Sierra Wireless AR7550 Operators Guide
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Product Technical Specification
Important Notice
Due to the nature of wireless communications, transmission and reception of data can never be
guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant
delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used
in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used
in situations where failure to transmit or receive data could result in damage of any kind to the user or
any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or
received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or
receive such data.
Safety and Hazards
Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without
proper device certifications. These areas include environments where cellular radio can interfere
such as explosive atmospheres, medical equipment, or any other equipment which may be
susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that
could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether
the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED
OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with
various onboard systems.
Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door
is open. Sierra Wireless modems may be used at this time.
The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of
a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In
some states and provinces, operating such communications devices while in control of a vehicle is an
offence.
Limitations of Liability
This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or
noninfringement. The recipient of the manual shall endorse all risks arising from its use.
The information in this manual is subject to change without notice and does not represent a
commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,
GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability
arising under or in connection with the Sierra Wireless product, regardless of the number of events,
occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.
Customer understands that Sierra Wireless is not providing cellular or GPS (including A-GPS)
services. These services are provided by a third party and should be purchased directly by the
Customer.
41124764188 Rev 0.41 March 20, 2013 2
Product Technical Specification
SPECIFIC DISCLAIMERS OF LIABILITY: CUSTOMER RECOGNIZES AND ACKNOWLEDGES
SIERRA WIRELESS IS NOT RESPONSIBLE FOR AND SHALL NOT BE HELD LIABLE FOR ANY
DEFECT OR DEFICIENCY OF ANY KIND OF CELLULAR OR GPS (INCLUDING A-GPS)
SERVICES.
Patents
This product may contain technology developed by or for Sierra Wireless Inc.
This product includes technology licensed from QUALCOMM
This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents
licensed from InterDigital Group and MMP Portfolio Licensing.
®
.
Copyright
© 2013 Sierra Wireless. All rights reserved.
Trademarks
AirCard
AirVantage™, Watcher™ and the Sierra Wireless logo are trademarks of Sierra Wireless.
filed or registered trademarks of Sierra Wireless S.A. in France and/or in other countries.
Windows
Macintosh and Mac OS are registered trademarks of Apple Inc., registered in the U.S. and other
countries.
QUALCOMM
Other trademarks are the property of the respective owners.
®
is a registered trademark of Sierra Wireless. Sierra Wireless™, AirPrime™, AirLink™,
®
, inSIM®, WAVECOM®, WISMO®, Wireless Microprocessor®, Wireless CPU®, Open AT® are
,
®
and Windows Vista® are registered trademarks of Microsoft Corporation.
®
is a registered trademark of QUALCOMM Incorporated. Used under license.
Contact Information
Phone: 1-604-232-1488
Sales Desk:
Post:
Technical Support:
RMA Support:
Web:
Hours: 8:00 AM to 5:00 PM Pacific Time
E-mail:
Sierra Wireless
13811 Wireless Way
Richmond, BC
Canada V6V 3A4
support@sierrawireless.com
repairs@sierrawireless.com
Fax: 1-604-231-1109
www.sierrawireless.com
sales@sierrawireless.com
Consult our website for up-to-date product descriptions, documentation, application notes, firmware
upgrades, troubleshooting tips, and press releases: www.sierrawireless.com
41124764188 Rev 0.41 March 20, 2013 3
Product Technical Specification
Document History
Version Date Updates
Creation based on document 4112476: AirePrime – AR755x Series – Product
0.1 March 29, 2013
Technical Specification – Rev0.4.
41124764188 Rev 0.41 March 20, 2013 4
Contents
1. INTRODUCTION ................................................................................................ 11
1.1. General Features ............................................................................................................ 11
2. FUNCTIONAL SPECIFICATIONS ...................................................................... 12
2.1. Modes of Operation ......................................................................................................... 12
2.2. Communications Functions ............................................................................................. 12
2.3. Block Diagrams ............................................................................................................... 13
3. HARDWARE SPECIFICATIONS ........................................................................ 14
3.1. Environmental Specifications .......................................................................................... 14
3.2. Electrical Specifications ................................................................................................... 14
3.2.1. Absolute Maximum and ESD Ratings ...................................................................... 14
3.3. Mechanical Specifications ............................................................................................... 15
3.3.1. Physical Dimensions and Connection Interface ....................................................... 15
3.3.2. Mechanical Drawing ................................................................................................. 16
3.3.3. Footprint ................................................................................................................... 17
3.3.4. Thermal Consideration ............................................................................................. 18
4. RF SPECIFICATION .......................................................................................... 19
4.1. LTE RF Interface ............................................................................................................. 19
4.1.1. LTE Max TX Output Power ...................................................................................... 19
4.1.2. LTE RX Sensitivity ................................................................................................... 20
4.2. CDMA RF Interface ......................................................................................................... 20
4.2.1. CDMA Max TX Output Power .................................................................................. 20
4.2.2. CDMA RX Sensitivity ............................................................................................... 21
4.3. WCDMA RF Interface ...................................................................................................... 21
4.3.1. WCDMA Max TX Output Power ............................................................................... 21
4.3.2. WCDMA RX Sensitivity ............................................................................................ 21
4.4. WWAN Antenna Interface ............................................................................................... 22
4.4.1. WWAN Antenna Recommendations ........................................................................ 22
4.5. Primary Antenna Diagnostics .......................................................................................... 23
4.6. RX2 Antenna Diagnostics ............................................................................................... 23
5. GNSS SPECIFICATION ..................................................................................... 25
5.1. GNSS .............................................................................................................................. 25
5.2. GNSS Antenna Interface ................................................................................................. 25
5.2.1. GNSS Antenna Recommendations ......................................................................... 26
5.3. GNSS Antenna Diagnostics ............................................................................................ 26
5.4. Current Consumption ...................................................................................................... 29
5.5. Digital IO Characteristics ................................................................................................. 29
5.6. Internal Device Frequencies ............................................................................................ 30
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Product Technical Specification
6. BASEBAND SPECIFICATION ........................................................................... 32
6.1. Power Supply .................................................................................................................. 32
6.1.1. Under-Voltage Lockout (UVLO) ............................................................................... 32
6.2. VCOIN ............................................................................................................................. 33
6.3. ON/OFF Control .............................................................................................................. 34
6.3.1. ON/OFF Timing ........................................................................................................ 34
6.3.3. Software-Initiated Power Down ................................................................................ 36
6.3.4. Deep Sleep............................................................................................................... 36
6.3.4.1. Sequence to Enter Deep Sleep Mode ........................................................................... 37
6.4. USB ................................................................................................................................. 37
6.5. UART ............................................................................................................................... 38
6.6. Ring Indicator .................................................................................................................. 38
6.7. UIM Interface ................................................................................................................... 39
6.7.1. Internal UIM .............................................................................................................. 39
6.8. General Purpose IO ........................................................................................................ 40
6.8.1. AT Port Switch ......................................................................................................... 40
6.9. Secure Digital IO ............................................................................................................. 40
6.10. I2C ................................................................................................................................... 41
6.11. Voltage Reference ........................................................................................................... 41
6.12. RESET ............................................................................................................................. 41
6.13. ADC ................................................................................................................................. 42
6.14. LED .................................................................................................................................. 43
6.15. Audio ............................................................................................................................... 43
6.15.1. Analog Audio ............................................................................................................ 43
6.15.2. Digital Audio ............................................................................................................. 44
6.15.2.1. PCM ............................................................................................................................ 44
6.15.2.2. I2S .............................................................................................................................. 47
6.16. SPI Bus ............................................................................................................................ 49
6.16.1. Characteristics ......................................................................................................... 49
6.16.2. SPI Configuration ..................................................................................................... 49
6.16.3. SPI Waveforms ........................................................................................................ 49
6.16.4. SPI Pin Description .................................................................................................. 50
6.16.5. Application ................................................................................................................ 50
6.17. HSIC Bus ......................................................................................................................... 51
6.17.1. HSIC Pin Description ............................................................................................... 51
6.17.2. HSIC Waveforms ..................................................................................................... 51
6.17.3. Application ................................................................................................................ 52
6.18. Temperature Monitoring .................................................................................................. 53
7. ROUTING CONSTRAINTS AND RECOMMENDATIONS ................................. 54
7.1. RF Routing Recommendations ....................................................................................... 54
7.2. Power and Ground Recommendations ........................................................................... 56
7.3. Antenna Recommendations ............................................................................................ 56
7.4. Interface Circuit Recommendations ................................................................................ 57
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Product Technical Specification
8. REGULATORY INFORMATION ......................................................................... 58
8.1. Important Notice .............................................................................................................. 58
8.2. Important Compliance Information for USA OEM Integrators ......................................... 58
9. REFERENCES ................................................................................................... 60
10.ABBREVIATIONS .............................................................................................. 61
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List of Figures
Figure 1. AirPrime AR7550 Block Diagram .................................................................................... 13
Figure 2. AR55x Assembly Drawing ............................................................................................... 16
Figure 3. AirPrime AR7550 Mechanical Dimensions Drawing ....................................................... 16
Figure 4. AirPrime AR7550 Footprint ............................................................................................. 17
Figure 5. AirPrime AR7550 Recommended Application Land Pattern ........................................... 17
Figure 6. AirPrime AR7550 Heatsink Contact Area ....................................................................... 18
Figure 7. VGNSS_ANT vs. ADC Readings Relationship ............................................................... 28
Figure 8. GNSS Power Supply and Antenna Diagnostics Block Diagram ..................................... 28
Figure 9. Under-Voltage Lockout (UVLO) Diagram ........................................................................ 32
Figure 10. Recommended ON/OFF Control ..................................................................................... 34
Figure 11. Alternate ON/OFF Control ............................................................................................... 35
Figure 12. Power Mode Diagram ...................................................................................................... 36
Figure 13. Recommended UIM Holder Implementation ................................................................... 39
Figure 14. Illustration of Reset Timing When RESIN_N < Trdel ...................................................... 42
Figure 15. Illustration of Reset Timing When RESIN_N Held Low > Trdet+Trdel ............................ 42
Figure 16. LED Reference Circuit ..................................................................................................... 43
Figure 17. Audio Block Diagram ....................................................................................................... 43
Figure 18. PCM_FS Timing Diagram (2048 kHz Clock) ................................................................... 45
Figure 19. PCM Codec to AR Device Timing Diagram (Primary PCM) ........................................... 46
Figure 20. AR Device to PCM Codec Timing Diagram (Primary PCM) ........................................... 46
Figure 21. PCM_FS Timing Diagram (128 kHz Clock) ..................................................................... 47
Figure 22. PCM Codec to AR Device Timing Diagram (Auxiliary PCM) .......................................... 47
Figure 23. AR Device to PCM Codec Timing Diagram (Auxiliary PCM) .......................................... 47
Figure 24. I2S Signals Timing Diagram ............................................................................................ 48
Figure 25. 4-Wire Configuration SPI Transfer .................................................................................. 49
Figure 26. Example of 4-wire SPI Bus Application ........................................................................... 50
Figure 27. HSIC Signal Sample Waveforms .................................................................................... 51
Figure 28. Example of HSIC Bus Application ................................................................................... 52
Figure 29. Temperature Monitoring State Machine .......................................................................... 53
Figure 30. AppCAD Screenshot for Microstrip Design Power Mode Diagram ................................. 54
Figure 31. RF Routing Examples ..................................................................................................... 55
Figure 32. Coplanar Clearance Example ......................................................................................... 55
Figure 33. Antenna Microstrip Routing Example .............................................................................. 56
Figure 34. AirPrime AR7550 Input Reference Circuit ....................................................................... 57
Figure 35. AirPrime AR7550 Output Reference Circuit .................................................................... 57
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List of Tables
Table 1. AirPrime AR7550 Embedded Modules ........................................................................... 11
Table 2. AirPrime AR7550 Modes of Operation ............................................................................ 12
Table 3. Communications Functions ............................................................................................. 12
Table 4. AirPrime AR7550 Environmental Specifications ............................................................. 14
Table 5. AirPrime AR7550 Absolute Maximum Ratings ................................................................ 14
Table 6. AirPrime AR7550 Embedded Module Dimensions ......................................................... 15
Table 7. AirPrime AR7550 Maximum LTE Transmitter Output Power .......................................... 19
Table 8. AirPrime AR7550 Minimum LTE Receiver Sensitivity ..................................................... 20
Table 9. AirPrime AR7550 Maximum CDMA Transmitter Output Power ...................................... 21
Table 10. AirPrime AR7550 Minimum CDMA Receiver Sensitivity ................................................. 21
Table 11. AirPrime AR7550 Maximum WCDMA Transmitter Output Power .................................. 21
Table 12. AirPrime AR7550 Minimum WCDMA Receiver Sensitivity ............................................. 21
Table 13. AirPrime AR7550 WWAN Antenna Characteristics ........................................................ 22
Table 14. WWAN Antenna Interface Pads ...................................................................................... 22
Table 15. AirPrime AR7550 WWAN Antenna Recommendations ................................................. 22
Table 16. Primary Antenna ADC Characteristics ............................................................................ 23
Table 17. Primary Antenna Diagnostics Ranges ............................................................................ 23
Table 18. RX2 Antenna ADC Characteristics.................................................................................. 23
Table 19. RX2 Antenna Diagnostics Ranges .................................................................................. 24
Table 20. GNSS Characteristics ..................................................................................................... 25
Table 21. GNSS Antenna Interface Characteristics ........................................................................ 25
Table 22. GNSS Antenna Interface Pads ........................................................................................ 26
Table 23. GNSS Recommended Antenna Characteristics ............................................................. 26
Table 24. GNSS Antenna Diagnostics Ranges ............................................................................... 26
Table 25. VGNSS_ANT Current Draw ............................................................................................ 27
Table 26. AirPrime AR7550 Current Consumption Values ............................................................. 29
Table 27. Digital IO Characteristics ................................................................................................. 29
Table 28. Internal Device Frequencies ............................................................................................ 30
Table 29. Power Supply Requirements ........................................................................................... 32
Table 30. Power Supply Pads ......................................................................................................... 32
Table 31. UVLO Thresholds ............................................................................................................ 33
Table 32. VCOIN Pad ...................................................................................................................... 33
Table 33. VCOIN Interface Specification ......................................................................................... 33
Table 34. VCOIN Charging Specifications ...................................................................................... 33
Table 35. ON/OFF Control Pads ..................................................................................................... 34
Table 36. ON/OFF Internal Pull-Up ................................................................................................. 34
Table 37. Power-ON Sequence Symbol Definitions ....................................................................... 35
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Product Technical Specification
Table 38. Period of Wake Intervals ................................................................................................. 36
Table 39. Deep Sleep Function Availability ..................................................................................... 36
Table 40. USB Pad Details .............................................................................................................. 37
Table 41. USB Characteristics ........................................................................................................ 38
Table 42. UART Pads ...................................................................................................................... 38
Table 43. Ring Indicator Pad ........................................................................................................... 38
Table 44. UIM Pads ......................................................................................................................... 39
Table 45. GPIO Interface Pads ....................................................................................................... 40
Table 46. AT Port Switch States ..................................................................................................... 40
Table 47. SDIO Interface Pads ....................................................................................................... 40
Table 48. I2C Interface Pads ........................................................................................................... 41
Table 49. Voltage Reference Pad ................................................................................................... 41
Table 50. Voltage Reference Characteristics .................................................................................. 41
Table 51. Reset Interface Pads ....................................................................................................... 41
Table 52. Reset Timing ................................................................................................................... 42
Table 53. ADC Interface Pads ......................................................................................................... 42
Table 54. ADC Interface Characteristics ......................................................................................... 43
Table 55. LED Interface Pad ........................................................................................................... 43
Table 56. Analog Audio Interface Pads ........................................................................................... 43
Table 57. Analog Audio Interface Characteristics ........................................................................... 44
Table 58. Digital Audio Interface Pads ............................................................................................ 44
Table 59. PCM Interface Configurations ......................................................................................... 44
Table 60. Primary PCM Timing ....................................................................................................... 45
Table 61. Auxiliary PCM Timing ...................................................................................................... 46
Table 62. SPI Configuration ............................................................................................................ 49
Table 63. SPI Master Timing Characteristics .................................................................................. 50
Table 64. SPI Pin Description ......................................................................................................... 50
Table 65. HSIC Pin Description ....................................................................................................... 51
Table 66. Temperature Monitoring States ....................................................................................... 53
Table 67. Reference Specifications ................................................................................................. 60
Table 68. Abbreviations ................................................................................................................... 61
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1. Introduction
1.1. General Features
The AirPrime AR7550 embedded modules are designed for the automotive industry. They support
LTE, CDMA, WCDMA air interface standards and shares hardware and firmware interfaces with the
AirPrime AR5550 and AR855x. They also have Global Navigation Satellite System (GNSS)
capabilities including GPS and GLONASS.
The AirPrime AR7550 embedded modules are based on the Qualcomm MDM9615 wireless chipset
and support the following bands.
Table 1. AirPrime AR7550 Embedded Modules
Product Description Band Support
LTE: B4, B7*, B13
AirPrime
AR7550
LTE/CDMA2000/ /WCDMA embedded module
CDMA: BC0, BC1
WCDMA: B2, B5
* LTE B7 for AirPrime AR7550 is optional.
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2. Functional Specifications
This chapter highlights the features of the AirPrime AR7550 series of embedded modules.
2.1. Modes of Operation
The AirPrime AR7550 supports 2G/3G/4G operations and also supports GNSS operation. For
complete details, refer to the table below.
Table 2. AirPrime AR7550 Modes of Operation
Frequency (MHz)
Mode Band
Downlink (DL) UE Receive Uplink (UL) UE Transmit
Band 4 2110 MHz to 2155 MHz 1710 MHz to 1755 MHz
LTE
CDMA2000 –
1xRTT & 1xEVDO
Band 7 2620MHz to 2690 MHz 2500 MHz to 2570 MHz
Band 13 746 MHz to 756 MHz 777 MHz to 787 MHz
Band Class 0 869 MHz to 894 MHz 824 MHz to 849 MHz
Band Class 1 1930 MHz to 1990 MHz 1850 MHz to 1910 MHz
WCDMA/HSPA
GNSS
Note: Supported bands vary depending on product. Refer to Table 1 AirPrime AR7550 Embedded
II (1900/PCS) 1930 MHz to 1990 MHz 1850 MHz to 1910 MHz
V (850/CELL) 869 MHz to 894 MHz 824 MHz to 849 MHz
GPS L1 1574.42 – 1576.42 ---
GLONASS L1 FDMA 1597.5 – 1605.8 ---
Modules for the list of bands supported by each module variant.
2.2. Communications Functions
The AirPrime AR7550 provides the following communications functions via the LTE, CDMAand UMTS
networks.
Table 3. Communications Functions
Communications Function LTE CDMA WCDMA GSM/GPRS/EDGE
Voice
Packet Data
Short Message Service (SMS)
OTA
DTMF
Circuit Switched EVRC, EVRC-B AMR, AMR-WB FR, EFR, HR
VoLTE
OTAPA
OTASP
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Product Technical Specification
2.3. Block Diagrams
Figure 1. AirPrime AR7550 Block Diagram
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3. Hardware Specifications
3.1. Environmental Specifications
The environmental specification for both operating and storage of the AirPrime AR7550 embedded
modules are defined in the table below.
Table 4. AirPrime AR7550 Environmental Specifications
Parameter Temperature Range Operating Class
-30°C to +75°C Class A
Ambient Operating Temperature
Ambient Storage Temperature -40°C to +90°C ---
Ambient Humidity 95% or less ---
-40°C to -30°C
+75°C to +85°C
Class B
Class A is defined as the operating temperature range that the device:
Shall exhibit normal function during and after environmental exposure.
Shall meet the minimum requirements of 3GPP, 3GPP2 or appropriate wireless standards.
Class B is defined as the operating temperature range that the device:
Shall remain fully functional during and after environmental exposure
Shall exhibit the ability to establish a voice, SMS or DATA call (emergency call) at all times
even when one or more environmental constraint exceeds the specified tolerance.
Unless otherwise stated, full performance should return to normal after the excessive
constraint(s) have been removed.
3.2. Electrical Specifications
This section provides details for some of the key electrical specifications of the AirPrime AR7550
embedded modules.
3.2.1. Absolute Maximum and ESD Ratings
This section defines the Absolute Maximum and Electrostatic Discharge (ESD) Ratings of the
AirPrime AR7550 embedded modules.
Warning:
Table 5. AirPrime AR7550 Absolute Maximum Ratings
Parameter Min Max Units
VBATT Power Supply Input - 5.0 V
VIN Voltage on any digital input or output pin - VCC_1v8+0.5 V
IIN Latch-up current -100 100 mA
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If these parameters are exceeded, even momentarily, damage may occur to the device.
Product Technical Specification
Parameter Min Max Units
Maximum Voltage applied to antenn a interface pins
Primary Antenna - 36 V
VANT
ESD Ratings
RX2 Antenna - 36 V
GNSS Antenna - 36 V
ESD1
1 The ESD Simulator configured with 330pF, 1000.
Caution: The AirPrime AR7550 embedded modules are sensitive to Electrostatic Discharge. ESD
Primary, RX2 and GNSS antenna pads - Contact - ± 8 kV
All other signal pads - Contact - ± 1.5 kV
countermeasures and handling methods must be used when handling the AirPrime AR7550
devices.
3.3. Mechanical Specifications
3.3.1. Physical Dimensions and Connection Interface
The AirPrime AR7550 embedded modules are a Land Grid Array (LGA) form factor device. The
device does not have a System or RF connectors. All electrical and mechanical connections are made
via the 303 pad LGA on the underside of the PCB.
Table 6. AirPrime AR7550 Embedded Module Dimensions
Parameter Nominal Max Units
Overall Dimension 32 x 37 32.25 x 37.25 mm
Overall Module Height 3.64 3.89 mm
PCB Thickness 1.6 1.76 mm
Flatness Specification - 0.1 mm
Weight tbd - g
Note: The dimensions in Error! Reference source not found. are accurate as of the release date of this
document.
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Product Technical Specification
3.3.2. Mechanical Drawing
Figure 2. AR55x Assembly Drawing
Figure 3. AirPrime AR7550 Mechanical Dimensions Drawing
Note: The dimensions in Error! Reference source not found. are preliminary and subject to change.
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Product Technical Specification
3.3.3. Footprint
The AirPrime AR7550 device LGA footprint is a 303 pad array of 0.9mm, 1.45mm, and 1.90mm pads.
The following drawing illustrates the device footprint. The application footprint is recommended to
mirror the device footprint as illustrated in the following drawing (subject to change).
Figure 4. AirPrime AR7550 Footprint
Figure 5. AirPrime AR7550 Recommended Application Land Pattern
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Product Technical Specification
3.3.4. Thermal Consideration
The AirPrime AR7550 device is designed to work over an extended temperature range. In order to do
this efficiently a method of sinking heat from the product is recommended.
Refer to application notes (TBD) for details.
Figure 6. AirPrime AR7550 Heatsink Contact Area
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4. RF Specification
This section presents the WWAN RF interface of the AirPrime AR7550 series of embedded modules.
The specifications for the LTE, CDMA and WCDMA interfaces are defined.
4.1. LTE RF Interface
This section presents the LTE RF Specification for the AirPrime AR7550.
4.1.1. LTE Max TX Output Power
The Maximum Transmitter Output Power of the AirPrime AR7550 embedded modules are specified in
the following table.
Table 7. AirPrime AR7550 Maximum LTE Transmitter Output Power
Band Frequency Band
Nomi
nal
Max
TX
Outp
ut
Powe
r
+23
dB
Tolera
nce
+1/‐2
dB
Band 4
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