power control level);
uplink/downlink data rates, etc.
AT command “AT+CFUN=0” AT+CSCLK=1 can be used to set the
Minimum functionality mode
supply. In this mode, the RF part of the module will not work and the
SIM card will not be accessible, but the serial port and USB port are
still accessible. The power consumption in
normal mode.
Flight mode
SIM7020_Hardware_Design_V1.02 35 2018-07-25
AT command “AT+CFUN=4” can be used to set the module to flight
mode
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sible. The power consumption in this mode is lower than normal
, all the output of the LDO and DCDC in the module will be
up the module.
the module will not work, but the serial port and USB port are still
acces
mode.
In this mode, the module will be the least current consumption.
Meanwhile
PSM mode
closed except the RTC power. And also all of the functions will be
unavailable except the RTC function. In PSM, RTC_GPIO0 will
change state from high to low. RTC_EINT or PWRKEY can wake
Module will go into power off mode by sending the AT command
Power off mode
“AT+ C P O WD ” or pull down the PWRKEY pin, normally. In this
mode the power management unit shuts down the power supply, and
software is not active. The serial port and USB are is not accessible.

5.3.2 Sleep mode

In sleep mode, the current consumption of module will be reduced to the minimal level, and module
can still receive paging message and SMS.
Several hardware and software conditions must be satisfied together in order to let SIM7020 enter
sleep mode:
1. UART condition
2. USB condition
3. Software condition

5.3.3 Minimum functionality mode and Flight mode

Minimum functionality mode ceases a majority function of the module, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality
levels.
AT+CFUN=0: Minimum functionality
AT+CFUN=1: Full functionality (Default)
AT+CFUN=4: Flight mode
If SIM7020 has been set to minimum functionality mode, the RF function and SIM card function will
be closed. In this case, the serial port and USB are still accessible, but RF function and SIM card will
be unavailable.
If SIM7020 has been set to flight mode, the RF function will be closed. In this case, the serial port
and USB are still accessible, but RF function will be unavailable.
When SIM7020 is in minimum functionality or flight mode, it can return to full functionality by the
AT command “AT+CFUN=1”.
SIM7020_Hardware_Design_V1.02 36 2018-07-25
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IO
Vih(min).
Vih(max).
Vil(min).
Vil(max).
VB AT
1.575
2.725
IO
Voh(min).
Voh(max).
Vol(min).
Vol(max).
VB AT
RTC_GPIO0
1.785
- - 0.315
2.1(min)
RTC_GPIO0
3.085
- - 0.545
3.6(max)
Sleep/Idle Mode
Power Saving Mode
eDRX

5.3.4 Power Saving Mode (PSM)

SIM7030 module can enter into PSM for reducing its power consumption. The mode is similar to
power-off, but the module remains registered on the network and there is no need to re-attach or
re-establish the network connections. So in PSM all the functions will be unavailable except the RT C
function, module cannot immediately respond users’ requests.
In PSM, RTC_GPIO0 will change state from low to high if RTC_EINT receive interrupt event.
Either of the following methods will wake up the module from PSM:
Pulling PWRKEY or RTC_EINT to low level will wake up the module.
When the timer expires, the module will be automatically woken up.
Power domain of RTC_GPIO0 and RTC_EINT is VBAT, please consider the electrical
characteristics when connecting to external IO (suggest to use trigger as low-active).
Table 29: RTC_GPIO0/RTC_EINT characteristics
RTC_EINT
RTC_EINT
2.1 0 0.525 2.1(min)
3.6 0 0.905 3.6(max)

5.3.5 Extended Mode DRX (e-DRX)

In idle or sleep mode, module and the network may negotiate over non-access stratum signaling the
use of extended mode DRX for reducing power consumption.

5.4 Current Consumption

The current consumption is listed in the table below.
Table 30: Current consumption on VBAT Pins (VBAT=3.3V)
LTE supply current
(without USB connection)
PSM supply current
SIM7020_Hardware_Design_V1.02 37 2018-07-25
Sleep mode Typical: 236uA (at+cfun=0) Idle mode Typical: 5.6mA
PSM mode Typical: 3.4uA
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@PTW=10.24s, eDRX=20.48s, DRX=1.28s
Typical
@PTW=20.48s, eDRX=81.92s, DRX=2.56s
@PTW=40.96s, eDRX=655.36s, DRX=2.56s
LTE data
@23dbm Typical: 134mA
@0dbm Typical: 32mA
@23dbm Typical: 116mA
@0dbm Typical: 31 mA
@23dbm Typical: 116mA
@0dbm Typical: 25mA
@23dbm Typical: 128mA
@0dbm Typical: 25mA
@23dbm Typical: 113mA
@0dbm Typical: 26mA
@23dbm Typical: 126mA
@0dbm Typical: 27mA
Part
Contact discharge(kV)
Air discharge(kV)
GND (Shield)
+/-6
+/-12
GND (RF)
+/-6
+/-12
VB AT
+/-5
+/-10
Antenna port
+/-5
+/-10
Other PADs
+/-3
+/-6
Typical230uA
@PTW=10.24s, eDRX=20.48s, DRX=2.56s
130uA
eDRX mode supply current
(Tested in sl eep mode)
Typical95uA
@PTW=20.48s, eDRX=162.84s, DRX=2.56s
Typical77.5uA
Typical69uA
LT E -FDD B1
LT E -FDD B3
LT E -FDD B5
LT E -FDD B8
LT E -FDD B20
LT E -FDD B28
@10dbm Typical: 42mA
@10dbm Typical: 44mA
@10dbm Typical: 35mA
@10dbm Typical: 35mA
@10dbm Typical: 34mA
@10dbm Typical: 38mA

5.5 ESD Notes

SIM7020 is sensitive to ESD in the process of storage, transporting, and assembling. When SIM7020
is mounted on the users’ mother board, the ESD components should be placed beside the connectors
which human body may touch, such as SIM card holder, audio jacks, switches, keys, etc. The
following table shows the SIM7020 ESD measurement performance without any external ESD
component.
Table 31: The ESD performance measurement table
Note: Temperature: 25℃, Humidity: 45%, tested on SIMCOM-EVB.
SIM7020_Hardware_Design_V1.02 38 2018-07-25
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6 SMT Production Guide

6.1 Top and Bottom View of SIM7020

Figure 25: Top and bottom view of SIM7020

6.2 Typical SMT Reflow Profile

SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only a
generic recommendation and should be adjusted to the specific application and manufacturing
constraints.
Figure 26: The ramp-soak-spike reflow profile of SIM7020
Note: For more details about secondary SMT, please refer to the document [21].
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Moisture Sensitivity Level
2a
4 weeks
3
168 hours
Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
Baking temperature
Moisture
Time
40℃±5℃

6.3 Moisture Sensitivity Level (MSL)

SIM7020 is qualified to Moisture Sensitivity Level (MSL) 4 in accordance with JEDEC J-STD-033.
If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying
equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.
Table 32: Moisture Sensitivity Level and Floor Life
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as
(MSL)
stated
1
Unlimited at ≦30℃/85% RH
2 1 year
4 72 hours
5 48 hours
5a 24 hours
6
NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.

6.4 Baking Requirements

SIM7020 modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage under the following conditions: the environment temperature is lower than 40, and the air
humidity is less than 90%.
If the condition meets one of the following ones shown below, the modules should be baked
sufficiently before re-flow soldering, and the baking condition is shown in table below; otherwise the
module will be at the risk of permanent damage during re-flow soldering.
If the vacuum package is broken or leakage;
If the vacuum package is opened after 6 months since it’s been packed;
If the vacuum package is opened within 6 months but out of its Floor Life at factory
ambient30/60%RH or as stated.
Table 33: Baking requirements
<5% 192 hours
120±5
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<5% 4 hours
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Note: Care should be taken if that plastic tray is not heat-resistant, the modules should be taken
out for preheating, and otherwise the tray may be damaged by high-temperature heating.

6.5 Stencil Foil Design Recommendation

The recommended thickness of stencil foil is 0.15mm.
Figure 27: Recommended SMT stencil footprint outline
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7 Packaging

SIM7020 module support tray packaging (default packaging).
Module tray drawing
Figure 28: packaging diagram
Figure 29: Tray drawing
Table 34: Tray size
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Length (±3mm)
Width (±3mm)
±
Length ±
Width ±
Height
Module number
242.0 161.0 50
Small carton drawing
Figure 30: Small carton drawing
Table 35: Small Carton size
Length
Width
270 180 120 50*20=1000
Big carton drawing
Height
Module number
Figure 31: Big carton drawing
Table 36: Big Carton size
Module number
380 280 280 1000*4=4000
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NO.
Title
Description
SIM7X00 Series_AT Command Manual_V1.xx
ITU-T Draft new recommendationV.25ter
Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME)
[4]
GSM 07.10
Support GSM 07.10 multiplexing protocol
Digital cellular telecommunications (Phase 2+); Use of Data
Data Circuit terminating Equipment
Cell Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+); Specification of the SIM Application Toolkit for the
interface
Digital cellular telecommunications system (Phase 2+);
Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information
Digital cellular telecommunications system (Phase 2)
Conformance specification
Digital cellular telecommunications system (Release 5); Electromagnetic Compatibility (EMC) for mobile terminals
and ancillary equipment.
Technical Specification Group Radio Access Network; Terminal conformance specification; Radio transmission and reception (FDD)
User Equipment (UE) conformance specification; Part 3: Abstract Test Suites.
Electromagnetic compatibility and Radio spectrum Matters
3.2 of the R&TTE Directive

8 Appendix

8.1 Related Documents

Table 37: Related Documents
[1]
[2]
[3] GSM 07.07
[5] GSM 07.05
[6] GSM 11.14
[7] GSM 11.11
[8] GSM 03.38
[9] GSM 11.10
AT Command Manual
Serial asynchronous automatic dialing and control
Terminal Equipment – (DTE – DCE) interface for Short Message Service (SMS) and
Subscriber Identity Module – Mobile Equipment (SIM – ME)
Specification of the Subscriber Identity Module – Mobile
Mobile Station (MS) conformance specification
[10]
[11]
[12]
[13]
[14]
[15]
SIM7020_Hardware_Design_V1.02 44 2018-07-25
3GPP TS 51.010-1
3GPP TS 34.124
3GPP TS 34.121
3GPP TS 34.123-1
3GPP TS 34.123-3
EN 301 908-02 V2.2.1
Mobile Station (MS) conformance specification
Electromagnetic Compatibility (EMC) for mobile terminals
and ancillary equipment.
(ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article
Smart Machine Smart Decision
Electromagnetic compatibility and Radio Spectrum Matters
radio equipment and services; Part 24: Specific conditions for
ect Spread (UTRA) for Mobile and
portable (UE) radio and ancillary equipment
Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification
[19]
GCF-CC V3.23.1
Global Certification Forum - Certification Criteria
Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)
[21]
Module secondary-SMT-UGD-V1.xx
Module secondary SMT Guidelines
[22]
SIM7X00
Note_V1.xx
This document describes how to use UART interface of
[24]
ETSI EN 301 908-13
IMT cellular networks; Harmonized EN covering the
Part 13
[25]
Antenna design guidelines for diversity receiver system
Antenna design guidelines for diversity receiver system
[26]
SIM7X00 Series_Sleep Mode_ Application Note_V1.xx
Sleep Mode Application Note
(ERM); Electromagnetic Compatibility (EMC) standard for
[16]
EN 301 489-24 V1.2.1
IMT-2000 CDMA Dir
[17]
[18]
[20]
[23]
IEC/EN60950-1(2001)
3GPP TS 51.010-1
2002/95/EC
Series_UART_Application
SIM7X00 Series_USB
AUDIO_Application
Note_V1.xx
(ETSI TS 136521-1 R13.4.0)
Safety of information technology equipment (2000)
SIMCom modules.
USB AUDIO Application Note
essential requirements of article 3.2 of the R&TTE Directive;
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Abbreviation
Description
ADC
Analog-to-Digital Converter
ARP
Antenna Reference Point
BER
Bit Error Rate
BD
BeiDou
BTS
Base Transceiver Station
CS
Coding Scheme
CSD
Circuit Switched Data
CTS
Clear to Send
DAC
Digital-to-Analog Converter
DRX
Discontinuous Reception
DSP
Digital Signal Processor
DTE
Data Terminal Equipment (typically computer, terminal, printer)
DTR
Data Terminal Ready
DTX
Discontinuous Transmission
EFR
Enhanced Full Rate
EGSM
Enhanced GSM
EMC
Electromagnetic Compatibility
ESD
Electrostatic Discharge
ETS
European Telecommunication Standard
EVDO
Evolution Data Only
FCC
Federal Communications Commission (U.S.)
FD
SIM fix dialing phonebook
FDMA
Frequency Division Multiple Access
FR
Full Rate
GMSK
Gaussian Minimum Shift Keying
GNSS
Global Navigation Satellite System
GPRS
General Packet Radio Service
GPS
Global Positioning System
GSM
Global Standard for Mobile Communications
HR
Half Rate
HSPA
High Speed Packet Access
I2C
Inter-Integrated Circuit
IMEI
International Mobile Equipment Identity
LT E
Long Term Evolution
MO
Mobile Originated
MS
Mobile Station (GSM engine), also referred to as TE
MT
Mobile Terminated
NMEA
National Marine Electronics Association
PAP
Password Authentication Protocol
PBCCH
Packet Switched Broadcast Control Channel
PCB
Printed Circuit Board

8.2 Terms and Abbreviations

Table 38: Terms and Abbreviations
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PCS
Personal Communication System, also referred to as GSM 1900
RF
Radio Frequency
RMS
Root Mean Square (value)
RTC
Real Time Clock
SIM
Subscriber Identification Module
SMS
Short Message Service
SMPS
Switched-mode power supply
TDMA
Time Division Multiple Access
TE
Terminal Equipment, also referred to as DTE
TX
Transmit Direction
UA RT
Universal Asynchronous Receiver & Transmitter
VSWR
Voltage Standing Wave Ratio
SM
SIM phonebook
NC
Not connect
EDGE
Enhanced data rates for GSM evolution
HSDPA
High Speed Downlink Packet Access
HSUPA
High Speed Uplink Packet Access
ZIF
Zero intermediate frequency
WCDMA
Wideband Code Division Multiple Access
VCTCXO
Voltage control temperature-compensated crystal oscillator
SIM
Universal subscriber identity module
UMTS
Universal mobile telecommunications system
UA RT
Universal asynchronous receiver transmitter
PSM
Power save mode
SIM7020_Hardware_Design_V1.02 47 2018-07-25
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Marks
Requirements
When in a hospital or other health care facility, observe the restrictions about the use of
mobiles. Switch the cellular terminal or mobile off, medical equipment may be
cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to prevent
interference with communication systems. Forgetting to think much of these
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
s or where blasting operations are in progress. Operation of any
electrical equipment in potentially explosive atmospheres can constitute a safety
hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
RF interference can occur if it is used close to TV sets, radios, computers
or other electric equipment.
nds free operation.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
invalid SIM card. While you are in this condition and need emergent
emergency calls. In order to make or receive calls, the
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.

8.3 Safety Caution

Table 39: Safety Caution
sensitive and not operate normally due to RF energy interference.
Switch off the
instructions may impact the flight safety, or offend local legal action, or both.
chemical plant
switched on.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for ha
Before making a call with a hand-held terminal or mobile, park the vehicle.
networks and cannot be guaranteed to connect in all conditions, especially with a
mobile fee or an
help, please remember to use
cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
those features before you can make an emergency call.
SIM7020_Hardware_Design_V1.02 48 2018-07-25
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Contact us:
Shanghai SIMCom Wireless Solutions Limited.
Address: Building B, No.633 Jinzhong Road, Changning District, Shanghai P.R.China 200335
Tel: +86 21 3157 5100\3157 5200
Email: simcom@simcom.com, simcom@sim.com
Website: www.simcomm2m.com
Technical Support
EMEA APAC America
West Europe
we-support@simcom.com
East Europe
ee-support@simcom.com
Middle East
me-support@simcom.com
Africa
af-support@simcom.com
ASEAN
asean-support@simcom.com
Australia and New Zealand
anz-support@simcom.com
Big China
China-support@simcom.com
North America
us-support@simcom.com
Central and South America
la-support@simcom.com
SIM7020_Hardware_Design_V1.02 49 2018-07-25
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