Siemens SIMATIC IPC677E Operating Instructions Manual

SIMATIC IPC677E

SIMATIC
Industrial PC SIMATIC IPC677E
Operating Instructions
04/2019
A5E45
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117996-AA
Siemens AG Division Digital Factory Postfach 48 48 90026 NÜRNBERG GERMANY
A5E45117996-AA
Copyright © Siemens AG 2019. All rights reserved
DANGER
indicates that death or severe personal injury will result if proper precautions are not taken.
WARNING
indicates that death or severe personal injury may result if proper precautions are not taken.
CAUTION
indicates that minor personal injury can result if proper precautions are not taken.
NOTICE
indicates that property damage can result if proper precautions are not taken.
WARNING
Siemens products may only be used for the applications described in the catalog and in the relevant technical
ambient conditions must be complied with. The information in the relevant documentation must be observed.

Legal information

Warning notice system
This manual contains notices you have to observe in order to ensure your personal safety, as well as to prevent damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are graded according to the degree of danger.
If more than one degree of danger is present, the warning notice representing the highest degree of danger will be used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to property damage.
Qualified Personnel
The product/system described in this documentation may be operated only by personnel qualified for the specific task in accordance with the relevant documentation, in particular its warning notices and safety instructions. Qualified personnel are those who, based on their training and experience, are capable of identifying risks and avoiding potential hazards when working with these products/systems.
Proper use of Siemens products
Note the following:
documentation. If products and components from other manufacturers are used, these must be recommended or approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and maintenance are required to ensure that the products operate safely and without any problems. The permissible
Trademarks
All names identified by ® are registered trademarks of Siemens AG. The remaining trademarks in this publication may be trademarks whose use by third parties for their own purposes could violate the rights of the owner.
Disclaimer of Liability
We have reviewed the contents of this publication to ensure consistency with the hardware and software described. Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the information in this publication is reviewed regularly and any necessary corrections are included in subsequent editions.
04/2019 Subject to change

Preface

Edition
Comment
04/2019
First edition
Purpose of the operating instructions
These operating instructions contain all the information you need for the installation, electrical connection, commissioning and expansion of the SIMATIC IPC677E and to maintain and repair the device. They are intended for the following qualified specialist personnel:
Installation personnel
Commissioning engineers
IT administrators
Service and maintenance personnel
Basic knowledge required
A solid background in electrical installation, personal computers, Microsoft operating systems and network technology is required to understand this manual. General knowledge in the field automation control engineering is recommended.
Scope of the operating instructions
These operating instructions are valid for all order versions of the SIMATIC IPC677E.
History
The following editions of these operating instructions have already been published:
SIMATIC IPC677E Operating Instructions, 04/2019, A5E45117996-AA
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Preface
Security information
Siemens provides products and solutions with industrial security functions that support the secure operation of plants, systems, machines and networks.
In order to protect plants, systems, machines and networks against cyber threats, it is necessary to implement – and continuously maintain – a holistic, state-of-the-art industrial security concept. Siemens' products and solutions constitute one element of such a concept.
Customers are responsible for preventing unauthorized access to their plants, systems, machines and networks. Such systems, machines and components should only be connected to an enterprise network or the internet if and to the extent such a connection is necessary and only when appropriate security measures (e.g. firewalls and/or network segmentation) are in place.
For additional information on industrial security measures that may be implemented, please visit (http://www.siemens.de/industrialsecurity).
Siemens' products and solutions undergo continuous development to make them more secure. Siemens strongly recommends that product updates are applied as soon as they are available and that the latest product versions are used. Use of product versions that are no longer supported, and failure to apply the latest updates may increase customers' exposure to cyber threats.
To stay informed about product updates, subscribe to the Siemens Industrial Security RSS Feed under (http://www.siemens.de/industrialsecurity).
Disclaimer for third-party software updates
This product includes third-party software. Siemens AG only provides a warranty for updates/patches of the third-party software, if these have been distributed as part of a Siemens software update service contract or officially released by Siemens AG. Otherwise, updates/patches are undertaken at your own risk. You can find more information about our Software Update Service offer on the Internet at Software Update Service (http://www.automation.siemens.com/mcms/automation-software/en/software-update-
service).
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Table of contents

Preface ...................................................................................................................................................... 3
1 Product description .................................................................................................................................. 11
1.1 Important instructions and manuals for operating the device ................................................. 11
1.2 Product highlights ................................................................................................................... 13
1.3 Applications ............................................................................................................................. 15
1.4 External design of the device .................................................................................................. 16
1.4.1 Side view, right ........................................................................................................................ 16
1.4.2 Side view, left .......................................................................................................................... 17
1.4.3 Status displays ........................................................................................................................ 19
1.5 Internal design of the device ................................................................................................... 21
1.6 Accessories and spare parts .................................................................................................. 22
1.6.1 Accessories: Hardware ........................................................................................................... 22
1.6.2 Accessories: Software ............................................................................................................ 23
2 Safety instructions ................................................................................................................................... 25
2.1 General safety instructions ..................................................................................................... 25
2.2 Note on transport and storage ................................................................................................ 27
2.3 Notes on mounting .................................................................................................................. 28
2.4 Notes on ambient and environmental conditions .................................................................... 28
2.5 Information on I/O devices ...................................................................................................... 30
2.6 Notes on device and system extensions ................................................................................ 31
3 Mounting and connecting the device........................................................................................................ 33
3.1 Preparing for mounting ........................................................................................................... 33
3.1.1 Scope of delivery .................................................................................................................... 33
3.1.2 Checking the delivery package ............................................................................................... 35
3.1.3 Identification data of the device .............................................................................................. 36
3.1.4 Mounting positions .................................................................................................................. 37
3.1.5 Preparing the mounting cutout ................................................................................................ 39
3.2 Mounting the device ................................................................................................................ 41
3.2.1 Installation guidelines ............................................................................................................. 41
3.2.2 Mounting the device with mounting clips ................................................................................ 42
3.3 Connecting the device ............................................................................................................ 46
3.3.1 Country-specific information on supply voltage ...................................................................... 46
3.3.2 Connection of equipotential-bonding cable ............................................................................ 47
3.3.3 Connecting the power supply ................................................................................................. 48
3.3.3.1 Connecting 100-240 VAC power supply ................................................................................. 48
3.3.3.2 Connecting the 24 VDC power supply .................................................................................... 50
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3.3.4 Connecting I/O devices .......................................................................................................... 52
3.3.5 Connecting the device to networks ........................................................................................ 53
3.3.6 Connecting Ethernet/USB strain relief ................................................................................... 54
4 Commissioning the device ....................................................................................................................... 55
4.1 Switching on the device ......................................................................................................... 55
4.2 Configuring automatic switch-on of device ............................................................................ 55
4.3 Switching off the device ......................................................................................................... 56
5 Operating the device ................................................................................................................................ 59
5.1 Multi-monitoring ...................................................................................................................... 59
5.2 Drive configurations ............................................................................................................... 59
5.2.1 RAID1 system ........................................................................................................................ 59
5.3 Operating RAID systems ....................................................................................................... 60
5.3.1 Display of a defective drive of a RAID system ....................................................................... 60
5.3.2 RAID1 system: Installation options for drives ........................................................................ 60
5.3.3 Configure the onboard RAID system ..................................................................................... 60
5.3.4 Monitoring the onboard RAID system with "Intel® Rapid Storage Technology" ................... 62
5.3.5 Integrating a new drive into the onboard RAID system ......................................................... 63
5.3.6 Data synchronization in the RAID system ............................................................................. 64
5.4 Monitoring of the device ......................................................................................................... 65
5.4.1 Monitoring functions ............................................................................................................... 65
5.4.2 SIMATIC IPC DiagBase ......................................................................................................... 66
5.4.3 SIMATIC IPC DiagMonitor ..................................................................................................... 66
5.5 Remote maintenance of the device ....................................................................................... 67
5.5.1 Remote maintenance functions ............................................................................................. 67
5.5.2 SIMATIC IPC Remote Manager ............................................................................................. 68
5.6 Trusted Platform Module (TPM) ............................................................................................. 69
5.7 Buffer memory NVRAM (optional) ......................................................................................... 69
6 Expanding the device and assigning device parameters ......................................................................... 71
6.1 Opening the Device ............................................................................................................... 71
6.2 Expansion cards .................................................................................................................... 73
6.2.1 Usable expansion cards ......................................................................................................... 73
6.2.2 Installing/removing expansion cards ...................................................................................... 73
6.3 Memory modules.................................................................................................................... 76
6.3.1 Usable memory modules ....................................................................................................... 76
6.3.2 Installing and removing memory module ............................................................................... 77
6.4 Drives ..................................................................................................................................... 79
6.4.1 Changing the drive in the removable tray .............................................................................. 79
6.4.2 Changing internal SSD .......................................................................................................... 81
6.4.3 Changing internal hard disk drive .......................................................................................... 84
6.4.4 Replacing a drive in the RAID system ................................................................................... 86
6.4.5 Replacing M.2 NVMe SSD ..................................................................................................... 87
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7 Maintaining and servicing your device ..................................................................................................... 89
7.1 Repair information ................................................................................................................... 89
7.2 Maintenance intervals ............................................................................................................. 90
7.3 Cleaning the Device Front ...................................................................................................... 91
7.4 Removing and installing hardware .......................................................................................... 92
7.4.1 Replacing device fans ............................................................................................................. 92
7.4.2 Replace power supply fan ...................................................................................................... 95
7.4.3 Changing the backup battery .................................................................................................. 98
7.4.4 Replace power supply .......................................................................................................... 100
7.4.5 Replacing the bus board ....................................................................................................... 102
7.4.6 Replacing the processor ....................................................................................................... 106
7.5 Installing operating system, software and drivers ................................................................. 109
7.5.1 Installing the operating system ............................................................................................. 109
7.5.2 Installing software and drivers .............................................................................................. 109
7.6 Configuring firmware/BIOS ................................................................................................... 110
7.7 Backing up data and changing partitions .............................................................................. 110
7.8 Recycling and disposal ......................................................................................................... 110
8 Technical specifications ......................................................................................................................... 111
8.1 Applicability of technical specifications ................................................................................. 111
8.2 General technical specifications ........................................................................................... 111
8.3 Current/power consumption and power supply .................................................................... 113
8.3.1 Current/power consumption of the system components ...................................................... 113
8.3.2 Technical specifications AC power supply (AC) ................................................................... 114
8.3.3 Technical specifications of direct voltage power supply (DC) .............................................. 114
8.4 Electromagnetic compatibility ............................................................................................... 115
8.5 Ambient conditions ................................................................................................................ 115
8.6 Technical specifications of the drives ................................................................................... 116
8.7 Technical specifications of the motherboard ........................................................................ 116
8.8 Technical specifications of graphics/display ......................................................................... 117
8.9 Technical specifications of the interfaces ............................................................................. 117
8.10 Technical specifications of the operating systems ............................................................... 119
9 Dimension drawings .............................................................................................................................. 121
9.1 Dimension drawing of 19" device with capacitive multi-touch screen .................................. 121
9.2 Dimension drawing of 22" device with capacitive multi-touch screen .................................. 122
9.3 Dimension drawing of 24" device with capacitive multi-touch screen .................................. 123
9.4 Dimension drawing of the expansion cards .......................................................................... 124
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Table of contents
10 Standards and approvals ....................................................................................................................... 125
10.1 CE marking .......................................................................................................................... 125
10.2 DIN ISO 9001 certificate and software license agreements ................................................ 126
10.3 UL approval .......................................................................................................................... 126
10.4 FCC (USA) ........................................................................................................................... 127
10.5 Canada ................................................................................................................................. 127
10.6 Australia / New Zealand ....................................................................................................... 128
10.7 Eurasion Customs Union EAC ............................................................................................. 128
10.8 Korea .................................................................................................................................... 128
A Hardware descriptions ........................................................................................................................... 129
A.1 Motherboard ......................................................................................................................... 129
A.1.1 Layout of the motherboard ................................................................................................... 129
A.1.2 Position of the interfaces on the motherboard ..................................................................... 130
A.2 Internal Interfaces ................................................................................................................ 131
A.2.1 Assignment of the internal interfaces ................................................................................... 131
A.2.2 Device fan supply (X512) ..................................................................................................... 131
A.2.3 Supply for the power supply fan (X515) ............................................................................... 132
A.2.4 Supply for the serial ATA drives (X516 - X521) ................................................................... 132
A.3 Bus board ............................................................................................................................. 133
A.3.1 Design and principle of operation of the bus board ............................................................. 133
A.3.2 Pin assignment 12 V power supply connection for expansion cards ................................... 134
A.4 External interfaces ............................................................................................................... 135
A.5 System resources ................................................................................................................ 136
A.5.1 Currently allocated system resources .................................................................................. 136
A.5.2 I/O address allocation .......................................................................................................... 136
A.5.3 Interrupt Assignments .......................................................................................................... 138
A.5.4 Exclusive PCI hardware interrupt ......................................................................................... 141
A.5.5 Memory address assignments ............................................................................................. 142
B Technical support .................................................................................................................................. 143
B.1 Service and support ............................................................................................................. 143
B.2 Troubleshooting ................................................................................................................... 144
B.2.1 Problems with device functions ............................................................................................ 144
B.2.2 Problems when booting the device ...................................................................................... 145
B.2.3 Problems with RAID systems ............................................................................................... 146
B.2.4 Problems when using expansion cards ............................................................................... 146
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Table of contents
C Markings and symbols ........................................................................................................................... 147
C.1 Overview ............................................................................................................................... 147
C.2 Safety .................................................................................................................................... 147
C.3 Operator controls .................................................................................................................. 147
C.4 Certificates, approvals and markings .................................................................................... 148
C.5 Interfaces .............................................................................................................................. 149
D List of abbreviations ............................................................................................................................... 151
D.1 Abbreviations ........................................................................................................................ 151
Index ...................................................................................................................................................... 155
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Table of contents
SIMATIC IPC677E
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1
Documentation
Contents
Source
com/cs/ww/en/view/109760621)

1.1 Important instructions and manuals for operating the device

Operating Instructions
Quick Install Guide Information on:
Current product infor­mation
Firmware/BIOS de­scription
Windows® operating system

Product description

Technical specifications
Installation of the device
Operation of the device
Installing and removing hard-
ware
Dimension drawings
Operating Instructions of the
device
Installation of the device
Connecting the device to the
power supply
Connecting I/O devices
Switching the device on
Current notes on the device
Changes compared with these
Operating Instructions
Information on:
Important firmware settings
Firmware settings in the delivery
state
Boot modes
Information on:
Commissioning the operating system
Restoring the operating system
Configuration of the operating
system
Supplied data storage medium
Online at:
SIMATIC IPC Documentation (https://support.industry.siemens.
com/cs/ww/en/view/109760621)
Supplied in printed form with the device
Supplied data storage medium
Online at:
SIMATIC IPC Documentation (https://support.industry.siemens.
Supplied data storage medium
Online at:
Firmware/BIOS description (https://support.industry.siemens.
com/cs/ww/en/view/109760621)
Supplied data storage medium
Online at:
Microsoft® Windows® 10 (https://support.industry.siemens.
com/cs/ww/en/view/109749498)
SIMATIC IPC677E Operating Instructions, 04/2019, A5E45117996-AA
11
Product description
Documentation
Contents
Source
com/cs/ww/en/view/39129913)
com/cs/de/en/view/21766418)
/Default.aspx)
com/cs/ww/en/view/109751260)
1.1 Important instructions and manuals for operating the device
SIMATIC IPC Di­agBase
SIMATIC IPC Diag­Monitor
SIMATIC IPC Remote Manager
SIMATIC IPC Image & Partition Creator
Information on:
Temperature monitoring
Fan monitoring
Monitoring drives
Watchdog
Operating hours counter
Battery monitoring
Monitoring functions such as with SIMATIC IPC DiagBase with addi­tional extended functions.
Information on:
Remote maintenance of SIMATIC Industrial PCs (IPCs) via a management PC.
Using Intel ®Active Management Technology (Intel® AMT).
Information on:
Backup and recovery of files, directories, drive partitions.
Supplied data storage medium
Online at:
SIMATIC IPC DiagBase (https://support.industry.siemens.
com/cs/ww/en/view/109749690)
Online at:
SIMATIC IPC DiagMonitor (https://support.industry.siemens.
Online at:
SIMATIC IPC Remote Manager (http://support.automation
.siemens.com/WW/view /en/48707158)
Online at:
SIMATIC IPC Image Partition Creator (https://support.industry.siemens.
SIMATIC NET Industrial communication
SIMATIC Industrial PC Panel Drivers and Tools
Information on:
Setting the brightness
Configuration of the screen sav-
er
Touch settings for resistive touch and multi-touch
Online at:
SIMATIC NET (http://w3.siemens.com/mcms
/automation/en/industrial­communications/Pages
Online at:
SIMATIC Industrial PC Panel Drivers and Tools V1.3 PDT IPC/IFP with capacitive multi­touch screen (https://support.industry.siemens.
SIMATIC IPC677E
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Product description
Note
Depending on the manual may differ from the features of your device.

1.2 Product highlights

1.2 Product highlights
The SIMATIC IPC677E is a powerful industrial PC. It is perfectly suited for PC applications with high-level industry functionality.
Device view
configuration ordered the features and illustrations described in this
Maximum industrial compatibility for 24-hour continuous use in industrial environments
Maximum processor power (in full configuration) without loss of power (throttling) at up to +45 °C ambient temperature
Full metal enclosure with high electromagnetic compatibility (EMC) for use in industry
Independent industrial product design for high shock and vibration resistance
CE marking for the industrial field
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Product description
1.2 Product highlights
High productivity through fast data processing
8th generation Intel® processors: Celeron, Core i3 and i7
Graphics controller (630/P630) integrated in processor up to 4K Ultra HD resolution, three
independent graphic interfaces
Maximum performance, e.g. through Intel C246 chip set, DDR4 memory (up to 64 GB) with support of dual channel technology
High data transfer rates, e.g. with PCI Express Gen 3 technology, USB 3.1 Gen 2 SuperSpeed (SuperSpeed+) (10 Gbps), M.2 NVMe
Low noise level due to variable-speed fans
High system availability thanks to minimization of standstill times
Hot swap (swapping of drive during operation) in removable drive bays in RAID systems
Efficient event diagnostics through the SIMATIC IPC DiagBase or DiagMonitor monitoring
software (optional) and signaling software OPC/SNMP/LAN
Remote control and remote maintenance of the device through iAMT (Intel® Active Management Technology)
SSD as 2.5" SATA or M.2 NVMe
Preventative data backup with the SIMATIC IPC Image & Partition Creator
High investment protection
Platform with embedded Intel components for long-term stability
Availability: 3 to 6 years
Assured spare parts availability: 5 years after end of production
Certified for worldwide marketing (cULus)
Support of legacy interfaces (COM)
Compatible installation across device generations
Worldwide service and support
Device variants
Devices with capacitive multi-touch screen display:
19" display, resolution: 1920 x 1080 pixels
22" display, resolution: 1920 x 1080 pixels
24" display, resolution: 1920 x 1080 pixels
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Product description

1.3 Applications

User-friendly application scenarios for commissioning, use and service
High flexibility and expandability thanks to integrated interfaces and up to 2 slots (PCI and
PCI Express)
Pre-installed and activated operating system
Fast restoration of delivery state of the operating system (with supplied data storage
medium)
Gbit LAN with teaming capability (3 x LAN 10/100/1000 Mbps connections)
Service-friendly equipment design (modifications, service)
Can be used flexibly in a wide variety of positions
1.3 Applications
The device offers industrial PC systems for high-performance and space-saving applications in particular for manufacturers in the field of machine, plant and control cabinet engineering:
Operating, process and visualization applications
Industrial image processing
Quality assurance and monitoring tasks
Measurement, control and rule-based tasks
Data acquisition and management
The SIMATIC IPC has the CE mark for use in industrial environments.
SIMATIC IPC677E Operating Instructions, 04/2019, A5E45117996-AA
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Product description
Removable drives
Slots for removable drives
RAID status indicators
HDD alarm
Battery compartment
CMOS backup battery
Front fan

1.4 External design of the device

1.4 External design of the device

1.4.1 Side view, right

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Product description
device is switched on with the on/off switch. You then do not need to press the on/off button.
4 status LEDs
Status display of the status indicators (Page 19)
COM1 X30
Serial interface
DVI/VGA X70
DVI-D connection for CRT or LCD monitor with DVI port
X71/X72
1.4 External design of the device

1.4.2 Side view, left

Connection side
On/off button The on/off button has three functions:
Switch on the PC: Briefly press once
Shut down operating system and switch off PC: Briefly press once
Switch off PC without shutting down the operating system (hardware reset): Press for more
than 4 seconds.
Note: The BIOS setup entry "After Power Failure" has been set to "Power On". This means the
DisplayPort
3 × Ethernet
X1P1/X2P1/X3P1
DisplayPort connection for digital monitor
X1P1, left: RJ45 Ethernet port 1 (exclusive PCI interrupt) with 10/100/1000 Mbps, iAMT ca- pable
X2P1, center: RJ45 Ethernet port 2 (shared PCI interrupt) with 10/100/1000 Mbps
X3P1, right: RJ45 Ethernet port 3 (shared PCI interrupt) with 10/100/1000 Mbps
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Product description
2 × USB X61/X63
USB 3.1 GEN 2 Type C high current, backward compatible with USB 3.0/2.0/1.1
2 × USB X60/X62
USB 3.1 GEN 2 Type A high current, backward compatible with USB 3.0/2.0/1.1
2 × USB X64/X65
USB 3.1 GEN 2 Type A high current, backward compatible with USB 3.0/2.0/1.1
strain relief
V AC
symbol is pressed inward on the device. Position "OFF" is the delivery state.
al)
1.4 External design of the device
Fixing screws for
100 V AC to 240
On/off switch You switch on the device with the on/off switch. This requires that the BIOS setup entry "After
PCI/PCIe expan-
sion cards, USB on expan-
sion card (option-
Power supply connection
Power Failure" is set to "Power On". The on/off switch does not isolate the device from the power supply. Position "ON", when the "-)"
2 slots for expansion cards (Slot1/X101, Slot2/X102)
SIMATIC IPC677E
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Product description
Position
Status indicator
Color
Description
Off - Green
BIOS ready to boot
green/yellow (1 Hz)
Yellow
Idle state
Flashing red (1 Hz)
Watchdog status display: active
Off - Green
Can be controlled by user program
(e.g. SoftPLC)
Off - Red
-
program (e.g. SoftPLC)
Off - Yellow
-
(e.g. SoftPLC)
1.4 External design of the device

1.4.3 Status displays

The status display consists of four multi-colored LEDs.
PC ON/WD
RUN/STOP or L1
ERROR or L2
MAINT or L3
Flashing
Yellow Can be controlled by controller program
Flashing red Can be controlled by user program or controller
Red Can be controlled by controller program
BIOS in POST, power switch on
For additional information on controlling the LEDs or the NVRAM with a Windows operating system, please refer to "Buffer memory NVRAM (optional) (Page 69)". Example programs for controlling the LEDs under Windows operating systems are available on the Internet at the following address: Technical support (https://support.industry.siemens.com/cs/ww/en/)
SIMATIC IPC677E Operating Instructions, 04/2019, A5E45117996-AA
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Product description
Display
Meaning
Color
Description
Both off
RAID is OK
up red
up red
RAID system in the RAID software".
Both flash
RAID is synchronized
Status indicator
Status
Meaning of the status
Off
10 Mbps
Lit green
100 Mbps
Lit orange
1000 Mbps
Lit
Connection exists
1.4 External design of the device
RAID status indicators in removable drive bay
Status indicator position, see also Side view, right (Page 16).
LED "HDDx ALARM"
Ethernet status indicators
HDD alarm in connection with RAID and moni­toring software
LED ① lights
LED ② lights
Both light up red
HDD1 is not OK
HDD2 is not OK
RAID is not OK For information on locating the hard disk, see
section "Displaying a defective hard disk of a
LED 1
LED 2
SIMATIC IPC677E
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Flashes Activity
Product description
100 V AC to 240 V AC power supply
Slots for removable drives
Expansion card slots
Heat sink of the processor
Expansion card slots
Motherboard
Slots for memory modules
Retainer for expansion cards

1.5 Internal design of the device

1.5 Internal design of the device
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Product description

1.6 Accessories and spare parts

1.6 Accessories and spare parts

1.6.1 Accessories: Hardware

Accessories from Siemens are available for your device that are not included in the scope of delivery.
Obtaining accessories and original spare parts via the SIEMENS Industry Mall
1. On the Internet, go to Industry Mall (https://mall.industry.siemens.com).
2. Log in with your customer data.
3. Select your user language.
4. Go to your device in the product catalog (tree structure on left):
"Automation technology > PC-based Automation > Industrial PC > Box PC> ..."
5. In the tree structure on the left, click on: SIMATIC IPC677E.
6. Select the "Accessories" tab in the display area.
SIEMENS spare parts services
Information on ordering, the provision and delivery of spare parts can be found under "Industry Online Support: Spare parts services (http://support.automation.siemens.com/WW/view/en/16611927)".
SIMATIC IPC677E
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Product description
Software
Description
(https://mall.industry.siemens.com).
Processors of the type i7 offer iAMT functionality.
1.6 Accessories and spare parts

1.6.2 Accessories: Software

The following software products, among others, can be additionally ordered for your device:
SIMATIC IPC Image & Partition Cre­ator
SIMATIC IPC DiagMonitor The SIMATIC IPC DiagMonitor software offers additional
SIMATIC IPC Remote Manager The SIMATIC IPC Remote Manager enables the use of Intel®
This tool provides convenient and efficient functions for back­ing up and restoring the full content of memory cards, hard disks and individual partitions (images).
The SIMATIC IPC Image & Partition Creator can be ordered using the Siemens online ordering system
alarm and linking options in addition to the local monitoring functions of the SIMATIC IPC DiagBase software and in­cludes:
The software for the stations to be monitored.
A library for creating user-specific applications.
Active Management Technology (Intel® AMT). Remote access to SIMATIC IPCs enables, for example, sys-
tem or program errors to be corrected as well as firm­ware/BIOS and program updates to be performed from a control room (without deployment in the field).
Access is possible even if the operating system no longer starts.
Further information on the software products and references to the online catalog and ordering system (Industry Mall) can be found on the SIMATIC IPC software (http://www.automation.siemens.com/mcms/pc-based-automation/en/industrial-
pc/expansion_components_accessories) homepage.
See also
Industry Mall (https://mall.industry.siemens.com)
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Product description
1.6 Accessories and spare parts
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2
WARNING
The installer of the system is responsible for the safety of a system in which the device is integrated.
WARNING
Risk of electric shock
DANGER
Risk of lightning strikes

2.1 General safety instructions

There is a risk of malfunction which could result in death or serious injury.
Ensure that only suitably qualified personnel perform the work.
Risk due to electric shock
Risk of lightning strikes
The on/off button and on/off switch do not fully disconnect the device from the supply voltage.
There is also a risk of fire if the device or connecting lines are damaged.
Always fully disconnect the device from the supply voltage before performing work on the device or when the device will not be used over an extended period of time.
For control cabinet mounting: Use a central, easily accessible AC circuit breaker close to the device, if possible.
When you install the device, make sure that the power supply connector is easily accessible.
A lightning flash may enter the mains cables and data transmission cables and jump to a person.
Death, serious injury and burns may result.
Disconnect the device from the power supply in good time when a thunderstorm is approaching.
Do not touch power cables and data transmission cables during a thunderstorm.
Keep sufficient distance from electric cables, distributors, systems, etc.
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Safety instructions
NOTICE
Possible functional restrictions in case of non-validated plant operation
Note Burn-in effect and backlighting The brightness of the backlighting deteriorates over the course of the screen's life cycle. A
permanent picture with bright screen objects leads to a burn
Note Defective pixels in the display The manufacturing process of modern displays does not currently guarantee that all pixels of
the display are perfect. It is therefore inevitable that the display will contain a of defective pixels. This does not limit the function in any way provided the defective pixels are not all in one location.
Note Use in an industrial environment without additional protective measures This device was designed for use in a normal industrial environment according to
IEC
NOTICE
Electrostatic sensitive devices (ESD)
2.1 General safety instructions
Avoiding functional restrictions
The device is tested and certified on the basis of the technical standards. In rare cases, functional restrictions can occur during plant operation.
Validate the correct functioning of the plant to avoid functional restrictions.
TFT displays
-in effect.
Use a screen saver to extend the life of the screen and the backlighting and to prevent
the burn-in effect.
Use in industrial environments
60721-3-3.
ESD directive
Electrostatic sensitive devices can be labeled with an appropriate symbol.
small number
The device contains electronic components which may be destroyed by electrostatic charge. This can result in malfunctions and damage to the machine or plant.
Take corresponding precautionary measures before you open the device.
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Safety instructions
NOTICE
Damage to the device during transport and storage
WARNING
Electric shock and fire hazard due to damaged device
NOTICE
Damage from condensation

2.2 Note on transport and storage

2.2 Note on transport and storage
Damage caused by transportation and storage
If a device is transported or stored without packaging, shocks, vibrations, pressure and moisture may impact the unprotected unit. Damaged packaging indicates that ambient conditions have already had a massive impact on the device and it may be damaged.
This may cause the device, machine or plant to malfunction.
Keep the original packaging.
Pack the device in the original packaging for transportation and storage.
Damage from condensation
A damaged device can be under hazardous voltage and trigger a fire in the machine or plant. A damaged device has unpredictable properties and states.
Death or serious injury could occur.
Avoid installing and commissioning a damaged device.
Label the damaged device and keep it locked away. Send off the device for immediate
repair.
If the device is subjected to low temperatures or extreme fluctuations in temperature during transportation, moisture could occur on or inside the HMI device (condensation).
Moisture can cause a short-circuit in electrical circuits and damage the device.
Store the device in a dry place.
Bring the device to room temperature before starting it up.
Do not expose the device to direct heat radiation from a heating device.
If condensation develops, wait approximately 12 hours or until the device is completely
dry before switching it on.
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Safety instructions
DANGER
Electrocution risk when control cabinet is open
NOTICE
Voided approvals
NOTICE
Ambient conditions and chemical resistance

2.3 Notes on mounting

2.3 Notes on mounting
Device in the control cabinet
When you open the control cabinet, there may be a dangerous voltage at certain areas or components.
Touching these areas or components can cause death or serious bodily injury.
Always disconnect the cabinet from the mains before opening it.
Ensure that the power to the control cabinet cannot be turned on accidentally.

2.4 Notes on ambient and environmental conditions

Certifications and approvals
If the following conditions for system installation are not observed, approvals in accordance with UL 61010-2-201 and EN 61010-2-201 are rendered void and there is a risk of overheating and personal injury.
You should observe the following information on ambient and environmental conditions.
Ambient and environmental conditions
Unsuitable environmental conditions can cause faults or damage the device. Failure to comply nullifies the warranty in accordance with IEC/EN/UL 61010-2-201.
Operate the device only in closed rooms.
Only operate the device in the ambient conditions specified in the technical
specifications.
Observe the permitted mounting positions of the device.
Do not obstruct the venting slots of the device.
Please note that when the device is operated in severe environments which are subject
to caustic vapors or gases, the provision of clean air is ensured.
Clean the enclosure surface with a damp cloth and make sure that no water enters the device.
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Safety instructions
CAUTION
Immunity to RF interference
2.4 Notes on ambient and environmental conditions
When you plan your project, you should make allowances for:
Take note of the climatic and mechanical ambient conditions (Page 115).
You must observe the Mounting positions (Page 37) when mounting the device.
For installation in a cabinet, observe the SIMATIC setup guidelines as well as the relevant
DIN/VDE requirements or the applicable country-specific regulations.
When the device is used in the programmable controller area in accordance with IEC/EN/UL61010-2-201, note that the device is classified as "Open Equipment". An IEC/EN/UL61010-2-201 compliant enclosure is therefore a mandatory requirement for approval or operation according to IEC/EN/UL61010-2-201.
The device must be installed in such a way that it is part of a restricted access location (e.g. a locked control cabinet, control panel or server room).
Always maintain a minimum clearance of 100 mm to the area of the ventilation slots and do not cover the ventilation slots of the enclosure.
High frequency radiation
The device has an increased immunity to RF radiation according to the specifications on electromagnetic compatibility in the technical specifications.
High frequency radiation, e g. from a cellular phone, can result in malfunctioning of the device.
Persons are injured and the plant is damaged.
Avoid high-frequency radiation.
Remove radiation sources from the environment of the device.
Switch off radiating devices.
Reduce the radio output of radiating devices.
Read the information on electromagnetic compatibility.
Read the information in the technical specifications.
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Safety instructions
CAUTION
Fault caused by I/O devices
NOTICE
Damage through regenerative feedback
Note
Checking the regenerative feedback
When

2.5 Information on I/O devices

2.5 Information on I/O devices
The connection of I/O devices can cause faults in the device.
The result may be personal injury and damage to the machine or plant.
Only connect I/O devices which are approved for industrial applications in accordance with EN 61000-6-2 and IEC 61000-6-2.
I/O devices that are not hotplug-capable may only be connected after the device has been disconnected from the power supply.
Regenerative feedback of voltage to ground by a connected or installed component can damage the device.
Connected or built-in I/Os, for example, a USB drive, are not permitted to supply any voltage to the device.
Regenerative feedback is generally not permitted.
measuring the counter emf, remember the following:
The computer in question must be turned off and the power supply connector must be
plugged in.
During the measurement, all cables from the plant to the computer should be connected. All other components in the plant must be active.
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