Simcom 201606 User Manual

SIM7500A_User Manual_V1.01

Smart Machine Smart Decision

Document Title Version Date Status Document Control ID

SIM7500A_User Manual V1.01 2016-07-06 Released SIM7500A_User Manual_V1.01

General Notes

SIMCom offers this information as a service to its customers to support the application and engineering efforts that use the products designed by SIMCom. The information provided is based on the requirements specifically from the customers. SIMCom has not undertaken any independent search for additional relevant information, including any information that may be in the customer’s possession. Furthermore, the system validation of the product designed by SIMCom within a larger electronic system remains the res ponsibility of the customer or the customer’s system integrator. All specifications supplied herein are subject to change without notice.

Copyright

This document contains the proprietary technical information which is the property of SIMCom Limited, copying of this document, giving it to others, the using or communication of the contents thereof are forbidden without the official authority by SIMCom. Offenders are liable to the payment of the damages. All rights are reserved in the event of grant of a patent or the registration of a utility model or design. All specifications supplied herein are subject to change without notice

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Table Index

Table 1: SIM7500 series frequency bands............................................................................................................ 8

Table 2: General features ..................................................................................................................................... 9

Table 3: Pin Definitions ..................................................................................................................................... 12

Table 4: IO parameters definition....................................................................................................................... 13

Table 5: Pin description ...................................................................................................................................... 13

Table 6: VBAT Pins electronic characteristic ..................................................................................................... 17

Table 7: Recommended zener diode list ............................................................................................................. 18

Table 8: Power on timing and electronic characteristic ...................................................................................... 20

Table 9: Power off timing and Electronic Characteristic .................................................................................... 21

Table 10: RESET pin electronic characteristic ................................................................................................... 22

Table 11: USIM Electronic characterist ic in 1.8V mode (USIM_VDD=1.8V) .................................................. 25

Table 12: USIM Electronic characteristic 3.0V mode (USIM_VDD=2.95V) .................................................... 26

Table 13: Amphenol USIM Socket Pin Description ........................................................................................... 27

Table 14: PCM Format ....................................................................................................................................... 28

Table 15: PCM T iming Parameters .................................................................................................................... 29

Table 16: NETLIGHT pin status ........................................................................................................................ 31

Table 17: Pin definit ion of the STATUS............................................................................................................. 31

Table 18: Pin multiplex f unction list .................................................................................................................. 32

Table 19: Sink current electronic characteristic ................................................................................................. 32

Table 20: ADC Electronic Characteristics .......................................................................................................... 33

Table 21: Conducted transmission power .......................................................................................................... 34

Table 22: Operating frequencies ........................................................................................................................ 34

Table 23: Conducted receive sensitivity ............................................................................................................. 35

Table 24: Reference sensitivity (QPSK) ............................................................................................................ 35

Table 25: Trace Loss .......................................................................................................................................... 35

Table 26: Recommended TVS ........................................................................................................................... 37

Table 28: Absolute maximum ratings ................................................................................................................. 38

Table 29: Recommended operating ratings ........................................................................................................ 38

Table 30: 1.8V Digital I/O characteristics* ........................................................................................................ 38

Table 31: Operating temperature ........................................................................................................................ 39

Table 32: Operating mode Definitions ............................................................................................................... 39

Table 33: Current consumption on VBAT Pins (VBAT=3.8V) .......................................................................... 40

Table 34: The ESD performance measur ement table (Temperature: 25℃, Humidity: 45%) ............................. 41

Table 35: The Description of Label Information ................................................................................................ 43

Table 36: Moisture Sensitivity Level and Floor Life ......................................................................................... 44

Table 37: Tray size ............................................................................................................................................. 45

Table 38: Small Carton size ............................................................................................................................... 46

Table 39: Big carton size .................................................................................................................................... 46

Table 40: Coding schemes and maximum net data rates over ai r interface ........................................................ 48

Table 41: Rela t e d documents ............................................................................................................................. 50

Table 42: T e rms and Abbrevia tions .................................................................................................................... 52

Table 43: Safety caution ..................................................................................................................................... 54

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Figure Index

Figure 1: SIM7500 series Block Diagram ............................................................................................................ 9

Figure 2: Pin assignment overview .................................................................................................................... 11

Figure 3: Dimensions (Unit: mm) ...................................................................................................................... 15

Figure 4: Footprint recommendation (Unit: mm) ............................................................................................... 16

Figure 5: Power supply application circuit......................................................................................................... 17

Figure 6: Linear r egulator reference circuit ....................................................................................................... 18

Figure 7: Switching mode power supply reference circuit ................................................................................. 18

Figure 8: Reference Power on/off Circuit .......................................................................................................... 19

Figure 9: Power on timing sequence .................................................................................................................. 20

Figure 10: Power off timing sequence ............................................................................................................... 21

Figure 11: Reference reset circuit ...................................................................................................................... 22

Figure 12: UART full modem ............................................................................................................................ 23

Figure 13: UART null Modem ........................................................................................................................... 23

Figure 14: Reference circui t of level shift .......................................................................................................... 23

Figure 15: RI behaviour（SMS and URC report） ........................................................................................... 24

Figure 16: RI behaviour（voice call） .............................................................................................................. 24

Figure 17: USB reference circuit ....................................................................................................................... 25

Figure 18: USIM inter face reference circuit ...................................................................................................... 26

Figure 19: Amphenol SIM card socket .............................................................................................................. 27

Figure 20: PCM_SYNC timing .......................................................................................................................... 28

Figure 21: EXT codec to module timing ............................................................................................................ 28

Figure 22: Module to EXT codec timing ........................................................................................................... 29

Figure 23: Audio codec reference circuit ........................................................................................................... 30

Figure 24: I2C reference circu it ......................................................................................................................... 30

Figure 25: NETLIGHT reference circuit ............................................................................................................ 31

Figure 26: ISINK reference circuit..................................................................................................................... 32

Figure 27: Antenna matching circuit (MAIN_ANT) .......................................................................................... 36

Figure 28: Antenna matching circuit (DIV_ANT) ............................................................................................. 36

Figure 31: Top and bottom view of Module ....................................................................................................... 42

Figure 32: Label Information ............................................................................................................................. 42

Figure 33: The ramp-soak-spike Reflow Profile of Module............................................................................... 43

Figure 34: Packaging introduce ......................................................................................................................... 45

Figure 35: Module tray drawing introduce ......................................................................................................... 45

Figure 36: Small carton drawing introduce ........................................................................................................ 46

Figure 37: Big carton drawing introduce ........................................................................................................... 46

Figure 38: Reference design .............................................................................................................................. 47

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Revision History

Data Version Description of change Author

2016-07-06 V1.01

new

Shengwu.sun

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Standard

Frequency

SIM7500A

BAND2



BAND5



LTE-FDD B4



LTE-FDD B7

LTE-FDD B17



1 Introduction

This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and testing results of the SIMCom SIM7500 series. With the help of this document and other software application notes/user guides, users can understand and use modules to design and develop applications quickly.

1.1 Product Outline

The SIM7500A support many air-interface standards, refer to the following table.

Table 1: SIM7500 series frequency bands

WCDMA

LTE-FDD B1 LTE-FDD B2 LTE-FDD B3

LTE

LTE-FDD B8

LTE-FDD B20

With a small physical dimension of 24*27*2.75 mm and with the functions integrated, the Module can meet almost any space requirement in users’ applications, such as smart phones, PDA’s, industrial handhelds, machine-to-machine, vehicle applications, etc.

1.2 Hardware Interface Overview

The interfaces that are described in detail in the next chapters include:

● Power Supply

● USB Interface

● UART Interface

● USIM Interface

● GPIO

● ADC

● Power Output

● Current Sink Source

● PCM Interface

● I2C Interface

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GSM/WCDMA

/LTE

RF FEM

GSM/

WCDMA/LTE PA

RF

Transceiver

Baseband

XO

19.2MHz

NAND

Flash

I2C

PCM Interrupt

Status LED

{

USB

USIM

Power On

Reset

UART

GPIOs ADC LDO

VBAT

Sink Current Source

DDR

Main Antenna

Power

Management

Qualcomm

Chip

SMT Interface

WCDMA

/LTE

RF FEM

AUX Antenna

TX

RX

SYSTEM POWER

VBAT

GNSS RF

GNSS Antenna

Feature

Implementation

Power supply

Single supply voltage 3.4～4.2V

Radio frequency bands

Please refer to the table 1

WCDMA: Class 3 (0.25W) LTE: Class 3 (0.25W)

1.3 Hardware Block Diagram

The block diagram of the Module is shown in the figure below.

Figure 1: SIM7500 series Block Diagram

1.4 Functional Overview

Table 2: General features

Power saving

Transmitting power

Data Transmission Throughout

Antenna

SMS

USIM interface Support identity card: 1.8V/ 3V

Current in sleep mode : <5mA

HSPA+: 5.76 Mbps(UL), 42 Mbps(DL) LTE Category 1: 10 Mbps (DL) LTE Category 1: 5 Mbps (UL)

WCDMA /LTE main antenna WCDMA /LTE auxiliary antenna

MT, MO, CB, Text and PDU mode SMS storage: USIM card or ME(default) Transmission of SMS alternatively over CS or PS.

USIM application toolkit

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Support SAT class 3, GSM 11.14 Release 98

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Phonebook management

Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN

Firmware upgrade over USB interface

Weight:4.0 g Size:24*27*2.75mm

Support USAT

Support PCM interface

Audio feature

Only support PCM master mode and short frame sync, 16-bit linear data formats

A full modem serial port by default Baud rate: 300bps to 4Mbps(default:115200bps)

UART interface

Auto-bauding baud rate: 9600,19200,38400,57600,115200bps Can be used as the AT commands or data stream channel. Support RTS/CTS hardware handshake Multiplex ability according to GSM 07.10 Multiplexer Protocol.

USB

Firmware upgrade USB

USB 2.0 specification-compliant as a peripheral

Physical characteristics

Normal operation temperature: -30°C to +80°C

Temperature range

Extended operation temperature: -40°C to +85°C* Storage temperature -45°C to +90°C

*Note: Module is able to make and receive voice calls, data calls, SMS and make WCDMA/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range.

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DBG_TXD

I2S_MCLK

LTE_ACTIVE

SIM7500x

Top View

MAIN_ANT

NETLIGHT

STATUS

2

3

4

5

6

7

8

9

36

16

15

14

13

12

39

38

1

37

GND

10

11

40

42

41

43

GND

28

27

26

25

24

23

22

21

20

19

18

17

29

30

31

32

33

34

35

56

44

45

46

47

48

49

50

51

52

53

54

55

DIV_ANT

SCL

SDA GND

USB_DM

USB_DP

VBUS

SIM_DATA

SIM_CLK SIM_DET

SIM_RST

SIM_VDD

GND

PCM_CLK

PCM_SYNC

PCM_IN

PCM_OUT

GND

L11_1V8

RESET

ADC

GPIO_1

ISINK

GND

PWRKEY

GND

VBAT

GND

RTS

DCD

TXD

RXD

DTR

CTS

RI

GND

GPIO_37

GPIO_49

GND

GNSS_ANT

GND

2 Package Information

2.1 Pin Assignment Overview

All functions of the SIM7500 series will be provided through 56 pads that will be connected to the customers’ platform. The following Figure is a high-level view of the pin assignment of the SIM7500 series.

Figure 2: Pin assignment overview

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Pin No.

Pin Name

Pin No.

Pin Name

9

VBUS

10

USIM_DATA

17

MCLK

18

PCM_CLK

25

ADC

26

GPIO_1

33

VBAT

34

VBAT

41

CTS

42

RI

49

GPIO_49

50

STATUS

Table 3: Pin Definitions

1 GND 2 DIV_ANT 3 GND 4 SCL 5 SDA 6 GND 7 USB_DM 8 USB_DP

11 USIM_CLK 12 USIM_DET 13 USIM_RST 14 USIM_VDD 15 GND 16 GND

19 PCM_SYNC 20 PCM_IN 21 PCM_OUT 22 GND 23 L11_1V8 24 RESET

27 ISINK 28 GND 29 GND 30 PWRKEY 31 GND 32 GND

35 GND 36 RTS 37 DCD 38 TXD 39 RXD 40 DTR

43 GND 44 GND 45 MAIN_ANT 46 GND 47 GND 48* GPIO_37

51 DBG_TXD 52 NETLIGHT 53 GND 54 GND 55 GNSS_ANT 56 GND

*Note: SIM7500A could not support GNSS Function.

Before the normal power up, pin48 cannot be pulled up.

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PI

Power input

PO

Power output

AI

Analog input

AIO

Analog input/output

I/O

Bidirectional input /output

DI

Digital input

DO

Digital output

DOH

Digital output with high level

DOL

Digital output with low level

PU

Pull up

PD

Pull down

Default status

VBAT

Power supply, voltage range: 3.4

4.2V.

x. 50Ma

current output for external circuit,

If unused, keep it

1, 3, 6,

4,56

RESET has been

internally.

USIM_RST

13

DO

USIM Reset

2.2 Pin Description

Table 4: IO parameters definition

Pin type Description

Table 5: Pin description

Pin name Pin No. Power Supply

33,34 PI

L11_1V8 23 PO

15,16,22 ,28,29,3

GND

1,32,35, 43,44,46 ,47,53,5

System Control

PWRKEY 30 DI,PU

Description Comment

～

1.8V output with Ma open.

such as level shift circuit.

Ground

System power on/off control input, active low.

Default 0.8V

RESET 24 DI, PU

USIM interface

USIM_DATA 10 I/O,PU

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System reset control input, active low.

USIM Card data I/O, which has been pulled up via a 100KR resistor to USIM_VDD internally.

13

pulled up to 1.8V via a resistor

All lines of USIM interface should be protected against ESD.

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USB_DP

Positive line of the differential, bi-directional USB signal.

RXD

39

DI,PU

Receive Data

DCD

37

DOH

Carrier detects

TXD

38

DOH

Transmit Data

DTR

40

DI,PU

DTE get ready

SCL

4

DO

I2C clock output

PCM_OUT

21

DO

PCM data output.

If unused, please

PCM_IN

20

DI

PCM data input.

PCM_SYNC

19

DO

PCM data frame sync signal.

PCM_CLK

18

DO

PCM data bit clock.

MCLK

17

DO

Audio Master clock

GPIO

LED control output as network status indication.

If unused, please

Operating status output.

Low level: Power off

GPIO_1

26

IO

GPIO

Default: GPIO

L: USIM is inserted

GPIO_37

48

IO

GPIO

USIM_CLK 11 DO USIM clock

Power output for USIM card, its

USIM_VDD 14 PO

output Voltage depends on USIM card type automatically. Its output current is up to 50Ma.

USB

VBUS 9 DI,PD

USB_DM 7 I/O

Valid USB detection input with

3.6～5.85V detection voltage

Negative line of the differential, bi-directional USB signal.

8 I/O

UART interface

RTS 36 DOH Request to send CTS 41 DI,PU Clear to Send

RI 42 DOH Ring Indicator

I2C interface

SDA 5 I/O I2C data input/output

PCM interface

If unused, keep them open.

NETLIGHT 52 DO

STATUS 50 DO

GPIO_49 49 IO GPIO

USIM_DET 12 IO

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keep them open.

High level: Power on and firmware ready

keep them open.

Optional: USIM card detecting input. H: USIM is removed

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If unused, please

ADC

25

AI

Analog-digital converter input

RF interface

MAIN _ANT 45 AIO MAIN antenna soldering pad DIV_ANT 2 AI Auxiliary antenna soldering pad NC 55 AI

Other interface

ISINK 27 AI Ground-referenced current sink. DGB_TXD 51 DO Use for debug

2.3 Mechanical Information

The following figure shows the package outline drawing of Module.

keep them open.

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Figure 3: Dimensions (Unit: mm)

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2.4 Footprint Recommendation

Figure 4: Footprint recommendation (Unit: mm)

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Symbol

Description

Min.

Typ.

Max.

Unit

VBAT

Module power voltage

3.4

3.8

4.2

V

VBAT(peak)

VBAT

34

33

32

31

GND

MODULE

C101

FB101

5.1V 500mW

220uF

VBAT

33pF

C102

3 Interface Application

3.1 Power Supply

On VBAT pads, a ripple current up to 2A typically, may cause voltage drop. Therefore, the power supply for these pads must be able to provide sufficient current up to more than 2A in order to avoid the voltage drop of more than 300mV.

Table 6: VBAT Pins electronic characteristic

I I

VBAT(average)

I

VBAT(sleep)

I

VBAT(power-off)

Module power peak current in normal mode. 1.0 - 2 A

Module power average current in normal mode

Please refer to the table 34

Power supply current in sleep mode

Module power current in power off mode. - - 20 uA

3.1.1 Power supply Design Guide

Make sure that the voltage on the VBAT pins will never drop below 3.4V.

Note: If the power supply for BAT pins can support up to 2A, using a total of more than 220uF capacitors is recommended, or else users must use a total of 1000uF capacitors, in order to avoid the voltage drop of more than 300mV.

Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band can be used for EMC. These capacitors should be put as close as possible to VBAT pads. Also, user should keep VBAT trace on the circuit board wider than 2 mm to minimize PCB trace impedance. The following figure shows the recommended circuit.

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Figure 5: Power supply application circuit

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4

Crownpo

CDZ55C5V1SM

500mW

0805

Vin

Vout

GND

FB

3

+

PWR_CTRL

R102

R101

VBAT

100K

47K

+

C103

330uF

C104

100nF

U101

MIC29302

5

4

1

2

C101 C102

100uF

1uF

DC INPUT

R103 470R

On/Off

FUSE

Vin

Vout

FB

U101

1

2

3

4

5

LM2596-

ADJ

+

100uH

MBR360

L101

C

101

+

C102

D102 C103

R102

R101

FB101

330uF

VBAT

2.2

K

1

K

100uF

1uF

C104

100nF

270 ohm@100

Mhz

DC INPUT

PWR_

CTRL

GND

On/Off

In addition, in order to guard over voltage protection, it is suggested to use a zener diode with 5.1V reverse zener voltage and more than 500mW power dissipation.

Table 7: Recommended zener diode list

No. Manufacturer Part Number power dissipation Package

1 On semi MMSZ5231BT1G 500mW SOD123 2 Prisemi PZ3D4V2H 500mW SOD323 3 Vishay MMSZ4689-V 500mW SOD123

3.1.2 Recommended Power Supply Circuit

It is recommended that a switching mode power supply or linear regulator power supply is used. It is important to make sure that all the components used in the power supply circuit can resist a peak current up to 2A. The following figure shows the linear regulator reference circuit with 5V input and 3.8V output.

Figure 6: Linear regulator reference circuit

If there is a big voltage difference between input and output for VBAT power supply, or the efficiency is extremely important, then a switching mode power supply will be preferable. The following figure shows the switching mode power supply reference circuit.

Figure 7: Switching mode power supply reference circuit

Note: The Switching Mode power supply solution for VBAT must be chosen carefully against Electro Magnetic Interference and ripple current from depraving RF performance.

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47K

PWRKEY

Power

On off logic

Diode

dVDD

MODULE

100Ω

100nF

4.7K

Turn on /off

impulse

3.1.3 Voltage Monitor

To monitor the VBAT voltage, the AT command “AT+CBC” can be used. For monitoring the VBAT voltage outside or within a special range, the A T command “AT+CVALARM” can be used to enable the under-voltage warning function. If users need to power off Module, when the VBAT voltage is out of a range, the AT command “AT+CPMVT” can be used to enable under-voltage power-off function.

Note: Under-voltage warning function and under-voltage power-off function are disabled by default. For more information about these AT commands, please refer to Document [1].

3.2 Power on/Power off/Reset Function

3.2.1 Power on

Module can be powered on by pulling the PWRKEY pin down to ground. The PWRKEY pin has been pulled up to dVDD internally, so you does not need to pull it up externally. It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the PWRKEY pin. Please refer to the following figure for the recommended reference circuit.

The power-on scenarios are illustrated in the following figure.

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Figure 8: Reference Power on/off Circuit

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STATUS

(Output)

T

on

VBAT

PWRKEY

(Input)

T

on(status)

UART Port

Undefined

Active

T

on(uart)

Undefined

Active

USB Port T

on(usb)

Symbol

Parameter

Min.

Typ.

Max.

Unit

output high level(indicating power up ready )

on(uart)

on(usb)

Figure 9: Power on timing sequence

Table 8: Power on timing and electronic characteristic

Ton

T

on(status)

T

The time from power-on issue to UART port ready 20 s

T

The time from power-on issue to USB port ready 20 s

The time of active low le vel impulse of P W RKEY pin to power on module

The time from power-on issue to STATUS pin

VIH Input high level voltage on PWRKEY pin 0.6 0.8 1.8 V VIL Input low level voltage on PWRKEY pin -0.3 0 0.5 V

3.2.2 Power off

The following methods can be used to power off Module.

● Method 1: Power off Module by pulling the PWRKEY pin down to ground.

● Method 2: Power off Module by AT command “AT+CPOF”.

● Method 3: Over-voltage or under-voltage automatic power off. The voltage range can be set by

AT command

● Method 4: Over-temperature or under-temperature automatic power off.

“AT+CPMVT”.

Note: If the temperature is outside the range of -30~+80 AT port. If the temperature is outside the range of -40~+85 automatically.

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100 500 - ms

22 - -

℃, some warning will be reported via

℃, M odu l e w i l l be power ed

20

s

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(

Output

)

T

off

( Input

)

T

off(status)

UART Port

UndefinedActive

T

off(uart)

T

on

T

off-on

USB Port

Undefined

Active

T

off(

usb

)

PWRKEY

STATUS

Min.

Typ.

Max.

The active low level time pulse on PWRKEY pin to

off issue to STATUS pin output

low level(indicating power off )*

off(uart)

T

off(usb)

The time from power-off issue to USB port off

15 - -

s

For details about “AT+CPOF” and “AT+CPMVT”, please refer to Document [1].

These procedures will make modules disconnect from the network and allow the software to enter a safe state and save data before modules are powered off completely. The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.

Figure 10: Power off timing sequence

Table 9: Power off timing and Electronic Characteristic

Symbol Parameter

T

off

off(status)

The time from power-off issue to UART port off 15 - - s

off-on

power off module The time from power-

The buffer time from power-off issue to power-on issue

3.2.3 Reset Function

Time value

Unit

2.5 -- -- s

22 - - s

0 - - s

Module can be reset by pulling the RESET pin down to ground.

Note: This function is only used as an emergency reset when AT command “AT+CPOF” and the PWRKEY pin all have lost efficacy.

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Reset

impulse

RESET

Reset

Logic

R

1.8V

MODULE

100Ω

100nF

The RESET pin has been pulled up to 1.8V internally, so it does not need to be pulled up externally. It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the RESET pin. Please refer to the following figure for the recommended reference circuit.

Figure 11: Reference reset circuit

Table 10: RESET pin electronic characteristic

Symbol Description Min. Typ. Max. Unit

T

reset

The active low level time impulse on RESET pin to reset module

100 ms

VIH Input high level voltage 1.17 1.8 2.1 V VIL Input low level voltage -0.3 0 0.8 V

3.3 UART Interface

Module provides a 7-wire UART (universal asynchronous serial transmission) interface as DCE (Data Communication Equipment). AT commands and data transmission can be performed through UART interface.

3.3.1 UART Design Guide

The following figures show the reference design.

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TXD RXD

RTS CTS

DTR

DCD

RI

TXD RXD RTS CTS DTR DCD RING

MODULE

(DCE)

HOST

(DTE

)

UART

MODULE

(

DCE

)

HOST

(DTE)

UARTUART

TXD RXD

RTS CTS

DTR

DCD

RI

TXD RXD RTS CTS DTR DCD RING

Interrupt

Wake up host

TXD RXD

RTS CTS DTR DCD

RI

A7

A1 A2 A3 A4 A5 A6

MODULE

UART port

A8

B7

B1 B2 B3 B4 B5 B6

B8

VCCA OE

VDD_1V8 or

External 1V8

100nF

3.3V

100nF

VCCB

GND

TXD_3.3V

RXD_3.3V

RTS_3.3V

CTS_3.3V DTR_3.3V DCD_3.3V

RI_3.3V

47K 47K

Figure 12: UART full modem

Figure 13: UART null Modem

The Module UART is 1.8V voltage interface. If user’s UART application circuit is a 3.3V voltage interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR provided by Texas Instruments is recommended. The following figure shows the voltage matching reference design.

Figure 14: Reference circuit of level shift

To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect Module to the RS-232-C interface, for example SP3238ECA, etc.

Note: Module supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. The default band rate is 115200bps.

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Idle

HIGH

LOW

Receiving SMS and any URC report coming.

AT+CFGRI=1

RI

Clear by AT+CRIRS

Idle

HIGH

LOW

Receiving SMS .

AT+CFGRI=0

RI

Clear by AT+CRIRS

HIGH

LOW

Idle

Ring

Establish

the call

Hang up

the call

Idle

RI

100ms

5900ms

3.3.2 RI and DTR Behavior

The RI pin can be used to interrupt output signal to inform the host controller such as application CPU.

Normally RI will stay at high level until certain conditions such as receiving SMS, or a URC report come in. It will then change to low level. It will stay low until the host controller clears the interrupted event with “AT+CRIRS” AT command.

Figure 15: RI behaviour

（SMS and URC report）

Normally RI will be kept high until a voice call, then it will output periodic rectangular wave with 5900ms low level and 100ms high level. It will output this kind of periodic rectangular wave until the call is answered or hung up.

Figure 16: RI behaviour

（voice call）

Note: For more details of AT commands about UART, please refer to document [1] and [22].

DTR pin can be used to wake Module from sleep. When Module enters sleep mode, pulling down DTR can wake Module.

3.4 USB Interface

The Module contains a USB interface compliant with the USB2.0 specification as a peripheral, but the USB charging function is not supported.

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USB_

VBU

S

USB_

DM

USB_DP

GND

MODULE

HOST

USB

VBUS

D

-

D

+

GND

D

2

D

1

Bead

D

3

L

3.4.1 USB Application Guide

Module can be used as a USB device. Module supports the USB suspend and resume mechanism which can reduce power consumption. If there is no data transmission on the USB bus, Module will enter suspend mode automatically and will be resumed by some events such as voice call, receiving SMS, etc.

Figure 17: USB reference circuit

Because of the high bit rate on USB bus, more attention should be paid to the influence of the junction capacitance of the ESD component on USB data lines. Typically, the capacitance should be less than 1pF. It is recommended to use an ESD protection component such as ESD9L5.0ST5G provided by On Semiconductor (

www.onsemi.com ).

D3 is suggested to select the diode with anti-ESD and voltage surge function, or customer could add a ZENER diode for surge clamping. The recommend diodes list please refer to table 7. L is recommended (MURATA) DLW21SN371SQ2L.

Note

：

The USB_DM and USB_DP nets must be traced by 90Ohm+/-10% differential

impedance.

3.5 USIM Interface

Module supports both 1.8V and 3.0V USIM Cards.

Table 11: USIM Electronic characteristic in 1.8V mode (USIM_VDD=1.8V)

Symbol Parameter

USIM_ VDD

LDO power output voltage

Min. Typ. Max. Unit

1.75 1.8 1.95 V

VIH High-level input voltage VIL Low-level input voltage VOH High-level output voltage VOL Low-level output voltage

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0.65*USIM_VDD - USIM_VDD +0.3 V

-0.3 0 0.35*USIM_VDD V USIM_VDD -0.45 - USIM_VDD V 0 0 0.45 V

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MODULE

USIM

_VDD

USIM_

CLK

USIM_

DATA

USIM_

RST

VCC GND RST VPP CLK I

/O

51

Ω

100nF

C

707 10M006 512

SIM CARD

51Ω

51

Ω

22pF22

pF22pF

ESDA6

V1

Table 12: USIM Electronic characteristic 3.0V mode (

Symbol Parameter

USIM_ VDD

LDO power output voltage

VIH High-level input voltage VIL Low-level input voltage VOH High-level output voltage VOL Low-level output voltage

Min. Typ. Max. Unit

2.75 2.95 3.05 V

0.65*USIM_VDD - USIM_VDD +0.3 V

-0.3 0 0.25*USIM_VDD V USIM_VDD -0.45 - USIM_VDD V 0 0 0.45 V

USIM_VDD=2.95V)

3.5.1 USIM Application Guide

It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST (

www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the USIM

peripheral circuit should be close to the USIM card socket. The following figure shows the 6-pin SIM card holder reference circuit.

Figure 18: USIM interface reference circuit

Note: USIM_DATA has been pulled up with a 100KΩ resistor to USIM_VDD in module. A 100nF capacitor on USIM_VDD is used to reduce interference. For more details of AT commands about USIM, please refer to document [1].

3.5.2 SIM Card Design Guide

SIM card signal could be interferenced by some high frequency signal, it is strongly recommended to follow these guidelines while designing:

 SIM card holder should be far away from antenna  SIM traces should keep away from RF lines, VBAT and high-speed signal lines

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Signal

Description

C1

USIM_VDD

USIM Card Power supply.

C2

USIM_RST

USIM Card Reset.

C3

USIM_CLK

USIM Card Clock.

C5

GND

Connect to GND.

C6

VPP

C7

USIM_DATA

USIM Card data I/O.

 The traces should be as short as possible  Keep SIM card holder’s GND connect to main ground directly  Shielding the SIM card signal by ground well  Recommended to place a 100nF capacitor on SIM_VDD line and keep close to the SIM

card holder

 Add some TVS which parasitic capacitance should not exceed 50pF  Add 51Ω resistor to (SIM_RST/SIM_CLK/SIM_DATA) signal could enhance ESD

protection

 Add 22pF capacitor to (SIM_RST/SIM_CLK/SIM_DATA) signal to induce RF signal

interference

3.5.3

Recommended USIM Card Holder

It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by Amphenol. User can visit

http://www.amphenol.com for more information about the holder.

Table 13: Amphenol USIM Socket Pin Description

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Figure 19: Amphenol SIM card socket

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PCM Clock/Sync Source

Master Mode(Fixed)

3.6 PCM Interface

Module provides a PCM interface for external codec, which can be used in master mode with short sync and 16 bits linear format.

Table 14: PCM Format

Characteristics Specification

Line Interface Format Linear(Fixed) Data length 16bits(Fixed)

PCM Clock Rate 2048 KHz (Fixed) PCM Sync Format Short sync(Fixed) Data Ordering MSB

Note: For more details about PCM AT commands, please refer to document [1].

3.6.1 PCM Timing

Module supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec.

Figure 20: PCM_SYNC timing

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Figure 21: EXT codec to module timing

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Parameter

Description

Min.

Typ.

Max.

Unit

488

T(clkh)

PCM_CLK high level time

–

244 – ns

T(clkl)

PCM_CLK low level time

–

244 – ns

PCM_SYNC setup time high before falling edge of

PCM_IN setup time before falling edge of T(pdout)

Delay from PCM_CLK rising to PCM_OUT valid

– – 60

ns

Delay from PCM_CLK falling to PCM_OUT

Figure 22: Module to EXT codec timing

Table 15: PCM Timing Parameters

T(sync) PCM_SYNC cycle time – 125 – μs T(synch) PCM_SYNC high level time –

– ns T(syncl) PCM_SYNC low level time – 124.5 – μs T(clk) PCM_CLK cycle time – 488 – ns

T(susync)

T(hsync)

T(sudin)

PCM_CLK PCM_SYNC hold time after falling edge of

PCM_CLK

– 122 – ns

– 366 – ns

60 – – ns

T(hdin) PCM_IN hold time after falling edge of PCM_CLK 60 – – ns

T(zdout)

HIGH-Z

– – 60 ns

3.6.2 PCM Application Guide

The following figure shows the external codec reference design.

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MODULE

PCM_IN

PCM_SYNC PCM_CLK

PCM_OUT

33pF

ADCOUT

FS BCLK

DACIN

MCLK

SCLK SDIO

SCL SDA

VDDA

VDDSPK

VDDD

3.3V

3.8V VDD_1V8

MIC+

MIC-

MICBIAS

MOUT

MIC

SPK

NAU8810

1.3K

1uF 1uF

47uF

Module

SDA

Device

SDA

GNDGND

SCL

Figure 23: Audio codec reference circuit

Note: Module can transmit PCM data by the USB port besides the PCM interface. For more details please refer to documents [1] and [23].

3.7 I2C Interface

Module provides a I2C interface compatible with I2C specification, version 2.1, with clock rate up to 400 kbps. Its operation voltage is 1.8V.

3.7.1 I2C Design Guide

The following figure shows the I2C bus reference design.

Figure 24: I2C reference circuit

：

Note SDA and SCL have pull-up resistors in module. So, 2 external pull up resistors are not needed in application circuit. “AT+CRIIC and AT+CWIIC” AT commands could be used to read/write register values of the I2C peripheral devices. For more details about A T commands please refer to document [1].

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Module

NETLIGHT

VBAT

4.7K

47K

R

NETLIGHT pin status

Module status

Always On

Searching Network/Call Connect

200ms ON, 200ms OFF

Data Transmit

800ms ON, 800ms OFF

Registered network

OFF

Power off / Sleep

Pin name

Pin number

Description

3.8 Network Status

The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the following figure.

Figure 25: NETLIGHT reference circuit

Note: The value of the resistor named “R” depends on the LED characteristic.

Table 16: NETLIGHT pin status

Note: NETLIGHT output low level as “OFF”, and high level as “ON”.

3.9 Operating Status Indication

The pin50 is for operating status indication of the module. The pin output is high when module is powered on, and output is low when module is powered off.

Table 17: Pin definition of the STATUS

STATUS 50 Operating status indication

Note: For timing about STATUS, please reference to the chapter “3.2 power on/down scenarios”

3.10 Pin Multiplex Function

Some pins of Module could be used for alternate function besides default function.

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MODULE

ISINK

ISINK pin is

VBAT

tolerant-suitable for driving

white LEDs

Current Controls

Passive

device

+

-

VBAT

Pin Number

Pin Name

Default Function

Alternate Function

4 SCL SCL GPIO11

5

SDA

GPIO10

12

USIM_DET

GPIO34

USIM_DET

18 PCM_CLK

PCM_CLK

GPIO23,SPI_CLK I2C_SCL

19

PCM_SYNC

GPIO20,SPI_MOSI

20

PCM_IN

PCM_IN,

GPIO21,SPI_MISO

21 PCM_OUT

PCM_OUT

GPIO22,SPI_CS_N I2C_SDA

Table 18: Pin multiplex function list

Note：For more details of AT commands about GPIO multiplex function, please refer to document [1].

3.11 Other interface

3.11.1 Sink Current Source

The ISINK pin is VBAT tolerant and intended to drive some passive devices such as LCD backlight, white LED, etc. Its output current can be up to 40 mA and be set by the AT command “AT+ CLEDITST”.

Table 19: Sink current electronic characteristic

Symbol Description Min. Typ. Max. Unit

V

Voltage tolerant 0.5 - VBAT V

ISINK

I

Current tolerant 0 - 40 mA

ISINK

ISINK is a ground-referenced current sink. The following figure shows its reference circuit.

Figure 26: ISINK reference circuit

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Characteristics

Min.

Typ.

Max.

Unit

Resolution

15

Bits

Input Range

0.1 1.7

V

Input serial resistance

1

–

MΩ

Note: The sinking current can be adjusted to meet the design requirement through the AT command “AT+ CLEDITST =<0>, <value>”.The “value” ranges from 0 to 8, on behalf of the current from 0mA to 40mA by 5mA step.

3.11.2 ADC

Module has 1 dedicated ADC pins named ADC. They are available for digitizing analog signals such as battery voltage and so on. These electronic specifications are shown in the following table.

Table 20: ADC Electronic Characteristics

–

Note: “AT+CADC” can be used to read the voltage of the ADC pins, for more details, please refer to document [1].

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Frequency

Power

Min.

E-GSM900

33dBm ±2dB

5dBm ± 5dB

DCS1800

30dBm ±2dB

0dBm ± 5dB

E-GSM900 (8-PSK)

27dBm ±3dB

5dBm ± 5dB

DCS1800 (8-PSK)

26dBm +3/-4dB

0dBm ±5dB

WCDMA B2

24dBm +1/-3dB

<-50dBm

WCDMA B5

24dBm +1/-3dB

<-50dBm

LTE-FDD B1

23dBm +/-2.7dB

<-40dBm

LTE-FDD B2

23dBm +/-2.7dB

<-40dBm

LTE-FDD B3

23dBm +/-2.7dB

<-40dBm

LTE-FDD B4

23dBm +/-2.7dB

<-40dBm

LTE-FDD B7

23dBm +/-2.7dB

<-40dBm

LTE-FDD B8

23dBm +/-2.7dB

<-40dBm

LTE-FDD B17

23dBm +/-2.7dB

<-40dBm

LTE-FDD B20

23dBm +/-2.7dB

<-40dBm

Frequency

Receiving

Transmission

E-GSM900

925～960 MHz

880～915 MHz

DCS1800

1805～1880 MHz

1710～1785 MHz

WCDMA B2

1930~1990 MHz

1850~1910 MHz

WCDMA B5

869~894 MHz

824~849 MHz

LTE-FDD B1

1920 ~1980 MHz

2110 ~2170 MHz

LTE-FDD B2

1930 ~1990 MHz

1850 ~1910 MHz

LTE-FDD B3

1710 ~1785 MHz

1805 ~1880 MHz

LTE-FDD B4

2110 ~2155 MHz

1710 ~1755 MHz

LTE-FDD B7

2500 ~2570 MHz

2620~2690 MHz

LTE-FDD B8

880 ~915 MHz

925~960 MHz

LTE-FDD B17

734 ~746 MHz

704 ~716 MHz

LTE-FDD B20

832 ~862 MHz

791~821 MHz

GPS

4 RF Specifications

4.1 WCDMA/LTE RF Specifications

Table 21: Conducted transmission power

Table 22: Operating frequencies

1574.4 ～1576.44 MHz GLONASS BD

1598 ～1606 MHz 1559 ～1563 MHz

-

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Frequency

Receive sensitivity(Typical)

Receive sensitivity(MAX)

< -109dBm

< -110dBm

WCDMA B5

< -110dBm

3GPP

LTE

See table 24

3GPP

2

-102.7

-99.7

-98

-95

-101

-93.2

-92

FDD

20

-97

-94

TBD

-91.2

-90

FDD

700MHz-960MHz

<0.5dB

1710MHz-2170MHz

<0.9dB

Table 23: Conducted receive sensitivity

E-GSM900 < -109dBm DCS1800 WCDMA B2

3GPP 3GPP 3GPP

Table 24: Reference sensitivity (QPSK)

E-UTRA band

1.4 MHz 3MHz 5MHz 10MHz 10 MHz 15 MHz 20 MHz

3GPP standard Test value 3GPP standard

Duplex

1 - - -100 -97 -101.3 -95.2 -94 FDD

3 -101.7 -98.7 -97 -94 -100 -92.2 -91 FDD 4 -104.7 -101.7 -100 -97 -102 -95.2 -94 FDD 7 -98 -95 TBD -93.2 -92 FDD 8 -102.2 -99.2 -97 -94 -99.8 FDD 17 - - -97 -94 -102.4 FDD

4.2 WCDMA/LTE Antenna Design Guide

Users should connect antennas to Module’s antenna pads through the micro-strip line or other types of RF trace. The trace impedance must be controlled in 50Ω. SIMCom reco mmends that the total insertion loss between Module and antenna should meet the following requirements:

Table 25: Trace Loss

Frequency Loss

2300MHz-2650MHz <1.2dB

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit should be added. The following figure is the recommended circuit.

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RF connector

R2

C1

MODULE

45

MAIN_

ANT

GND

C

2

44

R1

Matching circuit

MAIN ANT

RF connector

R

2

C

1

MODULE

45

MAIN

_

ANT

GND

C2

44

R1

Matching circuit

MAIN ANT

D1

R4

C3

MODULE

2

DIV_ANT

GND

C4

1

R3

Matching circuit

Diversity antenna

D2

Figure 27: Antenna matching circuit (MAIN_ANT)

In above figure, the components R1,C1,C2 and R2 are used for antenna matching, the value of components can only be achieved after the antenna tuning and usually provided by antenna vendor. By default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component D1 is a TVS for ESD protection, and it is optional for users according to application environment. The RF test connector is used for the conducted RF performance test, and should be placed as close as to the module’s MAIN_ANT pin. The traces impedance between Module and antenna must be controlled in 50Ω.

Figure 28: Antenna matching circuit (DIV_ANT)

In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4 are 0Ωresistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is optional for users according to application environment. Two TVS are recommended in the table below.

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Package

Part Number

Vender

0201

LXES03AAA1-154

Murata

0402

LXES15AAA1-153

Table 26: Recommended TVS

Murata

Note：SIMCom suggests the LTE auxiliary antenna to be kept on, since the re are many high bands in the designing of FDD-LTE. Because of the high insert loss of the RF cable and layout lines, the receiver sensitivity of these bands above will have risk to meet the authentication without the diversity antenna. For more details about auxiliary antenna design notice, please

refer to document [25]

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Parameter

Min.

Max.

Unit

Voltage at VBAT

-0.5

6.0

V

Voltage at VBUS

-0.5

6.3

V

Voltage at digital pins (RESET,SPI,GPIO,I2C,UART,PCM)

-0.3

2.1

V

Voltage at digital pins :USIM

-0.3

3.05

V

Voltage at PWRKEY

-0.3

1.8

Parameter

Min.

Typ.

Max.

Unit

Voltage at VBAT

3.4

3.8

4.2

V

Voltage at VBUS

3.6 5 5.25

V

5 Electrical Specifi cations

5.1 Absolute Maximum Ratings

Absolute maximum rating for digital and analog pins of Module are listed in the following table:

Table 27: Absolute maximum ratings

5.2 Operating Conditions

Table 28: Recommended operating ratings

Table 29: 1.8V Digital I/O characteristics*

Parameter Description Min. Typ. Max. Unit

VIH High-level input voltage VIL Low-level input voltage VOH High-level output voltage VOL Low-level output voltage

IOH

IOL

High-level output current(no pull down resistor)

Low-level output current(no pull up resistor)

1.17 1.8 2.1 V

-0.3 0 0.63 V

1.35 - 1.8 V 0 - 0.45 V

- 2 mA

- -2 - mA

IIH

IIL

*Note: These parameters are for digital interface pins, such as SPI, GPIOs (NETLIGHT), I2C, UART, PCM.

The operating temperature of Module is listed in the following table.

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Input high leakage current (no pull down resistor)

Input low leakage current(no pull up resistor)

- - 1 uA

-1 - - uA

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Parameter

Min.

Typ.

Max.

Unit

Normal operation temperature

-30

25

80

Extended operation temperature*

-40

25

85

Storage temperature

-45

25

+90

GSM/WCDMA / LTE

Connection between two subscribers is in progress. In this case, the

AT command “AT+CFUN=0” can be used to set the module to a

unctionality mode without removing the power supply. In this mode, the RF part of the module will not work and the USIM card will not be accessible, but the serial port and USB port are still

AT command “AT+CFUN=4” or pulling down the FLIGHTMODE pin can be used to set the module to flight mode without removing the power supply. In this mode, the RF part of the module will not work

ll accessible. The power

Table 30: Operating temperature

℃

*Note: Module is able to make and receive voice calls, data calls, SMS and make WCDMA/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range.

5.3 Operating Mode

5.3.1 Operating Mode Definition

The table below summarizes the various operating modes of Module series products.

Table 31: Operating mode Definitions

Mode Function

In this case, the current consumption of module will be reduced to the

Sleep

GSM/WCDMA / LTE Idle

Talk

minimal level and the module can still receive paging message and SMS.

Software is active. Module is registered to the network, and the module is ready to communicate.

power consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences, antenna.

Normal operation

GSM/WCDMA/LTE Standby

Module is ready for data transmission, but no data is currently sent or received. In this case, power consumption depends on network settings.

There is data transmission in progress. In this case, power

GPRS/EDGE/WCDM A / LTE transmission

consumption is related to network settings (e.g. power control level); uplink/downlink data rates, etc.

minimu m f Minimum functionality mode

accessible. The power consumption in this mode is lower than normal

mode.

Flight mode

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consumption in this mode is lower than normal mode.

Module will go into power off mode by sending the AT command Power off

“AT+CPOF” or by pulling down the PWRKEY pin normally. In this

mode the power management unit shuts down the power supply and

software is not active. The serial port and USB are is not accessible.

5.3.2 Sleep Mode

In sleep mode, the current consumption of module will be reduced to the minimal level, and module can still receive paging message and SMS. Several hardware and software conditions must be satisfied together in order to let Module enter into sleep mode:

1. UART condition

2. USB condition

3. Software condition

Note: Before designing, pay attention to how to realize sleeping/waking function and refer to Document [26] for more details.

5.3.3 Minimum Functionality Mode and Flight Mode

Minimum functionality mode ceases a majority function of module, thus minimizing the power consumption. This mode is set by the AT command which provides a choice of the functionality levels.

● AT+CFUN=0: Minimum functionality

● AT+CFUN=1: Full functionality (Default)

● AT+CFUN=4: Flight mode

If Module has been set to minimum functionality mode, the RF function and USIM card function will be closed. In this case, the serial port and USB are still accessible, but RF function and USIM card will be unavailable. If Module has been set to flight mode, the RF function will be closed. In this case, the serial port and USB are still accessible, but RF function will be unavailable. When Module is in minimum functionality or flight mode, it can retu rn to full functionality by the AT command “AT+CFUN=1”.

5.4 Current Consumption

The current consumption is listed in the table below.

Table 32: Current consumption on VBAT Pins (VBAT=3.8V)

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UMTS Sleep/Idle Mode

LTE Sleep/Idle mode

(without USB connection)

UMTS Talk

WCDMA B5

@Power 23.48dBm Typical: 480mA

HSDPA Data

WCDMA B2

@Power 24dBm T y pical: TBD

WCDMA B5

@Power 24dBm T y pical: TBD

LTE Data

@5 MHz 22.2dBm Typical: 589mA

@20 MHz 22.38dBm Typical: 626mA

@5 MHz 23.05dBm Typical: 519mA

@20 MHz 22.83dBm Typical: 600mA

@5 MHz 22.69dBm Typical: 516mA @10 MHz 22.9dBm Typical: 512mA

Part

Contact discharge

Air discharge

+/-5K

+/-10K

Antenna port

+/-5K

+/-10K

USB

WCDMA supply current (without USB connection)

LTE supply current

WCDMA B2

LTE-FDD B2

LTE-FDD B4

LTE-FDD B17

Sleep mode @DRX=9 Typical: 1.11 Idle mode @DRX=9 Typical: 17.5

Sleep mode Typical: 1.56 Idle mode Typical: 22

@Power 22dBm Typical: 524mA

@10 MHz 22.7dBm Typical: 577mA

@10 MHz 23.04dBm Typical: 556mA

5.5 ESD Notes

Module is sensitive to ESD in the process of storage, transporting and assembling. Especially, Module is mounted on the users’ mother board, The ESD components should be placed beside the connectors which human body might touch, such as USIM card holder, audio jacks, switches and keys, etc. The following table shows the Module ESD measurement performance without any external ESD component.

Table 33: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)

GND VBAT

UART PCM Other PADs

+/-6K +/-12K

+/-4K +/-8K +/-4K +/-8K +/-4K +/-8K +/-3K +/-6K

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A

D

F

H

B

G

C

E

6 SMT Production Guide

6.1 Top and Bottom View of Module

Figure 29: Top and bottom view of Module

6.2 Label Information

Figure 30: Label Information

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No.

Description

E

Serial Number (SN)

F

International Mobile Equipment Identity (IMEI)

Table 34: The Description of Label Information

A LOGO B No.1 Pin C Project Name D Part Number

G FCC ID H QR code

6.3 Typical SMT Reflow Profile

SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only a generic recommendation and should be adjusted to the specific application and manufacturing constraints.

Figure 31: The ramp-soak-spike Reflow Profile of Module

Note: For more details about secondary SMT, please refer to the document [21].

6.4 Moisture Sensitivity Level (MSL)

Module is qualified to Mois ture Sensitivity Level (MSL) 3 in a ccordance with JEDEC J -STD-033.

If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not heat-resistant, and only can be baked at 45° C.

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Moisture Sensitivity Level

Floor Life (out of bag) at factory ambient≤30°C/60% RH or as

2a

4 weeks

4

72 hours

Mandatory bake before use. After bake, it must be reflowed within the

Table 35: Moisture Sensitivity Level and Floor Life

(MSL)

stated

1 Unlimited at ≦30℃/85% RH 2 1 year

3 168 hours

5 48 hours 5a 24 hours 6

time limit specified on the label.

NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.

6.5 Stencil Foil Design Recommendation

The recommended thickness of stencil foil is more than 0.1mm.

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Length（±3mm）

Width（±3mm）

Module number

7 Packaging

Module module support tray packaging.

Module tray drawing：

Figure 32: Packaging introduce

Figure 33: Module tray drawing introduce

Table 36: Tray size

242.0 161.0 15

Small carton drawing：

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270

180

120

15*20=300

Figure 34: Small carton drawing introduce

Table 37: Small Carton size

Length（±10mm） Width（±10mm） Height（±10mm） Module number

Big carton drawing：

Table 38: Big carton size

Figure 35: Big carton drawing introduce

Length（±10mm） Width（±10mm） Height（±10mm） Module number

380 280 280 300*4=1200

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C103

C102

C101

VBAT VBAT

Power supply

220uF

100uF 1uF

C109 100nF

USIM_VDD

USIM_RST

USIM_CLK

USIM_DATA

34 33

Power supply

35 32

GND GND

POWERKEY

30

24

4.7K

47K

Turn on/off pulse

6

GND GND

0R

C107

C106

NC

MAIN_ANT

45

46

GND GND

44

GND

47

SIM_DATA

SIM_VDD

SIM_RST

SIM_CLK

ESDA6V1W5

USB_VBUS

9 7

NETLIGHT

10K

300R

LED

Network

Status

USB_DP

8

USB_DN

USB_VBUS USB_DN USB_DP

12 25

48

26

49

52

50 51

10 11 13 14

16

GND GND

15

22 28

GND GND

43

GND

29

SIM7500x

R102

R103

R104

R105

R106

R107

TVS

VBAT

23

L11_1V8

VBAT

If USB interface is used， Connect

USB_VBUS to 3.6V-5.25V

SIM_DET

ADC

GPIO_1 GPIO_37 GPIO_49

STATUS

DBG_TXD

C114 100NF

C115 22PF C117 22PFC116 22PF

R120 22R

R121 22R

R122 22R

Reset pulse

TXD RXD

CTS RTS

RI DCD DTR

UART_TXD UART_RXD

UART_CTS UART_RTS

UART_RI UART_DCD UART_DTR

38 39 41 36 42 37 40

RESET

SCL

I2C_SCL

4

SDA

5

I2C_SDA

18

20 19 21

PCM_IN

PCM_OUT

PCM_SYNC

PCM_CLK

Audio CODEC Chip

or

DSP

17

I2S_MCLK

31

GND

27

ISINK

DIV_ANT

2

R101

1

GND

GNSS_ANT

55

54

GND GND

53

GND

56

0R

C104

C105

Div Antenna

NC

3

GND

C104

4.7uF

C108

33pF

NC

L101

GNSS Antenna

NC

L102

Appendix

A. Reference Design

Note: The UART port suggest to be used by isolated circuit .

Figure 36: Reference design

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Multislot definition(GPRS/EDGE)

1 1 1 2 2 2 1

3

3 2 2

3

4 3 1

4

5 2 2

4

6 3 2 4 7 3 3

4

8 4 1

5

9 3 2 5 10 4 2

5

11 4 3

5

12 4 4

5

CS 3 = 15.6 kb/s / time slot

62.4 kb/s

GMSK

CS 4 = 21.4 kb/s / time slot

85.6 kb/s

GMSK

MCS 4 = 17.6 kb/s/ time slot

70.4 kb/s

GMSK

MCS 5 = 22.4 kb/s/ time slot

89.6 kb/s

8PSK

Category 1

1.2Mbps

16QAM,QPSK

Category 3

1.8Mbps

16QAM,QPSK

Category 8

7.2Mbps

16QAM,QPSK

B. Coding Schemes and Maximum Net Data Rates over Air Interface

Table 39: Coding schemes and maximum net data rates over air interface

Slot class DL slot num ber UL slot num ber Active slot number

GPRS coding scheme Max data rata（4 slots） Modulation type

CS 1 = 9.05 kb/s / time slot 36.2 kb/s GMSK CS 2 = 13.4 kb/s / time slot 53.6 kb/s GMSK

EDGE coding scheme Max data rata（4 slots） Modulation type

MCS 1 = 8.8 kb/s/ time slot 35.2 kb/s GMSK MCS 2 = 11.2 kb/s/ time slot 44.8 kb/s GMSK MCS 3 = 14.8 kb/s/ time slot 59.2 kb/s GMSK

MCS 6 = 29.6 kb/s/ time slot 118.4 kb/s 8PSK MCS 7 = 44.8 kb/s/ time slot 179.2 kb/s 8PSK MCS 8 = 54.4 kb/s/ time slot 217.6 kb/s 8PSK MCS 9 = 59.2 kb/s/ time slot 236.8 kb/s 8PSK

HSDPA device category Max data rate（peak） Modulation type

Category 2 1.2Mbps 16QAM,QPSK

Category 4 1.8Mbps 16QAM,QPSK Category 5 3.6Mbps 16QAM,QPSK Category 6 3.6Mbps 16QAM,QPSK Category 7 7.2Mbps 16QAM,QPSK

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Category 10

14.4Mbps

16QAM,QPSK

Category 11

0.9Mbps

QPSK

Category 17

23.4Mbps

64QAM

Category 19

35.5Mbps

64QAM

Category 24

42.2Mbps

64QAM

HSUPA device category

Max data rate（peak）

Modulation type

Category 1

0.96Mbps

QPSK

Category 6

5.76Mbps

QPSK

LTE-FDD device category

Category 2

50Mbps

QPSK/16QAM/64QAM

Category 3

100Mbps

QPSK/16QAM/64QAM

Category 1

5Mbps

QPSK/16QAM

Category 2

25Mbps

QPSK/16QAM

Category 9 10.2Mbps 16QAM,QPSK

Category 12 1.8Mbps QPSK Category 13 17.6Mbps 64QAM Category 14 21.1Mbps 64QAM Category 15 23.4Mbps 16QAM Category 16 28Mbps 16QAM

Category 18 28Mbps 64QAM

Category 20 42Mbps 64QAM Category 21 23.4Mbps 16QAM Category 22 28Mbps 16QAM Category 23 35.5Mbps 64QAM

Category 2 1.92Mbps QPSK Category 3 1.92Mbps QPSK Category 4 3.84Mbps QPSK Category 5 3.84Mbps QPSK

(Downlink)

Max data rate（peak） Modulation type

Category 1 10Mbps QPSK/16QAM/64QAM

Category 4 150Mbps QPSK/16QAM/64QAM

LTE-FDD device category (Uplink)

Max data rate（peak） Modulation type

Category 3 50Mbps QPSK/16QAM Category 4 50Mbps QPSK/16QAM

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SN

Title

Description

SIM7X00 Series_AT Command Manual_V1.xx

ITU-T Draft new recommendationV.25ter

Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME)

[4]

GSM 07.10

Support GSM 07.10 multiplexing protocol

Digital cellular teleco mmunications (Phase 2+); Use of Data

Data Circuit terminating Equipment

DCE) interface for Short Message Service (SMS)

and Cell Broadcast Service (CBS)

Digital cellular telecommunications system (Phase 2+); Specification of the SIM Application Toolkit for the

interface

Digital cellular telecommunications system (Phase 2+);

Equipment (SIM – ME) interface

Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information

Digital cellular telecommunications system (Phase 2)；

Part 1:

Conformance specification

Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification

Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.

Technical Specification Group Radio Access Network; Terminal conformance specification; Radio transmission and reception (FDD)

User Equipment (UE) conformance specification; Part 3: Abstract Test Suites.

Electromagnetic compatibility and Radio spectrum Matters

3.2 of the R&TTE Directive

Electromagnetic compatibility and Radio Spectrum Matters

radio equipment and services; Part 24: Specific conditions for

UTRA) for Mobile and

portable (UE) radio and ancillary equipment

[17]

IEC/EN60950-1(2001)

Safety of information technology equipment (2000)

Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification

C. Related Documents

Table 40: Related documents

[1]

[2]

[3] GSM 07.07

[5] GSM 07.05

[6] GSM 1 1. 14

[7] GSM 11.11

[8] GSM 03.38

[9] GSM 11.10

SIM7X00 Series_AT Command Manual

Serial asynchronous automatic dialing and control

Terminal Equipment – (DTE –

Subscriber Identity Module – Mobile Equipment (SIM – ME)

Specification of the Subscriber Identity Module – Mobile

Mobile Station (MS) conformance specification；

[10] 3GPP T S 51.010-1

[11] 3GPP TS 34.124

[12] 3GPP T S 34.121

[13] 3GPP T S 34.123-1

[14] 3GPP T S 34.123-3

[15] EN 301 908-02 V2.2.1

[16] EN 301 489-24 V1.2.1

(ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article

(ERM); Electromagnetic Compatibility (EMC) standard for

IMT-2000 CDMA Direct Spread (

[18] 3GPP T S 51.010-1

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[19]

GCF-CC V3.23.1

Global Certification Forum - Certification Criteria

Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain

trical and electronic equipment

(RoHS)

[21]

Module secondary-SMT-UGD-V1.xx

Module secondary SMT Guidelines

[22] [24]

Antenna design guidelines for diversity receiver system

[25]

SIM7X00 Series_Sleep Mode_ Application Note_V1.xx

SIM7X00 Series_Sleep Mode_ Application Note

[20] 2002/95/EC

SIM7X00 Series_UART_Application Note_V1.xx

SIM7X00 Series_USB

[23]

AUDIO_Application Note_V1.xx

hazardous substances in elec

SIM7X00 Series_UART_ Appl icat ion Note

SIM7X00 Series_USB AUDIO_Applicat ion Note

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Abbreviation

Description

ADC

Analog-to-Digital Converter

ARP

Antenna Reference Point

BER

Bit Error Rate

BTS

Base Transceiver Station

CS

Coding Scheme

CSD

Circuit Switched Data

CTS

Clear to Send

DAC

Digital-to-Analog Converter

DRX

Discontinuous Reception

DSP

Digital Signal Processor

DTE

Data Terminal Equipment (typically computer, terminal, printer)

DTR

Data Ter minal Ready

DTX

Discontinuous Transm ission

EFR

Enhanced Full Rate

EGSM

Enhanced GSM

EMC

Electromagnetic Compatibility

ESD

Electrostatic Discharge

ETS

European T ele comm unicat ion Standard

EVDO

Evolution Data Only

FCC

Federal Communications Commission (U.S.)

FD

SIM fix dialing phonebook

FDMA

Frequency Division Multiple Access

FR

Full Rate

GMSK

Gaussian Minimum Shift Keying

GPRS

General Packet Radio Service

GSM

Global Standard for Mobile Communications

GNSS

Global Navigation Satellite System

HR

Half Rate

HSPA

High Speed Packet Access

I2C

Inter-Integrated Circuit

IMEI

International Mobile Equipment Identity

LTE

Long T e rm Evolution

MO

Mobile Originated

MS

Mobile Station (GSM engine), also referred to as TE

MT

Mobile Terminated

PAP

Password Authentication Protocol

PBCCH

Packet Switched Broadcast Control Channel

PCB

Printed Circuit Board

PCS

Personal Communication System, also referred to as GSM 1900

RF

Radio Frequency

RMS

Root Mean Square (value)

RTC

Real Time Clock

SIM

Subscriber Identification Module

D. Terms and Abbreviations

Table 41: T erms and Abbreviations

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SMS

Short Message Service

SPI

serial peripheral interface

SMPS

Switched-mode power supply

TDMA

Time Division Multiple Access

TE

Terminal Equipment, also referred to as DTE

TX

Transmit Direction

UART

Universal Asynchronous Receiver & Transmitter

VSWR

Voltage Standing W ave Ratio

SM

SIM phonebook

NC

Not connect

EDGE

Enhanced data rates for GSM evolution

HSDPA

High Speed Downlink Packet Access

HSUPA

High Speed Uplink Packet Access

ZIF

Zero intermediate frequency

WCDMA

Wideband Code Divi si on Multipl e Access

VCTCXO

Voltage control temperature-compensated crystal oscillator

USIM

Universal subscriber identity module

UMTS

Universal mobile telecommunications system

UART

Universal asynchronous receiver transmitter

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Marks

Requirements

When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be

Switch off the cellular terminal or mobile b efore boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to

stems. Forgeting to think much of these

Do not operate the cellular terminal or mobile in the presence of flammable gases or

u are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety

nd transmits radio frequency energy while

switched on. RF interference can occur if it is used close to TV sets, radios,

hicle, unless it is securely mounted in a holder for hands free operation.

GSM cellular terminals or mobiles operate over radio frequency signals and cellular

t be guaranteed to connect in all conditions, especially with a mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the

obile must be switched on and in a service area with adequate

Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to

Also, some networks require that a valid SIM card be properly inserted in the cellular

E. Safety Caution

Table 42: Safety caution

sensitive and not operate normally due to RF energy interference.

prevent interference with communication sy instructions may impact the flight safety or offend local legal action, or both.

fumes. Switch off the cellular terminal wh en yo

hazard. Your cellular terminal or mobile receives a

computers or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile when

driving a ve Before making a call with a hand-held terminal or mobile, park the vehicle.

networks and canno

cellular terminal or m cellular signal strength.

deactivate those features before you can make an emergency call.

terminal or mobile.

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Contact us: Shanghai SIMCom Wireless Solutions Ltd.

Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R. China 200335 Tel：+86 21 3235 3300 Fax：+86 21 3235 3020 URL：

www.simcomm2m.com

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Simcom 201606 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Contents

Table Index

Figure Index

Revision History

1 Introduction

1.1 Product Outline

1.2 Hardware Interface Overview

1.3 Hardware Block Diagram

1.4 Functional Overview

2 Package Information

2.1 Pin Assignment Overview

2.2 Pin Description

2.3 Mechanical Information

2.4 Footprint Recommendation

3 Interface Application

3.1 Power Supply

3.1.1 Power supply Design Guide

3.1.2 Recommended Power Supply Circuit

3.1.3 Voltage Monitor

3.2 Power on/Power off/Reset Function

3.2.1 Power on

3.2.2 Power off

3.2.3 Reset Function

3.3 UART Interface

3.3.1 UART Design Guide

3.3.2 RI and DTR Behavior

3.4 USB Interface

3.4.1 USB Application Guide

3.5 USIM Interface

3.5.1 USIM Application Guide

3.5.2 SIM Card Design Guide

Recommended USIM Card Holder

3.6 PCM Interface

3.6.1 PCM Timing

3.6.2 PCM Application Guide

3.7 I2C Interface

3.7.1 I2C Design Guide

3.8 Network Status

3.9 Operating Status Indication

4 RF Specifications

4.1 WCDMA/LTE RF Specifications

4.2 WCDMA/LTE Antenna Design Guide

5 Electrical Specifi cations

5.1 Absolute Maximum Ratings

5.2 Operating Conditions

5.3 Operating Mode

5.3.1 Operating Mode Definition

5.3.2 Sleep Mode

5.3.3 Minimum Functionality Mode and Flight Mode

5.4 Current Consumption

5.5 ESD Notes

6 SMT Production Guide

6.1 Top and Bottom View of Module

6.2 Label Information

6.3 Typical SMT Reflow Profile

6.4 Moisture Sensitivity Level (MSL)

6.5 Stencil Foil Design Recommendation

7 Packaging

Appendix

A. Reference Design

B. Coding Schemes and Maximum Net Data Rates over Air Interface

C. Related Documents

D. Terms and Abbreviations

E. Safety Caution