Silicon Laboratories Si4113G-BM, Si4113G-BT, Si4122G-BM, Si4122G-BT, Si4123G-BM Datasheet

...
Si4133G
Si4123G/22G/13G/12G
D
UAL-BAND
F
GSM
OR
RF S
GPRS W
AND
YNTHESIZER WITH INTEGRATED
IRELESS COMMUNICATIONS
Features
!
Dual-Band RF Synthesizers
RF1: 900 MHz to 1.8 GHz
"
RF2: 750 MHz to 1.5 GHz
"
!
IF Synthesizer
IF: 500 MHz to 1000 MHz
"
!
Integrated VCOs, Loop Filters, Varactors, and Resonators
!
Minimal External Components Required
!
Fast Settling Time: 140 µs
!
Low Phase Noise
!
Programmable Power Down Modes
!
1 µA Standby Current
!
18 mA Typical Supply Current
!
2.7 V to 3.6 V Operation
!
Packages: 24-Pin TSSOP and 28-Pin MLP
Applications
!
GSM, DCS1800, and PCS1900 Cellular Telephones
!
GPRS Data Terminals
!
HSCSD Data Terminals
Description
The Si4133G is a monolithic integrated circuit that performs both IF and dual-band RF synthesis for GSM and GPRS wireless communications applications. Th e Si4133G includes th ree VCOs, loop fi lters, reference and VCO dividers, and phase detectors. Divider and power down settings are programmable through a three-wi re serial interface.
Functional Block Diagram
XIN
PWDNB
SDATA
SCLK
SENB
AUXOUT
Reference
Amplif ier
Power
Down
Control
Serial
Interfa c e
22-bit
Data
Register
Test Mux
÷
65
Phase Detector
Phase Detector
Phase Detector
÷
÷N
÷N
RF1
N
RF2
IF
RFLA RFLB
RFOUT
RFLC RFLD
IFOUT
IFLA IFLB
VCO
S
Si4133G-BT
Ordering Information:
See page 28.
Pin Assignments
Si4133G-BT
SCLK
1
SDATA
2
GNDR
3
RFLD
4
RFLC
5
GNDR
6
RFLB
7
RFLA
8
GNDR
9
GNDR
10
RFOUT
11
VDDR
12
Si4133G-BM
GNDR
SDATA
SCLK
1
GNDR
2
RFLD
3
RFLC
4
GNDR
5
RFLB
6
RFLA
7
GNDR
8 9 10 11 12 13 14
SENB
SENB
24
VDDI
23
IFOU T
22
GNDI
21
IFLB
20
IFLA
19
GNDD
18
VDDD
17
GNDD
16
XIN
15
PWDNB
14
AUXOUT
13
VDDI
IFOU T
GNDI
22232425262728
21
GNDI
20
IFLB
19
IFLA
18
GNDD
17
VDDD
16
GNDD
15
XIN
GNDR
VDDR
GNDR
RFOUT
GNDD
PWDNB
AUXOUT
Patents pending
Rev. 1.1 4/01 Copyright © 2001 by Silicon Laboratories Si4133G-DS11
Si4133G
2 Rev. 1.1
Si4133G
T
ABLE OF
C
ONTENTS

Section Page

Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Setting the VCO Center Frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Self-Tuning Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Output Frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PLL Loop Dynamics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
RF and IF Outputs (RFOUT and IFOUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Reference Frequency Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Power Down Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Auxiliary Output (AUXOUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Pin Descriptions: Si4133G-BT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Pin Descriptions: Si4133G-BM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Si4133G Derivative Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Package Outline: Si4133G-BT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Package Outline: Si4133G-BM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Rev. 1.1 3
Si4133G

Electrical Specifications

Table 1. Recommended Operating Conditions
Parameter Symbol Test Condition Min Typ Max Unit
Ambient Temperature T Supply Voltage V Supply Voltages Difference V
Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at 3.0 V and an operating temperature of 25°C unless otherwise stated.
Table 2. Absolute Maximum Ratings
1,2
DD
A
(V
(V
DDR
DDI
– V – V
DDD DDD
), )
–20 25 85 °C
2.7 3.0 3.6 V
–0.3 0.3 V
Parameter Symbol Value Unit
DC Supply Voltage V Input Current
Input Voltage
3
3
Storage Temperature Range T
Notes:
1. Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2. This device is a high performan ce RF integrated circ uit with an ESD rating of < 2 kV. Handling and assembly of this device should only be done at ESD-protected workstations.
3. For signals SCLK, SDATA, SENB, PWDNB and XIN.
I
V
DD
IN
IN
STG
–0.5 to 4.0 V
±10 mA
–0.3 to VDD+0.3 V
–55 to 150
o
C
4 Rev. 1.1
Si4133G
Table 3. DC Characteristics
(VDD = 2.7 to 3.6 V, TA = –20 to 85°C
Parameter Symbol Test Condition Min Typ Max Unit
Typical Supply Current RF1 Mode Supply Current RF2 Mode Supply Current IF Mode Supply Current
1
1 1
1
Standby Current PWDNB = 0 1 µA High Level Input Voltage Low Level Input Voltage High Level Input Current
Low Level Input Current
High Level Output Voltage Low Level Output Voltage
Notes:
1. RF1 = 1.55 GHz, RF2 = 1.2 GHz, IF = 800 MHz
2. For signals SCLK, SDATA, SENB, and PWDNB.
3. For signal AUXOUT.
2
2
2
2
3
3
V
IH
V
IL
I
IH
I
IL
V
OH
V
OL
RF1 and IF Operating 18 31 mA
—1317mA —1217mA —1014mA
0.7 V
DD
——V
——0.3 VDDV
=
V
V
V
V
IH
= 3.6 V
DD
=
IL
=
DD
3.6 V,
0V,
3.6 V
–10 10 µA
–10 10 µA
IOH = –500 µA VDD–0.4 V
IOH = 500 µA 0.4 V
Rev. 1.1 5
Si4133G
Table 4. Serial Interface Timing
(VDD = 2.7 to 3.6 V, TA = –20 to 85°C)
Parameter
1
SCLK Cycle Time t SCLK Rise Time t SCLK Fall Time t SCLK High Time t SCLK Low Time t SDATA Setup Time to SCLK SDATA Hold Time from SCLK SENB to SCLKDelay Time SCLK to SENBDelay Time SENB to SCLKDelay Time
2
2 2 2 2
SENB Pulse Width t
Symbol Test Condition Min Typ Max Unit
Figure 1 40 ns Figure 1 50 ns Figure 1 50 ns Figure 1 10 ns Figure 1 10 ns Figure 2 5 ns Figure 2 0 ns Figure 2 10 ns Figure 2 12 ns Figure 2 12 ns Figure 2 10 ns
t t t t
clk
t
su
hold
en1
en2
en3
w
r
f
h
l
Notes:
1. All timing is referenced to the 50% level of the waveform, unless otherwise noted.
2. Timing is not referenced to 50% level of waveform. See Figure 2.
SCLK
80% 50% 20%
t
r
t
f
t
h
t
l
t
clk
Figure 1. SCLK Timing Diagram
6 Rev. 1.1
Si4133G
SCLK
SDATA
SENB
t
su
First bit
cloc ked in
t
hold
D17 D16 D15 A1 A0
t
en1
Figure 2. Serial Interface Timing Diagram
cloc ked in
t
en2
Last bit
t
en3
t
w
D17D16D15D14D13D12D11D10D9D8D7D6D5D4D3D2D1D0A3A2A1A
data
field
address
field
Figure 3. Serial Word Format
0
Rev. 1.1 7
Si4133G
Table 5. RF and IF Synthesizer Characteristics
(VDD = 2.7 to 3.6 V, TA = –20 to 85°C)
Parameter
1
XIN Input Frequency f Reference Amplifier Sensit ivity V
Symbol Test Condition Min Typ Max Unit
REF
REF
—13—MHz
0.5 V
DD
V
PP
+0.3
Phase Detector Update Frequency f RF1 Center Frequency Range
f
RF2 Center Frequency Range f IF VCO Center Frequency f Tuning Range from f
CEN
φ
CEN CEN
CEN
f
φ
Note: L
= f
/R 200 KHz
REF
947 1720 MHz 789 1429 MHz
526 952 MHz
±10% –5 5 %
EXT
RF1 VCO Pushing Open loop 0.5 MHz/V RF2 VCO Pushing 0.4 MHz/V IF VCO Pushing 0.3 MHz/V RF1 VCO Pulling VSWR = 2:1, all RF2 VCO Pulling 0.1 MHz
phases, open loop
IF VCO Pulling 0.1 MHz
—0.4—MHz
PP PP PP
RF1 Phase Noise 1 MHz offset –132 dBc/Hz
3 MHz offset –142 dBc/Hz RF1 Integrated Phase Error 100 Hz to 100 kHz 0.9 deg rms RF2 Phase Noise 1 MHz offset –134 dBc/Hz
3 MHz offset –144 dBc/Hz RF2 Integrated Phase Error 100 Hz to 100 kHz 0.7 deg rms IF Phase Noise 100 kHz offset –117 dBc/Hz IF Integrated Phase Error 100 Hz to 100 kHz 0.4 deg rms RF1 Harmonic Suppression Second Harmonic –26 dBc RF2 Harmonic Suppressio n –26 dBc IF Harmonic Suppression –26 dBc RFOUT Power Level IFOUT Power Level
ZL = 50 ZL = 50
–7 –2 1 dBm –8 –6 –1 dBm
RF1 Reference Spurs Offset = 200 kHz –70 dBc
Offset = 400 kHz –75 dBc Offset = 600 kHz –80 dBc
R
F2 Reference Spurs Offset = 200 kHz –75 dBc
Offset = 400 kHz –80 dBc Offset = 600 kHz –80 dBc
Power Up Request to Synthesizer Ready Time, RF1, RF2, IF
2
Power Down Request to Synthesizer Off
3
Time
Notes:
1. RF1 = 1.55 GHz, RF2 = 1.2 GHz, IF = 550MHz for all parameters unless otherwise noted.
2. From power up request (PWDNB or SENB during a write of 1 to bits PDIB and PDRB in Register 2) to RF and IF
synthesizers ready (settled to within 0.1 ppm frequency error). Typical settling time to 5 degrees phase error is 120 µs.
3. From power down request (PWDNB↓, or SENBduring a write of 0 to bits PDIB and PDRB in Register 2) to supply current equal to I
PWDN
.
t
t
pup
pdn
Figures 4, 5 140 µs
Figures 4, 5 100 ns
8 Rev. 1.1
Si4133G
RF and IF syn thesize r s se t tled to w i t hi n 0.1 ppm frequency error.
I
PWDN
t
I
T
pup
t
pdn
SENB
SDATA
PDIB = 1
PDRB = 1
PDIB = 0
PDRB = 0
Figure 4. Software Power Management Timing
Diagram
RF and IF synthesizers settled to within 0.1 p pm frequency error.
I
PWD N
t
I
T
pup
t
pdn
PWDNB
Figure 5. Hardware Power Management Timing
Diagram
Rev. 1.1 9
Si4133G
TRACE A: Ch1 FM Gate Time
800
Real
160
/div
Axis is 0.1 ppm/div
Hz
Hz
A Offset
133.59375 us
-800 Hz
Start: 0 s
Figure 6. Typical Transient Response RF1 at 1.6 GHz
with 200 kHz Phase Detector Update Frequency
Stop: 299.21875 us
10 Rev. 1.1
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