Siemens BSM50GD60DN2 Datasheet

IGBT Power Module
• Power module
• 3-phase full-bridge
• Including fast free-wheel diodes
• Package with insulated metal base plate
BSM 50 GD 60 DN2
V
CE
I
C
Package Ordering Code
BSM 50 GD 60 DN2 600V 50A ECONOPACK 2K C67076-A2515-A67
Maximum Ratings Parameter
Collector-emitter voltage Collector-gate voltage
R
GE
= 20 k
Gate-emitter voltage DC collector current
T
= 40 °C
C
Pulsed collector current,
T
= 40 °C
C
t
Power dissipation per IGBT
T
= 25 °C
C
Chip temperature Storage temperature
= 1 ms
p
Symbol Values Unit
V V
CE CGR
600 V
600
V I
GE
C
± 20
A
50
I
Cpuls
100
P
tot
W
200
T
j
T
stg
+ 150 °C
-55 ... + 150
≤ ≤
0.6
1.5
K/W
2500 Vac
Thermal resistance, chip case Diode thermal resistance, chip case Insulation test voltage, t = 1min.
R R V
thJC thJC is
D
Creepage distance - 16 mm Clearance - 11 DIN humidity category, DIN 40 040 - F sec IEC climatic category, DIN IEC 68-1 - 55 / 150 / 56
Semiconductor Group
1 Jan-10-1997
BSM 50 GD 60 DN2
Electrical Characteristics
= 25 °C, unless otherwise specified
, at T
j
Parameter
Static Characteristics
Gate threshold voltage
V
GE
=
V
CE, IC
= 1 mA
Collector-emitter saturation voltage
V V
GE GE
= 15 V, = 15 V,
= 50 A,
I
C
= 50 A,
I
C
= 25 °C
T
j
= 125 °C
T
j
Zero gate voltage collector current
V
CE
= 600 V,
V
GE
= 0 V,
= 25 °C
T
j
Gate-emitter leakage current
V
GE
= 25 V,
V
CE
= 0 V
AC Characteristics
Symbol Values Unit
min. typ. max.
V
GE(th)
V
4.5 5.5 6.5
V
CE(sat)
I
CES
-
-
2.1
2.2
2.7
2.8 mA
- - 1.5
I
GES
nA
- - 100
Transconductance
V
CE
= 20 V,
= 50 A
I
C
Input capacitance
V
CE
= 25 V,
= 0 V, f = 1 MHz
V
GE
Output capacitance
V
CE
= 25 V,
= 0 V, f = 1 MHz
V
GE
Reverse transfer capacitance
V
CE
= 25 V,
= 0 V, f = 1 MHz
V
GE
g
C
C
C
fs
iss
oss
rss
S
10 - -
nF
- 2.8 -
- 0.3 -
- 0.2 -
Semiconductor Group
2 Jan-10-1997
BSM 50 GD 60 DN2
Electrical Characteristics Parameter
= 25 °C, unless otherwise specified
, at T
j
Symbol Values Unit
Switching Characteristics, Inductive Load at
Turn-on delay time
= 300 V,
V R
CC Gon
= 22
V
GE
Rise time
= 300 V,
V R
CC Gon
= 22
V
GE
Turn-off delay time
= 300 V,
V R
CC Goff
= 22
V
GE
Fall time
= 300 V,
V R
CC Goff
= 22
V
GE
= 15 V,
= 15 V,
= -15 V,
= -15 V,
= 50 A
I
C
= 50 A
I
C
= 50 A
I
C
= 50 A
I
C
t
d(on)
t
r
t
d(off)
t
f
min. typ. max.
T
= 125 °C
j
- 60 -
- 80 -
- 330 -
- 550 -
ns
Free-Wheel Diode
Diode forward voltage
= 50 A,
I
F
= 50 A,
I
F
V V
= 0 V,
GE
= 0 V,
GE
= 25 °C
T
j
= 125 °C
T
j
Reverse recovery time
= 50 A,
I
F
iF/dt = -500 A/µs,
d
= -300 V,
V
R
V
= 125 °C
T
j
Reverse recovery charge
= 50 A,
I
F
iF/dt = -500 A/µs
d
= 25 °C
T
j
= 125 °C
T
j
= -300 V,
V
R
V
GE
GE
= 0 V
= 0 V
V
t
Q
F
-
-
rr
2
1.8
-
-
V
µs
- 0.2 -
rr
-
-
2.8 5
-
-
µC
Semiconductor Group
3 Jan-10-1997
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