Silicon Laboratories Finland GM210P Users Manual
BGM210P Blue Gecko Bluetooth Module
Data Sheet
The BGM210P is a module designed and built to meet the performance, security, and reliability requirements of line-powered
IoT products for Bluetooth networks.
Based on the EFR32BG21 SoC, it enables Bluetooth® Low Energy and Bluetooth Mesh
connectivity while delivering best-in-class RF range and performance, future-proof capability for feature and OTA firmware updates, enhanced security, low active current consumption, and a temperature rating suited for operating in demanding environmental
conditions.
The BGM210P is a complete solution that comes with robust and fully-upgradeable software stacks, world-wide regulatory certifications, advanced development and debugging
tools, and support that will simplify and minimize the development cycle and deployment
of your end-product helping to accelerate its time-to-market.
The BGM210P is targeted for a broad range of applications, including:
• Smart home
• Connected lighting
• Building automation and security
• Factory automation
Core / Memory
ARM Cortex
TM
M33 processor
with DSP extensions,
FPU and TrustZone
ETM Debug Interface RAM Memory
Flash Program
Memory
LDMA
Controller
Crystal
38.4
MHz
HF Crystal
Oscillator
EM23 HF RC
Oscillator
LF Crystal
Oscillator
HF
RC Oscillator
Ultra LF RC
Oscillator
KEY FEATURES
• Bluetooth 5.1 and Bluetooth Mesh
connectivity
• Chip antenna and RF pin
• +10 and +20 dBm TX power variants
• -97.0 dBm Bluetooth RX sensitivity at 1
Mbps
• 32-bit ARM Cortex-M33 core at 38.4 MHz
• 1024/96 kB of Flash/RAM memory
• Enhanced security features
• Optimal set of MCU peripherals
• 20 GPIO pins
•
-40 to +125 oC
• 12.9 mm x 15.0 mm x 2.2 mm
Fast Startup
RC Oscillator
LF
RC Oscillator
Energy
Management
Voltage
Regulator
Brown-Out
Detector
Power-On
Reset
SecurityClock Management
Crypto
Acceleration
Secure Debug
True Random
Number Generator
Security Core
32-bit bus
Peripheral Reflex System
Antenna
Chip
Antenna
Matching
RF Pin
Lowest power mode with peripheral operational:
RF Frontend
Radio Transceiver
I
LNA
Q
PA
PA
PGA
Frequency
Synth
DEMOD
IFADC
AGC
MOD
FRC
CRC
BUFC
RAC
Serial
Interfaces
USART
2
I
C
I/O Ports Analog I/F
External
Interrupts
General
Purpose I/O
Pin Reset
Pin Wakeup
Timers and Triggers
Timer/Counter
Low Energy
Timer
EM3—StopEM2—Deep SleepEM1—SleepEM0—Active
Protocol Timer
Watchdog Timer
Real Time
Capture Counter
Back-Up Real
Time Counter
ADC
Analog
Comparator
EM4—Shutoff
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1. Features
BGM210P Blue Gecko Bluetooth Module Data Sheet
Features
• Supported Protocols
• Bluetooth 5.1
• Bluetooth Low Energy
• Bluetooth Mesh
• AoA/AoD
• Wireless System-on-Chip
• 2.4 GHz radio
• TX power up to +20 dBm
•
High-performance 32-bit ARM Cortex-M33® with DSP instruction and floating-point unit for efficient signal processing
• 1024 kB flash program memory
• 96 kB RAM data memory
• Embedded Trace Macrocell (ETM) for advanced debugging
• Receiver Performance
• -104.5 dBm sensitivity (0.1% BER) at 125 kbps GFSK
• -100.1 dBm sensitivity (0.1% BER) at 500 kbps GFSK
• -97.0 dBm sensitivity (0.1% BER) at 1 Mbps GFSK
• -94.1 dBm sensitivity (0.1% BER) at 2 Mbps GFSK
• Current Consumption
• 9.3 mA RX current at 1 Mbps GFSK
• 16.1 mA TX current at 0 dBm (BGM210Px22)
• 34.1 mA TX current at 10 dBm (BGM210Px22)
• 173 mA TX current at 20 dBm (BGM210Px32)
• 50.9µA/MHz in Active Mode (EM0)
• 5.1μA EM2 DeepSleep current (RTCC running from LFXO,
Bluetooth Stack not running)
• 8.5μA EM2 DeepSleep current (RTCC running from LFXO,
Bluetooth Stack running)
• Regulatory Certifications
• CE
• ISED
• FCC
• Operating Range
• 1.8 to 3.8 V
• -40 to +125 °C
• Dimensions
• 12.9 mm x 15.0 mm x 2.2 mm
• Security
•
Secure Boot with Root of Trust and Secure Loader (RTSL)
• Hardware Cryptographic Acceleration with DPA countermeasures1 for AES128/256, SHA-1, SHA-2 (up to 256-bit),
ECC (up to 256-bit), ECDSA, and ECDH
• True Random Number Generator (TRNG) compliant with
NIST SP800-90 and AIS-31
•
ARM® TrustZone
®
• Secure Debug Interface lock/unlock
• MCU Peripherals
• 12-bit 1 Msps SAR Analog to Digital Converter (ADC)
• 2 × Analog Comparator (ACMP)
• 20 General Purpose I/O pins with output state retention and
asynchronous interrupts
• 8 Channel DMA Controller
• 12 Channel Peripheral Reflex System (PRS)
• 2 × 16-bit Timer/Counter
(3 Compare/Capture/PWM channels)
• 1 × 32-bit Timer/Counter
(3 Compare/Capture/PWM channels)
• 32-bit Real Time Counter
• 24-bit Low Energy Timer for waveform generation
• 2 × Watchdog Timer
• 3 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
•
2 × I2C interface with SMBus support
1
1. With Secure Element (SE) firmware v1.1.2 or newer
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2. Ordering Information
BGM210P Blue Gecko Bluetooth Module Data Sheet
Ordering Information
Table 2.1. Ordering Information
Ordering Code Protocol Stack TX Power Freq Band Antenna
1
BGM210P022JIA2
• Bluetooth 5.1 10 dBm 2.4 GHz Chip and
RF pin
1
BGM210P022JIA2R
• Bluetooth 5.1 10 dBm 2.4 GHz Chip and
RF pin
1
BGM210P032JIA2
• Bluetooth 5.1 20 dBm 2.4 GHz Chip and
RF pin
1
BGM210P032JIA2R
• Bluetooth 5.1 20 dBm 2.4 GHz Chip and
RF pin
2
BGM210PA22JIA2
• Bluetooth 5.1 10 dBm 2.4 GHz Chip and
RF pin
2
BGM210PA22JIA2R
• Bluetooth 5.1 10 dBm 2.4 GHz Chip and
RF pin
2
BGM210PA32JIA2
• Bluetooth 5.1 20 dBm 2.4 GHz Chip and
RF pin
2
BGM210PA32JIA2R
• Bluetooth 5.1 20 dBm 2.4 GHz Chip and
RF pin
1. Engineering sample device
2. Production device
Flash
(kB)
RAM
(kB) GPIO Temp Range Packaging
1024 96 20 -40 to 125 °C Cut Tape
1024 96 20 -40 to 125 °C Reel
1024 96 20 -40 to 125 °C Cut Tape
1024 96 20 -40 to 125 °C Reel
1024 96 20 -40 to 125 °C Cut Tape
1024 96 20 -40 to 125 °C Reel
1024 96 20 -40 to 125 °C Cut Tape
1024 96 20 -40 to 125 °C Reel
See 4.5 RF Transmitter General Characteristics for maximum TX power figures.
End-product manufacturers must verify that the module is configured to comply with the regulatory limits for each region, in accordance
with the formal certification test reports for the device.
BGM210P modules are pre-programmed with BGAPI UART DFU bootloader.
Throughout this document, the devices above may be referred to by their product family name (BGM210P), model name
(BGM210P22A / BGM210P32A) or full ordering code.
The SLWSTK6102A Wireless Gecko Module Starter Kit is available for BGM210P evaluation and development, as well as
SLWRB4308A (+20 dBm TX) and SLWRB4308B (+10 dBm TX) radio boards.
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Table of Contents
1. Features .................................2
2. Ordering Information ............................3
3. System Overview ..............................6
3.1 Block Diagram ..............................6
3.2 EFR32BG21 SoC .............................6
3.3 Antenna ................................6
3.4 Power Supply ..............................6
4. Electrical Specifications ...........................7
4.1 Absolute Maximum Ratings..........................7
4.2 General Operating Conditions .........................8
4.3 MCU Current Consumption at 3.0V .......................9
4.4 Radio Current Consumption at 3.0V .......................10
4.5 RF Transmitter General Characteristics .....................11
4.6 RF Receiver General Characteristics ......................12
4.7 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps .............13
4.8 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps .............14
4.9 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps ............15
4.10 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps ............16
4.11 High-Frequency Crystal ..........................17
4.12 GPIO Pins ...............................18
4.13 Microcontroller Peripherals .........................19
4.14 Typical Performance Curves .........................19
4.14.1 Antenna Radiation and Efficiency ......................20
5. Reference Diagrams............................ 21
5.1 Network Co-Processor (NCP) Application with UART Host ...............21
5.2 SoC Application .............................22
6. Pin Definitions ..............................23
6.1 Module Pinout ..............................23
6.2 Alternate Pin Functions ...........................24
6.3 Analog Peripheral Connectivity ........................24
6.4 Digital Peripheral Connectivity .........................25
7. Design Guidelines ............................28
7.1 Layout and Placement ...........................28
7.2 Proximity to Other Materials .........................30
7.3 Proximity to Human Body ..........................30
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8. Package Specifications ..........................31
8.1 Dimensions ...............................31
8.2 PCB Land Pattern .............................32
8.3 Package Marking .............................33
9. Soldering Recommendations ........................34
10. Tape and Reel .............................35
11. Certifications ..............................36
11.1 Qualified Antennas ............................36
11.2 CE .................................36
11.3 FCC .................................36
11.4 ISED Canada ..............................39
11.5 Proximity to Human Body ..........................41
12. Revision History............................. 42
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BGM210P Blue Gecko Bluetooth Module Data Sheet
System Overview
3. System Overview
3.1 Block Diagram
The BGM210P module is a highly-integrated, high-performance system with all the hardware components needed to enable 2.4 GHz
wireless connectivity and to support robust networking capabilities via multiple protocols.
Built around the EFR32BG21 Wireless Gecko SoC, the BGM210P includes a chip antenna, an RF matching network (optimized for
transmit power efficiency), supply decoupling and filtering components, a 38.4 MHz reference crystal, and an RF shield. It also comes
with a 50 Ω-matched RF pin and allows the use of an external 32 kHz crystal as a low frequency reference signal via GPIO pins.
Since the RF matching networks are optimized for transmit power efficiency, modules rated for +20 dBm will show non-optimal current
consumption and performance when operated at a lower output power (e.g. +10 or 0 dBm). The same applies for modules rated for +10
dBm.
VDD
IOVDD
GPIO
Antenna
RF Match
Supply Decoupling
Silicon Labs
(up to 20)
EFR32BG21
RFPIN
3.2 EFR32BG21 SoC
The EFR32BG21 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 1 MB of Flash memory, a dedicated
core for security, a rich set of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG21
Wireless Gecko Reference Manual and the EFR32BG21 Data Sheet for details.
3.3 Antenna
BGM210P modules include a ceramic chip antenna on board with the characteristics detailed in the table below. They also include a 50
Ω-matched RF pin to enable the use of an external antenna instead of the module's chip antenna. See 4.14.1 Antenna Radiation and
Efficiency and 11.1 Qualified Antennas for other relevant details.
RF Match
HF XTAL
External LF XTAL option
Figure 3.1. BGM210P Block Diagram
RF SHIELD
GND
Table 3.1. Antenna Efficiency and Peak Gain
Parameter With optimal layout Note
Efficiency -1 to -2 dB Antenna efficiency, gain and radiation pattern are highly depend-
Peak gain 1.86 dBi
ent on the application PCB layout and mechanical design. Refer
to Design Guidelines for recommendations to achieve optimal antenna performance.
3.4 Power Supply
The BGM210P requires a single nominal supply level of 3.0 V to operate. However, it can support use cases needing different levels for
the main supply (VDD) and for digital IO (IOVDD). All necessary decoupling and filtering components are included in the module.
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BGM210P Blue Gecko Bluetooth Module Data Sheet
Electrical Specifications
4. Electrical Specifications
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
• Typical values are based on TA=25 °C and VDD supply at 3.0 V, by production test and/or technology characterization.
• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,
unless stated otherwise.
4.1 Absolute Maximum Ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of
the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 4.1. Absolute Maximum Ratings
Parameter Symbol Test Condition Min Typ Max Unit
Storage temperature range T
Voltage on any supply pin V
Voltage ramp rate on VDD
supply pin
DC voltage on any GPIO pin V
Total current into VDD power
lines
Total current into GND pin I
Current per I/O pin I
Current for all I/O pins I
STG
DDMAX
V
DDRAMPMAX
DIGPIN
I
VDDMAX
GNDMAX
IOMAX
IOALLMAX
-50 — +150 °C
-0.3 — 3.8 V
— — 1.0 V / µs
-0.3 — V
IOVDD
+
V
0.3
Source — — 200 mA
Sink — — 200 mA
Sink — — 50 mA
Source — — 50 mA
Sink — — 200 mA
Source — — 200 mA
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BGM210P Blue Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.2 General Operating Conditions
This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum
values of all other tables are specifed over this operating range, unless otherwise noted.
Table 4.2. General Operating Conditions
Parameter Symbol Test Condition Min Typ Max Unit
Operating ambient tempera-
T
A
-I temperature grade -40 — +125 ° C
ture range
VDD Supply Voltage V
IOVDD operating supply volt-
DD
V
IOVDD
1.8 3.0 3.8 V
1.8 3.0 3.8 V
age (All IOVDD pins)
HCLK and Core frequency f
PCLK frequency f
EM01 Group A clock fre-
HCLK
PCLK
f
EM01GRPACLK
MODE = WS1, RAMWSEN = 1
MODE = WS1, RAMWSEN = 0
MODE = WS0, RAMWSEN = 0
1
1
1
— — 80 MHz
— — 50 MHz
— — 39 MHz
— — 50 MHz
— — 80 MHz
quency
HCLK Radio frequency f
HCLKRADIO
38 38.4 40 MHz
Note:
1. Flash wait states are set by the MODE field in the MSC_READCTRL register. RAM wait states are enabled by setting the RAMW-
SEN bit in the SYSYCFG_DMEM0RAMCTRL register.
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BGM210P Blue Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.3 MCU Current Consumption at 3.0V
Unless otherwise indicated, typical conditions are: VDD = 3.0 V. TA = 25 °C. Minimum and maximum values in this table represent the
worst conditions across process variation at TA = 25 °C.
Table 4.3. MCU Current Consumption at 3.0V
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in EM0
mode with all peripherals dis-
1
abled
Current consumption in EM1
mode with all peripherals dis-
1
abled
Current consumption in EM2
mode
Current consumption in EM3
mode
I
ACTIVE
I
EM1
I
EM2
I
EM3
80 MHz HFRCO, CPU running
— 50.9 — µA/MHz
Prime from flash
80 MHz HFRCO, CPU running
— 45.6 55.5 µA/MHz
while loop from flash
80 MHz HFRCO, CPU running
— 59.8 — µA/MHz
CoreMark loop from flash
38.4 MHz crystal, CPU running
— 63.8 — µA/MHz
while loop from flash
80 MHz HFRCO — 28.7 37.6 µA/MHz
38.4 MHz crystal — 46.9 — µA/MHz
Full RAM retention and RTC run-
— 5.1 — µA
ning from LFXO (Bluetooth Stack
not running)
Full RAM retention, RTCC run-
— 8.5 — µA
ning, and Bluetooth Stack running
from LFXO
1 bank (16 kB) RAM retention and
— 4.5 10.5 µA
RTC running from LFRCO
Full RAM retention and RTC run-
— 4.8 11.4 µA
ning from ULFRCO
1 bank (16 kB) RAM retention and
— 4.3 — µA
RTC running from ULFRCO
Current consumption in EM4
I
EM4
No BURTC, no LF oscillator — 0.21 0.5 µA
mode
Current consumption during
I
RST
Hard pin reset held — 146 — µA
reset
Current consumption per re-
I
RAM
— 0.10 — µA
tained 16kB RAM bank in
EM2
Note:
1. The typical EM0/EM1 current measurement includes some current consumed by the security core for periodical housekeeping
purposes. This does not include current consumed by user-triggered security operations, such as cryptographic calculations.
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BGM210P Blue Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.4 Radio Current Consumption at 3.0V
RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VDD = 3.0V. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across
process variation at TA = 25 °C.
Table 4.4. Radio Current Consumption at 3.0V
Parameter Symbol Test Condition Min Typ Max Unit
Current consumption in receive mode, active packet
reception
Current consumption in receive mode, Stack running
Current consumption in
transmit mode
I
RX_ACTIVE
I
RX_LISTEN
I
TX
125 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
500 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
1 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
2 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
125 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
500 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
1 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
2 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooh stack running
f = 2.4 GHz, CW, 10 dBm Module,
0 dBm output power
f = 2.4 GHz, CW, 10 dBm Module,
10 dBm output power
— 9.3 — mA
— 9.3 — mA
— 9.3 — mA
— 9.9 — mA
— 9.1 — mA
— 9.1 — mA
— 9.1 — mA
— 9.8 — mA
— 16.1 — mA
— 34.1 — mA
f = 2.4 GHz, CW, 20 dBm Module,
10 dBm output power, VDD = 3.0
V
f = 2.4 GHz, CW, 20 dBm Module,
P
=19.2 dBm, VDD = 3.3 V
OUT
Note:
1. The maximum power for Bluetooth Low-Energy is limited to 19.2 dBm.
— 59.7 — mA
— 173 — mA
1
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BGM210P Blue Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.5 RF Transmitter General Characteristics
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. Measured with RF center frequency of 2.45 GHz on
RF2G4_IO2 port.
Table 4.5. RF Transmitter General Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
RF tuning frequency range F
Maximum TX output power
1
RANGE
POUT
Minimum active TX Power POUT
Output power step size POUT
Output power variation vs
POUT
VDD supply voltage, Freq =
2450MHz
MAX
MIN
STEP
VAR_V
2400 — 2483.5 MHz
20 dBm Module, BLE, VDD =
2
3.3V
— 19.2 — dBm
10 dBm Module — 10 — dBm
20 dBm Module, VDD = 3.3 V — -20.5 — dBm
10 dBm Module — -19.3 — dBm
10 dBm Module, -5 dBm < P
OUT
<
— 1.5 — dB
0 dBm
10 dBm Module, 0 dBm < P
OUT
<
— 1.0 — dB
10 dBm
20 dBm Module, 0 dBm < P
OUT
<
— 0.7 — dB
5 dBm
20 dBm Module, 5 dBm < P
POUT
MAX
20 dBm Module, P
POUT
VDD swept from 3.0V
MAX
OUT
=
OUT
<
— 0.5 — dB
— 1.0 — dB
to 3.8V.
10 dBm Module, P
POUT
VDD swept from 1.8V
MAX
OUT
=
— 0.2 — dB
to 3.0V.
Output power variation vs
temperature, Freq =
2450MHz
POUT
VAR_T
20 dBm Module, P
POUT
, VDD = 3.3V, tempera-
MAX
OUT
=
ture swept from -40 to +125 °C.
10 dBm Module, P
POUT
, VDD = 3.0V, tempera-
MAX
OUT
=
— 1.5 — dB
— 0.3 — dB
ture swept from -40 to +125 °C.
Output power variation vs RF
frequency
POUT
VAR_F
20 dBm Module, P
POUT
, VDD = 3.3V, Freq.
MAX
OUT
=
— 0.2 — dB
swept from 2400 to 2483.5 MHz
10 dBm Module, P
POUT
, VDD = 3.0V, Freq.
MAX
OUT
=
— 0.2 — dB
swept from 2400 to 2483.5 MHz
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices covered in this data sheet can be found in the TX Power column of the Ordering Information Table.
2. The maximum power for Bluetooth Low-Energy.
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BGM210P Blue Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.6 RF Receiver General Characteristics
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. Measured with RF center frequency of 2.45 GHz on
RF2G4_IO2 port.
Table 4.6. RF Receiver General Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
RF tuning frequency range F
RANGE
2400 — 2483.5 MHz
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BGM210P Blue Gecko Bluetooth Module Data Sheet
Electrical Specifications
4.7 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps
Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2.
Table 4.7. RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps
Parameter Symbol Test Condition Min Typ Max Unit
Max usable receiver input
level
SAT Signal is reference signal, packet
length is 37 bytes
1
Sensitivity SENS Signal is reference signal, 37 byte
1
1
3
5
Signal to co-channel interfer-erC/I
N ± 1 Adjacent channel se-
C/I
lectivity
CC
1
payload
With non-ideal signals2
(see notes)1
Interferer is reference signal at +1
MHz offset1 4 3
Interferer is reference signal at -1
5
5
N ± 2 Alternate channel selectivity
C/I
MHz offset1 4 3
2
Interferer is reference signal at +2
MHz offset1 4 3
Interferer is reference signal at -2
5
5
N ± 3 Alternate channel selectivity
C/I
MHz offset1 4 3
3
Interferer is reference signal at +3
MHz offset1 4 3
Interferer is reference signal at -3
MHz offset1 4 3
5
— 10 — dBm
— -97.0 — dBm
— -96.7 — dBm
— +6.6 — dB
— -8.3 — dB
— -8.7 — dB
— -42.1 — dB
— -48.9 — dB
— -42.4 — dB
— -54.8 — dB
Selectivity to image frequen-cyC/I
IM
Interferer is reference signal at im-
— -42.1 — dB
age frequency with 1 MHz preci-
5
sion1
Selectivity to image frequency ± 1 MHz
C/I
IM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1
5
Interferer is reference signal at im-
— -42.4 — dB
— -8.3 — dB
age frequency -1 MHz with 1 MHz
5
6
— -23 — dBm
Intermodulation performance IM
precision1
n = 3
Note:
1. 0.1% Bit Error Rate.
2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
3. Desired signal -67 dBm.
4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
5. With allowed exceptions.
6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4
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