Sierra Wireless SB555 User Manual
SB555
Development Kit
Hardware Integration
Guide
Proprietary and Confidential
2130075
Rev 1.0
Preface
Important
Notice
Safety and
Hazards
Because of the nature of wireless communications, transmission and reception of data can
never be guaranteed. Data may be delayed,
corrupted (i.e., have errors) or be totally lost.
Although significant delays or losses of data are
rare when wireless devices such as the Sierra
Wireless modem are used in a normal manner
with a well-constructed network, the Sierra
Wireless modem should not be used in situations
where failure to transmit or receive data could
result in damage of any kind to the user or any
other party, including but not limited to personal
injury, death, or loss of property. Sierra
Wireless, Inc., accepts no responsibility for
damages of any kind resulting from delays or
errors in data transmitted or received using the
Sierra Wireless modem, or for failure of the
Sierra Wireless modem to transmit or receive
such data.
Do not operate the Sierra Wireless modem in
areas where blasting is in progress, where
explosive atmospheres may be present, near
medical equipment, near life support equipment,
or any equipment which may be susceptible to
any form of radio interference. In such areas, the
Sierra Wireless modem MUST BE POWERED
OFF. The Sierra Wireless modem can transmit
signals that could interfere with this equipment.
Do not operate the Sierra Wireless modem in any
aircraft, whether the aircraft is on the ground or
in flight. In aircraft, the Sierra Wireless modem
MUST BE POWERED OFF. When operating,
the Sierra Wireless modem can transmit signals
that could interfere with various onboard
systems.
Rev 1.0 Apr.02 Proprietary and Confidential 1
SB555 Hardware Integration Guide
The driver or operator of any vehicle should not
operate the Sierra Wireless modem while in
control of a vehicle. Doing so will detract from
the driver or operator's control and operation of
that vehicle. In some states and provinces,
operating such communications devices while in
control of a vehicle is an offence.
Note: Some airlines may permit the use of cellular
phones while the aircraft is on the ground and the
door is open. Sierra Wireless modems may be
used at this time.
Limitation of
Liability
The information in this manual is subject to
change without notice and does not represent a
commitment on the part of Sierra Wireless, Inc.
SIERRA WIRELESS, INC. SPECIFICALLY
DISCLAIMS LIABILITY FOR ANY AND ALL
DIRECT, INDIRECT, SPECIAL, GENERAL,
INCIDENTAL, CONSEQUENTIAL, PUNITIVE
OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR
REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR
INABILITY TO USE ANY SIERRA WIRELESS,
INC. PRODUCT, EVEN IF SIERRA WIRELESS,
INC. HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE
FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.
2 Proprietary and Confidential 2130075
Preface
Patents Portions of this product are covered by some or
all of the following US patents:
5,515,013 5,617,106 5,629,960 5,682,602
5,748,449 5,845,216 5,847,553 5,878,234
5,890,057 5,929,815 6,169,884 6,191,741
6,199,168 6,327,154 6,339,405 D367,062
D372,248 D372,701 D416,857 D442,170
D452,495 D452,496 and other patents pending.
This product includes
technology licensed from:
Copyright ©2002 Sierra Wireless, Inc. All rights reserved.
Printed in Canada.
Tr a d e m a r k s
Rev 1.0 Apr.02 Proprietary and Confidential 3
“Heart of the Wireless Machine” is a registered
trademark of Sierra Wireless, Inc.
Sierra Wireless, the Sierra Wireless logo, the red
wave design, and Watcher are trademarks of
Sierra Wireless, Inc.
®
Windows
Corporation.
Qualcomm
Qualcomm Incorporated.
Other trademarks are the property of the
respective owners.
is a registered trademark of Microsoft
®
is a registered trademark of
SB555 Hardware Integration Guide
Contact Information
Sales Desk: Phone: 1-604-232-1488
Technical Support: Included with the purchase of the SB555
Post: Sierra Wireless, Inc.
Fax: 1-604-231-1109
Web: www.sierrawireless.com
Hours: 8:00 AM to 5:00 PM Pacific Time
e-mail: sales@sierrawireless.com
Development Kit you receive five hours of tier 3
engineering integration support. You will have
received instructions by e-mail on how to access the
OEM Customer Support web site. For more details,
please contact your account manager, or the Sierra
Wireless sales desk.
13811 Wireless Way,
Richmond, BC
Canada V6V 3A4
Your comments and suggestions on improving
this documentation are welcome and appreciated. Please e-mail your feedback to
documentation@sierrawireless.com. Thank you.
Consult our website for up-to-date product
descriptions, documentation, application notes,
firmware upgrades, troubleshooting tips, and
press releases:
www.sierrawireless.com
4 Proprietary and Confidential 2130075
Table of Contents
About this Guide. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Document structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Terminology and acronyms . . . . . . . . . . . . . . . . . . . . . . . . 13
Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Mechanical Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Physical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Mounting the module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Module weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Module shields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Module connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Host interface connector . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Location of pin 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Antenna connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Assembly sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Environmental issues . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Thermal dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Shock and vibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Dust, dirt, and moisture . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Rev 1.0 Apr.02 Proprietary and Confidential 5
Hardware Integration Guide
Electrical Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Modem specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Location of pin 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
General requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Unused pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Preventing back-power when the modem is off . . . . . . . . 27
Voltage regulation and buffering . . . . . . . . . . . . . . . . . . . . 28
Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Sample power integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Power source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
MOSFET power switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Pins 1 and 2: Modem VCC . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Power regulator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Pins 3, 4, 25, 30: Ground connection . . . . . . . . . . . . . . . . . 33
Requirements of the power interface. . . . . . . . . . . . . . . . . . . . 34
Module shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Power ramp-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Power-up timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Trace widths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
6 Proprietary and Confidential 2130075
Contents
Serial Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Serial port specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 37
External pullup and pulldown resistors . . . . . . . . . . . . . . 38
ESD protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Primary port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Pin 21: /DCD1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Pin 22: RxD1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Pin 23: TxD1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Pin 24: /DTR1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Pin 25: GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Pin 26: /DSR1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Pin 27: /RTS1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Pin 28: /CTS1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Pin 29: /RI1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Pin 30: GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Port configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Primary port sample integrations . . . . . . . . . . . . . . . . . . . 45
Sample 1: Internal host integration . . . . . . . . . . . . . . . . . 46
Sample 2: External serial connector. . . . . . . . . . . . . . . . . 47
Sample 3: Minimum integration . . . . . . . . . . . . . . . . . . . . 49
Secondary port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Pin 17: /CTS2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Pin 18: /RTS2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Pin 19: TxD2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Pin 20: RxD2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Pin 25: GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Rev 1.0 Apr.02 Proprietary and Confidential 7
Hardware Integration Guide
Port configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Secondary port sample integration . . . . . . . . . . . . . . . . . . 54
Minimum integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Voice Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Introduction to voice features . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Audio block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Headset integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Headset interface specifications . . . . . . . . . . . . . . . . . . . . 60
Microphone input (headset) . . . . . . . . . . . . . . . . . . . . . . . . 62
Speaker output (headset) . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Sample headset integration . . . . . . . . . . . . . . . . . . . . . . . . 62
Line level voice integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Microphone input (line level) . . . . . . . . . . . . . . . . . . . . . . . 65
Speaker output (line level). . . . . . . . . . . . . . . . . . . . . . . . . . 65
Control Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Control interface specifications . . . . . . . . . . . . . . . . . . . . . 67
External pullup and pulldown resistors . . . . . . . . . . . . . . . 68
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Status indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Human interface (LEDs) . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Sample LED status interface . . . . . . . . . . . . . . . . . . . . . . . . 70
8 Proprietary and Confidential 2130075
Contents
Machine interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Sample machine interface to status outputs . . . . . . . . . 72
Shutdown and reset control. . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Pin 37: /Shdn_Ack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Pin 38: /ShutDown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Pin 39: /Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Sample shutdown interface integration . . . . . . . . . . . . . 76
Shutdown sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Shutdown timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
RF Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
RF connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Connector considerations . . . . . . . . . . . . . . . . . . . . . . . . . 80
Ground plane isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
ESD protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Antenna and cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Matching antenna and cable. . . . . . . . . . . . . . . . . . . . . . . 83
Antenna options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Interference and sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Device generated RF. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Modem generated RF switching noise . . . . . . . . . . . . . . 87
Rev 1.0 Apr.02 Proprietary and Confidential 9
Hardware Integration Guide
Appendix A:
Host Connector Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Appendix B:Sample Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Appendix C:
Electrostatic Discharge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Charge creation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Damage from ESD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Types of damage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Exposed interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Protection from ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
TVS diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
PCB design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
ESD integration considerations . . . . . . . . . . . . . . . . . . . . . . . 101
Return ground path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Selection guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
10 Proprietary and Confidential 2130075
1: About this Guide
• Introduction
• Document
structure
• References
• Conventions
Introduction
This guide is one component of the SB555 Development Kit. It covers the integration of the
product from the hardware point of view. Other
guides in the kit cover project planning, software
integration, and product verification and configuration.
For details on the features of the SB555
embedded modem, please consult the SB555
Embedded Modem Product Specification
(document #2130072).
To aid you in making decisions on what aspects
of the modem require integration in your project,
and to determine what hardware is required to
support particular features, please consult the
SB555 Development Kit Design Guide
(document #2130179). This hardware guide
covers the details of integrating each interface
but does not discuss the reasons to include or
exclude any particular element.
Where configurable features are mentioned, the
method of configuring or calibrating can be
found in the Verification and Configuration
Guide (document #2130078).
1
Rev 1.0 Apr.02 Proprietary and Confidential 11
SB555 Hardware Integration Guide
Document structure
This document covers hardware integration
issues in these main categories:
• Mechanical Integration
· Mounting
· Connectors
· Environmental Issues
• Electrical Integration
· General Specifications
· General Considerations
· Power Supply
· Electrostatic Discharge (ESD)
• Serial Interface
· Primary Port (Serial 1) - Data
· Secondary Port (Serial 2) - Control
• Voi ce Interf ace
· Analog Voice
• Control Signals
· Status Signals
· Shutdown Control
· Reset
• RF integration
· RF Connections
· Antenna and Cabling
· Interference and Sensitivity
• Appendix A—Pinouts
• Appendix B—Sample Integration, a typical
MCU integration block diagram
• Appendix C—Electrostatic Discharge (ESD)
12 Proprietary and Confidential 2130075
About This Guide
References
This guide covers only the hardware integration
of the SB555 modem. It does not deal with
specifics of product modem operation or use of
the optional Embedded Modem Interface Kit.
Please consult the other documents provided
with the Development Kit or the Interface Kit
User Guide for additional information on operations.
You may also want to consult other documents
available on our Internet site at
www.sierrawireless.com.
Terminology and acronyms
This document makes wide use of acronyms that
are in common use in data communications and
cellular/PCS technology. Our Internet site
provides a Glossary (document 2110032) that
may be helpful in understanding some acronyms
and terminology used in this guide.
Conventions
Numerics Numeric values are generally
presented in decimal but may also be expressed
in hexadecimal or binary. Hexadecimal values
are shown with a prefix of 0x, i.e. in the form
0x3D. Binary values are shown with a prefix of
0b, i.e. in the form 0b00111101. Otherwise,
values are presumed decimal.
Rev 1.0 Apr.02 Proprietary and Confidential 13
SB555 Hardware Integration Guide
Units Units of measure are given in metric.
Where measure is provided in imperial units,
they are shown in parenthesis after the metric
units.
Signal Names When signals are discussed by
their function, the functional name is used in
standard font (i.e. Reset, Shutdown
Acknowledge). When the pin, wire, or trace
carrying the signal is referenced, it will use the
proper name in an alternate font:
/Reset
/Shdn_Ack
Signals that are active low are named with a
prefix slash “/” as shown in the sample above.
Signal names without the slash are active high.
Fonts Command and register syntax is noted
using an alternate font:
AT~AUDMOD=1
Responses from the modem, or host system
software prompts, are shown in this font:
CONNECT 14400
Character codes which are described with words
or standard abbreviations are shown within
angle brackets: such as
<space> for a blank space character.
and
<CR> for Carriage Return
14 Proprietary and Confidential 2130075
2:
Mechanical Integration
• Introduction
• Physical
dimensions
• Mounting
• Connectors
• Assembly
sequence
• Environmental
issues
Introduction
The SB555 CDMA2000 1X embedded modem
form factor is the proprietary Sierra Wireless
embedded module package. Physical dimensions, mounting holes, and connectors are
identical to other upcoming Sierra Wireless
embedded modem products.
This chapter covers the integration issues
surrounding:
• Mounting
• Connector fit
• Assembly sequence
• Environmental issues
2
Rev 1.0 Apr.02 Proprietary and Confidential 15
SB555 Hardware Integration Guide
Physical dimensions
The SB555 comes in the Sierra Wireless proprietary standard module package. Dimensions in
millimeters are shown in the figure below.
Figure 2-1: Module dimensions (in mm)
16 Proprietary and Confidential 2130075
Mechanical Integration
Mounting the module
Note: The integration
should include standoffs
of some kind to protect
the modem shields from
being crushed during
assembly and from
coming into contact with
circuitry on the host
device.
Sierra Wireless embedded modules have four (4)
mounting holes of 2.5 mm (0.984”) diameter, one
located at each corner of the module (as seen in
Figure 2-1). The mounting holes are sized to
accommodate a metric M2 (#2 screw).
The 40-pin host connector allows for either
bottom or top entry, to permit mounting in any
orientation. Sierra Wireless does not provide
mounting hardware.
The sample illustration does not show standoffs.
Figure 2-2: Sample bottom entry mounting (mm)
Rev 1.0 Apr.02 Proprietary and Confidential 17
SB555 Hardware Integration Guide
Module weight
The module has a total weight under 14
grams (0.49 ounces). Typical weight is 13.5
grams (0.48 ounces).
Module shields
The SB555 comes with shields on both top and
bottom. These shields are attached to a fence
surrounding the circuitry.
Figure 2-3: Shield fence frame
The internal webbing of the fence frame may be
removed in some units to permit factory rework.
This webbing is used for automated pick-and-
18 Proprietary and Confidential 2130075
Mechanical Integration
place only. The product has been fully qualified
mechanically and electrically with and without
the webbing.
Module connectors
There are two connectors: a 40-pin header for the
host interface, and an MMCX connector for the
antenna. Both are mounted offset from the
module centerline to prevent assembly orientation errors.
Host interface connector
The host connector is a 40-pin, 1 mm pitch,
2-row, female header (Samtec part #CLM-120-02F-n-BE with bottom entry option). This host
connector is capable of accepting either a top or
bottom entry mating header connector.
Suitable mating connectors are:
• Samtec (
FTMH series
• Major League Electronics
(
www.majorleagueelectronics.com) BSTCM-7
series
The recommended exposed pin length is:
• 1.4 mm (0.055”) for top entry
• 3.2 mm (0.125”) for bottom entry
The connector is not keyed. The connector is
offset from the module centerline to prevent
assembly orientation errors.
www.samtec.com) MW, FTM or
Rev 1.0 Apr.02 Proprietary and Confidential 19
SB555 Hardware Integration Guide
Location of pin 1
Pin 1 of the host connector is shown in
Figure 2-4. When viewing the module with the
connector facing up and the RF connector at the
bottom, pin 1 is on the extreme right of the inside
edge (lower row).
Pin 40
Pin 2
Pin 19Pin 39
Figure 2-4: Host connector pin locations
Pin 1
Antenna connector
The antenna connector is an MMCX female jack
oriented in line with the module longitudinal
axis. Mating plugs can be either straight or rightangle.
The detent on the connector is quite stiff to
ensure the connection remains intact through
vibration and shock. The connector is designed
for 500 connection cycles, which may not be
sufficient for some end-user applications. For
this reason, and to allow for ESD protection, the
modem’s MMCX connector should not be
presented directly to the user for antenna
attachment.
The integration can include a host system built-in
antenna—without presenting a connector to the
user—or any of a variety of RF connector types
(SMA, SMB, TNC, etc.) as suits the application.
See “Ground plane isolation” on page 81 for
additional information on insulating the RF
connector ground.
20 Proprietary and Confidential 2130075
Mechanical Integration
For mechanical integration, use a flexible 50 Ω
coaxial cable to allow attachment of the MMCX
connector to the modem either before or after
mounting the module on the host device.
Assembly sequence
Due to the strong detent in the MMCX antenna
connector, Sierra Wireless recommends that you
connect the antenna cable to the modem before
connecting the modem’s 40-pin connector to the
host device. This will avoid stress on the host
connector. Your situation may vary; this is only
a recommendation. Where host mounting is
performed prior to antenna cable attachment, the
module should be secured, with screws and
standoffs, to the host device.
Use suitable standoffs with screws or other
mounts to hold the module securely in place,
while preventing the modem’s shield from
grounding to the host device.
Environmental issues
The SB555 embedded modem conforms to the
specifications listed in Table 2-1 on the following
page. Enhanced specifications may be achieved
through appropriate mounting.
Rev 1.0 Apr.02 Proprietary and Confidential 21
SB555 Hardware Integration Guide
Table 2-1: Environmental specifications
Temperature range Operating: -30 to +60°C (-22 to +140°F)
(modem ambient*)
Storage: -40 to +85
°C (-40 to +185°F)
Humidity MIL-STD-202F
95% non-condensing @ 65
Vibration
(random)**
Vibration
(sine wave)**
MIL-STD-810E
0.04 g2/Hz, 10 – 2000 Hz
PC Card Standard
15 g (147 m/s
Shock** MIL-STD-202F
50 g (490 m/s
Drop**
(unpackaged)
PC Card Standard
0.75 meter drop onto non-cushioned vinyl
2
), 10 – 2000 Hz
2
), 11 ms, 6 pulses/axis
°C (149°F)
(2 drops on each axis, 6 drops total)
* Modem ambient means in the immediate area of the modem, not the ambient
temperature around the finished device. This is typically a temperature inside
your device.
A thermistor inside the modem (monitored by the modem CPU firmware)
causes flow control to be activated should the internal temperature reach
75ºC (167ºF) as measured at the radio. Flow control is released when the
temperature falls below 75ºC. Should the temperature of the radio reach
80ºC (176ºF), the modem terminates the connection in order to protect components and avoid drifting outside radio specifications.
** Vibration, shock, and drop tests are performed for survivability. The modem is
not in operation during the test. Cosmetic damage is ignored.
Thermal dissipation
Determination of thermal dissipation depends
heavily on the usage model of the modem. The
SB555 modem generates more heat when actively
transmitting. However the transmitter is not on
at all times, nor is the transmit power constant.
22 Proprietary and Confidential 2130075
Table 2-2 provides a guideline of the energy to be
dissipated when the modem is in various states
of activity.
Table 2-2: Energy dissipation (typical)
Mechanical Integration
Mode Current
consumption
Shutdown 3.3 V @ 0.7 mA 2.3 mW
Slotted sleep (SCI = 2)
(DTR deasserted)
Slotted sleep (SCI = 2)
(DTR asserted)
Receive 3.3 V @ 160 mA 528 mW
Transmit
(typical at +3 dBm)
Transmit (worst case)
(full power +23.5 dBm)
3.3 V @ 5 mA 16.5 mW
3.3 V @ 40 mA 132 mW
3.3 V @ 370 mA 1219 mW
4.2 V @ 900 mA 3376 mW
Energy to
dissipate
Transmit cases are usually short duration bursts.
Electrostatic discharge
This is treated as an electrical integration issue.
The SB555 does not provide a specified level of
protection from electrostatic discharge (ESD).
Exposed interfaces should be protected by your
circuitry design. Details are covered in Chapter
3:Electrical Integration.
Consult “Electrostatic Discharge” on page 95 for
a general discussion of ESD.
Rev 1.0 Apr.02 Proprietary and Confidential 23
SB555 Hardware Integration Guide
Shock and vibration
The specifications provided on shock and
vibration are for the module free of integration
hardware.
A person rolling off a bed onto the floor is likely
to emerge without injury; whereas one with a fire
hydrant strapped to his back may not. Once
integrated into your device, the surrounding
hardware can have a significant impact on the
modem’s survivability.
Through the mounting and integration decisions
you make, your design will need to meet your
own product’s survivability specifications.
Dust, dirt, and moisture
The shields are not intended to provide the
modem with protection from dust, dirt, or
moisture. Your integration should provide
reasonable insulation from these environmental
factors as needed to meet your product’s specificatons.
24 Proprietary and Confidential 2130075
3: Electrical Integration
• Introduction
• Specifications
• General
requirements
• Power supply
• Electrostatic
discharge
Introduction
This chapter covers the integration requirements
and issues related to the general electrical
connection of the SB555 modem, and the power
supply in particular. RF issues are covered in
Chapter 7:RF Integration on page 79.
The SB555 embedded modem presents all
electrical interfaces on the single 40-pin host
connector. This chapter covers:
• The connector and the general electrical
characteristics of the modem
• Power supply considerations
• Electrostatic Discharge (ESD) protection
The elements of integrating each of the modem
interfaces (serial, voice, and control signals) are
covered in subsequent chapters.
3
Modem specifications
The SB555 embedded modem provides a single
40-pin (2x20) header. The connector pinouts are
specified in Appendix A:Host Connector Pinouts
on page 89.
All signals are 3.0 V, HCMOS logic compatible.
Rev 1.0 Apr.02 Proprietary and Confidential 25
SB555 Hardware Integration Guide
Table 3-1: Host interface electrical characteristics
Parameter Test Conditions Min Typical Max Units
Power
V
DC supply Max ripple 100 mV
cc
Digital Interface
V
V
I
I
V
V
I
I
IH
IL
OH
OL
IH
IL
OH
OL
HI threshold 2.1 3.0 3.3 V
LO threshold 0 0 0.8 V
Input current 3 V applied to input 0 120 µA
Input current 0 V applied to input 0 -120 µA
HI output IOH = 2.0 mA 2.4 3.0 V
LO output IOL = -2.0 mA 0 0.4 V
Output
current
Output
current
p-p
3.2 3.3 4.2 V
VOH > 2.0 V 3.0 mA
VOL < 1.0 V -3.0 mA
Location of pin 1
Pin 1 of the connector is shown in Figure 3-1.
When viewing the module with the connector
facing up and the RF connector at the bottom,
pin 1 is on the extreme right of the inside edge
(lower row).
Pin 40
Pin 2
Pin 19Pin 39
Figure 3-1: Host connector pin locations
26 Proprietary and Confidential 2130075
Pin 1
Electrical Integration
General requirements
Unused pins
Unused signals must be terminated properly.
The pinout tables, both in the Appendix and in
the interface sections, include a column for termination of unused pins.
Preventing back-power when the modem is off
Note: Without proper
input protection, the
modem may draw
sufficient current to
remain powered, even
when the normal supply
power is removed.
Active low signals may be deasserted (driven
high) by the host device when the modem is not
needed. This applies 3.0 V to the modem on
these pins and presents the risk of backpowering.
All connector inputs must be either high
impedance (>20 kΩ), or driven low, when the
modem is powered off. This is required to
prevent back-powering the modem. This is
particularly important if the DTR signal is
deasserted (high) when the modem is not in use.
The sample integration shown in the appendix
uses buffers. These provide both voltage
conversion between 3.0 V of the modem and
3.3 V of the host MCU, and the required
protection from back powering both the MCU
and the modem.
Rev 1.0 Apr.02 Proprietary and Confidential 27
SB555 Hardware Integration Guide
Voltage regulation and buffering
All logic signals at the SB555 host connector are
referenced to 3.0 V. Logic signals at the host
device may be referenced to 3.3 V, thus requiring
the use of buffers between the devices. These
buffers are discussed in the sections on the
specific interfaces. See the Typical MCU
Integration block diagram in the appendix.
Note: The actual VCC of
the logic internal to the
SB555 is 3.0 V, not the
3.2 V–4.2 V applied to
the V
SB555 module. The
74AHC series parts can
tolerate 3.3 V applied to
inputs while VCC=0V.
pins of the
CC
This buffer is mainly to protect the SB555 when it
is powered down while the host device remains
powered up.
Additionally, the modem’s input pins should not
have a voltage applied to them that is more than
0.3 V above the internal V
, which could
CC
happen when the modem is powered down.
Although some of the SB555 output lines are
configured as inputs by a reset, they all have
weak internal pullup or pulldown devices
(approx. 50 k to 375 k
Ω), so no external resistors
need to be added. If you decide to add external
resistors:
• Use pulldown resistors for:
· /RI1
· /DCD1
• Use pullup resistors (to 3.0 V) for:
· /DSR1
· /CTS2
· RxD2
· /Shdn_Ack
This is consistent with the internal devices. A
suggested value is 100 k
Ω.
28 Proprietary and Confidential 2130075
Loading...