7 USB Interface ............................................................................................................................................. 29
7.1 USB Data Connections ....................................................................................................................... 29
7.2 USB Pull-Up resistor ........................................................................................................................... 29
7.3 USB Power Supply .............................................................................................................................. 29
7.6 USB Suspend Current ......................................................................................................................... 31
7.7 USB Detach and Wake-Up Signaling.................................................................................................. 31
7.8 USB Driver .......................................................................................................................................... 32
7.9 USB v2.0 Compliance and Compatibility ............................................................................................ 32
8 Serial Peripheral Interface (SPI) ................................................................................................................. 33
9.6 Slots and Sample Formats .................................................................................................................. 37
9.7 Additional Features ............................................................................................................................. 38
9.8 PCM_CLK and PCM_SYNC Generation ............................................................................................ 38
12.1 Bluetooth ...................................................................................................................................... 45
12.2 FCC and IC .................................................................................... Error! Bookmark not defined.
12.2.1 FCC et IC ....................................................................................... Error! Bookmark not defined.
12.3 CE ................................................................................................................................................ 48
12.4 MIC Japan .................................................................................................................................... 48
WT11u is a fully integrated Bluetooth 2.1 +
EDR, class 1 module combining
antenna, Bluetooth radio and an on-board
iWRAP Bluetooth stack. Silicon Labs WT11u
provides an ideal solution for developers that
want to quickly integrate long range and
high performance Bluetooth wireless
technology to their design without
investing several months into Bluetooth radio
and stack development. WT11u provides a
100dB link budget ensuring long rage and
robust Bluetooth connectivity. WT11u uses
Silicon Labs’ iWRAP Bluetooth stack, which is
an embedded Bluetooth stack implementing
13 different Bluetooth profiles and Apple iAP
connectivity. By using WT11u combined with
iWRAP Bluetooth stack and Silicon Labs’
excellent technical support designers ensure
quick time to market, low development costs
and risk.
APPLICATIONS:
Industrial and M2M
Point-of-Sale devices
Computer Accessories
KEY FEATURES:
Radio features:
Bluetooth v.2.1 + EDR
Bluetooth class 1 radio
Transmit power: +17 dBm
Receiver sensitivity: -84 dBm (DH5)
Range: 350 meters line-of-sight
Integrated chip antenna or U.FL
connector
Hardware features:
UART and USB host interfaces
802.11 co-existence interface
6 software programmable IO pins
Operating voltage: 2.7V to 3.6V
Temperature range: -40C to +85C
Dimensions: 35.75 x 14.50 x 2.6 mm
Qualifications:
Bluetooth
CE
FCC
IC
Japan
PHYSICAL OUTLOOK
Silicon Laboratories Finland Oy
1 Ordering Information
Firmware
U.FL Connector
Internal chip antenna
iWRAP 5.6 firmware, reel
WT11u-E-AI56
WT11u-A-AI56
iWRAP 5.5 firmware, reel
WT11u-E-AI55
WT11u-A-AI55
HCI firmware, BT2.1 + EDR, reel
WT11u-E-HCI21001
WT11u-A-HCI21001
iWRAP 5.6 firmware with iAP, reel
WT11u-E-AI56IAP
WT11u-A-AI56IAP
iWRAP 5.6 firmware, cut reel
WT11u-E-AI56C
WT11u-A-AI56C
iWRAP 5.5 firmware, cut reel
WT11u-E-AI55C
WT11u-A-AI55C
HCI firmware, BT2.1 + EDR, cut reel
WT11u-E-HCI21001C
WT11u-A-HCI21001C
iWRAP 5.6 firmware with iAP, cut reel
WT11u-E-AI56IAPC
WT11u-A-AI56IAPC
Table 1: Ordering information
Silicon Laboratories Finland Oy
Page 6 of 51
Pad name
Pad
number
Pad type
Description
RESET
17
Input
Reset input, active high, internal 220kohm pull-down. Keep
high for >5ms for reset
GND
1, 14, 15, 28
GND
Ground connection, connect all to a ground plane with
minimal trace lengths
VDD_PA
2
Supply voltage
Supply voltage for RF power amplifier
VDD
16
Supply voltage
Chipset supply voltage
WT11i
GND
VDD_PA
PIO2
PIO3
UART_RTS#
UART_RX
PCM_OUT
USB+
USB-
UART_CTS#
PCM_IN
PCM_CLK
PCM_SYNC
GND
GND
AIO
UART_TX
PIO5
SPI_MOSI
SPI_MISO
SPI_CLK
SPI_CS#
PIO4
PIO7
PIO6
RESET
VDD
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
2 Pinout and Terminal Description
Figure 1: WT11u connection diagram
Table 2: Supply and RF Terminal Descriptions
Silicon Laboratories Finland Oy
Page 7 of 51
PIO signal
Pad number
Description
PIO[2]
3
Bi-directional digital in/out with programmable strength and pull-up/pulldown
PIO[3]
4
Bi-directional digital in/out with programmable strength and pull-up/pulldown
PIO[4]
20
Bi-directional digital in/out with programmable strength and pull-up/pulldown
PIO[5]
25
Bi-directional digital in/out with programmable strength and pull-up/pulldown
PIO[6]
18
Bi-directional digital in/out with programmable strength and pull-up/pulldown
PIO[7]
19
Bi-directional digital in/out with programmable strength and pull-up/pulldown
Table 10: Transmitter performance for BDR (room temperature, VDD=3.3V)
Figure 3: Typical TX power as a function of VDD_PA
3.6 Receiver Performance
Antenna gain not taken into account
TBD
Silicon Laboratories Finland Oy
Page 14 of 51
Characteristic, VDD=3.3V, room temperature
Packet type
Typ
Bluetooth
specification
Unit
Sensitivity for 0.1% BER
DH1
TBD
-70
dBm
DH5
-85
dBm
2-DH1
TBD
dBm
2-DH5
TBD
dBm
3-DH1
TBD
dBm
3-DH5
TBD
dBm
Sensitivity variation over temperature range
TBD
dBm
Operating mode
Peak
Average
Unit
Stand-by, page mode 0
TBD
mA
TX 3-DH5
TBD
mA
TX 2-DH5
TBD
mA
TX DH5
TBD
mA
RX
TBD
mA
Deep sleep
TBD
mA
Inquiry
TBD
mA
3.7 Current Consumption
Table 11: WT11u Current Consumption
Silicon Laboratories Finland Oy
Page 15 of 51
WT11i-A
3.8 WT11u-A Antenna Specification
WT11u-A uses a monopole type on a chip antenna with maximum gain of 0.5 dBi. The radiation pattern and the
total radiated efficiency are dependent on the layout and any metal around the antenna has an effect on the
radiation characteristics. Typically the efficiency is 30 … 50%.
Figure 4: Antenna radiation pattern in a USB dongle layout
Figure 5: Antenna radiation pattern in a USB dongle layout
Silicon Laboratories Finland Oy
Page 16 of 51
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