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SIM4000
Sensor Integration Machine
O P E R A T I N G I N S T R U C T I O N S
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Described product
SIM4000
Manufacturer
SICK AG
Erwin-Sick-Str. 1
79183 Waldkirch
Germany
Legal information
This work is protected by copyright. Any rights derived from the copyright shall be
reserved for SICK AG. Reproduction of this document or parts of this document is only
permissible within the limits of the legal determination of Copyright Law. Any modifica‐
tion, abridgment or translation of this document is prohibited without the express writ‐
ten permission of SICK AG.
The trademarks stated in this document are the property of their respective owner.
© SICK AG. All rights reserved.
Original document
This document is an original document of SICK AG.
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Contents
CONTENTS
1 About this document........................................................................ 5
1.1 Information on the operating instructions.............................................. 5
1.2 Explanation of symbols............................................................................ 5
1.3 Further information................................................................................... 6
1.4 Customer service...................................................................................... 6
2 Safety information............................................................................ 7
2.1 General safety notes................................................................................. 7
2.2 Intended use............................................................................................. 7
2.3 Improper use............................................................................................. 7
2.4 IP technology............................................................................................. 8
2.5 Limitation of liability................................................................................. 8
2.6 Modifications and conversions................................................................ 8
2.7 Requirements for skilled persons and operating personnel................. 9
2.8 Hazard warnings and operational safety................................................ 9
3 Product description........................................................................... 11
3.1 Device view............................................................................................... 11
3.2 Functionality.............................................................................................. 11
3.3 Product features and functions............................................................... 12
4 Transport and storage....................................................................... 14
4.1 Transport................................................................................................... 14
4.2 Transport inspection................................................................................. 14
4.3 Storage...................................................................................................... 14
5 Mounting............................................................................................. 15
5.1 Overview of mounting procedure............................................................. 15
5.2 Scope of delivery...................................................................................... 15
5.3 Preparing for mounting............................................................................ 15
5.4 Mounting the SIM4000............................................................................ 16
5.5 Mounting the SIM4000 (at a critical ambient temperature of max.
50 °C)........................................................................................................ 16
6 Electrical installation........................................................................ 19
6.1 Important information.............................................................................. 19
6.2 Preparing the electrical installation......................................................... 19
6.3 Assembling the cables (optional)............................................................ 19
6.4 Pin allocation of the connections............................................................ 21
6.5 Connecting peripheral devices................................................................ 27
6.6 Connecting voltage supply....................................................................... 27
7 Commissioning.................................................................................. 29
7.1 Preparatory commissioning..................................................................... 29
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CONTENTS
8 Operation............................................................................................ 30
8.1 Status LEDs............................................................................................... 30
9 Maintenance...................................................................................... 34
9.1 Cleaning..................................................................................................... 34
9.2 Maintenance............................................................................................. 34
10 Decommissioning............................................................................. 35
10.1 Disposal..................................................................................................... 35
11 Technical data.................................................................................... 36
11.1 Features.................................................................................................... 36
11.2 Performance............................................................................................. 36
11.3 Interfaces.................................................................................................. 36
11.4 Mechanics and electronics...................................................................... 37
11.5 Ambient data............................................................................................. 38
12 Annex.................................................................................................. 39
12.1 Dimensional drawings.............................................................................. 39
12.2 Licenses.................................................................................................... 40
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1 About this document
1.1 Information on the operating instructions
These operating instructions provide important information on how to use devices from
SICK AG.
Prerequisites for safe work are:
Compliance with all safety notes and handling instructions supplied.
•
Compliance with local work safety regulations and general safety regulations for
•
device applications
The operating instructions are intended to be used by qualified personnel and electrical
specialists.
NOTE
Read these operating instructions carefully before starting any work on the device, in
order to familiarize yourself with the device and its functions.
The instructions constitute an integral part of the product and are to be stored in the
immediate vicinity of the device so they remain accessible to staff at all times. Should
the device be passed on to a third party, these operating instructions should be handed
over with it.
ABOUT THIS DOCUMENT 1
These operating instructions do not provide information on operating the machine in
which the device is integrated. For information about this, refer to the operating instruc‐
tions of the particular machine.
1.2 Explanation of symbols
Warnings and important information in this document are labeled with symbols. The
warnings are introduced by signal words that indicate the extent of the danger. These
warnings must be observed at all times and care must be taken to avoid accidents, per‐
sonal injury, and material damage.
DANGER
… indicates a situation of imminent danger, which will lead to a fatality or serious inju‐
ries if not prevented.
WARNING
… indicates a potentially dangerous situation, which may lead to a fatality or serious
injuries if not prevented.
CAUTION
… indicates a potentially dangerous situation, which may lead to minor/slight injuries if
not prevented.
NOTICE
… indicates a potentially harmful situation, which may lead to material damage if not
prevented.
NOTE
… highlights useful tips and recommendations as well as information for efficient and
trouble-free operation.
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1 ABOUT THIS DOCUMENT
1.3 Further information
NOTE
All the documentation available for the device can be found on the online product page
at:
www.mysick.com
b
The following information is available for download there:
Model-specific online data sheets for device variants, containing technical data,
•
dimensional drawings and diagrams
EU declaration of conformity for the product family
•
Dimensional drawings and 3D CAD dimension models in various electronic for‐
•
mats
These operating instructions, available in English and German, and in other lan‐
•
guages if necessary
Other publications related to the devices described here
•
Publications dealing with accessories
•
1.4 Customer service
If you require any technical information, our customer service department will be happy
to help. To find your representative, see the final page of this document.
NOTE
Before calling, make a note of all type label data such as type code, serial number, etc.
to ensure faster processing.
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2 Safety information
2.1 General safety notes
The following safety notes must always be observed regardless of specific application
conditions:
The device must only be mounted, commissioned, operated, and maintained by
•
professionally qualified safety personnel.
Electrical connections with peripheral devices must only be made when the volt‐
•
age supply is disconnected.
The device is only to be operated when mounted in a fixed position.
•
The device voltage supply must be protected in accordance with the specifica‐
•
tions.
The specified ambient conditions must be observed at all times.
•
The electrical connections to peripheral devices must be screwed on correctly.
•
The cooling fins must not be covered or restricted in their functionality.
•
The pin assignment of pre-assembled cables must be checked and adjusted if
•
necessary.
These operating instructions must be made available to the operating personnel
•
and kept ready to hand.
SAFETY INFORMATION 2
2.2 Intended use
The device is a programmable control and evaluation unit for sensors and image proc‐
essing devices. The device also acts as a link between system and plant controls, and
the connected terminal devices. The device is mainly used in an industrial environment
in production, testing, and control. Other applications are possible depending on the
device-specific properties.
The device is programmed on a PC by using the development environment software
SICK AppSpace. Depending on the application, a browser-based, graphical user inter‐
face (HMI) can be created, which provides opportunities defined by the application
developer to influence an application at operator level.
The device connection to the peripherals is established by means of a range of indus‐
trial fieldbuses and other interfaces.
The device offers various interfaces for controlling, programming, and operating pur‐
poses, which can be activated as necessary via development environments, control sys‐
tems (programmable logic controllers), or applications.
However, configuration, programming, and control requires various technical skills,
depending on how the device is connected and used.
2.3 Improper use
Use of the device is generally only permitted in the ambient conditions specified in the
technical data.
The SIM4000 is not suitable for certain application conditions, including:
Use in areas with explosive atmosphere (hazardous area)
•
Use in safety-relevant environments (safety)
•
Use in extreme ambient conditions (see technical data)
•
Use under water or in a corrosive atmosphere
•
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2 SAFETY INFORMATION
2.4 IP technology
NOTE
SICK uses standard IP technology in its products. The emphasis is placed on availability
of products and services. SICK always assumes that the integrity and confidentiality of
the data and rights affected by the use of the aforementioned products will be ensured
by the customer. In all cases, appropriate security measures, such as network separa‐
tion, firewalls, virus protection, and patch management, must be taken by the customer
on the basis of the situation in question.
2.5 Limitation of liability
Applicable standards and regulations, the latest state of technological development,
and our many years of knowledge and experience have all been taken into account
when assembling the data and information contained in these operating instructions.
The manufacturer accepts no liability for damage caused by:
■
Failing to observe the operating instructions
■
Incorrect use
■
Use by untrained personnel
■
Unauthorized conversions
■
Technical modifications
■
Use of unauthorized spare parts, consumables, and accessories
With special variants, where optional extras have been ordered, or owing to the latest
technical changes, the actual scope of delivery may vary from the features and illustra‐
tions shown here.
2.5.1 Programmable device
The Sensor Integration Machine (SIM) is a programmable device.
Therefore the respective programmer is responsible for his/her programming perform‐
ance and the resulting working principle of the device.
The liability and warranty of SICK AG is limited to the device specification (hardware
functionality and any programming interfaces) according to the agreed conditions.
Therefore, SICK AG is not liable, among other things, for damages that are caused by
programming of the customer or third parties.
2.6
Modifications and conversions
NOTICE
Modifications and conversions to the device and/or the installation may result in
unforeseeable dangers.
Interrupting or modifying the device or SICK software will invalidate any warranty claims
against SICK AG. This applies in particular to opening the housing, even as part of
mounting and electrical installation.
Before technical modifications to and expansions of the device, the prior written appro‐
val of the manufacturer must be obtained.
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2.7 Requirements for skilled persons and operating personnel
WARNING
Risk of injury due to insufficient training.
Improper handling of the device may result in considerable personal injury and material
damage.
■
All work must only ever be carried out by the stipulated persons.
The operating instructions state the following qualification requirements for the various
areas of work:
■
Instructed personnel have been briefed by the operator about the tasks assigned
to them and about potential dangers arising from improper action.
■
Skilled personnel have the specialist training, skills, and experience, as well as
knowledge of the relevant regulations, to be able to perform tasks delegated to
them and to detect and avoid any potential dangers independently.
■
Electricians have the specialist training, skills, and experience, as well as knowl‐
edge of the relevant standards and provisions to be able to carry out work on elec‐
trical systems and to detect and avoid any potential dangers independently. In Ger‐
many, electricians must meet the specifications of the BGV A3 Work Safety Regu‐
lations (e.g. Master Electrician). Other relevant regulations applicable in other
countries must be observed.
SAFETY INFORMATION 2
The following qualifications are required for various activities:
Activities Qualification
Mounting, maintenance
Electrical installation,
device replacement
Basic practical technical training
■
Knowledge of the current safety regulations in the workplace
■
Practical electrical training
■
Knowledge of current electrical safety regulations
■
Knowledge of device control and operation in the particular
■
application concerned (e.g. conveying line)
Commissioning, configura‐
tion
Basic knowledge of the WindowsTM operating system in use
■
Basic knowledge of the design and setup of the described
■
connections and interfaces
Basic knowledge of data transmission
■
Basic knowledge of bar code technology
■
Operation of the device for
the particular application
Knowledge of device control and operation in the particular
■
application concerned (e.g. conveying line)
Knowledge of the software and hardware environment for
■
the particular application concerned (e.g. conveying line)
Table 1: Activities and technical requirements
2.8 Hazard warnings and operational safety
Please observe the safety notes and the warnings listed here and in other chapters of
these operating instructions to reduce the possibility of risks to health and avoid dan‐
gerous situations.
The SIM4000 is classified as a device belonging to LED risk group RG 1 in accordance
with IEC 62471:-1:2006-07/EN 62471-1:2008-09. The status indicators operate with
blue, green, yellow, and red LEDs in an irregular flashing sequence.
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2 SAFETY INFORMATION
The accessible beam from the LEDs does not represent a risk due to the normal restric‐
tions imposed by human behavior. It is not possible to entirely rule out temporary, diso‐
rienting optical effects on the human eye (e.g., dazzle, flash blindness, afterimages,
impairment of color vision), particularly in conditions of dim lighting. No protective
measures are required.
CAUTION
Improper use can lead to hazardous radiation exposure.
■
■
■
■
■
No maintenance is required to ensure compliance with LED risk group RG 1.
Do not look into the illumination intentionally for extended periods of time.
Do not open the housing.
Observe the applicable national regulations regarding photobiological safety.
The peak wavelengths for the status indicators are as follows (+-10 nm):
– blue 460 nm
– green 515 nm
– yellow 590 nm
– red 645 nm
RG 0 (no risk) is not exceeded from a distance of 2 meters.
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3 Product description
2
3
à
1
4
6
9
5
7
á
8
â
ß
3.1 Device view
PRODUCT DESCRIPTION 3
1
2
3
4
5
6
7
8
9
3.2 Functionality
The SIM4000 Sensor Integration Machine – part of the SICK AppSpace ecosystem – is
opening up new possibilities for application solutions.
Data from SICK sensors such as laser scanners and cameras can be merged into a
point cloud, evaluated, archived, and transmitted. 8 Gigabit Ethernet interfaces are
available for 2D or 3D cameras, and in some cases feature a voltage supply over Ether‐
net (PoE).
I/O connection
POWER main and CAN voltage supply
Status indicators of the voltage supply
Connections for 1–2 incremental encoders with 1–2 status indicators
1–2 serial connections with 1–2 status indicators
1–2 fieldbus connections with 1–2 status indicators
1–2 CAN connections with 1–2 status indicators
1–8 sensor connections with S1–S8 status indicators
1–8 Ethernet connections with 1–8 status indicators
Functional ground connection
Device status indicators
Servicing panel
Status indicators of Ethernet connections
Sensors can be integrated via IO-Link for distance and height measuring purposes.
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PRODUCT DESCRIPTION
3
Thanks to the high-performance multi-core processor featuring hardware support, the
SIM4000 enables image preprocessing and handling of input and output signals in real
time.
The integrated HALCON image processing library, plus the open SICK AppSpace soft‐
ware platform, make it possible to develop customized application programs for even
the most demanding 2D and 3D vision applications.
The SIM4000 is equipped with industrial-standard, Ethernet-based fieldbus interfaces
and can also be integrated into a SICK CAN sensor network. The HMI and data visuali‐
zation features can be provided on any browser-enabled notebook, PC, or tablet.
The app is developed in the SDKs SICK AppStudio and in HDevelop from MVTec.
3.3 Product features and functions
3.3.1 Functions
12
Figure 1: Application examples
The device as part of the SICK AppSpace ecosystem is opening up new possibilities for
application solutions.
Data from SICK sensors and cameras can be merged into a point cloud, evaluated,
archived, and transmitted. 8 GigE interfaces are available and in some cases with PoE.
Sensors can be integrated via IO-Link for distance and height measuring purposes.
Thanks to the powerful multi-core CPU with co-processors for image preprocessing and
I/O handling in real time, the device is able to find solutions for sophisticated image
processing tasks by using the HALCON library as well as SICK tools.
Features:
6 x GigE with PoE to connect to 2D/3D cameras as well as a network or PC
•
2 x 10 GigE to connect to 10 GigE cameras and to quickly archive sensor or proc‐
•
ess data with high data volume
Real-time-capable hardware architecture with precise synchronization of I/O sig‐
•
nals
4 x serial/encoder interfaces
•
2 x Ethernet-based fieldbus interfaces
•
Integrated illumination control and supply
•
4 x IO-Link master connections
•
Housing with IP65 enclosure rating
•
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Benefits:
3.3.2 SICK AppSpace
PRODUCT DESCRIPTION
Support for two SICK CAN networks with voltage supply to the sensors connected
•
to the CAN interfaces
S1 to S8 sensor connections with switchable and electronically monitored LPS
•
(Low Power Supply) pins
Tailored application development with SICK AppSpace
•
High-performance, innovative application solutions thanks to the merging of sen‐
•
sor and camera data
Integrated HALCON library opens up a whole host of image processing possibilities
•
for every industrial field of application
Multi-sensor/camera-based data recording and archiving enable quality control,
•
process analysis, and predictive maintenance for vertical integration in Industry
4.0
Real-time-capable hardware reduces integration work in, for example, time-critical
•
robotics applications
Quick and easy commissioning thanks to prefabricated cables
•
3
The SICK AppSpace ecosystem reveals new paths leading to solutions for customerspecific applications and consists of software tools and programmable sensors or devi‐
ces, such as the SIM4000. The SICK AppStudio SDK is used for developing sensor
apps on programmable SICK devices. Its user interface for machine operators can be
created individually as a web GUI. The SICK AppManager software tool supports the
service in the field in the simple distribution and management of sensor apps.
Figure 2: SICK AppSpace
Detailed instructions on the SICK AppStudio as well as programming the SIM4000 can
be found www.supportportal.sick.com.
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4 TRANSPORT AND STORAGE
4 Transport and storage
4.1 Transport
For your own safety, please read and observe the following notes:
NOTE
Damage to the device due to improper transport.
■
The device must be packaged for transport with protection against shock and
damp.
■
Recommendation: Use the original packaging as it provides the best protection.
■
Transport should be performed by specialist staff only.
■
The utmost care and attention is required at all times during unloading and trans‐
portation on company premises.
■
Note the symbols on the packaging.
■
Do not remove packaging until immediately before you start mounting.
4.2
Transport inspection
4.3 Storage
Immediately upon receipt in Goods-in, check the delivery for completeness and for any
damage that may have occurred in transit. In the case of transit damage that is visible
externally, proceed as follows:
■
Do not accept the delivery or only do so conditionally.
■
Note the scope of damage on the transport documents or on the transport compa‐
ny's delivery note.
■
File a complaint.
NOTE
Complaints regarding defects should be filed as soon as these are detected. Damage
claims are only valid before the applicable complaint deadlines.
Store the device under the following conditions:
■
Recommendation: Use the original packaging.
■
Do not store outdoors.
■
Store in a dry area that is protected from dust.
■
So that any residual damp can evaporate, do not package in airtight containers.
■
Do not expose to any aggressive substances.
■
Protect from sunlight.
■
Avoid mechanical shocks.
■
Storage temperature: see "Technical data", page 36.
■
Relative humidity: see "Technical data", page 36.
■
For storage periods of longer than 3 months, check the general condition of all
components and packaging on a regular basis.
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5 Mounting
5.1 Overview of mounting procedure
NOTE
The mounting procedure described here for SIM4000 meets the requirements for use
in the target system.
Additional or different requirements may become necessary in the laboratory and dur‐
ing preparation, and should be taken into account as necessary, see "Commissioning",
page 29. If you have any questions or anything remains unclear in this regard, please
contact our service team.
Mounting the bracket, if provided.
•
Mounting the SIM4000.
•
Assembling and laying cables.
•
Connecting peripheral devices.
•
Connecting the voltage supply.
•
5.2 Scope of delivery
MOUNTING 5
SIM4000
•
1x grounding screw
•
1x toothed lock washer
•
6x sliding nuts
•
Safety note
•
5.3 Preparing for mounting
Mounting requirements
NOTE
It is recommended to mount the device using the adapter holding plate (part no.
2083419) which is available as an accessory. The specific mounting instructions must
be taken into account at high ambient temperatures of max. 50 °C, see "Mounting the
SIM4000 (at a critical ambient temperature of max. 50 °C)", page 16.
Select the mounting site: Plan space requirements and sufficient distance from
•
other devices. Be aware of the possibility of heat dissipation.
Unpack the device and allow to acclimatise to avoid formation of condensation.
•
Prepare vibration reduction measures, if necessary.
•
Preparing for mounting with holding plate
NOTE
The device can also be mounted onto an aluminum profile without holes.
1. Place the holding plate at the mounting site.
2. Mark the mounting holes.
3. Proceed to drill the mounting holes.
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5 MOUNTING
5.4 Mounting the SIM4000
Mounting the SIM4000 with the adapter holding plate, available as an accessory
1. Mount the holding plate on SIM4000 using the supplied screws.
2. Place SIM4000 with the holding plate on the mounting site.
3. Secure the holding plate by tightening the 3 screws.
4. Alternatively: Pre-mount the 4 screws for suspended mounting and mount the
holding plate with the device.
NOTICE
Use self-locking or lock nuts on mounting sites that are exposed to vibrations to
prevent the holding plate from loosening.
5.5 Mounting the SIM4000 (at a critical ambient temperature of max. 50 °C)
NOTICE
To prevent damage to the device or the attached peripheral devices at high ambient
temperatures of a maximum of 50 °C, the following extended installation conditions
must be taken into account when mounting the device.
16
Prerequisites:
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0
10
20
30
40
50
60
0 20 40 60 80 100 120
Ambient temperature [°C]
CPU load [%]
0
10
20
30
40
50
60
0 10 20 30 40 50 60 70 80
Ambient temperature [°C]
Load PoE [W]
MOUNTING
Device is mounted vertically (device name on top)
•
Mounting takes place using the supplied sliding nuts and the holding plate, which
•
is available as an accessory
Aluminum profiles for mounting on the system (min. 1,200 mm in length)
•
No direct sunlight and heat radiation
•
Distance to other components or housing walls: min. 400 mm (above, below, to
•
the left), min 500 mm (on the heat-sink side)
Degradation of ambient temperature
Depending on the following device configurations, degradation of the permitted ambi‐
ent temperature must be taken into account:
CPU load ≥75% (can be read using SICK AppStudio)
•
PoE load ≥25 W (load of attached camera)
•
Load at voltage/switching outputs ≥100 W
•
5
Figure 3: Degradation of ambient temperature depending on the CPU capacity
Figure 4: Degradation of ambient temperature depending on the PoE load
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0
10
20
30
40
50
60
0 50 100 150 200 250 300 350
Ambient temperature [°C]
Load voltage outputs [W]
5 MOUNTING
Figure 5: Degradation of ambient temperature depending on the load on the voltage outputs
Mounting steps
1. Click the three sliding nuts into place into each of the vertical slots.
2. Screw the holding plate (or equivalent) to the sliding nuts with 6 screws.
3. Fit the device with the holding plate on the aluminum profile.
CAUTION
Danger from hot surfaces
An ambient temperature greater than 45 °C can lead to contact-critical heat in the lat‐
eral heat sink. It must be therefore be ensured that accidental contact is unlikely.
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6 Electrical installation
6.1 Important information
WARNING
Risk of injury and damage caused by electrical current!
Due to equipotential bonding currents, incorrect grounding can lead to the following
dangers and faults: Voltage is applied to the metal housing, cable fires due to cable
shields heating up, the product and other devices become damaged.
Generate the same ground potential at all grounding points.
b
Ground the equipotential bonding via the functional ground connection with a low
b
impedance (use standard cable lug with M4 hole).
NOTICE
Risk of damage to the device due to incorrect supply voltage
An incorrect supply voltage may result in damage to the device.
Only operate the device with the specified supply voltage.
b
All circuits connected to the device must be designed as SELV circuits (in accord‐
b
ance with EN 60950).
ELECTRICAL INSTALLATION 6
NOTE
Layout of data cables
■
Use screened data cables with twisted-pair wires.
■
Implement the screening design correctly and completely.
■
To avoid interference, e.g. from switching power supplies, motors, clocked drives,
and contactors, always use cables and layouts that are suitable for EMC.
■
Do not lay cables over long distances in parallel with power supply cables and
motor cables in cable channels.
6.2
Preparing the electrical installation
To carry out the electrical installation, you will need:
Connection cables for the peripheral devices, including the corresponding data
•
sheets
Voltage supply cable (scope of delivery)
•
If customers assemble the cables: crimping tool, ferrules, soldering iron, and other
•
installation material
6.3 Assembling the cables (optional)
NOTE
Customer assembly of the cables is only necessary in special cases. SICK offers a large
range of pre-assembled cables at www.sick.com
Depending on the peripheral devices to be connected and the connecting interface
used, various connection cables must be assembled before installing the device.
Ensure that you plan a sufficient length of cable for strain-relief clamps, for example.
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1
3
5
7
9
8
6
4
2
6 ELECTRICAL INSTALLATION
NOTICE
Risk of damage/malfunction due to incorrect PIN assignment
Incorrect wiring of the male connectors/female connectors can lead to damage to or
malfunctions in the system.
Observe data sheets provided by the cable manufacturer.
b
Observe the pin assignment.
b
Overview of connections
I/O: Universal input/output with seven configurable inputs/outputs and four opto-decou‐
1
pled inputs.
POWER IN: Voltage supply input. Up to 4 x 24 V @ 8 A can be connected, whereby the
2
main supply is available at both male connectors.
INC: Two configurable RS-422 / RS-485 receivers/transceivers to connect incremental
3
encoders. 2x RS-422 channels (A, B) and a 0.5 A LPS voltage supply are available for
each connection to peripherals. Note: RS-485 is not currently supported.
SERIAL: Two configurable RS-232 receivers/transceivers. One RS-232 / RS-422 (full
4
duplex/half duplex) and a 1 A LPS voltage supply are available for each connection to
peripherals.
FBUS: Two Ethernet-based fieldbus interfaces.
5
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CAN: Two standard CAN receivers/transceivers with one termination resistor per channel,
4
31
2
6
can be activated via software. A 3.4 A LPS voltage supply is available for each connection
to peripherals. To enable voltage supply to the peripherals, both PowerIn CAN voltage sup‐
ply strands must be connected to 24 V.
SENSOR 1-4: 4 sensor connections with digital inputs/outputs and voltage supply. Can be
7
alternatively used as IO-Link master connections. A switchable 1 A LPS voltage supply is
available for each connection to connected peripherals.
SENSOR 5-8: Four IO connections with two configurable inputs/outputs and one dedi‐
8
cated input. A 2.5 A LPS voltage supply is available for each connection to peripherals. To
enable voltage supply to the peripherals, both PowerIn main voltage supply strands must
be connected to 24 V.
ETHERNET: Six 1 Gigabit Ethernet with switchable 15 W PoE and two 10 Gbit Ethernet. To
9
enable PoE voltage supply, both PowerIn main voltage supply strands must be connected
to 24 V.
6.4 Pin allocation of the connections
6.4.1 POWER In main/CAN
ELECTRICAL INSTALLATION
6
Figure 6: POWER In main/CAN pin assignment, M12 – 4-pin T-coded, male
Pin Signal Function
1 +24 V U
2 GND U
3 GND U
4 24 V U
Housing Screen
Table 2: M12 – 4-pin (main, male)
Pin Signal Function
1 +24 V U
2 GND U
3 GND U
4 24 V U
Housing Screen
Table 3: M12 – 4-pin (male)
s
a
s
a
s
a
s
a
Supply voltage, system
Ground
Ground
Supply voltage, sensor 5–8 +
PoE
Supply voltage, system
Ground
Ground
Supply voltage, CAN
Additional notes:
Max. 7.5 A permanent load per connection
•
24 V supply voltage ±10%
•
Maximum power consumption for SIM4000: 70 W
•
Maximum power output of all connections: 300 W
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•
System supply voltage can be set up redundantly.
•
Power cables must be protected with max. 12 A.
•
21
Page 22
3
1
7
2
6
5
4
8
13
14
17
15
9
10
12
16
11
ELECTRICAL INSTALLATION
6
6.4.2 I/O
Figure 7: I/O pin assignment, M12 – 17-pin A-coded, female
Pin Signal Function Factory settings
1 GND Ground
2 24 V OUT Supply voltage, peripherals
3 In/Out 1 Configurable switching
input/output
4 In/Out 2 Configurable switching
input/output
5 In/Out 3 Configurable switching
input/output
6 In/Out 4 Configurable switching
input/output
7 In/Out 5 Configurable switching
input/output
8 In/Out 6 Configurable switching
input/output
9 In/Out 7 Configurable switching
input/output
10 In 1 Isolated switching input
11 SensGND 1 Isolated GND In 1
12 In 2 Isolated switching input
13 SensGND 2 Isolated GND In 2
14 In 3 Isolated switching input
15 SensGND 3 Isolated GND In 3
16 In 4 Isolated switching input
17 SensGND 4 Isolated GND In 4
Housing - Screen
Table 4: M12 – 17-pin (female)
All IO connections config‐
ured as inputs
Additional notes:
Connection to control cabinet to connect devices directly
•
4 isolated inputs and 7 GPIO
•
Max. 0.5 A output for supply voltage connection (compliant with LPS)
•
Digital outputs can be configured as inputs
•
Outputs:
•
Max. current output: 100 mA
°
Min. high output logic level: VCC – 3 V
°
Max. low output logic level: 3 V
°
Push/pull, NPN, PNP configurable
°
Max. input frequency: 30 kHz
°
Inputs:
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•
Min. high input logic level: 12 V
°
Max. low input logic level: 4 V
°
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Page 23
6.4.3 INC
1
7
2
6
5
4
3
8
1
7
2
6
5
4
3
8
1
43
2
ELECTRICAL INSTALLATION 6
In/Out 1–7: max. input frequency: 30 kHz
°
In 1–4 (isolated): maximum 10 kHz
°
Figure 8: Incremental pin assignment, M12 – 8-pin A-coded, female
Pin Signal Function AppSpace name
1 A - Incremental input/output to pin 1/2 and 3/4
2 A +
RS-422 to pin 1/2 (Tx) and 3/4 (Rx)
3 B - Tx: B_out Rx: B_in
4 B +
5 Z - Not used
6 Z +
7 GND Ground
8 +24 V Supply voltage, peripherals
Housing - Screen
Table 5: M12 – 8-pin (female)
Tx: A_out Rx: A_in
6.4.4 SERIAL
6.4.5 FBUS
Figure 9: Serial pin assignment, M12 – 8-pin A-coded, female
Pin Signal Function AppSpace name
1 A - Incremental output to pin 1/2 Tx: A_out Rx:
2 A +
3 B - Incremental output to pin 3/4
4 B +
5 Z -
RS-232 to pin 4 (Tx) and 6 (Rx)
RS-422 to pin 3/4 (Tx) and 5/6 (Rx)
Tx: B_out Rx:
6 Z +
7 GND Ground
8 +24 V Supply voltage, peripherals
Housing - Screen
Table 6: M12 – 8-pin (female)
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Figure 10: Fieldbus pin assignment, M12 – 4-pin D-coded, female
23
Page 24
1
43
5
2
1
43
5
2
6 ELECTRICAL INSTALLATION
Pin Signal Function
1 TD+ (TX1_P) Transmit data +
2 RD+ (RX1_P) Receive data +
3 TD- (TX1_N) Transmit data -
4 RD- (RX1_N) Receive data -
Housing Screen
Table 7: M12 – 4-pin D-coded (female)
Additional notes:
Designed for line topology
•
Data transmission rates: 10/100 Mbit/s
•
ProfiNet support
•
6.4.6 CAN
6.4.7 SENSOR 1–4
Figure 11: CAN pin assignment, M12 – 5-pin A-coded, female
Pin Signal Function Factory settings
1 - Screen
2 +24 V Supply voltage, periph‐
erals
3 GND Ground
4 CAN_H CAN high - Term active
5 CAN_L CAN low
Housing - Screen
Table 8: M12 – 5-pin A-coded (female)
Deactivated
Additional notes:
Access to CANopen I/O modules
•
Data transmission rates from 50 Kbit/s up to 1 Mbit/s
•
Max. 3.2 A output for supply voltage connections (compliant with LPS)
•
Internal termination through programming
•
Figure 12: Pin assignment of sensor 1–4, M12 – 5-pin A-coded, female
Pin Signal Function Factory settings
1 +24 V Supply voltage, periph‐
erals
2 DI Input
3 GND Ground
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Table 9: M12 – 5-pin A-coded (female)
All IO connections con‐
figured as inputs
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1
43
5
2
ELECTRICAL INSTALLATION
Pin Signal Function Factory settings
4 C/D Configurable switching
input/output
5 NC Not connected
Housing Screen
Table 9: M12 – 5-pin A-coded (female)
Additional notes:
4x IO-Link master (1x master available per connection)
•
IO-Link stack is implemented in FPGA (SoftCore)
•
Max. 1 A output for supply voltage connections S1 to S4 (compliant with LPS)
•
Switching output:
•
Max. output 100 mA.
°
Min. high output logic level: VCC – 3 V
°
Max. low output logic level: 3 V
°
Push/pull, NPN, PNP configurable
°
Push/pull, NPN, PNP configurable by user
°
Max. IO-Link output frequency: 230 kHz
°
Max. IO output frequency: 30 kHz
°
Switching input:
•
Min. high input logic level: 12 V
°
Max. low input logic level: 4 V
°
Max. IO-Link input frequency: 230 kHz
°
Max. IO input frequency: 30 kHz
°
6
6.4.8 SENSOR 5–8
Figure 13: Pin assignment of sensor 5–8, M12 – 5-pin A-coded, female
Pin Signal Function Factory settings
1 +24 V Supply voltage, periph‐
erals
2 IN Input
3 GND Ground
4 I/O 1 Configurable switching
input/output
5 I/O 2 Configurable switching
input/output
Housing - Screen
Table 10: M12 – 5-pin A-coded (female)
Max. 2.5 A output for supply voltage connections S5 to S8 (compliant with LPS)
•
Switching output:
•
Max. output 100 mA
°
Min. high output logic level: VCC – 3 V
°
Max. low output logic level: 3 V
°
Push/pull, NPN, PNP configurable
°
Push/pull, NPN, PNP configurable by user
°
Max. IO output frequency: 30 kHz
°
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Deactivated
IN
IN
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1
7
2
6
54
3
8
6 ELECTRICAL INSTALLATION
Switching input:
•
°
°
°
Illumination control:
Voltage supply for S5 to S8, configurable
•
Reference CSC illumination
•
Ramp up: < 10 μs
•
Ramp down: < 10 μs
•
Delay: < 10 μs
•
Max. frequency: 10 kHz
•
Max. voltage supply: 1 A
•
6.4.9 ETHERNET
Figure 14: Ethernet pin assignment, M12 – 8-pin X-coded, female
Min. high input logic level: 12 V
Max. low input logic level: 4 V
Max. IO input frequency: 30 kHz
Pin Function
1 D1+
2 D1-
3 D2+
4 D2-
5 D4+
6 D4-
7 D3-
8 D3+
Table 11: M12 – 1 and 10 Gbit Ethernet (female)
Additional notes:
6x 1 GigE connections with configurable PoE and 2x 10 GigE connections are
•
available.
The GigE connections can be used to connect to cameras as well as a PC or net‐
•
work.
The relevant drivers are implemented in the SIM4000 to enable usage of the SICK
•
picoCam and midiCam camera families as well as cameras compatible with GigE
Vision.
The 10 GigE connections are intended for quick data transmission to the archive
•
or other host systems, as well as for connection to the relevant 10 GigE cameras.
Jumbo frame support is required.
•
NOTICE
When supplying connected cameras using PoE, both POWER main voltage sup‐
plies need to be connected. The total current consumption must not exceed 7.5 A
(input at 24 V Main 2).
The sine power may affect the operating temperature.
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6.5 Connecting peripheral devices
The device can be connected to a wide range of sensors and cameras.
The required pin assignments can be found in the data sheets for the peripherals to be
connected as well as in the relevant connection descriptions, see "Pin allocation of the
connections", page 21.
1. If necessary, assemble connection cables, see "Assembling the cables (optional)",
page 19.
2. Connect the cables to peripheral devices.
3. Route the cables to the device using installation materials (cable channels, cable
ties, etc.). When doing so, pay attention to cable strain relief.
4. Connect cables to the relevant device connections and screw together tightly.
5. Seal unused connections with dummy plugs.
6.6 Connecting voltage supply
Block diagram
+24 V Us
M12
24V IN
CAN
+24 V Ua
+24 V Us
M12
24V IN
Main
+24 V Ua
El Fuse
<10A
El Fuse
<10A
El Fuse
<10 A
24V_Device
24V_CAN
24V_Sensor/P0E
ELECTRICAL INSTALLATION 6
10Gbit Ethernet
Prozessor
Unit
PTC Fuse UL Listed
0,5A
EL. Fuse
(0,5A max)
EL. Fuse
(0,5A max)
EL. Fuse
(1A max)
EL. Fuse
(3,2A max)
Redundatn EL. Fuse
(2,5A max)
6X12W POE
1Gbit Ethernet
10Gbit Ethernet
1Gbit Ethernet
24V IO Driver
Incremental Driver
Serial Driver
IO LINK Driver
CAN Driver
24V IO Driver
2X M12
Fieldbus
M12
IO
2x M12
INC
2x M12
Serial
4x M12
Sensor 1-4
2x M12
CAN
4x M12
Sensor 5-8
6x M12
Ethernet 1-6
2x M12
Ethernet 7-8
Figure 15: Connection to the power supply
NOTICE
Risk of damage/malfunction due to incorrect PIN assignment
Incorrect wiring of the male connectors/female connectors can lead to damage to or
malfunctions in the system.
Observe data sheets provided by the cable manufacturer.
b
Observe the pin assignment.
b
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6 ELECTRICAL INSTALLATION
NOTICE
Risk of damage to peripheral devices
If peripheral devices are connected when the voltage supply is also applied, these devi‐
ces can become damaged.
Only connect peripheral devices when the voltage supply is disconnected.
b
1. Ensure that the voltage has been disconnected by the user.
2. Connect the voltage supply cable(s) to the SIM4000 and screw together tightly.
3. Lay the cable(s) with strain relief.
4. Have the user connect the voltage supply.
5. Have the user activate the voltage.
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7 Commissioning
7.1 Preparatory commissioning
Commissioning for preparatory purposes and under laboratory conditions differs in
some respects from commissioning in the target system.
In general, all safety and hazard warnings applicable to mounting (page 15) and electri‐
cal installation (page 19) must also be observed under laboratory conditions. In addi‐
tion, further information must be taken into consideration to guarantee the most effec‐
tive preparation possible:
Only connect those devices to the SIM4000 that you want to configure or program.
•
Operate the SIM4000 in a controlled and contained network environment for the
•
time being to check network communication if necessary.
Note the company standards that apply to the use of checking and testing devices.
•
For initial programming, use ideal conditions for sensor or camera recognition.
•
Use the largest possible deviations from these ideal conditions to check the pro‐
•
gramming with respect to its error tolerance and reliability, and to determine error
limit values.
Procedure
COMMISSIONING 7
1. Place the SIM4000 on a non-slip base.
2. Connect the required peripheral devices, see "Connecting peripheral devices",
page 27.
3. Connect the network connection.
4. Connect the voltage supply.
5. Switch on the voltage supply.
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8 OPERATION
8 Operation
8.1 Status LEDs
When the SIM4000 is operating, the operational status of the connections is indicated
visually by status LEDs.
Using these status indicators, the operator can find out quickly and easily whether the
device and the peripherals are working properly or whether any faults or errors have
occurred.
Monitoring the visual indicators is part of the routine inspection carried out on the
SIM4000 and the machine/plant area into which the SIM4000 is incorporated.
8.1.1 Situation and function of the LEDs
POWER IN
Situation Designation LED behavior Description
DEVICE
SENSOR/Po
E
CAN
Voltage not applied to the con‐
nection.
Voltage applied.
Under/overvoltage detected.
Table 12: Power status LEDs
INC
Situation Designation LED behavior Description
PWR/ACT Voltage not applied to the con‐
nection.
Voltage applied. No signal activ‐
ity.
Voltage applied. Signal activity.
Voltage not applied to the con‐
nection. Signal activity.
Overvoltage or short-circuit
detected. No signal activity.
Overvoltage or short-circuit
detected. Signal activity.
Table 13: INC status LEDs
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SERIAL
Situation Designation LED behavior Description
PWR/ACT Voltage not applied to the con‐
nection.
Voltage applied. No signal activ‐
ity.
Voltage applied. Signal activity.
Voltage not applied to the con‐
nection. Signal activity.
Overvoltage or short-circuit
detected. No signal activity.
Overvoltage or short-circuit
detected. Signal activity.
Table 14: SERIAL status LEDs
FBUS
Situation Designation LED behavior Description
Link Connection not established with
fieldbus.
Connection established with
fieldbus.
Act No activity.
OPERATION 8
Data transmission via fieldbus.
Table 15: FBUS status LEDs
CAN
Situation Designation LED behavior Description
PWR/ACT Voltage not applied to the con‐
nection.
Voltage applied. No signal activ‐
ity.
Voltage applied. Signal activity.
Voltage not applied to the con‐
nection. Signal activity.
Overvoltage or short-circuit
detected. No signal activity.
Overvoltage or short-circuit
detected. Signal activity.
Term Termination resistor not acti‐
vated.
Termination resistor activated.
Table 16: CAN status LEDs
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8 OPERATION
SENSOR S1 – S8
Situation Designation LED behavior Description
PWR/ACT Voltage not applied to the con‐
nection.
Voltage applied. No signal activ‐
ity.
Voltage applied. Signal activity.
Voltage not applied to the con‐
nection. Signal activity.
Overvoltage or short-circuit
detected. No signal activity.
Overvoltage or short-circuit
detected. Signal activity.
Table 17: S1 to S8 status LEDs
ETHERNET 1 – 8
Situation Designation LED behavior Description
Link Connection not established with
Ethernet.
ETH1-ETH6 only. Connection
established with Ethernet.
Act No activity.
PoE Voltage supply via Ethernet.
Table 18: ETHERNET status LEDs
Data transmission via Ethernet.
Fault in the supply line (over‐
load, short-circuit).
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Device status
Situation Designation LED behavior Display
Dev RDY Runlevel READY, no errors
detected.
Runlevel READY, boot process
error.
Runlevel READY not reached.
Sys RDY User-defined, configurable with
AppSpace.
Result User-defined, configurable with
AppSpace.
OPERATION 8
Funct 1 User-defined, configurable with
AppSpace.
Funct 2 User-defined, configurable with
AppSpace.
Remote Remote maintenance active.
Currently not supported.
SSD 1 External SSD connected.
SSD 2 External SSD connected.
WIFI Currently not supported.
BLE Currently not supported.
BF / NS Bus error (fieldbus)
SF / MS System error (fieldbus)
Table 19: Device status indicators
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9 MAINTENANCE
9 Maintenance
9.1 Cleaning
The SIM4000 must be cleaned regularly from the outside to guarantee heat dissipation
and therefore operation. Particular attention must be paid to ensure that the cooling
fins are free from dust and dirt. Clean using a dry towel or an industrial vacuum
cleaner. Do not use cleaning agents.
9.2 Maintenance
The SIM4000 is maintenance-free. If damage or malfunctions occur that cannot be rec‐
tified, please contact the manufacturer's service department.
Check at regular intervals that the unused connections are sealed with blind plugs.
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10 Decommissioning
10.1 Disposal
CAUTION
Risk of injury due to hot device surface!
The surface of the device can become hot during operation.
Before commencing disassembly, switch off the device and allow it to cool down
b
as necessary.
Any device which can no longer be used must be disposed of in an environmentally
friendly manner in accordance with the applicable country-specific waste disposal regu‐
lations. As they are categorized as electronic waste, the device must never be disposed
of with household waste.
DECOMMISSIONING 10
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Page 36
11 TECHNICAL DATA
11 Technical data
11.1 Features
Feature Parameter
Task Data recording, evaluation, and archiving
Supported devices/excerpt 2D and 3D cameras, encoders, code readers, laser scanners, pho‐
Technology Embedded hardware architecture:
Random Access Memory 8 GB
Flash memory 512 MB in total, 490 MB of which available for applications
Memory card (optional) Industry-grade microSD memory card (flash card), max. 16 GB
toelectric sensors, etc.
16/8-Core PowerPC CPU (virtual/physical cores)
•
FPGA for image (pre-)processing
•
FPGA for I/O handling
•
Dedicated fieldbus controller
•
Software:
Can be programmed within the SICK AppSpace environment
•
Integrated HALCON image processing library
•
SICK vision tools
•
11.2 Performance
11.3 Interfaces
Feature Parameter
Programming software SICK AppStudio
Image processing algo‐
rithms
Feature Parameter
Data storage and retrieval Image and data logging via optional internal SSD, microSD mem‐
Serial (RS-232 / RS-422)
Quantity 2, also configurable as an encoder port
Function RS-232 / RS-422
Data transmission rate RS-422: 2 MBaud
Incremental
Quantity 2
Function Incremental encoder (In/OUT), RS-422 interface
Maximum frequency 2 MHz
Fieldbus
Quantity 2
Function Ethernet-based fieldbus
Data transmission rate 10/100 MBit/s
Protocol ProfiNet, Ethernet/IP, EtherCAT
Ethernet
Quantity 8
in accordance with HALCON12 and/or SICK vision tools
ory card, internal RAM and external FTP
RS-232: 115.2 kBaud
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TECHNICAL DATA 11
Feature Parameter
Function Host, AUX, image transmission, 6x PoE PSE 12 W max. (to 1 GigE
interfaces)
Data transmission rate 6 x [10/100/1,000 Mbit/s]
2 x 10,000 Mbit/s
Protocol TCP/IP, FTP (image transmission), GigE vision, GeniCam
CAN
Quantity 2
Function SICK CAN sensor network (master/slave, multiplexer/server) with
termination resistor which can be activated
CAN functional modes:
Mode 1: 2 separate CAN networks
Mode 2: 1 CAN network with 2x power-out
Data transmission rate 20 kbit/s ... 1 Mbit/s
Protocol CSN (SICK CAN sensor network)
IO-Link master
Quantity 4 (S1 to S4)
Data transmission rate max. 230 kBaud
Protocol IO-Link master 1.1
Digital switching inputs/outputs
I/O Inputs: 4 opto-decoupled, max. frequency: 10 kHz
Inputs/outputs: 7 (configurable), max. frequency: 30 kHz
S1–S4 Inputs: 1 each, max. frequency: 10 kHz
Inputs/outputs: 1 each (configurable), max. frequency: 30 kHz
S5–S8 Inputs: 1 each, max. frequency: 30 kHz
Inputs/outputs: 2 each (configurable), max. frequency: 30 kHz
USB AUX (USB 2.0), for configuration/diagnostics and image transmis‐
sion
11.4 Mechanics and electronics
Feature Parameter
Optical indicators 15 x red/green status indicators
Operating elements 1 selector switch (under the front right-hand flap)
Electrical connection I/O: 1 x M12, 17-pin female connector
Operating voltage 24 V DC, ± 10% SELV in accordance with EN 60950-1
Power consumption 60 W type, without connected sensors
6 x red/green PoE indicators
8 x orange activity indicators
10 x green Link indicators
12 x red/green device status indicators
POWER MAIN and CAN: 2 x M12, 4-pin male connector, T-coded
INC: 2 x M12, 8-pin female connector, A-coded
SERIAL: 2 x M12, 8-pin female connector, A-coded
FBUS: 2 x M12, 4-pin female connector, D-coded
CAN: 2 x M12, 5-pin female connector, A-coded
SENSOR S1–S4, IO-Link master: 4 x M12, 5-pin female connector,
A-coded
SENSOR S5–S8: 4 x M12, 5-pin female connector, A-coded
Ethernet GigE with POE: 6 x M12, 8-pin female connector, X-coded
Ethernet 10GigE: 2x M12, 8-pin female connector, X-coded
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11 TECHNICAL DATA
Feature Parameter
Power output Total 300 W max. (all connections)
Output current
S1–S8, IO Max. output current to switching output pins: 100 mA
S1–S4 Max. output current to power supply pins: 1 A, LPS in accordance
with EN 60950-1
S5–S8 Illumination switched via the power supply pin: I
accordance with EN 60950-1 with rise time < 10 µs, fall time
< 10 µs, delay < 10 µs
Illumination switched via digital output: I
ance with EN 60950-1
CAN Max. output current to power supply pins: 3.2 A, LPS in accord‐
ance with EN 60950-1
Serial, incremental Max. output current to power supply pins: 1 A, LPS in accordance
with EN 60950-1
IO Max. output current to power supply pins: 500 mA, LPS in accord‐
ance with EN 60950-1
Housing material Aluminum die cast
Housing color Light blue (RAL 5012)
Protection class II with functional ground
Weight 5120 g
Dimensions (W x D x H) 164.5 x 147 x 272 mm
= 1 A, LPS in
max
= 2.5 A, LPS in accord‐
max
11.5 Ambient data
Feature Parameter
Electromagnetic compati‐
bility (EMC)
Shock resistance EN 60068-2-6
Electrical safety EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 +AC:2011
Enclosure rating IP65 in accordance with EN 60529-2000-09 (requires blind plugs
Ambient operating temper‐
ature
Storage temperature -20 °C ... +70 °C
Permissible relative humid‐
ity
EN 61000-6-2:2005-08
EN 61000-6-4:2007 + A1:2011
EN 61131-9:2013-12
+ A2:2013
to be inserted into unused connections)
0 °C ... +50 °C, taking the described mounting requirements into
account, see "Mounting the SIM4000", page 16
90%, non-condensing
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12 Annex
MAIN
POWER
CAN
POWER IN
CAN
SENSOR / PoE
DEVICE
SERIAL1
2
INC1
2
FBUSP1 P2
S1 S2
1 2
S3
S4
CAN
SIM4000
SENSOR
S5 S6 S7 S8
1
2
3
4
1
2
3
4
5
6
7
8
5 6
7
8
ETHERNET
1 GigE / 10 GigE
I/0
Act
Link
Pwr/ActPwr/Act Pwr/Act Pwr/Act
Pwr/Act
Dev RDY
Sys RDY
Result
Funct 1
Funct 2
Remote
SSD 1
SSD 2
Wi-Fi
BLE
BF / NS
SF / MS
Link
Act
Link
Act
Link
Act
Link
Act
Link
Act
Link
Act
Link
Act
Link
Act
PoEPoEPoE
PoE
PoE
PoE
Pwr/ActPwr/Act Pwr/Act Pwr/Act
Pwr/Act
Pwr/Act
Pwr/Act Pwr/Act
Act
Link Term
Pwr/Act
Term
1
2
3
4
5
6
7
8
Link
Act
Link
Act
Link
Act
Link
Act
Link
Act
Link
Act
Link
Act
Link
Act
USB
Micro-SD
Dev RDY
Sys RDY
Result
Funct 1
Funct 2
Remote
SSD 1
SSD 2
Wi-Fi
BLE
BF / NS
SF / MS
Mode
30
(1.19)
85 (3.33)83 (3.25)
272 (10.71)
39.5 (1.56)
40
(1.56)
29 (1.16)
60 (2.37)
241 (9.49)
0
27.3
(1.07)
68.3
(2.69)
100.3
(3.95)
136.3
(5.36)
168.3
(6.62)
203.2
(8.00)
246.3
(9.69)
0
Repair warranty
void if broken
160.5 (6.32)
157.4 (6.20)
40
(1.57)
147 (5.79)
164.5 (6.48)
32
(1.18)
36
(1.42)
36
(1.42)
147 (5.79)
7.8 (0.31)
11.5 (0.45)
5.3 (0.21)
100
(3.94)
100
(3.94)
10.4 (0.41)
12.1 Dimensional drawings
All measurements in mm.
ANNEX 12
8019317/2016-04-26 | SICK OP E RA T IN G I N ST R UC T IO N S | SIM4000
Subject to change without notice
39
Page 40
330 (12.99)
165 (6.50)
265 (10.43)
301 (11.85)
310 (12.20)
320 (12.60)
65 (2.56)
29 (1.14)
19 (0.75)
0
10 (0.39)
118 (4.65)
M4 (8x)
Vesa 75 (2.95)
Vesa 100 (3.94)
99 (3.90)
84 (3.31)
74 (2.91)
59 (2.32)
44 (1.73)
34 (1.34)
19 (0.75)
0
R 6.5
(0.26)
R 2.75
(0.11)
R 2.75
(0.11)
1
12 ANNEX
12.2 Licenses
Adapter holding plate (available as accessory)
Counterbore M5 (9x)
1
SICK uses open-source software. This software is licensed by the rights holders using
the following licenses among others: the free licenses GNU General Public License (GPL
Version2, GPL Version3) and GNU Lesser General Public License (LGPL), the MIT
license, zLib license, and the licenses derived from the BSD license.
This program is provided for general use, but WITHOUT ANY WARRANTY OF ANY KIND.
This warranty disclaimer also extends to the implicit assurance of marketability or suita‐
bility of the program for a particular purpose.
More details can be found in the GNU General Public License. View the complete
license texts here: www.sick.com/licensetexts. Printed copies of the license texts are
also available on request.
40
O PE R AT I NG IN S TR U CT I ON S | SIM4000 8019317/2016-04-26 | SICK
Subject to change without notice
Page 41
ANNEX 12
8019317/2016-04-26 | SICK OP E RA T IN G I N ST R UC T IO N S | SIM4000
Subject to change without notice
41
Page 42
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sgp.com.sg
8019317/2016-04-26/COMAT/en
SICK AG | Waldkirch | Germany | www.sick.com
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