12-Bit (C8051F000/1/2, C8051F005/6/7)
10-bit (C8051F010/1/2, C8051F015/6/7)
±1LSB INL; No Missing Codes
Programmable Throughput up to 100ksps
Up to 8 External Inputs; Programmable as Single-
- Two 12-bit DACs
- Two Analog Comparators
- Voltage Reference
- Precision VDD Monitor/Brown-out Detector
ON-CHIP JTAG DEBUG & BOUNDARY SCAN
- On-Chip Debug Circuitry Facilitates Full Speed, Non-
- Provides Breakpoints, Single Stepping, Watchpoints, Stack
- Inspect/Modify Memory and Registers
- Superior Performance to Emulation Systems Using ICE-
1.1.CIP-51TM CPU .......................................................................................................................................12
Figure 1.4. Comparison of Peak MCU Execution Speeds...............................................................................12
Figure 1.5. On-Board Clock and Reset............................................................................................................13
The C8051F000 family are fully integrated mixed-signal System on a Chip MCUs with a true 12-bit multi-channel
ADC (F000/01/02/05/06/07), or a true 10-bit multi-channel ADC (F010/11/12/15/16/17). See the Product Selection
Guide in Table 1.1 for a quick reference of each MCUs’ feature set. Each has a programmable gain pre-amplifier,
two 12-bit DACs, two voltage comparators (except for the F002/07/12/17, which have one), a voltage reference,
and an 8051-compatible microcontroller core with 32kbytes of FLASH memory. There are also I2C/SMBus,
UART, and SPI serial interfaces implemented in hardware (not “bit-banged” in user software) as well as a
Programmable Counter/Timer Array (PCA) with five capture/compare modules. There are also 4 general-purpose
16-bit timers and 4 byte-wide general-purpose digital Port I/O. The C8051F000/01/02/10/11/12 have 256 bytes of
RAM and execute up to 20MIPS, while the C8051F005/06/07/15/16/17 have 2304 bytes of RAM and execute up to
25MIPS.
With an on-board VDD monitor, WDT, and clock oscillator, the MCUs are truly stand-alone System-on-a-Chip
solutions. Each MCU effectively configures and manages the analog and digital peripherals. The FLASH memory
can be reprogrammed even in-circuit, providing non-volatile data storage, and also allowing field upgrades of the
8051 firmware. Each MCU can also individually shut down any or all of the peripherals to conserve power.
On-board JTAG debug support allows non-intrusive (uses no on-chip resources), full speed, in-circuit debug using
the production MCU installed in the final application. This debug system supports inspection and modification of
memory and registers, setting breakpoints, watchpoints, single stepping, and run and halt commands. All analog
and digital peripherals are fully functional when using JTAG debug.
Each MCU is specified for 2.7V-to-3.6V operation over the industrial temperature range (-45C to +85C). The Port
I/Os, /RST, and JTAG pins are tolerant for input signals up to 5V. The C8051F000/05/10/15 are available in the
64-pin TQFP (see block diagram in Figure 1.1). The C8051F001/06/11/16 are available in the 48-pin TQFP (see
block diagram in Figure 1.2). The C8051F002/07/12/17 are available in the 32-pin LQFP (see block diagram in
Figure 1.3).
The C8051F000 family utilizes Silicon Laboratories’ proprietary CIP-51 microcontroller core. The CIP-51 is fully
compatible with the MCS-51
develop software. The core has all the peripherals included with a standard 8052, including four 16-bit
counter/timers, a full-duplex UART, 256 bytes of internal RAM space, 128 byte Special Function Register (SFR)
address space, and four byte-wide I/O Ports.
1.1.2. Improved Throughput
The CIP-51 employs a pipelined architecture that greatly increases its instruction throughput over the standard 8051
architecture. In a standard 8051, all instructions except for MUL and DIV take 12 or 24 system clock cycles to
execute with a maximum system clock of 12-to-24MHz. By contrast, the CIP-51 core executes 70% of its
instructions in one or two system clock cycles, with only four instructions taking more than four system clock
cycles.
The CIP-51 has a total of 109 instructions. The number of instructions versus the system clock cycles to execute
them is as follows:
Instructions
Clocks to Execute
With the CIP-51’s maximum system clock at 25MHz, it has a peak throughput of 25MIPS. Figure 1.4 shows a
comparison of peak throughputs of various 8-bit microcontroller cores with their maximum system clocks.
TM
instruction set. Standard 803x/805x assemblers and compilers can be used to
26 50 5 14 7 3 1 2 1
1 2 2/3 3 3/4 4 4/5 5 8
Figure 1.4. Comparison of Peak MCU Execution Speeds
25
20
15
MIPS
10
5
Silicon Labs
CIP-51
(25MHz clk)
Microchip
PIC17C75x
(33MHz clk)
Philips
80C51
(33MHz clk)
ADuC812
8051
(16MHz clk)
Rev. 1.7 12
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
1.1.3. Additional Features
The C8051F000 MCU family has several key enhancements both inside and outside the CIP-51 core to improve its
overall performance and ease of use in the end applications.
The extended interrupt handler provides 21 interrupt sources into the CIP-51 (as opposed to 7 for the standard
8051), allowing the numerous analog and digital peripherals to interrupt the controller. An interrupt driven system
requires less intervention by the MCU, giving it more effective throughput. The extra interrupt sources are very
useful when building multi-tasking, real-time systems.
There are up to seven reset sources for the MCU: an on-board VDD monitor, a Watchdog Timer, a missing clock
detector, a voltage level detection from Comparator 0, a forced software reset, the CNVSTR pin, and the /RST pin.
The /RST pin is bi-directional, accommodating an external reset, or allowing the internally generated POR to be
output on the /RST pin. Each reset source except for the VDD monitor and Reset Input Pin may be disabled by the
user in software. The WDT may be permanently enabled in software after a power-on reset during MCU
initialization.
The MCU has an internal, stand alone clock generator which is used by default as the system clock after any reset.
If desired, the clock source may be switched on the fly to the external oscillator, which can use a crystal, ceramic
resonator, capacitor, RC, or external clock source to generate the system clock. This can be extremely useful in low
power applications, allowing the MCU to run from a slow (power saving) external crystal source, while periodically
switching to the fast (up to 16MHz) internal oscillator as needed.
Figure 1.5. On-Board Clock and Reset
(Port
I/O)
Crossbar
CP0+
CP0-
CNVSTR
(CNVSTR
reset
enable)
Comparator 0
+
-
(CP0
reset
enable)
Missing
Detector
Internal
Clock
XTAL1
XTAL2
Generator
OSC
System
Clock
Clock Select
VDD
WDT
WDT
EN
Enable
Clock
(one-
shot)
EN
MCD
Enable
CIP-51
Microcontroller
Core
Supply
Monitor
+
-
PRE
WDT
Supply
Reset
Timeout
Strobe
Software Reset
System Reset
(wired-OR)
Reset
Funnel
/RST
Extended Interrupt
Handler
13 Rev. 1.7
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
1.2. On-Board Memory
The CIP-51 has a standard 8051 program and data address configuration. It includes 256 bytes of data RAM, with
the upper 128 bytes dual-mapped. Indirect addressing accesses the upper 128 bytes of general purpose RAM, and
direct addressing accesses the 128 byte SFR address space. The lower 128 bytes of RAM are accessible via direct
and indirect addressing. The first 32 bytes are addressable as four banks of general-purpose registers, and the next
16 bytes can be byte addressable or bit addressable.
The CIP-51 in the C8051F005/06/07/15/16/17 MCUs additionally has a 2048 byte RAM block in the external data
memory address space. This 2048 byte block can be addressed over the entire 64k external data memory address
range (see Figure 1.6).
The MCU’s program memory consists of 32k + 128 bytes of FLASH. This memory may be reprogrammed insystem in 512 byte sectors, and requires no special off-chip programming voltage. The 512 bytes from addresses
0x7E00 to 0x7FFF are reserved for factory use. There is also a single 128-byte sector at address 0x8000 to 0x807F,
which may be useful as a small table for software constants or as additional program space. See Figure 1.6 for the
MCU system memory map.
Figure 1.6. On-Board Memory Map
0x807F
0x8000
0x7FFF
0x7E00
0x7DFF
0x0000
PROGRAM MEMORY
128 Byte ISP FLASH
RESERVED
FLASH
(In-System
Programmable in 512
Byte Sectors)
0xFF
0x80
0x7F
0x30
0x2F
0x20
0x1F
0x00
DATA MEMORY
INTERNAL DATA ADDRESS SPACE
Upper 128 RAM
(Indirect Addressing
Only)
(Direct and Indirect
Addressing)
Bit Addressable
General Purpose
Registers
Special Function
Register's
(Direct Addressing Only)
Lower 128 RAM
(Direct and Indirect
Addressing)
EXTERNAL DATA ADDRESS SPACE
0xFFFF
0xF800
0x17FF
0x1000
0x0FFF
0x0800
0x07FF
0x0000
(same 2048 byte RAM block )
(same 2048 byte RAM block )
(same 2048 byte RAM block )
RAM - 2048 Bytes
(accessable using MOVX
instruction)
The same 2048 byte RAM
block can be addressed on
2k boundaries throughout
the 64k External Data
Memory space.
Rev. 1.7 14
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
1.3. JTAG Debug and Boundary Scan
The C8051F000 family has on-chip JTAG and debug circuitry that provide non-intrusive, full speed, in-circuit
debug using the production part installed in the end application using the four-pin JTAG I/F. The JTAG port is
fully compliant to IEEE 1149.1, providing full boundary scan for test and manufacturing purposes.
Silicon Labs’ debug system supports inspection and modification of memory and registers, breakpoints,
watchpoints, a stack monitor, and single stepping. No additional target RAM, program memory, timers, or
communications channels are required. All the digital and analog peripherals are functional and work correctly
while debugging. All the peripherals (except for the ADC) are stalled when the MCU is halted, during single
stepping, or at a breakpoint in order to keep them in sync.
The C8051F000DK, C8051F005DK, C8051F010DK, and C8051F015DK are development kits with all the
hardware and software necessary to develop application code and perform in-circuit debug with the C8051F000/1/2,
F005/6/7, F010/1/2, and F015/6/7 MCUs respectively. The kit includes software with a developer’s studio and
debugger, an integrated 8051 assembler, and an RS-232 to JTAG protocol translator module referred to as the EC.
It also has a target application board with the associated MCU installed and a large prototyping area, plus the RS232 and JTAG cables, and wall-mount power supply. The Development Kit requires a Windows
95/98/NT/2000/XP computer with one available RS-232 serial port. As shown in Figure 1.7, the PC is connected
via RS-232 to the EC. A six-inch ribbon cable connects the EC to the user’s application board, picking up the four
JTAG pins and VDD and GND. The EC takes its power from the application board. It requires roughly 20mA at
2.7-3.6V. For applications where there is not sufficient power available from the target board, the provided power
supply can be connected directly to the EC.
This is a vastly superior configuration for developing and debugging embedded applications compared to standard
MCU Emulators, which use on-board “ICE Chips” and target cables and require the MCU in the application board
to be socketed. Silicon Labs’ debug environment both increases ease of use and preserves the performance of the
precision analog peripherals.
Figure 1.7. Debug Environment Diagram
TARGET PCB
C8051F000/1/2/5/6/7
C8051F000/1/2/5/6/7
1.4. Programmable Digital I/O and Crossbar
The standard 8051 Ports (0, 1, 2, and 3) are available on the MCUs. All four ports are pinned out on the
F000/05/10/15. Ports 0 and 1 are pinned out on the F001/06/11/16, and onl
C8051F010/1/2/5/6/7
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
1.5. Programmable Counter Array
The C8051F000 MCU family has an on-board Programmable Counter/Timer Array (PCA) in addition to the four
16-bit general-purpose counter/timers. The PCA consists of a dedicated 16-bit counter/timer timebase with 5
programmable capture/compare modules. The timebase gets its clock from one of four sources: the system clock
divided by 12, the system clock divided by 4, Timer 0 overflow, or an External Clock Input (ECI).
Each capture/compare module can be configured to operate in one of four modes: Edge-Triggered Capture,
Software Timer, High Speed Output, or Pulse Width Modulator. The PCA Capture/Compare Module I/O and
External Clock Input are routed to the MCU Port I/O via the Digital Crossbar.
Figure 1.9. PCA Block Diagram
System
Clock
T0 Overflow
/4
/12
16-Bit Counter/Timer
Capture/Compare
Module 0
Capture/Compare
Module 1
Capture/Compare
Module 2
Capture/Compare
Module 3
Capture/Compare
Module 4
ECI
CEX0
CEX1
CEX2
CEX3
CEX4
Crossbar
Port I/O
1.6. Serial Ports
The C8051F000 MCU Family includes a Full-Duplex UART, SPI Bus, and I2C/SMBus. Each of the serial buses is
fully implemented in hardware and makes extensive use of the CIP-51’s interrupts, thus requiring very little
intervention by the CPU. The serial buses do not “share” resources such as timers, interrupts, or Port I/O, so any or
all of the serial buses may be used together.
17 Rev. 1.7
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
1.7. Analog to Digital Converter
The C8051F000/1/2/5/6/7 has an on-chip 12-bit SAR ADC with a 9-channel input multiplexer and programmable
gain amplifier. With a maximum throughput of 100ksps, the ADC offers true 12-bit accuracy with an INL of
±1LSB. The ADC in the C8051F010/1/2/5/6/7 is similar, but with 10-bit resolution. Each ADC has a maximum
throughput of 100ksps. Each ADC has an INL of ±1LSB, offering true 12-bit accuracy with the C8051F00x, and
true 10-bit accuracy with the C8051F01x. There is also an on-board 15ppm voltage reference, or an external
reference may be used via the VREF pin.
The ADC is under full control of the CIP-51 microcontroller via the Special Function Registers. One input channel
is tied to an internal temperature sensor, while the other eight channels are available externally. Each pair of the
eight external input channels can be configured as either two single-ended inputs or a single differential input. The
system controller can also put the ADC into shutdown to save power.
A programmable gain amplifier follows the analog multiplexer. The gain can be set in software from 0.5 to 16 in
powers of 2. The gain stage can be especially useful when different ADC input channels have widely varied input
voltage signals, or when it is necessary to “zoom in” on a signal with a large DC offset (in differential mode, a DAC
could be used to provide the DC offset).
Conversions can be started in four ways; a software command, an overflow on Timer 2, an overflow on Timer 3, or
an external signal input. This flexibility allows the start of conversion to be triggered by software events, external
HW signals, or convert continuously. A completed conversion causes an interrupt, or a status bit can be polled in
software to determine the end of conversion. The resulting 10 or 12-bit data word is latched into two SFRs upon
completion of a conversion. The data can be right or left justified in these registers under software control.
Compare registers for the ADC data can be configured to interrupt the controller when ADC data is within a
specified window. The ADC can monitor a key voltage continuously in background mode, but not interrupt the
controller unless the converted data is within the specified window.
Figure 1.10. ADC Diagram
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
(not bonded out on
F002, F007, F012,
and F017
+
-
+
-
+
-
+
-
9-to-1
AMUX
(SE or
DIFF)
SENSOR
TEMP
Programmable
Gain Amp
+
X
-
Control & Data
SFR's
REF
100ksps
SAR
ADC
SFR Bus
VREF
Rev. 1.7 18
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
1.8. Comparators and DACs
The C8051F000 MCU Family has two 12-bit DACs and two comparators on chip (the second comparator, CP1, is
not bonded out on the F002, F007, F012, and F017). The MCU data and control interface to each comparator and
DAC is via the Special Function Registers. The MCU can place any DAC or comparator in low power shutdown
mode.
The comparators have software programmable hysteresis. Each comparator can generate an interrupt on its rising
edge, falling edge, or both. The comparators’ output state can also be polled in software. These interrupts are
capable of waking up the MCU from idle mode. The comparator outputs can be programmed to appear on the Port
I/O pins via the Crossbar.
The DACs are voltage output mode and use the same voltage reference as the ADC. They are especially useful as
references for the comparators or offsets for the differential inputs of the ADC.
Figure 1.11. Comparator and DAC Diagram
(Port I/O)
(Port I/O)
CP0
CP1
CROSSBAR
CP0+
CP0-
CP1+
CP1-
DAC0
REF
DAC0
CP0
CP1
SFR's
(Data
and
Cntrl)
CIP-51
and
Interrupt
Handler
DAC1
REF
DAC1
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
2. ABSOLUTE MAXIMUM RATINGS*
Ambient temperature under bias................................................................................................................. -55 to 125°C
Storage Temperature .................................................................................................................................. -65 to 150°C
Voltage on any Pin (except VDD and Port I/O) with respect to DGND...................................-0.3V to (VDD + 0.3V)
Voltage on any Port I/O Pin or /RST with respect to DGND....................................................................-0.3V to 5.8V
Voltage on VDD with respect to DGND...................................................................................................-0.3V to 4.2V
Maximum Total current through VDD, AV+, DGND and AGND.....................................................................800mA
Maximum output current sunk by any Port pin...................................................................................................100mA
Maximum output current sunk by any other I/O pin.............................................................................................25mA
Maximum output current sourced by any Port pin ..............................................................................................100mA
Maximum output current sourced by any other I/O pin ........................................................................................ 25mA
*Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the devices at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
3. GLOBAL DC ELECTRICAL CHARACTERISTICS
-40°C to +85°C unless otherwise specified.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Analog Supply Voltage (Note 1) 2.7 3.0 3.6 V
Analog Supply Current Internal REF, ADC, DAC, Comparators
all active
Analog Supply Current with
analog sub-systems inactive
Analog-to-Digital Supply
Delta ( | VDD – AV+ | )
Digital Supply Voltage 2.7 3.0 3.6 V
Digital Supply Current with
CPU active
Digital Supply Current
(shutdown)
Digital Supply RAM Data
Retention Voltage
Specified Operating
Temperature Range
SYSCLK (System Clock
Frequency)
SYSCLK (System Clock
Frequency)
Tsysl (SYSCLK Low Time) 18 ns
Tsysh (SYSCLK High Time) 18 ns
Note 1: Analog Supply AV+ must be greater than 1V for VDD monitor to operate.
Note 2: SYSCLK must be at least 32 kHz to enable debugging.
Internal REF, ADC, DAC, Comparators
all disabled, oscillator disabled
0.5 V
VDD = 2.7V, Clock=25MHz
VDD = 2.7V, Clock=1MHz
VDD = 2.7V, Clock=32kHz
Oscillator not running 5
1.5 V
-40 +85
C8051F005/6/7, C8051F015/6/7
(Note 2)
C8051F000/1/2, C8051F010/1/2
(Note 2)
1 2 mA
5 20
12.5
0.5
10
0 25 MHz
0 20 MHz
mA
µA
mA
µA
µA
°C
Rev. 1.7 20
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
4. PINOUT AND PACKAGE DEFINITIONS
Table 4.1. Pin Definitions
Pin Numbers
F000
F001
Name
VDD
DGND
AV+
AGND
TCK
TMS
TDI
TDO
XTAL1
XTAL2
/RST
VREF
CP0+
CP0-
CP1+
CP1-
DAC0
DAC1
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
F005
F010
F015
31,
40,
62
30,
41,
61
16,
17
5,
15
22 18 14
21 17 13
28 20 15
29 21 16
18 14 10
19 15 11
20 16 12
6 3 3
4 2 2
3 1 1
2 45
1 46
64 48 32
63 47 31
7 4 4
8 5 5
9 6 6
10 7 7
11 8
12 9
F006
F011
F016
23,
32
22,
33,
27,
19
13,
43
44,
12
F002
F007
F012
F017
18,
20
17,
21
9,
29
8,
30
Type Description
D In
D In
D In
D Out
A In
A Out
D I/O
A I/O
A In
A In
A In
A In
A Out
A Out
A In
A In
A In
A In
A In
A In
Digital Voltage Supply.
Digital Ground.
Positive Analog Voltage Supply.
Analog Ground.
JTAG Test Clock with internal pull-up.
JTAG Test-Mode Select with internal pull-up.
JTAG Test Data Input with internal pull-up. TDI is latched on a rising edge of
TCK.
JTAG Test Data Output with internal pull-up. Data is shifted out on TDO on
the falling edge of TCK. TDO output is a tri-state driver.
Crystal Input. This pin is the return for the internal oscillator circuit for a
crystal or ceramic resonator. For a precision internal clock, connect a crystal
or ceramic resonator from XTAL1 to XTAL2. If overdriven by an external
CMOS clock, this becomes the system clock.
Crystal Output. This pin is the excitation driver for a crystal or ceramic
resonator.
Chip Reset. Open-drain output of internal Voltage Supply monitor. Is driven
low when VDD is < 2.7V. An external source can force a system reset by
driving this pin low.
Voltage Reference. When configured as an input, this pin is the voltage
reference for the MCU. Otherwise, the internal reference drives this pin.
Comparator 0 Non-Inverting Input.
Comparator 0 Inverting Input.
Comparator 1 Non-Inverting Input.
Comparator 1 Inverting Input.
Digital to Analog Converter Output 0. The DAC0 voltage output. (See
Section 7 DAC Specification for complete description).
Digital to Analog Converter Output 1. The DAC1 voltage output. (See
Section 7 DAC Specification for complete description).
Analog Mux Channel Input 0. (See ADC Specification for complete
description).
Analog Mux Channel Input 1. (See ADC Specification for complete
description).
Analog Mux Channel Input 2. (See ADC Specification for complete
description).
Analog Mux Channel Input 3. (See ADC Specification for complete
description).
Analog Mux Channel Input 4. (See ADC Specification for complete
description).
Analog Mux Channel Input 5. (See ADC Specification for complete
description).
Analog Mux Channel Input 6. (See ADC Specification for complete
description).
Analog Mux Channel Input 7. (See ADC Specification for complete
description).
Port0 Bit0. (See the Port I/O Sub-System section for complete description).
Port0 Bit1. (See the Port I/O Sub-System section for complete description).
Port0 Bit2. (See the Port I/O Sub-System section for complete description).
Port0 Bit3. (See the Port I/O Sub-System section for complete description).
Port0 Bit4. (See the Port I/O Sub-System section for complete description).
Port0 Bit5. (See the Port I/O Sub-System section for complete description).
Port0 Bit6. (See the Port I/O Sub-System section for complete description).
Port0 Bit7. (See the Port I/O Sub-System section for complete description).
Port1 Bit0. (See the Port I/O Sub-System section for complete description).
Port1 Bit1. (See the Port I/O Sub-System section for complete description).
Port1 Bit2. (See the Port I/O Sub-System section for complete description).
Port1 Bit3. (See the Port I/O Sub-System section for complete description).
Port1 Bit4. (See the Port I/O Sub-System section for complete description).
Port1 Bit5. (See the Port I/O Sub-System section for complete description).
Port1 Bit6. (See the Port I/O Sub-System section for complete description).
Port1 Bit7. (See the Port I/O Sub-System section for complete description).
Port2 Bit0. (See the Port I/O Sub-System section for complete description).
Port2 Bit1. (See the Port I/O Sub-System section for complete description).
Port2 Bit2. (See the Port I/O Sub-System section for complete description).
Port2 Bit3. (See the Port I/O Sub-System section for complete description).
Port2 Bit4. (See the Port I/O Sub-System section for complete description).
Port2 Bit5. (See the Port I/O Sub-System section for complete description).
Port2 Bit6. (See the Port I/O Sub-System section for complete description).
Port2 Bit7. (See the Port I/O Sub-System section for complete description).
Port3 Bit0. (See the Port I/O Sub-System section for complete description).
Port3 Bit1. (See the Port I/O Sub-System section for complete description).
Port3 Bit2. (See the Port I/O Sub-System section for complete description).
Port3 Bit3. (See the Port I/O Sub-System section for complete description).
Port3 Bit4. (See the Port I/O Sub-System section for complete description).
Port3 Bit5. (See the Port I/O Sub-System section for complete description).
Port3 Bit6. (See the Port I/O Sub-System section for complete description).
Port3 Bit7. (See the Port I/O Sub-System section for complete description).
Rev. 1.7 22
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
Figure 4.1. TQFP-64 Pinout Diagram
CP1-
CP1+
CP0-
CP0+
AGND
VREF
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
AGND
AV+
10
11
15
16
1
2
3
4
5
6
7
8
9
12
13
14
DAC0
64
17
DAC1
63
AV+
VDD
62
18
19
XTAL1
XTAL2
P3.5
P3.4
57
P0.7
56
DGND
61
60
P1.6
P1.7
59
58
C8051F000
C8051F005
C8051F010
C8051F015
20
21
22
23
24
25
TCK
TMS
/RST
P3.3
P3.1
P3.2
P0.6
55
26
P2.2
P2.3
53
54
27
P3.0
P2.1
28
TDI
P2.4
52
29
TDO
P2.5
51
30
DGND
P0.5
50
31
P0.4
49
VDD
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
P1.5
P0.3
P0.2
P3.6
P3.7
P2.6
P2.7
P0.1
DGND
VDD
P0.0
P1.0
P1.1
P1.2
P1.3
P1.4
P2.0
23 Rev. 1.7
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
Figure 4.2. TQFP-64 Package Drawing
64
PIN 1
DESIGNATOR
1
A2
D
D1
MIN
NOM
MAX
(mm)
(mm)
(mm)
A
-
-
1.20
A1
0.05
E1
E
e
A
b
A1
A2
b
D
D1
e
E
E1
0.95
0.17
-
0.15
-
1.05
0.22
0.27
-
12.00
-
10.00
-
0.50
-
12.00
-
10.00
-
-
-
-
-
Rev. 1.7 24
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
Figure 4.3. TQFP-48 Pinout Diagram
AGND
CP0-
CP0+
VREF
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
DAC0
48
1
2
3
4
5
6
7
8
9
10
11
12
13
AV+
CP1-
DAC1
47
46
14
15
XTAL2
XTAL1
CP1+
45
AGND
44
AV+
43
P1.6
42
P1.7
41
C8051F001
C8051F006
C8051F011
C8051F016
16
17
18
19
20
/RST
TMS
TCK
TDI
DGND
P0.7
40
21
TDO
P0.5
P0.6
39
38
22
23
VDD
DGND
P0.4
37
36
35
34
33
32
31
30
29
28
27
26
25
24
P1.5
P0.3
P0.2
P0.1
DGND
VDD
P0.0
P1.0
P1.1
P1.2
DGND
P1.3
P1.4
25 Rev. 1.7
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
Figure 4.4. TQFP-48 Package Drawing
48
PIN 1
IDENTIFIER
A2
1
D
D1
E1
E
e
A
A1
b
A
A1
A2
b
D
D1
e
E
E1
MIN
(mm)
-
0.05
0.95
0.17
-
-
-
-
-
NOM
(mm)
-
-
1.00
0.22
9.00
7.00
0.50
9.00
7.00
MAX
(mm)
1.20
0.15
1.05
0.27
-
-
-
-
-
Rev. 1.7 26
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
Figure 4.5. LQFP-32 Pinout Diagram
AGND
CP0-
CP0+
VREF
AIN0
AIN1
AIN2
AIN3
DAC0
32
DAC1
31
AGND
30
AV+
29
P0.7
28
1
2
3
4
5
6
C8051F002
C8051F007
C8051F012
C8051F017
7
8
9
10
11
12
13
AV+
XTAL1
XTAL2
/RST
TMS
P0.6
27
14
TCK
P0.5
26
15
TDI
P0.4
25
16
TDO
24
23
22
21
20
19
18
17
P0.3
P0.2
P0.1
DGND
VDD
P0.0
VDD
DGND
27 Rev. 1.7
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
Figure 4.6. LQFP-32 Package Drawing
IDENTIFIER
32
PIN 1
1
A2
D
D1
A1
eb
MIN
NOM
(mm)
A
A1
0.05
E1
E
A2
b
1.35
0.30
D
D1
e
A
E
E1
(mm)
-
1.40
0.37
-
9.00
-
7.00
-
0.80
-
9.00
-
7.00
MAX
(mm)
-
-
1.60
0.15
1.45
0.45
-
-
-
-
-
Rev. 1.7 28
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
5. ADC (12-Bit, C8051F000/1/2/5/6/7 Only)
The ADC subsystem for the C8051F000/1/2/5/6/7 consists of a 9-channel, configurable analog multiplexer
(AMUX), a programmable gain amplifier (PGA), and a 100ksps, 12-bit successive-approximation-register ADC
with integrated track-and-hold and programmable window detector (see block diagram in Figure 5.1). The AMUX,
PGA, Data Conversion Modes, and Window Detector are all configurable under software control via the Special
Function Register’s shown in Figure 5.1. The ADC subsystem (ADC, track-and-hold and PGA) is enabled only
when the ADCEN bit in the ADC Control register (ADC0CN, Figure 5.7) is set to 1. The ADC subsystem is in low
power shutdown when this bit is 0. The Bias Enable bit (BIASE) in the REF0CN register (see Figure 9.2) must be
set to 1 in order to supply bias to the ADC.
Figure 5.1. 12-Bit ADC Functional Block Diagram
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
+
-
+
-
+
-
+
-
9-to-1
AMUX
(SE or
DIFF)
X
+
-
ADCEN
AV+
AGND
12-Bit
SAR
ADC0LTLADC0LTHADC0GTLADC0GTH
AV+
ADC
SYSCLK
REF
12
24
COMB
LOGIC
12
ADC0LADC0H
Conversion Start
ADWINT
TEMP
SENSOR
AGND
M
T
T
CNV
D
A
R
2
B
3
O
STR
U
O
V
SY(
V
w
)
AMX0CF
AIN01IC
AIN23IC
AIN45IC
AIN67IC
AMX0SL
AMXAD1
AMXAD2
AMXAD3
AMXAD0
ADCSC0
ADCSC1
ADCSC2
ADC0CF
AMPGN2
AMPGN1
AMPGN0
ADCEN
ADCTM
ADCINT
ADC0CN
ADSTM0
ADSTM1
ADBUSY
ADWINT
ADLJST
5.1. Analog Multiplexer and PGA
Eight of the AMUX channels are available for external measurements while the ninth channel is internally
connected to an on-board temperature sensor (temperature transfer function is shown in Figure 5.3). Note that the
PGA gain is applied to the temperature sensor reading. AMUX input pairs can be programmed to operate in either
the differential or single-ended mode. This allows the user to select the best measurement technique for each input
channel, and even accommodates mode changes “on-the-fly”. The AMUX defaults to all single-ended inputs upon
reset. There are two registers associated with the AMUX: the Channel Selection register AMX0SL (Figure 5.5),
and the Configuration register AMX0CF (Figure 5.4). The table in Figure 5.5 shows AMUX functionality by
channel for each possible configuration. The PGA amplifies the AMUX output signal by an amount determined by
the AMPGN2-0 bits in the ADC Configuration register, ADC0CF (Figure 5.6). The PGA can be softwareprogrammed for gains of 0.5, 1, 2, 4, 8 or 16. It defaults to unity gain on reset.
29 Rev. 1.7
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
5.2. ADC Modes of Operation
The ADC uses VREF to determine its full-scale voltage, thus the reference must be properly configured before
performing a conversion (see Section 9). The ADC has a maximum conversion speed of 100ksps. The ADC
conversion clock is derived from the system clock. Conversion clock speed can be reduced by a factor of 2, 4, 8 or
16 via the ADCSC bits in the ADC0CF Register. This is useful to adjust conversion speed to accommodate
different system clock speeds.
A conversion can be initiated in one of four ways, depending on the programmed states of the ADC Start of
Conversion Mode bits (ADSTM1, ADSTM0) in ADC0CN. Conversions may be initiated by:
1. Writing a 1 to the ADBUSY bit of ADC0CN;
2. A Timer 3 overflow (i.e. timed continuous conversions);
3. A rising edge detected on the external ADC convert start signal, CNVSTR;
4. A Timer 2 overflow (i.e. timed continuous conversions).
Writing a 1 to ADBUSY provides software control of the ADC whereby conversions are performed “on-demand”.
During conversion, the ADBUSY bit is set to 1 and restored to 0 when conversion is complete. The falling edge of
ADBUSY triggers an interrupt (when enabled) and sets the ADCINT interrupt flag. Note: When conversions are
performed “on-demand”, the ADCINT flag, not ADBUSY, should be polled to determine when the
conversion has completed. Converted data is available in the ADC data word MSB and LSB registers, ADC0H,
ADC0L. Converted data can be either left or right justified in the ADC0H:ADC0L register pair (see example in
Figure 5.9) depending on the programmed state of the ADLJST bit in the ADC0CN register.
The ADCTM bit in register ADC0CN controls the ADC track-and-hold mode. In its default state, the ADC input is
continuously tracked, except when a conversion is in progress. Setting ADCTM to 1 allows one of four different
low power track-and-hold modes to be specified by states of the ADSTM1-0 bits (also in ADC0CN):
1. Tracking begins with a write of 1 to ADBUSY and lasts for 3 SAR clocks;
2. Tracking starts with an overflow of Timer 3 and lasts for 3 SAR clocks;
3. Tracking is active only when the CNVSTR input is low;
4. Tracking starts with an overflow of Timer 2 and lasts for 3 SAR clocks.
Modes 1, 2 and 4 (above) are useful when the start of conversion is triggered with a software command or when the
ADC is operated continuously. Mode 3 is used when the start of conversion is triggered by external hardware. In
this case, the track-and-hold is in its low power mode at times when the CNVSTR input is high. Tracking can also
be disabled (shutdown) when the entire chip is in low power standby or sleep modes.
Figure 5.2. 12-Bit ADC Track and Conversion Example Timing
(ADSTM[1:0]=10)
Timer2, Timer3 Overflow;
Write 1 to ADBUSY
(ADSTM[1:0]=00, 01, 11)
A. ADC Timing for External Trigger Source
CNVSTR
SAR Clocks
ADCTM=1
ADCTM=0
SAR Clocks
ADCTM=1
SAR Clocks
ADCTM=0
Low Power or
Convert
Track Or Convert
B. ADC Timing for Internal Trigger Sources
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Low Power or
Convert
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Track or Convert
1 2 3 4 5 6 7 8 9 1011 1213141516
Track
Track
ConvertTrack
Convert
Convert
Convert
Low Power Mode
Track
17 18 19
Low Power Mode
Rev. 1.7 30
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