Siemens AF51 Service Manual

Release 1.0

Service Manual

AF51

Level 1-3

Release Date Department Notes to change

R 1.0 29.12.2005 BenQ Mobile S CC CES New document

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Table of Content

1 Key Feature................................................................................................................................3

2 AF51 Interface to Accessories.................................................................................................4

3 Unit Description of AF51...........................................................................................................4

4 Exploded View of AF51.............................................................................................................5

5 Disassembly of AF51................................................................................................................6

6 Assembly of AF51...................................................................................................................17

7 BenQ Service Equipment User Manual.................................................................................27

8 GRT Software: Functionality Configuration..........................................................................28

9 GRT Software: Regular Usage ...............................................................................................30

10 JPICS (Java based Product Information Controlling System)............................................35

11 International Mobile Equipment Identity, IMEI......................................................................41

12 General Testing Information...................................................................................................42

13 Introduction of Service Repair Documentation for Level 3 Basic Repairs – AF51 ...........48

14 List of available Level 3 Basic Parts......................................................................................49

15 Hardware Requirements.........................................................................................................49

16 AF51 Board Layout .................................................................................................................50

17 SIM Card Problems .................................................................................................................51

18 IO Connector Problems ..........................................................................................................52

19 B to B Connector (upper slider part) Problems....................................................................53

20 Main Keypad Illumination Problems......................................................................................54

21 Connector Battery...................................................................................................................55

22 Filter EMI Problems.................................................................................................................56

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1 Key Feature

Battery
Stand – by Time
Talk Time
SIM Functionality /
Security Controls

Data Services

System Standards

Antenna
Length
Width
Weight
Display

Features

Li-Ion 620 mAh

Up to 220 hrs (standard battery)

Up to 300 min (standard battery)
SIM lock
Secure transactions
Digital signatures
Digital Rights Management: OMA standard

SMS, SMS MT, SMS MO
MMS rel. 4
GPRS class 8
WAP 1.2.1, WAP 2.0 content provisioning
Java MIDP 1.0, CDLC 1.0
WML/XHTML dual stack
Tri-band: 900/1800/1900 MHz
(for EMEA, APAC and LAM)
EGSM (GSM phase 2/phase 2+)
Integrated
79 mm
41 mm
80g
Main-Display: CSTN, 130 x 130 pixels, 65,536 colors
Sub-display: CSTN, 96 x 64 pixels, 65,536 colors
4-way navigation key and two soft keys
Two color displays: 65,536 color internal glass display, 65,536 color
external display
SMS to group, predefined text blocks
MMS supporting text, still images, voice and animations
32-chord polyphonic ring tones, MIDI, SP MIDI, WAV
Speed dialing keys
Programmable soft keys
Incite Service Light Indication LED
Calendar including day, week, and month
PC-Synchronization with Mobile Phone Manager
Personal information manager
GPRS modem assistant
J2ME (Java) based games and applications
Handsfree talking
Silent alert (Vibra)
Games, Speaker-dependent voice dialing
File manager: Flash File System and Explorer
Calculator, Currency converter
Birthday reminder
Start-up assistant for clock set
Car Kit Portable as accessory

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2 AF51 Interface to Accessories

Nano I/O connector is for G85 generation. The compatible interface is suitable to use the travel
charger.

3 Unit Description of AF51

Demonstrate modern styling with the timelessly elegant “pocket size” clamshell design with

integrated antenna and a valuable look.

The highly scratch-resistant internal glass display surface preserves the visibility of the colors

displayed and ensures a long-lasting, enjoyable user experience.

Ergonomic keypad and two color displays for convenient, easy handling. The integrated organizer

supports the simplification of daily life. The Incite Service Light Indication LED informs the user at a

glance about missed calls and incoming SMS, etc., under any light conditions.

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4 Exploded View of AF51

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5 Disassembly of AF51

All repairs as well as disassembling and assembling have to be carried out in an ESD

protected environment and with ESD protected equipment/tools. For all activities the

international ESD regulations have to be considered.

For more details please check information in c – market

https://market.benqmobile.com/SO/welcome.lookup.asp

There you can find the document “ESD Guideline”.

Step 1

Remove Battery Cover and Battery.

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Step 2

Remove Screw cover with the alternative

opening tool

Step 3

Step 4

Remove screws with the Torque –

Screwdriver T5+

Remove rear cover with the Alternative

Opening Tool carefully.

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Step 5

Step 6

Remove PCB cover plate by using the

alternative opening tool.

Step 7

Remove antenna by using the alternative

opening tool.

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Step 8

Step 9

Remove microphone by using tweezers

carefully.

Disconnect the Flex Cable from PCB by

using Tweezers.

Step 10

Assemble PCB by using the tweezers

carefully.

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Step 11

Step 12

Remove Keypad by using Tweezers.

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Step 13

Step 14

Remove screw cover by using the

alternative opening tool carefully.

Remove screws with the Torque –

Screwdriver T5+

Step 15

Remove Front Cover with the Alternative

Opening Tool.

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Step 16

Step 17

To avoid scratches it is mandatory to place

a protection foil onto the Display!!!

Step 18

Remove Display spacer.

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Step 19

Step 20

Remove Vibramotor by using tweezers.

Remove Vibra contact Flex foil by using

tweezers carefully

Step 21

Remove PCB by using the alternative

opening tool. Separate Earphone from front

cover carefully.

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Step 22

Remove Upper Case from Lower Case by

pushing the Hinge-spring, now you can

separate the Upper Base Frame from the

Lift Frame.

Take care of the Flex Cable!!!

Step 23

Step 24

Remove PCB from Lower base frame.

Take care of the Flex Cable!!!

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Step 25

To avoid scratches it is mandatory to place a

protection foil onto the Display!!!

Step 26

Step 27

Disconnect the loudspeaker from PCB with

Tweezers.

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Step 28

Remove Hinge - Spring by pushing it through

the Hinge.

Step 29

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p

g

yp

Overview Upper Parts Overview Lower Parts

Display Module

Upper Base
Frame

Screw Cover

Screw Cover
Spacer
Display

loudspeaker

Vibramotor

6 Assembly of AF51

Step 1

Main PCB

PCB

Screws

Rear Cover

ad

Lower Base Frame

Battery

Ke

PCB cover
plate

Push the Hinge inside the Frame.

Micro

Antenna

Hin

hone

e

Step 2

Assemble mircrophone by using tweezers.

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Step 3

Step 4

Attention! Before assembling the Display

Module it is mandatory to remove the

Display Foil!

Assemble Display Spacer.

Step 5

Fix the assembled Display Module into the

Lift Cover.

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Step 6

Step 7

???

Step 8

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Step 9

Step 10

To assemble the Display, you have to

push the Flex Cable through the slot of the

Lift Cover.

Use the Hinge – Tool to push the Hinge

spring inside to assemble the Upper Case

with Upper Base Case.

Step 11

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Step 12

Step 13

Assemble Vibramotor by using tweezers.

Attention! Before assembling the Display

Module it is mandatory to remove the

Display Foil!

Step 14

Assemble front cover.

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Step 15

Fix screws with the Torque – Screwdriver

T5+

Step 16

Assemble screw cover.

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Step 17

Step 18

Assemble the Keypad by using Tweezers.

Assemble PCB.

Step 19

Connect the Flex Cable with the

assembled PCB.

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Step 20

Assemble microphone by using

tweezers.

Step 21

Step 22

Assemble antenna module by using

tweezers.

Assemble PCB cover plate.

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Step 23

Step 24

Assemble rear cover.

Place screws with the Torque –

Screwdriver.

Step 25

Assemble Screw cover.

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Step 26

Assemble Battery.

Step 27

Step 28

Assemble Battery Cover.

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7 BenQ Service Equipment User Manual

Introduction

Every LSO repairing BenQ handset must ensure that the quality standards are observed.

BenQ has developed an automatic testing system that will perform all necessary

measurements. This testing system is known as:

BenQ Mobile Service Equipment

• For disassembling / assembling

Torque – Screwdriver

Part Number: F 30032 – P 228 – A1

Opening tool

(Case opening without destroying)

Part Number: F 30032 – P 38 – A1

Alternative Opening tool

Part Number: F30032 – P583 – A1

Tweezers

• For testing

All mobile phones have to be tested with the GRT – Software. The service partner is
responsible to ensure that all required hardware is available.

For additional Software and Hardware options as well as the supported GRT equipment,

please check the GRT User manual.

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8 GRT Software: Functionality Configuration

Sep 1:

Step 2:

Select „Settings >> SWUP / JPICS”

Proceed as follows:

¾ Select all required Variants you need to repair (click onto the “+” in

front of the product name.

¾ Check Com-Port setting. If necessary change it
¾ Check speed setting. Select always the lowest speed if your PC

does not have a fast serial card

¾ Enter the value for “JPICS Server Timeout”. Be careful, this value

defines how long GRT tries to reach the server until you get an
error message. Do not select a very long time

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Step 3: Connect to GRM Server

• Choose in the section „GRM” the „Connect to GRM Database“ functionality

Enter your GRT-Username and
Password into this fields

Activate always both boxes if you
connect to the database. Start
with “Connect”

It you IT infrastructure parameter
have changed, use this button to
move to the configuration mask

• End the connection with a click onto the „Exit button“

(appearing after successful data exchange)

GRT Software has now finished all required settings and configuration tasks. All
files have been down- and uploaded.
In dependency of the selected number of mobile phones and variants the volume

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9 GRT Software: Regular Usage

Step 1:

Step 2: Choose the area you want to work with

In any case customer data can be erased on request. (xfs and mapping have to be

activated) Of course JPICS hardware and authorisation have to be available.

Select the section SWUpdate

• Personal Repair

Personal Repair is always accessible. Basis for the decision if a SW-Update is
authorised by Siemens is the so called

Example: Mobile Phone has already SW50.

In this case SW-Update is not necessary and therefore not authorised

• Operator SWAP

This area is only accessible if you are released by the service management to
perform SW-Updates for Net-Operators. Basis for the decision if a SW-Update is
authorised by Siemens is the so called

Customer data will be erased without any exception and any chance to influence by

the user. JPICS hardware and authorisation have to be available.

• Operator SWUpdate

This area is only accessible if you are released by the service management to
perform SW-Updates for Net-Operators. Basis for the decision if a SW-Update is
authorised by Siemens is the so called

Like in “Personal Repair” customer data can be erased on request. (xfs and mapping

have to be activated) Of course JPICS hardware and authorisation have to be

available.

Service Release-Table .

Service -Release-Table shows SW50

Master-Table .

Master-Table .

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)

A

9.1 Window explanation

This general explanation is valid for all SW-Update channels

(Personal Repair, Operator SWAP, Operator SWUpdate)

1.1.1.1.1.1.4 Automatic read
out function of phone
type/Variant. Appearing in the

Remarks:

In case of malfunction please check

o Is the correct phone type selected
o Is the correct COM-Port selected
o If a variant is missing, move back to Settings select the missing variant and

conncet the GRM Server. Then continue with SW-Update.

After using „Check Variant“ Phone IMEI­Number will be shown here

Select boxes for:
Content = xfs
Settings = mapping

Attention:

ctivation of the boxes
will cause erase of
customer date while SW­Update

Window to select the mobile
phone CPU

Shows the different SW –Versions
a) SW inside the mobile phone
b) Version of Service Release Table
SW

Version of Master Table SW

c

Start button for SW­Update

Stop / leave SW-Update

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Case 1: Personal Repair (green)

Step 1: Carry out step 1 – 4 to start SW-Update.

1.1.1.1.1.1.3 Read out phone
type/Variant. >>Appears in the
window ab ove.

Remarks:

- The decision about a Siemens authorised SW-Update depends only on the

Service Release-Table .

- The SW which is booted by GRT can be below the SW mentioned in the

Service Release Table, if this SW is not released for the Net-Operator

- If xfs and mapping are activated, GRT will erase in any case the customer

data even if the action is cancelled.

- If the user wants to download an other variant then the automatically identified

one, he has simply to select an other variant from the list. Afterwards he has to
start the SW-Update

Select the mobile phone CPU type

Start SW-Update

Choose if customer data shall be erased.
If “Yes” activate the boxes in front of xfs
and mapping

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9.3 Case 2: Operator SWAP (red)

Step 1: Carry out step 1 – 4 to start SW-Update.

1.1.1.1.1.1.2 Read out phone
type/Variant. >>Appears in the
window ab ove.

Remarks:

- The decision about a Siemens authorised SW-Update depends only on the

Master-Table .

- The user has no chance to influence the decision

- Xfs and mapping are always activated there is no chance to deactivate them.

GRT will erase in any case the customer data even if the action is cancelled.

- If the user wants to download an other variant then the automatically identified

one, he has simply to select an other variant from the list. Afterwards he has to
start the SW-Update

Select the mobile phone CPU type

Start SW-Update

Choose if customer data shall be erased.
If “Yes” activate the boxes in front of xfs
and mapping

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9.4 Case 3 Operator SWUPdate (blue)

Step 1: Carry out step 1 – 4 to start SW-Update.

Remarks:

1.1.1.1.1.1.1 Read out phone
type/Variant. >>Appears in the
window above.

- The decision about a Siemens authorised SW-Update depends only on the

Master-Table .

- The user has no chance to influence the decision

- Xfs and mapping can be activated on demand. GRT will erase in any case

the customer data even if the action is cancelled.

- If the user wants to download an other variant then the automatically identified

one, he has simply to select an other variant from the list. Afterwards he has to
start the SW-Update

Select the mobile phone CPU type

Start SW-Update

Choose if customer data shall be erased.
If “Yes” activate the boxes in front of xfs
and mapping

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10 JPICS (Java based Product Information Controlling System)

Overview

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The following functions are available for the LSO:

• General mobile information

• Generate PINCODE

• Generate SIMLOCK – UNLOCK – Code

• Print IMEI labels

• Lock, Unlock and Test the BF - Bus

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The access to the JPICS server which is located in Kamp – Lintfort is protected by chip card

and in addition using secure socket layer (SSL) connection.

The JPICS server is only available for authorized users with a specially coded smart card.

These smart cards and the administration of the JPICS web server and the PICS database

– server can only be provided by the JPICS – TRUST – Center of the

responsible

department in Kamp – Lintfort.

In case of any questions or requests concerning smart cards or administration of the

databases please ask your responsible BenQ Customer Care Manager.

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Installation overview

The following installation description assumes that a web browser is already installed.

JPICS is tested with the following browsers:

Internet Explorer Version 5.5 and higher

1.

Netscape Version 6 and higher

2.

For further information regarding supported browsers, browser version and supported

operating systems, see the

Sun FAQ’s.

Here is a step by step instruction to install all the required components:

It is necessary to follow this order!

Smart Card Reader (Omnikey: Cardman 2020 USB or Cardman 3121 USB)

1.

CardOS interface (Siemens Version 3.0 B)

2.

Java Runtime Environment (Sun)

3.

Java additional components

4.

Every user is responsible for a proper installation matching the license
agreements.

For installation and further access you need the following:

1. The JPICS Installation – CD

2. The Smart Card JPICS. These cards can be ordered via your responsible Customer

Care Manager within Siemens or on

http://jpics.siemens.com/jpics/admin/request-

new_jpics.jsp

3. A supported Smart Card Reader (Omnikey Cardman) in order to access your Smart

Card.

Remark: We recommend using Cardman 2020 USB or Cardman 3121 USB. Serial card

readers are not supported!!!

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Generate Codes

In the JPICS application you can choose to generate:

• Masterphone codes

• Simlock – Unlock – Codes

Masterphone codes

The Masterphone code is used to unlock blocked mobiles.
Masterphone codes can only be supplied for mobiles which have been delivered in a

regular manner.

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Simlock – Unlock – Code

The Simlock – Unlock – Codes can only be generated if the following conditions are given:

• Mobile must have an active Simlock inside.

• The user must be given the authorization to obtain Simlock – Unlock – Codes for

the variant of the operator to which the mobile was delivered last time.

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Printing IMEI label

The module “printing IMEI label” offers the possibility to re-print IMEI labels for mobiles

again.

You are able to print 1 label in just one step.

To prevent that misaligned labels are being printed, the setting “Print test labels =

9” is

activated by default. After having printed a well aligned test label you can uncheck the

setting and print the correct label.

Hint:

For correct printing of IMEI labels you must have a Zebra – label printer with special

material that fits for label printing. This printer has to be connected to local LPT1 printer port

(also see Installation of IMPRINT) and MUST feature a printing resolution of 300dpi.

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11 International Mobile Equipment Identity, IMEI

The mobile equipment is uniquely identified by the International Mobile Equipment Identity,

IMEI, which consists of 15 digits. Type approval granted to a type of mobile is allocated 6

digits. The final assembly code is used to identify the final assembly plant and is assigned

with 2 digits. 6 digits have been allocated for the equipment serial number for manufacturer

and the last digit is spare.

The part number for the AF51 is S30880-S2950-#xxx where the last for letters specify the

housing and software variant.

AF51 series IMEI label is accessible by removing the battery.

Re – use of IMEI label is possible by using a hair – dryer to remove the IMEI label.

On this IMEI label, BenQ has also includes the data code for production or service, which

conforms to the industrial standard DIN EN 60062. The data code comprises of 2

characters: first character denotes the year and the second character denotes the month.

For example: S5

CODE Year Month CODE

P 2 0 0 2 M A R C H 3

R 2 0 0 3 A P R I L 4

S

2 0 0 4 M A Y

5

T 2 0 0 5 J U N E 6
U 2 0 0 6 J U L Y 7

To display the IMEI number, exit code and SW/HW version, key: * # 0 6 #

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12 General Testing Information

General Information

The technical instruction for testing GSM mobile phones is to ensure the best repair quality.

Validity

This procedure is to apply for all from Siemens AG authorized level 2 up to 2.5e workshops.

Procedure

All following checks and measurements have to be carried out in an ESD protected

environment and with ESD protected equipment/tools. For all activities the international

ESD regulations have to be considered.

Get delivery:

¾ Ensure that every required information like fault description, customer data a.s.o. is

available.

¾ Ensure that the packing of the defective items is according to packing requirements.

¾ Ensure that there is a description available, how to unpack the defective items and

what to do with them.

Enter data into your database:

(Depends on your application system)

¾ Ensure that every data, which is required for the IRIS-Reporting is available in your

database.

¾ Ensure that there is a description available for the employees how to enter the data.

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Incoming check and check after assembling:

!! Verify the customers fault description!!

¾ After a successful verification pass the defective item to the responsible

troubleshooting group.

¾ If the fault description can not be verified, perform additional tests to save time and to

improve repair quality.

- Switch on the device and enter PIN code if necessary unblock phone.

- Check the

- Check the display for error in

function of all keys including side keys.

line and row, and for illumination.

- Check the ringer/loudspeaker acoustics by individual validation.

- Perform a GSM Test as described on page 36.

Check the storage capability:

¾ Check internal resistance and capacity of the battery.

¾ Check battery charging capability of the mobile phone.

¾ Check charging capability of the power supply.

¾ Check current consumption of the mobile phone in different mode.

Visual inspection:

¾ Check the entire board for liquid damages.

¾ Check the entire board for electrical damages.

¾ Check the housing of the mobile phone for damages.

SW update:

¾ Carry out a software update and data reset according to the master tables and

operator/customer requirements.

Repairs:

The disassembling as well as the assembling of a mobile phone has to be
carried out by considering the rules mentioned in the dedicated manuals. If
special equipment is required the service partner has to use it and to ensure the
correct function of the tools.
If components and especially soldered components have to be replaced all rules
mentioned in dedicated manuals or additional information e.g. service
information have to be considered

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GSM Test:

With the availability of the GRT Test /Alignment software, this tool has to be used to perform
the outgoing test!

>Connect the mobile/board via internal antenna (antenna coupler) and external antenna

(Car cradle/universal antenna clip) to a GSM tester

>Use a Test SIM

For Triple Band phones use a separate test case, if the test software allows only one

handover.

Skip the GSM Band test cases if not performed by the mobile phone

Example: 1. Test file Band 1 = GSM900 / Band 2 = GSM1800

2. Test file Band 1 = GSM1900

Internal Antenna

Test case Parameter Measurements Limits

1 Location Update • GSM Band 1

• BS Power = -55 dBm

• middle BCCH

2 Call from BS • low TCH

• highest PCL

• BS Power = -75 dBm

• middle BCCH

3 TX GSM Band 1 • low TCH

• highest PCL

• BS Power = -75 dBm

• middle BCCH

4 Handover to GSM Band 2

Including Handover
Check

5 TX GSM Band 2 • low TCH

6 Call release from BS

• highest PCL0

• BS Power = -75 dBm

• middle BCCH

• Display check • individual
check

• Ringer/Loudspeaker

check

• Frequency Error

• Phase Error RMS

• Phase Error Peak

• Average Power

• Power Time Template

• Frequency Error

• Phase Error RMS

• Phase Error Peak

• Average Power

• Power Time Template

• individual
check

• GSM Spec.

• GSM Spec.

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External Antenna

7 Call from MS • GSM900

• high TCH

• second highest PCL

• BS Power = -75 dBm

• middle BCCH

8 TX GSM Band 1 • high TCH

• second highest PCL

• BS Power = -75 dBm

• middle BCCH

9 RX GSM Band 1 • high TCH

• BS Power = -102 dBm

• 50 Frames

• middle BCCH

10 Handover to GSM Band 2

Including Handover
Check

11 TX GSM Band 2 • high TCH

12 RX GSM Band2 • high TCH

13 Call release from MS

• second highest PCL

• BS Power = -75 dBm

• middle BCCH

• BS Power = -102 dBm

• 50 Frames

• middle BCCH

• Keyboard check • individual
check

• Frequency Error

• Phase Error RMS

• Phase Error Peak

• Average Power

• Power Time Template

• RX Level

• RX Qual

• BER Class Ib

• BER Class II

• BER Erased Frames

• Frequency Error

• Phase Error RMS

• Phase Error Peak

• Average Power

• Power Time Template

• RX Level

• RX Qual

• BER Class Ib

• BER Class II

• BER Erased Frames

• GSM Spec.

• GSM Spec.

• GSM Spec.

• GSM Spec.

Final Inspection:

The final inspection contains:

1) A 100% network test (location update, and set up call).

2) Refer to point 3.3.

3) A random sample checks of:

- Data reset (if required)

- Optical appearance

- complete function

4) check if PIN-Code is activated (delete the PIN-Code if necessary).

Basis is the international standard of DIN ISO 2859.

Use Normal Sample Plan Level II and the Quality Border 0, 4 for LSO.

Remark: All sample checks must be documented.

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Annex 1

Test SIM Card

There are two different “Test SIM Cards” in use:

1) Test SIM Card from the company “ORGA”

Pin 1 number: 0000
PUK 1 : 12345678

Pin 2 number: 0000
PUK 2 : 23456789

2) Test SIM Card from the company “T-D1”

Pin 1 number: 1234
PUK : 76543210

Pin 2 number: 5678
PUK 2 : 98765432

Technical Documentation

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Annex 2

Battery Date Code overview

Varta

Date code example N 9 A VA

Year (N:2001, O:2002...) Supplier Code
Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking)
Revision Letter (A, B,…)

Hitachi / Maxwell

Date code example N 9 A MX

Year (N:2001, O:2002...) Supplier Code
Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking)
Revision Letter (A, B,…)

Sanyo

Date code example N 9 A SY

Year (N:2001, O:2002...) Supplier Code
Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking)
Revision Letter (A, B,…)

NEC

Date code example N 8 A NT

Year (N:2001, O:2002...) Supplier Code
Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking)
Revision Letter (A, B,…)

Panasonic

Date code example O N A PAN

Year (N:2001, O:2002...) Supplier Code
Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking)
Revision Letter (A, B,…)

Sony

Date code example P N A SO

Year (O:2002, P:2003...) Supplier Code
Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking)
Revision Letter (A, B,…)

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13 Introduction of Service Repair Documentation

for Level 3 Basic Repairs – AF51

Purpose

This part of Service Repair Documentation is intended to carry out repairs on BenQ Mobile repair
level 3basic (only for workshops without level 3 equipment (special agreement required).
The described failures shall be repaired in BenQ authorized local workshops only.

The level 3basic partners are obliged to send exchanged boards (SWAP) to the next higher Service
Repair Partner.

All repairs have to be carried out in an ESD protected environment and with ESD protected
equipment/tools. For all activities the international ESD regulations have to be considered.

Assembling/disassembling has to be done according to the latest AF51 Level 2 repair
documentation. It has to be ensured that every repaired mobile Phone is checked according to the
latest released General Test Instruction document (both documents are available in the Technical
Support section of the C-market).

Check at least weekly C-market for updates and consider all AF51 related Customer Care
Information

AF51 Part number on IMEI label: S30880-S2950-#xxx

Scrap Handling: All Scrap information given in this manual are related to the
SCRAP-Rules and instructions.

Attention: Consider the new "LEAD-FREE" soldering rules (available in the communication
market), avoid excessive heat.

Scope

This document is the reference document for all BenQ mobile authorised Service Partners which are
released to repair BenQ mobile phones up to level 2.5 light.

Terms and Abbreviations

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14 List of available Level 3 Basic Parts

(According to Component Matrix V1.09 - check C-market for updates)

Product ID Order Number Description CM

AF51 V2801 L36840-L2082-D670 LED BLUE TOP
AF51 V2802 L36840-L2082-D670 LED BLUE TOP
AF51 V2803 L36840-L2082-D670 LED BLUE TOP
AF51 V2804 L36840-L2082-D670 LED BLUE TOP
AF51 V2805 L36840-L2082-D670 LED BLUE TOP
AF51 V2806 L36840-L2082-D670 LED BLUE TOP
AF51 V2807 L36840-L2082-D670 LED BLUE TOP
AF51 V2808 L36840-L2082-D670 LED BLUE TOP
AF51 V2809 L36840-L2082-D670 LED BLUE TOP
AF51 X1603 L50634-Z97-C407 CONNECTOR SIM CARD READER X75
AF51 X211 L50634-Z93-C364 IO-JACK NANO 12-POL
AF51 X2750 L36334-Z97-C341 CONNECTOR BOARD TO BOARD 30-POL
AF51 X320 L50634-Z97-C467 CONNECTOR BATTERY 3-POL X85
AF51 Z1601 L50620-U6029-D670 FILTER EMI (Fi-Type6) PB Free

15 Hardware Requirements

(According to L2.5L-L2.5 General soldering information V1.3 - check C-market for updates)

Jigs, Tools and working materials for all described repairs:

 hot air blower
 soldering gun
 tweezers
 flux
 solder

Technical Documentation

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16 AF51 Board Layout

Upper board side

Led´s

Lower board side

Connector
Board to
Board

Connector
SIM-Card

Connector
Battery

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IO Jack

EMI Filter

10/2005

Release 1.0

y

r

y

y

17 SIM Card Problems

Fault Symptoms

Customer: GRT:
Handset does not accept SIM card SIM Card Problems

SIM Card Problems

Watch for oxidation and

damaged pads of the

SIM Card reader

Okay

Check the status of the

EMI Filter visually

Exchange

SIM Card reade

Not
oka

not
oka

Check the status of the

SIM Card reader visually

Use the resistor test

function of a multimeter

to check connection

between spring

contacts and soldering

contacts.

The value must be ~0

Okay

Okay

Connector SIM Card Reader
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding
components! Resolder new component afterwards.
E-commerce order number: L50634-Z97-C407
E-commerce order name: CONNECTOR SIM CARD READER R65 (B)
Soldering temperature: ~ 360°C TIP Temp.

EMI Filter
Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding
components! Resolder new component afterwards.
E-commerce order number: L50620-U6029-D670
E-commerce order name: FILTER EMI (Fi-Type7) PB Free
Soldering temperature: ~ 360°C TIP Temp
IRIS Diagnose Code: 43300 Interface/SIM Card reader/Mechanical Damage

Not
oka

Okay

Back to customer

without repair

Caused by customer

SCRAP - has to be send

separately to WSC

Exchange the

damaged Filter

- Check for twisted or
Bent contacts

- Check for dry joints

Continue with

higher repair level

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y

18 IO Connector Problems

Fault Symptoms

Customer: GRT:
Charging Problems No connection to GRT
Problems with external loudspeaker or microphone when using a
car kit
Problems with accessories connected at the IO connector

IO connector Problems

Watch for oxidation and

damaged pads of the

IO connector

Okay

Not
oka

Not
oka

Check the dust inside

the IO connector

Okay

Check the status of the

IO connector visually

Exchange

IO connecto

Connector IO Jack
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding
components! Resolder new component afterwards.

E-commerce order number: L50634-Z93-C364
E-commerce order name: IO-JACK SLIM 12-POL
Soldering temperature: ~ 360°C TIP Temp.

IRIS Diagnose Code: 46100 Interface/Charging Connector/Mechanical Damage

Not
oka

Use the resistor test

function of a multimeter

to check connection

between spring

contacts and soldering

contacts.

The value must be ~0

Okay

47300 Interface/Data Interface/Mechanical Damage
4B100 Interface/Headset Connector/Mechanical Damage

Back to customer

without repair

Caused by customer

SCRAP - has to be send

separately to WSC

Clean IO connector

- Check for twisted or
Bent contacts

- Check for dry joints

Continue with

higher repair level

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y

19 B to B Connector (upper slider part) Problems

Fault Symptoms

Customer: GRT:
Upper slider keyboard malfunction Keyboard malfunction
Upper slider keypad illumination does not work Current measured failed
Display problems

B to B connector problems

Watch for oxidation and

damaged pads of the

B to B connector

Okay

Not
oka

Check the status of the

B to B connector visually

Exchange

B to B

connector

Not
oka

Continue with

higher repair level

Okay

Connector Board to Board

Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding
components! Resolder new component afterwards.

E-commerce order number: L36334-Z97-C341
E-commerce order name: BOARD TO BOARD 30-POL
Soldering temperature: ~ 360°C TIP Temp.

IRIS Diagnose Code: 32100 Keys / Main / No Function

32200 Keys / Main / Reduced Functionality
36000 Keys / Illumination

Back to customer

without repair

Caused by customer

SCRAP - has to be send

separately to WSC

- Check for twisted or
Bent contacts

- Check for dry joints

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y

y

20 Main Keypad Illumination Problems

Okay

Back to customer

without repair

Caused by customer

SCRAP - has to be send

separately to WSC

- Check for twisted or
Bent contacts

- Check for dry joints

Continue with

higher repair level

Fault Symptoms

Customer: GRT:
Main keypad illumination does not work Current measured failed

LED’s Problems

Watch for oxidation and

damaged pads of the

LED’s

Okay

Not
oka

Check the status of the

battery connector

visuall

Exchange

Keypad LED’s

Not
oka

Use the diode test

function of a multimeter

to check the status of
the diode. The typical

voltage drop on the

diode is 1.7 V when

testing the diode
function with the

multimeter.

LED WHITE TOP
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding
components! Resolder new component afterwards.

Attention: Remove Metal Dome Sheet before!!!

E-commerce order number: L36840-L2082-D670
E-commerce order name: LED WHITE TOP
Soldering temperature: ~ 360°C TIP Temp.

IRIS Diagnose Code: 36000 Keys / Illumination

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y

y

21 Connector Battery

Okay

Okay

Back to customer

Okay

without repair

Caused by customer

SCRAP - has to be send

separately to WSC

- Check for twisted or
Bent contacts

- Check for dry joints

Continue with

higher repair level

Fault Symptoms

Customer: GRT:

Mobile does not switch on No connection to GRT

Battery connector problems

Watch for oxidation and

damaged pads of the

Battery connector

Not
oka

Check the status of the

battery connector

visuall

Exchange

battery

connector

Not
oka

Use the resistor test

function of a multimeter

to check connection

between spring

contacts and soldering

contacts. The value

must be ~ 0.

Connector BATTERY

Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components!
Resolder new component afterwards.

E-commerce order number:
Soldering temperature: 240 - 255°C
IRIS Diagnose Code: 13000 Battery/Mechanical Damage

L50634-Z97-C467

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r

y

y

22 Filter EMI Problems

Fault Symptoms

Customer: GRT:
Handset does not allow data communication via
I/O connector

EMI Filter Problems

Watch for oxidation and

damaged pads of the

EMI Filter

Okay

Not
oka

Check the status of the

EMI Filter visually

Okay

Exchange

EMI Filte

not
oka

Use the resistor test

function of a multimeter

to check connection

between spring

contacts and soldering

contacts.

EMI Filter

Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding
components! Resolder new component afterwards.

E-commerce order number: L50620-U6029-D670
E-commerce order name: FILTER EMI (Fi-Type7) PB Free
Soldering temperature: ~ 360°C TIP Temp
IRIS Diagnose Code: 47000 Data connectivity

No service mode possible
No software update possible

Back to customer

without repair

Caused by customer

SCRAP - has to be send

separately to WSC

Not
oka

Exchange the

damaged Filter

Okay

Continue with

higher repair level

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