Siemens SIMATIC IPC677D Operating Instructions Manual

SIMATIC IPC677D

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SIMATIC
Operating Instructions
09/2014
A5E32995420
Preface
Overview
1
Safety instructions
2
Mounting and connecting the device
3
Commissioning the device
4
Operating the device and device functions
5
Expanding the device and assigning device parameters
6
Maintaining and servicing your device
7
Technical information
8
Technical support
A
List of abbreviations
B
-AC
Siemens AG Industry Sector Postfach 48 48 90026 NÜRNBERG GERMANY
A5E32995420-AC
Copyright © Siemens AG 2014. All rights reserved

Legal information

Warning notice system
DANGER
indicates that death or severe personal injury will result if proper precautions are not taken.
WARNING
indicates that death or severe personal injury may result if proper precautions are not taken.
CAUTION
indicates that minor personal injury can result if proper precautions are not taken.
NOTICE
indicates that property damage can result if proper precautions are not taken.
Qualified Personnel
personnel qualified
Proper use of Siemens products
WARNING
Siemens products may only be used for the applications described in the catalog and in the relevant technical
maintenance are required to ensure that the products operate safely and without any problems. The permissible ambient conditions must be complied with. The information in the relevant documentation must be observed.
Trademarks
Disclaimer of Liability
This manual contains notices you have to observe in order to ensure your personal safety, as well as to prevent damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are graded according to the degree of danger.
If more than one degree of danger is present, the warning notice representing the highest degree of danger will be used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to property damage.
The product/system described in this documentation may be operated only by task in accordance with the relevant documentation, in particular its warning notices and safety instructions. Qualified personnel are those who, based on their training and experience, are capable of identifying risks and avoiding potential hazards when working with these products/systems.
Note the following:
documentation. If products and components from other manufacturers are used, these must be recommended or approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and
All names identified by ® are registered trademarks of Siemens AG. The remaining trademarks in this publication may be trademarks whose use by third parties for their own purposes could violate the rights of the owner.
We have reviewed the contents of this publication to ensure consistency with the hardware and software described. Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the information in this publication is reviewed regularly and any necessary corrections are included in subsequent editions.
for the specific
09/2014 Subject to change

Preface

Purpose of the operating instructions
Basic knowledge required
Scope of the operating instructions
Scope of the documentation
These operating instructions contain all the information you need for commissioning and operating the SIMATIC IPC677D.
It is intended both for programming and testing personnel who commission the device and connect it with other units (automation systems, programming devices), as well as for service and maintenance personnel who install add-ons or carry out fault/error analyses.
A solid background in personal computers and Microsoft operating systems is required to understand this manual. General knowledge in the field automation control engineering is recommended.
These operating instructions apply to devices with the following order numbers 6AV7260.....
The documentation for the IPC includes the following:
SIMATIC IPC677D Quick Install Guide with product information about the device, for example important notes
SIMATIC IPC677D operating instructions
The documentation is supplied with the IPC in German and English in electronic form as a PDF file on the Documentation and Drivers CD/DVD.
SIMATIC IPC677D Operating Instructions, 09/2014, A5E32995420-AC
3
Preface
Conventions
Note
A note is important information about the product, handling the product or a re specific sections of the documentation that require special consideration.
History
Edition
Comments
12/2013
First edition
06/2014
Description of devices with capacitive multi-touch screen
Update with IPC Wizard 2.1 and corrections
See also
In these operating instructions, the term "device" is also used to refer to the "SIMATIC IPC677D".
The SIMATIC IPC677D consists of an operator panel with touch screen and a SIMATIC IPC627D computer unit. In these operating instructions, you also find descriptions and illustrations of the SIMATIC IPC627D which apply to the SIMATIC IPC677D.
"CP" is used as an abbreviation for "CP 1616 onboard" (for PROFINET) or "CP 5622" (for PROFIBUS).
In these operating instructions, "Windows Embedded Standard" is also used as a standard term for "Windows Embedded Standard 7". "Windows 7" is used as an abbreviation for "Windows 7 Ultimate".
A touch device generally refers to a device with a capacitive touch screen or a resistive touch screen. Touch screen is the general term for a capacitive multi-touch screen and resistive single touch screen.
ference to
The following editions of these operating instructions have already been published:
09/2014 Revision: HDD in a removable drive bay and RAID
Technical specifications (Page 121)
Certificates and approvals (Page 111)
SIMATIC IPC677D
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Table of contents

Preface ................................................................................................................................................... 3
1 Overview................................................................................................................................................. 9
2 Safety instructions ................................................................................................................................. 19
3 Mounting and connecting the device ..................................................................................................... 25
4 Commissioning the device .................................................................................................................... 49
1.1 Product description ................................................................................................................... 9
1.1.1 Applications ............................................................................................................................. 11
1.1.2 Features .................................................................................................................................. 11
1.2 Design of the device ............................................................................................................... 14
1.2.1 Operator controls and interfaces ............................................................................................ 14
1.2.2 Status displays ........................................................................................................................ 16
1.2.3 PROFINET status displays ..................................................................................................... 17
1.3 Accessories ............................................................................................................................. 18
2.1 General safety instructions ..................................................................................................... 19
2.2 Notes on usage ....................................................................................................................... 22
3.1 Preparing for mounting ........................................................................................................... 25
3.1.1 Checking the delivery package ............................................................................................... 25
3.1.2 Device identification data ........................................................................................................ 26
3.1.3 Permitted mounting positions ................................................................................................. 28
3.1.4 Preparing the mounting cutout ................................................................................................ 29
3.2 Mounting the device ................................................................................................................ 31
3.2.1 Installation guidelines.............................................................................................................. 31
3.2.2 Mounting clips or mounting brackets, position for IP65 .......................................................... 33
3.2.3 Mounting the device with mounting clips ................................................................................ 34
3.2.4 Mounting the device with mounting brackets .......................................................................... 35
3.2.5 Position of the mounting clips for IP66 ................................................................................... 37
3.3 Connecting the device ............................................................................................................ 37
3.3.1 Wiring information ................................................................................................................... 37
3.3.2 Connecting the Equipotential Bonding Circuit ........................................................................ 38
3.3.3 Connecting 100-240 VAC power supply ................................................................................. 39
3.3.4 Connecting the 24 VDC power supply .................................................................................... 41
3.3.5 Connecting peripheral equipment ........................................................................................... 43
3.3.6 Connecting the device to networks ......................................................................................... 44
3.3.7 PROFINET .............................................................................................................................. 45
3.3.8 Connecting Ethernet/USB strain relief .................................................................................... 46
3.3.9 Connecting the PROFINET strain relief .................................................................................. 47
4.1 General information on commissioning .................................................................................. 49
4.2 Switching on the device .......................................................................................................... 50
4.3 Windows Action Center........................................................................................................... 51
4.4 Notes on different device configurations................................................................................. 51
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Table of contents
5 Operating the device and device functions ............................................................................................ 55
6 Expanding the device and assigning device parameters ........................................................................ 69
7 Maintaining and servicing your device ................................................................................................... 81
4.4.1 RAID1 system (optional) ........................................................................................................ 51
4.4.2 Notes on the DVD burner ....................................................................................................... 53
4.5 Switching off the device ......................................................................................................... 53
5.1 Operator input options ........................................................................................................... 55
5.2 Operating a device with resistive single touch screen ........................................................... 56
5.3 Operating a device with capacitive multi-touch screen .......................................................... 57
5.4 IPC Wizard functions ............................................................................................................. 59
5.5 Extended device functions ..................................................................................................... 59
5.5.1 Monitoring functions ............................................................................................................... 59
5.5.1.1 Overview of the monitoring functions ..................................................................................... 59
5.5.1.2 Temperature monitoring/display ............................................................................................ 60
5.5.1.3 Watchdog (WD)...................................................................................................................... 61
5.5.1.4 Battery monitoring .................................................................................................................. 62
5.5.2 Enhanced Write Filter (EWF) ................................................................................................. 62
5.5.3 File Based Write Filter (FBWF) .............................................................................................. 64
5.5.4 Buffer memory SRAM (optional) ............................................................................................ 66
5.5.5 Active Management Technology (AMT) ................................................................................ 66
5.5.6 Trusted Platform Modul (TPM) ............................................................................................... 67
6.1 Opening the Device ............................................................................................................... 69
6.2 Expanding memory ................................................................................................................ 70
6.3 Expansion cards..................................................................................................................... 72
6.3.1 Notes on the expansion cards ............................................................................................... 72
6.3.2 Removing and installing expansion cards ............................................................................. 72
6.4 Drives ..................................................................................................................................... 74
6.4.1 Installation options for internal drives .................................................................................... 74
6.4.2 Removing and installing the drive bay module ...................................................................... 75
6.4.3 Removing and installing hard disks ....................................................................................... 75
6.4.4 Removing and installing an SSD drive .................................................................................. 77
6.4.5 Installation options for external drives ................................................................................... 78
6.4.6 Removing and installing a DVD drive .................................................................................... 79
7.1 Maintenance ........................................................................................................................... 81
7.2 Managing RAID systems ....................................................................................................... 81
7.2.1 Example for a RAID1 system during the boot phase of the system ...................................... 81
7.2.2 RAID software ........................................................................................................................ 82
7.2.3 Checking the status of the RAID system ............................................................................... 82
7.2.4 Displaying a defective hard disk of a RAID system in the RAID software ............................. 83
7.2.5 Special feature: Replacing hard disk in the RAID system when switched off ....................... 83
7.2.6 Integrating a new hard disk drive in the RAID system ........................................................... 84
7.3 Service and spare parts ......................................................................................................... 86
7.4 Cleaning the Device Front ..................................................................................................... 88
7.5 Separating the control unit from the computer unit ................................................................ 89
7.6 Connecting the control unit with the computer unit ................................................................ 90
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Table of contents
8 Technical information .......................................................................................................................... 111
7.7 Removing and installing hardware .......................................................................................... 91
7.7.1 Replacing a defective hard disk drive in the RAID system ..................................................... 91
7.7.2 Removing and installing the hard disk in the removable drive bay ........................................ 92
7.7.3 Replacing the Backup Battery ................................................................................................ 93
7.7.4 Removing and installing the power supply ............................................................................. 95
7.7.5 Removing and installing the bus board ................................................................................... 96
7.7.6 Removing and installing the power supply fan ....................................................................... 97
7.7.7 Removing and installing the device fan .................................................................................. 99
7.7.8 Replacing the processor ....................................................................................................... 100
7.8 Installing the software ........................................................................................................... 102
7.8.1 Sources for installation of the operating system ................................................................... 102
7.8.2 Updating the operating system ............................................................................................. 102
7.8.3 Installing drivers and software .............................................................................................. 103
7.8.4 Installing Windows 7 ............................................................................................................. 103
7.8.5 Setting up the language selection by means of the Multilanguage User Interface (MUI) .... 108
7.8.6 Recovery DVD languages .................................................................................................... 109
7.8.7 Installing the RAID controller software .................................................................................. 109
7.8.8 Update installation ................................................................................................................ 109
7.8.8.1 Updating the operating system ............................................................................................. 109
7.8.8.2 Installing or updating application programs and drivers ....................................................... 110
7.8.8.3 CP 1616 onboard .................................................................................................................. 110
7.8.9 Backing up data .................................................................................................................... 110
7.8.9.1 Creating an image ................................................................................................................. 110
7.9 Recycling and disposal ......................................................................................................... 110
8.1 Certificates and approvals .................................................................................................... 111
8.2 Directives and declarations ................................................................................................... 112
8.2.1 CE marking ........................................................................................................................... 112
8.2.2 ESD guideline ....................................................................................................................... 113
8.3 Dimension drawings .............................................................................................................. 115
8.3.1 Dimension drawing of 15" device with capacitive multi-touch screen .................................. 115
8.3.2 Dimension drawing of 19" device with capacitive multi-touch screen .................................. 116
8.3.3 Dimension drawing of 22" device with capacitive multi-touch screen .................................. 117
8.3.4 Dimension drawing of 15" device with resistive single touch screen .................................... 118
8.3.5 Dimension drawing of 19" device with resistive single touch screen .................................... 119
8.3.6 Dimension drawing of 22" device with resistive single touch screen .................................... 120
8.3.7 Dimensional drawing for the installation of expansion modules ........................................... 121
8.4 Technical specifications ........................................................................................................ 121
8.4.1 General technical specifications ........................................................................................... 121
8.4.2 Ambient conditions ................................................................................................................ 125
8.4.3 Current and power requirements .......................................................................................... 126
8.4.4 AC voltage supply ................................................................................................................. 127
8.4.5 DC power supply ................................................................................................................... 128
8.5 Hardware descriptions .......................................................................................................... 129
8.5.1 Motherboard .......................................................................................................................... 129
8.5.1.1 Structure and functions of the motherboard ......................................................................... 129
8.5.1.2 Position of the interfaces on the motherboard ...................................................................... 130
8.5.1.3 Internal interfaces ................................................................................................................. 131
8.5.1.4 Front ports ............................................................................................................................. 132
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Table of contents
A Technical support................................................................................................................................. 173
B List of abbreviations ............................................................................................................................. 177
Glossary .............................................................................................................................................. 183
Index ................................................................................................................................................... 191
8.5.2 Bus board ............................................................................................................................. 133
8.5.2.1 Layout and principle of operation ......................................................................................... 133
8.5.2.2 PCI slot pin assignment ....................................................................................................... 134
8.5.2.3 Pin assignment 12 V power supply connection for expansion cards................................... 136
8.5.2.4 PCI Express slot x16 pin assignment .................................................................................. 136
8.5.3 External ports ....................................................................................................................... 138
8.5.3.1 COM1/COM2 ....................................................................................................................... 138
8.5.3.2 DisplayPort ........................................................................................................................... 139
8.5.3.3 DVI-I ..................................................................................................................................... 140
8.5.3.4 Ethernet ................................................................................................................................ 141
8.5.3.5 USB 3.0 ................................................................................................................................ 141
8.5.3.6 PROFIBUS ........................................................................................................................... 142
8.5.3.7 PROFINET ........................................................................................................................... 142
8.5.4 System resources ................................................................................................................ 143
8.5.4.1 Currently allocated system resources .................................................................................. 143
8.5.4.2 System resources used by the BIOS/DOS .......................................................................... 143
8.5.5 CP 1616 onboard communications processor ..................................................................... 149
8.5.5.1 Properties ............................................................................................................................. 149
8.5.5.2 Typical Communication Partners ......................................................................................... 149
8.5.5.3 Firmware Loader .................................................................................................................. 151
8.5.5.4 Further actions in STEP 7/NCM PC..................................................................................... 153
8.6 BIOS description .................................................................................................................. 153
8.6.1 Overview .............................................................................................................................. 153
8.6.2 Opening the BIOS selection menu....................................................................................... 154
8.6.3 Configuration ........................................................................................................................ 155
8.6.4 Exit menu ............................................................................................................................. 157
8.6.5 General BIOS Setup settings ............................................................................................... 157
8.6.6 BIOS update ......................................................................................................................... 162
8.6.7 Alarm, error and system messages ..................................................................................... 163
8.7 Active Management Technology (AMT) .............................................................................. 164
8.7.1 Introduction .......................................................................................................................... 164
8.7.2 Overview of AMT.................................................................................................................. 165
8.7.3 Enabling Intel® AMT / basic configuration ........................................................................... 166
8.7.4 Resetting the Intel® AMT to the default settings and disabling AMT .................................. 168
8.7.5 Determining the network address ........................................................................................ 169
8.7.6 Forcing user consent ........................................................................................................... 169
8.8
Functional scope in Windows ................................
.............................................................. 170
8.8.1 Windows Embedded Standard 7 Professional .................................................................... 170
A.1 Service and support ............................................................................................................. 173
A.2 Troubleshooting ................................................................................................................... 174
A.3 Notes on the use of third-party modules .............................................................................. 176
SIMATIC IPC677D
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1
1.1

Product description

Devices with capacitive multi-touch screen
Devices with resistive single touch screen
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9
Overview
Features
Device variants
Devices with capacitive multi-touch screen
Devices with resistive single touch screen
Operating systems
1.1 Product description
The SIMATIC IPC677D provides high-level industrial functionality.
Compact design
Maintenance-free operation
Rugged
The color display is equipped with TFT technology in widescreen format and LED backlighting.
Device with a resistive single touch screen comes with a front-side USB port for connection of external peripheral devices.
The delivery note contains information on the precise scope of functions and product package for your device.
The SIMATIC IPC677D is available in the following device variants, which differ in regard to the display size, operating method and optional expansions.
Display:
Display:
The following operating systems are approved for the devices:
Windows 7 Ultimate (32/64-bit)
Windows Embedded Standard 7 P (32/64-bit)
– 15'' display, resolution 1366 × 768 pixels
– 19'' display, resolution 1366 × 768 pixels
– 22'' display, resolution 1920 × 1080 pixels
– 15" display, resolution 1280 × 800 pixels
– 19'' display, resolution 1366 × 768 pixels
– 22'' display, resolution 1920 × 1080 pixels
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Overview
1.1.1

Applications

1.1.2

Features

Basic data
Installation
In control cabinet
slots
Gen 3: 8 GT/s (985 Mbps) bandwidth per lane
1.1 Product description
The device are available for industrial PC systems for high-performance and space-saving applications in particular in the field of machine, plant and control cabinet engineering:
Measuring and controlling process and machine data, for example, automated washing systems, assembling machines and packaging machines
Operating and visualization tasks, for example, information terminals and large-scale displays in automobile manufacturing
Data logging and processing, for example, system data logging and distributed process control
Processor
Main memory
Equipment options with ex­pansion cards
Maximum bandwidth of PCI
Maximum bandwidth of PCI slots
Intel Xeon E3-1268L v3 2.3 (3.3) GHz, 4 cores, GT2, 8 MB cache, HT
Intel Core i3-4330TE 2.4 GHz, 2 cores, GT2, 3 MB cache, AMT
Intel Celeron G1820TE 2.2 GHz, 2 cores, GT1, 2 MB cache
Maximum memory configuration 16 GB with the following memory modules:
without ECC:
2 GB DDR3 SDRAM
4 GB DDR3 SDRAM
8 GB DDR3 SDRAM
with ECC:
4 GB DDR3 ECC
8 GB DDR3 ECC
2 × PCI
1 × PCI, 1 × PCIe x16 Gen3
1 × PCIe x4 Gen2, 1 × PCIe x16 Gen3
133 Mbps
Gen 2: 5 GT/s (500 Mbps) bandwidth per lane
Graphics
SIMATIC IPC677D Operating Instructions, 09/2014, A5E32995420-AC
Intel® HD Graphics Controller P4600/4700 GT1/GT2 2D and 3D engine integrated in chipset Dynamic Video Memory Technology (requires up to 512 MB in main memory)
DVI resolution of 640 × 480 pixels up to 1920 × 1200 pixels
Graphics memory is claimed in main memory (dynamic UMA)
Triple Head Mode
11
Overview
Basic data
connection.
Drives and storage media
SSD (Solid State Disk)
2.5" ≥ 240 GB Standard
USB stick
External, can be connected via USB port
Interfaces
Wake on LAN, Remote Boot and teaming are supported:
PROFIBUS/MPI
12 Mbps, electrically isolated, compatible with CP 5622, optional
PROFINET
3 × 10/100 bps, CP 1616 on-board, RJ45, optional
COM
Serial V.24 port
COM2/LPT
optional
1.1 Product description
DisplayPort resolutions depend on the graphics controller in the CPU,
which is represented by the processor:
Celeron G1820TE: GT1 (HD Graphics), maximum resolutions up to 2560 × 1600
Core I3-4330TE: GT2 (HD Graphics 4600), maximum resolutions up to 3840 × 2160
XEON E3-1268L v3: GT2 (HD Graphics 4600) maximum resolutions up to 3840 × 2160
Power supply
120 V / 230 VAC, 190 W; wide range
24 VDC, 210 W
AC and DC power supply with short-term power failure backup in accordance with NAMUR: maximum of 20 ms at 0.85 rated voltage.
The 24 VDC power supply is protected against reverse polarity
Hard disk
1 × 3.5" ≥ 250 GB, SATA
2 × 2.5" ≥ 250 GB, SATA only with
RAID1 system for automatic data mirroring on two hard disks
DVD drive DVD burner (slimline), optional
DVD+/-R/RW, CD, CD-RW, DVD-RAM
Double layer functionality
Ethernet 2 × 10/100/1000 Mbps, (2 x RJ45)
USB
Front: 1 × USB 3.0 high current
(only for devices with resistive single touch screen)
External: 4 × USB 3.0 high current (a maximum of 2 can be operated as high current at the same time)
External, optional: 1 × USB 2.0 high current, 1 × low current
Internal: 1 × USB 3.0 high current for internal USB stick/dongle
Monitor
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1 x DVI-I (VGA monitors can be connected with a DVI/VGA adapter acquired separately)
1 x DisplayPort
Overview
Software
1)
nese)
Optional software
Creator V3.3.2 or higher
partitioning
1.1 Product description
Operating systems
Without
Preinstalled / supplied on Restore CD/DVD:
1
– Windows 7 Ultimate 32 bit – Windows 7 Ultimate 64 bit1 – Windows Embedded Standard 7/P 32-bit) 1
MUI: Multi language user interface; 6 languages (English, German, French, Spanish, Italian, Chi-
SIMATIC IPC DiagMonitor V4.4.2 or higher
Software tool for local as well as remote monitoring of SIMATIC PCs:
Watchdog
Temperature
Fan speed
Hard disk monitoring (SMART)
Communication:
Ethernet interface (SNMP protocol)
OPC for integrating in SIMATIC software
Client server architecture
Structure of log files
SIMATIC IPC Image & Partition
Software tool for local data backup and hard disk
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Overview
1.2
Design of the device
1.2.1

Operator controls and interfaces

Device with PROFIBUS interface
Position "OFF" is the factory state.
100-240 VAC
Power supply connection
4 × USB
USB 3.0 high current, backward compatible with USB 2.0/1.1
COM1
Serial interface
DisplayPort
DisplayPort connection for digital monitor
DVI-I
DVI connector for CRT or LCD monitor with DVI port
(optional)
switch. You then do not need to press the on/off button.
4 status LEDs
Status display of the operating state

1.2 Design of the device

PROFIBUS DP/MPI
fieldbus
On/off switch You switch on the device with the on/off switch. This requires that the
PROFIBUS DP/MPI interface (RS 485, isolated), 9-pin sub D socket
BIOS setup entry "After Power Failure" is set to "Power On". The on/off switch does not isolate the device from the power supply.
Position "ON", when the "-)" symbol is pressed inward on the device.
2 × Ethernet
PCI/PCIe expansion
cards, COM2/LPT and USB
on expansion card
On/off button The on/off button has three functions:
X1P1, left: RJ45 Ethernet port 1 (exclusive PCI interrupt) with 10/100/1000 Mbps, iAMT capable
X2P1, right: RJ45 Ethernet port 2 (shared PCI interrupt) with 10/100/1000 Mbps
behind the cover
Switch on the PC: Briefly press once
Shut down operating system and switch off PC: Briefly press once
Switch off PC without shutting down the operating system (hardware
reset): Press for more than 4 seconds.
Note: The BIOS setup entry "After Power Failure" has been set to "Power On". This means the device is switched on with the on/off
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Overview
Device with PROFINET interface
CP 1616 onboard interface, three RJ45 sockets for devices with PROFINET, IRT capable
Device with COM2/LPT and USB expansion (optional)
LPT
COM
USB
Devices with resistive single-touch screen
Note
If you open the front of the device is no longer guaranteed.
1.2 Design of the device
The following PROFINET interface is located at the position of the PROFIBUS interface in the figure above:
The following expansion cards are located at the position of the cover in the figure above:
sealed cover for the front USB port, the degree of protection IP65 for the
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Overview
1.2.2

Status displays

Position
LED
State
Description
Off
-
Green
BIOS ready to boot
(1 Hz)
Yellow
Idle state
Flashing red (1 Hz)
Watchdog status display: active
Off
-
Green
Can be controlled by user program
(e.g. WinAC)
Off
-
Red
-
Off
-
Yellow
-
(e.g. WinAC)
1.2 Design of the device
The status display consists of four two-colored LEDs.
PC ON/WD
RUN/STOP / L1
ERROR / L2
MAINT / L3
Flashing green/yellow
Yellow Can be controlled by controller program
Flashing red Can be controlled by user program or controller
Red Can be controlled by controller program
BIOS in POST, power switch on
program (e.g. WinAC)
For additional information on controlling the LEDs or the SRAM with a Windows operating system, please refer to the chapter "Buffer memory SRAM (optional) (Page 66)". Example programs for controlling the LEDs under Windows operating systems is available on the Internet at the following address: Technical Support (http://www.siemens.de/automation/csi_en_WW)
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Overview
1.2.3

PROFINET status displays

PROFINET status display
Display
Meaning
LED
Description
Web or SNMP no longer possible
Virtual status displays
SNMP.
RUN
CP is active
STOP
CP is in the stop state
"fast flashing" states.
See also
1.3 Accessories
SF
PROFINET, optional
The two "virtual" CP 1616 LEDs can only be seen in the SIMATIC software and can be scanned via
Status display for CP 1616 onboard
OFF
Slow flashing
Fast flashing Exception error: Diagnostics via
AN
CP not available
CP disabled
No error, communication
established
Download in progress
Link status error
IO controller: IO device cannot
be addressed
IO controller: Duplicate IP address
Diagnostic information available
No communication established.
SIMATIC IPC677D Operating Instructions, 09/2014, A5E32995420-AC
PROFINET Virtual LEDs
Flashes There are no "slow flashing" or
Industry Automation and Drive Technologies - Homepage (http://www.siemens.com/automation/service&support)
17
Overview
1.3
Accessories
Other accessories

1.3 Accessories

Accessories are available for your device. These are not included in the product package. You can find Information on available accessories on the Internet at:
Industry Mall (https://mall.industry.siemens.com)
Expansion components and accessories (http://www.automation.siemens.com/mcms/pc-
based-automation/en/industrial-pc/expansion_components_accessories)
Touch stylus for devices with resistive single touch screen
Mounting bracket
If there are strict requirements for the front seal, fasten the device in a cabinet with mounting brackets.
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2
2.1

General safety instructions

WARNING
Life-threatening voltages are present with an open control cabinet
System expansions
NOTICE
Damage through system expansions
NOTICE
"Open Type" UL508
When you install the device in a control cabinet, some areas or components in the open control cabinet may be carrying life-threatening voltages.
If you touch these areas or components, you may be killed by electric shock.
Switch off the power supply to the cabinet before opening it.
Device and system expansions may be faulty and can affect the entire machine or plant.
The installation of expansions can damage the device, machine or plant. Device and system expansions may violate safety rules and regulations regarding radio interference suppression. If you install or exchange system expansions and damage your device, the warranty becomes void.
Note the following for system expansions:
Only install system expansion devices designed for this device. Contact your technical
Observe the information on electromagnetic compatibility (Page 112).
Note that the device is classified as "Open Type" for use in the area of Industrial Control Equipment (UL508). Installation of the device in an enclosure complying with UL508 for specific permitted mounting positions (see corresponding section) is a prerequisite for approval or operation in accordance with UL508.
support team or where you purchased your PC to find out which system expansion devices may safely be installed.
SIMATIC IPC677D Operating Instructions, 09/2014, A5E32995420-AC
19
Safety instructions
WARNING
Risk of fire through expansion cards
Battery and rechargeable battery
WARNING
Risk of explosion and release of harmful substances
High frequency radiation
NOTICE
Unintentional operating situations
2.1 General safety instructions
Expansion cards generate additional heat. The device may overheat and cause a fire.
Please note the following:
Observe the safety and installation instructions for the expansion cards.
If in doubt, install the device in an enclosure that is compliant with sections 4.6 and 4.7.3
of the IEC/EN/DIN-EN 60950-1 standard.
Improper handling of lithium batteries can result in an explosion of the batteries.
Explosion of the batteries and the released pollutants can cause severe physical injury. Worn batteries jeopardize the function of the device.
Note the following when handling lithium batteries:
Replace used batteries in good time; see the section "Replacing the backup battery" in the operating instructions.
Replace the lithium battery only with an identical battery or types recommended by the manufacturer (order no.: A5E00331143).
Do not throw lithium batteries into fire, do not solder on the cell body, do not recharge, do not open, do not short-circuit, do not reverse polarity, do not heat above 100°C and protect from direct sunlight, moisture and condensation.
High frequency radiation, e g. from a cellular phone, interferes with device functions and can result in malfunctioning of the device.
Persons are injured and the plant is damaged.
Avoid high-frequency radiation:
Remove radiation sources from the environment of the device.
Switch off radiating devices.
Reduce the radio output of radiating devices.
Observe the information on electromagnetic compatibility (Page 112).
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Safety instructions
ESD Guideline
NOTICE
Electrostatic sensitive devices (ESD)
Industrial Security
Disclaimer for third-party software updates
Notes on protecting administrator accounts
2.1 General safety instructions
Electrostatic sensitive devices can be labeled with an appropriate symbol.
When you touch electrostatic sensitive components, you can destroy them through voltages that are far below the human perception threshold.
If you work with components that can be destroyed by electrostatic discharge, observe the ESD Guideline (Page 113).
Siemens offers products and solutions with Industrial Security functions that support the safe operation of equipment, solutions, machines, devices and/or networks. They are important components in a comprehensive Industrial Security concept. As a result the products and solutions from Siemens are constantly evolving. Siemens recommends obtaining regular information regarding product updates.
For safe operation of Siemens products and solutions appropriate protective measures (e.g., cell protection concept) must be taken and each component must be integrated in a comprehensive Industrial Security concept, which corresponds with the current state of technology. The products of other manufacturers need to be taken into consideration if they are also used. You can find addition information on Industrial Security under (http://www.siemens.com/industrialsecurity).
Sign up for our product-specific newsletter to receive the latest information on product updates. For more information, see under (http://www.siemens.de/automation/csi_en_WW).
This product includes third-party software. Siemens AG only provides a warranty for updates/patches of the third-party software, if these have been distributed as part of a Siemens software update service contract or officially released by Siemens AG. Otherwise, updates/patches are undertaken at your own risk. You can find more information about our Software Update Service offer on the Internet at Software Update Service (http://www.automation.siemens.com/mcms/automation-software/en/software-update-
service/Pages/Default.aspx).
A user with administrator privileges has extensive access and manipulation options in the system.
Therefore, ensure there are adequate safeguards for protecting the administrator accounts to prevent unauthorized changes. To do this, use secure passwords and a standard user account for normal operation. Other measures, such as the use of security policies, should be applied as needed.
SIMATIC IPC677D Operating Instructions, 09/2014, A5E32995420-AC
21
Safety instructions
2.2
Notes on usage
NOTICE
Possible functional restrictions in case of non-validated plant operation
Environment
NOTICE
Ambient conditions and chemical resistance
Note Use in an industrial environment without additional protective measures
The device has been designed for use in a normal industrial environment in accordance with IEC contamination by sand).

2.2 Notes on usage

The device is tested and certified on the basis of the technical standards. In rare cases, functional restrictions can occur during plant operation.
Validate the correct functioning of the plant to avoid functional restrictions.
Unsuitable environmental conditions have a negative impact on device operation. Chemical substances such as cleaners or fuels may alter the color, shape and structure of the device surface, for example, the front panel.
The device may be damaged. possibly resulting in malfunctions.
For this reason, please observe the following precautions:
Always operate the device in closed rooms. All warranties shall be void in the case of noncompliance.
Operate the device only in accordance with the ambient conditions specified in the technical specifications.
Protect the device against dust, moisture and heat.
Do not expose the device to direct sunlight or to other strong sources of light.
Without additional safety measures, such as a supply of clean air, the device may not be
used in locations with harsh operating conditions caused by acidic vapors or gases.
Always use suitable cleaning agents. Read the information about Chemical resistance of the HMI devices and industrial PCs (http://support.automation.siemens.com/WW/view/en/39718396) on the Internet.
60721-3-3 (pollutant class 3C2 for chemical influences, 3S2 for dust without
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Safety instructions
TFT displays
NOTICE
Burn-in effect and backlighting
Defective pixels in the display
2.2 Notes on usage
A permanent picture with bright screen objects leads to a burn-in effect. The longer the same screen contents are displayed, the longer it will take for the burn-in effect to disappear. Screen savers reduce the risk of burn-in. The brightness of the backlighting deteriorates over the course of the screen's life cycle.
Use the "BbcScreenSaver" to extend the life of the screen and the backlighting.
At present, the manufacturing process of modern displays does not guarantee that all pixels of the display will be perfect. A small number of defective pixels in the display is therefore unavoidable. This does not present a functional problem as long as the defective pixels are not bunched in one location.
Additional information is available in the section "General technical specifications (Page 121)".
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Safety instructions
2.2 Notes on usage
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3
3.1

Preparing for mounting

3.1.1

Checking the delivery package

Procedure
Note Damage to the device during transport and storage
If a moisture may impact the unprotected unit. Damaged packaging indicates that ambient conditions have already had a massive impact on the device and it may be damaged.
This ma
WARNING
Electric shock and fire hazard due to damaged device
1. When accepting a delivery, please check the packaging for visible transport damage.
2. If any transport damage is present at the time of delivery, lodge a complaint at the shipping company in charge. Have the shipper confirm the transport damage immediately.
3. Unpack the device at its installation location.
4. Keep the original packaging in case you have to transport the unit again.
device is transported or stored without packaging, shocks, vibrations, pressure and
y cause the device, machine or plant to malfunction.
Keep the original packaging. Pack the device in the original packaging for transportation and storage.
5. Check the contents of the packaging and any accessories you may have ordered for completeness and damage.
6. Please inform the delivery service immediately if the package contents are incomplete or damaged or do not correspond with your order. Fax the enclosed form "SIMATIC IPC/PG Quality Control Report".
A damaged device can be under hazardous voltage and trigger a fire in the machine or plant. A damaged device has unpredictable properties and states.
Death or serious injury could occur.
SIMATIC IPC677D Operating Instructions, 09/2014, A5E32995420-AC
Make sure that the damaged device is not inadvertently installed and put into operation. Label the damaged device and keep it locked away. Send off the device for immediate repair.
25
Mounting and connecting the device
NOTICE
Damage from condensation
3.1.2

Device identification data

Unpacking the device
Identification date
Source
Value
Serial number
Rating plate
S VP ...
Order number of the device
Rating plate
6AV7260.....
have the COA label
Ethernet address 1
Ethernet address 2
for PROFINET devices)
(only for PROFINET devices)
3.1 Preparing for mounting
If the device is subjected to low temperatures or extreme fluctuations in temperature during transportation, as is the case in cold weather, for example, moisture can build up on or inside the device (condensation).
Moisture causes a short circuit in electrical circuits and damages the device.
In order to prevent damage to the device, proceed as follows:
Store the device in a dry place.
Bring the device to room temperature before starting it up.
Do not expose the device to direct heat radiation from a heating device.
If condensation develops, wait approximately 12 hours or until the device is
completely dry before switching it on.
7. Please keep the enclosed documentation in a safe place. It belongs to the device. You need the documentation when you commission the device for the first time.
8. Write down the identification data of the device.
The device can be clearly identified with the help of this identification data in case of repairs or theft.
Enter the identification data in the table below:
Microsoft Windows Product Key Certificate of Authenticity (COA)
CP 1616 onboard MAC Address Layer 2 (only
CP 1616 onboard MAC address PROFINET
Back of the de­vice
BIOS setup, "Main" menu
Only devices with preinstalled Windows operating systems
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Mounting and connecting the device
Rating plate
COA label
3.1 Preparing for mounting
Microsoft Windows "Product Key" from the "Certificate of Authenticity" (COA):
The COA label is present only when Windows Embedded Standard 7 or Windows 7 is installed.
COA label of a device with the Windows Embedded Standard 7 operating system
COA label of a device with the Windows 7 operating system
SIMATIC IPC677D Operating Instructions, 09/2014, A5E32995420-AC
27
Mounting and connecting the device
3.1.3

Permitted mounting positions

Mounting positions according to UL508/EN60950-1
CAUTION
Points to note with expansion cards
NOTICE
Operation in closed rooms
Mounting in horizontal format
Note Mounting precautions
3.1 Preparing for mounting
The following mounting positions are permitted for the device.
For information on the maximum permissible ambient temperatures during operation, refer to section "Ambient conditions (Page 125)".
Expansion cards may impose restrictions on the installation location (fire-proof enclosure) and permitted mounting positions (see Technical specifications). If the device has been fitted with expansion cards, please observe the safety and installation instructions for the expansion cards in the corresponding documentation.
If in doubt, install the device in an enclosure that is compliant with sections 4.6 and 4.7.3 of IEC/EN/DIN EN 60950-1.
The device is approved for operation in closed rooms only. Pay attention to the ambient and environmental conditions.
The total power for USB and PCI/PCIe expansions cannot exceed 30 W.
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Operation of a DVD drive in the inclined position is not permitted.
Mounting and connecting the device
Additional mounting positions according to UL508/CSA 22.2 No. 142
Mounting in vertical format
NOTICE
CD/DVD operation not permitted with mounting in vertical format
Note Mounting precautions
Note
This mounting position is also is mounted in an enclosure that complies with the requirements of sections 4.6 and 4.7.3 of IEC/EN/DIN EN 60950
3.1.4

Preparing the mounting cutout

Note Stability of the mounting cutout
The the enduring and safe mounting of the HMI device.
The force of the clamps or operation of the device may not lead to deformation of the material in order to achieve t
Note
Read the information in the section "
3.1 Preparing for mounting
CD/DVD drives must not be operated in this position. The CD drawer opens downward; this can lead to damage to the drawer mechanics.
The total power for USB and PCI/PCIe expansions cannot exceed 30 W.
permitted for Information Technology Equipment if the device
-1.
material in the area of the mounting cutout must provide sufficient strength to guarantee
he degrees of protection described below.
Installation guidelines (Page 31)".
SIMATIC IPC677D Operating Instructions, 09/2014, A5E32995420-AC
29
Mounting and connecting the device
Requirements for complying with degree of protection
Dimensions of the mounting cutout
Mounting cutout
15" 2
15" 3
19"
22"
Width w 1
399 mm
396 mm
465 mm
542 mm
Height h 1
280 mm
291 mm
319 mm
362 mm
1
2
3
Device with resistive single-touch screen
Installation depth
3.1 Preparing for mounting
The degree of protection of the HMI device can only be guaranteed if the following requirements are met:
Material thickness at the mounting cutout for IP65 degree of protection, or for enclosure type 4X/type 12 (indoor use only): 2 mm to 6 mm
Permitted deviation from plane at the mounting cutout: ≤ 0.5 mm
This condition must be fulfilled for the mounted HMI device.
Permissible surface roughness in the area of the seal: ≤ 120 µm (R
120)
z
Width and height must be interchanged for mounting in vertical format. Device with capacitive multi-touch screen
Information on the overall depth is available in the section "Dimension drawings (Page 115)".
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