Sierra Wireless Q2687 Users Manual

WA_DEV_Q26RD_PTS_001
002
April 20, 2010
AirPrime Q2687 Refreshed
Product Technical Specification and Customer Design Guideline
Product Technical Specification and Customer Design Guideline
Important Notice
Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data.
Safety and Hazards
Do not operate the Sierra Wireless modem in areas where blasting is in progress, where explosive atmospheres may be present, near medical equipment, near life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the Sierra Wireless modem MUST BE POWERED OFF. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems.
Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is
open. Sierra Wireless modems may be used at this time.
The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence.
Limitations of Liability
This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use.
The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 2
Product Technical Specification and Customer Design Guideline
Patents
5,515,013
5,629,960
5,845,216
5,847,553
5,878,234
5,890,057
5,929,815
6,169,884
6,191,741
6,199,168
6,339,405
6,359,591
6,400,336
6,516,204
6,561,851
6,643,501
6,653,979
6,697,030
6,785,830
6,845,249
6,847,830
6,876,697
6,879,585
6,886,049
6,968,171
6,985,757
7,023,878
7,053,843
7,106,569
7,145,267
7,200,512
7,295,171
7,287,162
D442,170
D459,303
D599,256
D560,911
Sales Desk:
Phone:
1-604-232-1488
Hours:
8:00 AM to 5:00 PM Pacific Time
E-mail:
sales@sierrawireless.com
Post:
Sierra Wireless 13811 Wireless Way Richmond, BC Canada V6V 3A4
Fax:
1-604-231-1109
Web:
www.sierrawireless.com
Portions of this product may be covered by some or all of the following US patents:
and other patents pending.
This product includes technology licensed from QUALCOMM
®
3G
Manufactured or sold by Sierra Wireless or its licensees under one or more patents licensed from InterDigital Group.
Copyright
© 2010 Sierra Wireless. All rights reserved.
Trademarks
AirCard® and Watcher® are registered trademarks of Sierra Wireless. Sierra Wireless™, AirPrime™,
AirLink, AirVantageand the Sierra Wireless logo are trademarks of Sierra Wireless.
, , ®, inSIM®, WAVECOM®, WISMO®, Wireless Microprocessor®, Wireless CPU®, Open AT® are filed or registered trademarks of Sierra Wireless S.A. in France and/or in other countries.
Windows
®
and Windows Vista® are registered trademarks of Microsoft Corporation.
Macintosh and Mac OS are registered trademarks of Apple Inc., registered in the U.S. and other countries.
QUALCOMM
®
is a registered trademark of QUALCOMM Incorporated. Used under license.
Other trademarks are the property of the respective owners.
Contact Information
Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips, and press releases: www.sierrawireless.com
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 3
Product Technical Specification and Customer Design Guideline
Document History
Version
Date
Updates
001
January 28, 2010
Creation
002
April 20, 2010
Reformatted in the rebranded SWI template.
In Section 3 Technical Specifications:
Moved the Power Supply Design Requirements to section 9.1
Power Supply
Updated Figure 5
In section 4 Interfaces:
Updated section 4.7.4 5-wire Serial Interface
Updated section 4.8.1 Pin Description
Updated section 4.8.3 4-wire Serial Interface
Updated section 8.4 Reliability Prediction Model.
Updated links in section 13.1.1 Web Site Support.
Updated Intelligent Embedded Module weight to 8g.
Updated the RF Component list.
Removed references to IMP Connector throughout the document.
Updated Figure 10 Example of a 4-wire SPI Bus Application.
Updated section 4.15 Temperature Sensor Interface.
Updated Power ON information based on Tracker 01626.
Updated U1 Chip information based on CUS57225.
Updated antenna gain information.
Updated FCC ID.
Updated power consumption values in section 6 Power Consumption.
Updated Figure 5 Q2687 Refreshed Embedded Module Mechanical Drawing and Figure 6 Maximum Bulk Occupied on the Host Board.
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 4

Contents

1. INTRODUCTION ................................................................................................ 16
1.1. Physical Dimensions ................................................................................................... 16
1.2. General Features ........................................................................................................ 16
1.3. GSM/GPRS/EGPRS Features .................................................................................... 18
1.4. Interfaces ................................................................................................................... 18
1.5. Operating System ....................................................................................................... 18
1.6. Connection Interfaces ................................................................................................. 19
1.7. Environment and Mechanics ....................................................................................... 19
1.7.1. RoHS Directive Compliant ................................................................................... 19
1.7.2. Disposing of the Product ...................................................................................... 19
2. FUNCTIONAL SPECIFICATIONS ...................................................................... 20
2.1. Functional Architecture ............................................................................................... 20
2.1.1. RF Functionalities ................................................................................................ 20
2.1.2. Baseband Functionalities ..................................................................................... 21
2.2. Operating System ....................................................................................................... 21
3. TECHNICAL SPECIFICATIONS ........................................................................ 22
3.1. Power Supply ............................................................................................................. 22
3.1.1. Power Supply Pin-Out .......................................................................................... 23
3.1.2. Start-Up Current .................................................................................................. 24
3.1.3. Decoupling of Power Supply Signals .................................................................... 24
3.2. Mechanical Specifications ........................................................................................... 24
3.3. Firmware Upgrade ...................................................................................................... 27
4. INTERFACES ..................................................................................................... 28
4.1. General Purpose Connector (GPC) ............................................................................. 28
4.1.1. Pin Description .................................................................................................... 29
4.1.2. Pin Out Differences .............................................................................................. 34
4.2. Electrical Information for Digital I/O ............................................................................. 35
4.3. General Purpose Input/Output .................................................................................... 37
4.3.1. Pin Description .................................................................................................... 37
4.4. Serial Interface ........................................................................................................... 39
4.4.1. SPI Bus ............................................................................................................... 39
4.4.1.1. Characteristics ........................................................................................................ 39
4.4.1.2. SPI Configuration .................................................................................................... 39
4.4.1.3. SPI Waveforms ....................................................................................................... 40
4.4.1.4. SPI1 Pin Description ................................................................................................ 41
4.4.1.5. SPI2 Pin Description ................................................................................................ 41
4.4.1.6. Application .............................................................................................................. 42
4.4.2. I2C Bus ................................................................................................................ 43
4.4.2.1. I2C Waveforms ........................................................................................................ 43
4.4.2.2. I2C Pin Description .................................................................................................. 44
4.4.2.3. Application .............................................................................................................. 44
4.5. Parallel Interface ......................................................................................................... 45
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Product Technical Specification and Customer Design Guideline
4.5.1. Pin Description .................................................................................................... 45
4.5.2. Electrical Characteristics ...................................................................................... 46
4.5.3. Asynchronous Access .......................................................................................... 46
4.5.4. Synchronous Access ........................................................................................... 48
4.5.5. Additional Information Regarding Address Size Bus ............................................. 51
4.5.6. Application ........................................................................................................... 51
4.6. Keyboard Interface ..................................................................................................... 52
4.6.1. Pin Description .................................................................................................... 52
4.6.2. Application ........................................................................................................... 53
4.7. Main Serial Link (UART1) ........................................................................................... 54
4.7.1. Pin Description .................................................................................................... 54
4.7.2. Level Shifter Implementation ................................................................................ 55
4.7.2.1. Recommended Components .................................................................................... 55
4.7.3. V24/CMOS Possible Designs ............................................................................... 56
4.7.4. 5-wire Serial Interface .......................................................................................... 57
4.7.5. 4-wire Serial Interface .......................................................................................... 57
4.7.6. 2-wire Serial Interface .......................................................................................... 57
4.8. Auxiliary Serial Link (UART2) ...................................................................................... 58
4.8.1. Pin Description .................................................................................................... 58
4.8.2. Level Shifter Implementation ................................................................................ 59
4.8.2.1. Recommended Components .................................................................................... 59
4.8.3. 4-wire Serial Interface .......................................................................................... 60
4.8.4. 2-wire Serial Interface .......................................................................................... 60
4.9. SIM Interface .............................................................................................................. 61
4.9.1. Pin Description .................................................................................................... 61
4.9.2. Electrical Characteristics ...................................................................................... 61
4.9.3. Application ........................................................................................................... 62
4.9.3.1. SIM Socket Pin Description ...................................................................................... 62
4.9.3.2. Recommended Components .................................................................................... 63
4.10. USB 2.0 Interface ....................................................................................................... 64
4.10.1. Pin Description .................................................................................................... 64
4.10.2. Electrical Characteristics ...................................................................................... 64
4.10.3. Application ........................................................................................................... 65
4.10.3.1. Recommended Components .................................................................................. 65
4.11. RF Interface ................................................................................................................ 66
4.11.1. RF Connections ................................................................................................... 66
4.11.1.1. UFL Connector ...................................................................................................... 66
4.11.1.2. Soldered Solution .................................................................................................. 66
4.11.1.3. Precidip Connector ................................................................................................ 66
4.11.2. RF Performance .................................................................................................. 66
4.11.3. Antenna Specifications ........................................................................................ 67
4.11.3.1. Application ............................................................................................................ 67
4.12. Analog Audio Interface................................................................................................ 68
4.12.1. Pin Description .................................................................................................... 68
4.12.2. Microphone Features ........................................................................................... 68
4.12.2.1. MIC1 Microphone Input .......................................................................................... 68
4.12.2.2. MIC2 Microphone Input .......................................................................................... 72
4.12.3. Speaker Features ................................................................................................ 75
4.12.3.1. Speakers Output Power ......................................................................................... 76
4.12.3.2. SPK1 Speaker Output............................................................................................ 76
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Product Technical Specification and Customer Design Guideline
4.12.3.3. SPK2 Speaker Output............................................................................................ 77
4.12.3.4. Differential Connection Example ............................................................................ 78
4.12.3.5. Single-Ended Connection Example ........................................................................ 78
4.12.3.6. Recommended Characteristics .............................................................................. 79
4.13. Digital Audio Interface (PCM) ...................................................................................... 80
4.13.1. PCM Waveforms.................................................................................................. 81
4.13.2. Pin Description .................................................................................................... 82
4.14. Battery Charging Interface .......................................................................................... 83
4.14.1. Charging Algorithms ............................................................................................ 84
4.14.1.1. Ni-Cd/Ni-Mh Charging Algorithm ............................................................................ 84
4.14.1.2. Li-Ion Charging Algorithm ...................................................................................... 85
4.14.2. Pre-Charging ....................................................................................................... 88
4.14.3. Temperature Monitoring ....................................................................................... 88
4.14.4. Recharging .......................................................................................................... 88
4.14.5. Application ........................................................................................................... 89
4.14.5.1. Temperature Computation Method ......................................................................... 89
4.14.6. Charger Recommendations ................................................................................. 90
4.15. Temperature Sensor Interface .................................................................................... 91
5. SIGNALS AND INDICATORS ............................................................................ 92
5.1. ON/~OFF Signal ......................................................................................................... 92
5.1.1. Pin Description .................................................................................................... 92
5.1.2. Electrical Characteristics ...................................................................................... 92
5.1.3. Power-ON ............................................................................................................ 92
5.1.4. Power-OFF .......................................................................................................... 94
5.1.5. Application ........................................................................................................... 95
5.2. Reset Signal (~RESET) .............................................................................................. 96
5.2.1. Reset Sequence .................................................................................................. 96
5.2.2. Pin Description .................................................................................................... 97
5.2.3. Electrical Characteristics ...................................................................................... 97
5.2.4. Application ........................................................................................................... 97
5.3. BOOT Signal .............................................................................................................. 99
5.3.1. Pin Description .................................................................................................... 99
5.4. BAT-RTC (Backup Battery) ....................................................................................... 100
5.4.1. Pin Description .................................................................................................. 100
5.4.2. Electrical Characteristics .................................................................................... 101
5.4.3. Application ......................................................................................................... 101
5.4.3.1. Super Capacitor .....................................................................................................101
5.4.3.2. Non-Rechargeable Battery ......................................................................................101
5.4.3.3. Rechargeable Battery .............................................................................................102
5.5. Buzzer Output........................................................................................................... 103
5.5.1. Pin Description .................................................................................................. 103
5.5.2. Electrical Characteristics .................................................................................... 103
5.5.3. Application ......................................................................................................... 104
5.5.4. Recommended Characteristics .......................................................................... 104
5.6. External Interrupt ...................................................................................................... 105
5.6.1. Pin Description .................................................................................................. 105
5.6.2. Electrical Characteristics .................................................................................... 105
5.6.3. Application ......................................................................................................... 105
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Product Technical Specification and Customer Design Guideline
5.7. VCC_2V8 and VCC_1V8 Output ............................................................................... 107
5.7.1. Pin Description .................................................................................................. 107
5.7.2. Electrical Characteristics .................................................................................... 107
5.8. FLASH-LED (LED0) .................................................................................................. 108
5.8.1. Pin Description .................................................................................................. 108
5.8.2. Electrical Characteristics .................................................................................... 109
5.8.3. Application ......................................................................................................... 109
5.9. Analog to Digital Converter ....................................................................................... 110
5.9.1. Pin Description .................................................................................................. 110
5.9.2. Electrical Characteristics .................................................................................... 110
5.10. Digital to Analog Converter ....................................................................................... 111
5.10.1. Pin Description .................................................................................................. 111
5.10.2. Electrical Characteristics .................................................................................... 111
6. POWER CONSUMPTION ................................................................................ 112
6.1. Power Consumption without the Sierra Wireless Software Suite ................................ 112
6.2. Power Consumption with the Sierra Wireless Software Suite .................................... 113
7. CONSUMPTION MEASUREMENT PROCEDURE .......................................... 116
7.1. Hardware Configuration ............................................................................................ 116
7.1.1. Equipments Used .............................................................................................. 116
7.1.2. Q Series Development Kit Board v3 ................................................................... 117
7.1.3. SIM Cards ......................................................................................................... 117
7.2. Software Configuration ............................................................................................. 118
7.2.1. Embedded Module Configuration ....................................................................... 118
7.2.2. Equipment Configuration.................................................................................... 118
8. RELIABILITY COMPLIANCE AND RECOMMENDED STANDARDS ............. 120
8.1. Reliability Compliance............................................................................................... 120
8.2. Applicable Standards Listing ..................................................................................... 120
8.3. Environmental Specifications .................................................................................... 121
8.3.1. Function Status Classification ............................................................................ 121
8.4. Reliability Prediction Model ....................................................................................... 122
8.4.1. Life Stress Tests ................................................................................................ 122
8.4.2. Environmental Resistance Stress Tests ............................................................. 123
8.4.3. Corrosive Resistance Stress Tests..................................................................... 124
8.4.4. Thermal Resistance Cycle Stress Tests ............................................................. 125
8.4.5. Mechanical Resistance Stress Tests .................................................................. 126
8.4.6. Handling Resistance Stress Tests ...................................................................... 128
9. DESIGN GUIDELINES ..................................................................................... 129
General Rules and Constraints ................................................................................................ 129
9.1. Power Supply ........................................................................................................... 129
9.2. Antenna .................................................................................................................... 129
9.1. Layout/Pads Design .................................................................................................. 130
9.2. Routing Constraints .................................................................................................. 131
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Product Technical Specification and Customer Design Guideline
9.2.1. System Connector ............................................................................................. 131
9.2.2. Power Supply .................................................................................................... 131
9.2.2.1. Ground Plane and Shielding Connection .................................................................133
9.2.3. SIM Interface ..................................................................................................... 133
9.2.4. Audio Circuit ...................................................................................................... 133
9.2.5. RF Circuit .......................................................................................................... 133
9.2.5.1. UFL/SMA Connector...............................................................................................135
9.2.5.2. Coaxial Cable .........................................................................................................135
9.2.5.3. Precidip Connector .................................................................................................136
9.3. EMC and ESD Recommendations ............................................................................ 137
9.4. Mechanical Integration .............................................................................................. 137
9.5. Operating System Upgrade ....................................................................................... 138
10. EMBEDDED TESTABILITY ............................................................................. 139
10.1. Serial Link Access .................................................................................................... 139
10.2. RF Output Accessibility ............................................................................................. 140
11. CONNECTOR AND PERIPHERAL DEVICE REFERENCES .......................... 141
11.1. General Purpose Connector ..................................................................................... 141
11.2. SIM Card Reader ...................................................................................................... 141
11.3. Microphone............................................................................................................... 141
11.4. Speaker .................................................................................................................... 142
11.5. Antenna Cable .......................................................................................................... 142
11.6. RF board-to-board connector .................................................................................... 142
11.7. GSM antenna ........................................................................................................... 142
11.8. Buzzer ...................................................................................................................... 143
12. CERTIFICATION COMPLIANCE AND RECOMMENDED STANDARDS ....... 144
12.1. Certification Compliance ........................................................................................... 144
12.2. Applicable Standards Listing ..................................................................................... 144
13. REFERENCES ................................................................................................. 146
13.1. Web Site Support ..................................................................................................... 146
13.2. Reference Documents .............................................................................................. 146
13.2.1. Sierra Wireless Software Documentation ........................................................... 146
13.2.2. Firmware Documentation ................................................................................... 147
13.2.3. Hardware Documentation .................................................................................. 147
13.2.4. Other Sierra Wireless Documentation ................................................................ 147
13.2.5. Other Related Documentation ............................................................................ 148
13.2.6. Application Notes ............................................................................................... 148
13.3. List of Abbreviations ................................................................................................. 148
14. SAFETY RECOMMENDATIONS (FOR INFORMATION ONLY) ..................... 151
14.1. RF Safety ................................................................................................................. 151
14.1.1. General ............................................................................................................. 151
14.1.2. Exposure to RF Energy ...................................................................................... 151
14.1.3. Efficient Terminal Operation ............................................................................... 151
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Product Technical Specification and Customer Design Guideline
14.1.4. Antenna Care and Replacement ........................................................................ 151
14.2. General Safety.......................................................................................................... 152
14.2.1. Driving ............................................................................................................... 152
14.2.2. Electronic Devices ............................................................................................. 152
14.2.3. Vehicle Electronic Equipment ............................................................................. 152
14.2.4. Medical Electronic Equipment ............................................................................ 152
14.2.5. Aircraft ............................................................................................................... 152
14.2.6. Children ............................................................................................................. 153
14.2.7. Blasting Areas ................................................................................................... 153
14.2.8. Potentially Explosive Atmospheres..................................................................... 153
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 10

List of Figures

Figure 1. Functional Architecture ............................................................................................... 20
Figure 2. Power Supply During Burst Emission .......................................................................... 22
Figure 3. Power Supply Ripple Graph (TBC) .............................................................................. 23
Figure 4. Start-up Current Waveform ......................................................................................... 24
Figure 5. Q2687 Refreshed Embedded Module Mechanical Drawing ......................................... 25
Figure 6. Maximum Bulk Occupied on the Host Board ............................................................... 26
Figure 7. SPI Timing Diagram (Mode 0, Master, 4 wires) ........................................................... 40
Figure 8. SPI Timing Diagram with LOAD Signal (Mode 0, Master, 4 wires) ............................... 41
Figure 9. Example of a 3-wire SPI Bus Application..................................................................... 42
Figure 10. Example of a 4-wire SPI Bus Application..................................................................... 42
Figure 11. I2C Timing Diagram (master) ....................................................................................... 43
Figure 12. Example1 of an I2C Bus Application ............................................................................ 44
Figure 13. Example2 of an I2C Bus Application ............................................................................ 44
Figure 14. Asynchronous Access................................................................................................. 47
Figure 15. Synchronous Access .................................................................................................. 49
Figure 16. Read Synchronous Timing .......................................................................................... 49
Figure 17. Write Synchronous Timing .......................................................................................... 50
Figure 18. Example of a Parallel Bus Application (NAND Memory) .............................................. 51
Figure 19. Example of a Keyboard Implementation ...................................................................... 53
Figure 20. Example of an RS-232 Level Shifter Implementation for UART1 ................................. 55
Figure 21. Example of V24/CMOS Serial Link Implementation for UART1.................................... 56
Figure 22. Example of a Full Modem V24/CMOS Serial Link Implementation for UART1 .............. 56
Figure 23. Example of RS-232 Level Shifter Implementation for UART2 ...................................... 59
Figure 24. Example of a Typical SIM Socket Implementation ....................................................... 62
Figure 25. Example of a USB Implementation .............................................................................. 65
Figure 26. MIC1 Equivalent Circuits ............................................................................................. 69
Figure 27. Example of a MIC1 Differential Connection with LC Filter ............................................ 69
Figure 28. Example of a MIC1 Differential Connection without an LC Filter .................................. 70
Figure 29. Example of a MIC1 Single-Ended Connection with LC Filter ........................................ 71
Figure 30. Example of a MIC1 Single-Ended Connection without an LC Filter .............................. 71
Figure 31. MIC2 Equivalent Circuits ............................................................................................. 72
Figure 32. Example of a MIC2 Differential Connection with LC Filter ............................................ 73
Figure 33. Example of a MIC2 Differential Connection without an LC Filter .................................. 74
Figure 34. Example of a MIC2 Single-Ended Connection with LC Filter ........................................ 74
Figure 35. Example of a MIC2 Single-Ended Connection without an LC Filter .............................. 75
Figure 36. SPK1 Equivalent Circuits ............................................................................................ 76
Figure 37. SPK2 Equivalent Circuits ............................................................................................ 77
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Product Technical Specification and Customer Design Guideline
Figure 38. Example of an SPK Differential Connection................................................................. 78
Figure 39. Example of an SPK Single-Ended Connection ............................................................ 78
Figure 40. PCM Frame Waveform ............................................................................................... 81
Figure 41. PCM Sampling Waveform ........................................................................................... 81
Figure 42. Battery Charging Diagram........................................................................................... 83
Figure 43. Ni-Cd/Ni-Mh Charging Waveform ................................................................................ 84
Figure 44. Li-Ion Full Charging Waveform .................................................................................... 85
Figure 45. Phase 2 Pulse ............................................................................................................ 86
Figure 46. Phase 2 Rest .............................................................................................................. 87
Figure 47. Phase 3 Switch ........................................................................................................... 87
Figure 48. Example of an ADC Application .................................................................................. 89
Figure 49. Temperature Sensor Characteristics ........................................................................... 91
Figure 50. Power-ON Sequence (no PIN code activated) ............................................................. 93
Figure 51. Power-OFF Sequence ................................................................................................ 95
Figure 52. Example of ON/~OFF Pin Connection ......................................................................... 95
Figure 53. Reset Sequence Waveform ........................................................................................ 96
Figure 54. Example of ~Reset Pin Connection with Switch Configuration ..................................... 98
Figure 55. Example of ~Reset Pin Connection with Transistor Configuration ................................ 98
Figure 56. Example of BOOT Pin Implementation ........................................................................ 99
Figure 57. Real Time Clock Power Supply ................................................................................. 100
Figure 58. RTC Supplied by a Gold Capacitor ........................................................................... 101
Figure 59. RTC Supplied by a Non-Rechargeable Battery.......................................................... 101
Figure 60. RTC Supplied by a Rechargeable Battery ................................................................. 102
Figure 61. Example of a Buzzer Implementation ........................................................................ 104
Figure 62. Example of an LED Driven by the Buzzer Output ...................................................... 104
Figure 63. Example of INT0 Driven by an Open Collector .......................................................... 106
Figure 64. Example of INT1 Driven by an Open Collector .......................................................... 106
Figure 65. LED0 State During RESET and Initialization Time ..................................................... 109
Figure 66. Example of FLASH-LED Implementation................................................................... 109
Figure 67. Typical Hardware Configuration ................................................................................ 116
Figure 68. Layout Requirement ................................................................................................. 130
Figure 69. Precidip Connector Pad Design (Sierra Wireless Side).............................................. 131
Figure 70. Power Supply Routing Example ................................................................................ 132
Figure 71. Burst Simulation Circuit ............................................................................................. 132
Figure 72. AppCad Screenshot for MicroStrip Design ................................................................ 134
Figure 73. Routing Examples..................................................................................................... 134
Figure 74. UFL/SMA Connector ................................................................................................. 135
Figure 75. Antenna Connection to both RF pad and Ground pad ............................................... 136
Figure 76. Precidip Connector ................................................................................................... 136
Figure 77. Main Serial Link (UART1) Debug Access .................................................................. 139
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 12

List of Tables

Table 1: Q2687 Refreshed Embedded Module Features........................................................... 17
Table 2: List of RF Frequency Ranges...................................................................................... 20
Table 3: Input Power Supply Voltage ........................................................................................ 23
Table 4: Power Supply Pin-Out................................................................................................. 23
Table 5: Current Start-Up (TBC) ............................................................................................... 24
Table 6: Available Interfaces and Signals ................................................................................. 28
Table 7: General Purpose Connector Pin Description ............................................................... 29
Table 8: Signal Comparison between the Q Series Intelligent Embedded Modules ................... 34
Table 9: Electrical Characteristic of a 2.8 Volt Type (2V8) Digital I/O ......................................... 35
Table 10: Electrical Characteristic of a 1.8 Volt Type (1V8) Digital I/O ......................................... 35
Table 11: Open Drain Output Type ............................................................................................. 35
Table 12: Reset State Definition ................................................................................................. 36
Table 13: GPIO Pin Description .................................................................................................. 37
Table 14: SPI Bus Configuration................................................................................................. 39
Table 15: SPI Bus AC Characteristics ........................................................................................ 40
Table 16: SPI1 Pin Description ................................................................................................... 41
Table 17: SPI2 Pin Description ................................................................................................... 41
Table 18: I2C AC Characteristics ................................................................................................ 43
Table 19: I2C Pin Description ...................................................................................................... 44
Table 20: Parallel Interface Pin Description ................................................................................ 45
Table 21: AC Characteristics of Asynchronous Accesses ........................................................... 47
Table 22: AC Characteristics of Synchronous Accesses ............................................................. 50
Table 23: Address Bus Size Details ............................................................................................ 51
Table 24: Keyboard Interface Pin Description ............................................................................. 52
Table 25: UART1 Pin Description ............................................................................................... 54
Table 26: UART2 Pin Description ............................................................................................... 58
Table 27: SIM Pin Description .................................................................................................... 61
Table 28: Electrical Characteristics of the SIM Interface ............................................................. 61
Table 29: SIM Socket Pin Description ......................................................................................... 62
Table 30: USB Pin Description ................................................................................................... 64
Table 31: Electrical Characteristics of the USB Interface ............................................................ 64
Table 32: Antenna Specifications ............................................................................................... 67
Table 33: Analog Audio Pin Description ...................................................................................... 68
Table 34: Electrical Characteristics of MIC1 ................................................................................ 69
Table 35: Recommended Components for a MIC1 Differential Connection ................................. 70
Table 36: Recommended Components for a MIC1 Single-Ended Connection ............................. 72
Table 37: Electrical Characteristics of MIC2 ................................................................................ 72
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Product Technical Specification and Customer Design Guideline
Table 38: Recommended Components for a MIC2 Differential Connection ................................. 74
Table 39: Recommended Components for a MIC2 Single-Ended Connection ............................. 75
Table 40: Speaker Information ................................................................................................... 76
Table 41: Electrical Characteristics of SPK1 ............................................................................... 76
Table 42: Electrical Characteristics of SPK2 ............................................................................... 77
Table 43: AC Characteristics of the Digital Audio Interface ......................................................... 82
Table 44: PCM Interface Pin Description .................................................................................... 82
Table 45: Electrical Characteristics of Ni-Cd/Ni-Mh Battery Timing Charge ................................. 85
Table 46: Electrical Characteristics of Li-Ion Battery Timing Charge............................................ 86
Table 47: Battery Charging Interface Pin Description .................................................................. 88
Table 48: Electrical Characteristics of the Temperature Monitoring Feature ................................ 88
Table 49: Charger Recommendations ........................................................................................ 90
Table 50: ON/~OFF Signal Pin Description ................................................................................. 92
Table 51: Electrical Characteristics of the ON/~OFF Signal ........................................................ 92
Table 52: T
on/off-hold
Minimum Values ........................................................................................... 94
Table 53: Reset Signal Pin Description ....................................................................................... 97
Table 54: Electrical Characteristics of the Reset Signal .............................................................. 97
Table 55: Reset Settings ............................................................................................................ 98
Table 56: BOOT Settings ........................................................................................................... 99
Table 57: Boot Signal Pin Description ......................................................................................... 99
Table 58: BAT-RTC Pin Description ......................................................................................... 100
Table 59: Electrical Characteristics of the BAT-RTC Interface................................................... 101
Table 60: PWM/Buzzer Output Pin Description ......................................................................... 103
Table 61: Electrical Characteristics of the Buzzer Output .......................................................... 103
Table 62: External Interrupt Pin Description .............................................................................. 105
Table 63: Electrical Characteristics of the External Input/Interrupt ............................................. 105
Table 64: VCC_2V8 and VCC_1V8 Pin Description .................................................................. 107
Table 65: Electrical Characteristics of the VCC_2V8 and VCC_1V8 Signals ............................. 107
Table 66: FLASH-LED Status ................................................................................................... 108
Table 67: FLASH-LED Pin Description ..................................................................................... 108
Table 68: Electrical Characteristics of the FLASH-LED Signal .................................................. 109
Table 69: ADC Pin Description ................................................................................................. 110
Table 70: Electrical Characteristics of the ADC ......................................................................... 110
Table 71: DAC Pin Description ................................................................................................. 111
Table 72: Electrical Characteristics of the DAC ......................................................................... 111
Table 73: Power Consumption Without the Sierra Wireless Software Suite; Typical Values ...... 112
Table 74: Power Consumption With the Application CPU @ 26MHz, Typical Values................. 113
Table 75: Power Consumption With the Application CPU @ 104MHz, Typical Values ............... 114
Table 76: Recommended Equipments ...................................................................................... 117
Table 77: Operating Mode Configuration .................................................................................. 118
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Product Technical Specification and Customer Design Guideline
Table 78: Standards Conformity for the Q2687 Refreshed Embedded Module .......................... 120
Table 79: Applicable Standards and Requirements................................................................... 120
Table 80: Operating Class Temperature Range ........................................................................ 121
Table 81: ISO Failure Mode Severity Classification................................................................... 122
Table 82: Life Stress Tests ....................................................................................................... 122
Table 83: Environmental Resistance Stress Tests .................................................................... 123
Table 84: Corrosive Resistance Stress Tests ........................................................................... 124
Table 85: Thermal Resistance Cycle Stress Tests .................................................................... 125
Table 86: Mechanical Resistance Stress Tests ......................................................................... 126
Table 87: Handling Resistance Stress Tests ............................................................................. 128
Table 88: Contact Information of GSM Antenna Providers ........................................................ 143
Table 89: Standards Conformity for the Q2687 Refreshed Embedded Module .......................... 144
Table 90: Applicable Standards and Requirements for the Q2687 Refreshed Embedded Module ...
................................................................................................................................. 144
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1. Introduction

The Q2687 Refreshed Intelligent Embedded Module is a self-contained E-GSM/DCS/GSM850/PCS GPRS/EGPRS 900/1800/850/1900 quad-band embedded module. It supports the Sierra Wireless Software Suite, the world’s most comprehensive cellular development environment which allows embedded standard ANSI C applications to be natively executed directly on the embedded module. For more information about Sierra Wireless Software Suite, refer to the documents listed in section
13.2 Reference Documents.
Note that this document only covers the Q2687 Refreshed Intelligent Embedded Module and does not cover the programmable capabilities available through the Sierra Wireless Software Suite.

1.1. Physical Dimensions

Length: 40 mm
Width: 32.2 mm
Thickness: 4 mm
Weight: 8g
Note: The physical dimensions mentioned above do not include the shielding pins.

1.2. General Features

The following table lists the Q2687 Refreshed embedded module features.
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Product Technical Specification and Customer Design Guideline
Introduction
Table 1: Q2687 Refreshed Embedded Module Features
Featur e
Descri ption
Shieldin g
The Q2687 Refreshed embedded module has complete body shielding.
Intelligent Embedded Modul e Control
Full set of AT commands for GSM/GPRS/EGPRS including GSM 07.07 and
07.05 AT command sets
Status indication for GSM
GSM/DCS Output Power
Class 4 (2 W) for GSM 850 and E-GSM
Class 1 (1 W) for DCS and PCS
GPRS
GPRS multislot class 10
Multislot class 2 supported
PBCCH support
Coding schemes: CS1 to CS4
EGPRS
EGPRS multislot class 10
Multislot class 2 supported
PBCCH support
Coding schemes MCS5 to MCS9
Voice
GSM Voice Features with Emergency calls 118 XXX
Full Rate (FR)/ Enhanced Full Rate (EFR) / Half Rate (HR) / Adaptive Multi
Rate (AMR)
Echo cancellation and noise reduction
Full duplex Hands free
SMS
SMS MT, MO
SMS CB
SMS storage into SIM card
GSM Supplementar y Services
Call Forwarding, Call Barring
Multiparty
Call Waiting, Call Hold
USSD
Data/Fax
Data circuit asynchronous, transparent, and non-transparent up to 14400
bits/s
Fax Group 3 compatible
SIM Interface
1.8V/3V SIM interface
5V SIM interfaces are available with external adaptation
SIM Tool Kit Release 99
Real Tim e Cl ock
Real Time Clock (RTC) with calendar and alarm
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Product Technical Specification and Customer Design Guideline
Introduction

1.3. GSM/GPRS/EGPRS Features

2-Watt EGSM – GPRS 900/850 radio section running under 3.6 volts
1-Watt GSM-GPRS1800/1900 radio section running under 3.6 volts
0.5-Watt EGPRS 900/850 radio section running under 3.6 volts
0.4-Watt EGPRS 1800/1900 radio section running under 3.6 volts
Hardware GSM/GPRS class 10 and EGPRS class 10 capable

1.4. Interfaces

Digital section running under 2.8V and 1.8V
3V/1V8 SIM interface
Complete Interfacing:
Power supply  Serial link  Analog audio  PCM digital audio  SIM card  Keyboard  USB 2.0 slave  Serial LCD (not available with AT commands)  Parallel port for specific applications (under Open AT® control only)

1.5. Operating System

Real Time Clock (RTC) with calendar
Battery charger
Echo cancellation + noise reduction (quadri codec)
Full GSM or GSM/GPRS/EGPRS Operating System stack
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Product Technical Specification and Customer Design Guideline
Introduction

1.6. Connection Interfaces

The Q2687 Refreshed embedded module is compliant with RoHS Directive 2002/95/EC which sets limits for the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.
This electronic product is subject to the EU Directive 2002/96/EC for Waste Electrical and Electronic Equipment (WEEE). As such, this product must not be disposed off at a municipal waste collection point. Please refer to local regulations for directions on how to dispose of this product in an environmental friendly manner.
The Q2687 Refreshed Intelligent Embedded Module has four external connections:
Three for RF circuit:
UFL connector  Soldered connection  Precidip connection
One for baseband signals:
100-pin I/O connector (compatible with Q2686 and Q2687 embedded modules)

1.7. Environment and Mechanics

1.7.1. RoHS Directive Compliant

1.7.2. Disposing of the Product

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2. Functional Specifications

RF Bandwidth
Transmit Band ( Tx)
Receive Band (Rx)
GSM 850
824 to 849 MHz
869 to 894 MHz
E-GSM 900
880 to 915 MHz
925 to 960 MHz
DCS 1800
1710 to 1785 MHz
1805 to 1880 MHz

2.1. Functional Architecture

The global architecture of the Q2687 Refreshed Embedded Module is described in the figure below.
Figure 1. Functional Architecture

2.1.1. RF Functionalities

The Radio Frequency (RF) functionalities of the Q2687 Refreshed embedded module complies with the Phase II EGSM 900/DCS 1800 and GSM 850/PCS 1900 recommendations. The frequency range for the transmit band and receive band are given in the table below.
Table 2: List of RF Frequency Ranges
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Product Technical Specification and Customer Design Guideline
Functional Specifications
RF Bandwidth
Transmit Band ( Tx)
Receive Band (Rx)
PCS 1900
1850 to 1910 MHz
1930 to 1990 MHz
The Radio Frequency (RF) component is based on a specific quad-band chip that includes the following:
Quad-band LNAs (Low Noise Amplifier)
Digital Low-IF Receiver
Offset PLL/PL (Phase Locked Loop and Polar Loop) transmitter
Frequency synthesizer
Digitally controlled crystal oscillator (DCXO)
Tx/Rx FEM (Front-End module) for quad-band GSM/GPRS/EGPRS

2.1.2. Baseband Functionalities

The digital part of the Q2687 Refreshed embedded module is composed of a PCF5213 PHILIPS chip. This chipset uses a 0.18µm mixed technology CMOS, which allows massive integration as well
as low current consumption.

2.2. Operating System

The Q2687 Refreshed Embedded Module is Sierra Wireless Software Suite compliant. With the Sierra Wireless Software Suite, customers can embed their own applications with the Q2687 Refreshed embedded module and turn the Q2687 Refreshed embedded module into a solution for their specific market need.
The operating system allows for the Q2687 Refreshed Embedded Module to be controlled by AT commands. However, some interfaces in the Q2687 Refreshed embedded module may still not be available even with AT command control as these interfaces are dependent on the peripheral devices connected to the Q2687 Refreshed embedded module.
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3. Technical Specifications

3.1. Power Supply

The power supply is one of the key issues in the design of a GSM terminal. Due to the burst emission in GSM/GPRS, the power supply must be able to deliver high current peaks in a short time. During these peaks, the ripple (U Input Power Supply Voltage).
Listed below are the corresponding radio burst rates in connected mode:
GSM/GPRS class 2 terminals emit 577µs radio bursts every 4.615ms (see Figure 2 Power
Supply During Burst Emission)
GPRS class 10 terminals emit 1154µs radio bursts every 4.615ms
In connected mode, the RF Power Amplifier current (2.0A peak in GSM /GPRS mode) flows with a ratio of:
1/8 of the time (around 577µs every 4.615ms for GSM /GPRS cl 2 2RX/1TX)
) on the supply voltage must not exceed a certain limit (refer to Table 3:
ripp
and
2/8 of the time (around 1154µs every 4.615ms for GSM /GPRS cl 10 3RX/2TX)
with the rising time at around 10µs.
Figure 2. Power Supply During Burst Emission
Only VBATT (external power supply source) input is necessary to supply the Q2687 Refreshed embedded module. VBATT also provides for the following functions:
Directly supplies the RF components with 3.6V. (Note that it is essential to keep a minimum
voltage ripple at this connection in order to avoid any phase error or spectrum modulation degradation. On the other hand, insufficient power supply could dramatically affect some RF performances such as TX power, modulation spectrum, EMC performance, spurious emission and frequency error.)
Internally used to provide through several regulators, the power supplies VCC_2V8 and
VCC_1V8, which are needed for the baseband signals.
The Q2687 Refreshed embedded module shielding case is the grounding. The ground must be connected on the motherboard through a complete layer on the PCB.
The following table describes the electrical characteristics of the input power supply voltage that will guarantee nominal functioning of the Q2687 Refreshed embedded module.
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Product Technical Specification and Customer Design Guideline
Technical Specifications
Table 3: Input Power Supply Voltage
V
MI N
V
NO M
V
MA X
Ripple M ax (U
ri pp
)
I
pe ak
M ax
VBATT
3.2V
1,2
3.6V
4.8V
250mVpp (freq < 10kHz) 40mVpp (10kHz < freq <
100kHz) 5mVpp (freq > 100kHz)
(TBC)
2.0A
Signal
Pin Number
VBATT
1, 2, 3, 4
GND
Shielding
1: This value must be guaranteed during the burst (with 2.0A Peak in GSM, GPRS or EGPRS mode)
2: Maximum operating Voltage Standing Wave Ratio (VSW R) 2:1.
Figure 3. Power Supply Ripple Graph (TBC)
When the Q2687 Refreshed embedded module is supplied with a battery, the total impedance (battery + protections + PCB) should be less than 150 m.
Caution: When the Q2687 Refreshed embedded module is in Alarm mode or Off mode, no voltage has to be
applied on any pin of the 100-pin connector except on VBATT (pins 1 to 4), BAT-RTC (pin 7) for RTC operation or ON/~OFF (pin 19) to power-ON the Q2687 Refreshed embedded module.

3.1.1. Power Supply Pin-Out

Table 4: Power Supply Pin-Out
The grounding connection is made through the shielding; therefore the four leads must be soldered to the ground plane.
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Product Technical Specification and Customer Design Guideline
Technical Specifications

3.1.2. Start-Up Current

Current Pe ak at Am bien t Temper ature (25°C)
VBATTmin (3. 2V)
VBATTtyp (3. 6V)
VBATTmax ( 4. 8V)
I
Startup
86 mA
77 mA
64 mA
During the initial second following Power ON, a peak of current appears. This peak of current is called
“I
current” and has a duration of about 161ms (typical) (TBC).
Startup
Figure 4: Start-up Current Waveform shows the current waveform and identifies the peak considered as the start-up current.
<TBC>
Figure 4. Start-up Current Waveform
In this condition, we can consider the following results:
Table 5: Current Start-Up (TBC)

3.1.3. Decoupling of Power Supply Signals

Decoupling capacitors on VBATT lines are embedded in the Q2687 Refreshed embedded module, so it should not be necessary to add decoupling capacitors close to the embedded module.
However, in case of EMI/RFI problems, the VBATT signal may require some EMI/RFI decoupling – parallel 33pF capacitors close to the embedded module or a serial ferrite bead (or both to get better results). Low frequency decoupling capacitors (22µF to 100µF) can be used to reduce TDMA noise (217Hz).
Caution: When ferrite beads are used, the recommendation given for the power supply connection must be
carefully followed (high current capacity and low impedance).

3.2. Mechanical Specifications

The Q2687 Refreshed Embedded Module has a complete self-contained shield and the mechanical specifications are shown in the figure below, which also specifies the following:
The area needed for the Q2687 Refreshed embedded module to fit in an application
The drill template for the four pads to be soldered on the application board
The dimensions and tolerance for correctly placing the 100-pin female connector on the
application board
It is strongly recommended to plan a free area (no components) around the Q2687 Refreshed embedded module in order to facilitate the removal/re-assembly of the embedded module on the application board.
Also take note that when transmitting, the Q2687 Refreshed Embedded Module produces heat (due to the internal Power Amplifier). This heat will generate a temperature increase and may warm the application board on which the Q2687 Refreshed embedded module is soldered. This is especially true for GPRS Class 10 use in low band. The Q2687 Refreshed Embedded Module’s built-in temperature sensor can be used to monitor the temperature inside the module. For more information, refer to document [14] AirPrime Q2687 Product Technical Specification.
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Product Technical Specification and Customer Design Guideline
Technical Specifications
Figure 5. Q2687 Refreshed Embedded Module Mechanical Drawing
WA_DEV_Q26RD_PTS_001 Rev 002 April 20, 2010 25
Product Technical Specification and Customer Design Guideline
Technical Specifications
Figure 6. Maximum Bulk Occupied on the Host Board
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Product Technical Specification and Customer Design Guideline
Technical Specifications

3.3. Firmware Upgrade

The firmware upgrade process consists of downloading GSM/GPRS/EGPRS software into the corresponding internal flash memories of the Q2687 Refreshed Intelligent Embedded Module.
Downloading is done through the GSM Main Serial link port (UART1) connected to a PC using the XMODEM protocol.
A specific AT command, AT+WDWL, is used to start the download. For more information, refer to document [8] Firmware 7.43 AT Commands Manual (Sierra Wireless Software Suite 2.33).
Access to the following UART1 main serial link signals are required to carry out downloading:
CT103-TXD1
CT104-RXD1
~CT106-CTS1
~CT105-RTS1
GND
Consequently, it is very important to plan and define easy access to these signals during the hardware design of the application board. For more information about these signals, refer to section
4.7 Main Serial Link (UART1).
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4. Interfaces

Name
Driven by AT commands
Driven by Open AT®
Serial Interface
 Parallel Interface
Keyboard Interface
Main Serial Link
Auxiliary Serial Link
  SIM Interface
General Purpose IO
Analog to Digital Converter
Analog Audio Interface
PWM / Buzzer Output
Battery Charging Interface
  External Interruption
BAT-RTC (Backup Battery)
LED0 signal
  Digital Audio Interface (PCM)
USB 2.0 Interface
Caution: Some of the Embedded Module interface signals are multiplexed in order to limit the number of pins
but this architecture includes some restrictions.

4.1. General Purpose Connector (GPC)

A 100-pin connector is provided to interface the Q2687 Refreshed Intelligent Embedded Module with a board containing either a serial or parallel LCD module; a keyboard, a SIM connector or a battery connection.
The following table lists the interfaces and signals available on the GPC and specifies whether these interfaces and signals are driven by AT Command, Open AT® or both.
Table 6: Available Interfaces and Signals
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Product Technical Specification and Customer Design Guideline
Interfaces

4.1.1. Pin Description

Pin #
Signal Nam e
I/O Type
Volt age
I/O*
Reset Stat e
Descri ption
Dealing wi th Unused Pins Nominal
Mux
1
ADC0/VBATT
VBATT
I Power Supply
2 ADC0/VBATT
VBATT
I Power Supply
3 ADC0/VBATT
VBATT
I Power Supply
4 ADC0/VBATT
VBATT
I Power Supply
5 VCC_1V8
VCC_1V8
O 1.8V Supply Output
NC 6 CHG-IN
CHG-IN
I Charger input
NC
7
BAT-RTC
BAT-RTC
I/O RTC Battery connection
NC
8
CHG-IN
CHG-IN
I Charger input
NC
9
SIM-VCC
1V8 or 3V
O SIM Power Supply
10
VCC_2V8
VCC_2V8
O 2.8V Supply Output
NC
11
SIM-IO
1V8 or 3V
I/O
Pull-up (about 10kΩ)
SIM Data 12
SIMPRES
GPIO18
VCC_1V8
I Z SIM Detection
NC
13
~SIM-RST
1V8 or 3V
O 0 SIM reset Output
14
SIM-CLK
1V8 or 3V
O 0 SIM Clock
15
BUZZER0
Open Drain
O Z Buzzer Output
NC
16
BOOT
VCC_1V8
I Not Used
Add a test point / a jumper/ a switch to VCC_1V8 (Pin 5) in case Download Specific mode is used (See product specification for details)
Refer to the following table for the pin description of the general purpose connector.
Table 7: General Purpose Connector Pin Description
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Product Technical Specification and Customer Design Guideline
Interfaces
Pin #
Signal Nam e
I/O Type
Volt age
I/O*
Reset Stat e
Descri ption
Dealing wi th Unused Pins Nominal
Mux
17
LED0
Open Drain
O
1 and Undefined
LED0 Output
NC 18
~RESET
VCC_1V8
I/O RESET Input
NC or add a test point
19
ON/~OFF
VBATT
I ON / ~OFF Control
20
ADC1/BAT­TEMP
Analog
I Analog temperature
Pull to GND 21
ADC2
Analog
I Analog to Digital Input
Pull to GND
22
GPIO31/ SPI1 Load
VCC_2V8
I/O Z
NC 23
SPI1-CLK
GPIO28
VCC_2V8
O Z SPI1 Clock
NC
24
SPI1-I
GPIO30
VCC_2V8
I Z SPI1 Data Input
NC
25
SPI1-IO
GPIO29
VCC_2V8
I/O Z SPI1 Data Input / Output
NC
26
SPI2-CLK
GPIO32
VCC_2V8
O Z SPI2 Clock
NC
27
SPI2-IO
GPIO33
VCC_2V8
I/O Z SPI2 Data Input / Output
NC
28
GPIO35/SPI2­Load
VCC_2V8
I/0 Z
NC 29
SPI2-I
GPIO34
VCC_2V8
I Z SPI2 Data Input
NC
30
CT104-RXD2
GPIO15
VCC_1V8
O Z Auxiliary RS232 Receive
Add a test point for debugging
31
CT103-TXD2
GPIO14
VCC_1V8
I Z Auxiliary RS232 Transmit
(TXD2) Pull-up to VCC_1V8 with 100kΩ and add a test point for debugging
32
~CT106-CTS2
GPIO16
VCC_1V8
O Z Auxiliary RS232 Clear To Send
(CTS2) Add a test point for debugging
33
~CT105-RTS2
GPIO17
VCC_1V8
I Z Auxiliary RS232 Request To Send
(RTS2) Pull-up to VCC_1V8 with 100kΩ and add a test point for debugging
34
MIC2N
Analog
I Micro 2 Input Negative
NC
35
SPK1P
Analog
O Speaker 1 Output Positive
NC
36
MIC2P
Analog
I Micro 2 Input Positive
NC
37
SPK1N
Analog
O Speaker 1 Output Negative
NC
38
MIC1N
Analog
I Micro 1 Input Negative
NC
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