Sierra Wireless Q2426-SK UserMan rev
WISMO Quik Q2400 series
Q2406 and Q2426
Product Specification
Reference:
Revision:
Date:
WM_PRJ_Q2400_PTS_002
004
March 5, 2004
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WM_PRJ_Q2400_PTS_002 - 004
March 5, 2004
Document Information
Revision Date History of the evolution
001 24 Oct 02 Creation (Preliminary version)
002 24 Jan. 03 Remove “Preliminary” status.
Modification in applicable products list:
• Add Q2406D and Q2426D products and Q2406E
and Q2426E products
• Remove Q2406C and Q2426C products
Update sensitivity value for GSM850 and EGSM900 RF
bands.
Update mechanical drawing.
003 14 Apr 03 Extract of Design guidelines information
004 March 5, 2004 FCC wording for starter kit approval and not modular approval Gulmit Sobti
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WM_PRJ_Q2400_PTS_002 - 004
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Contents
Document Information...................................................................................................................................................................... 2
Contents.............................................................................................................................................................................................. 3
Caution 6
Trademarks...........................................................................................................................................................................................6
Overview 7
Reference documents....................................................................................................................................................................... 8
1 General description................................................................................................................................................................ 9
1.1 General information.................................................................................................................. 9
1.2 Functional description ............................................................................................................10
1.2.1 RF functionalities.......................................................................................................... 11
1.2.2 Baseband functionalities ..............................................................................................11
1.3 Firmware................................................................................................................................. 12
2 Interfaces ..............................................................................................................................................................................13
2.1 General Purpose Connector (GPC) .......................................................................................13
2.2 Power supply.......................................................................................................................... 14
2.2.1 General description ......................................................................................................14
2.2.2 Power consumption...................................................................................................... 15
2.3 Electrical information for digital I/O......................................................................................... 17
2.4 LCD interface.......................................................................................................................... 18
2.4.1 SPI bus 18
2.4.2 Two-wire interface ........................................................................................................ 18
2.5 SPI Auxiliary bus .................................................................................................................... 18
2.6 Keyboard interface ................................................................................................................. 19
2.7 Main serial link (UART1) ........................................................................................................20
2.8 Auxiliary serial link (UART2)...................................................................................................20
2.9 SIM interface ..........................................................................................................................21
2.9.1 General Description...................................................................................................... 21
2.9.2 SIM 3/5V management................................................................................................. 22
2.10 General Purpose Input/Output ...............................................................................................23
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WM_PRJ_Q2400_PTS_002 - 004
March 5, 2004
Activity status indication .........................................................................................................23
2.11
2.12 Analog to Digital Converter (ADC) .........................................................................................24
2.13 Audio interface 25
2.13.1 Microphone inputs ........................................................................................................ 25
2.13.1.1 Common microphone inputs characteristics ........................................................ 25
2.13.1.2 Main Microphone Inputs (MIC2) ........................................................................... 27
2.13.1.3 Auxiliary Microphone Inputs (MIC1) .....................................................................27
2.13.2 Speaker outputs ........................................................................................................... 28
2.13.2.1 Common speaker outputs characteristics ............................................................28
2.13.2.2 Speaker 2 Outputs................................................................................................ 29
2.13.2.3 Speaker 1 Outputs................................................................................................ 29
2.13.3 Buzzer Output .............................................................................................................. 29
2.14 Battery charging interface ......................................................................................................30
2.14.1 Hardware description ................................................................................................... 30
2.14.2 Li-ion charging procedure............................................................................................. 31
2.15 ON / ~OFF ......................................................................................................................32
2.15.1 General description ......................................................................................................32
2.15.2 Operating sequences ...................................................................................................33
2.15.2.1 Power ON .............................................................................................................33
2.15.2.2 Power OFF ........................................................................................................... 34
2.16 BOOT (optional) ..................................................................................................................... 34
2.17 Reset signal (~RST) ...............................................................................................................35
2.17.1 General description ......................................................................................................35
2.17.2 Reset sequence ........................................................................................................... 36
2.18 External Interrupt (~INTR) ......................................................................................................36
2.19 VCC output ......................................................................................................................37
2.20 Real Time Clock Supply (VCC_RTC)..................................................................................... 37
2.21 RF interface ...................................................................................................................... 37
2.21.1 RF connections ............................................................................................................ 38
2.21.1.1 General ................................................................................................................. 38
2.21.1.2 Antenna directly connected to the module: matching circuit ................................38
2.21.2 RF performances.......................................................................................................... 40
2.21.3 Antenna specifications ................................................................................................. 40
3 Technical specifications ...................................................................................................................................................42
3.1 General Purpose Connector pin out description .................................................................... 42
3.2 Environmental Specifications ................................................................................................. 46
3.3 Mechanical specifications.......................................................................................................47
3.3.1 Physical characteristics ................................................................................................ 47
3.3.2 Mechanical drawings.................................................................................................... 47
4 Appendix..................................................................................................................................................................................49
4.1 Wavecom acceptance test ..................................................................................................... 49
4.2 GSM Standard and Recommendations .................................................................................49
4.3 Safety recommendations (for information only) .....................................................................52
4.3.1 RF safety ...................................................................................................................... 52
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4.3.1.1
General ................................................................................................................. 52
4.3.1.2 Exposure to RF energy......................................................................................... 52
4.3.1.3 Efficient terminal operation ................................................................................... 52
4.3.1.4 Antenna care and replacement ............................................................................ 52
4.3.2 General safety .............................................................................................................. 53
4.3.2.1 Driving................................................................................................................... 53
4.3.2.2 Electronic devices................................................................................................. 53
4.3.2.3 Vehicle electronic equipment................................................................................ 53
4.3.2.4 Medical electronic equipment ............................................................................... 53
4.3.2.5 Aircraft .................................................................................................................. 54
4.3.2.6 Children ................................................................................................................ 54
4.3.2.7 Blasting areas ....................................................................................................... 54
4.3.2.8 Potentially explosive atmospheres .......................................................................54
4.4 General Purpose Connector data sheet................................................................................. 57
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WM_PRJ_Q2400_PTS_002 - 004
March 5, 2004
Caution
Information furnished herein by Wavecom are accurate and reliable. However no responsibility is
assumed for its use. Please read carefully the safety precautions for a terminal based on WISMO
Quik Q2400 Series.
General information about Wavecom and its range of products is available at the following internet
address: http://www.wavecom.com
Trademarks
Some mentioned products are registered trademarks of their respective companies.
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WM_PRJ_Q2400_PTS_002 - 004
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Overview
This document defines and specifies the WISMO QUIK Q24x6 Series, available under two
GSM/GPRS Class 10 dual-band versions:
• Q2406A: E-GSM/GPRS 900/1800 MHz version with 16 Mbits of Flash memory and 2 Mbits
of SRAM (16/2).
• Q2406B: E-GSM/GPRS 900/1800 MHz version with 32 Mbits of Flash memory and 4 Mbits
of SRAM (32/4).
• Q2406D: E-GSM/GPRS 900/1800 MHz version with 64 Mbits of Flash memory and 8 Mbits
of SRAM (64/8). This configuration will be available for handset application and vertical
application where UART2 is not used.
• Q2406E: E-GSM/GPRS 900/1800 MHz version with 64 Mbits of Flash memory and 4 Mbits
of SRAM (64/4). This configuration will be available for handset application and vertical
application where UART2 is not used.
• Q2426A: GSM/GPRS 850/1900 MHz version with 16 Mbits of Flash memory and 2 Mbits of
SRAM (16/2).
• Q2426B: GSM/GPRS 850/1900 MHz version with 32 Mbits of Flash memory and 4 Mbits of
SRAM (32/4).
• Q2426D: GSM/GPRS 850/1900 MHz version with 64 Mbits of Flash memory and 8 Mbits of
SRAM (64/8). This configuration will be available for handset application and vertical
application where UART2 is not used.
• Q2426E: GSM/GPRS 850/1900 MHz version with 64 Mbits of Flash memory and 4 Mbits of
SRAM (64/4). This configuration will be available for handset application and vertical
application where UART2 is not used.
Note: the WISMO Q24x6 module is an evolution of the Q2403 module with which it is fully hardware
and software compatible (except for power consumption).
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WM_PRJ_Q2400_PTS_002 - 004
Reference documents
[1] WISMO Quik Q2400 Series Customer Design Guidelines
WM_PRJ_Q2400_PTS_005
[2] WISMO Quik Q2400 Series Manufacturing Guide
WM_PRJ_Q2400_PTS_006
[3] AT Commands Interface Guide
WM_ASW_OAT_UGD_004
[4] Wavecom Acceptance and Verification Plan
WAVE Plan, Release 1.4
[5] Q2406 or Q2426 delta with the Q2403
WM_PRJ_Q2400_PTS_004
March 5, 2004
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1 General description
1.1 General information
WISMO Quik Q24x6 sub-series is a range of self-contained E-GSM/GSM-GPRS 900/1800 or
850/1900 dual-band modules including the following features:
• 58.4 x 32.2 x 3.9 mm.
• 2 Watts E-GSM 900/GSM 850 radio section running under 3.6 Volts.
• 1 Watt GSM1800/1900 radio section running under 3.6 Volts.
• Digital section running under 2.8 Volts.
• 3V only SIM interface (for 5 V SIM interface with external adaptation, refer to document [1]).
• Real Time Clock with calendar.
• Battery charge management.
• Echo Cancellation + noise reduction.
• Full GSM or GSM/GPRS software stack.
• Hardware GPRS class 10 capable.
• Complete shielding.
• Complete interfacing through a 60-pin connector:
o Power supply,
o Serial link,
o Audio,
o SIM card interface,
o Keyboard,
o LCD (not available with AT commands).
WISMO Quik Q24x6 sub-series has two external connections:
• RF connection pads (to the antenna),
• 60-pin General Purpose Connector (GPC) to Digital, Keyboard, Audio and Supply.
WISMO Quik Q24x6 sub-series is designed to fit in very small terminals and only some custom
functions have to be added to make a complete dual-band solution:
• Keypad and LCD module,
• Earpiece and Microphone,
• Base connector,
• Battery,
• Antenna,
• SIM connector.
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1.2 Functional description
WM_PRJ_Q2400_PTS_002 - 004
March 5, 2004
G
E
N
E
R
A
L
P
U
R
P
O
S
E
C
O
N
N
E
C
T
O
R
Pow er Supply
Battery
M anagement
SIM Supply
FLA SH
SRAM
RF Interface
I/O Con t roller
A/D Converter
SIM Controller
CPU
Memory
M anagement
Unit
R.T.C
RF
F
U
N
C
T
I
O
N
S
RF
C
O
N
N
E
C
T
I
O
N
Audio Interface
Figure 1: Functional architecture
GPSI or SPI
Controller
Vocoder
Keyb oard
Controller
UART 1 & 2
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March 5, 2004
1.2.1 RF functionalities
The Radio Frequency (RF) functionalities comply with the Phase II E-GSM 900/DCS 1800 and GSM
850/PCS 1900 recommendation.
The frequencies are:
Q2406
• Rx (E-GSM 900): 925 to 960 MHz.
• Rx (DCS 1800): 1805 to 1880 MHz.
• Tx (E-GSM 900): 880 to 915 MHz.
• Tx (DCS 1800): 1710 to 1785 MHz.
Q2426
• Rx (GSM 850): 869 to 894 MHz.
• Rx (PCS 1900): 1930 to 1990 MHz.
• Tx (GSM 850): 824 to 849 MHz.
• Tx (PCS 1900): 1850 to 1910 MHz.
The Radio Frequency (RF) part is based on a specific dual band chip including :
• Low-IF Receiver,
• Dual RF (Radio Frequency) synthesizer,
• Digital IF to Baseband Converter,
• Offset PLL (Phase Lock Loop) transmitter,
• 1 (logarithmic) Power Amplifier (PA) controller,
• Dual band Power Amplifier (PA) module.
1.2.2 Baseband functionalities
The digital part of the WISMO Quik Q24x6 sub-series is based on a PHILIPS-VLSI chip (ONE C
GSM/GPRS Kernel).
This chipset is using a 0.25 µm mixed technology CMOS, which allows massive integration as well
as low current consumption.
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March 5, 2004
1.3 Firmware
WISMO Quik Q24x6 sub-series is designed to be integrated into various types of applications such
as handsets or vertical applications (telemetry, multimedia,…).
For vertical applications, the firmware offers a set of AT commands to control the module (for further
information, refer to document [3]).
Please be aware that some of these interfaces can not be handled when using the WISMO
Quik Q24x6 sub-series driven by AT commands: LCD interface, auxiliary serial link interface
and SPI bus.
AAA TTT
This symbol is used to indicate the interfaces not available with AT commands.
These functions have then to be managed externally i.e using the main processor of the
application.
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WM_PRJ_Q2400_PTS_002 - 004
March 5, 2004
2 Interfaces
Note:
Some of the WISMO interface signals are multiplexed in order to limit number of pins but this
architecture implies some limitation.
For example, in case of using SPI bus, 2-wire bus cannot be used.
Warning:
All external signals must be inactive when the WISMO module is OFF to avoid any damage
when starting and allow WISMO module to start correctly.
2.1 General Purpose Connector (GPC)
A 60-pin connector, with 0.5 mm pitch, is provided to interface the WISMO Quik Q24x6 sub-series
with a board containing either a LCD module, or a keyboard, or a SIM connector, or a battery
connection...
The interfaces available on the GPC are described in the next paragraphs.
The GPC is made by KYOCERA / AVX group with the following reference:
14 5087 060 930 861.
The matting connector has the following reference:
24 5087 060 X00 861.
For further details, refer to paragraph 4.4 General Purpose Connector data sheet.
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WM_PRJ_Q2400_PTS_002 - 004
V
V
March 5, 2004
2.2 Power supply
2.2.1 General description
The power supply is one of the key issues in the design of a GSM terminal. Due to the bursted
emission in GSM / GPRS, the power supply must be able to deliver high current peaks in a short
time. During these peaks the ripple (U
in table “Power Supply Voltage” hereafter.
In communication mode, a GSM/GPRS class 2 terminal emits 577 µs radio bursts every 4.615 ms.
In communication mode, a GPRS class 10 terminal emits 1154 µs radio bursts every 4.615 ms.
) on the supply voltage must not exceed the limits specified
ripp
VBA TT
IBATT
(1)
or VDD if connected to VBATT
(1 )
Uripp
t = 577 µs
T = 4.615 ms
Figure 2: Typical power supply voltage in GSM mode
Two different inputs are provided for the power supply:
• the first one, VBATT is used to supply the RF part,
• the second one, VDD is used to supply the baseband part.
Notes
:
• It is possible to connect VBATT to VDD.
Uripp
max
min
• In case of separate power supplies, they have to be in the same state i.e both active or
inactive at the same time.
VBATT: supplies directly the RF components with 3.6 V. It is essential to keep a minimum voltage
ripple at this connection in order to avoid any phase error. The RF Power Amplifier current (2.0 A
peak in GSM /GPRS mode with a 50 Ohms RF output flows with a ratio of:
• 1/8 of the time (around 577 µs every 4.615 ms for GSM/GPRS class 2),
• 2/8 of the time (around 1154 µs every 4.615 ms for GSM/GPRS class 10).
The rising time is around 10 µs.
VDD: supplies the +2.8 V ballast regulators of the WISMO module. It is essential to keep the voltage
over 3.1 volts.
The WISMO module shielding case is the grounding. The ground has to be connected on the mother
board through a complete layer on the PCB.
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WM_PRJ_Q2400_PTS_002 - 004
March 5, 2004
Power Supply Voltage
V
VBATT
VDD
V
MIN
3.3 V (*) 3.6 V 4.5 V (**) 50 mVpp for freq<200 kHz
3.1 V 4.5 V 100 mVpp
V
NOM
MAX
Ripple max (U
500 µVpp for freq>200 kHz
ripp
)
(*): This value has to be guaranteed during the burst (with 2.0 A Peak in GSM or GPRS mode).
(**): max operating Voltage Stationary Wave Ratio (VSWR) 2:1.
When supplying the module with a battery, the total impedance (battery+contacts+protections+PCB)
should be < 150 mOhms to limit voltage drop-out within emission burst.
Refer to document [1] for further information about power supply design.
2.2.2 Power consumption
The following information is given assuming a 50 Ω RF output.
Power consumption in OFF mode
(module supplied, OFF state, no software running)
Conditions I
Overall consumption
Off 5 µA 10 µA
I
NOM
MAX
VBATT + VDD
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WM_PRJ_Q2400_PTS_002 - 004
March 5, 2004
Power consumption in E-GSM/GPRS 900 MHz and GSM/GPRS 850 MHz mode
class 10
Conditions I
VBATT+VDD
During TX bursts @Pcl5 1.60 A peak 1.8 A peak
During RX bursts
Average 1Rx/1Tx @Pcl5 250 mA 300 mA
Average 1Rx/1Tx @Pcl8 190 mA 200 mA
Average GPRS Cl 10 (3Rx/2Tx)
@Pcl5
Average GPRS Cl 10 (3Rx/2Tx)
@Pcl8
Average Idle mode 3 mA 7 mA
Power Control Level: Pcl5=2 W typ.; Pcl8=0.5 W typ.
Power consumption in GSM/GPRS 1800 MHz and
GSM/GPRS 1900 MHz mode class 10
Conditions I
VBATT+VDD
During TX bursts @Pcl0 1 A peak 1.5 A peak
During RX bursts
Average 1Rx/1Tx @Pcl0 190 mA 235 mA
Average 1Rx/1Tx @Pcl3 150 mA 180 mA
Average GPRS Cl 10 (3Rx/2Tx)
@Pcl0
Average GPRS Cl 10 (3Rx/2Tx)
@Pcl3
I
NOM
MAX
110 mA peak 115 mA peak
400 mA 510 mA
260 mA 300 mA
I
NOM
MAX
130 mA peak 140 mA peak
320 mA 410 mA
240 mA 270 mA
Average Idle mode 2 mA 6.5 mA
Power Control Level: Pcl0=1 W typ.; Pcl3=0.25 W typ.
Power Supply Pinout
Signal Pin number
+VBATT
VDD
GND
55, 57, 58, 59, 60
11
Shielding
The ground connection is done through the shielding the four legs have to be soldered to the
ground plane.
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WM_PRJ_Q2400_PTS_002 - 004
2.3 Electrical information for digital I/O
All digital I/O comply with 3 Volts CMOS.
Operating conditions
Parameter I/O type Min Max Condition
March 5, 2004
VIL
VIH
VOL
VOH
CMOS -0.5 V 0.8 V
CMOS 2.1 V 3.0 V
1X 0.2 V I
= -1 mA
OL
2X 0.2 V IOL = -2 mA
3X 0.2 V IOL = -3 mA
1X 2.6 V I
2X 2.6 V I
3X 2.6 V I
= 1 mA
OH
= 2 mA
OH
= 3 mA
OH
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WM_PRJ_Q2400_PTS_002 - 004
A
March 5, 2004
2.4 LCD interface
The WISMO Quik Q24x6 sub-series can be connected to a LCD module driver through either a SPI
bus or a two-wire interface.
2.4.1 SPI bus
The SPI bus includes a CLK signal (SPI_CLK), an I/O signal (SPI_IO) and an EN signal (SPI_EN)
complying with SPI bus standard.
Pin description
Signal Pin number I/O I/O type Description
SPI_CLK 10 O 1X SPI Serial Clock
SPI_IO 8 I/O CMOS / 1X SPI Data
SPI_EN * 28 O 1X SPI Enable
* Multiplexed with GPO3.
2.4.2 Two-wire interface
T
T
T
The two-wire interface includes a CLK signal (SCL) and a DATA signal (SDA) complying with a
standard 96 kHz interface. The maximum speed transfer is 400 kbits/s.
Pin description
Signal Pin number I/O I/O type Description
SCL 10 O 1X Serial Clock
SDA 8 I/O CMOS / 1X Serial Data
2.5 SPI Auxiliary bus
A second SPI Chip Enable (called SPI_AUX) has to be used to add a SPI peripheral to the WISMO
Quik Q24x6 sub-series.
Pin description
Signal Pin number I/O I/O type Description
SPI_CLK 10 O 1X SPI Serial Clock
SPI_IO 8 I/O CMOS / 1X SPI Data
SPI_AUX * 26 O 1X SPI Aux. Enable
* Multiplexed with GPO0.
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WM_PRJ_Q2400_PTS_002 - 004
March 5, 2004
2.6 Keyboard interface
Warning:
This interface is not FULLY available with AT commands:
An AT command allows to get the input key code (see AT+CMER command description). This
code has then to be processed by the application.
This interface provides 10 connections:
• 5 rows (ROW0 to ROW4),
• 5 columns (COL0 to COL4).
The scanning is a digital one, and the debouncing is done in the WISMO module. No discrete
components like R, C (Resistor, Capacitor) are needed.
Pin description
Signal Pin number I/O I/O type Description
ROW0 13 I/O CMOS / 1X Row scan
ROW1 15 I/O CMOS / 1X Row scan
ROW2 17 I/O CMOS / 1X Row scan
ROW3 19 I/O CMOS / 1X Row scan
ROW4 21 I/O CMOS / 1X Row scan
COL0 23 I/O CMOS / 1X Column scan
COL1 25 I/O CMOS / 1X Column scan
COL2 27 I/O CMOS / 1X Column scan
COL3 29 I/O CMOS / 1X Column scan
COL4 31 I/O CMOS / 1X Column scan
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