Sierra Wireless WMP100 User Manual
r
Product Technical Specification and
Customer Design Guidelines
®
Wireless Microprocesso
WMP100/
Open AT® Software Suite v1.0
Reference: WM_DEV_WUP_PTS_005
Revision: 002
Date: March 19, 2007
®
WMP100/Open AT
Software
Suite v1.0
Product Technical Specification &
Customer Design Guidelines
Reference: WM_DEV_WUP_PTS_005
Revision:
Date:
002
March 19, 2007
®
Powered by the Wavecom Open AT
Software Suite
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged
without prior written agreement.
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confidential ©
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Document Information
Level Date History of the evolution
001 19/10/2006 Creation (Preliminary version)
002 19/03/2007 Updates
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Overview
This document defines and specifies the WMP100/Open AT® Software Suite
v1.0 available in a GSM/GPRS Class 10 quad-band version.
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Table of Contents
Document Information......................................................................... 2
Overview ............................................................................................. 3
Table of Contents................................................................................ 4
Table of Figures................................................................................. 10
Cautions ............................................................................................ 12
Trademarks ....................................................................................... 12
Copyright .......................................................................................... 12
1 References................................................................................ 13
1.1 Reference documents............................................................................13
1.1.1 WAVECOM reference documentation ............................................13
1.1.2 General reference documentation ..................................................13
1.2 List of abbreviations ..............................................................................14
2 General description................................................................... 17
2.1 General information...............................................................................17
2.1.1 Overall dimensions ........................................................................17
2.1.2 Environment and mechanics..........................................................17
2.1.3 GSM/GPRS Features ......................................................................17
2.1.4 Interfaces.......................................................................................18
2.1.5 Operating system ..........................................................................18
2.2 Functional description ...........................................................................19
2.2.1 RF functionalities ...........................................................................20
2.2.2 Baseband functionalities................................................................20
2.3 Software description .............................................................................20
3 Interfaces ................................................................................. 21
3.1 General Interfaces .................................................................................21
3.2 Power supply ........................................................................................22
3.2.1 Power supply description ..............................................................22
3.2.2 Power supply constraints on VBATT-RF ........................................22
3.2.3 Power supply constraints on VBATT-BB........................................23
3.2.4 Electrical characteristics ................................................................23
3.2.5 Pin description...............................................................................23
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Application ....................................................................................24
3.2.6
3.3 Power consumption ..............................................................................25
3.3.1.1 Power consumption without Open AT® processing .................26
3.3.1.2 Power consumption with a Dhrystone Open AT® application...27
3.3.1.3 Consumption waveform samples.............................................28
3.3.1.3.1 Connected mode current waveform .......................................28
3.3.1.3.2 Slow Idle mode current waveform .........................................29
3.3.1.3.3 Fast Idle mode current waveform ..........................................30
3.3.1.3.4 Transfer mode Class 10 current waveform ............................31
3.4 Electrical information for digital I/O........................................................32
3.5 SPI Bus .................................................................................................34
3.5.1 Features ........................................................................................34
3.5.1.1 Characteristics .........................................................................34
3.5.1.2 SPI configuration .....................................................................34
3.5.1.3 SPI waveforms ........................................................................35
3.5.2 Pin description...............................................................................36
3.5.3 Application ....................................................................................36
3.5.3.1 4-wire interface .......................................................................36
3.5.3.2 3-wire interface .......................................................................37
3.6 I2C bus..................................................................................................38
3.6.1 Features ........................................................................................38
3.6.1.1 Characteristics .........................................................................38
3.6.1.2 I²C waveforms .........................................................................38
3.6.2 Pin description...............................................................................39
3.6.3 Application ....................................................................................39
3.7 Keyboard interface.................................................................................40
3.7.1 Features ........................................................................................40
3.7.2 Pin description...............................................................................41
3.7.3 Application ....................................................................................42
3.8 Main serial link (UART1)........................................................................42
3.8.1 Features ........................................................................................42
3.8.2 Pin description...............................................................................43
3.8.3 First download ..............................................................................45
3.8.4 Application ....................................................................................46
3.9 Auxiliary serial link (UART2) ..................................................................50
3.9.1 Features ........................................................................................50
3.9.2 Pin description...............................................................................51
3.9.3 Application ....................................................................................51
3.10 SIM Interface.........................................................................................52
3.10.1 Features ........................................................................................52
3.10.2 Pin description...............................................................................54
3.10.3 Application ....................................................................................54
3.11 General Purpose Input/Output ...............................................................56
3.11.1 Features ........................................................................................56
3.11.2 Pin description...............................................................................56
3.12 Analog to Digital Converter....................................................................58
3.12.1 Features ........................................................................................58
3.12.2 Pin description...............................................................................58
3.12.3 Application ....................................................................................59
3.13 Digital to Analog Converter....................................................................60
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3.13.1
Features ........................................................................................60
3.13.2 Pin description...............................................................................60
3.14 Analogue audio interface.......................................................................61
3.14.1 Microphone Features .....................................................................61
3.14.1.1 Electrical characteristics...........................................................61
3.14.1.1.1 MIC1 Microphone Inputs ...................................................61
3.14.1.1.2 MIC2 Microphone Inputs ...................................................62
3.14.2 Speaker Features ...........................................................................64
3.14.2.1 Speakers Outputs Power .........................................................64
3.14.2.1.1 SPK1 Speaker Outputs.......................................................64
3.14.2.1.2 SPK2 Speaker Outputs......................................................66
3.14.3 Pin description...............................................................................67
3.14.4 Application ....................................................................................67
3.14.4.1 Microphone .............................................................................67
3.14.4.1.1 MIC2 Differential connection example................................67
3.14.4.1.2 MIC2 single-ended connection example ............................69
3.14.4.1.3 MIC1 Differential connection example................................70
3.14.4.1.4 MIC1 Single-ended connection example ............................72
3.14.4.2 Speaker ...................................................................................73
3.14.4.2.1 SPK2 Differential connection..............................................73
3.14.4.2.2 SPKx Single-ended connection ..........................................74
3.14.5 Design recommendation ................................................................74
3.14.5.1 General ....................................................................................74
3.14.5.2 Recommended microphone characteristics..............................74
3.14.5.3 Recommended speaker characteristics ....................................75
3.14.5.4 Recommended filtering components........................................75
3.14.5.5 Audio track and PCB layout recommendation ..........................77
3.15 PWM / Buzzer Output ...........................................................................78
3.15.1 Features ........................................................................................78
3.15.2 Pin description...............................................................................78
3.15.3 Application ....................................................................................79
3.16 Battery charging interface .....................................................................80
3.16.1 Feature ..........................................................................................80
3.16.1.1 Pre-Charging ...........................................................................81
3.16.1.2 Temperature monitoring ..........................................................81
3.16.2 Pin description...............................................................................82
3.16.3 Application ....................................................................................82
3.17 ON / ~OFF signal...................................................................................84
3.17.1 Features ........................................................................................84
3.17.2 Pin description...............................................................................84
3.17.3 Application ....................................................................................84
3.17.3.1 Power ON ................................................................................85
3.17.3.2 Power OFF...............................................................................87
3.18 BOOT signal ..........................................................................................88
3.18.1 Features ........................................................................................88
3.18.2 Pin description...............................................................................88
3.18.3 Application ....................................................................................88
3.19 Reset signals .........................................................................................89
3.19.1 Features ........................................................................................89
3.19.2 Pin description...............................................................................92
3.19.3 Application ....................................................................................93
3.20 External Interrupt ..................................................................................94
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3.20.1
Features ........................................................................................94
3.20.2 Pin description...............................................................................94
3.20.3 Application ....................................................................................95
3.21 VCC_2V8 and VCC_1V8 output ..............................................................96
3.21.1 Features ........................................................................................96
3.21.2 Pin description...............................................................................96
3.21.3 Application ....................................................................................96
3.22 Real Time Clock.....................................................................................97
3.22.1 Features ........................................................................................97
3.22.2 Pin description...............................................................................97
3.22.3 Application ....................................................................................98
3.22.4 Design recommendation ................................................................98
3.23 BAT-RTC (Backup Battery) ....................................................................99
3.23.1 Features ........................................................................................99
3.23.2 Pin description.............................................................................100
3.23.3 Application ..................................................................................100
3.23.3.1 Super Capacitor .....................................................................100
3.23.3.2 Non Rechargeable battery......................................................101
3.23.3.3 Rechargeable battery cell .......................................................101
3.24 FLASH-LED signal ...............................................................................102
3.24.1 Features ......................................................................................102
3.24.2 Pin description.............................................................................103
3.24.3 Application ..................................................................................104
3.25 Digital audio interface (PCM) ...............................................................104
3.25.1 Features ......................................................................................104
3.25.2 Pin description.............................................................................107
3.25.3 Application TBD...........................................................................107
3.26 USB 2.0 interface ................................................................................107
3.26.1 Features ......................................................................................107
3.26.2 Pin description.............................................................................108
3.26.3 Application ..................................................................................109
3.27 Memory interface ................................................................................110
3.27.1 Features ......................................................................................111
3.27.1.1 Generic Description................................................................111
3.27.1.2 Case of ST 32/8 (M36W0R5030T0ZAQF) ..............................112
3.27.1.3 Access bus Waveform ...........................................................113
3.27.1.4 Flash space............................................................................116
3.27.1.5 RAM space ............................................................................116
3.27.1.6 16-bit wide data bus User Space ...........................................117
3.27.2 Electrical characteristics of the signals.........................................117
3.27.3 Pin description.............................................................................117
3.27.4 Application ..................................................................................120
3.27.5 Constraints ..................................................................................121
3.28 RF interface .........................................................................................124
3.28.1 RF connection..............................................................................124
3.28.2 RF performances .........................................................................124
3.28.3 Antenna specifications ................................................................125
3.28.4 Antenna.......................................................................................125
4 Consumption measurement procedure ................................... 127
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged
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Hardware configuration.......................................................................127
4.1
4.1.1 Equipment ...................................................................................127
4.1.2 Wireless Microprocessor motherboard ........................................129
4.1.3 SIM cards used ...........................................................................130
4.2 Software configurations ......................................................................130
4.2.1 Wireless Microprocessor configuration ........................................130
4.2.2 Equipment configuration .............................................................131
4.3 Template .............................................................................................132
5 Technical specifications ......................................................... 133
5.1 Ball Grid Array pin out .........................................................................133
5.2 Environmental Specifications...............................................................139
5.3 MSL level ............................................................................................140
5.4 Mechanical specifications....................................................................140
5.4.1 Physical characteristics................................................................140
5.4.2 Mechanical drawings ..................................................................140
5.4.3 Mechanical constraints................................................................143
5.5 PCB specifications...............................................................................143
6 Peripheral devices references ................................................. 143
6.1 SIM Card Reader .................................................................................143
6.2 Microphone.........................................................................................143
6.3 Speaker ...............................................................................................143
6.4 Antenna Cable.....................................................................................144
6.5 GSM antenna ......................................................................................144
7 Noises and design................................................................... 145
7.1 EMC recommendations .......................................................................145
7.2 Power Supply......................................................................................145
8 Appendix................................................................................. 146
8.1 Standards and Recommendations.......................................................146
8.2 Safety recommendations (for information only) ...................................150
8.2.1 RF safety .....................................................................................150
8.2.1.1 General ..................................................................................150
8.2.1.2 Exposure to RF energy...........................................................150
8.2.1.3 Efficient terminal operation ....................................................150
8.2.1.4 Antenna care and replacement ..............................................151
8.2.2 General safety..............................................................................151
8.2.2.1 Driving...................................................................................151
8.2.2.2 Electronic devices ..................................................................151
8.2.2.3 Vehicle electronic equipment .................................................151
8.2.2.4 Medical electronic equipment ................................................151
8.2.2.5 Aircraft ..................................................................................152
8.2.2.6 Children .................................................................................152
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8.2.2.7
Blasting areas ........................................................................152
8.2.2.8 Potentially explosive atmospheres .........................................152
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Table of Figures
Figure 1 : Functional architecture ................................................................... 19
Figure 2 : Power supply during burst emission ..............................................22
Figure 3 : Reject filter diagram........................................................................ 24
Figure 4: SPI Timing diagrams, Mode 0, Master, 4 wires ............................... 35
Figure 5: Example of 4-wire SPI bus application............................................. 36
Figure 6: Example of 3-wire SPI bus application............................................. 37
Figure 7: I²C Timing diagrams, Master ........................................................... 38
Figure 8: First example of I²C bus application................................................. 39
Figure 9: Second example of I²C bus application ............................................ 40
Figure 10: Example of keyboard implementation ............................................ 42
Figure 11: Example of UART1 connection for download with another device on
the link...................................................................................................... 45
Figure 12: Example of RS-232 level shifter implementation for UART1........... 46
Figure 13: Example of V24/CMOS serial link implementation for UART1 ........ 48
Figure 14: Example of full modem V24/CMOS serial link implementation for
UART1 ...................................................................................................... 49
Figure 15: Example of RS-232 level shifter implementation for UART2........... 51
Figure 16: Example of SIM Socket implementation......................................... 54
Figure 17: Example of MIC2 input differential connection with LC filter.......... 67
Figure 18: Example of MIC2 input differential connection without LC filter..... 68
Figure 19: Example of MIC2 input single-ended connection with LC filter ...... 69
Figure 20: Example of MIC2 input single-ended connection without LC filter . 69
Figure 21: Example of MIC1 input differential connection with LC filter.......... 70
Figure 22: Example of MIC1 input differential connection without LC filter..... 71
Figure 23: Example of MIC1 input single-ended connection with LC filter ...... 72
Figure 24: Example of MIC1 input single-ended connection without LC filter . 72
Figure 25: Example of Speaker differential connection.................................... 73
Figure 26: Example of Speaker single-ended connection ................................ 74
Figure 27: Microphone ................................................................................... 75
Figure 28: Audio track design......................................................................... 77
Figure 29: Example of buzzer implementation ................................................ 79
Figure 30: Example of LED driven by the BUZZ-OUT output........................... 79
Figure 31: Charging block diagram................................................................. 80
Figure 32: Charging schematic for Li-Ion ........................................................ 82
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Figure 33: Example of ON/~OFF pin connection ............................................. 84
Figure 34 : Power-ON sequence (no PIN code activated) ................................ 85
Figure 35 : Power-OFF sequence ................................................................... 87
Figure 36: Example of BOOT pin implementation ........................................... 88
Figure 37 : Reset functional block................................................................... 89
Figure 38 : Reset waveform events ................................................................ 90
Figure 39 : Reset sequence waveform............................................................ 91
Figure 40 : BOOT sequence waveform .......................................................... 92
Figure 41: Example of ~RESET pin connection with push button configuration
................................................................................................................. 93
Figure 42: Example of ~RESET pin connection with transistor configuration.. 93
Figure 43: Example of INTx driving example with open collector.................... 95
Figure 44: Example of INTx driving example with open collector.................... 95
Figure 45 : PCB lay out for the crystal MS2V-T1S .......................................... 98
Figure 46 : Real Time Clock power supply...................................................... 99
Figure 47: RTC supplied by a gold capacitor................................................. 100
Figure 48: RTC supplied by a non rechargeable battery................................ 101
Figure 49: RTC supplied by a rechargeable battery cell ................................ 101
Figure 50 : FLASH-LED state during RESET and Initialization time ............... 103
Figure 51: Example of GSM activity status implementation.......................... 104
Figure 52 : PCM Frame waveform................................................................ 106
Figure 53 : PCM Sampling waveform........................................................... 106
Figure 54: Example of USB implementation.................................................. 109
Figure 55: Memory bus ................................................................................ 110
Figure 56: Read synchronous timing ............................................................ 113
Figure 57: Write synchronous timing ...........................................................114
Figure 58: Read / Write Asynchronous timing .............................................. 115
Figure 59: Memory connection schematic .................................................... 120
Figure 60: Memory PCB ............................................................................... 123
Figure 61: Antenna and ground balls placement .......................................... 126
Figure 62: RF 50 ohms embedded line ......................................................... 126
Figure 63: Antenna connection point keep away area ..................................126
Figure 64: RF connector and ESD protection example .................................. 127
Figure 65: Typical hardware configuration ................................................... 128
Figure 66 : Environmental classes ................................................................ 139
Figure 67 : Mechanical drawing ................................................................... 141
Figure 68 : Mechanical drawing ................................................................... 142
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Cautions
This platform contains a modular transmitter. This device is used for wireless
applications. Note that all electronics parts and elements are ESD sensitive.
Information provided herein by WAVECOM is accurate and reliable. However
no responsibility is assumed for its use and any of such WAVECOM
information is herein provided “as is” without any warranty of any kind,
whether express or implied.
General information about WAVECOM and its range of products is available at
the following internet address:
http://www.wavecom.com
Trademarks
®, WAVECOM®, WISMO®, Open AT®, Wireless Microprocessor®, Wireless
®
, and certain other trademarks and logos appearing on this document, are
CPU
filed or registered trademarks of Wavecom S.A. in France or in other countries.
All other company and/or product names mentioned may be filed or registered
trademarks of their respective owners.
Copyright
This manual is copyrighted by WAVECOM with all rights reserved. No part of
this manual may be reproduced in any form without the prior written
permission of WAVECOM. No patent liability is assumed with respect to the
use of their respective owners.
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged
confidential ©
without prior written agreement.
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1 References
1.1 Reference documents
For more details, several documents are referenced in this specification. The
WAVECOM documents references herein are provided in the WAVECOM
documentation package; the general reference documents which are not
WAVECOM owned are not provided in the documentation package.
1.1.1 WAVECOM reference documentation
®
[1] Wireless Microprocessor
Reference: WM_DEV_WUP_PTS_004
[2] WMP100 Development Kit User Guide
Reference: WM_DEV_WUP_UGD_001
WMP100 Technical Specification
®
[3] AT Command Interface Guide for Open AT
Firmware v6.5
Reference: WM_DEV_OAT_UGD_035
1.1.2 General reference documentation
[4] “I²C Bus Specification”, Version 2.0, Philips Semiconductor 1998
[5] ISO 7816-3 Standard
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1.2 List of abbreviations
Abbreviation Definition
AC Alternative Current
ADC Analog to Digital Converter
A/D Analog to Digital conversion
AF Audio-Frequency
AT ATtention (prefix for modem commands)
AUX AUXiliary
CAN Controller Area Network
CB Cell Broadcast
CEP Circular Error Probable
CLK CLocK
CMOS Complementary Metal Oxide Semiconductor
CS Coding Scheme
CTS Clear To Send
DAC Digital to Analogue Converter
dB Decibel
DC Direct Current
DCD Data Carrier Detect
DCE Data Communication Equipment
DCS Digital Cellular System
DR Dynamic Range
DSR Data Set Ready
DTE Data Terminal Equipment
DTR Data Terminal Ready
EFR Enhanced Full Rate
E-GSM Extended GSM
EMC ElectroMagnetic Compatibility
EMI ElectroMagnetic Interference
EMS Enhanced Message Service
EN ENable
ESD ElectroStatic Discharges
FIFO First In First Out
FR Full Rate
FTA Full Type Approval
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Abbreviation
Definition
GND GrouND
GPI General Purpose Input
GPC General Purpose Connector
GPIO General Purpose Input Output
GPO General Purpose Output
GPRS General Packet Radio Service
GPS Global Positioning System
GSM Global System for Mobile communications
HR Half Rate
I/O Input / Output
LED Light Emitting Diode
LNA Low Noise Amplifier
MAX MAXimum
MIC MICrophone
MIN MINimum
MMS Multimedia Message Service
MO Mobile Originated
MT Mobile Terminated
na Not Applicable
NF Noise Factor
NMEA National Marine Electronics Association
NOM NOMinal
NTC Négative Temperature Coefficient
PA Power Amplifier
Pa Pascal (for speaker sound pressure measurements)
PBCCH Packet Broadcast Control CHannel
PC Personal Computer
PCB Printed Circuit Board
PDA Personal Digital Assistant
PFM Power Frequency Modulation
PSM Phase Shift Modulation
PWM Pulse Width Modulation
RAM Random Access Memory
RF Radio Frequency
RFI Radio Frequency Interference
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Abbreviation
Definition
RHCP Right Hand Circular Polarization
RI Ring Indicator
RST ReSeT
RTC Real Time Clock
RTCM Radio Technical Commission for Maritime services
RTS Request To Send
RX Receive
SCL Serial CLock
SDA Serial DAta
SIM Subscriber Identification Module
SMS Short Message Service
SPI Serial Peripheral Interface
SPL Sound Pressure Level
SPK SPeaKer
SRAM Static RAM
TBC To Be Confirmed
TDMA Time Division Multiple Access
TP Test Point
TVS Transient Voltage Suppressor
TX Transmit
TYP TYPical
UART Universal Asynchronous Receiver-Transmitter
USB Universal Serial Bus
USSD Unstructured Supplementary Services Data
VSWR Voltage Standing Wave Ratio
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2 General description
2.1 General information
The WMP100 Wireless Microprocessor® is a self-contained E-GSM/GPRS
900/1800 and 850/1900 quad-band processor, including the characteristics
listed in the subsection below.
2.1.1 Overall dimensions
• Length: 25 mm
• Width: 25 mm
• Thickness: 3.65 mm
• Weight: 4.25 g
• Package: WMBGA576 / ball Ø 0,6 mm @ pitch 1mm
2.1.2 Environment and mechanics
• Green policy: Restriction of Hazardous Substances in Electrical and
Electronic Equipment (RoHS) compliant
• Complete shielding
The WMP100 is compliant with RoHS Directive 2002/95/EC which sets limits
for the use of certain restricted hazardous substances. This directive states
that “from 1st July 2006, new electrical and electronic equipment put on the
market does not contain lead, mercury, cadmium, hexavalent chromium,
polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.
2.1.3 GSM/GPRS Features
• 2 Watts EGSM 900/GSM 850 radio section running under 3.6 Volts
• 1 Watt GSM1800/1900 radio section running under 3.6 Volts
• Hardware GPRS class 10 capable
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2.1.4 Interfaces
• Digital section running under 2.8 Volts and 1.8Volts.
• 3V/1V8 SIM interface
• 1.8V Parallel interface for devices (memories, LCD…)
• Power supply
• Watchdog
• Serial links (UART)
• Analogue audio
• ADC / DAC
• PCM digital audio
• Keyboard
• USB 2.0 slave
• Serial buses (I2C,SPI)
• PWM
• GPIOs
2.1.5 Operating system
• Real Time Clock with calendar
• Echo Cancellation + noise reduction (quadri codec)
• Full GSM or GSM/GPRS Operating System stack
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2.2 Functional description
The global architecture of WMP100 is described below:
WMP100
32768
kHz
Analog Interfaces
AUDIO
CH1 & CH2
DAC
ADCs
Control &
Power
power
supplys
reset
RTC
Charging
DSP
core
ARM 946
32bit
core
AHB bus
Radio
GSM / GPRS
Digital Interfaces
UART
1,2
SPI
1,2
PCM
SIM
I²C
ITs
USB 2.0
KEYPAD
GPIOs
PWM
Extended Memory Bridge
ControlDataAddress
Figure 1 : Functional architecture
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2.2.1 RF functionalities
The Radio Frequency (RF) range complies with the Phase II EGSM 900/DCS
1800 and GSM 850/PCS 1900 recommendation. The frequencies are listed in
the table below.
Transmit band (Tx) Receive band (Rx)
GSM 850 824 to 849 MHz 869 to 894 MHz
E-GSM 900 880 to 915 MHz 925 to 960 MHz
DCS 1800 1710 to 1785 MHz 1805 to 1880 MHz
PCS 1900 1850 to 1910 MHz 1930 to 1990 MHz
The RF part is based on a specific quad band chip including:
• a Digital low-IF receiver
• a Quad-band LNAs (Low Noise Amplifier)
• an Offset PLL (Phase Locked Loop) transmitter
• a Frequency synthesizer
• a Digitally controlled crystal oscillator (DCXO)
• a Tx/Rx FEM (Front-End Wireless Microprocessor
®
) for quad-band
GSM/GPRS
2.2.2 Baseband functionalities
The Baseband is composed of an ARM9, a DSP and an analog element (with
audio signals, I/Q signals, ADC, DAC).
The core power supply is to 1.8 volts. The analog power supply is to 2.8v
2.3 Software description
The Open AT® Software Suite v1.0 is the software package that supports
WMP100. It consists of:
®
• An Open AT
command interface over a serial port or USB.
• An Open AT
applications (telemetry, multimedia, automotive…)
• An Open AT
and debugs applications over the Open AT
• Several Open AT
that are able to run over the Open AT
Firmware v6.5 which drives the WMP100 thanks to an AT
®
Operating System (OS) v5.0 which runs various types of
®
Integrated Development Environment (IDE) which builds
®
plug-ins which are software provided by Wavecom
®
Operating System
®
Operating System
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3 Interfaces
3.1 General Interfaces
The WMP100 is provided with a “Development Kit Wireless Microprocessor®”
containing an access to the all interfaces.
The available interfaces are described in the table below.
chapter Name Driven by
18.5.1 SPI Bus X X
18.5.2 I2C Bus X X
11 Keyboard Interface X X
12.2 Main Serial Link X X
13.2 Auxiliary Serial Link X X
14 SIM Interface X X
3 General Purpose IO X X
18.3 Analog to Digital
Converter
18.4 Digital to Analog
Converter
16 Analog audio Interface
9 PWM / Buzzer Output X X
18.3.1 Battery charging
interface
18.7 External Interruption X X
18.1 VCC_2V8 and
VCC_1V8
17 Real Time Clock X X
18.2 BAT-RTC (Backup
Battery)
8 FLASH-LED signal X X
18.6 Digital Audio Interface
(PCM)
15 USB 2.0 Interface X X
4 Memory interface
(on parallel interface)
Open AT®
Firmware
v6.5
X X
X X
X X
X X
X X
X X
X X
X X
Not
driven by
Open AT®
Firmware
v6.5
Driven by
Open AT®
OS v5.0
Not
driven by
Open AT®
OS v5.0
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3.2 Power supply
3.2.1 Power supply description
The power supply is one of the key elements in the design of a GSM terminal.
The WMP100 is powered by a single power supply VBATT. This power supply
feeds two inputs to the supply, VBATT-BB and VBATT-RF.
VBATT-RF powers all the radio components of the WMP100. It has to be
carefully designed because most of the current is transmitted through this
input. The VBATT-RF current is bursted due to the GSM / GPRS transmission
protocol.
VBATT-BB supplies the digital part of the WMP100. VBATT-BB is directly
connected to the internal power management unit of the WMP100. This unit
controls the VBATT-BB voltage and provides the power supplies like VCC_1V8
and VCC_2V8.
Note: The VBATT-BB input generates noise, so the VBATT must be filtered by a
band reject filter.
3.2.2 Power supply constraints on VBATT-RF
Due to the bursted emission in GSM / GPRS, the power supply must be able to
deliver high current peaks in a short time. During the peaks the ripple (U
the supply voltage must not exceed a certain limit (see
voltage
for details).
Table 1 Power supply
ripp
) on
• In communication mode, a GSM/GPRS class 2 terminal emits 577μs
radio bursts every 4.615ms. (See
VBATT-RFT
t = 577 μs
Uripp
T = 4,615 ms
Figure 2 below.)
Uripp
Figure 2 : Power supply during burst emission
• In communication mode, a GPRS class 10 terminal emits 1154μs radio
bursts every 4.615ms.
VBATT-RF:
• supplies the RF components with 3.6 V directly. It is essential to keep a
minimum voltage ripple at this connection in order to avoid any phase
error.
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The RF Power Amplifier current (1.5 A peak in GSM /GPRS mode) flows
with a ratio of:
o 1/8 of the time (around 577μs every 4.615ms for GSM /GPRS cl. 2)
and
o 2/8 of the time (around 1154μs every 4.615ms for GSM /GPRS cl.
10).
The rising time is around 10μs.
3.2.3 Power supply constraints on VBATT-BB
The VBATT-BB input is used as well to supply the WMP100 core as well to
monitor the level voltage of VBATT.
VBATT-BB is internally connected to several regulators and to a switching
regulator which provides the VCC_1V8 voltage internally. Because the
switching regulator generates perturbation on the VBATT signal, it is
mandatory to add an external reject filter between VBATT and VBATT-BB.
3.2.4 Electrical characteristics
Input power Supply Voltage
V
V
MIN
NOM
V
I
MAX
Ripple max (U
MAX
ripp
)
VBATT-BB 3.2 3.6 4.8 0.3 A (TBC) (TBD)
VBATT-RF
1,2
3.2 3.6 4.8 1.5 A (TBC) 10mV(TBC)
Table 1 Power supply voltage
(1): This value has to be guaranteed during the burst (with 1.5A Peak in GSM
or GPRS mode)
(2): Maximum operating Voltage Stationary Wave Ratio (VSWR) 2:1
When powering the WMP100 with a battery, the total impedance
(battery+protections+PCB) should be <150 mOhms.
3.2.5 Pin description
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Signal Pin number
VBATT-BB
VBATT-RF
AC1,AC2,AD1,AD2
A12,A13,A14,B12,B13,B14
3.2.6 Application
The reject filter must be connected between VBATT and VBATT-BB.
VBATT-RF
VBATT
Filter
C1 C2
L1
VBATT-BB
WMP100
Figure 3 : Reject filter diagram
Recommended components:
C1, C2: 10μF +/-20%
o GRM21BR60J106KE19L from MURATA
o CM21X5R106M06AT from KYOCERA
o JMK212BJ106MG-T from TAYO YUDEN
o C2012X5R0J106MT from TDK
L1: 220nH +/-5%
o 0805CS-221XJLC from COILCRAFT
o 0805G221J E from STETCO
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3.3 Power consumption
Power consumption depends on the configuration used. It is for this reason
that the following consumption values are given for each mode, RF band and
type of software used (with or without an Open AT
Note: All of the following information is given assuming a 50 Ω RF output.
The following consumption values were obtained by performing measurements
on WMP100 samples at a temperature of 25° C.
®
application).
Three VBATT values are used to measure the consumption, VBATT
VBATT
(4.8V) and VBATT
MAX
(3.6V).
TYP
(3.2V),
MIN
The average current is given for the three VBATT values and the peak current
given is the maximum current peak measured with the three VBATT voltages.
For a more detailed description of the operating modes, (refer to the document
[3] AT Command Interface Guide for Open AT® Firmware v6.5).
For more information about the consumption measurement procedure, refer to
§ 4.
All following consumption measurement values have to be confirmed.
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®
3.3.1.1 Power consumption without Open AT
processing
The following measurement results are relevant when:
®
¾ There is no Open AT
®
¾ The Open AT
application is disabled
¾ No processing is required by the Open AT
application
®
application
Power consumption without Open AT® processing
I
Operating mode Parameters
MIN
average
VBATT=4,8V
I
NOM
average
VBATT=3,6V
I
MAX
average
VBATT=3,2V
I
MAX
peak
unit
Alarm Mode
Fast Idle Mode
Slow Idle Mode 1
Fast Standby Mode
Slow Standby Mode
Connected Mode
Transfer Mode
class 8 (4Rx/1Tx)
Transfer Mode
class 10 (3Rx/2Tx)
21
Paging 9 (Rx burst occurrence ~2s) 15
Paging 2 (Rx burst occurrence ~0,5s) 17
Paging 9 (Rx burst occurrence ~2s)
Paging 2 (Rx burst occurrence ~0,5s)
1.5
(1.5 to 1.75)
4
(4 to 4.3)
30
1.4
850/900 MHz
PCL5 (TX power 33dBm) 210
PCL19 (TX power 5dBm) 81
PCL0 (TX power 30dBm) 145
1800/1900 MHz
PCL15 (TX power 0dBm) 77
850/900 MHz
gam. 3(TX power 33dBm) 201
gam.17(TX power 5dBm) 78
gam.3(TX power 30dBm) 138
1800/1900 MHz
gam.18(TX power 0dBm) 74
850/900 MHz
gam.3 (TX power 33dBm) 364
gam.17 (TX power 5dBm) 112
gam.3 (TX power 30dBm) 237
1800/1900 MHz
gam.18 (TX power 0dBm) 104
16
17
18
1.6
(1.6 to 1.9)
4.4
(4.4 to 4.75)
36
1.4
218
89
153
85
209
85
146
81
372
120
245
111
15 µA
18 160 RX mA
19 160 RX mA
1.7
(1.7 to 2.05)
4.6
(4.6 to 4.95)
160
160
RX
RX
39 mA
1.5 mA
222 1450 TX mA
92 270 TX mA
157 850 TX mA
88 250
TX
213 1450 TX mA
88 270
TX
149 850 TX mA
84 250
TX
378 1450 TX mA
123 270 TX mA
248 850 TX mA
115 250
TX
mA
mA
mA
mA
mA
mA
means that the current peak is the RF transmission burst (Tx burst)
TX
means that the current peak is the RF reception burst (Rx burst)
RX
1
Slow Idle Mode consumption depends on the SIM card used. Some SIM cards
respond faster than others, in which case the longer the response time is, the
higher the consumption is. These measurements were performed with a large
number of 3V SIM cards, the results in brackets are the minimum and
maximum currents measured from among all the SIMs used.
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®
3.3.1.2 Power consumption with a Dhrystone Open AT
®
The Open AT
application used is the Dhrystone application. The following
application
consumption results are measured during the run of the Dhrystone application.
Power consumption with Dhrystone Open AT® application
I
Operating mode Parameters
MIN
average
VBATT=4,8V
I
NOM
average
VBATT=3,6V
I
MAX
average
VBATT=3,2V
I
MAX
peak
unit
Alarm Mode
Fast Idle Mode
Slow Idle Mode
Fast Standby Mode
Slow Standby Mode
Connected Mode
Transfer Mode
class 8 (4Rx/1Tx)
Transfer Mode
class 10 (3Rx/2Tx)
N/A
Paging 9 (Rx burst occurrence ~2s) 31
Paging 2 (Rx burst occurrence ~0,5s) 32
Paging 9 (Rx burst occurrence ~2s) N/A
Paging 2 (Rx burst occurrence ~0,5s) N/A
31
N/A
850/900 MHz
PCL5 (TX power 33dBm) 211
PCL19 (TX power 5dBm) 82
PCL0 (TX power 30dBm) 146
1800/1900 MHz
PCL15 (TX power 0dBm) 78
850/900 MHz
gam. 3(TX power 33dBm) 202
gam.17(TX power 5dBm) 78
gam.3(TX power 30dBm) 140
1800/1900 MHz
gam.18(TX power 0dBm) 75
850/900 MHz
gam.3 (TX power 33dBm) 365
gam.17 (TX power 5dBm) 113
gam.3 (TX power 30dBm) 239
1800/1900 MHz
gam.18 (TX power 0dBm) 105
N/A
38
39
N/A
N/A
38
N/A
219
90
154
85
210
86
148
82
373
121
247
113
N/A µA
41 160 RX mA
42 160
mA
RX
N/A 160 RX mA
N/A 160 RX mA
41 mA
N/A mA
223 1450 TX mA
93 270
mA
TX
159 850 TX mA
89 250
mA
TX
214 1450 TX mA
89 270
mA
TX
151 850 TX mA
85 250 TX mA
379 1450 TX mA
125 270
mA
TX
250 850 TX mA
117 250
mA
TX
means that the current peak is the RF transmission burst (Tx burst)
TX
means that the current peak is the RF reception burst (Rx burst)
RX
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3.3.1.3 Consumption waveform samples
The consumption waveforms presented below are for an EGSM900 network
configuration without the Open AT
®
Software Suite running on the WMP100.
The typical VBATT voltage is 3.6V.
Four significant operating mode consumption waveforms are described:
¾ Connected Mode (PCL5: Tx power 33dBm)
¾ Slow Idle mode (Paging 9)
¾ Fast idle mode (Paging 9)
¾ Transfer mode (GPRS class 10, gam.3: Tx power 33dBm )
The following waveform shows only the form of the current.
3.3.1.3.1 Connected mode current waveform
Connected mode 33dBm
Current(A) / Time (s)
1.6
TX PEAK
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
0
.
0
0
2
0
.
0
0
4
0
.
0
0
6
0
.0
0
8
0
.0
1
0
.
0
1
2
0
.
0
1
4
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3.3.1.3.2 Slow Idle mode current waveform
Slow Idle mode Paging ~2s
Current(A) / Time (s)
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
-0.02
RX PEAK
0
0
1
2
3
4
5
6
7
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