Siemens BSP149 Datasheet

SIPMOS Small-Signal Transistor BSP 149
V
I
R
N channel
Depletion mode
High dynamic resistance
Available grouped in V
Type Ordering
DS
D
DS(on)
200 V
0.48 A
3.5
Code
GS(th)
Tape and Reel Information Pin Configuration Marking Package
1234
BSP 149 Q67000-S071 E6327: 1000 pcs/reel G D S D BSP 149 SOT-223
Maximum Ratings Parameter Symbol Values Unit
R
= 20 k V
GS
Gate-source voltage Gate-source peak voltage, aperiodic Continuous drain current, Pulsed drain current, Max. power dissipation,
T
= 28 ˚C I
A
T
= 25 ˚C I
A
T
= 25 ˚C P
A
Operating and storage temperature range
V
V V
D
D puls
T
j
DS
DGR
GS
gs
tot
, T
stg
200 V 200
± 14 ± 20
0.48 A
1.44
1.8 W – 55 … + 150 ˚C
Thermal resistance
1)
chip-ambient chip-soldering point
R
thJA
R
thJS
70 10
K/W
DIN humidity category, DIN 40 040 E – IEC climatic category, DIN IEC 68-1 55/150/56
1)
Transistor on epoxy pcb 40 mm × 40 mm × 1.5 mm with 6 cm2 copper area for drain connection.
Semiconductor Group 1 09.96
BSP 149
Electrical Characteristics
at Tj = 25 ˚C, unless otherwise specified.
Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
V
= 3 V, ID = 0.25 mA
GS
Gate threshold voltage
V
= 3 V, ID = 1 mA
DS
Drain-source cutoff current
V
= 200 V, VGS = 3 V
DS
T
= 25 ˚C
j
T
= 125 ˚C
j
Gate-source leakage current
V
= 20 V, VDS = 0
GS
Drain-source on-resistance
V
= 0 V, ID = 0.03 A
GS
Dynamic Characteristics
Forward transconductance
V
2 × IR
DS
DS(on)max
, ID = 0.48 A
Input capacitance
V
= 0, VDS = 25 V, f = 1 MHz
GS
Output capacitance
V
= 0, VDS = 25 V, f = 1 MHz
GS
Reverse transfer capacitance
V
= 0, VDS = 25 V, f = 1 MHz
GS
Turn-on time
V
=30V,VGS = 2 ... + 5V, RGS =50Ω,
DD
I
=0.29 A
D
Turn-off time t
V
=30V,VGS = 2 ... + 5V, RGS =50Ω,
DD
I
=0.29 A
D
t
, (ton = t
on
, (t
off
+ tr)
d(on)
= t
d(off)
+ tf)
off
V
(BR)DSS
V
GS(th)
I
DSS
I
GSS
R
DS(on)
g
fs
C
iiss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
V
200
1.8 1.2 0.7 µA
– –
– –
0.2 200
nA
10 100
2.5 3.5
S
0.4 0.75 – pF
500 670
–4060
–1220 – 7 10 ns –2030
–6080 –5065
Semiconductor Group 2
BSP 149
Electrical Characteristics (cont’d)
at Tj = 25 ˚C, unless otherwise specified.
Parameter Symbol Values Unit
min. typ. max.
Reverse Diode
Continuous reverse drain current
T
= 25 ˚C
A
Pulsed reverse drain current
T
= 25 ˚C
A
Diode forward on-voltage
I
= 0.96 A, VGS = 0
F
V
Grouping Symbol Limit Values Unit Test Condition
GS(th)
I
S
0.48
I
SM
1.44
V
SD
0.9 1.2
min. max.
Range of Threshold voltage selected in groups
1) A specific group cannot be ordered separately. Each reel only contains transistors from one group.
V
GS(th)
P R S T U V W
V
GS(th)
1)
:
V
GS(th)
0.15 V
– 0.95 – 1.08 – 1.21 – 1.34 – 1.47 – 1.60 – 1.73
– 0.80 – 0.93 – 1.06 – 1.19 – 1.32 – 1.45 – 1.58
V V V V V V V
V
D1
V
D2
I
= 1 mA
D
Package Outline
A
V
= 0.2 V; = 3 V;
SOT-223
Dimensions in mm
Semiconductor Group 3
Loading...
+ 4 hidden pages