siemens spd08p05 Datasheet

Page 1
SIPMOS ® Power Transistor
• P channel
• Enhancement mode
Preliminary data
SPD08P05 SPU08P05
Pin 1 Pin 2 Pin 3
G D S
Type
SPD08P05 -50 V -8 A 0.3 SPU08P05 -50 V -8 A 0.3
Maximum Ratings Parameter Symbol Values Unit
V
DS
I
D
R
DS(on
)
Ω Ω
Continuous drain current
T
= 30 °C
C
Pulsed drain current
T
= 25 °C
C
Avalanche energy, single pulse
I
= -8 A, VDD = -25 V, RGS = 25
D
L = 2.2 mH, T
= 25 °C
j
Ω
Gate source voltage V Power dissipation
T
= 25 °C
C
Operating temperature T Storage temperature T Thermal resistance, junction - case R Thermal resistance, junction - ambient (PCB mount)** R Thermal resistance, junction - ambient R
Package Ordering Code
P-TO252 Q67000-. . . - . . . P-TO251 Q67000-. . . - . . .
I
D
-8
I
Dpuls
-32
E
AS
70
±
GS
P
tot
20 V
40
j stg
thJC thJA thJA
-55 ... + 150 °C
-55 ... + 150
≤
3.1 K/W
≤
50
≤
100
A
mJ
W
IEC climatic category, DIN IEC 68-1 55 / 150 / 56
** when mounted on 1 " square PCB ( FR4 );for recommended footprint
Semiconductor Group 1 23/Jan/1998
Page 2
Preliminary data
SPD08P05 SPU08P05
Electrical Characteristics,
Parameter Symbol Values Unit
Static Characteristics
Drain- source breakdown voltage
V
= 0 V, ID = -0.25 mA, Tj = 25 °C
GS
Gate threshold voltage
V
GS=VDS, ID
= 1 mA
Zero gate voltage drain current
V
= -50 V, VGS = 0 V, Tj = 25 °C
DS
V
= -50 V, VGS = 0 V, Tj = 125 °C
DS
Gate-source leakage current
V
= -20 V, VDS = 0 V
GS
Drain-Source on-resistance
V
= -10 V, ID = -5 A
GS
at Tj = 25°C, unless otherwise specified
min. typ. max.
V
(BR)DSS
-50 - -
V
GS(th)
-2.1 -3 -4
I
DSS
-
-
I
GSS
- -10 -100
R
DS(on)
- 0.25 0.3
-0.1
-10
V
µA
-1
-100 nA
Ω
Semiconductor Group 2 23/Jan/1998
Page 3
Preliminary data
SPD08P05 SPU08P05
Electrical Characteristics,
Parameter Symbol Values Unit
Dynamic Characteristics
Transconductance
V
≥
2
DS
* ID * RDS(on)max, ID
Input capacitance
V
= 0 V, VDS = -25 V, f = 1 MHz
GS
Output capacitance
V
= 0 V, VDS = -25 V, f = 1 MHz
GS
Reverse transfer capacitance
V
= 0 V, VDS = -25 V, f = 1 MHz
GS
Turn-on delay time
V
= -30 V, VGS = -10 V, ID = -2.9 A
DD
R
= 50
G
Ω
Rise time
V
= -30 V, VGS = -10 V, ID = -2.9 A
DD
R
= 50
G
Ω
Turn-off delay time
V
= -30 V, VGS = -10 V, ID = -2.9 A
DD
R
= 50
G
Ω
Fall time
V
= -30 V, VGS = -10 V, ID = -2.9 A
DD
R
= 50
G
Ω
at Tj = 25°C, unless otherwise specified
min. typ. max.
g
fs
= 5 A
C
iss
1.5 2.3 -
- 750 1000
C
oss
- 270 400
C
rss
- 120 180
t
d(on)
- 20 30
t
r
- 110 170
t
d(off)
- 70 90
t
f
- 100 140
S
pF
ns
Semiconductor Group 3 23/Jan/1998
Page 4
Preliminary data
SPD08P05 SPU08P05
Electrical Characteristics,
at Tj = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Reverse Diode
Inverse diode continuous forward current
T
= 25 °C
C
Inverse diode direct current,pulsed
T
= 25 °C
C
Inverse diode forward voltage
V
= 0 V, IF = -16 A
GS
Reverse recovery time
V
= -30 V, I
R
F=lS, diF
/dt = 100 A/µs
Reverse recovery charge
V
= -30 V, I
R
F=lS, diF
/dt = 100 A/µs
I
I
V
t
Q
S
SM
SD
rr
A
- - -8
- - -32 V
- -1.25 -1.7 ns
- 90 -
rr
µC
- 0.23 -
Semiconductor Group 4 23/Jan/1998
Page 5
Preliminary data
SPD08P05 SPU08P05
Power dissipation
P
= ƒ(TC)
tot
45
W
P
35
tot
30
25
20
15
10
5
0
0 20 40 60 80 100 120 °C 160
Drain current
ID = ƒ(TC)
parameter: V
-9
A
I
-7
D
-6
-5
-4
-3
-2
-1
0
0 20 40 60 80 100 120 °C 160
T
C
GS
≥
-10 V
T
C
Safe operating area
ID = ƒ(VDS)
parameter: D = 0.01, TC = 25°C
2
-10
A
I
D
1
-10
DS(on)
R
0
-10
-1
-10
0
-10
=
I
D
/
DS
V
1
-10
t
= 190.0µs
p
DC
1 ms
10 ms
V
-10
V
DS
Transient thermal impedance
Z
= ƒ(tp)
th JC
parameter: D = tp / T
1
10
K/W
Z
thJC
2
10
10
10
10
0
-1
D = 0.50
0.20
0.10
10
0.05
0.02
0.01
-2
-1
10
10 0 s
t
p
-2
single pulse
-3
-7
-6
-5
-4
10
10
10
10
10
-3
Semiconductor Group 5 23/Jan/1998
Page 6
Preliminary data
SPD08P05 SPU08P05
Typ. output characteristics
ID = ƒ(VDS)
parameter: tp = 80 µs , T
-18
P
= 40W
tot
l
A
I
D
-14
-12
-10
-8
-6
-4
-2
0
0 -2 -4 -6 -8 -10 -12 -14 -16 V -19
= 25 °C
j
k
j
i
h
g
f
e
d
c
b
a
VGS [V]
a -4.0 b -4.5 c -5.0 d -5.5 e -6.0 f -6.5 g -7.0 h -7.5 i -8.0 j -9.0 k -10.0 l -20.0
V
DS
Typ. drain-source on-resistance
R
DS (on)
= ƒ(ID)
parameter: tp = 80 µs, Tj = 25 °C
0.9
a
b
c
d
e
f
R
DS (on)
g
Ω
0.7
0.6
0.5
0.4
0.3
0.2
V
V
V
[V] =
[V] =
[V] =
GS
GS
GS
0.1
a
a
a
b
c
d
e
-4.0
-4.5
-5.0
-5.5
-6.0
-6.5
0.0 0 -2 -4 -6 -8 -10 -12 A -16
-7.0
-7.5
f
g
-8.0
h
-9.0
h
i
-10.0
j
-20.0
i
j
I
D
Typ. transfer characteristics ID = f (VGS)
parameter: tp = 80 µs
≥
V
2 x
x R
ID
DS(on)max
-15 A
-13
-12
-11
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1 0
0 -1 -2 -3 -4 -5 -6 -7 -8 V -10
I
DS
D
Typ. forward transconductance gfs = f (I
)
D
parameter: tp = 80 µs,
≥
V
2 x I
DS
g
fs
V
GS
x R
D
DS(on)max
4.0
S
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0 0 -2 -4 -6 -8 -10 -12 A -15
I
D
Semiconductor Group 6 23/Jan/1998
Page 7
Preliminary data
SPD08P05 SPU08P05
Drain-source on-resistance
R
DS (on)
= ƒ(Tj)
parameter: ID = -5 A, VGS = -10 V
0.70
Ω
0.60
R
0.55
DS (on)
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
-60 -20 20 60 100 °C 160
98%
typ
Gate threshold voltage
V
GS (th)
= ƒ(Tj)
parameter: VGS = VDS, ID = 1 mA
-4.6 V
-4.0
V
GS(th)
-3.6
-3.2
-2.8
-2.4
-2.0
-1.6
-1.2
-0.8
-0.4
0.0
-60 -20 20 60 100 °C 160
T
j
98%
typ
2%
T
j
Typ. capacitances
C = f (V
DS
)
parameter:VGS = 0V, f = 1MHz
4
10
pF
C
3
10
2
10
1
10
0 -5 -10 -15 -20 -25 -30 V -40
Forward characteristics of reverse diode
IF = ƒ(VSD)
parameter: Tj, tp = 80 µs
2
-10
A
I
F
1
-10
C
iss
C
oss
0
C
rss
V
DS
-10
Tj = 25 °C typ Tj = 150 °C typ Tj = 25 °C (98%)
= 150 °C (98%)
T
j
-1
-10
0.0 -0.4 -0.8 -1.2 -1.6 -2.0 -2.4 V -3.0
V
SD
Semiconductor Group 7 23/Jan/1998
Page 8
Preliminary data
SPD08P05 SPU08P05
Avalanche energy EAS = ƒ(Tj)
parameter: ID = -8 A, VDD = -25 V RGS = 25 Ω, L = 2.2 mH
75
mJ
65 60
E
AS
55 50 45 40 35 30 25 20 15 10
5 0
20 40 60 80 100 120 °C 160
Drain-source breakdown voltage
V
(BR)DSS
V
(BR)DSS
T
j
= ƒ(Tj)
-60 V
-58
-57
-56
-55
-54
-53
-52
-51
-50
-49
-48
-47
-46
-45
-60 -20 20 60 100 °C 160
T
j
Semiconductor Group 8 23/Jan/1998
Page 9
Package Outlines
P-TO252 Dimension in mm
Preliminary data
SPD08P05 SPU08P05
P-TO251 Dimension in mm
Semiconductor Group 9 23/Jan/1998
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